KR102767271B1 - Photosensitive resin composition, photosensitive resin layer using the same, color filter comprising the photosensitive resin layer, cmos image sensor, display device and camera - Google Patents

Abstract

(A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the photopolymerization initiator includes a first photopolymerization initiator represented by the following chemical formula 1 and a second photopolymerization initiator represented by the following chemical formula 2, and the first photopolymerization initiator and the second photopolymerization initiator are included in a weight ratio of 70:30 to 79:21; a photosensitive resin film manufactured using the photosensitive resin composition, a color filter and a CMOS image sensor including the photosensitive resin film, a display device including the color filter, and a camera including the CMOS image sensor are provided.
[Chemical Formula 1]

[Chemical formula 2]

(In the above chemical formulas 1 and 2, each substituent is as defined in the specification.)

Description

Photosensitive resin composition, photosensitive resin film using the same, color filter and CMOS image sensor including the photosensitive resin film, display device including the color filter, and camera including the CMOS image sensor {PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, COLOR FILTER COMPRISING THE PHOTOSENSITIVE RESIN LAYER, CMOS IMAGE SENSOR, DISPLAY DEVICE AND CAMERA}

The present invention relates to a photosensitive resin composition, a photosensitive resin film using the same, a color filter and a CMOS image sensor including the photosensitive resin film, a display device including the color filter, and a camera including the CMOS image sensor.

The present invention relates to a colored photosensitive resin composition suitable for producing a color filter used in a display device such as a liquid crystal display (LCD), a color filter having a colored region produced by the composition, and an image display device (display device) such as a solid-state imaging element having the color filter and a liquid crystal display for an organic LED.

Color filters are manufactured from red (R), green (G), and blue (B) dyes or pigments, and the spectrum of the pigment material is improved when it has a narrow absorption band without unnecessary wavelengths other than the required absorption wavelength. In addition, it must have excellent heat resistance, light resistance, and chemical resistance so that it does not fade or change color under ultraviolet rays, acid, and alkali conditions exposed during the etching process of the color resist.

In addition, the present invention relates to a colored photosensitive resin composition necessary for manufacturing a CMOS image sensor and a camera including the CMOS image sensor.

CMOS image sensor (CIS) is a non-memory semiconductor that converts the image received by the camera into a digital signal. CIS is a collection of pixels such as color filters, photodiodes, and amplifiers. As the pixel size decreases, high-sensitivity materials are required for accurate light color recognition.

However, in the case of a photosensitive resin film manufactured using a conventional photosensitive resin composition, there was a problem of inferior straightness of the pixel wall surface due to deterioration of the pattern taper that occurred during the manufacturing process.

Therefore, efforts to solve the above problems are still ongoing.

One embodiment is to provide a photosensitive resin composition capable of improving the straightness of a pattern pixel by controlling the mixing weight ratio of two photopolymerization initiators having different structures.

Another embodiment is to provide a photosensitive resin film manufactured using the photosensitive resin composition.

Another embodiment is to provide a color filter including the photosensitive resin film.

Another embodiment is to provide a CMOS image sensor including the photosensitive resin film.

Another embodiment is to provide a display device including the color filter.

Another embodiment is to provide a camera including the CMOS image sensor.

One embodiment provides a photosensitive resin composition comprising: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the photopolymerization initiator comprises a first photopolymerization initiator represented by the following chemical formula 1 and a second photopolymerization initiator represented by the following chemical formula 2, and the first photopolymerization initiator and the second photopolymerization initiator are included in a weight ratio of 70:30 to 79:21.

[Chemical Formula 1]

[Chemical formula 2]

In the above chemical formulas 1 and 2,

R ¹ and R ⁶ are each independently a halogen group, a hydroxy group, a nitro group, a cyano group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C3 to C20 cycloalkyl group or a substituted or unsubstituted C6 to C20 aryl group,

R ² to R ⁵ are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group,

n1 and n2 are each independently an integer from 0 to 4.

The first photopolymerization initiator and the second photopolymerization initiator may be included in a weight ratio of 72:28 to 78:22.

In the above chemical formulas 1 and 2, R ⁴ and R ⁵ can each independently be a substituted or unsubstituted C1 to C20 alkyl group.

The above R ⁴ and R ⁵ are each independently an unsubstituted C1 to C20 alkyl group, and the carbon number of the R ⁴ may be less than the carbon number of the R ⁵ .

The above first photopolymerization initiator may include at least one of the following chemical formulae 1-1 to 1-3.

[Chemical Formula 1-1]

[Chemical Formula 1-2]

[Chemical Formula 1-3]

The second photopolymerization initiator may include at least one of the following chemical formulas 2-1 to 2-3.

[Chemical Formula 2-1]

[Chemical Formula 2-2]

[Chemical Formula 2-3]

The above binder resin may be included in an amount of 0.1 wt% to 1 wt% based on the total amount of the photosensitive resin composition.

The above binder resin may be included in a smaller amount than the photopolymerizable monomer.

The above colorant may include a pigment.

The above colorant may be included in an amount of 50 wt% to 80 wt% based on the total amount of the photosensitive resin composition.

The photosensitive resin composition may include, based on the total amount of the photosensitive resin composition, 0.1 to 1 wt% of the (A) binder resin; 1 to 10 wt% of the (B) photopolymerizable monomer; 0.1 to 5 wt% of the (C) photopolymerization initiator; 50 to 80 wt% of the (D) colorant; and the remainder of the (E) solvent.

The above photosensitive resin composition may further include an additive of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorinated surfactant, a radical polymerization initiator, or a combination thereof.

The above photosensitive resin composition may further include an additive of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorinated surfactant, a radical polymerization initiator, or a combination thereof.

Another embodiment provides a photosensitive resin film manufactured using the photosensitive resin composition.

Another embodiment provides a color filter including the photosensitive resin film.

Another embodiment provides a CMOS image sensor including the photosensitive resin film.

Another embodiment provides a display device including the color filter.

Another embodiment provides a camera including the CMOS image sensor.

Specific details of other aspects of the present invention are included in the detailed description below.

A photosensitive resin film manufactured using a photosensitive resin composition according to one embodiment has excellent pattern straightness, and thus can be applied to display devices, cameras, etc., to exhibit excellent performance.

Figure 1 is a scanning electron microscope photograph (front view photograph) of a cross-section of a photosensitive resin film pattern manufactured using a photosensitive resin composition according to Example 1.
FIG. 2 is a scanning electron microscope photograph (planar photograph) taken from above of a photosensitive resin film pattern manufactured using a photosensitive resin composition according to Example 1.
Figure 3 is a scanning electron microscope photograph (front view photograph) of a cross-section of a photosensitive resin film pattern manufactured using a photosensitive resin composition according to Comparative Example 1.
Figure 4 is a scanning electron microscope photograph (planar photograph) taken from above of a photosensitive resin film pattern manufactured using a photosensitive resin composition according to Comparative Example 1.
Figure 5 is a scanning electron microscope photograph (front view photograph) of a cross-section of a photosensitive resin film pattern manufactured using a photosensitive resin composition according to Comparative Example 2.
Figure 6 is a scanning electron microscope photograph (planar photograph) taken from above of a photosensitive resin film pattern manufactured using a photosensitive resin composition according to Comparative Example 2.
Figure 7 is a drawing explaining the taper angle (θ) of the photosensitive resin film pattern.

Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples, and the present invention is not limited thereby, and the present invention is defined only by the scope of the claims described below.

Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, "aryl group" means a C6 to C20 aryl group, "arylalkyl group" means a C6 to C20 arylalkyl group, "alkylene group" means a C1 to C20 alkylene group, "arylene group" means a C6 to C20 arylene group, "alkylarylene group" means a C6 to C20 alkylarylene group, "heteroarylene group" means a C3 to C20 heteroarylene group, and "alkoxylene group" means a C1 to C20 It refers to a C20 alkoxylene group.

Unless otherwise specified herein, "substitution" means that at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 It means substituted with a C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, or a combination thereof.

Additionally, unless otherwise specifically stated herein, “hetero” means that the chemical formula contains at least one heteroatom of at least one of N, O, S, and P.

Additionally, unless otherwise specifically stated herein, “(meth)acrylate” means both “acrylate” and “methacrylate”, and “(meth)acrylic acid” means both “acrylic acid” and “methacrylic acid”.

Unless otherwise specified herein, “combination” means a mixture or copolymerization.

Unless otherwise specified herein, unsaturated bonds include not only multiple bonds between carbon-carbon atoms, but also those involving other molecules, such as carbonyl bonds and azo bonds.

Unless otherwise defined in the chemical formulas herein, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.

In this specification, the cardo-based resin means a resin in which at least one functional group selected from the group consisting of the following chemical formulas 3-1 to 3-11 is included in the backbone of the resin.

Additionally, unless otherwise specified herein, “*” means a moiety that is connected to the same or different atoms or chemical formulas.

According to one embodiment, a photosensitive resin composition comprises (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the photopolymerization initiator comprises a first photopolymerization initiator represented by the following chemical formula 1 and a second photopolymerization initiator represented by the following chemical formula 2, and the first photopolymerization initiator and the second photopolymerization initiator are contained in a weight ratio of 70:30 to 79:21.

[Chemical Formula 1]

[Chemical formula 2]

In the above chemical formulas 1 and 2,

R ¹ and R ⁶ are each independently a halogen group, a hydroxy group, a nitro group, a cyano group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C3 to C20 cycloalkyl group or a substituted or unsubstituted C6 to C20 aryl group,

R ² to R ⁵ are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group,

n1 and n2 are each independently an integer from 0 to 4.

Conventionally, a photosensitive resin composition undergoes thermal curing through a coating and baking process on a substrate. Thereafter, a process of forming a pattern of a desired shape is performed through an exposure process. If the taper angle of the pattern pixel formed after all processes are completed is severely tilted or shows a shape that goes inward (reverse taper), excellent characteristics cannot be exhibited. The present invention improves the taper characteristics by controlling the taper angle of the pattern pixel to be close to 90° by mixing and using the first photopolymerization initiator and the second photopolymerization initiator represented by the chemical formulas 1 and 2 in a weight ratio of 70:30 to 79:21. That is, the photosensitive resin film manufactured using the photosensitive resin composition according to one embodiment can improve the straightness of the pattern pixel wall.

Each component is described in detail below.

(C) Photopolymerization initiator

The first photopolymerization initiator and the second photopolymerization initiator should be included in a weight ratio of 70:30 to 79:21 to improve pattern straightness. If the mixing weight ratio of the first photopolymerization initiator and the second photopolymerization initiator is outside the above range, the pattern taper angle becomes an obtuse or acute angle and moves away from 90°, making it difficult to improve pattern straightness.

Specifically, the first photopolymerization initiator and the second photopolymerization initiator may be included in a weight ratio of 72:28 to 78:22, in which case pattern straightness may be more easily improved.

For example, in the chemical formulas 1 and 2, R ⁴ and R ⁵ may each independently be a substituted or unsubstituted C1 to C20 alkyl group. Specifically, R ⁴ and R ⁵ may each independently be an unsubstituted C1 to C20 alkyl group, and the number of carbon atoms in R ⁴ may be less than the number of carbon atoms in R ^5. In this case, a better effect in improving pattern straightness can be expected.

For example, the first photopolymerization initiator may include at least one of the following chemical formulae 1-1 to 1-3, but is not necessarily limited thereto.

[Chemical Formula 1-1]

[Chemical Formula 1-2]

[Chemical Formula 1-3]

For example, the second photopolymerization initiator may include at least one of the following chemical formulas 2-1 to 2-3, but is not necessarily limited thereto.

[Chemical Formula 2-1]

[Chemical Formula 2-2]

[Chemical Formula 2-3]

Meanwhile, the photosensitive resin composition according to one embodiment may further include, in addition to the first photopolymerization initiator and the second photopolymerization initiator, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, an acetophenone-based compound, or a combination thereof.

Examples of the above benzophenone compounds include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

Examples of the above thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples thereof include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and 2-[4-(4-ethylphenyl)-phenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine.

Examples of the above oxime compounds include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. Specific examples of the above O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate, 1-(4-phenylsulfanylphenyl)-butane-1-one oxime-O-acetate, etc.

Examples of the above acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

In addition to the above compound, the photopolymerization initiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, a fluorene compound, etc.

The above photopolymerization initiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy.

Examples of the above photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.

The above photopolymerization initiator may be included in an amount of 0.1 wt% to 5 wt%, for example, 0.1 wt% to 3 wt%, based on the total amount of the photosensitive resin composition. When the photopolymerization initiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, thereby obtaining excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

(A) Binder resin

The above binder resin may be a cardo-based binder resin, an acrylic-based binder resin, a polyimide-based binder resin, a polyurethane-based binder resin, or a combination thereof.

The above binder resin may preferably be a mixture of the above cardo-based binder resin and the above acrylic-based binder resin among the above types. In this case, the heat resistance and chemical resistance of the photosensitive resin composition may be improved, and above all, it may be very advantageous in securing low-reflection characteristics.

The weight average molecular weight of the above-mentioned cardo-based binder resin may be 1,000 g/mol to 50,000 g/mol, and specifically, may be 3,000 g/mol to 35,000 g/mol. When the weight average molecular weight of the above-mentioned cardo-based binder resin is within the above range, excellent patterning properties and developability can be obtained when manufacturing a black matrix or a light-shielding barrier.

The above-mentioned cardo-based binder resin may be a compound including a repeating unit represented by the following chemical formula 3.

[Chemical Formula 3]

In the above chemical formula 3,

R ₂₄ to R ₂₇ can each independently be a hydrogen atom, a halogen atom, or a substituted or unsubstituted C1 to C20 alkyl group,

R ₂₈ and R ₂₉ can each independently be a hydrogen atom, or CH ₂ OR _a (R _a is a vinyl group, an acrylic group, or a methacrylic group),

R ₃₀ may be a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, an acrylic group, or a methacryl group,

Z ₁ may be any one selected from the group consisting of a single bond, O, CO, SO ₂ , CR _b R _c , SiR _d R _e (wherein, R _b to R _e are the same as or different from each other and are hydrogen atoms, or substituted or unsubstituted C1 to C20 alkyl groups), or compounds represented by the following chemical formulas 3-1 to 3-11,

Z ₂ can be an acid anhydride residue or an acid dianhydride residue.

[Chemical Formula 3-1]

[Chemical Formula 3-2]

[Chemical Formula 3-3]

[Chemical Formula 3-4]

[Chemical Formula 3-5]

In the above chemical formula 3-5,

R _f is a hydrogen atom, an ethyl group, C ₂ H ₄ Cl, C ₂ H ₄ OH, CH ₂ CH=CH ₂ , or a phenyl group.

[Chemical Formula 3-6]

[Chemical Formula 3-7]

[Chemical Formula 3-8]

[Chemical Formula 3-9]

[Chemical Formula 3-10]

[Chemical Formula 3-11]

The above-mentioned cardo-based binder resin can be specifically obtained by reacting a compound represented by the following chemical formula 4 with tetracarboxylic dianhydride.

[Chemical Formula 4]

The above tetracarboxylic acid dianhydride may be an aromatic tetracarboxylic acid dianhydride. Examples of the above aromatic tetracarboxylic dianhydrides include pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenylethertetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, Examples thereof include, but are not limited to, 1,4,5,8-naphthalenetetracarboxylic acid dianhydride, 2,3,5,6-pyridinetetracarboxylic acid dianhydride, 3,4,9,10-perylenetetracarboxylic acid dianhydride, and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride.

The above acrylic binder resin comprises a first ethylenically unsaturated monomer　A resin comprising a copolymer of a second ethylenically unsaturated monomer copolymerizable therewith and one or more acrylic repeating units.

The above first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5 to 50 wt%, and specifically, 10 to 40 wt%, based on the total amount of the acrylic binder resin.

The above second ethylenically unsaturated monomer is selected from the group consisting of aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzyl methyl ether; unsaturated carboxylic acid ester compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxy butyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylic acid amino alkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; Examples thereof include cyanide vinyl compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; etc., and these may be used alone or in combination of two or more thereof.

Specific examples of the above acrylic binder resin include, but are not limited to, a methacrylic acid/benzyl methacrylate copolymer, a methacrylic acid/benzyl methacrylate/styrene copolymer, a methacrylic acid/benzyl methacrylate/2-hydroxyethyl methacrylate copolymer, a methacrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, and the like. These may be used singly or in combination of two or more.

The weight average molecular weight of the above acrylic binder resin may be 3,000 g/mol to 150,000 g/mol, specifically 5,000 g/mol to 50,000 g/mol, and more specifically 20,000 g/mol to 30,000 g/mol.　When the weight average molecular weight of the above acrylic binder resin is within the above range, the physical and chemical properties of the black photosensitive resin composition are excellent, the viscosity is appropriate, and the adhesion to the substrate is excellent when manufacturing a light-shielding layer.

The acid value of the above acrylic binder resin may be 15 mgKOH/g to 60 mgKOH/g, and specifically may be 20 mgKOH/g to 50 mgKOH/g. When the acid value of the above acrylic binder resin is within the above range, the resolution of the pixel pattern is excellent.

When the above-mentioned cardo-based binder resin and the above-mentioned acrylic-based binder resin are used in combination, the acrylic-based binder resin may be included in a greater amount than the cardo-based binder resin. In this case, the developability and process margin can be improved.

The above binder resin may be included in an amount of 0.1 wt% to 1 wt%, for example, 0.3 wt% to 0.8 wt%, based on the total amount of the photosensitive resin composition. When the binder resin is included within the above range, the viscosity is appropriately maintained, so that patternability, processability, and developability are excellent when manufacturing a photosensitive resin film.

(B) Photopolymerizable monomer

The above photopolymerizable monomer may be a monomer or oligomer, and a monofunctional or polyfunctional (difunctional, trifunctional, etc.) ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond may be used.

The above photopolymerizable monomer has the above ethylenically unsaturated double bond, and thus can sufficiently polymerize upon exposure to light in a pattern forming process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

The photopolymerizable monomers include, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol. It may be penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylol propane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, or a combination thereof.

Examples of commercially available products of the above photopolymerizable monomers are as follows. Examples of monofunctional esters of (meth)acrylic acid include Aronix M- ^101® , M- ^111® , M- ^114® from Toagosei Chemical Co., Ltd.; KAYARAD TC- ^110S® , TC- ^120S® from Nihon Kayaku Co., Ltd.; V- ^158® , V- ^2311® from Osaka Yuki Chemical Co., Ltd. Examples of bifunctional esters of (meth)acrylic acid include Aronix M- ^210® , M- ^240® , M- ^6200® from Toagosei Chemical Co., Ltd.; Examples thereof include KAYARAD HDDA ^® , HX-220 ^® , R-604 ^® from Nihon Kayaku Co., Ltd.; V-260 ^® , V-312 ^® , V-335 HP ^® from Osaka Yuki Chemical Industry Co., Ltd.; and the like. Examples of the trifunctional ester of (meth)acrylic acid include Aronix M-309 ^® , M-400 ^{® , M-405 ® ,} M-450 ^® , M-7100 ^® , M-8030 ^® , M-8060 ^® from Toagosei Chemical Industry Co., Ltd.; Examples thereof include KAYARAD ^TMPTA® , DONG DPCA- ^20® , DONG- ^30® , DONG- ^60® , DONG- ^120® from Nihon Kayaku Co., Ltd.; and V- ^295® , DONG- ^300® , DONG- ^360® , DONG- ^GPT® , DONG- ^3PA® , DONG- ^400® from Osaka Yuki Kayaku Kogyo Co., Ltd. The above products can be used alone or in combination of two or more.

The above photopolymerizable monomer can also be used after being treated with an acid anhydride to provide better developing properties.

The photopolymerizable monomer may be included in an amount of 1 wt% to 10 wt%, for example 1 wt% to 5 wt%, based on the total amount of the photosensitive resin composition. When the photopolymerizable monomer is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, and also excellent resolution and adhesion.

(D) Colorant

The colorant may include a pigment, such as a red pigment, a green pigment, a yellow pigment, a blue pigment, or a combination thereof.

For example, the blue pigment may include a phthalocyanine-based compound. For example, the blue pigment may be a phthalocyanine-based compound.

For example, examples of the blue pigment include copper phthalocyanine pigments such as C.I. Blue Pigment 15:6, C.I. Blue Pigment 15, C.I. Blue Pigment 15:1, C.I. Blue Pigment 15:2, C.I. Blue Pigment 15:3, C.I. Blue Pigment 15:4, C.I. Blue Pigment 15:5, C.I. Blue Pigment 16, etc. For example, the blue pigment may be represented by the following chemical formula 4, but is not necessarily limited thereto.

[Chemical Formula 4]

Examples of the red pigments include C.I. Red Pigment 254, C.I. Red Pigment 255, C.I. Red Pigment 264, C.I. Red Pigment 270, C.I. Red Pigment 272, C.I. Red Pigment 177, C.I. Red Pigment 89, etc. Examples of the green pigments include C.I. Green Pigment 36, C.I. Green Pigment 7, C.I. Green Pigment 58, C.I. Green Pigment 59, C.I. Green Pigment 62, etc. Examples of the yellow pigments include isoindoline pigments such as C.I. Yellow Pigment 139, quinophthalone pigments such as C.I. Yellow Pigment 138, nickel complex pigments such as C.I. Yellow Pigment 150, etc. The above pigments may be used alone or in combination of two or more, and are not limited to these examples.

A dispersant may be used together to disperse the pigment. Specifically, the pigment may be used by pre-surface-treating it with a dispersant, or the dispersant may be added together with the pigment during the preparation of the composition.

Nonionic dispersants, anionic dispersants, cationic dispersants, etc. can be used as the above dispersant. Specific examples of the above dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, alkyl amide alkylene oxide adducts, alkyl amines, etc., and these can be used alone or in mixtures of two or more.

Examples of commercially available products of the above dispersants include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450 from EFKA Chemicals; Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or Ajinomoto's PB711, PB821, etc.

The above dispersant may be included in an amount of 0.1 wt% to 15 wt% based on the total amount of the photosensitive resin composition. When the dispersant is included within the above range, the composition has excellent dispersibility, and thus stability, developability, and patternability are excellent when manufacturing a black column spacer.

The above pigment can also be used after being pretreated with a water-soluble inorganic salt and a wetting agent. If the pigment is used after being pretreated as described above, the average particle size of the pigment can be made finer.

The above pretreatment can be performed through a step of kneading the pigment together with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained in the kneading step.

The above-mentioned kneading can be performed at a temperature of 40°C to 100°C, and the above-mentioned filtration and washing can be performed by washing away the inorganic salt using water or the like and then filtering.

Examples of the water-soluble inorganic salt include, but are not limited to, sodium chloride, potassium chloride, etc. The wetting agent acts as a medium that allows the pigment and the water-soluble inorganic salt to be uniformly mixed and the pigment to be easily pulverized, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerin polyethylene glycol, etc., and these may be used alone or in combination of two or more.

The pigment that has undergone the above-mentioned kneading step may have an average particle size of 5 nm to 200 nm, for example, 5 nm to 150 nm. When the average particle size of the pigment is within the above range, the stability in the pigment dispersion is excellent, and there is no concern about a decrease in pixel resolution.

Specifically, the pigment may be used in the form of a pigment dispersion containing the dispersant and the solvent described below, and the pigment dispersion may contain a pigment in solid content, a dispersant, and a solvent. The pigment in solid content may be contained in an amount of 5 wt% to 20 wt%, for example, 8 wt% to 15 wt%, based on the total amount of the pigment dispersion.

The above colorant may be included in an amount of 50 wt% to 80 wt%, for example 60 wt% to 80 wt%, based on the total amount of the photosensitive resin composition. When the colorant is included within the above range, the coloring effect and developing performance are excellent.

(E) Solvent

The solvent may be a substance that is compatible with, but does not react with, the binder resin, the colorant, the photopolymerization initiator, and the photopolymerizable monomer.

Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether (EDM); cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-Alkoxypropionic acid alkyl esters, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, etc., monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyls such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate; Esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; Examples include ketone acid esters such as ethyl pyruvate, and also high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

Among these, taking compatibility and reactivity into consideration, preferred examples thereof include ketones such as cyclohexanone; glycol ethers such as ethylene glycol monoethyl ether, ethylene diglycol methyl ethyl ether, ethylene glycol dimethyl ether, and ethylene glycol diethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate.

The above solvent may be included as a remainder, for example, 15 wt% to 40 wt%, based on the total amount of the photosensitive resin composition. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the production of the photosensitive resin film.

(F) Other additives

Meanwhile, the photosensitive resin composition may further include an additive of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorinated surfactant, a radical polymerization initiator, or a combination thereof.

The above silane coupling agent may have a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc.

Examples of the above silane coupling agent include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc., and these may be used alone or in combination of two or more.

The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, the adhesion, storability, etc. are excellent.

In addition, the photosensitive resin composition may further include a surfactant, such as a fluorinated surfactant, to improve coating properties and prevent defects, if necessary.

Examples of the above fluorinated surfactants include BM Chemie's BM- ^1000® , BM-1100® ^, etc.; Dainippon Ink Chemical Co., Ltd.'s Mecapac F ^142D® , Dong F 172®, Dong F ^173® , Dong F ^183® , Dong F ^{554® ,} etc.; Sumitomo Re-EM Co., Ltd.'s Prorad FC- ^135® , Dong FC- ^170C® , Dong FC- ^430® , Dong FC-431® ^, etc.; Asahi Glass Co., Ltd.'s Saffron S- ^112® , Dong S- ^113® , Dong S-131®, Dong S- ^141® , Dong S- ^{145®, etc} .; Fluorinated surfactants sold commercially by Doray Silicone Co., Ltd. under the names SH- ^28PA® , Dong- ^190® , Dong- ^193® , SZ- ^6032® , and SF- ^8428® can be used.

The above fluorine-based surfactant can be used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the above surfactant is included within the above range, coating uniformity is secured, no staining occurs, and wetting for an IZO substrate or glass substrate is excellent.

In addition, other additives such as antioxidants and stabilizers may be added in a certain amount to the photosensitive resin composition as long as the physical properties are not impaired.

Another embodiment provides a photosensitive resin film manufactured by exposing, developing, and curing the photosensitive resin composition described above.

The method for manufacturing the above photosensitive resin film is as follows.

(1) Application and film formation stage

A photosensitive resin composition is applied to a substrate that has undergone a predetermined pretreatment to a desired thickness using a method such as spin or slit coating, roll coating, screen printing, or applicator, and then heated at 70 to 100°C for 1 to 10 minutes to remove the solvent, thereby forming a coating film.

(2) Exposure stage

In order to form the pattern required for the obtained film, a mask composed of a full tone part that implements a black matrix pattern is interposed, and then an active line of 200 to 500 nm is irradiated. As a light source used for the irradiation, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an argon gas laser, etc. can be used, and in some cases, X-rays, electron beams, etc. can also be used.

The exposure dose varies depending on the type, mixing amount, and dry film thickness of each component of the composition, but is 80 mJ/ ^cm2 or less when using a high-pressure mercury lamp.

(3) Phenomenon stage

In the developing method, after the above exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, thereby leaving only the exposed parts to form a pattern.

(4) Post-processing step

In the above process, the image pattern obtained by the phenomenon is subjected to a post-heating process (230°C) to obtain a pattern.

By using the photosensitive resin composition described above, a pattern having excellent taper characteristics, i.e. excellent straightness, can be obtained.

Another embodiment provides a color filter including the photosensitive resin film.

Another embodiment provides a CMOS image sensor including the photosensitive resin film.

Another embodiment provides a display device including the color filter.

Another embodiment provides a camera including the CMOS image sensor.

Hereinafter, preferred embodiments of the present invention will be described. However, the following embodiments are only preferred embodiments of the present invention, and the present invention is not limited to the following embodiments.

(Example)

(First photopolymerization initiator)

Example 1

A photopolymerization initiator represented by the following chemical formula 1-1 (SPI-03 3; Samyang)

[Chemical Formula 1-1]

Example 2

Photopolymerization initiator represented by chemical formula 1-2 (SPI-03 0; Samyang)

[Chemical Formula 1-2]

Example 3

Photopolymerization initiator represented by chemical formula 1-3 (SPI-03 41; Samyang)

[Chemical Formula 1-3]

(Second photopolymerization initiator)

Example 4

Photopolymerization initiator represented by chemical formula 2-1 (SPI-02 27; Samyang)

[Chemical Formula 2-1]

Example 5

Photopolymerization initiator represented by chemical formula 2-2 (SPI-02 2; Samyang)

[Chemical Formula 2-2]

Example 6

Photopolymerization initiator represented by chemical formula 3-3 (SPI-02 1; Samyang)

[Chemical Formula 2-3]

(Preparation of photosensitive resin composition: Examples 1 to 7, Comparative Examples 1 and 2)

Example 1

Photosensitive resin compositions according to Examples 1 to 7 and Comparative Examples 1 and 2 were prepared with the compositions shown in Table 1 below.

Specifically, after accurately measuring the content of the photopolymerization initiator, the solvent was added, and the mixture was sufficiently stirred (for 30 minutes or more) until the photopolymerization initiators (the first photopolymerization initiator and the second photopolymerization initiator) were completely dissolved. The binder resin and the photopolymerizable monomer were sequentially added, and the mixture was stirred for another hour or so. Then, the additive was added, the colorant (pigment dispersion) was added, and finally, the entire composition was stirred for 2 hours or more, thereby producing a photosensitive resin composition.

(Unit: g) Example Comparative example 1 2 3 4 5 6 7 1 2 (A) Binder resin Acrylic binder resin (RY-117, Showa Denko) 0.675 0.675 0.675 0.675 0.675 0.675 0.675 0.675 0.675 (B) Photopolymerizable monomer Dipentaerythritol exacrylate (DPHA, Nippon Gunyakusha) 1.039 1.039 1.039 1.039 1.039 1.039 1.039 1.039 1.039 M2100 (Samsung SDI) 0.693 0.693 0.693 0.693 0.693 0.693 0.693 0.693 0.693 (C) Photopolymerization initiator (C-1) 0.216 0.2016 0.22752 0.20736 0.22464 - - 0.231 0.202 (C-2) - - - - - 0.216 - - - (C-3) - - - - - - 0.216 - - (C-4) 0.072 0.0864 0.06048 0.08064 0.06336 - - 0.058 0.087 (C-5) - - - - - 0.072 - - - (C-6) - - - - - - 0.072 - - menstruum Propylene glycol monomethyl ether acetate (PGMEA) 16.707 16.707 16.707 16.707 16.707 16.707 16.707 16.707 16.707 Pigment Red pigment dispersion (CI-254-P71, SAKATA) 66.597 66.597 66.597 66.597 66.597 66.597 66.597 66.597 66.597 Yellow pigment dispersion (BJ1144, SANYO) 11.337 11.337 11.337 11.337 11.337 11.337 11.337 11.337 11.337 Additives Surfactant (F-554, DIC) 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Coupling agent (KBM-503, Shinetsu) 0.154 0.154 0.154 0.154 0.154 0.154 0.154 0.154 0.154

(C-1) Photopolymerization initiator represented by chemical formula 1-1

(C-2) Photopolymerization initiator represented by chemical formula 1-2

(C-3) Photopolymerization initiator represented by chemical formula 1-3

(C-4) Photopolymerization initiator represented by chemical formula 2-1

(C-5) Photopolymerization initiator represented by chemical formula 2-2

(C-6) Photopolymerization initiator represented by chemical formula 2-3

(Evaluation: Taper Angle)

Examples 1 to 7 and Comparative Examples 1 and 2 of the photosensitive resin compositions were coated at a thickness of 1.3 ㎛ on a 10 cm x 10 cm glass that had been pretreated using a spin coater (Mikasa, Opticoat MS-A150), soft-baked at 80° C. for 150 seconds using a hot plate, and exposed at 50 mJ using an exposure device (Ushio, HB-50110AA) and a photo pattern mask. Subsequently, development was performed with a 0.2 wt% potassium hydroxide (KOH) aqueous solution using a developer (SVS, SSP-200), and hard-baking was performed at 230° C. for 30 minutes in an oven to obtain a patterned glass specimen. After cutting the above glass specimen diagonally into a line pattern, the cut pattern was measured using FE-SEM (X10K), and the results are shown in Table 2 and Figures 1 to 6 below.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 Taper angle (°) 90 89.0 89.1 89.8 89.9 88.4 88.3 92.1 86.7

From the above Table 2 and FIGS. 1 to 6, it can be confirmed that the photosensitive resin composition according to one embodiment has better taper characteristics than the photosensitive resin compositions according to Comparative Examples 1 and 2, thereby improving pattern straightness. In addition, it can be confirmed from Examples 1 to 7 that the pattern straightness can be improved by controlling the taper characteristics depending on the mixing weight ratio and type of the first photopolymerization initiator and the second photopolymerization initiator.

The present invention is not limited to the above embodiments, but can be manufactured in various different forms, and a person having ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential characteristics of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims (17)

Regarding the total amount of photosensitive resin composition,
(A) 0.1 wt% to 1 wt% of binder resin;
(B) 1 to 10 wt% of a photopolymerizable monomer;
(C) 0.1 to 5 wt% of photopolymerization initiator;
(D) 50 to 80 wt% of colorant; and
(E) Solvent residue
Including,
The above photopolymerization initiator comprises a first photopolymerization initiator represented by the following chemical formula 1 and a second photopolymerization initiator represented by the following chemical formula 2,
A photosensitive resin composition in which the first photopolymerization initiator and the second photopolymerization initiator are included in a weight ratio of 70:30 to 79:21:
[Chemical Formula 1]

[Chemical formula 2]

In the above chemical formulas 1 and 2,
R ¹ and R ⁶ are each independently a halogen group, a hydroxy group, a nitro group, a cyano group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C3 to C20 cycloalkyl group or a substituted or unsubstituted C6 to C20 aryl group,
R ² to R ⁵ are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group,
n1 and n2 are each independently an integer from 0 to 4.
In the first paragraph,
A photosensitive resin composition wherein the first photopolymerization initiator and the second photopolymerization initiator are contained in a weight ratio of 72:28 to 78:22.
In the first paragraph,
In the above chemical formulas 1 and 2,
A photosensitive resin composition wherein R ⁴ and R ⁵ are each independently a substituted or unsubstituted C1 to C20 alkyl group.
In the third paragraph,
A photosensitive resin composition wherein R ⁴ and R ⁵ are each independently an unsubstituted C1 to C20 alkyl group, and the carbon number of R ⁴ is less than the carbon number of R ⁵ .
In the first paragraph,
A photosensitive resin composition wherein the first photopolymerization initiator comprises at least one of the following chemical formulae 1-1 to 1-3.
[Chemical Formula 1-1]

[Chemical Formula 1-2]

[Chemical Formula 1-3]

In the first paragraph,
A photosensitive resin composition wherein the second photopolymerization initiator comprises at least one of the following chemical formulas 2-1 to 2-3.
[Chemical Formula 2-1]

[Chemical Formula 2-2]

[Chemical Formula 2-3]

In the first paragraph,
A photosensitive resin composition wherein the binder resin is contained in an amount of 0.1 wt% to 1 wt% based on the total amount of the photosensitive resin composition.
In the first paragraph,
A photosensitive resin composition wherein the binder resin is contained in a smaller amount than the photopolymerizable monomer.
In the first paragraph,
The above colorant is a photosensitive resin composition containing a pigment.
In Article 9,
A photosensitive resin composition wherein the colorant is contained in an amount of 50 to 80 wt% based on the total amount of the photosensitive resin composition.
delete In the first paragraph,
The photosensitive resin composition further comprises an additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorinated surfactant, a radical polymerization initiator, or a combination thereof.
A photosensitive resin film manufactured using the photosensitive resin composition of any one of claims 1 to 10 and 12.
A color filter comprising a photosensitive resin film of claim 13.
A CMOS image sensor comprising a photosensitive resin film of claim 13.
A display device comprising a color filter according to claim 14.
A camera comprising a CMOS image sensor of claim 15.

Images