KR102866811B1 - A camera capable of booting at low temperatures through heating and dissipation and its operating method - Google Patents

Abstract

An embodiment includes a lens module that receives light from the outside; an image sensor that converts light received from the lens module into an electric signal, and a control board that operates in response to a camera driving signal; a heat dissipation module for heating and dissipating heat; a heat transfer pad that transfers heat from the heat dissipation module; a temperature sensor module that senses temperature; a heater module that is installed in the heat dissipation module and generates heat; a main body that accommodates the lens module, the control board, the heat dissipation module, the heat transfer pad, the temperature sensor module, and the heater module; And a support module configured in multiple stages to support the control board and assist heat transfer; wherein the control board includes an image signal processing board including the image sensor, a main control board controlling the image signal processing board in response to the application of a power signal, a heating power control board driving the heater module in response to the input of an external power source to increase the temperature inside the camera, and a PoE power control board provided separately from the heating power control board and receiving power from the heating power control board to provide driving power to the main control board. A camera capable of booting at a low temperature according to heating and heat dissipation can be provided.

Description

{A camera capable of booting at low temperatures through heating and dissipation and its operating method}

The present invention relates to a camera capable of booting at low temperatures by heating and dissipating heat, and a method for driving the same.

Electronic devices face unique challenges in high-altitude mountainous regions, extreme cold environments like the Arctic, or environments where temperatures can reach -50°C in the dead of winter. In these conditions, internal heat generation ensures that devices like cameras operate normally. Internal heat generation is a crucial factor in ensuring that devices remain functional even in extreme cold. However, if power is interrupted due to a power supply failure or other external issues, the internal temperature of the device can drop dramatically, causing core components like chipsets to drop below their designed minimum operating temperatures. This can compromise the operating temperature characteristics of these components, ultimately leading to device shutdowns.

Furthermore, the internal heat generated during normal operation of the equipment can cause other problems. For example, high-performance electronic components such as CMOS sensors can experience internal temperatures exceeding 60°C when continuously processing high-performance tasks. This high temperature can lead to performance degradation or damage to the equipment.

Additionally, when the camera is exposed to direct sunlight outdoors during summer, the internal temperature can soar to as high as 80°C. This can overload the device's electronic circuitry or cause permanent damage, requiring special protective measures for use under these conditions.

The use of electronic equipment in such extreme temperature conditions requires complex thermal management and reliability assurance. Therefore, equipment used in these environments must be specially designed, and a thermal management system is essential to ensure stable operation and long-term reliability of the camera.

KR 10-2344576 B KR 10-0820966 B KR 10-2280335 B

The present invention provides a camera capable of booting at low temperatures by heating and dissipating heat so that the camera can boot without interruption in its function in an extremely low-temperature environment, and a method of operating the same.

In addition, the present invention provides a camera capable of booting at low temperatures and a method of operating the same, which enables normal operation of the camera by heating and dissipating heat, even when the internal temperature of the camera drops rapidly due to a power supply problem or other external problem in an environment where the internal heat generation of the camera alone is not sufficient.

In addition, the present invention provides a camera capable of booting at low temperatures and a method of driving the same, which can prevent core components such as chipsets from falling below their minimum operating temperatures by heating and dissipating heat.

An embodiment includes a lens module that receives light from the outside; an image sensor that converts light received from the lens module into an electric signal, and a control board that operates in response to a camera driving signal; a heat dissipation module for heating and dissipating heat; a heat transfer pad that transfers heat from the heat dissipation module; a temperature sensor module that senses temperature; a heater module that is installed in the heat dissipation module and generates heat; a main body that accommodates the lens module, the control board, the heat dissipation module, the heat transfer pad, the temperature sensor module, and the heater module; And a support module configured in multiple stages to support the control board and assist heat transfer; wherein the control board includes an image signal processing board including the image sensor, a main control board controlling the image signal processing board in response to the application of a power signal, a heating power control board driving the heater module in response to the input of an external power source to increase the temperature inside the camera, and a PoE power control board provided separately from the heating power control board and receiving power from the heating power control board to provide driving power to the main control board. A camera capable of booting at a low temperature according to heating and heat dissipation can be provided.

In another aspect, the support module is composed of a plurality of stages, and the heat dissipation module, the main control board, the heating power control board, and the PoE power control board are sequentially stacked at a predetermined distance from each other on each of the plurality of stages of the support module.

A camera capable of booting at low temperatures can be provided, depending on heating and dissipation.

On the other hand, the heating power control board controls the operation of the heater module, and when the internal temperature of the camera exceeds the reference temperature, power is supplied to the main control board through the PoE power control board, thereby enabling the camera to boot at low temperatures.

A camera capable of booting at low temperatures can be provided, depending on heating and dissipation.

In another aspect, the heat dissipation module is in contact with the main control board on which the image signal processing board is mounted, or in contact with the heat transfer pad.

When heated through the above heater module, the overall temperature inside the camera is rapidly increased, and when the camera is operated, the heat generated from the image sensor is dissipated to the outside through the heat transfer pad, support module, and main body.

A camera capable of booting at low temperatures can be provided, depending on heating and dissipation.

In another aspect, the heating power control board stops the operation of the heater module when the temperature detected by the temperature sensor module is higher than the preset temperature, supplies power to the PoE power control board, and the PoE power control board converts the received power and provides it to the main control board, thereby starting normal operation of the camera, thereby providing a camera capable of booting at low temperatures according to heating and heat dissipation.

In another aspect, the support module includes a plurality of short-axis support modules, each of the first to fourth support modules, and the plurality of short-axis support modules are connected in a row to form a multi-stage structure, and the image signal processing board, the main control board, the heating power control board, and the PoE power control board are sequentially stacked at each stage, and the heat transfer pad is arranged between the control boards so that heat is transferred to each stage or released to the outside, and a camera capable of booting at a low temperature according to heating and heat dissipation can be provided.

In another aspect, some of the first to fourth support modules are formed as long-axis support modules, and a light-emitting module is fastened to the long-axis support modules, and the light-emitting module is fixed via some of the support columns of the support modules, so that a camera capable of booting at a low temperature can be provided according to heating and heat dissipation arranged around the lens module.

In another aspect, the heat transfer pad includes beryllium copper and is formed with an elastic thickness to maintain close contact with the inner surface of the camera body, thereby transferring heat generated during heating to the entire interior of the camera, and efficiently dissipating heat generated from the image sensor to the outside when the camera is overheated during operation, thereby providing a camera capable of booting at a low temperature according to heating and heat dissipation.

In another aspect, the heater module is configured as a PTC (Positive Temperature Coefficient) heater, and can provide a camera capable of booting at low temperatures by heating and dissipating the internal temperature of the camera to a set temperature or higher at a point when operation is stopped according to the control of the heating power control board and then operating the camera normally through the PoE power control board.

In another aspect, the PoE power control board can provide power to the main control board using a network power supply method including PoE (Power over Ethernet), and when external adapter power is supplied, the heating power control board first drives the heater module, and when a predetermined temperature or higher is reached, the heating power control board supplies power to the PoE power control board to drive the main control board, thereby providing a camera capable of booting at a low temperature according to heating and heat dissipation.

In another aspect, a method for operating a camera capable of booting at a low temperature according to heating and heat dissipation may be provided, including: (a) a step of waking up a heating power control board in response to an external power supply; (b) a step of measuring a temperature inside a camera through a temperature sensor module by the heating power control board and determining whether the temperature is below a preset temperature; (c) a step of operating the heater module to heat the inside of the camera when the temperature is determined to be below a preset temperature; (d) a step of stopping the operation of the heater module by the heating power control board and supplying power to a PoE power control board when the measured value of the temperature sensor module rises above a preset temperature; and (e) a step of operating the camera normally by the POE power control board by supplying operating power to the main control board.

In addition, the embodiment includes a support module; a lens module that receives light from the outside; a control board including an image sensor that is connected to the support module and converts light received from the lens module into an electric signal; a heat dissipation module that is connected to the support module and heats and dissipates heat; a heat transfer pad that is connected to the support module and transfers heat from the heat dissipation module; a temperature sensor module that senses temperature; a heater module that is installed in the heat dissipation module and heats the heat dissipation module; and a main body that houses the lens module, the control board, the heat dissipation module, the heat transfer pad, the temperature sensor module, and the support module; wherein the control board includes an image signal processing board including the image sensor, a main control board that controls the image signal processing board in response to an application of a power signal, and a power control board that controls the operation of the heater module based on a temperature inside the main body detected from the temperature sensor module in response to a reception of a camera drive signal and provides drive power to the main control board.

In another aspect, the heat dissipation module can provide a camera capable of booting at a low temperature according to the heat and heat dissipation that comes into contact with the image signal processing board and the heat transfer pad mounted on the main control board.

In another aspect, the power control board provides driving power to the main control board when the temperature inside the main body is higher than the preset temperature, and the main control board receives the driving power and controls the image signal processing board, thereby providing a camera capable of booting at low temperatures according to heating and heat dissipation.

In another aspect, the power control board may provide a camera capable of booting at a low temperature by heating and dissipating heat by driving the heater module when the temperature inside the main body is lower than a preset first temperature, and then stopping the operation of the heater module and supplying driving power to the main control board when the temperature inside the main body is higher than a preset second temperature.

In another aspect, the support module includes first to fourth support modules, the first support module includes a first long-axis support module and a plurality of first short-axis support modules, the second support module includes a second long-axis support module and a plurality of second short-axis support modules, the third support module includes a plurality of third short-axis support modules, the fourth support module includes a plurality of fourth short-axis support modules, each of the plurality of first to fourth short-axis support modules is connected in a row to form a plurality of stages, and the image signal processing board, the main control board, the power control board, and the heat transfer pad are installed in each of the plurality of stages, and the support module can provide a camera capable of booting at a low temperature according to heating or heat dissipation by conducting heat or heat dissipation.

In another aspect, a camera capable of booting at low temperatures according to heating and heat dissipation can be provided, further comprising a light-emitting module fastened by the first and second long-axis support modules.

In another aspect, the heat transfer pad includes first to third heat transfer pads, the first heat transfer pad contacting the heat dissipation module and being fastened to the support module, and the second and third heat transfer pads being connected to the first heat transfer pad to provide a camera capable of booting at a low temperature according to heating and dissipation by contacting the inner surface of the main body.

In another aspect, the heater module can provide a camera capable of booting at low temperatures by heating and dissipating heat inserted into the through hole of the heat dissipation module.

In another aspect, a camera capable of booting at a low temperature can be provided in which the image signal processing board, the first heat transfer pad, the main control board, and the power control board are sequentially installed in each of the plurality of stages according to heating and heat dissipation.

In another aspect, the camera drive signal can provide a camera capable of booting at low temperatures according to heating and dissipation, which are external power signals input from the outside to the power control board.

In another aspect, a power control board of a camera may measure the temperature inside the main body in response to an input of power from the outside, drive a heater module in response to the measured temperature being lower than a preset first temperature, and then stop driving the heater module and transmit a driving signal of the main control board to the main control board in response to the temperature inside the main body being higher than a preset second temperature, thereby providing a method for driving a camera capable of booting at a low temperature according to heating and heat dissipation.

In another aspect, the second temperature may provide a method of operating a camera capable of booting at a low temperature according to heating and dissipation, which is a temperature value higher than the first temperature.

The embodiment can help the camera operate effectively even in extreme weather conditions and contribute to expanding the use of the camera in various fields such as outdoor activities, exploration, and scientific research.

In detail, the embodiment allows the camera to boot even at low temperatures through heating and heat dissipation.

Additionally, the embodiment allows the camera to operate stably without malfunction even in low-temperature environments by maintaining key components inside the camera at an appropriate temperature.

Additionally, the embodiment prevents camera performance degradation or damage even at high temperatures.

Additionally, the embodiment allows the camera to maintain its performance even in situations where the internal temperature of the camera may rise rapidly when exposed to direct sunlight outdoors in the summer.

Furthermore, the embodiment enables a camera to operate stably in both extremely low-temperature and high-temperature environments by driving a heater module via a heating power control board to perform a low-temperature boot, and then supplying full-scale operating power to the camera using an added PoE power control board. At this time, the wiring and board layout can be systematically configured through the first to fourth support modules, maximizing the efficiency of internal camera temperature management.

FIG. 1 is a perspective view of a camera capable of booting at low temperatures by heating and dissipating heat according to an embodiment of the present invention.
Figures 2 to 5 illustrate the camera module from various angles.
Figure 6 illustrates a support module.
Fig. 7 illustrates a heat transfer pad. Fig. 7(a) illustrates a state in which the heat transfer pad is unfolded, and Fig. 7(b) illustrates a state in which the second and third heat transfer pads provided on both sides of the first heat transfer pad are bent at a predetermined angle.
Figure 8 schematically illustrates the power control board.
Figure 9 schematically illustrates a portion of a side surface of a camera module.
FIG. 10 is a flowchart of a method for driving a camera capable of booting at low temperatures by heating and dissipating heat according to an embodiment of the present invention.
FIG. 11 is a flowchart of a method for driving a camera capable of booting at low temperatures by heating and dissipating heat according to various embodiments of the present invention.

The present invention is capable of various modifications and embodiments. Therefore, specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as the methods for achieving them, will become clear with reference to the embodiments described in detail below together with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms. In the following embodiments, the terms "first," "second," etc. are not used in a limiting sense but are used for the purpose of distinguishing one component from another. Furthermore, the singular expression includes the plural expression unless the context clearly indicates otherwise. Furthermore, terms such as "include" or "have" indicate the presence of a feature or component described in the specification, and do not preemptively exclude the possibility that one or more other features or components may be added. Furthermore, in the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

Fig. 1 is a perspective view of a camera capable of booting at low temperatures by heating and dissipating heat according to an embodiment of the present invention. In addition, Figs. 2 to 5 illustrate the camera module from various angles. In addition, Fig. 6 illustrates a support module, and Fig. 7 illustrates a heat transfer pad. Fig. 7(a) illustrates a state in which the heat transfer pad is unfolded, and Fig. 7(b) illustrates a state in which the second and third heat transfer pads provided on both sides of the first heat transfer pad are bent at a predetermined angle. In addition, Fig. 8 schematically illustrates a power control board, and Fig. 9 schematically illustrates a portion of a side surface of the camera module.

Referring to FIGS. 1 to 9, a camera (10) capable of booting at low temperatures according to heating and dissipation according to an embodiment of the present invention may be, but is not limited to, an IP network camera or a coaxial camera. The camera (10) includes a main body (20), and a camera module (100) may be installed inside the main body (20).

The camera module (100) may include a lens module (110), a light-emitting module (200), a control board (30), a heat dissipation module (600), a heat transfer pad (700), a temperature sensor module (800), and a support module (900).

The lens module (110) can be precisely designed to optimize optical performance and provide clear images even in various shooting environments. The lens module (110) may include, but is not limited to, a lens, a coating applied to the lens, an aperture, a focus ring, a zoom ring, and a body mount. The lens may be composed of multiple lenses, each lens element having a specific refractive index and capable of refracting light to focus an image. The coating may be multi-layered to reduce reflections of the lens elements and increase transmittance, and this coating may reduce flare or ghosting that may occur in the lens. The aperture is composed of an openable diaphragm located in the middle of the lens and can control the amount of light passing through. The aperture value (f-stop) controls the size of the aperture to control the amount of light and provide a sense of depth and background blur (bokeh) effect. The focus ring is a ring that helps the user manually focus. By operating this ring, the position of the lens elements can be adjusted and the desired subject can be precisely focused on. The zoom ring allows the user to adjust the focal length of the lens to change the size of the subject being photographed. The body mount houses the aforementioned lens elements, provides mechanical and electronic connections between various components within the lens module (110), and allows for communication to adjust functions such as autofocus.

The light emitting module (200) may include a light emitting element (210), a light emitting module substrate (230), and a light emitting module connector (220). A plurality of light emitting elements (210) may be mounted on the light emitting module substrate (230). A plurality of light emitting elements (210) may be mounted spaced apart from each other on the upper surface of the light emitting module substrate (230). An opening may be formed in the central region of the light emitting module substrate (230), and a portion of the lens module (110) may be exposed through the opening. The light emitting module substrate (230) may have a circular opening formed in the center and may be configured as a circular plate shape overall, but is not limited thereto. The lead of the light emitting element (210) may be connected to the light emitting module substrate (230) as a metal wire that provides an electrical connection. The light emitting module substrate (230) may effectively disperse heat generated from the light emitting element (210). In various embodiments, a light emitting module driver may be installed on the light emitting module substrate (230). The light emitting module driver may be configured to provide power for driving the light emitting element (210), maintain a constant current to ensure stable operation of the light emitting element (210), and protect the light emitting element (210) from overcurrent or overcurrent. A light emitting module connector (220) may be installed on the light emitting module substrate (230). The light emitting module connector (220) may be installed in an edge region of the lower surface of the light emitting module substrate (230). In various embodiments, the light emitting module connector (220) may be electrically connected to the light emitting module driver. One end of a light emitting module wire (221) may be electrically connected to the light emitting module connector (220).

The control board (30) may include an image signal processing board (300), a main control board (400), and a power control board (500). The image signal processing board (300), the main control board (400), and the power control board (500) may be installed on each layer separated by a support module (900).

The image signal processing board (300) can have a lens module (110) mounted on it.

An image sensor (370) may be installed on the image signal processing board (300). An image sensor (370) may be installed on the lower surface of the image signal processing board (300).

The image signal processing board (300) can receive raw digital image data generated by the image sensor (370) and process and optimize it. In various embodiments, the image signal processing board (300) can perform various digital image processing tasks such as color correction, noise reduction, resolution adjustment, and improving the clarity and contrast of the image. In addition, it is responsible for compression, file format conversion, and execution of advanced functions (such as face recognition and HDR image generation), and can transmit the processed image to a storage medium or output it to a display device.

The image sensor (370) can convert light collected from the lens module (110) into an electrical signal. In various embodiments, the image sensor (370) can convert analog light signals into digital data using, but is not limited to, CMOS (Complementary Metal-Oxide-Semiconductor) or CCD (Charge-Coupled Device) technology.

The main control board (400) is located at the lower side of the image signal processing board (300) and can be responsible for performing the overall functions of the camera (10). A processor and memory can be mounted thereon, and in various embodiments, a communication device and an input/output interface can be provided on the main control board (400).

The power control board (500) may be located at the lower side of the main control board (400). The power control board (500) includes a power control board (510), and the power control board (510) may be provided with an external power input connector (520), a heater connection connector (530), a temperature sensor connection connector (540), and a main board power connection connector (550).

The heat dissipation module (600) may be installed between the image signal processing board (300) and the heat transfer pad (700). One surface of the heat dissipation module (600) may be in contact with one surface of the image sensor (370). The upper surface of the image sensor (370) is mounted on the image signal processing board (300), and the lower surface of the image sensor (370) may be in contact with the upper surface of the heat dissipation module (600). The lower surface of the heat dissipation module (600) may be in contact with the heat transfer pad (700).

The heater module (610) can be installed in the heat dissipation module (600). In various embodiments, a through hole is formed through the heat dissipation module (600), and the heater module (610) can be inserted into the through hole.

In various embodiments, the hole may be formed to penetrate the heat dissipation module (600) in a direction parallel to the image signal processing board (300). A heater connection line (611) may be connected to the heater module (610). One end of the heater connection line (611) may be connected to the heater module (610), and the other end may be connected to the heater connection connector (530) on the power control board (500).

In various embodiments, the heater module (610) may be configured as, but is not limited to, a positive temperature coefficient (PTC) heater.

The heat transfer pad (700) may include first to third heat transfer pads (710, 720, 730). In various embodiments, the heat transfer pad (700) may be composed of, but is not limited to, beryllium copper.

In various embodiments, the heat transfer pad (700) may have a predetermined elasticity.

In various embodiments, the first heat transfer pad (710) may be configured as a square pad type, the second heat transfer pad (720) may be connected to one side of the first heat transfer pad (710), and the third heat transfer pad (730) may be connected to the other side of the first heat transfer pad (710). The second and third heat transfer pads (720, 730) may be configured in a shape that is bent downward at a predetermined angle with respect to the connection point between the second and third heat transfer pads (720, 730) and the first heat transfer pad (710), respectively. In various embodiments, the first to third heat transfer pads (710, 720, 730) may be configured integrally with each other. A fastening hole (711) for fastening to the support module (900) may be formed in an edge region of the first heat transfer pad (710). The first heat transfer pad (710) can be connected to the support module (900) and positioned between the image signal processing board (300) and the main control board (400). In addition, the heat dissipation module (600) can be in contact with the first heat transfer pad (710).

The second and third heat transfer pads (720, 730) can be connected to the first heat transfer pad (710) with a predetermined elasticity so as to be in contact with the inner side of the main body (20). In addition, the second and third heat transfer pads (720, 730) are configured with a predetermined thickness so that when the camera module (100) is installed on the inner side of the main body (20), they can maintain elasticity with a predetermined strength while in contact with the inner side of the main body (20) and maintain contact with the inner surface of the main body (20).

A temperature sensor module (800) can be installed in a support module (900). A sensor connection line (810) can be connected to the temperature sensor module (800). One end of the sensor connection line (810) can be connected to the temperature sensor module (800), and the other end can be connected to a temperature sensor connection connector (540).

The support module (900) may include first to fourth support modules (910, 920, 930, 940).

In various embodiments, the first to fourth support modules (910, 920, 930, 940) may be composed of a material having excellent heat transfer properties. For example, the first to fourth support modules (910, 920, 930, 940) may be composed of beryllium copper, but are not limited thereto.

Each of the first to fourth support modules (910, 920, 930, 940) may be configured in the shape of a polygonal column. For example, it may be configured in the shape of a hexagonal column, but is not limited thereto.

A first protrusion may be formed on one side of each of the first to fourth support modules (910, 920, 930, 940), and a second protrusion may be formed on the other side. In addition, a protrusion insertion hole may be formed in the first protrusion.

The first support module (910) may include a first long-axis support module (911) and a first short-axis support module (912). The first long-axis support module (911) may be formed with a first length, and the first short-axis support module (912) may be formed with a second length that is shorter than the first length.

The second protrusion of the first long axis support module (911) is inserted into the protrusion insertion hole formed on the first protrusion of the first short axis support module (912), so that the first long axis support module (911) and the first short axis support module (912) can be fastened to each other.

The first short-axis support module (912) may be composed of a plurality of short-axis support modules, which may be composed of the same second length. Each of these may be connected to a plurality of first short-axis support modules in a row in such a manner that the second protrusion of the short-axis support module located at the top is inserted into the protrusion insertion hole on the first protrusion of the short-axis support module located at the bottom. In addition, the second protrusion of the first long-axis support module (911) may be inserted into the protrusion insertion hole formed on the first protrusion of the short-axis support module located at the top.

The second support module (920) may include a second long-axis support module (921) and a second short-axis support module (922), similar to the first support module (910). The second long-axis support module (921) may be formed with a first length, and the second short-axis support module (922) may be formed with a second length that is shorter than the first length.

The third support module (930) may be composed of a plurality of third short-axis support modules, similar to the first short-axis support module (912) described above, and these may be composed of the same second length.

The fourth support module (940) may be composed of a plurality of fourth short-axis support modules, similar to the first short-axis support module (912) described above, and these may be composed of the same second length.

Each of the first short-axis support module (912), the second short-axis support module (922), the third support module (930), and the fourth support module (940) may be composed of a total of four short-axis support modules.

The first stage is defined between the first and second long axis support modules (911, 921) and the uppermost short axis support module (the first short axis support module) of the first short axis support module (912), the second short axis support module (922), the third support module (930) and the fourth support module (940), the second stage is defined between the uppermost short axis support module (the first short axis support module) and the second short axis support module of the first short axis support module (912), the second short axis support module (922), the third support module (930) and the fourth support module (940), the third stage is defined between the second short axis support module and the third short axis support module of the first short axis support module (912), the second short axis support module (922), the third support module (930) and the fourth support module (940), the third stage is defined between the first short axis support module (912), the second short axis support module (922), the third support module (930) and the fourth support module (940), the third stage is defined between the first short axis support module (912), the second short axis support module (922), the third support module (930) and the fourth support module (940), the third stage is defined between the second short axis support module and the third short axis support module. The area between the third and fourth short-axis support modules of the short-axis support module (922), the third support module (930), and the fourth support module (940) can be defined as the fourth stage.

An image signal processing board (300) may be located in the first stage, a first heat transfer pad (710) may be located in the second stage, a main control board (400) may be located in the third stage, and a power control board (500) may be located in the fourth stage.

Additionally, a light emitting module (200) may be installed on the first protrusion of the first and second long axis support modules (911, 921).

The control board (30) can be configured in a square type, and four fastening holes can be formed on the corner sides.

The second protrusions of the first and second long-axis support modules (911, 921) can be fastened to the protrusion insertion holes on the first protrusions of the uppermost short-axis support modules (first short-axis support modules) of the first short-axis support module (912), the second short-axis support module (922), the third support module (930), and the fourth support module (940) by penetrating the fastening holes of the image signal processing board (300).

The second protrusion of the first short-axis support module of the first short-axis support module (912), the second short-axis support module (922), the third support module (930), and the fourth support module (940) can be fastened to the protrusion insertion hole on the first protrusion of the second short-axis support module through the fastening hole of the heat transfer pad (710).

The second protrusion of the second short-axis support module of the first short-axis support module (912), the second short-axis support module (922), the third support module (930) and the fourth support module (940) can be fastened to the protrusion insertion hole on the first protrusion of the third short-axis support module through the fastening hole of the main control board (400).

The second protrusion of the third short-axis support module of the first short-axis support module (912), the second short-axis support module (922), the third support module (930), and the fourth support module (940) can be fastened to the protrusion insertion hole on the first protrusion of the fourth short-axis support module through the fastening hole of the power control board (500).

The support module (900) can stack a control board (30), a heat transfer pad (710), a lens module (110), and a light emitting module (200) in a tower shape.

The support module (900) mechanically supports the main components of the camera module (100) and ensures that each part is stably fixed in place. In addition,

The support module (900) is positioned between various components such as the heat transfer pad (700), image signal processing board (300), and main control board (400), and serves to efficiently dissipate heat by assisting in the heat management of these components.

The support module (900) is made of a material that conducts heat well, which allows the heat generated internally to be transferred to the support module (900) itself and to be released into the surrounding air through a wider surface area. In addition, the support module (900) regulates the temperature of components that generate high heat, such as the image sensor (370) or the control board (30).

The support module (900) effectively transfers heat generated internally to the outside together with the heat transfer pad (700), thereby contributing to lowering the overall temperature of the camera (10). In addition, the support module (900) uniformly distributes heat and maintains the performance and stability of the camera (10) by contacting the main body (20) of the camera (10) and transferring heat to the outside of the camera (10).

In addition, the support module (900) is configured such that each of the plurality of single-axis support modules acts as a separate heat dissipation area, thereby more effectively dissipating the heat generated internally. In addition, since each module independently receives and dissipates heat, the heat distribution of the entire camera (10) system can be more uniform. In addition, the arrangement of the plurality of single-axis support modules prevents heat from being concentrated in one spot and allows the heat to spread over a wider area through the entire support structure. In addition, the plurality of single-axis support modules are connected to each other, thereby allowing heat to be effectively transferred from one module to another. This connected structure allows heat to move quickly within the support modules, thereby promoting heat transfer from high-temperature areas to low-temperature areas. This continuous heat transfer is particularly important when the camera (10) is exposed to a high-temperature environment, and prevents the internal components from overheating. In addition, the structure of the plurality of single-axis support modules increases the contact area with the main body (20), thereby allowing the heat generated internally to be more efficiently discharged to the outside. As each module comes into contact with the side of the main body (20) of the camera (10), the path for heat to be transferred to the outside increases, which improves the overall heat dissipation effect. In addition, since the control board (30) and the heat transfer pad (700) are positioned in multiple stages separated by the connection points of the multiple short-axis support modules and long-axis support modules, each stage can independently manage and disperse heat. This more effectively controls the heat generated within the camera (10) and prevents excessive heat concentration in a specific area. In addition, the separate arrangement of the boards constituting the control board (30) and the heat transfer pad prevents heat from being directly transferred to important electronic components, reducing the risk of performance degradation or damage due to heat. In addition, each layer (stage) in the multi-layer structure performs a separate functional role, which increases the mechanical stability of the entire system, and the connected short-axis support modules and long-axis support modules form a strong support structure, strengthening resistance to physical shock or vibration. In addition, the components located in each stage improve accessibility and ease of replacement, thereby facilitating maintenance and upgrades of the system. For example, if a problem occurs with a single component, only that component can be isolated and repaired or replaced.

FIG. 10 is a flowchart of a method for driving a camera capable of booting at low temperatures by heating and dissipating heat according to an embodiment of the present invention.

Referring to FIG. 10, a method for driving a camera capable of booting at a low temperature according to heating and dissipation according to an embodiment of the present invention (S100) may include a camera driving signal receiving step (S110), a camera internal temperature sensing step (S120), a step of determining whether the temperature is higher than a preset temperature (S130), a main control board driving step (S140), a camera driving step (S150), and a heating mode execution step (S160).

- Camera drive signal reception step (S110)

The power control board (500) can detect the reception of a camera drive signal. The camera drive signal may be an external power signal. In various embodiments, the power control board (500) can determine that a camera drive signal has been received when external power is input through the external power input connector (520). In various embodiments, the power control board (500) may also receive a camera drive signal from an external device.

- Camera internal temperature sensing step (S120)

The power control board (500) can detect sensing information from the temperature sensor module (800) in response to receiving a camera drive signal. The temperature sensor module (800) can detect the temperature inside the camera (10).

- Step for determining whether the temperature is above the preset temperature (S130)

The power control board (500) can determine whether the temperature inside the camera (10) is higher than the preset temperature. If the power control board (500) determines that the temperature inside the camera (10) is higher than the preset temperature, it can supply driving power to the main control board (400).

- Main control board operation stage (S140) and camera operation stage (S150)

The main control board (400) can drive the camera (10) in response to receiving the driving power. That is, the main control board (400) can control the image signal processing board (300) in response to receiving the driving power so that preset functions such as driving the lens module (110) and the image sensor (370), as well as shooting, transmitting the shot image, and recording the shot image of the camera (10) are performed.

- Heating mode execution step (S160)

If the power control board (500) determines that the temperature inside the camera (10) is lower than the preset temperature, it can supply a power signal to the heater module (610) for heating the heater module (610). The heater module (610) can generate heat upon receiving the power signal.

The power control board (500) can monitor the temperature inside the camera (10) through the temperature sensor module (800) while the heater module (610) is operating.

If the power control board (500) determines that the temperature inside the camera (10) is higher than the preset temperature, the heating of the heater module (610) is stopped, and the above-described main control board driving (S140) and camera driving (S150) steps can be performed.

For example, the temperature inside the main body (20) of the camera (10) is measured using the temperature sensor module (800) in the power control board (500), and when the temperature is, for example, less than 0°C, the heater module (610) in the power control board (500) is heated to raise the inside of the camera to the required temperature in a short period of time, and when the temperature inside the camera measured by the temperature sensor module (800) rises to, for example, 0°C or higher, the heating of the heater module (610) in the power control board (500) is stopped and power is supplied to the main control board (400) so that the camera (10) can operate normally, and the high temperature of the image sensor (370) can be dissipated through the main body (20) of the camera (10) in contact with the attached heat dissipation module (600), the heat transfer pad (700), and the support module (900), thereby enabling normal operation.

FIG. 11 is a flowchart of a method for driving a camera capable of booting at low temperatures by heating and dissipating heat according to various embodiments of the present invention.

Referring to FIG. 11, a method for driving a camera capable of booting at a low temperature according to heating and dissipation according to various embodiments of the present invention (S200) may include a camera driving signal receiving step (S210), a camera internal temperature sensing step (S220), a step of determining whether the temperature is higher than a preset first temperature (S230), a main control board driving step (S240), a camera driving step (S250), a heating mode performing step (S260), and a step of determining whether the temperature is higher than a preset second temperature (S270).

- Camera drive signal reception step (S210)

The power control board (500) may wake up in response to the application of an external power signal and determine that a camera drive signal has been received. In various embodiments, the power control board (500) may also receive a camera drive signal from an external device.

- Camera internal temperature sensing step (S220)

The power control board (500) can detect the temperature inside the camera (10) from the temperature sensor module (800) in response to receiving a camera drive signal.

- Step for determining whether the temperature is higher than the preset first temperature (S230)

The power control board (500) can determine whether the temperature inside the camera (10) is higher than the preset first temperature. If the power control board (500) determines that the temperature inside the camera (10) is higher than the preset first temperature, it can supply driving power to the main control board (400).

- Main control board operation stage (S240) and camera operation stage (S250)

The main control board (400) can normally operate the camera (10) in response to receiving the driving power. That is, the main control board (400) can control the image signal processing board (300) in response to receiving the driving power so that preset functions such as shooting, transmitting a shot image, and recording a shot image of the camera (10) are performed.

- Heating mode execution step (S260)

If the power control board (500) determines that the temperature inside the camera (10) is lower than the preset first temperature, it supplies a power signal for heating the heater module (610) to the heater module (610), and heats the heater module (610). The heat generated by the heating of the heater module (610) is transferred to the heat dissipation module (600), and the heat is transferred to the image sensor (370) in contact with the heat dissipation module (600), thereby increasing the temperature of the image sensor (370). In addition, the heat is transferred to the heat transfer pad (700) in contact with the heat dissipation module (600), and the heat is transferred to the support module (900) in contact with the heat transfer pad (700), thereby increasing the internal temperature of the camera (10).

- Step for determining whether the temperature is higher than the preset second temperature (S270)

The power control board (500) monitors the temperature inside the camera (10) through the temperature sensor module (800) while the heater module (610) is operating, and if the power control board (500) determines that the temperature inside the camera (10) is higher than the preset second temperature, the heating of the heater module (610) is stopped, and the main control board operating (S240) and camera operating (S250) steps described above can be performed.

The second temperature here may have a higher temperature value than the first temperature.

For example, the temperature inside the main body (20) of the camera (10) is measured using the temperature sensor module (800) in the power control board (500), and when the temperature is, for example, less than 0°C, the heater module (610) in the power control board (500) is heated to raise the inside of the camera to the required temperature in a short period of time, and when the temperature inside the camera measured by the temperature sensor module (800) rises to, for example, 10°C or higher, the heating of the heater module (610) in the power control board (500) is stopped and power is supplied to the main control board (400) so that the camera (10) can operate normally, and the high temperature of the image sensor (370) can be dissipated through the main body (20) of the camera (10) in contact with the attached heat dissipation module (600), the heat transfer pad (700), and the support module (900), thereby enabling normal operation.

- Heating process

In the embodiment, when external power is applied to the camera (10), the power control board (500) heats the heater module (610), so that the temperature of the heater module (610) itself can rapidly increase. For example, the heater module (610) can increase from -50°C to 160°C in just a few seconds. As the heater module (610) is heated, the heat dissipation module (600) surrounding the heater module (610) can be heated and transfer heat to the surroundings. That is, the heated heat dissipation module (600) contacts the elastic heat transfer pad (700) to transfer heat to the heat transfer pad (700), and the heat is transferred through the inner surface of the main body (20) in contact with the support module (900) connected to the four corners of the first heat transfer pad (710) and the second and third heat transfer pads (720, 730), thereby increasing and spreading the temperature inside the camera (10) as a whole. In addition, when the internal temperature of the camera (10) reaches 0°C through the temperature sensor module (800), the control of the heater module (610) is cut off from the power control board (500), and power is supplied to the main control board (400) to drive the camera (10).

- The process of dissipation

When power is normally supplied from the main control board (400) and the camera (10) is operated, the temperature of the image sensor (370) may rise above a predetermined temperature (for example, above 60°C) due to heavy work, making normal operation of the camera (10) difficult. In addition, when sunlight is directly irradiated on the camera (10) outdoors in the summer, the internal temperature of the camera (10) may increase significantly (for example, up to 80°C). At this time, the heat dissipation module (600) is in contact with the image sensor (370), so that the heat emitted from the image sensor (370) is dissipated to the outside through the main body (20) in contact with the heat transfer pad (700), the support module (900), and the second and third heat transfer pads (720, 730), thereby maintaining the normal operating temperature range of the camera.

FIG. 12 is a perspective view of a camera capable of booting at low temperatures by heating and dissipating heat according to another embodiment of the present invention.

Referring to Fig. 12, the camera (10) may be an IP network camera type. The camera module (100) may further include a PoE (Power over Ethernet) power control board (570) to quickly heat the camera in an ultra-low temperature state and drive the camera using a PoE (Power over Ethernet) power control board after a certain temperature is reached. In addition, in order to support the PoE power control board (570), one short-axis support module is added to each of the first to fourth support modules (910, 920, 930, 490) described in Fig. 6, forming a total of five stages, and a PoE power control board (570) may be further installed at the lowest stage. The operation process of such a configuration will be described in more detail below.

In the embodiment according to Fig. 2, the described power control board (500) may be referred to as a heating power control board (500). That is, when an external power source (e.g., an adapter, a DC power source, etc.) is applied to the camera (10), power is first input to the heating power control board (500) to control the operation of the PTC heater module (610).

The heating power control board (500) detects the internal temperature of the camera from the temperature sensor module (800) and can supply driving current to the heater module (610) when the temperature is lower than a set reference temperature (e.g., 0°C or lower).

When the heater module (610) is driven, the temperature rapidly increases to a high temperature (e.g., 160°C) within a very short time (e.g., about 3 seconds) even in an extremely low temperature environment such as -50°C, and accordingly, the temperature of the heat dissipation module (600) can also rapidly increase.

The heated heat dissipation module (600) is assembled so as to be in direct contact with a heat transfer pad (700) including beryllium copper (e.g., the first to third heat transfer pads (710, 720, 730)), so that the heat of the heat dissipation module (600) can be spread throughout the interior of the camera through the heat transfer pad (700).

In particular, the heat transfer pad (700) made of beryllium copper is manufactured to have a certain thickness and elasticity, so that it can always maintain a state of close contact with the inner surface of the main body (20) of the camera (10). At this time, the beryllium copper pads are connected to the support module (900), and both ends of the heat transfer pad (700) are in contact with the case (inside the main body (20)) of the camera (10), so that localized high heat is uniformly transferred and spread throughout the inside of the camera. Accordingly, the internal temperature of the camera (10) rises in a short period of time, and when the temperature measured by the temperature sensor module (800) reaches a reference temperature of, for example, 0°C or higher, the heating power control board (500) can block the driving current to the heater module (610) to prevent unnecessary overheating.

In an embodiment of the present invention, in addition to the aforementioned heating power control board (500), a PoE power control board (570) may be further installed at the bottom. That is, in addition to the image signal processing board (300), main control board (400) , and heating power control board (500) (= power control board) that constitute the control board (30) in the embodiment according to FIG. 2, a PoE power control board (570) may be placed on the lower layer.

To this end, one additional short-axis support module may be additionally connected to each of the first to fourth support modules (910, 920, 930, 940) of the support module (900), thereby forming a total of five stages. A PoE power control board (570) may be positioned at the lowest stage (the fifth stage) among the five stages.

The PoE power control board (570) is a board for the PoE (Power over Ethernet) power method. After the heating process is completed (or according to an external specific control signal), it receives power from the heating power control board (500) and distributes power to the main control board (400), thereby operating the camera (10) normally.

- Heating action

1) External power supply

When an external adapter power source (such as 12 V DC) is supplied to the IP camera (10), power is first supplied to the heating power control board (500).

2) PTC heater module (610) operation

When the heating power control board (500) determines that the internal temperature is below a standard (e.g., -50°C) through the temperature sensor module (800), it heats the PTC heater module (610). The heater module (610) quickly raises its temperature to a preset high temperature (e.g., 160°C) and transfers heat through the heat dissipation module (600).

3) Heat diffusion

The heated heat dissipation module (600) directly contacts the heat transfer pad (700) to raise the overall internal temperature of the camera (10). The heat can be evenly spread through the camera case (inner surface of the main body (20)) and the support module (900) that are in contact with the beryllium copper.

4) Power switching after reaching temperature standard

When the internal temperature reaches, for example, 0°C through the temperature sensor module (800), the heating power control board (500) can stop the operation of the heater module (610) and supply power to the PoE power control board (570).

5) Power on the PoE power control board (570) and apply power to the main control board (400).

The PoE power control board (570) then supplies driving power to the main control board (400), and the main control board (400) activates the image signal processing board (300), the image sensor (370), the lens module (110), etc., so that the camera (10) can normally perform functions such as shooting, image transmission, and recording.

- Dispersive action

Even in the embodiment of the present invention, during the process of driving the camera through the main control board (400), the image sensor (370) may rise to a high temperature (for example, 60°C to 80°C or higher), or in the summer, direct sunlight may be irradiated on the camera (10), causing the internal temperature to rapidly rise. At this time, similarly to the embodiment according to FIG. 2, heat conduction between the heat dissipation module (600) and the heat transfer pad (700) (beryllium copper) , the support module (900) , and the camera (10) body (20) is actively performed, so that the excessively increased heat can be quickly released (heat dissipated) to the outside. Through this, the internal components including the image sensor (370) can maintain a stable temperature range and continue normal operation. That is, in the embodiment, the PoE power control board (570) can be configured to receive power from the PoE power control board (570) in the normal operation phase after completion of low-temperature booting and distribute it to the main control board (400), etc., or in some cases, to operate the camera (10) only with PoE power through a network cable instead of an external power source (e.g., IP camera environment).

According to an embodiment, by driving the heater module (610) in a short time through the heating power control board (500) immediately after external power is applied, the camera can be quickly and stably heated in an extremely low temperature environment (-50°C, etc.).

After heating is complete, stable power is supplied to the main control board (400) through the PoE power control board (570), so that the camera operates normally and video shooting, transmission, recording, etc. are possible. In particular, power can be conveniently supplied even in a PoE environment.

In addition, by securing each layer (stage) of the support module (900) additionally and placing the PoE power control board (570) in a separate space, thermal interference is reduced and accessibility for maintenance or board replacement when necessary is improved, which has the advantage of being improved.

Referring again to Fig. 10, a method of driving the camera of Fig. 12 capable of booting at low temperatures according to heating and dissipation is described.

- Camera drive signal reception step (S110)

When an external power source (e.g., an adapter, DC power, etc.) is supplied, the heating power control board (500) can recognize this as a camera drive signal being input. At this time, although a PoE power control board (570) is separately installed below the heating power control board (500), the initial power supply path still enters the heating power control board (500).

- Camera internal temperature sensing step (S120)

The heating power control board (500) can measure the internal temperature of the camera (10) through the temperature sensor module (800). The sensing value can be periodically checked to determine whether the internal temperature is below a preset temperature (e.g., 0°C).

- Step for determining whether the temperature is above the preset temperature (S130)

The heating power control board (500) determines whether the internal temperature is higher than a predetermined reference temperature (e.g., 0°C). If it is higher than the reference temperature, power is immediately supplied to the main control board (400) (proceed to S140 below), and if it is lower than the reference temperature, the heater module (610) is driven to perform heating for low-temperature booting (S160).

- Main control board driving stage (S140) and camera driving stage (S150)

If it is determined that the temperature is higher than the reference temperature, the heating power control board (500) supplies driving power to the main control board (400). Thereafter, the main control board (400) can perform the main functions (capture, image processing, storage, transmission, etc.) of the camera (10) including the image signal processing board (300). In the embodiment, in order to stably supply power to the main control board (400), the heating power control board (500) can also supply power to the PoE power control board (570) when necessary to drive the camera in a PoE environment.

- Heating mode execution step (S160)

The heating power control board (500) can send a driving signal to the heater module (610) to perform rapid heating when the internal temperature of the camera (10) measured by the temperature sensor module (800) is below a reference value. For example, the heater module (610) can raise the temperature to 160°C in just 3 seconds even in an extremely low temperature environment such as -50°C, and this heat can raise the internal temperature of the entire camera through the heat dissipation module (600), the heat transfer pad (700) (e.g., beryllium copper), the support module (900), and the main body (20). When the internal temperature reaches 0°C (or a set value), the heating power control board (500) can stop driving the heater module (610) and drive the main control board (400) (see S140 to S150).

Referring again to Fig. 11, a method of driving the camera of Fig. 12 capable of booting at low temperatures according to heating and dissipation is described.

- Camera drive signal reception step (S210)

When power is supplied from the outside (Wake-up), the heating power control board (500) can recognize that a camera (10) drive signal has been input.

- Camera internal temperature sensing step (S220)

The heating power control board (500) measures the internal temperature of the camera through the temperature sensor module (800) and can check preset temperatures (e.g., first temperature, second temperature).

- Step for determining whether the temperature is higher than the preset first temperature (S230)

For example, if the internal temperature of the camera (10) is higher than the first temperature (e.g., 0°C), driving power can be supplied to the main control board (400) (S240) and the camera can be driven (S250).

If it is below the first temperature, it can enter heating mode (S260).

- Main control board driving stage (S240) and camera driving stage (S250)

Similar to FIG. 10, when driving power is supplied to the main control board (400), the camera (10) can perform functions such as shooting, image processing, and transmission. According to an embodiment, the power supplied to the main control board (400) may come in through the PoE power control board (570), and a structure in which power supplied from the PoE network (or power from an external adapter of the heating power control board (500)) is converted and distributed by the PoE power control board (570) is possible.

- Heating mode execution step (S260)

When the internal temperature of the camera (10) is lower than the first temperature, the heating power control board (500) drives the heater module (610) to heat the heat dissipation module (600), the heat transfer pad (700), the support module (900), and the entire body (20). After a certain period of time, when the internal temperature rises above the second temperature (e.g., 10°C, etc.), the heater operation is stopped and the main control board (400) operation step is performed (S240 to S250).

- Step for determining whether the temperature is higher than the preset second temperature (S270)

When the temperature sensor module (800) detects that the internal temperature has reached the second temperature (higher than the first temperature) during heating mode, the heating power control board (500) stops the operation of the heater module (610) and starts supplying power to the main control board (400) so that the camera can operate normally.

The embodiments of the present invention described above may be implemented in the form of program commands that can be executed through various computer components and recorded on a computer-readable recording medium. The computer-readable recording medium may include program commands, data files, data structures, etc., either singly or in combination. The program commands recorded on the computer-readable recording medium may be specially designed and configured for the present invention or may be known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specifically configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc. Hardware devices may be changed into one or more software modules to perform processing according to the present invention, and vice versa.

The specific implementations described in the present invention are exemplary embodiments and do not limit the scope of the present invention in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted. In addition, the lines connecting or connecting members between components depicted in the drawings are merely representative of functional connections and/or physical or circuit connections, and may be replaced or represented as various additional functional connections, physical connections, or circuit connections in an actual device. In addition, unless specifically mentioned as "essential," "important," etc., a component may not be absolutely necessary for the application of the present invention.

Although the detailed description of the present invention has been described with reference to preferred embodiments of the present invention, it will be understood by those skilled in the art or having ordinary knowledge in the art that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

Claims (11)

A lens module that receives light from outside;
A control board including an image sensor that converts light received from the lens module into an electrical signal and operates in response to a camera driving signal;
Heat dissipation module for heating and heat dissipation;
A heat transfer pad that transfers heat from the above heat dissipation module;
Temperature sensor module that senses temperature;
A heater module installed in the above heat dissipation module and generating heat;
A support module composed of multiple stages to support the above control board and assist in heat transfer; and
A main body including the lens module, control board, heat dissipation module, heat transfer pad, temperature sensor module, support module and heater module;
The above control board is a plurality of boards installed in each of the plurality of stages,
An image signal processing board including the above image sensor,
A main control board that controls the image signal processing board in response to the application of a power signal,
A heating power control board that increases the internal temperature of the camera by driving the above heater module, and
It is provided separately from the above heating power control board and includes a PoE power control board that provides driving power to the above main control board.
The above heating power control board, in response to an external power input, drives the heater module to increase the internal temperature of the camera when the temperature detected by the temperature sensor module is below a preset reference temperature, and controls the supply of power to the PoE power control board when the detected temperature rises above the reference temperature.
The above PoE power control board receives power from the heating power control board and supplies driving power to the main control board to initiate booting of the camera.
The above heat dissipation module is located between the image signal processing board and the heat transfer pad and is in contact with the image signal processing board and the heat transfer pad.
The above support module includes first to fourth support modules,
The first and second support modules include a long-axis support module and a plurality of first short-axis support modules connected in a row to each other, and the third and fourth support modules include a plurality of second short-axis support modules connected in a row to each other.
The above image signal processing board is connected between the long axis support module and the first short axis support module,
The above main control board and the above PoE power control board are each connected between different second short-circuit support modules,
The above plurality of boards are positioned at a predetermined distance from each other by the support module,
The above support module heats or dissipates heat by conducting heat from the plurality of boards and the heat transfer pad.
A camera that can boot at low temperatures depending on heating and dissipation.
In the first paragraph,
In each of the above multiple stages, the main control board, the heating power control board, and the POE power control board are sequentially stacked at a predetermined distance apart.
A camera that can boot at low temperatures depending on heating and dissipation. delete In the first paragraph,
The above heat dissipation module,
When heating through the above heater module, the overall temperature inside the camera increases,
When the camera is operated, the heat generated from the image sensor is configured to be dissipated to the outside through the heat transfer pad, support module, and main body.
A camera that can boot at low temperatures depending on heating and dissipation. In the first paragraph,
The above heating power control board stops the operation of the heater module when the temperature detected by the temperature sensor module is higher than the preset temperature and supplies power to the PoE power control board.
The above PoE power control board converts the received power and provides it to the main control board, thereby initiating normal operation of the camera.
A camera that can boot at low temperatures depending on heating and dissipation. delete delete In the first paragraph,
The above heat transfer pad contains beryllium copper,
It is formed with an elastic thickness, and maintains close contact with the inner surface of the camera body, thereby transmitting the heat generated during heating throughout the interior of the camera.
It is configured to dissipate heat generated from the image sensor to the outside when the camera overheats during operation.
A camera that can boot at low temperatures depending on heating and dissipation.
In the first paragraph,
The above heater module is composed of a PTC (Positive Temperature Coefficient) heater.
A camera that can boot at low temperatures depending on heating and dissipation. In the first paragraph,
The above PoE power control board provides power to the main control board using a network power supply method including PoE (Power over Ethernet).
A camera that can boot at low temperatures depending on heating and dissipation.


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