JP3607207B2 - Method and apparatus for removing semiconductor wafer from storage container - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for removing a semiconductor wafer from a storage container, and an alignment method and apparatus for a semiconductor wafer.
[0002]
[Prior art]
In general, a semiconductor wafer is cut into a thin disk shape from a silicon single crystal ingot, a circuit is formed on the surface thereof, and a product is obtained by cutting and packaging into chips. In the production of semiconductors, not only technological innovation but also decentralization or globalization of production bases has progressed. Therefore, the process of cutting out the semiconductor wafer, the process of forming the circuit and the process of packaging are performed in different places and factories. It is becoming more common.
[0003]
Because semiconductor wafers are built with a large number of semiconductor chips, they are extremely expensive and are easily damaged. Therefore, sufficient consideration is required for logistics such as transportation and handling of semiconductor wafers. Therefore, a dedicated storage container is usually used for transporting the semiconductor wafer from a place where a certain process is performed to a place where another process is performed.
[0004]
Conventionally, semiconductor wafers are transported by forming a large number of grooves on the inner wall surface, and inserting both sides of the semiconductor wafer into these grooves, so that semiconductor wafers can be accommodated in multiple stages between the grooves. A storage container with an emphasis on structure is used.
[0005]
Incidentally, in recent years, in the production of semiconductor devices, the outer diameter of semiconductor wafers has increased. Further, as the package of the semiconductor device is made thinner, the thickness of the semiconductor wafer for manufacturing the semiconductor chip is reduced. Incidentally, the outer diameter of the semiconductor wafer is increased to 12 inches (300 mm). The thickness is reduced to about 75 to 50 μm.
[0006]
When such a large and thin semiconductor wafer is transported using the conventional storage container as described above, the semiconductor wafer is warped due to its own weight or the influence of the baking pattern on the semiconductor wafer. In addition to adversely affecting semiconductor wafers and baking patterns, it is also difficult to put semiconductor wafers in and out of the container, so a new storage container for transporting large and thin semiconductor wafers has been proposed. Has been made.
[0007]
In this new storage container, a peripheral wall with an inner diameter where the outer diameter of the semiconductor wafer fits on the bottom plate with a slight margin is erected in a cylindrical shape divided at multiple locations, and a cushioning material is laid on the bottom of the peripheral wall. Semiconductor wafers and spacers are alternately stacked to store a predetermined number of sheets, and have a structure with a separate lid that covers the peripheral wall. Such a new storage container has a semiconductor wafer with a large diameter and a reduced thickness. Even so, the semiconductor wafer can be transported without hindrance by being stacked through the spacer.
[0008]
By the way, in the manufacturing process of a semiconductor product, a semiconductor wafer having a large number of circuit patterns (functional elements) formed on the surface thereof is then subjected to a back-grinding (back grinding) step if necessary, and then each functional element is separated. Before being supplied to the step of cutting (dicing step) into individual semiconductor chips, a step of mounting the semiconductor wafer on a dedicated ring frame using an adhesive tape is required.
[0009]
This mounting process uses an adhesive tape having a width larger than the outer diameter of the semiconductor wafer, takes out the ring frame taken out from the ring frame supply section into the tape application section, and draws a predetermined amount from the reel to the ring frame at this tape application section. After sticking the adhesive tape and cutting the adhesive tape along the periphery of the ring frame, the ring frame is supplied onto the semiconductor wafer held on the wafer mount, and the adhesive tape of the ring frame is applied in the vacuum chamber. This is performed by attaching a semiconductor wafer, and then taking out the ring frame to which the semiconductor wafer is attached to the reverse mounting portion.
[0010]
Therefore, in order to automatically perform such a mounting process, the semiconductor wafer is taken out from the storage container and supplied to the wafer mount portion, and the semiconductor wafer is attached to the center of the ring frame. Therefore, a semiconductor wafer alignment apparatus for centering the semiconductor wafer supplied to the wafer mount portion is required.
[0011]
[Problems to be solved by the invention]
However, the conventional semiconductor wafer take-out device and semiconductor wafer alignment device from the storage container are for use with the conventional storage container, and new storage for the above-described semiconductor wafers having a larger diameter and thinner thickness. Due to the proposal of the container, it is necessary to develop a new semiconductor wafer take-out apparatus and a semiconductor wafer alignment apparatus corresponding to the new storage container.
[0012]
Accordingly, an object of the present invention is to automatically take out a semiconductor wafer from a new storage container, and to perform centering of the taken-out semiconductor wafer with high accuracy, so that a semiconductor wafer from a storage container corresponding to the new storage container can be obtained. and to provide a take-out method and equipment.
[0013]
[Means for Solving the Problems]
In order to solve the above-described problems, the first invention provides a placement portion for a storage container in which semiconductor wafers and spacers are alternately stacked and accommodated, and a semiconductor wafer suction / conveyance unit that moves up and down, horizontally, and places. Using a wafer take-out mechanism that can freely move forward and backward with respect to the storage container on the placement unit, and a spacer take-out mechanism that allows the spacer adsorption and transfer body to move up and down and move forward and backward with respect to the storage container on the placement unit. The mounting portion tilts the storage container and then returns to the horizontal position to position the semiconductor wafer by moving the semiconductor wafer in one direction within the storage container, and for each positioning operation, the semiconductor in the storage container by the wafer take-out mechanism is placed. The removal of the wafer and the removal of the spacer in the storage container by the spacer removal mechanism are alternately performed. , Faces to the center axis of the transport unit is coaxially state to the central axis of the container just above the container, the suction, the semiconductor wafer and the centering by the transport unit moves horizontally in storage container is lowered In this state, the uppermost semiconductor wafer is adsorbed, and after adsorbing, the semiconductor wafer in the storage container is taken out by moving horizontally so as to be coaxial with the storage container. Adopts a configuration in which the uppermost spacer is adsorbed by descending immediately above the storage container, and the spacer in the storage container is taken out by ascending after the adsorption.
[0014]
In the present invention, when the storage container is tilted by the mounting portion, air is blown to the wafer from a position on the inclined upward side so that the semiconductor wafer is moved in the downward tilt direction within the storage container, or the wafer take-out mechanism is The adsorption of the semiconductor wafer by the conveyance unit can be performed by starting from the central part and moving to the outer peripheral part.
[0015]
According to a second aspect of the present invention, there is provided a mounting portion of the storage container in which the semiconductor wafers and the spacers are alternately stacked and stored, and the semiconductor wafer adsorption, transport unit is moved up and down, horizontally, and forward and backward with respect to the storage container on the mounting portion. It consists of a free wafer take-out mechanism, and a spacer take-out mechanism that allows the spacer suction and transfer body to move up and down and move forward and backward with respect to the storage container on the mounting part. the semiconductor wafer so as to position the semiconductor wafer by lapping in one direction, are formed freely inclined dynamic returning horizontally After tilting the container, the wafer was taken out mechanism, the adsorption of the semiconductor wafer, the center of the transport unit half by axes, faces so as to be coaxial state to the central axis of the container just above the container, moves horizontally in storage container is lowered at this position The uppermost semiconductor wafer is adsorbed in a state of being aligned with the body wafer, and is formed so as to take out the semiconductor wafer by moving horizontally so as to be coaxial with the storage container after the adsorption. A configuration in which the spacer adsorption / conveying body is formed so as to descend immediately above the storage container to adsorb the uppermost spacer and to rise after the adsorption and take out the spacer is adopted.
[0016]
In the present invention, when the storage container is tilted above the mounting portion, an air nozzle that blows air from the position on the inclined upward side to the wafer and moves the semiconductor wafer in the downward tilt direction is disposed in the storage container. The semiconductor wafer adsorption / conveyance unit of the wafer take-out mechanism is formed of an inner adsorber and an outer adsorber fitted on the outer adsorber, and the inner adsorber can rotate and move up and down with respect to the outer adsorber. Thus, the inner adsorber and the outer adsorber can start the semiconductor wafer adsorption from the center of the inner adsorber and move to the outer adsorber.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0018]
FIG. 1 shows that the semiconductor wafer is automatically taken out from the above-described new storage container corresponding to the semiconductor wafer having a large diameter and thinned, and after aligning the semiconductor wafer, the semiconductor wafer is attached to the adhesive tape of the ring frame. The overall structure of the mounting device for automatically performing the mounting process of taking out the ring frame to the inverted mounting part and storing it in the cassette of the cassette storage part is shown. The semiconductor wafer take-out device 3 and the alignment device 4 from the storage container 2 are arranged on the front side.
[0019]
In the illustrated case, the wafer mount line supports a plurality of ring frames 5 on a lifting table, and each time the ring frame 5 is taken out, the ring frame supply unit 6 that rises intermittently by the thickness of the ring frame 5; An adhesive tape 7 is attached to the upper surface of the ring frame 5 taken out from the ring frame supply unit 6 with the adhesive surface down, and the adhesive tape 7 is cut along the periphery of the ring frame 5 and a suction table. The tape application ring frame 5 supplied from the tape application unit 8 is superposed on the semiconductor wafer A sucked and held on the semiconductor wafer A, and the semiconductor wafer A is applied to the adhesive tape 7 of the ring frame 5 by pressing in a vacuum chamber. Wafer mount portion 9 and ring frame 5 with semiconductor wafer A attached thereto are mounted on the wafer mount portion. Are formed side by side in a straight line, is a semiconductor wafer A anti reprint portion 10 so as to house the cassette 12 within the cassette accommodating portion 11 and a counter-reproduction part 10 received in an inverted state from.
[0020]
In the wafer mount unit 9, the semiconductor wafer A is supplied onto the suction table with the circuit pattern facing downward and the back surface facing upward, and the adhesive tape 7 is attached to the back surface. Becomes upward.
[0021]
A protective tape may be applied to the entire circuit pattern surface of the semiconductor wafer A. This protective tape is peeled off before the dicing process.
[0022]
In the semiconductor wafer take-out device 3, the mounting portion 13, the wafer alignment portion 4 and the wafer mount portion 9 of the storage container 2 in which the semiconductor wafers A and the spacers B are alternately stacked are stored in the X-axis direction perpendicular to the wafer mount line. Arranged in series, the semiconductor wafer A can be adsorbed and the transport unit 14 can move up and down, horizontally, and move in the X-axis direction. The semiconductor wafer A is taken out from the storage container 2, and the wafer alignment unit 4 takes the wafer. The wafer take-out mechanism 15 that sequentially conveys to the mount unit 9 and the spacer adsorption / conveyance body 16 can move in the Y-axis direction parallel to the vertical movement and the wafer mount line, and the spacer B from the storage container 2 on the mounting unit 13 can be moved. And a spacer take-out mechanism 18 for conveying it into the spacer storage box 17 It is made from the combined.
[0023]
As shown in FIG. 1 and FIG. 2, the storage container 2 is constructed such that a peripheral wall 20 having an inner diameter that allows the outer diameter of the semiconductor wafer A to be accommodated on the bottom plate 19 with a little margin is erected in a cylindrical shape divided at a plurality of locations. A cushion material C is laid on the bottom of the wafer, and a predetermined number of semiconductor wafers A and spacers B are alternately stacked on the cushion material C, and a separate lid is provided on the peripheral wall 20 (not shown). Yes.
[0024]
As shown in FIG. 2, the storage container mounting portion 13 in the wafer take-out mechanism 15 is provided with an elevating base 23 that moves up and down the opening 22 portion of the base stand 1 on an elevator 21 that is arranged at the lower portion of the base stand 1. On the lift base 23 , a substantially rectangular inclined plate 24 that stably supports the storage container 2 with a recess on the upper surface is horizontally supported, and one side of the tilt plate 24 is attached to the lift base 23 with a pivot 25, The tilting plate 24 can be tilted about a fulcrum 25, and a cylinder 27 and a pin 28 are coupled to the lifting base 23 via a bracket 26 at a position opposite to the pivot 25 of the tilting plate 24. The inclined plate 24 can be inclined at a predetermined angle from the horizontal state.
[0025]
The storage container 2 placed on the inclined plate 24 stores the semiconductor wafer A by bringing the semiconductor wafer A stored therein by the inclination toward one direction of the peripheral wall 20 on the inclined downward side and returning it horizontally. Positioning with respect to the container 2 is performed.
[0026]
In order to more reliably position the semiconductor wafer A when the storage container 2 is tilted, the air is placed at a position on the inclination rising side outside the storage container 2 placed on the mounting portion 13 as shown in FIG. The nozzle 29 is disposed so as to be tilted integrally with the tilted plate 24, and air is blown to the semiconductor wafer A from the position on the tilted up side, so that the semiconductor wafer A is reliably brought in the tilted down direction in the storage container 2. be able to.
[0027]
As shown in FIG. 1, the wafer take-out mechanism 15 is provided with a guide frame 30 that is long in the X-axis direction perpendicular to the wafer mount line at an upper position on one side of the mounting portion 13, and as shown in FIG. The ball screw 31 provided along the guide frame 30 is mounted with a transport body 32 that moves in the X-axis direction along the length direction of the guide frame 30 by the rotation of the ball screw 31, and the semiconductor wafer is attached to the transport body 32. A transfer arm 33 protruding at a right angle toward the mounting portion 13 side of A is fixed, and a lifting bracket 34 is attached to the front surface of the transfer arm 33 so as to move along the vertical guide 35 in the vertical Z-axis direction. A moving plate 36 is attached to the lower surface of the bracket 34 so as to move along the horizontal guide 37 in the horizontal Y-axis direction. Adsorption of the wafer through the actuator 39, the transport unit 14 is mounted.
[0028]
In addition, what is necessary is just to use drive sources, such as a cylinder, suitably for the movement of the raising / lowering bracket 34 in the Z-axis direction and the movement of the moving plate 36 in the Y-axis direction.
[0029]
The θ-axis drive motor 38 for rotation is fixed to the upper end of the moving plate 36, and an actuator 39 is attached to the lower portion of the moving plate 36. The suction / conveyance unit 14 is a drive motor that protrudes below the actuator 39. The disk-shaped inner adsorbing body 41 attached to the rotary shaft 40 and an annular outer adsorbing body 42 fitted to the outside of the inner adsorbing body 41 are formed. The outer adsorbing body 42 is an actuator via a bracket 43. The inner adsorber 41 can be moved up and down and rotated relative to the outer adsorber 42. With this configuration, the suction transport unit 14 of the wafer, X, Y, Ri Do movable in the Z-axis, that Do rotatable relative to θ axis.
[0030]
The inner adsorber 41 and the outer adsorber 42 have a porous adsorbing surface at the lower part, the inner adsorber 41 and the outer adsorber 42 are separated from each other, and the inner adsorber 41 extends from the center to the outer periphery. As the semiconductor wafer A is adsorbed, air is released to the outside so that bubbles are not generated between the adsorbing surfaces.
[0031]
As shown in FIGS. 1 and 3, the spacer take-out mechanism 18 arranges the storage portion 44 of the spacer storage box 17 on the other side of the placement portion 13 of the storage container 2 so as to be coaxially arranged in the Y-axis direction. A guide frame 45 disposed at a right angle to the guide frame 30 of the wafer take-out mechanism 15 is provided at an upper position in front of the storage portion 44, and a transport body 47 that moves in the Y axis direction on a guide shaft 46 provided on the guide frame 45. Is attached to the transport body 47 so as to protrude toward the storage section 44, and is provided with a spacer suction and transport body 16 that moves up and down by a cylinder 49. The spacer suction and transport body 16 are formed on the lower surface. The spacer B is adsorbed by a plurality of adsorbing pads 50 provided. The transport body 47 may be moved by using an appropriate driving means such as a cylinder or a ball screw mechanism.
[0032]
A bottomed cylindrical storage box 17 having an inner diameter in which the spacer B is accommodated is placed in the storage section, and the suction pad 50 is placed between the storage container 2 and the storage box 17 directly above the storage section 13. Moving in the Y-axis direction, the spacer B in the storage container 2 is attracted and lifted, and transported into the storage box 17 and stacked.
[0033]
The alignment unit of the alignment apparatus 4 is set at an intermediate position between the mounting unit 13 of the storage container 2 and the wafer mount unit 9 of the wafer mount line, and adsorbs the semiconductor wafer A in the storage container 2 by the adsorption and transfer unit 14. In this alignment unit, a transmission sensor 51 for measuring the outer periphery of the semiconductor wafer A in a non-contact manner is disposed at a position on the lower outer side of the suction and transport unit 14, and the inner suction body 41 is lowered and rotated. Thus, the transmission sensor 51 performs multi-point position measurement on the outer circumference of the semiconductor wafer A rotating away from the outer adsorption body 42 and averages the center of the semiconductor wafer A, and the adsorption and conveyance are performed based on the result. The semiconductor wafer A is centered by correcting the position of the unit 14 in the X and Y directions.
[0034]
In addition, two cameras 52 that capture the circuit pattern line a of the semiconductor wafer A after centering are placed at positions just below the suction and transport unit 14 that stops at the alignment unit, on both sides sandwiching the rotation axis of the suction and transport unit 14. At this position, the camera 52 can perform suction correction or correction in the X and Y directions so that the circuit pattern line a matches the recognition point of the camera 52.
[0035]
Extraction equipment of the semiconductor wafer from the container of the present invention has a configuration as described above, it will now be described Removing the method of semiconductor wafer.
[0036]
<Semiconductor wafer removal method>
As shown by the solid line in FIG. 2, the storage container 2 in which the inclined plate 24 in the mounting portion 13 of the storage container 2 is leveled at a predetermined height and the semiconductor wafers A and the spacers B are alternately stacked is stored. The cylinder 27 is extended in this state, and the inclined plate 24 and the storage container 2 are inclined by a predetermined angle as shown in FIG. 4A, and the semiconductor wafer A is moved in one direction in the storage container 2. The semiconductor wafer A is positioned by the above-described method. At this time, air is supplementarily blown to the semiconductor wafer A located at the upper portion by the air nozzle 29 from the upper side of the inclination, so that the uppermost semiconductor wafer A is reliably positioned.
[0037]
When the inclined plate 24 and the container 2 are returned to the horizontal position after this positioning, the wafer take-out mechanism 15 causes the suction / conveyance unit 14 to move in the X-axis direction as indicated by the arrow (1) in FIG. As shown by a two-dot chain line in FIG. At this time, the adsorption / conveyance unit 14 is in a phase coaxial with the storage container 2 in a state where the inner adsorption body 41 is accommodated in the outer adsorption body 42, and the adsorption / conveyance unit 14 has an arrow ( As shown in 2), the predetermined stroke is lowered to enter the storage container 2.
[0038]
The suction / conveyance unit 14 descends and moves horizontally within the storage container 2 as indicated by the arrow (3) in FIG. 4C, thereby aligning with the semiconductor wafer A as shown by the solid line in FIG. In this state, the uppermost semiconductor wafer A is lightly pressed. In this state, the suction force is applied to the suction surface to suck the uppermost semiconductor wafer A.
[0039]
The inner adsorber 41 and the outer adsorber 42 adsorb the semiconductor wafer A so that the semiconductor wafer A is adsorbed from the center of the inner adsorber A and finally transferred to the outer adsorber 42. As shown in FIG. 4D, when the uppermost semiconductor wafer A is warped, it is adsorbed while being lightly pressed from above.
[0040]
When the semiconductor wafer A is adsorbed, the adsorption / conveyance unit 14 moves horizontally in the X-axis direction as indicated by an arrow (4) in FIG. 4E, and is coaxial with the storage container 1 as indicated by a two-dot chain line in FIG. Next, it rises as indicated by an arrow (5) in FIG. 4 (E), reaches the position indicated by the solid line in FIG. 4 (E), and adsorbs and takes out one semiconductor wafer A from the storage container 2. The transport unit 14 transports the semiconductor wafer A to the alignment unit as indicated by an arrow (6) in FIG.
[0041]
As described above, when the suction / conveyance unit 14 is moved up and down in a phase coaxial with the storage container 2 and the suction / conveyance unit 14 is moved horizontally in the storage container 2, the outer circumference of the semiconductor wafer A is taken out. Can be prevented from interfering with the peripheral wall 20 of the storage container 2, and the periphery of the semiconductor wafer A can be prevented from being damaged, and the semiconductor wafer A can be sucked coaxially by the sucking and transporting unit 14.
[0042]
As described above, when the semiconductor wafer A is completely taken out from the storage container 2 by the suction / conveyance unit 14, the spacer take-out mechanism 18 has the suction / transport body 16 placed immediately above the storage container 2 as shown in FIG. 3. Then, the uppermost spacer B in the storage container 2 is adsorbed by the suction pad 50 and is lifted after the adsorption, so that the spacer B in the storage container 2 is taken out, and the adsorbing and conveying body 16 is directly above the storage box 17. Then, it is lowered at this position to carry the spacer B in the storage box 17.
[0043]
As described above, every time the storage container 2 of the mounting portion 13 is tilted and returns to the horizontal position, the semiconductor wafer A in the storage container 2 is taken out by the wafer take-out mechanism 15, and the storage container 2 in the storage container 2 is taken in by the spacer take-out mechanism 18. The spacer B is taken out alternately.
[0044]
【The invention's effect】
As described above, according to the present invention, the semiconductor wafer can be automatically taken out from the storage container corresponding to the semiconductor wafer having a large diameter and thinned, and the semiconductor wafer taken out can be centered with high accuracy, and the large size can be obtained. Processing of a semiconductor wafer having a reduced diameter and a thinner thickness and automation of the processing process can be realized.
[Brief description of the drawings]
FIG. 1 is a plan view showing the entire structure of a mounting apparatus having a semiconductor wafer take-out apparatus and an alignment apparatus according to the present invention. FIG. 2 shows the structure of a semiconductor wafer take-out apparatus and an alignment apparatus in the section taken along line II-II in FIG. Fig. 3 is a longitudinal sectional view showing the structure of the spacer take-out mechanism in the section taken along the line III-III in Fig. 1. Fig. 4 shows the take-out process of the semiconductor wafer take-out device. (B) is a plan view of the same storage container as seen from the axial direction, (C) is a longitudinal section showing the suction state of the semiconductor wafer in the storage container by the suction and transfer unit (D) is a longitudinal sectional view showing a suction state when the semiconductor wafer is warped, (E) is a longitudinal section showing a state where the semiconductor wafer in the storage container is taken out by the suction and transfer unit. Plan [Explanation of symbols]
A Semiconductor wafer B Spacer 1 Base table 2 Storage container 3 Semiconductor wafer take-out device 4 Alignment device 5 Ring frame 6 Ring frame supply unit 7 Adhesive tape 8 Tape application unit 9 Wafer mount unit 10 Reverse mounting unit 11 Cassette storage unit 12 Cassette 13 Pick-up device 14 suction, transport unit 15 Pick-up mechanism 16 suction, transport body 17 Box 18 Pick-up mechanism 19 Bottom plate 20 Peripheral wall 21 Elevator 22 Opening 23 Lifting base 24 Inclined plate 25 Pivot 26 Bracket 27 Cylinder 28 Pin 29 Air nozzle 30 Guide frame 31 Hole Screw 32 Conveying body 33 Conveying arm 34 Elevating bracket 35 Vertical guide 36 Moving plate 37 Horizontal guide 38 Drive motor 39 Actuator 40 Rotating shaft 41 Inner adsorbing body 42 Outer adsorbing body 43 Bracket G 44 Storage section 45 Guide frame 46 Guide shaft 47 Transport body 48 Transport arm 49 Cylinder 50 Suction pad 51 Transmission sensor 51a Light emitting element 51b Light receiving element 52 Camera

Claims (6)

A receiving portion of a storage container in which semiconductor wafers and spacers are alternately stacked and stored, and a wafer take-out mechanism that allows the semiconductor wafer to be sucked and transported up and down, horizontally, and moved forward and backward with respect to the storage container on the mounting portion. And a spacer pick-up mechanism, and a spacer take-out mechanism that allows the carrier to move up and down and move forward and backward with respect to the storage container on the placement unit,
The mounting section tilts the storage container and then returns to the horizontal position. The semiconductor wafer is positioned by moving the semiconductor wafer in one direction in the storage container. Alternately taking out the semiconductor wafer and taking out the spacer in the storage container by the spacer taking-out mechanism,
The wafer is taken out mechanism, adsorption, the central axis of the transport unit faces so as to be coaxial state to the central axis of the container just above the container, the suction transport unit moves horizontally in storage container is lowered By adsorbing the uppermost semiconductor wafer in the state of being aligned with the semiconductor wafer, the semiconductor wafer in the storage container is taken out by moving horizontally so as to be coaxial with the storage container after suction,
Further, the spacer take-out mechanism is a semiconductor from a storage container, wherein the suction and transport body descends immediately above the storage container to adsorb the uppermost spacer, and lifts after the suction to take out the spacer in the storage container. Wafer removal method. 2. The semiconductor wafer according to claim 1, wherein when the storage container is tilted by the mounting portion, air is blown to the wafer from a position on the inclined upward side so that the semiconductor wafer is moved downwardly in the storage container. A method for taking out a semiconductor wafer from the storage container. 2. The method for removing a semiconductor wafer from a storage container according to claim 1, wherein the wafer is picked up by the wafer take-out mechanism and the semiconductor wafer is picked up by the transfer unit by moving from the central portion to the outer peripheral portion. A receiving portion of a storage container in which semiconductor wafers and spacers are alternately stacked and stored, and a wafer take-out mechanism that allows the semiconductor wafer to be sucked and transported up and down, horizontally, and moved forward and backward with respect to the storage container on the mounting portion. And a spacer take-out mechanism that allows the spacer suction, the transport body to move up and down, and to move forward and backward with respect to the storage container on the mounting portion.
The mounting portion is formed so as to freely tilt and return to the horizontal after the storage container is tilted so as to position the semiconductor wafer by moving the semiconductor wafer in one direction in the storage container.
The wafer take-out mechanism is such that the central axis of the semiconductor wafer adsorption / conveyance unit faces the central axis of the storage container directly above the storage container , and is lowered at this position to move horizontally within the storage container. By adsorbing the uppermost semiconductor wafer in a state of being aligned with the semiconductor wafer, it is formed so as to take out the semiconductor wafer by moving horizontally and rising so as to be coaxial with the storage container after adsorption,
The spacer take-out mechanism is a device for taking out a semiconductor wafer from a storage container formed so that the spacer adsorbing and conveying body descends immediately above the storage container to adsorb the uppermost spacer, and rises after the adsorption and takes out the spacer. . 5. An air nozzle is disposed above the mounting portion, wherein when the storage container is tilted, air is blown to the wafer from a position on the inclined upward side, and the semiconductor wafer is tilted downward in the storage container. The semiconductor wafer taking-out apparatus from the storage container as described. The semiconductor wafer adsorption / conveyance unit of the wafer take-out mechanism is formed of an inner adsorber and an outer adsorber fitted to the outside, and the inner adsorber can rotate and move up and down with respect to the outer adsorber. 5. The apparatus for taking out a semiconductor wafer from a storage container according to claim 4, wherein the inner adsorbent and the outer adsorbent are adapted to start adsorbing the semiconductor wafer from the central portion of the inner adsorbent and move to the outer adsorbent.

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