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CN108196418A - Laser projection module, depth camera and electronic device - Google Patents

Laser projection module, depth camera and electronic device Download PDF

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Publication number
CN108196418A
CN108196418A CN201810164311.XA CN201810164311A CN108196418A CN 108196418 A CN108196418 A CN 108196418A CN 201810164311 A CN201810164311 A CN 201810164311A CN 108196418 A CN108196418 A CN 108196418A
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Prior art keywords
conductive
circuit board
diffractive
laser
collimating
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吕杰
白剑
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN202011544934.3A priority Critical patent/CN112611546A/en
Priority to CN201810164311.XA priority patent/CN108196418A/en
Publication of CN108196418A publication Critical patent/CN108196418A/en
Priority to PCT/CN2019/074610 priority patent/WO2019165885A1/en
Priority to EP19737647.8A priority patent/EP3561590A4/en
Priority to TW108106937A priority patent/TWI696000B/en
Priority to US16/546,880 priority patent/US11307431B2/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

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  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Semiconductor Lasers (AREA)
  • Projection Apparatus (AREA)

Abstract

The invention discloses a laser projection module, a depth camera and an electronic device. The laser projection module comprises a laser emitter, an optical assembly, a circuit board assembly and a processor. The optical assembly is provided with a detection element. The circuit board assembly comprises a circuit board and a conductive element, and the detection element is electrically connected with the circuit board through the conductive element. The processor is connected with the circuit board. The processor is used for receiving the electric signal output by the detection element to judge whether the optical component is broken or not. According to the laser projection module, the depth camera and the electronic device, the detection element is arranged on the optical assembly, and the conductive element is used for electrically connecting the detection element with the circuit board, so that the processor can receive an electric signal output by the detection element, judge whether the optical assembly is broken according to the electric signal, and timely turn off the laser emitter or reduce the power of the laser emitter after the optical assembly is detected to be broken, so that the problem that the eyes of a user are injured due to overlarge laser energy is avoided.

Description

激光投射模组、深度相机和电子装置Laser projection module, depth camera and electronics

技术领域technical field

本发明涉及成像技术领域,特别涉及一种激光投射模组、深度相机和电子装置。The invention relates to the field of imaging technology, in particular to a laser projection module, a depth camera and an electronic device.

背景技术Background technique

现有的一些激光发射器会发射出聚焦信号较强的激光,这些激光经过准直元件、衍射元件后能量会衰减,以便满足信号强度低于对人体的伤害门限。这些激光发射器通常由玻璃或其他容易破碎的部件组成,一旦遇到摔落等情况,镜头破裂,则激光将直接发射出来,照射使用者的身体或眼睛,造成严重的安全问题。Some existing laser transmitters emit lasers with strong focused signals, and the energy of these lasers will be attenuated after passing through collimation elements and diffraction elements, so that the signal strength is lower than the threshold of harm to the human body. These laser emitters are usually composed of glass or other easily broken parts. Once the lens is broken in case of falling, the laser will be emitted directly to irradiate the user's body or eyes, causing serious safety problems.

发明内容Contents of the invention

本发明的实施例提供了一种激光投射模组、深度相机和电子装置。Embodiments of the present invention provide a laser projection module, a depth camera and an electronic device.

本发明实施方式的激光投射模组包括激光发射器、光学组件、电路板组件和与电路板组件连接的处理器。激光发射器用于发射激光。所述光学组件设置在所述激光发射器的发光光路上,所述激光经过所述光学组件后形成激光图案,所述光学组件上设置有检测元件。所述电路板组件包括电路板及导电元件,所述检测元件通过所述导电元件与所述电路板电连接,所述激光发射器设置在所述电路板组件上。所述处理器用于接收所述检测元件输出的电信号以判断所述光学组件是否破裂。The laser projection module according to the embodiment of the present invention includes a laser emitter, an optical component, a circuit board component and a processor connected to the circuit board component. Laser emitters are used to emit laser light. The optical assembly is arranged on the light-emitting optical path of the laser emitter, and the laser light forms a laser pattern after passing through the optical assembly, and a detection element is arranged on the optical assembly. The circuit board assembly includes a circuit board and a conductive element, the detection element is electrically connected to the circuit board through the conductive element, and the laser emitter is arranged on the circuit board assembly. The processor is used for receiving the electrical signal output by the detection element to determine whether the optical component is broken.

本发明实施方式的深度相机包括上述的激光投射模组、图像采集器和处理器。所述图像采集器用于采集由所述激光投射模组向目标空间中投射的激光图案,所述处理器用于处理所述激光图案以获得深度图像。The depth camera according to the embodiment of the present invention includes the above-mentioned laser projection module, an image collector and a processor. The image collector is used to collect the laser pattern projected by the laser projection module into the target space, and the processor is used to process the laser pattern to obtain a depth image.

本发明实施方式的电子装置包括壳体和上述的深度相机。所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像。An electronic device according to an embodiment of the present invention includes a housing and the aforementioned depth camera. The depth camera is disposed within and exposed from the housing to acquire depth images.

本发明实施方式的激光投射模组、深度相机和电子装置通过在光学组件上设置检测元件,并使用导电元件将检测元件与电路板电连接,从而使得处理器可以接收检测元件输出的电信号,以根据电信号判断光学组件是否破裂。在检测到光学组件破裂后,及时关闭激光发射器或减小激光发射器的功率,以避免光学组件破裂导致发射的激光能量过大而伤害用户的眼睛的问题,提升激光投射模组使用的安全性。The laser projection module, the depth camera and the electronic device in the embodiment of the present invention set the detection element on the optical assembly, and use the conductive element to electrically connect the detection element to the circuit board, so that the processor can receive the electrical signal output by the detection element, It can judge whether the optical component is broken according to the electrical signal. After detecting the rupture of the optical component, turn off the laser transmitter or reduce the power of the laser transmitter in time to avoid the problem of excessive laser energy emitted by the rupture of the optical component and damage the user's eyes, and improve the safety of the laser projection module. sex.

本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

附图说明Description of drawings

本发明上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and easy to understand from the following description of the embodiments in conjunction with the accompanying drawings, wherein:

图1是本发明某些实施方式的激光投射模组的结构示意图。FIG. 1 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图2是图1的激光投射模组沿II-II线的截面示意图。FIG. 2 is a schematic cross-sectional view of the laser projection module in FIG. 1 along line II-II.

图3是本发明某些实施方式的准直导电电极的线路示意图。Fig. 3 is a schematic circuit diagram of collimating conductive electrodes according to some embodiments of the present invention.

图4是本发明某些实施方式的激光投射模组的结构示意图。Fig. 4 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图5是图4的激光投射模组沿V-V线的截面示意图。FIG. 5 is a schematic cross-sectional view of the laser projection module in FIG. 4 along line V-V.

图6是本发明某些实施方式的激光投射模组的结构示意图。Fig. 6 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图7是图6的激光投射模组沿VII-VII线的截面示意图。FIG. 7 is a schematic cross-sectional view of the laser projection module in FIG. 6 along line VII-VII.

图8是本发明某些实施方式的激光投射模组的结构示意图。Fig. 8 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图9是本发明某些实施方式的衍射元件的剖面示意图。Fig. 9 is a schematic cross-sectional view of a diffraction element according to some embodiments of the present invention.

图10是本发明某些实施方式的衍射导电电极的线路示意图。Fig. 10 is a schematic circuit diagram of a diffractive conductive electrode according to some embodiments of the present invention.

图11是图8的激光投射模组沿XI-XI线的截面示意图。FIG. 11 is a schematic cross-sectional view of the laser projection module in FIG. 8 along line XI-XI.

图12是本发明某些实施方式的激光投射模组的结构示意图。Fig. 12 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图13是图12的激光投射模组沿XIII-XIII线的截面示意图。FIG. 13 is a schematic cross-sectional view of the laser projection module in FIG. 12 along line XIII-XIII.

图14是本发明某些实施方式的激光投射模组的结构示意图。Fig. 14 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图15是图14的激光投射模组沿XV-XV线的截面示意图。FIG. 15 is a schematic cross-sectional view of the laser projection module in FIG. 14 along line XV-XV.

图16是本发明某些实施方式的激光投射模组的结构示意图。Fig. 16 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图17是本发明某些实施方式的准直元件的剖面示意图。Fig. 17 is a schematic cross-sectional view of a collimating element according to some embodiments of the present invention.

图18是本发明某些实施方式的准直导电通路的线路示意图。Figure 18 is a circuit diagram of a collimating conductive path according to some embodiments of the present invention.

图19是图16的激光投射模组沿XIX-XIX线的截面示意图。FIG. 19 is a schematic cross-sectional view of the laser projection module in FIG. 16 along line XIX-XIX.

图20是本发明某些实施方式的激光投射模组的结构示意图。Fig. 20 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图21是图20的激光投射模组沿XXI-XXI线的截面示意图。FIG. 21 is a schematic cross-sectional view of the laser projection module in FIG. 20 along line XXI-XXI.

图22是本发明某些实施方式的激光投射模组的结构示意图。Fig. 22 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图23是图22的激光投射模组沿XXIII-XXIII线的截面示意图。FIG. 23 is a schematic cross-sectional view of the laser projection module in FIG. 22 along line XXIII-XXIII.

图24是本发明某些实施方式的激光投射模组的结构示意图。Fig. 24 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图25是本发明某些实施方式的衍射元件的剖面示意图。Fig. 25 is a schematic cross-sectional view of a diffraction element according to some embodiments of the present invention.

图26是本发明某些实施方式的衍射导电通路的线路示意图。Figure 26 is a schematic circuit diagram of a diffractive conductive pathway according to some embodiments of the present invention.

图27是图24的激光投射模组沿XXVII-XXVII线的截面示意图。FIG. 27 is a schematic cross-sectional view of the laser projection module in FIG. 24 along line XXVII-XXVII.

图28是本发明某些实施方式的激光投射模组的结构示意图。Fig. 28 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图29是图28的激光投射模组沿XXIX-XXIX线的截面示意图。FIG. 29 is a schematic cross-sectional view of the laser projection module in FIG. 28 along line XXIX-XXIX.

图30是本发明某些实施方式的激光投射模组的结构示意图。Fig. 30 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.

图31是图30的激光投射模组沿XXXI-XXXI线的截面示意图。FIG. 31 is a schematic cross-sectional view of the laser projection module in FIG. 30 along line XXXI-XXXI.

图32和图33是本发明某些实施方式的激光投射模组的结构示意图。FIG. 32 and FIG. 33 are structural schematic diagrams of laser projection modules in some embodiments of the present invention.

图34至图36是本发明某些实施方式的激光投射模组的部分结构示意图。34 to 36 are partial structural schematic diagrams of the laser projection module in some embodiments of the present invention.

图37是本发明某些实施方式的深度相机的结构示意图。Fig. 37 is a schematic structural diagram of a depth camera in some embodiments of the present invention.

图38是本发明某些实施方式的电子装置的结构示意图。Fig. 38 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.

具体实施方式Detailed ways

下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,旨在用于解释本发明,而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

在本发明的描述中,需要理解的是,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通信;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or indirectly connected through an intermediary, may be internal communication between two components or interaction between two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

请一并参阅图1和图2,本发明实施方式的激光投射模组100包括激光发射器10、光学组件40、电路板组件50和处理器80。激光发射器10用于发射激光、光学组件40设置在激光发射器10的发光光路上,激光经过光学组件40后形成激光图案。光学组件40上设置有检测元件70。电路板组件50包括电路板51和导电元件52。检测元件70通过导电元件52与电路板51电连接。激光发射器10设置在电路板组件50上。处理器80与电路板51连接。处理器80用于接收检测元件70输出的电信号以判断光学组件40是否破裂。Please refer to FIG. 1 and FIG. 2 together. The laser projection module 100 according to the embodiment of the present invention includes a laser emitter 10 , an optical component 40 , a circuit board component 50 and a processor 80 . The laser emitter 10 is used to emit laser light, and the optical assembly 40 is arranged on the light-emitting optical path of the laser emitter 10 , and the laser light forms a laser pattern after passing through the optical assembly 40 . A detection element 70 is disposed on the optical assembly 40 . The circuit board assembly 50 includes a circuit board 51 and conductive elements 52 . The detection element 70 is electrically connected to the circuit board 51 through the conductive element 52 . The laser emitter 10 is disposed on the circuit board assembly 50 . The processor 80 is connected to the circuit board 51 . The processor 80 is configured to receive the electrical signal output by the detection element 70 to determine whether the optical assembly 40 is broken.

激光投射模组100还包括镜筒60。镜筒60设置在电路板51上并与电路板51围成收容腔62。激光发射器10收容在收容腔62内。光学组件40包括收容在收容腔62内的衍射元件30和准直元件20。准直元件20与衍射元件30沿激光发射器10的发光光路依次设置。其中,准直元件20用于准直激光发射器10发射的激光。衍射元件30用于衍射经准直元件20准直后的激光以形成激光图案。The laser projection module 100 also includes a lens barrel 60 . The lens barrel 60 is disposed on the circuit board 51 and encloses a receiving chamber 62 with the circuit board 51 . The laser emitter 10 is accommodated in the accommodation cavity 62 . The optical assembly 40 includes a diffractive element 30 and a collimating element 20 accommodated in the receiving cavity 62 . The collimation element 20 and the diffraction element 30 are arranged in sequence along the light emitting path of the laser emitter 10 . Wherein, the collimation element 20 is used to collimate the laser light emitted by the laser emitter 10 . The diffraction element 30 is used to diffract the laser collimated by the collimation element 20 to form a laser pattern.

本发明实施方式的激光投射模组100通过在光学组件40上设置检测元件70,并使用导电元件52将检测元件70与电路板51电连接,从而使得处理器80可以接收检测元件70输出的电信号,以根据电信号判断光学组件40是否破裂。在检测到光学组件40破裂后,及时关闭激光发射器10或减小激光发射器10的功率,以避免光学组件40破裂导致发射的激光能量过大而伤害用户的眼睛的问题,提升激光投射模组100使用的安全性。The laser projection module 100 of the embodiment of the present invention arranges the detection element 70 on the optical assembly 40, and uses the conductive element 52 to electrically connect the detection element 70 to the circuit board 51, so that the processor 80 can receive the electrical output from the detection element 70. signal, so as to judge whether the optical component 40 is broken according to the electrical signal. After detecting that the optical assembly 40 is broken, turn off the laser emitter 10 or reduce the power of the laser emitter 10 in time, so as to avoid the problem that the emitted laser energy is too large and damage the user's eyes due to the rupture of the optical assembly 40, and improve the laser projection mode. Security used by group 100.

请一并参阅图1至图3,在某些实施方式中,导电元件52为多个,检测元件70为透光准直导电膜21。透光准直导电膜21设置在准直元件20上,透光准直导电膜21上设置有准直导电电极22。准直元件20破裂与否的判断机制如下:当准直元件20处于完好状态时,透光准直导电膜21的电阻较小,在此状态下给透光准直导电膜21通电,即施加一定大小的电压,则此时处理器80获取到的准直导电电极22输出的电流较大。而当准直元件20破裂时,形成在准直元件20上的透光准直导电膜21也会碎裂,此时碎裂位置处的透光准直导电膜21的电阻阻值接近无穷大,在此状态下给透光准直导电膜21上的准直导电电极22通电,处理器80获取到的准直导电电极22输出的电流较小。因此,第一种方式,可以根据准直电信号(即电流)与准直元件20未破裂状态下检测到的准直电信号(即电流)之间的差异大小来判断准直元件20是否破裂,进一步地,可根据透光准直导电膜21的状态来判断准直元件20是否破裂,即,若透光准直导电膜21破裂,则表明准直元件20也破裂;若透光准直导电膜21未破裂,则表明准直元件20也未破裂。第二种方式:可根据准直元件20上准直导电电极22通电后输出的准直电信号直接判断准直元件20是否破裂,具体地,准直导电电极22输出的准直电信号不在预设准直范围内时就确定准直元件20破裂,进而判断准直元件20也破裂;若准直元件20输出的准直电信号在预设准直范围内时就确定准直元件20未破裂,进而判断准直元件20也未破裂。Please refer to FIG. 1 to FIG. 3 together. In some embodiments, there are multiple conductive elements 52 , and the detection element 70 is a light-transmitting and collimating conductive film 21 . A light-transmitting and collimating conductive film 21 is disposed on the collimating element 20 , and a collimating conductive electrode 22 is disposed on the light-transmitting and collimating conductive film 21 . The judging mechanism of whether the collimation element 20 is broken or not is as follows: when the collimation element 20 is in a good state, the resistance of the light-transmitting collimating conductive film 21 is small, and in this state, the light-transmitting collimating conductive film 21 is energized, that is, an electric current is applied. For a voltage of a certain magnitude, the output current of the collimated conductive electrode 22 acquired by the processor 80 at this time is relatively large. And when the collimating element 20 is broken, the light-transmitting and collimating conductive film 21 formed on the collimating element 20 will also be fragmented. At this time, the resistance value of the light-transmitting and collimating conductive film 21 at the cracked position is close to infinity. In this state, the collimating conductive electrode 22 on the light-transmitting collimating conductive film 21 is energized, and the output current of the collimating conductive electrode 22 obtained by the processor 80 is relatively small. Therefore, in the first way, it can be judged whether the collimation element 20 is broken according to the difference between the collimation electric signal (ie current) and the collimation electric signal (ie current) detected in the unbroken state of the collimation element 20 , further, it is possible to judge whether the collimating element 20 is broken according to the state of the light-transmitting collimating conductive film 21, that is, if the light-transmitting collimating conductive film 21 breaks, then it shows that the collimating element 20 is also broken; If the conductive film 21 is not broken, it means that the collimation element 20 is not broken either. The second way: it can be directly judged whether the collimation element 20 is broken according to the collimation electric signal output by the collimation conductive electrode 22 on the collimation element 20 after being energized. When setting the collimation range, it is determined that the collimation element 20 is broken, and then it is judged that the collimation element 20 is also broken; if the collimation electrical signal output by the collimation element 20 is within the preset collimation range, it is determined that the collimation element 20 is not broken , and then it is judged that the collimation element 20 is not broken.

透光准直导电膜21可通过电镀等方式形成在准直元件20的表面。透光准直导电膜21的材质可以是氧化铟锡(Indium tin oxide,ITO)、纳米银丝、金属银线中的任意一种。氧化铟锡、纳米银丝、金属银线均具有良好的透光率及导电性能,可实现通电后的准直电信号输出,同时不会对准直元件20的出光光路产生遮挡。The light-transmissive and collimating conductive film 21 can be formed on the surface of the collimating element 20 by means of electroplating or the like. The material of the light-transmitting and collimating conductive film 21 may be any one of indium tin oxide (ITO), nano-silver wire, and metallic silver wire. Indium tin oxide, nano-silver wires, and metal silver wires all have good light transmittance and electrical conductivity, and can realize collimated electrical signal output after power-on without blocking the light-emitting optical path of the collimating element 20 .

具体地,准直元件20包括准直入射面201和准直出射面202,透光准直导电膜21为单层结构,设置在准直入射面201或准直出射面202上。透光准直导电膜21上设置有多条准直导电电极22,多条准直导电电极22互不相交。每条准直导电电极22包括准直输入端221和准直输出端222。每个准直输入端221及每个准直输出端222与处理器80均连接以形成一条准直导电回路,由此,多条准直导电电极22的准直输入端221及准直输出端222分别与处理器80连接以形成多条准直导电回路。其中,多条准直导电电极22的排布方式有多种,例如,每条准直导电电极22的延伸方向为透光准直导电膜21的长度方向,多条准直导电电极22平行间隔设置(如图3所示);或者,每条准直导电电极22的延伸方向为透光准直导电膜21的宽度方向,多条准直导电电极22平行间隔设置(图未示);或者,多条准直导电电极22的延伸方向为透光准直导电膜21的对角线方向,多条准直导电电极22平行间隔设置(图未示)。无论准直导电电极22的排布方式是上述的哪种方式,相较于设置单条准直导电电极22而言,多条准直导电电极22能够占据透光准直导电膜21较多的面积,相应地可以输出更多的准直电信号,处理器80可根据较多的准直电信号更为精确地判断透光准直导电膜21是否破裂,进一步地判断准直元件20是否破裂,提升准直元件20破裂检测的准确性。透光准直导电膜21还可为单层架桥结构,单层架桥结构的透光准直导电膜21与设置在衍射元件30上的单层架桥结构的透光衍射导电膜31类似,单层架桥结构的透光衍射导电膜31将在下文进行说明,因此,此处不对单层架桥结构的透光准直导电膜21进行详细展开。Specifically, the collimating element 20 includes a collimating incident surface 201 and a collimating outgoing surface 202 , and the light-transmitting collimating conductive film 21 is a single-layer structure, and is disposed on the collimating incident surface 201 or the collimating outgoing surface 202 . Multiple collimating conductive electrodes 22 are arranged on the light-transmitting collimating conductive film 21 , and the multiple collimating conductive electrodes 22 do not intersect each other. Each collimating conductive electrode 22 includes a collimating input terminal 221 and a collimating output terminal 222 . Each collimating input terminal 221 and each collimating output terminal 222 are connected to the processor 80 to form a collimating conductive loop, thus, the collimating input terminals 221 and the collimating output terminals of a plurality of collimating conductive electrodes 22 222 are respectively connected to the processor 80 to form a plurality of collimating conductive loops. Among them, there are many ways to arrange the multiple collimating conductive electrodes 22. For example, the extension direction of each collimating conductive electrode 22 is the length direction of the light-transmitting collimating conductive film 21, and the multiple collimating conductive electrodes 22 are spaced in parallel. set (as shown in Figure 3); or, the extension direction of each collimated conductive electrode 22 is the width direction of the light-transmitting collimated conductive film 21, and a plurality of collimated conductive electrodes 22 are arranged in parallel and spaced apart (not shown); or , the extending direction of the plurality of collimating conductive electrodes 22 is the diagonal direction of the light-transmitting collimating conductive film 21 , and the plurality of collimating conductive electrodes 22 are arranged in parallel and at intervals (not shown in the figure). No matter which way the collimating conductive electrodes 22 are arranged, compared with setting a single collimating conductive electrode 22, multiple collimating conductive electrodes 22 can occupy more area of the light-transmitting collimating conductive film 21 Correspondingly, more collimated electric signals can be output, and the processor 80 can more accurately judge whether the light-transmitting collimated conductive film 21 is broken according to more collimated electric signals, and further judge whether the collimating element 20 is broken, The accuracy of the collimation element 20 rupture detection is improved. The light-transmitting and collimating conductive film 21 can also be a single-layer bridging structure, and the light-transmitting and collimating conductive film 21 of the single-layer bridging structure is similar to the light-transmitting diffractive conductive film 31 of the single-layer bridging structure arranged on the diffraction element 30 The light-transmitting diffractive conductive film 31 with a single-layer bridging structure will be described below, therefore, the light-transmitting and collimating conductive film 21 with a single-layer bridging structure will not be developed in detail here.

连接准直导电电极22与电路板51的导电元件52的位置可以是:多个导电元件52贴附在镜筒60的侧壁61的内表面,每个导电元件52的一端与准直输入端221或准直输出端222电性连接,另一端与电路板51电性连接(如图1和图2所示);或者,镜筒60的侧壁61开设有与多个导电元件52对应的凹槽63,多个导电元件52设置在对应的凹槽63内,每个导电元件52的一端与准直输入端221或准直输出端222电性连接,另一端与电路板51电性连接(如图4和图5所示);或者,镜筒60的侧壁61沿轴向开设有一个环形孔64,多个导电元件52均设置在环形孔64内,每个导电元件52的一端与准直输入端221或准直输出端222电性连接,另一端与电路板51电性连接(如图6和图7所示)。The position of the conductive element 52 connecting the collimation conductive electrode 22 and the circuit board 51 can be: a plurality of conductive elements 52 are attached to the inner surface of the side wall 61 of the lens barrel 60, and one end of each conductive element 52 is connected to the collimation input end. 221 or the collimation output end 222 is electrically connected, and the other end is electrically connected with the circuit board 51 (as shown in Figure 1 and Figure 2); or, the side wall 61 of the lens barrel 60 is provided with a plurality of conductive elements 52 Groove 63, a plurality of conductive elements 52 are arranged in the corresponding groove 63, one end of each conductive element 52 is electrically connected to the collimation input end 221 or the collimation output end 222, and the other end is electrically connected to the circuit board 51 (as shown in Figure 4 and Figure 5); or, the side wall 61 of lens barrel 60 is provided with an annular hole 64 along the axial direction, and a plurality of conductive elements 52 are all arranged in the annular hole 64, and one end of each conductive element 52 It is electrically connected to the collimation input end 221 or the collimation output end 222 , and the other end is electrically connected to the circuit board 51 (as shown in FIG. 6 and FIG. 7 ).

其中,导电元件52可以是晶线521或者弹片522。Wherein, the conductive element 52 may be a crystal wire 521 or a shrapnel 522 .

例如,如图1和图2所示,导电元件52为弹片522。电路板51上设置有多片弹片522,多片弹片522的长度向激光发射器10的发光方向延伸。多片弹片522贴附在镜筒60的侧壁61的内表面,弹片522的数量为准直导电电极22的数量的两倍。每片弹片522的一端与电路板51连接,另一端与准直输入端221或准直输出端222连接。多片弹片522之间相互间隔设置,如此,保证多片弹片522之间相互绝缘,从而确保多条准直导电电极22之间相互绝缘。当然,也可在每片弹片522的除却与准直输入端221或准直输出端222的接触位置的其余表面上包覆一层绝缘材料,进一步确保多条准直导电电极22之间相互绝缘。For example, as shown in FIGS. 1 and 2 , the conductive element 52 is a shrapnel 522 . A plurality of shrapnels 522 are arranged on the circuit board 51 , and the lengths of the shrapnels 522 extend toward the light emitting direction of the laser emitter 10 . A plurality of elastic sheets 522 are attached to the inner surface of the side wall 61 of the lens barrel 60 , and the number of elastic sheets 522 is twice the number of collimating conductive electrodes 22 . One end of each shrapnel 522 is connected to the circuit board 51 , and the other end is connected to the collimation input end 221 or the collimation output end 222 . The multiple shrapnels 522 are spaced apart from each other, so as to ensure that the multiple shrapnels 522 are insulated from each other, thereby ensuring that the multiple alignment conductive electrodes 22 are insulated from each other. Of course, a layer of insulating material can also be coated on the remaining surface of each shrapnel 522 except for the contact position with the collimation input end 221 or the collimation output end 222, so as to further ensure that the plurality of collimation conductive electrodes 22 are insulated from each other. .

如图4和图5所示,镜筒60的侧壁61开设有与多片弹片522对应的凹槽63,多片弹片522设置在对应的凹槽63内。弹片522的设置位置与多个准直输入端221及多个准直输出端222的位置一一对应。弹片522的长度向激光发射器10的发光方向延伸,每片弹片522的一端与电路板51接触,另一端与准直输入端221或准直输出端222接触。As shown in FIG. 4 and FIG. 5 , the side wall 61 of the lens barrel 60 defines grooves 63 corresponding to the multiple elastic pieces 522 , and the multiple elastic pieces 522 are disposed in the corresponding grooves 63 . The positions of the elastic pieces 522 are in one-to-one correspondence with the positions of the multiple collimation input ends 221 and the multiple collimation output ends 222 . The length of the shrapnel 522 extends toward the light emitting direction of the laser emitter 10 , one end of each shrapnel 522 contacts the circuit board 51 , and the other end contacts the collimation input end 221 or the collimation output end 222 .

如图6和图7所示,导电元件52为晶线521,镜筒60的侧壁61沿轴向开设有环形孔64,多条晶线521均收容在环形孔64内。其中,部分晶线521的一端与准直输入端221电连接,另一端与电路板51电连接,其余部分的晶线521的一端与准直输出端222电连接,另一端与电路板51电连接。多条晶线521的外层可以包覆一层绝缘材料,如此,避免多条晶线521之间相互接触以导致多条准直导电电极22之间没有相互绝缘的问题。As shown in FIGS. 6 and 7 , the conductive element 52 is a crystal wire 521 , and the side wall 61 of the lens barrel 60 defines an annular hole 64 along the axial direction, and a plurality of crystal wires 521 are accommodated in the annular hole 64 . Wherein, one end of some crystal lines 521 is electrically connected to the collimation input end 221, and the other end is electrically connected to the circuit board 51; connect. The outer layer of the plurality of crystal wires 521 can be coated with a layer of insulating material, so as to avoid the problem that the plurality of crystal wires 521 are in contact with each other and the multiple collimating conductive electrodes 22 are not insulated from each other.

另外,晶线521也可以贴附在镜筒60的内表面,或者设置在镜筒60的侧壁61开设的凹槽63内;弹片也可以收容在环形孔64中。In addition, the crystal wire 521 can also be attached to the inner surface of the lens barrel 60 , or set in the groove 63 opened on the side wall 61 of the lens barrel 60 ; the elastic piece can also be accommodated in the annular hole 64 .

请一并参阅图8至图11,在某些实施方式中,导电元件52为多个,检测元件70为透光衍射导电膜31。透光衍射导电膜31设置在衍射元件30上。透光衍射导电膜31上设置有衍射导电电极32。衍射元件30破裂与否的判断机制与准直元件20上设置有透光准直导电膜21时破裂与否的判断机制相同,在此不再赘述。透光衍射导电膜31的材质与透光准直导电膜21的材质也相同,在此也不再赘述。Please refer to FIGS. 8 to 11 together. In some embodiments, there are multiple conductive elements 52 , and the detection element 70 is a light-transmitting diffractive conductive film 31 . The light-transmitting diffractive conductive film 31 is disposed on the diffractive element 30 . A diffractive conductive electrode 32 is disposed on the light-transmitting diffractive conductive film 31 . The judging mechanism of whether the diffractive element 30 is cracked or not is the same as that of the collimating element 20 provided with the light-transmitting collimating conductive film 21 , and will not be repeated here. The material of the light-transmitting diffractive conductive film 31 is also the same as that of the light-transmissive collimating conductive film 21 , which will not be repeated here.

具体地,衍射元件30包括衍射入射面301和衍射出射面302,透光衍射导电膜31为单层架桥结构,设置在衍射出射面302上。单层架桥结构的透光衍射导电膜31上设有多条衍射导电电极32。多条衍射导电电极32包括多条平行间隔的第一衍射导电电极323、多条平行间隔的第二衍射导电电极324和多条架桥衍射导电电极325。多条第一衍射导电电极323与多条第二衍射导电电极324纵横交错,每条第一衍射导电电极323连续不间断,每条第二衍射导电电极324在与对应的第一衍射导电电极323的交错处断开并与多条第一衍射导电电极323不导通。每条架桥衍射导电电极325将对应的第二衍射导电电极324的断开处导通。架桥衍射导电电极325与第一衍射导电电极323的交错位置处设有衍射绝缘体326。每条第一衍射导电电极323的两端与处理器80连接以形成一条衍射导电回路,每条第二衍射导电电极324的两端与处理器80连接以形成一条衍射导电回路,由此,多条第一衍射导电电极323的两端与处理器80均分别连接以形成多条衍射导电回路,多条第二衍射导电电极324的两端与处理器80均分别连接以形成多条衍射导电回路。其中,衍射绝缘体326的材料可为具有良好的透光性和绝缘性的有机材料,衍射绝缘体326可采用丝印或黄光制程等方式进行制作。多条第一衍射导电电极323与多条第二衍射导电电极324纵横交错指的是多条第一衍射导电电极323与多条第二衍射导电电极324相互垂直交错,即第一衍射导电电极323与第二衍射导电电极324的夹角为90度。当然,在其他实施方式中,多条第一衍射导电电极323与多条第二衍射导电电极324纵横交错还可以是多条第一衍射导电电极323与多条第二衍射导电电极324相互倾斜交错。使用时,处理器80可以同时对多条第一衍射导电电极323和多条第二衍射导电电极324通电以得到多个衍射电信号,或者,处理器80可依次对多条第一衍射导电电极323和多条第二衍射导电电极324通电以得到多个衍射电信号,随后,处理器80再根据衍射电信号来判断透光衍射导电膜31是否破裂。例如,当检测到编号为①的第一衍射导电电极323输出的衍射电信号不在预设衍射范围内,编号为③的第二衍射导电电极324输出的衍射电信号不在预设衍射范围内时,说明透光衍射导电膜31在编号为①的第一衍射导电电极323与编号为③的第二衍射导电电极324交错处破裂,则衍射元件30与透光衍射导电膜31破裂位置对应的位置也破裂。如此,单层架桥结构的透光衍射导电膜31可以更为精确地检测衍射元件30是否破裂以及破裂的具体位置。Specifically, the diffractive element 30 includes a diffractive incident surface 301 and a diffractive exit surface 302 , and the light-transmitting diffractive conductive film 31 is a single-layer bridging structure and is disposed on the diffractive exit surface 302 . A plurality of diffractive conductive electrodes 32 are arranged on the light-transmitting diffractive conductive film 31 with a single-layer bridging structure. The plurality of diffractive conductive electrodes 32 includes a plurality of first diffractive conductive electrodes 323 spaced in parallel, a plurality of second diffractive conductive electrodes 324 spaced in parallel and a plurality of bridged diffractive conductive electrodes 325 . A plurality of first diffractive conductive electrodes 323 and a plurality of second diffractive conductive electrodes 324 criss-cross, each first diffractive conductive electrode 323 is continuous and uninterrupted, and each second diffractive conductive electrode 324 is connected to the corresponding first diffractive conductive electrode 323 The intersections are disconnected and not connected to the plurality of first diffractive conductive electrodes 323 . Each bridging diffractive conductive electrode 325 conducts the disconnection of the corresponding second diffractive conductive electrode 324 . A diffractive insulator 326 is provided at the intersection of the bridging diffractive conductive electrode 325 and the first diffractive conductive electrode 323 . The two ends of each first diffractive conductive electrode 323 are connected to the processor 80 to form a diffractive conductive loop, and the two ends of each second diffractive conductive electrode 324 are connected to the processor 80 to form a diffractive conductive loop. The two ends of the first diffractive conductive electrodes 323 are respectively connected to the processor 80 to form multiple diffractive conductive loops, and the two ends of the multiple second diffractive conductive electrodes 324 are respectively connected to the processor 80 to form multiple diffractive conductive loops . Wherein, the material of the diffractive insulator 326 may be an organic material with good light transmittance and insulation properties, and the diffractive insulator 326 may be manufactured by silk screen or yellow light process. A plurality of first diffractive conductive electrodes 323 and a plurality of second diffractive conductive electrodes 324 criss-cross means that a plurality of first diffractive conductive electrodes 323 and a plurality of second diffractive conductive electrodes 324 are perpendicular to each other, that is, the first diffractive conductive electrodes 323 The included angle with the second diffractive conductive electrode 324 is 90 degrees. Of course, in other embodiments, the plurality of first diffractive conductive electrodes 323 and the plurality of second diffractive conductive electrodes 324 crisscross, or the plurality of first diffractive conductive electrodes 323 and the plurality of second diffractive conductive electrodes 324 are obliquely interlaced. . When in use, the processor 80 can simultaneously energize multiple first diffractive conductive electrodes 323 and multiple second diffractive conductive electrodes 324 to obtain multiple diffractive electrical signals, or the processor 80 can sequentially energize multiple first diffractive conductive electrodes 324 323 and the plurality of second diffractive conductive electrodes 324 are energized to obtain a plurality of diffractive electrical signals, and then the processor 80 judges whether the light-transmitting diffractive conductive film 31 is broken according to the diffractive electrical signals. For example, when it is detected that the diffraction electrical signal output by the first diffractive conductive electrode 323 numbered ① is not within the preset diffraction range, and the diffraction electrical signal output by the second diffractive conductive electrode 324 numbered ③ is not within the preset diffraction range, It shows that the light-transmitting diffractive conductive film 31 breaks at the intersection of the first diffractive conductive electrode 323 numbered ① and the second diffractive conductive electrode 324 numbered ③. rupture. In this way, the light-transmitting diffractive conductive film 31 with a single-layer bridging structure can more accurately detect whether the diffractive element 30 is cracked and the specific location of the crack.

透光衍射导电膜31也可为单层结构。单层结构的透光衍射导电膜31与单层结构的透光准直导电膜21的结构类似,在此不再赘述。The light-transmitting diffractive conductive film 31 can also be a single-layer structure. The structure of the light-transmitting diffractive conductive film 31 with a single-layer structure is similar to the structure of the light-transmissive collimating conductive film 21 with a single-layer structure, and will not be repeated here.

连接衍射导电电极32与电路板51的导电元件52的位置可以是:多个导电元件52贴附在镜筒60的侧壁61的内表面,每个导电元件52的一端与衍射输入端321(包括第一衍射导电电极323的衍射输入端3211及第二衍射导电电极324的衍射输入端3212)或衍射输出端322(包括第一衍射导电电极323的衍射输出端3221及第二衍射导电电极324的衍射输出端3222)电性连接,另一端与电路板51电性连接(如图8和图11所示);或者,镜筒60的侧壁61开设有与多个导电元件52对应的凹槽63,多个导电元件52设置在对应的凹槽63内,每个导电元件52的一端与衍射输入端321或衍射输出端322电性连接,另一端与电路板51电性连接(如图12和图13所示);或者,镜筒60的侧壁61沿轴向开设有一个环形孔64,多个导电元件52均设置在环形孔64内,每个导电元件52的一端与衍射输入端321或衍射输出端322电性连接,另一端与电路板51电性连接(如图14和图15所示)。The position of the conductive element 52 connecting the diffractive conductive electrode 32 and the circuit board 51 can be: a plurality of conductive elements 52 are attached to the inner surface of the side wall 61 of the lens barrel 60, and one end of each conductive element 52 is connected to the diffractive input end 321 ( Including the diffraction input end 3211 of the first diffractive conductive electrode 323 and the diffractive input end 3212 of the second diffractive conductive electrode 324) or the diffractive output end 322 (including the diffractive output end 3221 of the first diffractive conductive electrode 323 and the second diffractive conductive electrode 324 The diffraction output end 3222) is electrically connected, and the other end is electrically connected to the circuit board 51 (as shown in FIG. 8 and FIG. 11); or, the side wall 61 of the lens barrel 60 is provided with concave holes corresponding to the plurality of conductive elements 52. groove 63, a plurality of conductive elements 52 are arranged in the corresponding groove 63, one end of each conductive element 52 is electrically connected with the diffraction input end 321 or the diffraction output end 322, and the other end is electrically connected with the circuit board 51 (as shown 12 and shown in Figure 13); or, the side wall 61 of lens barrel 60 is provided with an annular hole 64 along the axial direction, and a plurality of conductive elements 52 are all arranged in the annular hole 64, and one end of each conductive element 52 is connected with the diffraction input The end 321 or the diffraction output end 322 are electrically connected, and the other end is electrically connected to the circuit board 51 (as shown in FIG. 14 and FIG. 15 ).

其中,导电元件52可以是晶线521或者弹片522。Wherein, the conductive element 52 may be a crystal wire 521 or a shrapnel 522 .

例如,如图8和图11所示,导电元件52为弹片522。电路板51上设置有多片弹片522,多片弹片522的长度向激光发射器10的发光方向延伸。多片弹片522贴附在镜筒60的侧壁61的内表面,弹片522的数量为衍射导电电极32的数量的两倍。每片弹片522的一端与电路板51连接,另一端与衍射输入端321或衍射输出端322连接。具体地,部分弹片522的一端与第一衍射输入端3211连接,另一端与电路板51连接;部分弹片522的一端与第一衍射输出端3221连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输入端3212连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输出端3222连接,另一端与电路板51连接。多片弹片522之间相互间隔设置,如此,保证多片弹片522之间相互绝缘,从而确保多条衍射导电电极32之间相互绝缘。当然,也可在每片弹片522的除却与准直输入端221或准直输出端222的接触位置的其余表面上包覆一层绝缘材料,进一步确保多条衍射导电电极32之间相互绝缘。For example, as shown in FIG. 8 and FIG. 11 , the conductive element 52 is a shrapnel 522 . A plurality of shrapnels 522 are arranged on the circuit board 51 , and the lengths of the shrapnels 522 extend toward the light emitting direction of the laser emitter 10 . A plurality of shrapnels 522 are attached to the inner surface of the side wall 61 of the lens barrel 60 , and the number of shrapnels 522 is twice the number of diffractive conductive electrodes 32 . One end of each shrapnel 522 is connected to the circuit board 51 , and the other end is connected to the diffraction input end 321 or the diffraction output end 322 . Specifically, one end of a part of the elastic piece 522 is connected to the first diffraction input end 3211, and the other end is connected to the circuit board 51; one end of the part of the elastic piece 522 is connected to the first diffraction output end 3221, and the other end is connected to the circuit board 51; One end of the shrapnel 522 is connected to the second diffraction output end 3222 and the other end is connected to the circuit board 51 . The plurality of shrapnels 522 are spaced apart from each other, so as to ensure that the plurality of shrapnels 522 are insulated from each other, thereby ensuring that the plurality of diffractive conductive electrodes 32 are insulated from each other. Of course, a layer of insulating material can also be coated on the remaining surface of each shrapnel 522 except the contact position with the collimation input end 221 or the collimation output end 222 , so as to further ensure the mutual insulation between the plurality of diffractive conductive electrodes 32 .

如图12和图13所示,镜筒60的侧壁61开设有与多片弹片522对应的凹槽63,多片弹片522设置在对应的凹槽63内。弹片522的设置位置与多个衍射输入端321及多个衍射输出端322的位置一一对应。弹片522的长度向激光发射器10的发光方向延伸,每片弹片522的一端与电路板51接触,另一端与衍射输入端321或衍射输出端322直接接触。具体地,部分弹片522的一端与第一衍射输入端3211连接,另一端与电路板51连接;部分弹片522的一端与第一衍射输出端3221连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输入端3212连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输出端3222连接,另一端与电路板51连接。As shown in FIG. 12 and FIG. 13 , the side wall 61 of the lens barrel 60 is provided with grooves 63 corresponding to the multiple elastic pieces 522 , and the multiple elastic pieces 522 are disposed in the corresponding grooves 63 . The positions of the shrapnel 522 are in one-to-one correspondence with the positions of the plurality of diffraction input ends 321 and the plurality of diffraction output ends 322 . The length of the shrapnel 522 extends toward the light emitting direction of the laser emitter 10 , and one end of each shrapnel 522 is in contact with the circuit board 51 , and the other end is in direct contact with the diffraction input end 321 or the diffraction output end 322 . Specifically, one end of a part of the elastic piece 522 is connected to the first diffraction input end 3211, and the other end is connected to the circuit board 51; one end of the part of the elastic piece 522 is connected to the first diffraction output end 3221, and the other end is connected to the circuit board 51; One end of the shrapnel 522 is connected to the second diffraction output end 3222 and the other end is connected to the circuit board 51 .

如图14和图15所示,导电元件52为晶线521,镜筒60的侧壁61沿轴向开设有环形孔64,多条晶线521均收容在环形孔64内。其中,部分晶线521的一端与衍射输入端321电连接,另一端与电路板51电连接,其余部分的晶线521的一端与衍射输出端322电连接,另一端与电路板51电连接。多条晶线521的外层可包覆一层绝缘材料,如此,避免多条晶线521之间相互接触以导致多条衍射导电电极32之间没有相互绝缘的问题。As shown in FIG. 14 and FIG. 15 , the conductive element 52 is a crystal wire 521 , and the side wall 61 of the lens barrel 60 defines an annular hole 64 in the axial direction, and a plurality of crystal wires 521 are accommodated in the annular hole 64 . One end of some crystal wires 521 is electrically connected to the diffraction input end 321, and the other end is electrically connected to the circuit board 51; one end of the rest of the crystal wires 521 is electrically connected to the diffraction output end 322, and the other end is electrically connected to the circuit board 51. The outer layer of the plurality of crystal wires 521 can be covered with a layer of insulating material, so as to avoid the problem that the plurality of crystal wires 521 are in contact with each other and the plurality of diffractive conductive electrodes 32 are not insulated from each other.

另外,晶线521也可以贴附在镜筒60的内表面,或者设置在镜筒60的侧壁61开设的凹槽63内;弹片也可以收容在环形孔64中。In addition, the crystal wire 521 can also be attached to the inner surface of the lens barrel 60 , or set in the groove 63 opened on the side wall 61 of the lens barrel 60 ; the elastic piece can also be accommodated in the annular hole 64 .

请一并参阅图16至图19,在某些实施方式中,导电元件52为多个,检测元件70为掺杂在准直元件20内的准直导电粒子23。准直导电粒子23形成准直导电通路24。此时,准直元件20是否破裂的判断机制如下:当准直元件20处于完好状态时,相邻的准直导电粒子23之间是接合的。此时整个准直导电通路24的电阻较小,在此状态下给准直导电通路24通电,即施加一定大小的电压,则此时处理器80获取到的准直导电通路24输出的电流较大。而当准直元件20破裂时,掺杂在准直元件20中的准直导电粒子23之间接合点断开,此时整个准直导电通路24的电阻接近无穷大,在此状态下给准直导电通路24通电,处理器80获取到的准直导电通路24输出的电流较小。因此,第一种方式,可以根据准直导电通路24通电后输出的准直电信号(即电流)与准直元件20为破裂状态下检测到的准直电信号之间的差异大小来判断准直元件20是否破裂;第二种方式:可根据准直导电通路24通电后输出的准直电信号直接判断准直元件20是否破裂,具体地,若准直电信号不在预设准直范围内就确定准直元件20破裂,若准直电信号在预设准直范围内时则确定准直元件20未破裂。Please refer to FIG. 16 to FIG. 19 together. In some embodiments, there are multiple conductive elements 52 , and the detection element 70 is collimated conductive particles 23 doped in the collimation element 20 . Aligned conductive particles 23 form an aligned conductive path 24 . At this time, the judging mechanism of whether the collimating element 20 is broken is as follows: when the collimating element 20 is in a good state, adjacent collimating conductive particles 23 are bonded. At this time, the resistance of the entire collimated conductive path 24 is relatively small. In this state, the collimated conductive path 24 is energized, that is, a voltage of a certain size is applied, and the output current of the collimated conductive path 24 obtained by the processor 80 is relatively small. big. And when the collimating element 20 was broken, the junction between the collimating conductive particles 23 doped in the collimating element 20 was disconnected. At this moment, the resistance of the entire collimating conductive path 24 was close to infinity. The path 24 is energized, and the output current of the collimated conductive path 24 obtained by the processor 80 is relatively small. Therefore, in the first way, the collimation can be judged according to the difference between the collimation electrical signal (i.e. current) output after the collimation conductive path 24 is energized and the collimation electrical signal detected when the collimation element 20 is in a broken state. Whether the collimating element 20 is broken; the second method: it can be directly judged whether the collimating element 20 is broken according to the collimating electrical signal output after the collimating conductive path 24 is energized, specifically, if the collimating electrical signal is not within the preset collimating range It is determined that the collimation element 20 is broken, and if the collimation electrical signal is within a preset collimation range, then it is determined that the collimation element 20 is not broken.

具体地,准直元件20中掺杂了多个准直导电粒子23,多个准直导电粒子23形成多条互不相交且相互绝缘的多条准直导电通路24。准直导电通路24的排布方式有多种:例如,每条准直导电通路24的延伸方向为准直元件20的长度方向(如图18所示);或者,每条准直导电通路24的延伸方向为准直元件20的宽度方向(图未示),多条准直导电通路24平行间隔设置;或者,每条准直导电通路24的延伸方向为准直入射面201的对角线方向(图未示),多条准直导电通路24平行间隔设置;或者,每条准直导电通路24的延伸方向为准直入射面201与准直出射面202的对角线方向(图未示),多条准直导电通路24沿平行间隔设置;或者,每条准直导电通路24沿准直元件20的厚度方向平行间隔设置(图未示)。无论准直导电通路24的排布方式是上述的哪种方式,相较于设置单条准直导电通路24而言,多条准直导电通路24能够占据准直元件20较多的体积,相应地可以输出更多的准直电信号,处理器80可根据较多的准直电信号更为精确地判断准直元件20是否破裂,提升准直元件20破裂检测的准确性。在其他实施方式中,多条准直导电通路24的排布方式还可以与下文记述的衍射元件30中的多条准直导电通路24的排布方式类似,在此先不进行叙述。Specifically, the collimating element 20 is doped with a plurality of collimating conductive particles 23 , and the multiple collimating conductive particles 23 form a plurality of collimating conductive paths 24 that are mutually disjoint and mutually insulated. There are many ways to arrange the collimating conductive paths 24: for example, the extending direction of each collimating conductive path 24 is the length direction of the collimating element 20 (as shown in FIG. 18 ); or, each collimating conductive path 24 The extension direction of the collimation element 20 is the width direction (not shown in the figure), and a plurality of collimation conductive paths 24 are arranged in parallel and at intervals; or, the extension direction of each collimation conductive path 24 is the diagonal line of the collimation incident surface 201 direction (not shown), a plurality of collimated conductive paths 24 are arranged in parallel and at intervals; or, the extension direction of each collimated conductive path 24 is the diagonal direction of the collimated incident surface 201 and the collimated outgoing surface 202 (not shown in the figure) shown), a plurality of collimating conductive paths 24 are arranged in parallel and at intervals; or, each collimating conductive path 24 is arranged in parallel and at intervals along the thickness direction of the collimating element 20 (not shown in the figure). Regardless of the above arrangement of the collimating conductive paths 24, compared with setting a single collimating conductive path 24, multiple collimating conductive paths 24 can occupy more volume of the collimating element 20, correspondingly More collimated electrical signals can be output, and the processor 80 can more accurately determine whether the collimating element 20 is broken according to more collimating electrical signals, thereby improving the accuracy of detecting the collimating element 20 breaking. In other embodiments, the arrangement of the multiple collimating conductive paths 24 may also be similar to the arrangement of the multiple collimating conductive paths 24 in the diffraction element 30 described below, and will not be described here.

连接准直导电通路24与电路板51的导电元件52的位置可以是:多个导电元件52贴附在镜筒60的侧壁61的内表面,每个导电元件52的一端与准直输入端241或准直输出端242电性连接,另一端与电路板51电性连接(如图16和图19所示);或者,镜筒60的侧壁61开设有与多个导电元件52对应的凹槽63,多个导电元件52设置在对应的凹槽63内,每个导电元件52的一端与准直输入端241或准直输出端242电性连接,另一端与电路板51电性连接(如图20和图21所示);或者,镜筒60的侧壁61沿轴向开设有一个环形孔64,多个导电元件52均设置在环形孔64内,每个导电元件52的一端与准直输入端241或准直输出端242电性连接,另一端与电路板51电性连接(如图22和图23所示)。The position of the conductive element 52 connecting the collimation conductive path 24 and the circuit board 51 can be: a plurality of conductive elements 52 are attached to the inner surface of the side wall 61 of the lens barrel 60, and one end of each conductive element 52 is connected to the collimation input end. 241 or the collimation output end 242 is electrically connected, and the other end is electrically connected with the circuit board 51 (as shown in Figure 16 and Figure 19); Groove 63, a plurality of conductive elements 52 are arranged in the corresponding groove 63, one end of each conductive element 52 is electrically connected to the collimation input end 241 or the collimation output end 242, and the other end is electrically connected to the circuit board 51 (as shown in Figure 20 and Figure 21); Or, the side wall 61 of lens barrel 60 is provided with an annular hole 64 along the axial direction, and a plurality of conductive elements 52 are all arranged in the annular hole 64, and one end of each conductive element 52 It is electrically connected with the collimation input end 241 or the collimation output end 242 , and the other end is electrically connected with the circuit board 51 (as shown in FIG. 22 and FIG. 23 ).

其中,导电元件52可以是晶线521或者弹片522。Wherein, the conductive element 52 may be a crystal wire 521 or a shrapnel 522 .

例如,如图16和图19所示,导电元件52为弹片522。电路板51上设置有多片弹片522,多片弹片522的长度向激光发射器10的发光方向延伸。多片弹片522贴附在镜筒60的侧壁61的内表面,弹片522的数量为准直导电通路24的数量的两倍。每片弹片522的一端与电路板51连接,另一端与准直输入端241或准直输出端242连接。多片弹片522之间相互间隔设置,如此,保证多片弹片522之间相互绝缘,从而确保多条准直导电通路24之间相互绝缘。当然,也可在每片弹片522的除却与准直输入端241或准直输出端242的接触位置的其余表面上包覆一层绝缘材料,进一步确保多条准直导电通路24之间相互绝缘。For example, as shown in FIG. 16 and FIG. 19 , the conductive element 52 is a shrapnel 522 . A plurality of shrapnels 522 are arranged on the circuit board 51 , and the lengths of the shrapnels 522 extend toward the light emitting direction of the laser emitter 10 . A plurality of elastic pieces 522 are attached to the inner surface of the side wall 61 of the lens barrel 60 , and the number of the elastic pieces 522 is twice the number of the collimating conductive paths 24 . One end of each shrapnel 522 is connected to the circuit board 51 , and the other end is connected to the collimation input end 241 or the collimation output end 242 . The multiple shrapnels 522 are spaced apart from each other, so as to ensure that the multiple shrapnels 522 are insulated from each other, thereby ensuring that the multiple collimated conductive paths 24 are insulated from each other. Of course, a layer of insulating material can also be coated on the remaining surface of each shrapnel 522 except the contact position with the collimation input end 241 or the collimation output end 242, so as to further ensure mutual insulation between the plurality of collimation conductive paths 24 .

如图20和图21所示,镜筒60的侧壁61开设有与多片弹片522对应的凹槽63,多片弹片522设置在对应的凹槽63内。弹片522的设置位置与多个准直输入端241及多个准直输出端242的位置一一对应。弹片522的长度向激光发射器10的发光方向延伸,每片弹片522的一端与电路板51接触,另一端与准直输入端241或准直输出端242直接接触。As shown in FIG. 20 and FIG. 21 , the sidewall 61 of the lens barrel 60 is provided with grooves 63 corresponding to the multiple elastic pieces 522 , and the multiple elastic pieces 522 are disposed in the corresponding grooves 63 . The positions of the elastic pieces 522 are in one-to-one correspondence with the positions of the multiple collimation input terminals 241 and the multiple collimation output terminals 242 . The length of the shrapnel 522 extends toward the light emitting direction of the laser emitter 10 , and one end of each shrapnel 522 is in contact with the circuit board 51 , and the other end is in direct contact with the collimation input end 241 or the collimation output end 242 .

如图22和图23所示,导电元件52为晶线521,镜筒60的侧壁61沿轴向开设有环形孔64,多条晶线521均收容在环形孔64内。其中,部分晶线521的一端与准直输入端241电连接,另一端与电路板51电连接,其余部分的晶线521的一端与准直输出端242电连接,另一端与电路板51电连接。多条晶线521的外层可包覆一层绝缘材料,如此,避免多条晶线521之间相互接触以导致多条准直导电通路24之间没有相互绝缘的问题。As shown in FIG. 22 and FIG. 23 , the conductive element 52 is a crystal wire 521 , and the side wall 61 of the lens barrel 60 defines an annular hole 64 along the axial direction, and a plurality of crystal wires 521 are accommodated in the annular hole 64 . Wherein, one end of some crystal lines 521 is electrically connected to the collimation input end 241, and the other end is electrically connected to the circuit board 51; connect. The outer layer of the plurality of crystal wires 521 can be coated with a layer of insulating material, so as to avoid the problem that the plurality of crystal wires 521 are in contact with each other and the multiple collimation conductive paths 24 are not insulated from each other.

另外,晶线521也可以贴附在镜筒60的内表面,或者设置在镜筒60的侧壁61开设的凹槽63内;弹片也可以收容在环形孔64中。In addition, the crystal wire 521 can also be attached to the inner surface of the lens barrel 60 , or set in the groove 63 opened on the side wall 61 of the lens barrel 60 ; the elastic piece can also be accommodated in the annular hole 64 .

请一并参阅图24至图27,在某些实施方式中,导电元件52为多个,检测元件70为掺杂在衍射元件30中的多个衍射导电粒子33,多个衍射导电粒子33形成导电通路34。衍射元件30破裂与否的机制与准直元件20掺杂准直导电粒子23时破裂与否的判断机制相同,在此不再赘述。Please refer to FIGS. 24 to 27 together. In some embodiments, there are multiple conductive elements 52, and the detection element 70 is a plurality of diffractive conductive particles 33 doped in the diffractive element 30. A plurality of diffractive conductive particles 33 form Conductive pathway 34 . The mechanism of whether the diffraction element 30 is broken or not is the same as that of the collimating element 20 when doped with collimated conductive particles 23 , and will not be repeated here.

具体地,衍射元件30中掺杂了多个衍射导电粒子33,多个衍射导电粒子33形成多条衍射导电通路34,每条衍射导电通路34包括衍射输入端341和衍射输出端342。多条衍射导电通路34包括多条第一衍射导电通路343和多条第二衍射导电通路344。多条第一衍射导电通路343平行间隔设置,多条第二衍射导电通路344平行间隔设置。其中,多条第一衍射导电通路343和多条第二衍射导电通路344在空间上纵横交错,每条第一衍射导电通路343包括第一衍射输入端3411和第一衍射输出端3421,每条第二衍射导电通路344包括第二衍射输入端3421和第二衍射输出端3422,即衍射输入端341包括第一衍射输入端3411和第二衍射输入端3412,衍射输出端342包括第一衍射输出端3421和第二衍射输出端3422。每个第一衍射输入端3411及每个第一衍射输出端3421与处理器80连接以形成一条衍射导电回路,每个第二衍射输入端3412及每个第二衍射输出端3422与处理器80连接以形成一条衍射导电回路。由此,多条第一衍射导电通路343的两端与处理器80均分别连接以形成多条衍射导电回路,多条第二衍射导电通路344的两端均与处理器80分别连接以形成多条衍射导电回路。多条第一衍射导电通路343与多条第二衍射导电通路344在空间上纵横交错指的是多条第一衍射导电通路343与多条第二衍射导电通路344在空间上相互垂直交错,即第一衍射导电通路343与第二衍射导电通路344的夹角为90度。此时,多条第一衍射导电通路343的延伸方向为衍射元件30的长度方向,且多条第二衍射导电通路344的延伸方向为衍射元件30的宽度方向(如图26所示);或者,多条第一衍射导电通路343的延伸方向为衍射元件30的厚度方向,且多条第二衍射导电通路344的延伸方向为衍射元件30的长度方向(图未示)。当然,在其他实施方式中,多条第一衍射导电通路343与多条第二衍射导电通路344在空间上纵横交错还可以是多条第一衍射导电通路343与多条第二衍射导电通路344在空间上相互倾斜交错。使用时,处理器80可以同时对多条第一衍射导电通路343和多条第二衍射导电通路344通电以得到多个电信号。或者,处理器80可依次对多条第一衍射导电通路343和多条第二衍射导电通路344通电以得到多个衍射电信号,随后,处理器80再根据衍射电信号来判断衍射元件30是否破裂。例如,当检测到编号为②的第一衍射导电通路343输出的电信号不在预设衍射范围内,且编号为④的第二衍射导电通路344输出的衍射电信号也不在预设衍射范围内时,说明衍射元件30在编号为②的第一衍射导电通路343和编号为④的第二衍射导电通路344的交错处破裂,则衍射元件30对应的位置也破裂,如此,通过多条第一衍射导电通路343和多条第二衍射导电通路344纵横交错排布的方式可以更为精确地检测衍射元件30是否破裂以及破裂的具体位置。在其他实施方式中,多条衍射导电通路34的排布方式还可以与准直元件20中准直导电通路24的排布方式类似,在此不再赘述。Specifically, the diffractive element 30 is doped with a plurality of diffractive conductive particles 33 , and the plurality of diffractive conductive particles 33 form a plurality of diffractive conductive paths 34 , and each diffractive conductive path 34 includes a diffractive input end 341 and a diffractive output end 342 . The plurality of diffractive conductive paths 34 includes a plurality of first diffractive conductive paths 343 and a plurality of second diffractive conductive paths 344 . A plurality of first diffractive conductive paths 343 are arranged in parallel and at intervals, and a plurality of second diffractive conductive paths 344 are arranged in parallel and at intervals. Wherein, a plurality of first diffractive conductive paths 343 and a plurality of second diffractive conductive paths 344 are criss-crossed in space, and each first diffractive conductive path 343 includes a first diffractive input end 3411 and a first diffractive output end 3421, each The second diffractive conductive path 344 includes a second diffractive input port 3421 and a second diffractive output port 3422, that is, the diffractive input port 341 includes a first diffractive input port 3411 and a second diffractive input port 3412, and the diffractive output port 342 includes a first diffractive output port 3412. End 3421 and the second diffraction output end 3422. Each first diffraction input end 3411 and each first diffraction output end 3421 are connected to the processor 80 to form a diffraction conductive loop, each second diffraction input end 3412 and each second diffraction output end 3422 are connected to the processor 80 connected to form a diffractive conductive loop. Thus, both ends of the multiple first diffractive conductive paths 343 are respectively connected to the processor 80 to form multiple diffractive conductive loops, and both ends of the multiple second diffractive conductive paths 344 are respectively connected to the processor 80 to form multiple diffractive conductive loops. strip diffractive conductive loop. The plurality of first diffractive conductive paths 343 and the plurality of second diffractive conductive paths 344 criss-cross in space means that the plurality of first diffractive conductive paths 343 and the plurality of second diffractive conductive paths 344 are vertically interlaced with each other in space, that is The included angle between the first diffractive conductive path 343 and the second diffractive conductive path 344 is 90 degrees. At this time, the extending direction of the plurality of first diffractive conductive paths 343 is the longitudinal direction of the diffraction element 30, and the extending direction of the plurality of second diffractive conductive paths 344 is the width direction of the diffractive element 30 (as shown in Figure 26); or The extending direction of the plurality of first diffractive conductive paths 343 is the thickness direction of the diffractive element 30 , and the extending direction of the plurality of second diffractive conductive paths 344 is the longitudinal direction of the diffractive element 30 (not shown). Of course, in other embodiments, the plurality of first diffractive conductive paths 343 and the plurality of second diffractive conductive paths 344 criss-cross in space can also be the plurality of first diffractive conductive paths 343 and the plurality of second diffractive conductive paths 344 Inclined and interlaced with each other in space. In use, the processor 80 can simultaneously energize multiple first diffractive conductive paths 343 and multiple second diffractive conductive paths 344 to obtain multiple electrical signals. Alternatively, the processor 80 may sequentially energize a plurality of first diffractive conductive paths 343 and a plurality of second diffractive conductive paths 344 to obtain a plurality of diffractive electrical signals, and then, the processor 80 judges whether the diffractive element 30 is rupture. For example, when it is detected that the electrical signal output by the first diffractive conductive path 343 numbered ② is not within the preset diffraction range, and the diffracted electrical signal output by the second diffractive conductive path 344 numbered ④ is also not within the preset diffraction range , indicating that the diffraction element 30 is broken at the intersection of the first diffractive conductive path 343 numbered ② and the second diffractive conductive path 344 numbered ④, and the corresponding position of the diffractive element 30 is also broken. The criss-cross arrangement of the conductive paths 343 and the plurality of second diffractive conductive paths 344 can more accurately detect whether the diffractive element 30 is cracked and the specific location of the crack. In other implementation manners, the arrangement of the plurality of diffractive conductive paths 34 may also be similar to the arrangement of the collimating conductive paths 24 in the collimating element 20 , which will not be repeated here.

连接衍射导电通路34与电路板51的导电元件52的位置可以是:多个导电元件52贴附在镜筒60的侧壁61的内表面,每个导电元件52的一端与衍射输入端341(包括第一衍射输入端3411和第二衍射输入端3412)或衍射输出端342(包括第一衍射输出端3421和第二衍射输出端3422)电性连接,另一端与电路板51电性连接(如图24和图27所示);或者,镜筒60的侧壁61开设有与多个导电元件52对应的凹槽63,多个导电元件52设置在对应的凹槽63内,每个导电元件52的一端与衍射输入端341或衍射输出端342电性连接,另一端与电路板51电性连接(如图28和图29所示);或者,镜筒60的侧壁61沿轴向开设有一个环形孔64,多个导电元件52均设置在环形孔64内,每个导电元件52的一端与衍射输入端341或衍射输出端342电性连接,另一端与电路板51电性连接(如图30和图31所示)。The position of the conductive element 52 connecting the diffraction conductive path 34 and the circuit board 51 can be: a plurality of conductive elements 52 are attached to the inner surface of the side wall 61 of the lens barrel 60, and one end of each conductive element 52 is connected to the diffraction input end 341 ( including the first diffraction input end 3411 and the second diffraction input end 3412) or the diffraction output end 342 (including the first diffraction output end 3421 and the second diffraction output end 3422) are electrically connected, and the other end is electrically connected to the circuit board 51 ( 24 and 27); or, the side wall 61 of the lens barrel 60 is provided with grooves 63 corresponding to the plurality of conductive elements 52, and the plurality of conductive elements 52 are arranged in the corresponding grooves 63, each conductive One end of the element 52 is electrically connected to the diffraction input end 341 or the diffraction output end 342, and the other end is electrically connected to the circuit board 51 (as shown in Figures 28 and 29); or, the side wall 61 of the lens barrel 60 is axially An annular hole 64 is provided, and a plurality of conductive elements 52 are arranged in the annular hole 64, one end of each conductive element 52 is electrically connected to the diffraction input end 341 or the diffraction output end 342, and the other end is electrically connected to the circuit board 51 (As shown in Figure 30 and Figure 31).

其中,导电元件52可以是晶线521或者弹片522。Wherein, the conductive element 52 may be a crystal wire 521 or a shrapnel 522 .

例如,如图24和图27所示,导电元件52为弹片522。电路板51上设置有多片弹片522,多片弹片522的长度向激光发射器10的发光方向延伸。多片弹片522贴附在镜筒60的侧壁61的内表面,弹片522的数量为衍射导电通路34的数量的两倍。每片弹片522的一端与电路板51连接,另一端与衍射输入端341或衍射输出端342连接。具体地,部分弹片522的一端与第一衍射输入端3411连接,另一端与电路板51连接;部分弹片522的一端与第一衍射输出端3421连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输入端3412连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输出端3422连接,另一端与电路板51连接。多片弹片522之间相互间隔设置,如此,保证多片弹片522之间相互绝缘,从而确保多条衍射导电通路34之间相互绝缘。当然,也可在每片弹片522的除却与衍射输入端341或衍射输出端342的接触位置的其余表面上包覆一层绝缘材料,进一步确保多条衍射导电通路34之间相互绝缘。For example, as shown in FIG. 24 and FIG. 27 , the conductive element 52 is a shrapnel 522 . A plurality of shrapnels 522 are arranged on the circuit board 51 , and the lengths of the shrapnels 522 extend toward the light emitting direction of the laser emitter 10 . A plurality of shrapnels 522 are attached to the inner surface of the side wall 61 of the lens barrel 60 , and the number of shrapnels 522 is twice the number of diffractive conductive paths 34 . One end of each shrapnel 522 is connected to the circuit board 51 , and the other end is connected to the diffraction input end 341 or the diffraction output end 342 . Specifically, one end of a part of the elastic piece 522 is connected to the first diffraction input end 3411, and the other end is connected to the circuit board 51; one end of the part of the elastic piece 522 is connected to the first diffraction output end 3421, and the other end is connected to the circuit board 51; One end of the shrapnel 522 is connected to the second diffraction output end 3422 and the other end is connected to the circuit board 51 . The multiple shrapnels 522 are spaced apart from each other, so as to ensure that the multiple shrapnels 522 are insulated from each other, thereby ensuring that the multiple diffractive conductive paths 34 are insulated from each other. Of course, a layer of insulating material can also be coated on the remaining surface of each shrapnel 522 excluding the contact position with the diffraction input end 341 or the diffraction output end 342 , so as to further ensure that the plurality of diffraction conductive paths 34 are mutually insulated.

如图28和图29所示,镜筒60的侧壁61开设有与多片弹片522对应的凹槽63,多片弹片522设置在对应的凹槽63内。弹片522的设置位置与多个衍射输入端341和衍射输出端342的位置一一对应。弹片522的长度向激光发射器10的发光方向延伸,每片弹片522的一端与电路板51接触,另一端与衍射输入端341或衍射输出端342直接接触。具体地,部分弹片522的一端与第一衍射输入端3411连接,另一端与电路板51连接;部分弹片522的一端与第一衍射输出端3421连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输入端3412连接,另一端与电路板51连接;部分弹片522的一端与第二衍射输出端3422连接,另一端与电路板51连接。As shown in FIG. 28 and FIG. 29 , the side wall 61 of the lens barrel 60 is provided with grooves 63 corresponding to the multiple elastic pieces 522 , and the multiple elastic pieces 522 are disposed in the corresponding grooves 63 . The positions of the shrapnel 522 are in one-to-one correspondence with the positions of the plurality of diffraction input ends 341 and the diffraction output ends 342 . The length of the shrapnel 522 extends toward the light emitting direction of the laser emitter 10 , and one end of each shrapnel 522 is in contact with the circuit board 51 , and the other end is in direct contact with the diffraction input end 341 or the diffraction output end 342 . Specifically, one end of a part of the elastic piece 522 is connected to the first diffraction input end 3411, and the other end is connected to the circuit board 51; one end of the part of the elastic piece 522 is connected to the first diffraction output end 3421, and the other end is connected to the circuit board 51; One end of the shrapnel 522 is connected to the second diffraction output end 3422 and the other end is connected to the circuit board 51 .

如图30和图31所示,导电元件52为晶线521,镜筒60的侧壁61沿轴向开设有环形孔64,多条晶线521均收容在环形孔64内。其中,部分晶线521的一端与第一衍射输入端3411电连接,另一端与电路板51电连接;部分晶线521的一端与第一衍射输出端3421电连接,另一端与电路板51电连接;部分晶线521的一端与第二衍射输入端3412电连接,另一端与电路板51电连接;部分晶线521的一端与第二衍射输出端3422电连接,另一端与电路板51电连接。多条晶线521的外层可包覆一层绝缘材料,如此,避免多条晶线521之间相互接触以导致多条衍射导电通路34之间没有相互绝缘的问题。As shown in FIG. 30 and FIG. 31 , the conductive element 52 is a crystal wire 521 , and the side wall 61 of the lens barrel 60 is provided with an annular hole 64 along the axial direction, and a plurality of crystal wires 521 are accommodated in the annular hole 64 . Wherein, one end of part of crystal wire 521 is electrically connected with first diffraction input end 3411, and the other end is electrically connected with circuit board 51; Connection; one end of part of the crystal line 521 is electrically connected to the second diffraction input end 3412, and the other end is electrically connected to the circuit board 51; one end of the part of the crystal line 521 is electrically connected to the second diffraction output end 3422, and the other end is electrically connected to the circuit board 51 connect. The outer layer of the plurality of crystal wires 521 can be covered with a layer of insulating material, so as to avoid the problem that the plurality of crystal wires 521 are in contact with each other and the plurality of diffractive conductive paths 34 are not insulated from each other.

另外,晶线521也可以贴附在镜筒60的内表面,或者设置在镜筒60的侧壁61开设的凹槽63内;弹片也可以收容在环形孔64中。In addition, the crystal wire 521 can also be attached to the inner surface of the lens barrel 60 , or set in the groove 63 opened on the side wall 61 of the lens barrel 60 ; the elastic piece can also be accommodated in the annular hole 64 .

请参阅图32,在某些实施方式中,准直元件20的准直入射面201上设置有透光准直导电膜21,透光准直导电膜21上设置有多条平行设置的准直导电电极22,衍射元件30中掺杂有多个衍射导电粒子33,多个衍射导电粒子33形成多条平行且相互绝缘的衍射导电通路34。导电元件52为晶线52。镜筒60的侧壁61沿轴向开设有一个环形孔64,分别连接多条准直导电电极22与电路板51的多条晶线5212(下称“准直晶线5212”)均贴附在镜筒60的侧壁61的内表面上,分别连接多条衍射导电通路34与电路板51的多条晶线5211(下称“衍射晶线5211”)均收容在环形孔64内。具体地,部分准直晶线5212的一端与准直输入端221电连接,另一端与电路板51电连接,其余部分的准直晶线5212的一端与准直输出端222电连接,另一端与电路板51电连接。部分衍射晶线5211的一端与衍射输入端321连接,另一端与电路板51电连接,其余部分的衍射晶线5211的一端与衍射输出端322连接,另一端与电路板51连接。准直元件20上的准直导电电极22可通过准直晶线5212将准直电信号输出至处理器80,衍射元件30上的衍射导电通路34可通过衍射晶线5211将衍射电信号输出至处理器80。如此,处理器80不仅可以检测准直元件20是否破裂,还可检测到衍射元件30是否破裂,并在检测到准直元件20和衍射元件30中任意一者破裂时,即刻关闭激光发射器10或减小激光发射器10的发射功率,以避免对人眼产生危害。Please refer to FIG. 32. In some embodiments, a light-transmitting collimating conductive film 21 is provided on the collimating incident surface 201 of the collimating element 20, and a plurality of collimating collimating conductive films 21 are provided on the light-transmitting collimating conductive film 21. The conductive electrode 22 and the diffraction element 30 are doped with a plurality of diffractive conductive particles 33 , and the plurality of diffractive conductive particles 33 form a plurality of parallel and mutually insulated diffractive conductive paths 34 . The conductive element 52 is a crystal wire 52 . The side wall 61 of the lens barrel 60 is provided with an annular hole 64 along the axial direction, and a plurality of crystal wires 5212 (hereinafter referred to as "collimation wires 5212") respectively connected to a plurality of collimating conductive electrodes 22 and the circuit board 51 are attached. On the inner surface of the side wall 61 of the lens barrel 60 , a plurality of crystal wires 5211 (hereinafter referred to as “diffraction crystal wires 5211 ”) respectively connecting the plurality of diffractive conductive paths 34 and the circuit board 51 are accommodated in the annular hole 64 . Specifically, one end of part of the collimation crystal wire 5212 is electrically connected to the collimation input end 221, and the other end is electrically connected to the circuit board 51, and one end of the remaining part of the collimation crystal wire 5212 is electrically connected to the collimation output end 222, and the other end is electrically connected to the collimation output end 222. It is electrically connected to the circuit board 51 . One end of some diffractive crystal wires 5211 is connected to the diffraction input end 321 , and the other end is electrically connected to the circuit board 51 . The collimating conductive electrode 22 on the collimating element 20 can output the collimated electrical signal to the processor 80 through the collimating crystal line 5212, and the diffractive conductive path 34 on the diffractive element 30 can output the diffractive electrical signal to the processor 80 through the diffractive crystal line 5211. Processor 80. In this way, the processor 80 can not only detect whether the collimation element 20 is broken, but also detect whether the diffraction element 30 is broken, and when any one of the collimation element 20 and the diffraction element 30 is detected to be broken, the laser emitter 10 is immediately turned off. Or reduce the emission power of the laser transmitter 10 to avoid harm to human eyes.

请参阅图33,在某些实施方式中,电路板组件50还包括基板53,电路板51承载在基板53上。电路板51可以是硬板、软板或软硬结合板。电路板51开设有过孔511,激光发射器10承载在基板53上并收容在过孔511内。激光发射器10经由电路板51与处理器80电连接。基板53上还开设有散热孔531,激光发射器10或电路板51工作产生的热量可以由散热孔531散出,散热孔531内还可以填充导热胶,以进一步提高基板53的散热性能。Referring to FIG. 33 , in some embodiments, the circuit board assembly 50 further includes a substrate 53 on which the circuit board 51 is carried. The circuit board 51 may be a rigid board, a flexible board or a combination of rigid and flexible boards. The circuit board 51 defines a via hole 511 , and the laser emitter 10 is carried on the substrate 53 and accommodated in the via hole 511 . The laser transmitter 10 is electrically connected to the processor 80 via the circuit board 51 . The heat dissipation hole 531 is also provided on the substrate 53 , the heat generated by the laser transmitter 10 or the circuit board 51 can be dissipated through the heat dissipation hole 531 , and the heat dissipation hole 531 can also be filled with thermal conductive glue to further improve the heat dissipation performance of the substrate 53 .

激光发射器10可以是垂直腔面发射激光器(Vertical Cavity Surface EmittingLaser,VCSEL)或者边发射激光器(edge-emitting laser,EEL),在如图33所示的实施例中,激光发射器10为边发射激光器,具体地,激光发射器10可以为分布反馈式激光器(Distributed Feedback Laser,DFB)。激光发射器10用于向收容腔62内发射激光。请结合图34,激光发射器10整体呈柱状,激光发射器10远离基板53的一个端面形成发光面11,激光从发光面11发出,发光面11朝向准直元件20。激光发射器10固定在基板53上,具体地,激光发射器10可以通过封胶15粘接在基板53上,例如激光发射器10与发光面11相背的一面粘接在基板53上。请结合图33和图35,激光发射器10的侧面12也可以粘接在基板53上,封胶15包裹住四周的侧面,也可以仅粘结侧面的某一个面与基板53或粘结某几个面与基板53。此时封胶15可以为导热胶,以将激光发射器10工作产生的热量传导至基板53中。The laser transmitter 10 can be a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) or an edge-emitting laser (edge-emitting laser, EEL). In the embodiment shown in FIG. 33, the laser transmitter 10 is an edge-emitting laser. The laser, specifically, the laser transmitter 10 may be a distributed feedback laser (Distributed Feedback Laser, DFB). The laser emitter 10 is used to emit laser light into the accommodation cavity 62 . Please refer to FIG. 34 , the laser emitter 10 has a columnar shape as a whole, and an end surface of the laser emitter 10 away from the substrate 53 forms a light-emitting surface 11 , from which the laser light is emitted, and the light-emitting surface 11 faces the collimation element 20 . The laser emitter 10 is fixed on the substrate 53 , specifically, the laser emitter 10 can be bonded on the substrate 53 through the sealant 15 , for example, the side of the laser emitter 10 opposite to the light-emitting surface 11 is bonded on the substrate 53 . Please combine Figure 33 and Figure 35, the side 12 of the laser emitter 10 can also be bonded on the substrate 53, and the sealing glue 15 can wrap the sides around, or only a certain surface of the side can be bonded to the substrate 53 or a certain surface can be bonded. Several faces are connected with the substrate 53 . At this time, the sealing glue 15 can be a heat-conducting glue, so as to conduct the heat generated by the laser emitter 10 to the substrate 53 .

激光投射模组100采用边发射激光器作为激光发射器10,一方面边发射激光器较VCSEL阵列的温飘较小,另一方面,由于边发射激光器为单点发光结构,无需设计阵列结构,制作简单,激光投射模组100的成本较低。The laser projection module 100 adopts an edge-emitting laser as the laser emitter 10. On the one hand, the temperature fluctuation of the edge-emitting laser is smaller than that of the VCSEL array; , the cost of the laser projection module 100 is relatively low.

分布反馈式激光器的激光在传播时,经过光栅结构的反馈获得功率的增益。要提高分布反馈式激光器的功率,需要通过增大注入电流和/或增加分布反馈式激光器的长度,由于增大注入电流会使得分布反馈式激光器的功耗增大并且出现发热严重的问题,因此,为了保证分布反馈式激光器能够正常工作,需要增加分布反馈式激光器的长度,导致分布反馈式激光器一般呈细长条结构。当边发射激光器的发光面11朝向准直元件20时,边发射激光器呈竖直放置,由于边发射激光器呈细长条结构,边发射激光器容易出现跌落、移位或晃动等意外,因此通过设置封胶15能够将边发射激光器固定住,防止边发射激光器发生跌落、移位或晃动等意外。When the laser light of the distributed feedback laser is propagating, the power gain is obtained through the feedback of the grating structure. To increase the power of the distributed feedback laser, it is necessary to increase the injection current and/or increase the length of the distributed feedback laser, because increasing the injection current will increase the power consumption of the distributed feedback laser and cause serious heating problems, so , in order to ensure that the distributed feedback laser can work normally, it is necessary to increase the length of the distributed feedback laser, resulting in the distributed feedback laser generally having a slender strip structure. When the light-emitting surface 11 of the side-emitting laser is facing the collimation element 20, the side-emitting laser is placed vertically. Since the side-emitting laser is in a slender structure, the side-emitting laser is prone to accidents such as falling, shifting or shaking. Therefore, by setting The sealant 15 can fix the side-emitting laser to prevent accidents such as dropping, shifting or shaking of the side-emitting laser.

请参阅图33和图36,在某些实施方式中,激光发射器10也可采用如图36所示的固定方式固定在基板53上。具体地,激光投射模组100包括多个支撑件16,支撑件16可以固定在基板53上。多个支撑件16围成收容空间160,激光发射器10收容在收容空间160内并被多个支撑件16支撑柱。在安装时可以将激光发射器10直接安装在多个支撑件16之间。在一个例子中,多个支撑件16共同夹持激光发射器10,以进一步防止激光发射器10发生晃动。Please refer to FIG. 33 and FIG. 36 , in some embodiments, the laser emitter 10 may also be fixed on the substrate 53 in a fixing manner as shown in FIG. 36 . Specifically, the laser projection module 100 includes a plurality of supports 16 , and the supports 16 can be fixed on the substrate 53 . A plurality of support members 16 enclose a receiving space 160 , and the laser emitter 10 is accommodated in the receiving space 160 and is supported by the plurality of support members 16 . During installation, the laser emitter 10 can be installed directly between a plurality of supports 16 . In one example, multiple supports 16 jointly clamp the laser emitter 10 to further prevent the laser emitter 10 from shaking.

在某些实施方式中,基板53可以省去,激光发射器10直接固定在电路板51上以减小激光投射模组100的整体厚度。In some embodiments, the substrate 53 can be omitted, and the laser emitter 10 is directly fixed on the circuit board 51 to reduce the overall thickness of the laser projection module 100 .

请参阅图37,本发明还提供一种深度相机1000。本发明实施方式的深度相机1000包括上述任意一项实施方式的激光投射模组100、图像采集器200和处理器80。其中,图像采集器200用于采集经衍射元件衍射后向目标空间中投射的激光图案。处理器80分别与激光投射模组100及图像采集器200连接。处理器80用于处理激光图案以获取深度图像。此处的处理器80可以为激光投射模组中的处理器80。Please refer to FIG. 37 , the present invention also provides a depth camera 1000 . The depth camera 1000 in the embodiment of the present invention includes the laser projection module 100 , the image collector 200 and the processor 80 in any one of the above embodiments. Wherein, the image collector 200 is used for collecting the laser pattern projected into the target space after being diffracted by the diffraction element. The processor 80 is connected to the laser projection module 100 and the image collector 200 respectively. Processor 80 is used to process the laser pattern to obtain a depth image. The processor 80 here may be the processor 80 in the laser projection module.

具体地,激光投射模组100通过投射窗口901向目标空间中投射激光图案,图像采集器200通过采集窗口902采集被目标物体调制后的激光图案。图像采集器200可为红外相机,处理器80采用图像匹配算法计算出该激光图案中各像素点与参考图案中的对应各个像素点的偏离值,再根据偏离值进一步获得该激光图案的深度图像。其中,图像匹配算法可为数字图像相关(Digital Image Correlation,DIC)算法。当然,也可以采用其它图像匹配算法代替DIC算法。Specifically, the laser projection module 100 projects a laser pattern into the target space through the projection window 901 , and the image collector 200 collects the laser pattern modulated by the target object through the collection window 902 . The image collector 200 can be an infrared camera, and the processor 80 uses an image matching algorithm to calculate the deviation value between each pixel point in the laser pattern and the corresponding pixel point in the reference pattern, and then further obtain the depth image of the laser pattern according to the deviation value . Wherein, the image matching algorithm may be a digital image correlation (Digital Image Correlation, DIC) algorithm. Of course, other image matching algorithms can also be used instead of the DIC algorithm.

请一并参阅图1及图38,本发明实施方式的电子装置3000包括壳体2000及上述实施方式的深度相机1000。深度相机1000设置在壳体2000内并从壳体2000暴露以获取深度图像。Please refer to FIG. 1 and FIG. 38 together. An electronic device 3000 according to an embodiment of the present invention includes a casing 2000 and the depth camera 1000 according to the above embodiment. The depth camera 1000 is disposed inside the housing 2000 and exposed from the housing 2000 to acquire a depth image.

本发明实施方式的激光投射模组100通过在光学组件40上设置检测元件70,并使用导电元件将检测元件70与电路板51电连接,从而使得处理器80可以接收检测元件70输出的电信号,以根据电信号判断光学组件40是否破裂。在检测到光学组件40破裂后,及时关闭激光发射器10或减小激光发射器10的功率,以避免光学组件40破裂导致发射的激光能量过大而伤害用户的眼睛的问题,提升激光投射模组100使用的安全性。The laser projection module 100 of the embodiment of the present invention arranges the detection element 70 on the optical assembly 40, and uses a conductive element to electrically connect the detection element 70 to the circuit board 51, so that the processor 80 can receive the electrical signal output by the detection element 70 , so as to judge whether the optical component 40 is broken according to the electric signal. After detecting that the optical assembly 40 is broken, turn off the laser emitter 10 or reduce the power of the laser emitter 10 in time, so as to avoid the problem that the emitted laser energy is too large and damage the user's eyes due to the rupture of the optical assembly 40, and improve the laser projection mode. Security used by group 100.

在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

尽管上面已经示出和描述了本发明的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (14)

1.一种激光投射模组,其特征在于,所述激光投射模组包括:1. A laser projection module, characterized in that, the laser projection module comprises: 激光发射器,所述激光发射器用于发射激光;a laser emitter, the laser emitter is used to emit laser light; 光学组件,所述光学组件设置在所述激光发射器的发光光路上,所述激光经过所述光学组件后形成激光图案,所述光学组件上设置有检测元件;An optical component, the optical component is arranged on the light-emitting optical path of the laser emitter, the laser light passes through the optical component to form a laser pattern, and the optical component is provided with a detection element; 电路板组件,所述电路板组件包括电路板及导电元件,所述检测元件通过所述导电元件与所述电路板电连接,所述激光发射器设置在所述电路板组件上;和A circuit board assembly, the circuit board assembly includes a circuit board and a conductive element, the detection element is electrically connected to the circuit board through the conductive element, and the laser emitter is arranged on the circuit board assembly; and 与所述电路板连接的处理器,所述处理器用于接收所述检测元件输出的电信号以判断所述光学组件是否破裂。A processor connected to the circuit board, the processor is used to receive the electrical signal output by the detection element to determine whether the optical component is broken. 2.根据权利要求1所述的激光投射模组,其特征在于,所述激光投射模组还包括镜筒,所述镜筒设置在所述电路板上并与所述电路板围成收容腔,所述激光发射器收容在所述收容腔内,所述光学组件包括收容在所述收容腔内的衍射元件与准直元件,所述准直元件与所述衍射元件沿所述激光发射器的发光光路依次设置。2. The laser projection module according to claim 1, wherein the laser projection module further comprises a lens barrel, the lens barrel is arranged on the circuit board and forms a storage cavity with the circuit board , the laser emitter is accommodated in the accommodation cavity, the optical assembly includes a diffraction element and a collimation element accommodated in the accommodation cavity, and the collimation element and the diffraction element are arranged along the laser emitter The light-emitting light paths are set in sequence. 3.根据权利要求2所述的激光投射模组,其特征在于,所述导电元件包括多个,所述检测元件为设置在所述准直元件上的透光准直导电膜,所述透光准直导电膜上设置有准直导电电极,所述准直导电电极包括准直输入端和准直输出端,所述准直输入端通过一个所述导电元件与所述电路板连接,所述准直输出端通过另一个所述导电元件与所述电路板连接。3. The laser projection module according to claim 2, wherein the conductive element comprises a plurality, the detection element is a light-transmitting collimating conductive film arranged on the collimating element, and the transparent A collimating conductive electrode is arranged on the photo-collimating conductive film, and the collimating conductive electrode includes a collimating input terminal and a collimating output terminal, and the collimating input terminal is connected to the circuit board through one conductive element, so The collimation output end is connected to the circuit board through another conductive element. 4.根据权利要求2所述的激光投射模组,其特征在于,所述导电元件包括多个,所述检测元件为掺杂在所述准直元件内的准直导电粒子,所述准直导电粒子形成准直导电通路,所述准直导电通路包括准直输入端和准直输出端;所述准直输入端通过一个导电元件与所述电路板连接,所述准直输出端通过另一个所述导电元件与所述电路板连接。4. The laser projection module according to claim 2, wherein the conductive element comprises a plurality, the detection element is collimated conductive particles doped in the collimated element, and the collimated The conductive particles form a collimated conductive path, and the collimated conductive path includes a collimated input end and a collimated output end; the collimated input end is connected to the circuit board through a conductive element, and the collimated output end is connected to the circuit board through another One of the conductive elements is connected to the circuit board. 5.根据权利要求3或4所述的激光投射模组,其特征在于,多个所述导电元件贴附在所述镜筒的侧壁的内表面,每个所述导电元件的一端与所述准直输入端或所述准直输出端电性连接,另一端与所述电路板电性连接;或5. The laser projection module according to claim 3 or 4, wherein a plurality of conductive elements are attached to the inner surface of the side wall of the lens barrel, and one end of each conductive element is connected to the The collimation input end or the collimation output end are electrically connected, and the other end is electrically connected to the circuit board; or 所述镜筒的侧壁沿轴向开设有一个环形孔,多个所述导电元件均设置在所述环形孔内,每个所述导电元件的一端与所述准直输入端或所述准直输出端电性连接,另一端与所述电路板电性连接;或The side wall of the lens barrel is provided with an annular hole in the axial direction, and a plurality of the conductive elements are arranged in the annular hole, and one end of each of the conductive elements is connected to the collimating input end or the collimating input end. The direct output end is electrically connected, and the other end is electrically connected to the circuit board; or 所述镜筒的侧壁开设有与多个所述导电元件对应的凹槽,每个导电元件设置在对应的所述凹槽内,每个所述导电元件的一端与所述准直输入端或所述准直输出端电性连接,另一端与所述电路板电性连接。The side wall of the lens barrel is provided with grooves corresponding to a plurality of the conductive elements, each conductive element is arranged in the corresponding groove, and one end of each conductive element is connected to the collimation input end Or the collimation output end is electrically connected, and the other end is electrically connected to the circuit board. 6.根据权利要求2所述的激光投射模组,其特征在于,所述导电元件包括多个,所述检测元件为设置在所述衍射元件上的透光衍射导电膜,所述透光衍射导电膜上设置有衍射导电电极,所述衍射导电电极包括衍射输入端和衍射输出端,所述衍射输入端通过一个所述导电元件与所述电路板连接,所述衍射输出端通过另一个所述导电元件与所述电路板连接。6. The laser projection module according to claim 2, wherein the conductive element comprises a plurality, the detection element is a light-transmitting diffraction conductive film arranged on the diffraction element, and the light-transmitting diffraction A diffractive conductive electrode is provided on the conductive film, and the diffractive conductive electrode includes a diffractive input end and a diffractive output end, the diffractive input end is connected to the circuit board through one of the conductive elements, and the diffractive output end is connected to the circuit board through the other. The conductive element is connected to the circuit board. 7.根据权利要求2所述的激光投射模组,其特征在于,所述导电元件包括多个,所述检测元件为掺杂在所述衍射元件内的衍射导电粒子,所述衍射导电粒子形成衍射导电通路,所述衍射导电通路包括衍射输入端和衍射输出端;所述衍射输入端通过一个导电元件与所述电路板连接,所述衍射输出端通过另一个所述导电元件与所述电路板连接。7. The laser projection module according to claim 2, wherein the conductive element comprises a plurality, the detection element is diffractive conductive particles doped in the diffractive element, and the diffractive conductive particles form A diffractive conductive path, the diffractive conductive path includes a diffractive input end and a diffractive output end; the diffractive input end is connected to the circuit board through a conductive element, and the diffractive output end is connected to the circuit through another conductive element board connection. 8.根据权利要求6或7所述的激光投射模组,其特征在于,多个所述导电元件贴附在所述镜筒的侧壁的内表面,每个所述导电元件的一端与所述衍射输入端或所述衍射输出端电性连接,另一端与所述电路板电性连接;或8. The laser projection module according to claim 6 or 7, wherein a plurality of conductive elements are attached to the inner surface of the side wall of the lens barrel, and one end of each conductive element is connected to the The diffraction input end or the diffraction output end are electrically connected, and the other end is electrically connected to the circuit board; or 所述镜筒的侧壁沿轴向开设有一个环形孔,多个所述导电元件均设置在所述环形孔内,每个所述导电元件的一端与所述衍射输入端或所述衍射输出端电性连接,另一端与所述电路板电性连接;或The side wall of the lens barrel is provided with an annular hole in the axial direction, and a plurality of conductive elements are arranged in the annular hole, and one end of each conductive element is connected to the diffraction input end or the diffraction output one end is electrically connected, and the other end is electrically connected to the circuit board; or 所述镜筒的侧壁开设有与多个所述导电元件对应的多个凹槽,每个导电元件设置在对应的所述凹槽内,每个所述导电元件的一端与所述衍射输入端或所述衍射输出端电性连接,另一端与所述电路板电性连接。The side wall of the lens barrel is provided with a plurality of grooves corresponding to the plurality of conductive elements, each conductive element is arranged in the corresponding groove, and one end of each conductive element is connected to the diffraction input end or the diffraction output end is electrically connected, and the other end is electrically connected to the circuit board. 9.根据权利要求1所述的激光投射模组,其特征在于,所述激光发射器包括边发射激光器,所述边发射激光器包括发光面,所述发光面朝向所述准直元件。9 . The laser projection module according to claim 1 , wherein the laser emitter includes an edge-emitting laser, and the edge-emitting laser includes a light-emitting surface, and the light-emitting surface faces the collimation element. 10.根据权利要求9所述的激光投射模组,其特征在于,所述激光投射模组还包括固定件,所述电路板组件还包括基板,所述电路板承载在所述基板上,所述固定件用于将所述边发射激光器固定在所述基板上。10. The laser projection module according to claim 9, wherein the laser projection module further comprises a fixing member, the circuit board assembly further comprises a substrate, the circuit board is carried on the substrate, the The fixing member is used to fix the edge emitting laser on the substrate. 11.根据权利要求10所述的激光投射模组,其特征在于,所述固定件包括封胶,所述封胶设置在所述边发射激光器与所述电路板之间,所述封胶为导热胶。11. The laser projection module according to claim 10, wherein the fixing member includes a sealant, the sealant is arranged between the edge-emitting laser and the circuit board, and the sealant is thermal paste. 12.根据权利要求10所述的激光投射模组,其特征在于,所述固定件包括设置在所述电路板组件上的至少两个弹性的支撑件,至少两个所述支撑件共同形成收容空间,所述收容空间用于收容所述激光发射器,至少两个所述支撑件用于支撑住所述激光发射器。12. The laser projection module according to claim 10, wherein the fixing member comprises at least two elastic supporting members arranged on the circuit board assembly, and at least two of the supporting members together form a housing space, the accommodating space is used to accommodate the laser emitter, and at least two of the support members are used to support the laser emitter. 13.一种深度相机,其特征在于,所述深度相机包括:13. A depth camera, characterized in that the depth camera comprises: 权利要求1至12任意一项所述的激光投射模组;The laser projection module according to any one of claims 1 to 12; 图像采集器,所述图像采集器用于采集由所述激光投射模组向目标空间中投射的激光图案;和an image collector, the image collector is used to collect the laser pattern projected by the laser projection module into the target space; and 所述处理器用于处理所述激光图案以获得深度图像。The processor is configured to process the laser pattern to obtain a depth image. 14.一种电子装置,其特征在于,所述电子装置包括:14. An electronic device, characterized in that the electronic device comprises: 壳体;和shell; and 权利要求13所述的深度相机,所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像。The depth camera of claim 13 disposed within and exposed from the housing to acquire a depth image.
CN201810164311.XA 2018-02-27 2018-02-27 Laser projection module, depth camera and electronic device Pending CN108196418A (en)

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PCT/CN2019/074610 WO2019165885A1 (en) 2018-02-27 2019-02-02 Laser projection module and detection method for its cracking, depth camera and electronic device
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