CN110441920A - Laser projection mould group, depth camera and electronic device - Google Patents

Abstract

The invention discloses a laser projection module, a depth camera and an electronic device. The laser projection module includes a mirror base housing, a light source for emitting laser light, a collimation element arranged on the light output side of the light source and inside the mirror base housing for collimating laser light, and a collimating element located inside the mirror base housing and used for diffraction collimation Components Collimated laser light to form laser patterned diffractive optical elements, guard structures and processors. The protection structure includes a conductive layer and a wire, the conductive layer is arranged on the diffractive optical element and/or the collimation element, and the wire is at least partly embedded in the housing of the mirror base and connected to the conductive layer. The processor is electrically connected with the wire to realize the safe control of the laser projection module. The laser projection module in the embodiment of the present invention indirectly detects the state of the diffractive optical element through the protection structure to detect the signal of the conductive layer, so as to perform safety protection. In addition, the wires are at least partially embedded in the mirror base housing, which not only protects the wires by the mirror base housing, but also facilitates miniaturization of the laser projection module.

Description

Laser projection module, depth camera and electronic device

technical field

The invention relates to the field of imaging technology, in particular to a laser projection module, a depth camera and an electronic device.

Background technique

The laser projection module in the related art generally emits a patterned beam through a diffractive optical element to mark the spatial information of the target object. However, when the diffractive optical element is aged, deformed and damaged, the laser projection module The light beam may cause safety problems, such as causing damage to human eyes, etc.

Contents of the invention

The invention provides a laser projection module, a depth camera and an electronic device.

The laser projection module according to the embodiment of the present invention includes a mirror base housing, a light source for emitting laser light, a collimating element arranged on the light output side of the light source and inside the mirror base housing and used to collimate the laser light, A diffractive optical element, a protective structure and a processor are located in the mirror base housing and are used to diffract the laser light collimated by the collimating element to form a laser pattern. The protective structure includes a conductive layer and a wire, the conductive layer is arranged on the diffractive optical element and/or the collimation element, the wire is at least partially buried in the mirror base housing and connected to the conductive Floor. The processor is electrically connected with the wire to realize the safety control of the laser projection module.

The laser projection module according to the embodiment of the present invention detects the state of the conductive layer in real time by setting the conductive layer of the diffractive optical element and/or collimating element and the wire embedded in the mirror base housing and connected to the conductive layer, thereby indirectly detecting The state of the diffractive optical element is then used for security protection. In addition, since the wires are at least partially embedded in the mirror base housing, while the wires are protected by the mirror base housing, it is beneficial to miniaturization of the laser projection module.

In some embodiments, the light source is a vertical cavity surface emitting laser. The small size of the vertical cavity surface emitting laser is conducive to the miniaturization of the laser projection module.

In some embodiments, the collimating element includes a first lens, a second lens, and a third lens that are coaxial and sequentially arranged in a direction from the light source to the diffractive optical element. The laser is collimated through the lens, which is simple, convenient and low in cost.

In some embodiments, the first lens is made of glass, and the second lens and the third lens are made of plastic. In this way, while the cost is low, it is beneficial to ensure the stability of the laser projection module.

In some embodiments, the laser projection module includes a circuit board and a substrate disposed on the circuit board, the substrate is formed with substrate pads connected to the circuit board, and the wires are connected to the substrate The pads are welded, and the mirror base housing is located on the substrate. In this way, energization of the wire is realized.

In some embodiments, the wire includes a protruding part located at the lower part of the mirror base housing and protruding out of the mirror base housing, and the protruding part is welded to the pad of the substrate. In this way, adverse effects such as poor electrical properties and poor appearance caused to the mirror base housing caused by welding are reduced or avoided.

In some embodiments, the wire includes a conduction portion at least partially embedded in the mirror base housing, and the wire includes an upper portion of the mirror base housing and extends from the conduction portion to the A bent portion extending from the inner side of the mirror base housing, the bent portion is electrically connected to the conductive layer. In this way, while realizing the connection between the wire and the conductive layer, it is beneficial to save the internal space of the laser projection module.

In some embodiments, the laser projection module includes a circuit board and a reinforcing plate disposed on the lower surface of the circuit board. In this way, it is beneficial to improve the reliability of the laser projection module.

In some embodiments, the laser projection module includes a switch element, and the processor is connected to the switch element and configured to control the light source through the switch element. In this way, the light source can be turned off in time for protection when an abnormality occurs.

In some embodiments, the laser projection module includes a temperature sensing element, and the processor is connected to the temperature sensing element and is used for receiving an output signal of the temperature sensing element and controlling the laser projection according to the output signal. mod. In this way, the temperature of the laser projection module can be monitored for protection.

The depth camera in the embodiment of the present invention includes the laser projection module and the laser receiving module in any of the above embodiments. The laser receiving module is used to collect the laser pattern projected by the laser projection module into the target space, and the processor is used to process the laser pattern collected by the laser receiving module to obtain a depth image .

The depth camera in the embodiment of the present invention detects the signal of the conductive layer in real time by setting the conductive layer of the diffractive optical element and/or collimating element and the wire embedded in the lens base housing and connected to the conductive layer, thereby indirectly detecting the diffractive optical element status and further security protection. In addition, since the wires are at least partially buried in the mirror base housing, while the wires are protected by the mirror base housing, it is beneficial to the miniaturization of the depth camera.

An electronic device in an embodiment of the present invention includes a device housing and the depth camera in the above embodiment. The device casing is provided with a light-transmitting portion. The depth camera is accommodated in the device housing, and the laser projection module and the laser receiving module are arranged corresponding to the light-transmitting part.

The depth camera of the electronic device according to the embodiment of the present invention detects the signal of the conductive layer in real time by setting the conductive layer of the diffractive optical element and/or the collimating element and the wire embedded in the mirror base housing and connected to the conductive layer, thereby indirectly detecting The state of the diffractive optical element is then used for security protection. In addition, since the wires are at least partially embedded in the mirror base housing, while the wires are protected by the mirror base housing, it is beneficial to the miniaturization of the depth camera, thereby facilitating the miniaturization of the electronic device.

Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural view of a laser projection module according to an embodiment of the present invention;

Fig. 2 is another structural schematic diagram of the laser projection module according to the embodiment of the present invention;

FIG. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Description of main component symbols:

Laser projection module 10, mirror base housing 11, accommodating space 112, light source 12, light emitting surface 122, circuit board 13, reinforcing plate 131, collimation element 14, first lens 142, second lens 144, third lens 146. Substrate 15, substrate pad 152, diffractive optical element 16, switch element 17, temperature sensing element 171, protective structure 18, conductive layer 182, first conductive layer 1822, second conductive layer 1824, wire 184, protrusion 1842, conduction part 1844, bending part 1846, processor 19, depth camera 100, laser receiving module 20, electronic device 1000, device housing 200, light-transmitting part 300, first light-transmitting part 310, second light-transmitting part light section 320 .

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1 and FIG. 2 , an embodiment of the present invention provides a laser projection module 10 . The laser projection module 10 includes a mirror base housing 11, a light source 12 for emitting laser light, a collimation element 14 arranged on the light output side of the light source 12 and inside the mirror base housing 11 for collimating laser light, and a collimating element 14 located in the mirror base housing A diffractive optical element 16 (Diffractive Optical Elements, DOE) in the body 11 for diffracting the collimated laser light by the collimating element 14 to form a laser pattern, a guard structure 18 and a processor 19 . The protection structure 18 includes a conductive layer 182 and a wire 184 , the conductive layer 182 is disposed on the diffractive optical element 16 and/or the collimation element 14 , and the wire 184 is at least partially buried in the mirror base housing 11 and connected to the conductive layer 182 . The processor 19 is electrically connected with the wire 184 to realize the safety control of the laser projection module 10 .

The laser projection module 10 of the embodiment of the present invention detects the conductive layer in real time by setting the conductive layer 182 on the diffractive optical element 16 and/or the collimating element 14 and the wire 184 embedded in the mirror base housing 11 and connected to the conductive layer 182. 182, thereby indirectly detecting the state of the diffractive optical element 16 for safety protection. In addition, since the wires 184 are at least partially embedded in the mirror base housing 11 , while the wires 184 are protected by the mirror base housing 11 , it is beneficial to miniaturization of the laser projection module 10 .

Specifically, the collimating element 14 can be fixed in the mirror base housing 11 by means of glue, and further, the collimating element 14 can be fixed by using photosensitive glue. In this embodiment, the conductive layer 182 includes a first conductive layer 1822 and a second conductive layer 1824 . A first conductive layer 1822 is formed on the collimating element 14 . The first conductive layer 1822 is evenly and closely adhered to the surface of the collimation element 14 through processes such as evaporation, adhesion or sticking. The first conductive layer 1822 has relatively high transmittance to infrared light beams or light beams of other specific wavelength bands and does not substantially affect the refraction and imaging capabilities of the collimating element 14 . Preferably, the first conductive layer 1822 may be a thin film with a transmittance of not less than 85% for infrared beams, such as Indium Tin Oxide (ITO). A second conductive layer 1824 is formed on the diffractive optical element 16 . The manner in which the second conductive layer 1824 is disposed on the diffractive optical element 16 may be similar to the manner in which the first conductive layer 1822 is disposed on the collimation element 14 , so details are not repeated here. In addition, the second conductive layer 1824 not only has a high transmittance for infrared beams, but also does not substantially affect the diffractive ability of the diffractive optical element 16 . Likewise, the second conductive layer 1824 may be indium tin oxide. That is to say, in this embodiment, the conductive layer 182 is disposed on the diffractive optical element 16 and the collimator element 14 . It can be understood that, in other implementation manners, the conductive layer 182 can be disposed on the diffractive optical element 16 or the collimating element 14 .

Normally, the first conductive layer 1822 is closely attached to the collimation element 14 , or is slightly loosened due to thermal deformation of the collimation element 14 . It can be understood that there is a safe range for the slight loosening of the first conductive layer 1822 caused by thermal deformation of the collimation element 14 , beyond which the collimation element 14 enters an abnormal state. Under abnormal circumstances, the collimation element 14 appears to be aging, deformed or damaged, etc., which cannot continue to work normally or will bring safety hazards. The first conductive layer 1822 will And loose, cracked, fall off. Since the change of the state (such as the physical state) of the first conductive layer 1822 will cause the change of the electrical signal, the processor 19 monitors the state of the first conductive layer 1822 through the wire 184 connected with the first conductive layer 1822, thereby indirectly monitoring the state of the quasi-conductive layer 1822. State of straight element 14. Similarly, the processor 19 monitors the state (such as the physical state) of the second conductive layer 1824 through the wire 184 connected to the second conductive layer 1824 , thereby indirectly monitoring the state of the diffractive optical element 16 . When an abnormal situation is detected, the processor 19 performs safety protection by controlling to turn off the light source 21 or reduce the power of the light source 21, so as to prevent the energy of the laser projected by the laser projection module 10 from being too high after the laser projection module 10 is damaged. It will cause harm to the eyes of the user, thereby improving the safety of the user when using the laser projection module 10 .

In some embodiments, the light source 12 is a Vertical Cavity Surface Emitting Laser (Vertical Cavity Surface Emitting Laser, VCSEL). The VCSEL has a small volume, which is beneficial to the miniaturization of the laser projection module 10 . Specifically, the laser light is emitted from the light emitting surface 122 of the light source 12 , and the light emitting surface 122 faces the collimating element 14 . In this way, the collimating element 14 can collimate the laser light emitted by the light source 12 .

In some implementations, the collimating element 14 includes a first lens 142 , a second lens 144 and a third lens 146 that are coaxial and arranged sequentially from the light source 12 to the diffractive optical element 16 . The laser is collimated through the first lens 142 , the second lens 144 and the third lens 146 , which is simple, convenient and low in cost.

In some embodiments, the material of the first lens 142 is glass, and the materials of the second lens 144 and the third lens 146 are both plastic. In this way, while the cost is low, it is beneficial to ensure the stability of the laser projection module 10 .

It can be understood that the closer the distance to the light source 12 is, the more severely the lens is heated, and glass is less sensitive to temperature than plastic, that is to say, when heated, glass deforms slightly. The first lens 142 closest to the light source 12 is made of glass, which can alleviate the change of the refractive index of the lens caused by the heat of the laser projection module 10, thereby improving the collimation effect. The use of plastic to make the second lens 144 and the third lens 146 farther away from the light source 12 can reduce the weight of the laser projection module 10 while reducing the cost. Based on the above, the use of glass to make the first lens 142, and the use of plastic to make the second lens 144 and the third lens 146 can take into account the cost, weight and quality of the laser projection module 10, which is conducive to improving the overall performance of the laser projection module 10 .

In some embodiments, conductive layer 182 has resistive properties. In this way, the detection of the state of the diffractive optical element 16 is realized to perform safety protection.

As mentioned above, the change of the state of the conductive layer 182 will cause the change of the electrical signal, and the processor 19 monitors the state of the conductive layer 182 through the wire 184 connected with the conductive layer 182, thereby indirectly monitoring the collimation element 14 and/or the diffraction The state of the optical element 16. Specifically, in this embodiment, the monitoring of the state of the conductive layer 182 by the processor 19 is realized by monitoring the resistance. Under normal conditions, there is a safe range for the slight loosening of the conductive layer 182 caused by the deformation of the collimating element 14 and/or the diffractive optical element 16 , that is to say, the resistance value of the conductive layer 182 can fluctuate within a normal range. When the resistance value of the conductive layer 182 exceeds the normal range, the danger of the laser projection module 10 increases, and the processor 19 performs safety protection by controlling to turn off the light source 21 or reduce the power of the light source 21 .

In some embodiments, the laser projection module 10 includes a circuit board 13 and a substrate 15 disposed on the circuit board 13, the substrate 15 is formed with a substrate pad 152 connected to the circuit board 13, and the wire 184 is welded to the substrate pad 152 , the mirror base housing 11 is located on the substrate 15 . In this way, the electrical connection between the wire 184 and the processor 19 is realized.

Specifically, the substrate 15 includes an aluminum nitride substrate, and the light source 12 and the processor 19 may also be disposed on the substrate 15 . The processor 19 communicates with the light source 12 and the wire 184 through the lines on the circuit board 13 . In this way, the processor 19 controls the light source 12 and the processor 19 monitors the conductive layer 182 through the wire 184 .

In some embodiments, the wire 184 includes a protruding portion 1842 located at the lower part of the mirror base housing 11 and protruding from the housing 11 , and the protruding portion 1842 is soldered to the substrate pad 152 . In this way, adverse effects on the mirror base housing 11 caused by soldering, such as poor electrical properties and poor appearance, are reduced or avoided.

It can be understood that the protruding part 1842 can increase the welding area and welding three-dimensional space, which is beneficial to improving the strength and efficiency of welding, and is beneficial to solving the problem of poor electrical properties. At the same time, the protruding portion 1842 distances the distance between the welding point and the mirror base housing 11 during welding, which can reduce or avoid the poor appearance of the mirror base housing 11 due to the influence of welding.

Specifically, the protruding portion 1842 protrudes from the mirror base housing 11 to the outside of the mirror base housing 11 . It is worth noting that the “outside” here not only refers to the outside in the direction perpendicular to the mirror base housing 11, but also refers to any direction of the mirror base housing 11 except the receiving space 112 defined by the mirror base housing 11 on the outside. That is to say, the protruding portion 1842 may protrude from the mirror base housing 11 to the outside of the mirror base housing 11 in a direction perpendicular to the surface of the mirror base housing 11 , or may protrude in a direction parallel to the surface of the mirror base housing 11 . 1842 protrudes from the mirror base housing 11 to the outside of the mirror base housing 11 in the direction of 11 into other angles. In short, as long as the protruding part 1842 protrudes from the mirror base housing 11 to the outside of the mirror base housing 11 and is welded to the substrate pad 152, the specific direction in which the protruding part 1842 protrudes is not limited here, nor is the protrusion The specific shape of the portion 1842.

In addition, when the protruding portion 1842 protruding to the outside of the mirror base 14 is soldered to the substrate pad 152, the protruding portion 1842 can be pre-positioned according to the position of the substrate pad 152, so as to facilitate the soldering of the protruding portion 1842 and the substrate. Disc 152 connection. At the same time, the welding point can be kept away from the mirror base shell 11 , reducing or avoiding the problem of poor appearance of the mirror base shell 11 .

In some embodiments, the wire 184 includes a conducting portion 1844 at least partially buried in the mirror base housing 11 , and the wire 184 includes a wire located on the upper part of the mirror base housing 11 and from the conducting portion 1844 to the mirror base housing 11 . The bent portion 1846 extending inside is electrically connected to the conductive layer 182 . In this way, while realizing the connection between the wire 184 and the conductive layer 182 , it is beneficial to save the internal space of the laser projection module 10 .

It should be noted that the "inside" here not only refers to the inner side in the direction perpendicular to the mirror base housing 11, but also refers to the receiving space 112 defined from the side wall of the mirror base housing 11 to the mirror base housing 11 inside in any direction. That is to say, the direction in which the bending portion 1846 bends from the side wall of the mirror base housing 11 to the inner side of the mirror base housing 11 may be perpendicular to the mirror base housing 11 , or may be other than the mirror base housing 11 . angle. As long as the bending part 1846 is bent from the side wall of the mirror base housing 11 to the inside of the mirror base housing 11 and connected to the conductive layer 182, the specific direction of the bending part 1846 is not limited here, nor is it limited. The specific shape of the folded portion 1846.

It can be understood that since the conduction portion 1844 is at least partially embedded in the mirror base housing 11 , the conduction portion 1844 is protected by the mirror base housing 11 , thereby reducing wear and extending the life of the wire 184 . In addition, there is no need to reserve space for the wires inside the receiving space 112 , which can save the space of the laser projection module 10 and facilitate the miniaturization of the laser projection module 10 .

In the production process, the wire 184 can be at least partially arranged in the mirror base housing 11 by insert molding (Insert Molding), and then welded to the substrate pad 152, so that while simplifying the manufacturing process, it can Reduce parts count and increase productivity. In addition, the process of insert molding sets the wires 184 at least partially in the mirror base housing 11 to solve or alleviate welding defects such as welding peeling and welding, and improve welding strength and welding efficiency. At the same time, the laser projection module 10 can The electrical conductivity is more stable and the impedance value is reduced, thereby improving the reliability of the laser projection module 10 .

In the embodiment of FIG. 1 , the wires 184 include a first wire 1841 and a second wire 1843 . The first wire 1841 and the second wire 1843 are spaced apart from each other, and there are two substrate pads 152 , the first wire 1841 corresponds to one of the substrate pads 152 , and the second wire 1843 corresponds to the other substrate pad 152 . This achieves energization of the conductive layer 182 . Please note that the "interval" here does not refer to or only refers to the interval in space, but refers to the insulation between the first wire 1841 and the second wire 1843 . Of course, in the case that the first wire 1841 and the second wire 1843 are insulated, the first wire 1841 and the second wire 1843 may be spaced apart from each other. In addition, the first wires 1841 and the second wires 1843 may be arranged symmetrically or asymmetrically, which is not limited here.

Specifically, in some embodiments, the first wire 1841 is connected to the first conductive layer 1822, the second wire 1843 is connected to the second conductive layer 1824, the first wire 1841 is a bundle of wires including a positive wire and a negative wire, and the second The lead wire 1843 is a bundle of lead wires including a positive electrode lead and a negative electrode lead. In this case, the processor 19 detects the state of the first conductive layer 1822 through the first wire 1841 , and detects the state of the second conductive layer 1824 through the second wire 1843 . That is to say, the processor 19 detects the first conductive layer 1822 and the second conductive layer 1824 independently of each other. In this way, it can be determined whether the aged, deformed or damaged element is the collimation element 14 or the diffractive optical element 16, so as to perform targeted replacement or other treatment. In some embodiments, the first wire 1841 can be a positive wire, the second wire 1843 can be a negative wire, and the processor 19 is connected to the first conductive layer 1822 and the second conductive layer 1824 through the first wire 1841 and the second wire 1843 respectively. , 1822 and 1824 may be electrically connected (eg, connected in series or in parallel) within the mirror base housing. In this case, the processor 19 detects the collimating element 14 and the diffractive optical element 16 as a whole.

In some embodiments, the laser projection module 10 includes a switch element 17 , and the processor 19 is connected to the switch element 17 and is used to control the light source 12 through the switch element 17 . In this way, the light source 12 can be turned off in time for protection when an abnormality occurs. Specifically, the switch element 17 includes a metal oxide semiconductor field effect transistor (Metal Oxide Semiconductor Field Effect Transistor, MOSEFT).

In some embodiments, the laser projection module 10 includes a temperature sensing element 171 , and the processor 19 is connected to the temperature sensing element 171 for receiving an output signal of the temperature sensing element 171 and controlling the laser projection module 10 according to the output signal. In this way, it is possible to monitor the temperature of the laser projection module 10 for protection.

Specifically, the temperature sensing element 171 includes a thermistor. The thermistor has high sensitivity, wide operating temperature range, easy to use, and low cost. Using a thermistor as the temperature sensing element 171 can achieve a good temperature measurement effect at a lower cost.

It can be understood that when the temperature measured by the temperature sensing element 171 is too high, the processor 19 controls the switch element 17 to turn off the light source 12 or reduce the power of the light source 12, so as to prevent the laser projection module 10 from breaking the laser projection module 10. The energy of the laser is too high, which will cause harm to the user's eyes and improve the safety of the user.

In some embodiments, the laser projection module 10 includes a circuit board 13 and a reinforcing plate 131 disposed on the lower surface of the circuit board 13 . The mirror housing 11 , the light source 12 , the collimating element 14 , the diffractive optical element 16 and the protective structure 18 are arranged on the upper surface of the circuit board 13 . In this way, it is beneficial to improve the reliability of the laser projection module 10 .

Specifically, the reinforcement plate 131 includes a steel sheet. It can be understood that the reinforcement plate 131 can increase the strength of the laser projection module 10, and protect the laser projection module 10 when the laser projection module 10 is impacted or squeezed, thereby improving laser projection. Reliability of projection module 10 .

The circuit board 13 includes a flexible circuit board. Flexible circuit boards have high wiring density, light weight, and thin thickness, and can be freely wound and folded, helping to reduce assembly processes and enhance reliability. In addition, the flexible circuit board can provide excellent electrical performance, and can meet the miniaturization design requirements of the laser projection module 10 .

Referring to FIG. 3 , a depth camera 100 according to an embodiment of the present invention includes a laser projection module 10 and a laser receiving module 20 in any of the above embodiments. The laser receiving module 20 is used to collect the laser pattern projected by the laser projection module 10 into the target space, and the processor 19 is used to process the laser pattern collected by the laser receiving module 20 to obtain a depth image.

The depth camera 100 according to the embodiment of the present invention detects the signal of the conductive layer 182 in real time through the conductive layer 182 disposed on the diffractive optical element 16 and/or the collimating element 14 and the wire 184 embedded in the mirror base housing 11 and connected to the conductive layer 182 , so as to indirectly detect the state of the diffractive optical element 16 to perform safety protection. In addition, since the wires 184 are at least partially embedded in the mirror base housing 11 , while the wires 184 are protected by the mirror base housing 11 , it is beneficial to miniaturization of the depth camera 100 .

Specifically, the laser projection module 10 can emit infrared laser light, and the laser receiving module 20 can include an infrared camera. The infrared camera includes an image sensor (not shown). The image sensor can sense the laser and convert the optical signal into an electrical signal, so as to realize the acquisition of the laser pattern.

An electronic device 1000 according to an embodiment of the present invention includes a device housing 200 and the depth camera 100 according to the above embodiment. The device housing 200 is provided with a light-transmitting portion 300 . The depth camera 100 is housed in the device housing 200 , and the laser projection module 10 and the laser receiving module 20 are arranged corresponding to the light-transmitting part 300 .

The depth camera 100 of the electronic device 1000 according to the embodiment of the present invention detects the conductive layer 182 in real time through the conductive layer 182 installed on the diffractive optical element 16 and/or the collimator element 14 and the wire 184 embedded in the mirror housing 11 and connected to the conductive layer 182. The signal of the layer 182 is used to indirectly detect the state of the diffractive optical element 16 for safety protection. In addition, since the wire 184 is at least partially embedded in the mirror base housing 11 , while the wire 184 is protected by the mirror base housing 11 , it is beneficial to the miniaturization of the depth camera 100 , thereby facilitating the miniaturization of the electronic device 1000 .

The electronic device 1000 includes, but is not limited to, mobile phones, tablet computers, wearable devices, access control devices, vehicle-mounted terminals, and other electronic devices that use a camera function.

Specifically, the light-transmitting portion 300 may include a through hole opened on the device casing 200 , or the light-transmitting portion 300 is a light-transmitting portion of the device casing 200 . In the illustrated example, the light-transmitting part 300 may include a first light-transmitting part 310 and a second light-transmitting part 320 spaced apart from the first light-transmitting part 310 , and the first light-transmitting part 310 is arranged corresponding to the laser projection module 10 , the laser light emitted by the light source 12 is emitted from the first light-transmitting part 310 to the outside of the electronic device 1000, the second light-transmitting part 320 is provided corresponding to the laser receiving module 20, and the laser receiving module 20 collects the laser projection through the second light-transmitting part 320 The laser pattern projected by the module 10. Of course, the light-transmitting part 300 can also be a single light-transmitting part, and the laser projection module 10 and the laser receiving module 20 share one light-transmitting part.

Specifically, the embodiments of the present invention may only satisfy one of the above-mentioned embodiments or satisfy multiple of the above-mentioned embodiments at the same time, that is to say, an embodiment formed by combining one or more of the above-mentioned embodiments also belongs to the protection scope of the embodiments of the present invention. .

In the description of this specification, reference is made to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples," etc. The description means that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiment of the present invention has been shown and described above, it can be understood that the above embodiment is exemplary and should not be construed as a limitation of the present invention, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (12)

1. A laser projection module, characterized in that it comprises: mirror housing; a light source for emitting laser light; a collimating element arranged on the light-emitting side of the light source and located in the housing of the mirror base, the collimating element is used to collimate the laser light; A diffractive optical element located in the housing of the mirror base, the diffractive optical element is used to diffract the laser beam collimated by the collimating element to form a laser pattern; A protective structure, the protective structure includes a conductive layer and a wire, the conductive layer is arranged on the diffractive optical element and/or the collimation element, the wire is at least partially buried in the mirror base housing and connected to said conductive layer; and A processor, the processor is electrically connected with the wire to realize the safety control of the laser projection module. 2. The laser projection module according to claim 1, wherein the light source is a vertical cavity surface emitting laser. 3. The laser projection module according to claim 1, wherein the collimation element comprises a first lens, a second lens and a coaxial lens arranged in sequence from the light source to the diffractive optical element. third lens. 4. The laser projection module according to claim 3, wherein the material of the first lens is glass, and the material of the second lens and the third lens are both plastic. 5. The laser projection module according to claim 1, wherein the laser projection module comprises a circuit board and a substrate arranged on the circuit board, the substrate is formed with a A substrate pad, the wire is welded to the substrate pad, and the mirror base housing is located on the substrate. 6. The laser projection module according to claim 5, wherein the wire comprises a protruding portion located at the lower part of the mirror base housing and protruding from the housing, and the protruding portion is in contact with the The substrate pads are soldered. 7. The laser projection module according to claim 5, wherein the wire comprises a conduction portion at least partially embedded in the mirror base housing, and the wire includes a wire located in the mirror base housing. The upper part is a bent part extending from the conduction part to the inner side of the mirror base housing, and the bent part is electrically connected to the conductive layer. 8 . The laser projection module according to claim 5 , wherein the laser projection module comprises a reinforcing plate disposed on the lower surface of the circuit board. 9. The laser projection module according to claim 1, characterized in that, the laser projection module includes a switch element, and the processor is connected to the switch element and is used to realize switching of the light source through the switch element. control. 10. The laser projection module according to claim 1, wherein the laser projection module includes a temperature sensing element, and the processor is connected to the temperature sensing element and is used to receive an output signal of the temperature sensing element and controlling the laser projection module according to the output signal. 11. A depth camera, characterized in that, comprising: The laser projection module according to any one of claims 1-10; and A laser receiving module, the laser receiving module is used to collect the laser pattern projected by the laser projection module into the target space, and the processor is used to process the laser light collected by the laser receiving module pattern to obtain a depth image. 12. An electronic device, characterized in that it comprises: a device housing, the device housing is provided with a light-transmitting portion; and The depth camera according to claim 11, wherein the depth camera is accommodated in the device casing, and the laser projection module and the laser receiving module are arranged corresponding to the light-transmitting part.