KR102682916B1 - Photosensitive resin composition, photosensitive resin layer using the same and display device - Google Patents
Photosensitive resin composition, photosensitive resin layer using the same and display device Download PDFInfo
- Publication number
- KR102682916B1 KR102682916B1 KR1020210028255A KR20210028255A KR102682916B1 KR 102682916 B1 KR102682916 B1 KR 102682916B1 KR 1020210028255 A KR1020210028255 A KR 1020210028255A KR 20210028255 A KR20210028255 A KR 20210028255A KR 102682916 B1 KR102682916 B1 KR 102682916B1
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- South Korea
- Prior art keywords
- photosensitive resin
- binder resin
- resin composition
- weight
- black
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 107
- 239000011347 resin Substances 0.000 title claims abstract description 107
- 239000011342 resin composition Substances 0.000 title claims abstract description 73
- 239000011230 binding agent Substances 0.000 claims abstract description 72
- 239000001023 inorganic pigment Substances 0.000 claims abstract description 39
- 239000000178 monomer Substances 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000003999 initiator Substances 0.000 claims abstract description 18
- 239000011164 primary particle Substances 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000000975 dye Substances 0.000 claims description 33
- 239000006229 carbon black Substances 0.000 claims description 20
- 239000004094 surface-active agent Substances 0.000 claims description 10
- 229920005822 acrylic binder Polymers 0.000 claims description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- AJDUTMFFZHIJEM-UHFFFAOYSA-N n-(9,10-dioxoanthracen-1-yl)-4-[4-[[4-[4-[(9,10-dioxoanthracen-1-yl)carbamoyl]phenyl]phenyl]diazenyl]phenyl]benzamide Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2NC(=O)C(C=C1)=CC=C1C(C=C1)=CC=C1N=NC(C=C1)=CC=C1C(C=C1)=CC=C1C(=O)NC1=CC=CC2=C1C(=O)C1=CC=CC=C1C2=O AJDUTMFFZHIJEM-UHFFFAOYSA-N 0.000 claims description 6
- 239000001044 red dye Substances 0.000 claims description 6
- 239000001043 yellow dye Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- KQIGMPWTAHJUMN-UHFFFAOYSA-N 3-aminopropane-1,2-diol Chemical compound NCC(O)CO KQIGMPWTAHJUMN-UHFFFAOYSA-N 0.000 claims description 3
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- 229910017053 inorganic salt Inorganic materials 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
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- 239000002245 particle Substances 0.000 description 4
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- 244000028419 Styrax benzoin Species 0.000 description 3
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- 125000003118 aryl group Chemical group 0.000 description 3
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 3
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- IPHJYJHJDIGARM-UHFFFAOYSA-M copper phthalocyaninesulfonic acid, dioctadecyldimethylammonium salt Chemical compound [Cu+2].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC.C=1C(S(=O)(=O)[O-])=CC=C(C(=NC2=NC(C3=CC=CC=C32)=N2)[N-]3)C=1C3=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 IPHJYJHJDIGARM-UHFFFAOYSA-M 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- WDAXFOBOLVPGLV-UHFFFAOYSA-N ethyl isobutyrate Chemical compound CCOC(=O)C(C)C WDAXFOBOLVPGLV-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005549 heteroarylene group Chemical group 0.000 description 1
- 125000004366 heterocycloalkenyl group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 1
- 125000005638 hydrazono group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000003903 lactic acid esters Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- YSGBMDFJWFIEDF-UHFFFAOYSA-N methyl 2-hydroxy-3-methylbutanoate Chemical compound COC(=O)C(O)C(C)C YSGBMDFJWFIEDF-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- UWMZZSRDUVJJDP-UHFFFAOYSA-M sodium 2-[3-(2-methylanilino)-6-(2-methyl-4-sulfonatoanilino)xanthen-10-ium-9-yl]benzoate Chemical compound [Na+].Cc1ccccc1Nc1ccc2c(-c3ccccc3C([O-])=O)c3ccc(Nc4ccc(cc4C)S([O-])(=O)=O)cc3[o+]c2c1 UWMZZSRDUVJJDP-UHFFFAOYSA-M 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229940035339 tri-chlor Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Architecture (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
Abstract
(A) 제1 바인더 수지 및 제2 바인더 수지를 포함하는 바인더 수지, (B) 광중합성 단량체, (C) 광중합 개시제, (D) 흑색 무기안료, (E) 무기산란체 및 (F) 용매를 포함하고, 상기 제1 바인더 수지는 상기 제2 바인더 수지보다 높은 굴절율을 가지고, 상기 제1 바인더 수지는 상기 제2 바인더 수지보다 같거나 적은 함량으로 포함되고, 상기 무기안료의 1차 입경은 45nm 이하인 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 디스플레이 장치가 제공된다.(A) a binder resin including a first binder resin and a second binder resin, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, (D) a black inorganic pigment, (E) an inorganic scattering agent, and (F) a solvent. wherein the first binder resin has a higher refractive index than the second binder resin, the first binder resin is contained in an amount equal to or less than that of the second binder resin, and the primary particle diameter of the inorganic pigment is 45 nm or less. A photosensitive resin composition, a photosensitive resin film manufactured using the same, and a display device including the photosensitive resin film are provided.
Description
본 기재는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 디스플레이 장치에 관한 것이다.This description relates to a photosensitive resin composition, a photosensitive resin film manufactured using the same, and a display device including the photosensitive resin film.
흑색 감광성 수지 조성물은 컬러필터, 액정표시재료, 유기발광소자(EL), 디스플레이 패널 재료 등의 표시 소자의 제조에 필수적인 재료이다. 예를 들어, 컬러 액정 디스플레이 등의 컬러필터에는 표시 콘트라스트나 발색 효과를 높이기 위해, 레드(red), 그린(green), 블루(blue) 등의 착색층 간의 경계 부분에 블랙 매트릭스나 차광용 격벽이 필요하고, 이는 주로 흑색 감광성 수지 조성물로 형성되는 것이다.Black photosensitive resin composition is an essential material for the manufacture of display devices such as color filters, liquid crystal display materials, organic light emitting devices (EL), and display panel materials. For example, in color filters such as color liquid crystal displays, a black matrix or light-shielding partition is provided at the boundary between colored layers such as red, green, and blue to increase display contrast and color development effect. It is necessary, and it is mainly formed of a black photosensitive resin composition.
특히, 최근의 액정 표시 디스플레이의 개발 방향은 고휘도 및 고색재현율에 맞춰져 있는데, 상기 물성을 달성하기 위한 일환으로 야외에서 들어오는 빛의 반사율을 저감시켜 고휘도 및 고색재현율을 달성하려는 시도가 있다. 디스플레이의 반사율 저하를 위해서 주로 개발하고 있는 방법은 편광필름의 반사방지 필름인 AR(Anti Reflective) 필름과 AG(Anti Glare) 필름을 적용하는 방법이다.In particular, the recent development direction of liquid crystal displays is focused on high brightness and high color gamut, and as part of achieving the above physical properties, there are attempts to achieve high brightness and high color gamut by reducing the reflectance of light coming from outdoors. The main method being developed to reduce the reflectance of displays is to apply AR (Anti Reflective) film and AG (Anti Glare) film, which are anti-reflection films of polarizing films.
그러나, 이와 같은 방법은 가격이 비쌀뿐더러 이제 한계에 봉착하여, 다른 방법으로 반사율을 저감시키려는 노력이 계속되고 있다.However, this method is not only expensive, but also has reached its limits, and efforts to reduce reflectance through other methods are continuing.
일 구현예는 차광 특성과 저반사 특성을 동시에 구현하면서, 패턴의 표면 거칠기 및 직진성 또한 우수한 감광성 수지 조성물을 제공하기 위한 것이다.One embodiment is to provide a photosensitive resin composition that simultaneously implements light-shielding properties and low-reflection properties while also providing excellent surface roughness and straightness of a pattern.
다른 일 구현예는 상기 감광성 수지 조성물을 이용하여 제조된 감광성 수지막을 제공하기 위한 것이다. Another embodiment is to provide a photosensitive resin film manufactured using the photosensitive resin composition.
또 다른 일 구현예는 상기 감광성 수지막을 포함하는 디스플레이 장치를 제공하기 위한 것이다.Another embodiment is to provide a display device including the photosensitive resin film.
일 구현예는 (A) 제1 바인더 수지 및 제2 바인더 수지를 포함하는 바인더 수지, (B) 광중합성 단량체, (C) 광중합 개시제, (D) 흑색 무기안료, (E) 무기산란체 및 (F) 용매를 포함하고, 상기 제1 바인더 수지는 상기 제2 바인더 수지보다 높은 굴절율을 가지고, 상기 제1 바인더 수지는 상기 제2 바인더 수지보다 같거나 적은 함량으로 포함되고, 상기 흑색 무기안료의 1차 입경은 45nm 이하인 감광성 수지 조성물을 제공한다.One embodiment includes (A) a binder resin including a first binder resin and a second binder resin, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, (D) a black inorganic pigment, (E) an inorganic scattering agent, and ( F) includes a solvent, wherein the first binder resin has a higher refractive index than the second binder resin, the first binder resin is contained in an amount equal to or less than the second binder resin, and 1 of the black inorganic pigment A photosensitive resin composition having a difference particle size of 45 nm or less is provided.
상기 제2 바인더 수지는 1.55 이하의 굴절율을 가질 수 있다.The second binder resin may have a refractive index of 1.55 or less.
상기 제1 바인더 수지는 카도계 바인더 수지이고, 상기 제2 바인더 수지는 아크릴계 바인더 수지일 수 있다.The first binder resin may be a cardo-based binder resin, and the second binder resin may be an acrylic-based binder resin.
상기 제2 바인더 수지의 함량은 상기 제1 바인더 수지 함량의 2배 이상일 수 있다.The content of the second binder resin may be twice or more than the content of the first binder resin.
상기 흑색 무기안료의 1차 입경은 30nm 이하일 수 있다.The primary particle diameter of the black inorganic pigment may be 30 nm or less.
상기 흑색 무기안료는 카본블랙을 포함할 수 있다.The black inorganic pigment may include carbon black.
상기 무기산란체는 SiO2, TiO2, ZrO2, BaSO3 또는 이들의 조합을 포함할 수 있다.The inorganic scattering agent may include SiO 2 , TiO 2 , ZrO 2 , BaSO 3 or a combination thereof.
상기 감광성 수지 조성물은 염료를 더 포함할 수 있다.The photosensitive resin composition may further include dye.
상기 염료는 적색 염료, 황색 염료, 바이올렛 염료 또는 이들의 조합을 포함할 수 있다.The dye may include red dye, yellow dye, violet dye, or a combination thereof.
상기 감광성 수지 조성물은, 상기 감광성 수지 조성물 총량에 대해, 상기 (A) 바인더 수지 1 중량% 내지 20 중량%, 상기 (B) 광중합성 단량체 0.5 중량% 내지 10 중량%, 상기 (C) 광중합 개시제 0.1 중량% 내지 5 중량%, 상기 (D) 흑색 무기안료 1 중량% 내지 20 중량%, 상기 (E) 무기산란체 0.1 중량% 내지 5 중량% 및 상기 (F) 용매 40 중량% 내지 80 중량%을 포함할 수 있다.The photosensitive resin composition includes 1% to 20% by weight of the (A) binder resin, 0.5% to 10% by weight of the (B) photopolymerizable monomer, and 0.1% by weight of the (C) photopolymerization initiator, based on the total amount of the photosensitive resin composition. % by weight to 5% by weight, 1% by weight to 20% by weight of the (D) black inorganic pigment, 0.1% by weight to 5% by weight of the (E) inorganic scattering agent, and 40% by weight to 80% by weight of the solvent (F) It can be included.
상기 감광성 수지 조성물은 말론산, 3-아미노-1,2-프로판디올, 실란계 커플링제, 레벨링제, 계면활성제 또는 이들의 조합을 더 포함할 수 있다.The photosensitive resin composition may further include malonic acid, 3-amino-1,2-propanediol, a silane-based coupling agent, a leveling agent, a surfactant, or a combination thereof.
다른 일 구현예는 상기 감광성 수지 조성물을 이용하여 제조된 감광성 수지막을 제공한다.Another embodiment provides a photosensitive resin film manufactured using the photosensitive resin composition.
또 다른 일 구현예는 상기 감광성 수지막을 포함하는 디스플레이 장치를 제공한다.Another embodiment provides a display device including the photosensitive resin film.
기타 본 발명의 측면들의 구체적인 사항은 이하의 상세한 설명에 포함되어 있다.Details of other aspects of the invention are included in the detailed description below.
일 구현예에 따른 감광성 수지 조성물은 서로 상이한 굴절율을 가지는 2종의 바인더 수지를 일정 함량 사용하되, 그 함량을 한정하고, 일정 범위의 1차 입경을 가지는 흑색 무기안료를 함께 사용함으로써, 차광성과 저반사 특성을 동시에 구현할 수 있으며, 나아가 패턴성 또한 우수하게 유지할 수 있다.The photosensitive resin composition according to one embodiment uses a certain amount of two types of binder resins having different refractive indices, limits the amount, and uses a black inorganic pigment with a primary particle size in a certain range, thereby improving light blocking and low Reflective characteristics can be implemented at the same time, and furthermore, excellent patterning can also be maintained.
도 1은 실시예 1에 따른 감광성 수지 조성물을 이용하여 제조된 감광성 수지막의 패턴 사진을 나타낸 주사전자현미경 사진이다.
도 2는 실시예 2에 따른 감광성 수지 조성물을 이용하여 제조된 감광성 수지막의 패턴 사진을 나타낸 주사전자현미경 사진이다.
도 3은 비교예 1에 따른 감광성 수지 조성물을 이용하여 제조된 감광성 수지막의 패턴 사진을 나타낸 주사전자현미경 사진이다.
도 4는 비교예 2에 따른 감광성 수지 조성물을 이용하여 제조된 감광성 수지막의 패턴 사진을 나타낸 주사전자현미경 사진이다.
도 5는 비교예 3에 따른 감광성 수지 조성물을 이용하여 제조된 감광성 수지막의 패턴 사진을 나타낸 주사전자현미경 사진이다.
도 6은 참고예 1에 따른 감광성 수지 조성물을 이용하여 제조된 감광성 수지막의 패턴 사진을 나타낸 주사전자현미경 사진이다.Figure 1 is a scanning electron microscope photograph showing a pattern photograph of a photosensitive resin film manufactured using the photosensitive resin composition according to Example 1.
Figure 2 is a scanning electron microscope photograph showing a pattern photograph of a photosensitive resin film manufactured using the photosensitive resin composition according to Example 2.
Figure 3 is a scanning electron microscope photograph showing a pattern photograph of a photosensitive resin film manufactured using the photosensitive resin composition according to Comparative Example 1.
Figure 4 is a scanning electron microscope photograph showing a pattern photograph of a photosensitive resin film manufactured using the photosensitive resin composition according to Comparative Example 2.
Figure 5 is a scanning electron microscope photograph showing a pattern photograph of a photosensitive resin film manufactured using the photosensitive resin composition according to Comparative Example 3.
Figure 6 is a scanning electron microscope photograph showing a pattern photograph of a photosensitive resin film manufactured using the photosensitive resin composition according to Reference Example 1.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구범위의 범주에 의해 정의될 뿐이다. Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.
본 명세서에서 특별한 언급이 없는 한, "알킬기"란 C1 내지 C20 알킬기를 의미하고, "알케닐기"란 C2 내지 C20 알케닐기를 의미하고, "사이클로알케닐기"란 C3 내지 C20 사이클로알케닐기를 의미하고, "헤테로사이클로알케닐기"란 C3 내지 C20 헤테로사이클로알케닐기를 의미하고, "아릴기"란 C6 내지 C20 아릴기를 의미하고, "아릴알킬기"란 C6 내지 C20 아릴알킬기를 의미하며, "알킬렌기"란 C1 내지 C20 알킬렌기를 의미하고, "아릴렌기"란 C6 내지 C20 아릴렌기를 의미하고, "알킬아릴렌기"란 C6 내지 C20 알킬아릴렌기를 의미하고, "헤테로아릴렌기"란 C3 내지 C20 헤테로아릴렌기를 의미하고, "알콕실렌기"란 C1 내지 C20 알콕실렌기를 의미한다.Unless otherwise specified herein, “alkyl group” refers to a C1 to C20 alkyl group, “alkenyl group” refers to a C2 to C20 alkenyl group, and “cycloalkenyl group” refers to a C3 to C20 cycloalkenyl group. , “Heterocycloalkenyl group” refers to a C3 to C20 heterocycloalkenyl group, “aryl group” refers to a C6 to C20 aryl group, “arylalkyl group” refers to a C6 to C20 arylalkyl group, and “alkylene group” means a C1 to C20 alkylene group, “arylene group” means a C6 to C20 arylene group, “alkylarylene group” means a C6 to C20 alkylarylene group, and “heteroarylene group” means a C3 to C20 heteroarylene group. It means an arylene group, and “alkoxylene group” means a C1 to C20 alkoxylene group.
본 명세서에서 특별한 언급이 없는 한, "치환"이란 적어도 하나의 수소 원자가 할로겐원자(F, Cl, Br, I), 히드록시기, C1 내지 C20 알콕시기, 니트로기, 시아노기, 아민기, 이미노기, 아지도기, 아미디노기, 히드라지노기, 히드라조노기, 카르보닐기, 카르바밀기, 티올기, 에스테르기, 에테르기, 카르복실기 또는 그것의 염, 술폰산기 또는 그것의 염, 인산이나 그것의 염, C1 내지 C20 알킬기, C2 내지 C20 알케닐기, C2 내지 C20 알키닐기, C6 내지 C20 아릴기, C3 내지 C20 사이클로알킬기, C3 내지 C20 사이클로알케닐기, C3 내지 C20 사이클로알키닐기, C2 내지 C20 헤테로사이클로알킬기, C2 내지 C20 헤테로사이클로알케닐기, C2 내지 C20 헤테로사이클로알키닐기, C3 내지 C20 헤테로아릴기 또는 이들의 조합의 치환기로 치환된 것을 의미한다.Unless otherwise specified herein, “substitution” means that at least one hydrogen atom is replaced by a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, Azido group, amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, ether group, carboxyl group or its salt, sulfonic acid group or its salt, phosphoric acid or its salt, C1 to C20 alkyl group, C2 to C20 alkenyl group, C2 to C20 alkynyl group, C6 to C20 aryl group, C3 to C20 cycloalkyl group, C3 to C20 cycloalkenyl group, C3 to C20 cycloalkynyl group, C2 to C20 heterocycloalkyl group, C2 to C20 heterocycloalkenyl group, C2 to C20 heterocycloalkynyl group, C3 to C20 heteroaryl group, or a combination thereof.
또한 본 명세서에서 특별한 언급이 없는 한, "헤테로"란, 화학식 내에 N, O, S 및 P 중 적어도 하나의 헤테로 원자가 적어도 하나 포함된 것을 의미한다.Also, unless otherwise specified herein, “hetero” means that at least one hetero atom among N, O, S, and P is included in the chemical formula.
또한 본 명세서에서 특별한 언급이 없는 한, "(메타)아크릴레이트"는 "아크릴레이트"와 "메타크릴레이트" 둘 다 가능함을 의미하며, "(메타)아크릴산"은 "아크릴산"과 "메타크릴산" 둘 다 가능함을 의미한다. Also, unless otherwise specified in the specification, “(meth)acrylate” means that both “acrylate” and “methacrylate” are possible, and “(meth)acrylic acid” means “acrylic acid” and “methacrylic acid.” "It means that both are possible.
본 명세서에서 별도의 정의가 없는 한, "조합"이란 혼합 또는 공중합을 의미한다. 또한 "공중합"이란 블록 공중합 내지 랜덤 공중합을 의미하고, "공중합체"란 블록 공중합체 내지 랜덤 공중합체를 의미한다.Unless otherwise defined herein, “combination” means mixing or copolymerization. Additionally, “copolymerization” refers to block copolymerization to random copolymerization, and “copolymer” refers to block copolymerization to random copolymerization.
본 명세서 내 화학식에서 별도의 정의가 없는 한, 화학 결합이 그려져야 하는 위치에 화학결합이 그려져 있지 않은 경우는 상기 위치에 수소 원자가 결합되어 있음을 의미한다.Unless otherwise defined in the chemical formulas in this specification, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.
본 명세서에서 카도계 수지란, 하기 화학식 2 내지 화학식 12로 이루어진 군에서 선택된 하나 이상의 관능기가 수지 내 주골격(backbone)에 포함되는 수지를 의미한다.As used herein, cardo-based resin refers to a resin in which at least one functional group selected from the group consisting of the following formulas 2 to 12 is included in the backbone of the resin.
본 명세서에서 별도의 정의가 없는 한, "*"는 동일하거나 상이한 원자(수소원자 포함) 또는 화학식과 연결되는 부분을 의미한다.Unless otherwise defined herein, “*” means a part connected to the same or different atoms (including hydrogen atoms) or a chemical formula.
본 명세서에서 별도의 정의가 없는 한, 굴절율이란 550nm 파장에서의 굴절율을 의미한다.Unless otherwise defined in this specification, refractive index means the refractive index at a wavelength of 550 nm.
일 구현예에 따른 감광성 수지 조성물은 (A) 제1 바인더 수지 및 제2 바인더 수지를 포함하는 바인더 수지, (B) 광중합성 단량체, (C) 광중합 개시제, (D) 흑색 무기안료, (E) 무기산란체 및 (F) 용매를 포함하며, 상기 제1 바인더 수지는 상기 제2 바인더 수지보다 높은 굴절율을 가지고, 상기 제1 바인더 수지는 상기 제2 바인더 수지보다 같거나 적은 함량으로 포함되고, 상기 무기안료의 1차 입경은 45nm 이하이기에, 이를 이용하여 제조된 감광성 수지막, 예컨대 블랙 매트릭스나 차광용 격벽은 종래 블랙 매트릭스나 차광용 격벽과 비교하여 차광성과 저반사 특성을 모두 구현할 수 있으며, 패턴성(패턴 표면 거칠기, 패턴 직진성 등) 또한 우수하다. The photosensitive resin composition according to one embodiment includes (A) a binder resin including a first binder resin and a second binder resin, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, (D) a black inorganic pigment, (E) An inorganic scatterer and (F) a solvent, wherein the first binder resin has a higher refractive index than the second binder resin, and the first binder resin is contained in an amount equal to or less than that of the second binder resin, Since the primary particle size of the inorganic pigment is 45 nm or less, photosensitive resin films manufactured using it, such as black matrices or light-shielding partitions, can realize both light-shielding and low-reflection characteristics compared to conventional black matrices or light-shielding partitions. Performance (pattern surface roughness, pattern straightness, etc.) is also excellent.
구체적으로, 일 구현예에 따른 감광성 수지 조성물은 컬러필터 내 Red, Green, Blue 색간 구별을 위한 블랙 매트릭스나 차광용 격벽에 적용되는데, 종래에는 블랙 매트릭스나 차광용 격벽용 조성물은 효과적인 차광 특성을 구현하기 위해 카본블랙을 주성분으로 하는 조성물이 대부분이었다. 카본블랙을 주성분으로 할 경우 광학밀도가 높아 차광 특성 구현에는 적합하나, 시인성 개선이 이루어지지 않는다는 문제점이 있다. 또한 카본블랙과 같은 흑색 무기안료의 상대적 함량이 높아질 경우 패턴 표면이 거칠어지거나 패턴 직진성, 해상도 등이 저하되는 문제가 있으며, 상기 카본블랙의 상대적 함량을 낮출 경우 차광성이 광학밀도가 저하되어 일반적인 코팅 두께(1㎛ 내지 1.3㎛) 내에서 필요한 최소한의 광학밀도를 구현하지 못한다는 문제가 있다. 본 발명자들은 상기와 같은 문제점을 인식하고, 시인성 개선을 위해 패널의 반사율을 낮추는 방향으로 개발을 진행하였으며, 여러 번의 시행착오 끝에 본 발명을 완성하기에 이르렀다. 실제로 반사율 개선을 위한 필름(예컨대, 저반사 편광 필름 등)을 부착하는 방식이 시도된 적이 있다. 그러나, 편광 필름의 가격이 비싸고, 해당기술로 구현 가능한 반사율이 이미 하한치에 다다랐기 때문에 현재 추가적인 필름 부착 방법으로는 한계가 있으므로 다른 방향으로 반사율을 낮출 수 있는 블랙 매트릭스 또는 차광용 격벽 제조용 조성물의 개발이 이루어지고 있다. 특히 8K 고해상도 모델의 TV의 경우 블랙 매트릭스의 표면적이 4K 대비 약 2배 증가하기 때문에, 차광성뿐만 아니라 반사율이 낮을수록 시인성 개선 효과는 더욱 커질 수 있다.Specifically, the photosensitive resin composition according to one embodiment is applied to a black matrix or a light-shielding partition wall for distinguishing between Red, Green, and Blue colors in a color filter. Conventionally, a black matrix or a light-shielding partition wall composition implements effective light-shielding properties. To achieve this, most compositions were composed of carbon black as the main ingredient. When carbon black is used as the main ingredient, the optical density is high and it is suitable for implementing light blocking properties, but there is a problem in that visibility is not improved. In addition, when the relative content of black inorganic pigments such as carbon black increases, there is a problem that the pattern surface becomes rough or the pattern straightness and resolution decrease, and when the relative content of carbon black is lowered, light blocking properties and optical density decrease, which is a general coating. There is a problem of not being able to achieve the minimum optical density required within the thickness (1㎛ to 1.3㎛). The present inventors recognized the above problems and proceeded with development to lower the reflectance of the panel to improve visibility, and completed the present invention after several trials and errors. In fact, a method of attaching a film (for example, a low-reflection polarizing film, etc.) to improve reflectance has been attempted. However, since the price of the polarizing film is high and the reflectance that can be achieved with the technology has already reached its lower limit, there are currently limits to additional film attachment methods, so the development of a composition for manufacturing a black matrix or light-shielding partition that can lower the reflectance in other directions This is being done. In particular, in the case of 8K high-resolution model TVs, the surface area of the black matrix increases by approximately twice that of 4K, so the lower the reflectance as well as the light blocking properties, the greater the effect of improving visibility.
이하에서 각 성분에 대하여 구체적으로 설명한다.Below, each component is described in detail.
(E) 무기산란체(E) Inorganic scatterer
일 구현예에 따른 감광성 수지 조성물은 무기산란체, 구체적으로 무기산란체 함유 분산액을 포함한다. 종래에도 무기 산란체 함유 분산액을 감광성 수지 조성물에 추가시키는 시도가 있긴 하였으나, 이 경우 추가되는 무기 산란체 함유 분산액의 양만큼, 함께 사용되는 기타 무기물의 함량이 증가할 수 밖에 없어, 차광성을 부여할 흑색 착색제(예컨대 흑색 안료 등)의 상대적인 함량이 줄어들게 되어, 광학밀도가 저하됨에 따라 블랙 매트릭스나 차광용 격벽으로 제조될 수 없는 문제가 있었다.The photosensitive resin composition according to one embodiment includes an inorganic scatterer, specifically a dispersion containing an inorganic scatterer. There have been attempts in the past to add dispersions containing inorganic scatterers to the photosensitive resin composition, but in this case, the content of other inorganic substances used together inevitably increases in proportion to the amount of dispersions containing inorganic scatterers added, thereby imparting light blocking properties. As the relative content of the black colorant (e.g., black pigment, etc.) decreases, the optical density decreases, resulting in the problem that it cannot be manufactured as a black matrix or light-shielding partition.
그러나 일 구현예에 따른 감광성 수지 조성물은 상기 무기 산란체 함유 분산액을 사용하되, 후술하는 것처럼 서로 상이한 굴절율을 가지는 2종의 바인더 수지를 사용하고, 나아가 상기 2종의 바인더 수지 간 함량을 한정함과 동시에 흑색 착색제로서의 역할을 수행하는 흑색 무기안료의 1차 입경을 더욱 한정함으로써, 전술한 문제점을 해결하였다. 즉, 일 구현예에 따른 감광성 수지 조성물을 이용하면 무기 산란체 함유 분산액을 포함함에도 광학밀도 저하 문제가 발생되지 않을 수 있다.However, the photosensitive resin composition according to one embodiment uses the dispersion containing the inorganic scatterer, but uses two types of binder resins having different refractive indices as described later, and further limits the content between the two types of binder resins. At the same time, the above-mentioned problem was solved by further limiting the primary particle size of the black inorganic pigment that serves as a black colorant. That is, when the photosensitive resin composition according to one embodiment is used, the problem of optical density deterioration may not occur even though it contains a dispersion containing inorganic scatterers.
예컨대, 상기 무기산란체는 SiO2, TiO2, ZrO2, BaSO3 또는 이들의 조합을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the inorganic scattering material may include SiO 2 , TiO 2 , ZrO 2 , BaSO 3 or a combination thereof, but is not necessarily limited thereto.
예컨대, 상기 무기산란체는 일 구현예에 따른 감광성 수지 조성물을 이루는 고형분 총량에 대해 1 중량% 이상 포함될 수 있다. 이 경우, 일 구현예에 따른 감광성 수지 조성물을 이용하여 제조되는 감광성 수지막은 3.2 이상의 광학밀도(단위: /1㎛)를 가질 수 있다.For example, the inorganic scattering agent may be included in an amount of 1% by weight or more based on the total amount of solids constituting the photosensitive resin composition according to one embodiment. In this case, the photosensitive resin film manufactured using the photosensitive resin composition according to one embodiment may have an optical density (unit: /1㎛) of 3.2 or more.
예컨대, 상기 무기산란체는 상기 감광성 수지 조성물 총량에 대해 0.1 중량% 내지 5 중량%, 예컨대0.1 중량% 내지 3 중량%로 포함될 수 있다. (무기산란체 분산액 기준으로는 상기 감광성 수지 조성물 총량에 대해 1 중량% 내지 20 중량%, 예컨대 5 중량% 내지 10 중량%로 포함될 수 있다.) 상기 무기산란체가 상기 함량 범위로 포함될 경우 저반사 특성 및 우수한 패턴성을 유지하면서, 동시에 차광성도 확보할 수 있다.For example, the inorganic scattering agent may be included in an amount of 0.1% by weight to 5% by weight, for example, 0.1% by weight to 3% by weight, based on the total amount of the photosensitive resin composition. (Based on the inorganic scatterer dispersion, it may be included in an amount of 1% to 20% by weight, for example, 5% to 10% by weight, based on the total amount of the photosensitive resin composition.) When the inorganic scatterer is included in the above content range, low reflection characteristics And, while maintaining excellent pattern properties, light blocking properties can also be secured.
(A) 바인더 수지(A) Binder resin
일 구현예에 따른 감광성 수지 조성물은 서로 상이한 굴절율을 가지는 2종의 바인더 수지를 포함하며, 보다 높은 굴절율을 가지는 바인더 수지(제1 바인더 수지)는 보다 낮은 굴절율을 가지는 바인더 수지(제2 바인더 수지)와 같거나 적은 함량으로 포함된다. 상기 바인더 수지가 이와 같은 구성을 가지지 못할 경우, 저반사 특성을 구현할 수 없다.The photosensitive resin composition according to one embodiment includes two types of binder resins having different refractive indices, wherein a binder resin (first binder resin) having a higher refractive index and a binder resin (second binder resin) having a lower refractive index. It is included in an amount equal to or less than. If the binder resin does not have this configuration, low-reflection characteristics cannot be realized.
구체적으로, 상기 제2 바인더 수지는 1.55 이하의 굴절율을 가질 수 있다. 예컨대, 상기 제1 바인더 수지는 1.60 이상의 굴절율을 가질 수 있다.Specifically, the second binder resin may have a refractive index of 1.55 or less. For example, the first binder resin may have a refractive index of 1.60 or more.
예컨대, 상기 제2 바인더 수지의 함량은 상기 제1 바인더 수지 함량의 2배 이상일 수 있다. 이 경우,현상성 및 공정마진 향상을 꾀할 수 있다.For example, the content of the second binder resin may be twice or more than the content of the first binder resin. In this case, developability and process margin can be improved.
예컨대, 상기 제1 바인더 수지는 카도계 바인더 수지일 수 있고, 상기 제2 바인더 수지는 아크릴계 바인더 수지일 수 있다. 이 경우, 일 구현예에 따른 감광성 수지 조성물의 내열성 및 내화학성이 개선될 수 있으며, 무엇보다도 저반사 특성 확보에 매우 유리할 수 있다. For example, the first binder resin may be a cardo-based binder resin, and the second binder resin may be an acrylic-based binder resin. In this case, the heat resistance and chemical resistance of the photosensitive resin composition according to one embodiment may be improved, and, above all, it may be very advantageous in securing low-reflection characteristics.
상기 카도계 바인더 수지의 중량평균분자량은 1,000 g/mol 내지 50,000 g/mol일 수 있고, 구체적으로는 3,000 g/mol 내지 35,000 g/mol일 수 있다. 상기 카도계 바인더 수지의 중량평균분자량이 상기 범위 내일 경우 블랙 매트릭스나 차광용 격벽 제조 시 우수한 패턴성 및 현상성을 얻을 수 있다.The weight average molecular weight of the cardo-based binder resin may be 1,000 g/mol to 50,000 g/mol, specifically 3,000 g/mol to 35,000 g/mol. If the weight average molecular weight of the cardo-based binder resin is within the above range, excellent patternability and developability can be obtained when manufacturing a black matrix or a partition for light blocking.
상기 카도계 바인더 수지는 하기 화학식 1로 표시되는 반복단위를 포함하는 화합물일 수 있다.The cardo-based binder resin may be a compound containing a repeating unit represented by the following formula (1).
[화학식 1][Formula 1]
상기 화학식 1에서,In Formula 1,
R24 내지 R27은 각각 독립적으로 수소 원자, 할로겐 원자, 또는 치환 또는 비치환된 C1 내지 C20 알킬기일 수 있고, R 24 to R 27 may each independently be a hydrogen atom, a halogen atom, or a substituted or unsubstituted C1 to C20 alkyl group,
R28 및 R29는 각각 독립적으로 수소 원자, 또는 CH2ORa(Ra는 비닐기, 아크릴기 또는 메타크릴기)일 수 있고,R 28 and R 29 may each independently be a hydrogen atom, or CH 2 OR a (R a is a vinyl group, an acrylic group, or a methacryl group),
R30은 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C2 내지 C20 알케닐기, 아크릴기, 또는 메타크릴기일 수 있고,R 30 may be a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, an acrylic group, or a methacryl group,
Z1은 단일결합, O, CO, SO2, CRbRc, SiRdRe(여기서, Rb 내지 Re는 서로 동일하거나 상이하며, 수소 원자, 또는 치환 또는 비치환된 C1 내지 C20 알킬기임), 또는 하기 화학식 2 내지 화학식 12로 표시되는 화합물로 이루어진 군에서 선택되는 어느 하나일 수 있고,Z 1 is a single bond, O, CO, SO 2 , CR b R c , SiR d R e (where R b to R e are the same or different from each other and represent a hydrogen atom, or a substituted or unsubstituted C1 to C20 alkyl group ), or any one selected from the group consisting of compounds represented by the following formulas 2 to 12,
Z2는 산무수물 잔기 또는 산이무수물 잔기일 수 있다.Z 2 may be an acid anhydride residue or an acid dianhydride residue.
[화학식 2][Formula 2]
[화학식 3][Formula 3]
[화학식 4][Formula 4]
[화학식 5][Formula 5]
[화학식 6][Formula 6]
상기 화학식 6에서,In Formula 6 above,
Rf는 수소 원자, 에틸기, C2H4Cl, C2H4OH, CH2CH=CH2, 또는 페닐기이다.R f is a hydrogen atom, an ethyl group, C 2 H 4 Cl, C 2 H 4 OH, CH 2 CH=CH 2 , or a phenyl group.
[화학식 7][Formula 7]
[화학식 8][Formula 8]
[화학식 9][Formula 9]
[화학식 10][Formula 10]
[화학식 11][Formula 11]
[화학식 12][Formula 12]
상기 카도계 바인더 수지는 구체적으로 하기 화학식 13으로 표시되는 화합물을 테트라카르복실산 이무수물과 반응시켜 얻을 수 있다. The cardo-based binder resin can be specifically obtained by reacting a compound represented by the following formula (13) with tetracarboxylic dianhydride.
[화학식 13][Formula 13]
상기 테트라카르복시산 이무수물은 방향족 테트라카르복시산 이무수물일 수 있다. 상기 방향족 테트라카르복시산 이무수물의 예로는, 피로멜릭산 이무수물, 3,3',4,4'-비페닐테트라카르복시산 이무수물, 2,3,3',4-비페닐테트라카르복시산 이무수물, 2,2',3,3'-비페닐테트라카르복시산 이무수물, 3,3',4,4'-벤조페논테트라카르복시산 이무수물, 3,3',4,4'-비페닐에테르테트라카르복시산 이무수물, 3,3',4,4'-디페닐술폰테트라카르복시산 이무수물, 1,2,3,4-사이클로펜탄테트라카르복시산 이무수물, 1,2,5,6-나프탈렌테트라카르복시산 이무수물, 2,3,6,7-나프탈렌테트라카르복시산 이무수물, 1,4,5,8-나프탈렌테트라카르복시산 이무수물, 2,3,5,6-피리딘테트라카르복시산 이무수물, 3,4,9,10-페릴렌테트라카르복시산 이무수물, 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판 이무수물 등을 들 수 있으나, 이에 한정되는 것은 아니다.The tetracarboxylic dianhydride may be aromatic tetracarboxylic dianhydride. Examples of the aromatic tetracarboxylic dianhydride include pyromelliic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 2,3,3',4-biphenyltetracarboxylic acid dianhydride, 2, 2',3,3'-Biphenyl tetracarboxylic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl ether tetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 2,3 ,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,5,6-pyridinetetracarboxylic dianhydride, 3,4,9,10-perylenetetra Carboxylic acid dianhydride, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, etc. may be mentioned, but are not limited thereto.
상기 아크릴계 바인더 수지는 제1 에틸렌성 불포화 단량체 및 이와 공중합 가능한 제2 에틸렌성 불포화 단량체의 공중합체로, 하나 이상의 아크릴계 반복단위를 포함하는 수지이다. The acrylic binder resin is a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.
상기 제1 에틸렌성 불포화 단량체는 하나 이상의 카르복시기를 함유하는 에틸렌성 불포화 단량체이며, 이의 구체적인 예로는 아크릴산, 메타크릴산, 말레산, 이타콘산, 푸마르산 또는 이들의 조합을 들 수 있다.The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.
상기 제1 에틸렌성 불포화 단량체는 상기 아크릴계 바인더 수지 총량에 대하여 5 내지 50 중량%로 포함될 수 있고, 구체적으로는 10 내지 40 중량%로 포함될 수 있다.The first ethylenically unsaturated monomer may be included in an amount of 5 to 50% by weight, specifically, 10 to 40% by weight, based on the total amount of the acrylic binder resin.
상기 제2 에틸렌성 불포화 단량체는 스티렌, α-메틸스티렌, 비닐톨루엔, 비닐벤질메틸에테르 등의 방향족 비닐 화합물; 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 부틸(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트, 2-히드록시 부틸(메타)아크릴레이트, 벤질(메타)아크릴레이트, 사이클로헥실(메타)아크릴레이트, 페닐(메타)아크릴레이트 등의 불포화 카르복시산 에스테르 화합물; 2-아미노에틸(메타)아크릴레이트, 2-디메틸아미노에틸(메타)아크릴레이트 등의 불포화 카르복시산 아미노 알킬 에스테르 화합물; 초산비닐, 안식향산 비닐 등의 카르복시산 비닐 에스테르 화합물; 글리시딜(메타)아크릴레이트 등의 불포화 카르복시산 글리시딜 에스테르 화합물; (메타)아크릴로니트릴 등의 시안화 비닐 화합물; (메타)아크릴아미드 등의 불포화 아미드 화합물; 등을 들 수 있으며, 이들을 단독으로 또는 둘 이상 혼합하여 사용할 수 있다.The second ethylenically unsaturated monomer may include aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzylmethyl ether; Methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxy butyl (meth)acrylate, benzyl (meth)acrylate, Unsaturated carboxylic acid ester compounds such as cyclohexyl (meth)acrylate and phenyl (meth)acrylate; unsaturated carboxylic acid amino alkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; Carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; Unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; Vinyl cyanide compounds such as (meth)acrylonitrile; Unsaturated amide compounds such as (meth)acrylamide; These can be mentioned, and these can be used alone or in a mixture of two or more.
상기 아크릴계 바인더 수지의 구체적인 예로는 메타크릴산/벤질메타크릴레이트 공중합체, 메타크릴산/벤질메타크릴레이트/스티렌 공중합체, 메타크릴산/벤질메타크릴레이트/2-히드록시에틸메타크릴레이트 공중합체, 메타크릴산/벤질메타크릴레이트/스티렌/2-히드록시에틸메타크릴레이트 공중합체 등을 들 수 있으나, 이에 한정되는 것은 아니며, 이들을 단독 또는 2종 이상을 배합하여 사용할 수도 있다. Specific examples of the acrylic binder resin include methacrylic acid/benzyl methacrylate copolymer, methacrylic acid/benzyl methacrylate/styrene copolymer, and methacrylic acid/benzyl methacrylate/2-hydroxyethyl methacrylate copolymer. Examples include polymers, methacrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymers, etc., but are not limited thereto, and these may be used alone or in combination of two or more types.
상기 아크릴계 바인더 수지의 중량평균분자량은 3,000 g/mol 내지 150,000 g/mol일 수 있고, 구체적으로는 5,000 g/mol 내지 50,000 g/mol일 수 있고, 더욱 구체적으로는 20,000 g/mol 내지 30,000 g/mol일 수 있다. 상기 아크릴계 바인더 수지의 중량평균분자량이 상기 범위 내일 경우, 일 구현예에 따른 감광성 수지 조성물의 물리적 및 화학적 물성이 우수하고 점도가 적절하며, 블랙 매트릭스나 차광용 격벽 제조시 기판과의 밀착성이 우수하다.The weight average molecular weight of the acrylic binder resin may be 3,000 g/mol to 150,000 g/mol, specifically 5,000 g/mol to 50,000 g/mol, and more specifically 20,000 g/mol to 30,000 g/mol. It can be mol. When the weight average molecular weight of the acrylic binder resin is within the above range, the photosensitive resin composition according to one embodiment has excellent physical and chemical properties, appropriate viscosity, and excellent adhesion to the substrate when manufacturing a black matrix or a light-shielding partition. .
상기 아크릴계 바인더 수지의 산가는 15 mgKOH/g 내지 60 mgKOH/g일 수 있고, 구체적으로는 20 mgKOH/g 내지 50 mgKOH/g일 수 있다. 상기 아크릴계 바인더 수지의 산가가 상기 범위 내일 경우 픽셀 패턴의 해상도가 우수하다.The acid value of the acrylic binder resin may be 15 mgKOH/g to 60 mgKOH/g, specifically 20 mgKOH/g to 50 mgKOH/g. When the acid value of the acrylic binder resin is within the above range, the resolution of the pixel pattern is excellent.
상기 바인더 수지는 상기 감광성 수지 조성물 총량에 대하여 1 중량% 내지 20 중량%, 예컨대 3 중량% 내지 15 중량%로 포함될 수 있다. 상기 바인더 수지가 상기 범위 내로 포함될 경우, 점도가 적절히 유지되어 블랙 매트릭스나 차광용 격벽 제조 시 패턴성, 공정성 및 현상성이 우수하다.The binder resin may be included in an amount of 1% to 20% by weight, for example, 3% to 15% by weight, based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, the viscosity is appropriately maintained, and patternability, processability, and developability are excellent when manufacturing a black matrix or a partition for light blocking.
(B) 광중합성 단량체(B) Photopolymerizable monomer
상기 광중합성 단량체는 적어도 1개의 에틸렌성 불포화 이중결합을 가지는 (메타)아크릴산의 일관능 또는 다관능 에스테르가 사용될 수 있다.The photopolymerizable monomer may be a mono- or multi-functional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond.
상기 아크릴계 광중합성 단량체는 상기 에틸렌성 불포화 이중결합을 가짐으로써, 패턴 형성 공정에서 노광 시 충분한 중합을 일으킴으로써 내열성, 내광성 및 내화학성이 우수한 패턴을 형성할 수 있다.Since the acrylic photopolymerizable monomer has the ethylenically unsaturated double bond, sufficient polymerization occurs during exposure to light in the pattern formation process, thereby forming a pattern with excellent heat resistance, light resistance, and chemical resistance.
상기 광중합성 단량체의 구체적인 예로는, 에틸렌 글리콜 디(메타)아크릴레이트, 디에틸렌 글리콜 디(메타)아크릴레이트, 트리에틸렌 글리콜 디(메타)아크릴레이트, 프로필렌 글리콜 디(메타)아크릴레이트, 네오펜틸 글리콜 디(메타)아크릴레이트, 1,4-부탄디올 디(메타)아크릴레이트, 1,6-헥산디올 디(메타)아크릴레이트, 비스페놀A 디(메타)아크릴레이트, 펜타에리트리톨 디(메타)아크릴레이트, 펜타에리트리톨 트리(메타)아크릴레이트, 펜타에리트리톨 테트라(메타)아크릴레이트, 펜타에리트리톨 헥사(메타)아크릴레이트, 디펜타에리트리톨 디(메타)아크릴레이트, 디펜타에리트리톨 트리(메타)아크릴레이트, 디펜타에리트리톨 펜타(메타)아크릴레이트, 디펜타에리트리톨 헥사(메타)아크릴레이트, 비스페놀A 에폭시(메타)아크릴레이트, 에틸렌 글리콜 모노메틸에테르 (메타)아크릴레이트, 트리메틸올 프로판 트리(메타)아크릴레이트, 트리스(메타)아크릴로일옥시에틸 포스페이트, 노볼락에폭시 (메타)아크릴레이트 등을 들 수 있다. Specific examples of the photopolymerizable monomer include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, and neopentyl glycol. Di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate , pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth) Acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylol propane tri( Meta)acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, etc. can be mentioned.
상기 광중합성 단량체의 시판되는 제품을 예로 들면 다음과 같다. 상기 (메타)아크릴산의 일관능 에스테르의 예로는, 도아 고세이 화학공업(주)社의 아로닉스 M-101®, 아로닉스 M-111®, 아로닉스 M-114® 등; 일본화학(주)社의 KAYARAD TC-110S®, KAYARAD TC-120S® 등; 오사카 유끼 화학공업(주)社의 V-158®, V-2311® 등을 들 수 있다. 상기 (메타)아크릴산의 이관능 에스테르의 예로는, 도아 고세이 화학공업(주)社의 아로닉스 M-210®, 아로닉스 M-240®, 아로닉스 M-6200® 등; 일본화학(주)社의 KAYARAD HDDA®, KAYARAD HX-220®, KAYARAD R-604® 등; 오사카 유끼 화학공업(주)社의 V-260®, V-312®, V-335 HP® 등을 들 수 있다. 상기 (메타)아크릴산의 삼관능 에스테르의 예로는, 도아 고세이 화학공업(주)社의 아로닉스 M-309®, 아로닉스 M-400®, 아로닉스 M-405®, 아로닉스 M-450®, 아로닉스 M-710®, 아로닉스 M-8030®, 아로닉스 M-8060® 등; 일본화학(주)社의 KAYARAD TMPTA®, KAYARAD DPCA-20®, KAYARAD-30®, KAYARAD-60®, KAYARAD-120® 등; 오사카 유끼 화학공업(주)社의 V-295®, V-300®, V-360®, V-GPT®, V-3PA®, V-400® 등을 들 수 있다. 상기 제품을 단독 사용 또는 2종 이상 함께 사용할 수 있다.Examples of commercially available products of the photopolymerizable monomer are as follows. Examples of the monofunctional ester of (meth)acrylic acid include Aronix M-101 ® , Aronix M-111 ® , and Aronix M-114 ® manufactured by Toagosei Chemical Co., Ltd.; Nippon Chemical Co., Ltd.'s KAYARAD TC-110S ® , KAYARAD TC-120S ® , etc.; Examples include V-158 ® and V-2311 ® manufactured by Osaka Yuki Chemical Co., Ltd. Examples of the above-mentioned difunctional ester of (meth)acrylic acid include Aronix M-210 ® , Aronix M-240 ® , and Aronix M-6200 ® manufactured by Toagosei Chemical Co., Ltd.; KAYARAD HDDA ® , KAYARAD HX-220 ® , KAYARAD R-604 ® , etc. from Nippon Chemical Co., Ltd.; Examples include V-260 ® , V-312 ® , and V-335 HP ® manufactured by Osaka Yuki Chemical Co., Ltd. Examples of the trifunctional ester of (meth)acrylic acid include Aronix M-309 ® , Aronix M-400 ® , Aronix M-405 ® , and Aronix M-450 ® manufactured by Toagosei Chemical Co., Ltd. Aronix M-710 ® , Aronix M-8030 ® , Aronix M-8060 ® , etc.; KAYARAD TMPTA ® , KAYARAD DPCA-20 ® , KAYARAD-30 ® , KAYARAD-60 ® , KAYARAD-120 ® , etc. from Nippon Chemical Co., Ltd.; Examples include V-295 ® , V-300 ® , V-360 ® , V-GPT ® , V-3PA ® , and V-400 ® from Osaka Yuki Chemical Co., Ltd. The above products can be used alone or in combination of two or more types.
상기 광중합성 단량체는 보다 우수한 현상성을 부여하기 위하여 산무수물로 처리하여 사용할 수도 있다.The photopolymerizable monomer may be used after being treated with an acid anhydride to provide better developability.
상기 광중합성 단량체는 상기 감광성 수지 조성물 총량 대비 0.5 중량% 내지 10 중량%, 예컨대 1 중량% 내지 5 중량%로 포함될 수 있다. 상기 광중합성 단량체가 상기 범위 내로 포함될 경우, 패턴 형성 공정에서 노광시 경화가 충분히 일어나 신뢰성이 우수하며, 알칼리 현상액에의 현상성이 우수하다.The photopolymerizable monomer may be included in an amount of 0.5% to 10% by weight, for example, 1% to 5% by weight, based on the total amount of the photosensitive resin composition. When the photopolymerizable monomer is included within the above range, sufficient curing occurs during exposure to light in the pattern formation process, resulting in excellent reliability and excellent developability in an alkaline developer.
(C) 광중합 개시제(C) Photopolymerization initiator
상기 광중합 개시제는 아세토페논계 화합물, 벤조페논계 화합물, 티오크산톤계 화합물, 벤조인계 화합물, 트리아진계 화합물, 옥심계 화합물 또는 이들의 조합 등을 사용할 수 있다.The photopolymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a combination thereof.
상기 아세토페논계 화합물의 예로는, 2,2'-디에톡시 아세토페논, 2,2'-디부톡시 아세토페논, 2-히드록시-2-메틸프로피오페논, p-t-부틸트리클로로 아세토페논, p-t-부틸디클로로 아세토페논, 4-클로로 아세토페논, 2,2'-디클로로-4-페녹시 아세토페논, 2-메틸-1-(4-(메틸티오)페닐)-2-모폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모폴리노페닐)-부탄-1-온 등을 들 수 있다.Examples of the acetophenone-based compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t -Butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.
상기 벤조페논계 화합물의 예로는, 벤조페논, 벤조일 안식향산, 벤조일 안식향산 메틸, 4-페닐 벤조페논, 히드록시 벤조페논, 아크릴화 벤조페논, 4,4'-비스(디메틸 아미노)벤조페논, 4,4'-비스(디에틸아미노)벤조페논, 4,4'-디메틸아미노벤조페논,4,4'-디클로로벤조페논, 3,3'-디메틸-2-메톡시벤조페논 등을 들 수 있다.Examples of the benzophenone-based compounds include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4 '-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.
상기 티오크산톤계 화합물의 예로는, 티오크산톤, 2-클로로티오크산톤, 2-메틸티오크산톤, 이소프로필 티오크산톤, 2,4-디에틸 티오크산톤, 2,4-디이소프로필 티오크산톤 등을 들 수 있다.Examples of the thioxanthone-based compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diiso Propyl thioxanthone, etc. can be mentioned.
상기 벤조인계 화합물의 예로는, 벤조인, 벤조인 메틸 에테르, 벤조인 에틸 에테르, 벤조인 이소프로필 에테르, 벤조인 이소부틸 에테르, 벤질디메틸케탈 등을 들 수 있다.Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyldimethyl ketal.
상기 트리아진계 화합물의 예로는, 2,4,6-트리클로로-s-트리아진, 2-페닐 4,6-비스(트리클로로메틸)-s-트리아진, 2-(3',4'-디메톡시스티릴)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4'-메톡시나프틸)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(p-메톡시페닐)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(p-톨릴)-4,6-비스(트리클로로 메틸)-s-트리아진, 2-비페닐 4,6-비스(트리클로로 메틸)-s-트리아진, 비스(트리클로로메틸)-6-스티릴-s-트리아진, 2-(나프토1-일)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4-메톡시나프토1-일)-4,6-비스(트리클로로메틸)-s-트리아진, 2-4-비스(트리클로로메틸)-6-피페로닐-s-트리아진, 2-4-비스(트리클로로메틸)-6-(4-메톡시스티릴)-s-트리아진등을 들 수 있다.Examples of the triazine-based compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'- Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-Biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho1-yl)-4,6 -bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichlor Romethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, etc. can be mentioned.
상기 옥심계 화합물의 예로는 O-아실옥심계화합물, 2-(O-벤조일옥심)-1-[4-(페닐티오)페닐]-1,2-옥탄디온, 1-(O-아세틸옥심)-1-[9-에틸-6-(2-메틸벤조일)-9H-카르바졸-3-일]에탄온, O-에톡시카르보닐-α-옥시아미노-1-페닐프로판-1-온, 1-(3-사이클로펜틸-1-(9-에틸-6-(2-메틸벤조일)-9H-카바졸-3-일)프로필리덴아미노옥시)에탄온, 2-(벤조일옥시이미노)-3-사이클로펜틸-1-(4-(페닐티오)페닐)프로판-1-온 등을 사용할 수 있다. 상기 O-아실옥심계 화합물의 구체적인 예로는, 1,2-옥탄디온, 2-디메틸아미노-2-(4-메틸벤질)-1-(4-모르폴린-4-일-페닐)-부탄-1-온, 1-(4-페닐술파닐페닐)-부탄-1,2-디온-2-옥심-O-벤조에이트, 1-(4-페닐술파닐페닐)-옥탄-1,2-디온-2-옥심-O-벤조에이트, 1-(4-페닐술파닐페닐)-옥탄-1-온옥심-O-아세테이트 및 1-(4-페닐술파닐페닐)-부탄-1-온옥심-O-아세테이트 등을 사용할 수 있다. Examples of the oxime-based compounds include O-acyloxime-based compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime) -1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, 1-(3-Cyclopentyl-1-(9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl)propylideneaminooxy)ethanone, 2-(benzoyloxyimino)-3 -Cyclopentyl-1-(4-(phenylthio)phenyl)propan-1-one, etc. can be used. Specific examples of the O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butane- 1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione -2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-oneoxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butane-1-oneoxime- O-acetate, etc. can be used.
일 구현예에 따른 감광성 수지 조성물은 옥심계 화합물과 아세토페논계 화합물의 혼합물을 광중합 개시제로 포함할 수 있다. 이 때, 상기 옥심계 화합물은 상기 아세토페논계 화합물보다 많은 함량으로 포함될 수 있다.The photosensitive resin composition according to one embodiment may include a mixture of an oxime-based compound and an acetophenone-based compound as a photopolymerization initiator. At this time, the oxime-based compound may be included in a larger amount than the acetophenone-based compound.
상기 광중합 개시제는 상기 화합물 이외에도 카바졸계 화합물, 디케톤류 화합물, 술포늄 보레이트계 화합물, 디아조계 화합물, 이미다졸계 화합물, 비이미다졸계 화합물, 플루오렌계 화합물 등을 사용할 수 있다.In addition to the above compounds, the photopolymerization initiator may include carbazole-based compounds, diketone-based compounds, sulfonium borate-based compounds, diazo-based compounds, imidazole-based compounds, biimidazole-based compounds, and fluorene-based compounds.
상기 광중합 개시제는 상기 감광성 수지 조성물 총량 대비 0.1 중량% 내지 5 중량%, 예컨대 0.1 중량% 내지 3 중량%로 포함될 수 있다. 상기 광중합 개시제가 상기 범위 내로 포함될 경우, 패턴 형성 공정에서 노광 시 광중합이 충분히 일어나게 되어, 제조된 블랙 매트릭스나 차광용 격벽의 감도가 우수해지게 된다.The photopolymerization initiator may be included in an amount of 0.1% to 5% by weight, for example, 0.1% to 3% by weight, based on the total amount of the photosensitive resin composition. When the photopolymerization initiator is included within the above range, photopolymerization sufficiently occurs during exposure in the pattern formation process, and the sensitivity of the manufactured black matrix or light-shielding partition becomes excellent.
(D) 흑색 무기안료(D) Black inorganic pigment
전술한 무기산란체 함유 분산액과의 상용성을 고려하되, 차광성을 높여 흑색을 용이하게 구현하기 위해, 상기 흑색 무기안료 분산액을 구성하는 상기 흑색 무기안료는 45nm 이하의 1차 입경을 가진다. 1차 입경이 45nm 이하인 흑색 무기안료 분산액은 일 구현예에 따른 감광성 수지 조성물 내 흑색 착색제로 사용되기에 매우 적합하다.Considering compatibility with the above-mentioned inorganic scatterer-containing dispersion, in order to easily achieve black color by increasing light blocking, the black inorganic pigment constituting the black inorganic pigment dispersion has a primary particle size of 45 nm or less. A black inorganic pigment dispersion with a primary particle diameter of 45 nm or less is very suitable for use as a black colorant in the photosensitive resin composition according to one embodiment.
예컨대, 상기 흑색 무기안료의 1차 입경은 30nm 이하일 수 있다.For example, the primary particle diameter of the black inorganic pigment may be 30 nm or less.
예컨대, 상기 흑색 무기안료는 카본블랙을 포함할 수 있다. 예컨대, 상기 흑색 무기안료는 카본블랙일 수 있다.For example, the black inorganic pigment may include carbon black. For example, the black inorganic pigment may be carbon black.
예컨대, 상기 흑색 무기안료 분산액의 함량은 상기 무기산란체 함유 분산액 함량의 3배 이상일 수 있다. 이 경우, 광학밀도가 보다 높아져 차광성 구현에 보다 유리하며, 반사율 저감에도 효과적일 수 있다.For example, the content of the black inorganic pigment dispersion may be three times or more than the content of the dispersion containing the inorganic scattering agent. In this case, the optical density becomes higher, making it more advantageous to realize light blocking properties, and it can also be effective in reducing reflectance.
상기 흑색 무기안료는 분산제와 함께 사용될 수 있다. 구체적으로는, 상기 흑색 무기안료를 분산제로 미리 표면처리하여 사용하거나, 조성물 제조 시 흑색 무기안료와 함께 분산제를 첨가하여 사용할 수 있다. The black inorganic pigment can be used together with a dispersant. Specifically, the black inorganic pigment can be used by previously surface-treating it with a dispersant, or the dispersant can be added together with the black inorganic pigment when preparing the composition.
상기 분산제로는 비이온성 분산제, 음이온성 분산제, 양이온성 분산제 등을 사용할 수 있다. 상기 분산제의 구체적인 예로는, 폴리 알킬렌 글리콜 및 이의 에스테르, 폴리 옥시 알킬렌, 다가 알코올 에스테르 알킬렌 옥사이드 부가물, 알코올 알킬렌 옥사이드 부가물, 술폰산에스테르, 술폰산염, 카르복실산 에스테르, 카르복실산염, 알킬 아미드 알킬렌 옥사이드 부가물, 알킬 아민 등을 들 수 있으며, 이들을 단독으로 또는 둘 이상 혼합하여 사용할 수 있다.As the dispersant, a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. may be used. Specific examples of the dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylic acid ester, and carboxylic acid salt. , alkyl amide, alkylene oxide adduct, alkyl amine, etc., and these can be used alone or in a mixture of two or more.
상기 분산제의 시판되는 제품을 예로 들면, BYK社의 DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 등; EFKA 케미칼社의 EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450 등; Zeneka社의 Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000 등; 또는 Ajinomoto社의 PB711, PB821 등이 있다.Examples of commercially available dispersants include BYK's DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, and DISPERBYK. -166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc.; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemicals; Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; Alternatively, there are Ajinomoto's PB711 and PB821.
상기 분산제는 상기 감광성 수지 조성물 총량 대비 0.1 중량% 내지 15 중량%로 포함될 수 있다. 분산제가 상기 범위 내로 포함될 경우, 조성물의 분산성이 우수함에 따라 차광용 격벽 제조 시 안정성, 현상성 및 패턴성이 우수하다. The dispersant may be included in an amount of 0.1% to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is included within the above range, the composition has excellent dispersibility, resulting in excellent stability, developability, and patternability when manufacturing a partition for light blocking.
상기 안료는 수용성 무기염 및 습윤제를 이용하여 전처리하여 사용할 수도 있다. 안료를 상기 전처리하여 사용할 경우 안료의 평균입경을 미세화할 수 있다.The pigment may be used after pretreatment using a water-soluble inorganic salt and a wetting agent. When the pigment is used after the above pretreatment, the average particle diameter of the pigment can be refined.
상기 전처리는 상기 안료를 수용성 무기염 및 습윤제와 함께 니딩(kneading)하는 단계, 그리고 상기 니딩단계에서 얻어진 안료를 여과 및 수세하는 단계를 거쳐 수행될 수 있다.The pretreatment may be performed through the steps of kneading the pigment with a water-soluble inorganic salt and a wetting agent, and filtering and washing the pigment obtained in the kneading step.
상기 니딩은 40℃내지 100℃의 온도에서 수행될 수 있고, 상기 여과 및 수세는 물 등을 사용하여 무기염을 수세한 후 여과하여 수행될 수 있다.The kneading may be performed at a temperature of 40°C to 100°C, and the filtration and washing may be performed by washing the inorganic salt with water or the like and then filtering.
상기 수용성 무기염의 예로는 염화나트륨, 염화칼륨 등을 들 수 있으나, 이에 한정되는 것은 아니다. 상기 습윤제는 상기 안료 및 상기 수용성 무기염이 균일하게 섞여 안료가 용이하게 분쇄될 수 있는 매개체 역할을 하며, 그 예로는 에틸렌 글리콜 모노에틸에테르, 프로필렌 글리콜 모노메틸에테르, 디에틸렌 글리콜 모노메틸에테르 등과 같은 알킬렌 글리콜 모노알킬에테르; 에탄올, 이소프로판올, 부탄올, 헥산올, 시클로헥산올, 에틸렌글리콜, 디에틸렌글리콜, 폴리에틸렌글리콜, 글리세린폴리에틸렌글리콜 등과 같은 알코올 등을 들 수 있으며, 이들을 단독 또는 둘 이상 혼합하여 사용할 수 있다.Examples of the water-soluble inorganic salt include sodium chloride and potassium chloride, but are not limited thereto. The wetting agent serves as a medium through which the pigment and the water-soluble inorganic salt can be uniformly mixed and the pigment can be easily pulverized, examples of which include ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc. alkylene glycol monoalkyl ether; Alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerol, polyethylene glycol, etc. can be used alone or in a mixture of two or more.
상기 니딩 단계를 거친 안료는 5 nm 내지 200 nm, 예컨대 5 nm 내지 150 nm의 평균 입경을 가질 수 있다. 안료의 평균 입경이 상기 범위 내인 경우, 안료 분산액에서의 안정성이 우수하고, 픽셀의 해상성 저하의 우려가 없다. The pigment that has gone through the kneading step may have an average particle diameter of 5 nm to 200 nm, for example, 5 nm to 150 nm. When the average particle diameter of the pigment is within the above range, stability in the pigment dispersion is excellent, and there is no concern about deterioration of pixel resolution.
구체적으로, 상기 흑색 무기안료는 상기 흑색 무기안료 분산액 총량에 대해 15 중량% 내지 40 중량%, 예컨대 20 중량% 내지 30 중량%로 포함될 수 있다.Specifically, the black inorganic pigment may be included in an amount of 15% to 40% by weight, for example, 20% to 30% by weight, based on the total amount of the black inorganic pigment dispersion.
상기 흑색 무기안료는 상기 감광성 수지 조성물 총량 대비 1 중량% 내지 20 중량%, 예컨대 1 내지 15 중량%로 포함될 수 있다. (흑색 무기안료 분산액 기준으로는 상기 감광성 수지 조성물 총량 대비 20 중량% 내지 40 중량%, 예컨대 20 중량% 내지 30 중량%로 포함될 수 있다.) 상기 흑색 무기안료가 상기 범위 내로 포함될 경우, 흑색 구현 효과 및 현상 성능이 우수해지게 된다.The black inorganic pigment may be included in an amount of 1 to 20% by weight, for example, 1 to 15% by weight, based on the total amount of the photosensitive resin composition. (Based on the black inorganic pigment dispersion, it may be included in an amount of 20% to 40% by weight, for example, 20% to 30% by weight, based on the total amount of the photosensitive resin composition.) When the black inorganic pigment is included within the above range, the effect of realizing black color and development performance becomes excellent.
(F) 용매(F) Solvent
상기 용매는 전술한 구성성분들 및 후술하는 기타 첨가제 등과의 상용성을 가지되 반응하지 않는 물질들이 사용될 수 있다.The solvent may be a material that is compatible with but does not react with the above-described components and other additives described later.
상기 용매의 예로는, 메탄올, 에탄올 등의 알코올류; 디클로로에틸에테르, n-부틸에테르, 디이소아밀에테르, 메틸페닐에테르, 테트라히드로퓨란 등의 에테르류; 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜디메틸에테르 등의 글리콜에테르류; 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 디에틸셀로솔브아세테이트 등의 셀로솔브아세테이트류; 메틸에틸카르비톨, 디에틸카르비톨, 디에틸렌글리콜모노메틸에테르, 디에틸렌글리콜모노에틸에테르, 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜에틸메틸에테르, 디에틸렌글리콜디에틸에테르 등의 카르비톨류; 프로필렌글리콜메틸에테르아세테이트, 프로필렌글리콜프로필에테르아세테이트 등의 프로필렌글리콜알킬에테르아세테이트류; 톨루엔, 크실렌 등의 방향족탄화수소류; 메틸에틸케톤, 사이클로헥사논, 4-히드록시-4-메틸-2-펜타논, 메틸-n-프로필케톤, 메틸-n-부틸케톤, 메틸-n-아밀케톤, 2-헵타논 등의 케톤류; 초산에틸, 초산-n-부틸, 초산이소부틸 등의 포화 지방족 모노카르복실산알킬에스테르류; 젖산메틸, 젖산에틸 등의 젖산에스테르류; 옥시초산메틸, 옥시초산에틸, 옥시초산부틸 등의 옥시초산알킬에스테르류; 메톡시초산메틸, 메톡시초산에틸, 메톡시초산부틸, 에톡시초산메틸, 에톡시초산에틸 등의 알콕시초산알킬에스테르류; 3-옥시프로피온산메틸, 3-옥시프로피온산에틸 등의 3-옥시프로피온산알킬에스테르류; 3-메톡시프로피온산메틸, 3-메톡시프로피온산에틸, 3-에톡시프로피온산에틸, 3-에톡시프로피온산메틸 등의 3-알콕시프로피온산알킬에스테르류; 2-옥시프로피온산메틸, 2-옥시프로피온산에틸, 2-옥시프로피온산프로필 등의 2-옥시프로피온산알킬에스테르류; 2-메톡시프로피온산메틸, 2-메톡시프로피온산에틸, 2-에톡시프로피온산에틸, 2-에톡시프로피온산메틸 등의 2-알콕시프로피온산알킬에스테르류; 2-옥시-2-메틸프로피온산메틸, 2-옥시-2-메틸프로피온산에틸 등의2-옥시-2-메틸프로피온산에스테르류, 2-메톡시-2-메틸프로피온산메틸, 2-에톡시-2-메틸프로피온산에틸 등의 2-알콕시-2-메틸프로피온산알킬류의 모노옥시모노카르복실산알킬에스테르류; 2-히드록시프로피온산에틸, 2-히드록시-2-메틸프로피온산에틸, 히드록시초산에틸, 2-히드록시-3-메틸부탄산메틸 등의 에스테르류; 피루빈산에틸 등의 케톤산에스테르류 등이 있으며, 또한, N-메틸포름아미드, N,N-디메틸포름아미드, N-메틸포름아닐라드, N-메틸아세트아미드, N,N-디메틸아세트아미드, N-메틸피롤리돈, 디메틸술폭시드, 벤질에틸에테르, 디헥실에테르, 아세틸아세톤, 이소포론, 카프론산, 카프릴산, 1-옥탄올, 1-노난올, 벤질알코올, 초산벤질, 안식향산에틸, 옥살산디에틸, 말레인산디에틸, γ부티로락톤, 3-메틸벤조산, 3-메톡시부틸아세테이트, 탄산에틸렌, 탄산프로필렌, 페닐셀로솔브아세테이트 등의 고비점 용매를 들 수 있다.Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; Glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; Carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; Aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone ; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Alkyl oxyacetic acid esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxy acetic acid alkyl esters such as methyl methoxy acetate, ethyl methoxy acetate, butyl methoxy acetate, methyl ethoxy acetate, and ethyl ethoxy acetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionate esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, 2-methoxy-2-methylpropionate methyl, 2-ethoxy-2- Monooxymonocarboxylic acid alkyl esters of alkyl 2-alkoxy-2-methylpropionate such as ethyl methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; Keto acid esters such as ethyl pyruvate, and others include N-methylformamide, N,N-dimethylformamide, N-methylformanilad, N-methylacetamide, and N,N-dimethylacetamide. , N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, benzoic acid. High boiling point solvents such as ethyl, diethyl oxalate, diethyl maleate, γ-butyrolactone, 3-methylbenzoic acid, 3-methoxybutyl acetate, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can be mentioned.
이들 중 좋게는 상용성 및 반응성을 고려하여, 사이클로헥사논 등의 케톤류; 에틸렌글리콜모노에틸에테르, 에틸렌글리콜디메틸에테르, 에틸렌글리콜디에틸에테르, 디에틸렌글리콜에틸메틸에테르 등의 글리콜에테르류; 에틸셀로솔브아세테이트 등의 에틸렌글리콜알킬에테르아세테이트류; 2-히드록시프로피온산에틸 등의 에스테르류; 디에틸렌글리콜모노메틸에테르 등의 카르비톨류; 프로필렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜프로필에테르아세테이트 등의 프로필렌글리콜알킬에테르아세테이트류, 3-메틸벤조산, 3-메톡시부틸아세테이트 등이 사용될 수 있다.Among these, considering compatibility and reactivity, ketones such as cyclohexanone are preferred; Glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and diethylene glycol ethylmethyl ether; Ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; Carbitols such as diethylene glycol monomethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, 3-methylbenzoic acid, 3-methoxybutyl acetate, etc. may be used.
상기 용매는 상기 감광성 수지 조성물 총량 대비 잔부량, 예컨대 40 중량% 내지 80 중량%, 예컨대 40 중량% 내지 70 중량%, 예컨대 40 중량% 내지 65 중량%로 포함될 수 있다. 상기 용매가 상기 범위 내로 포함될 경우 감광성 수지 조성물이 적절한 점도를 가짐에 따라 블랙 매트릭스나 차광용 격벽 제조 시 공정성이 우수하다.The solvent may be included in a residual amount, for example, 40% to 80% by weight, for example, 40% to 70% by weight, or for example, 40% to 65% by weight, relative to the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, resulting in excellent processability when manufacturing a black matrix or a partition for light blocking.
(G) 염료(G) dye
일 구현예에 따른 감광성 수지 조성물은 염료를 더 포함할 수 있다. 상기 염료는 적색 염료, 황색 염료, 바이올렛 염료 또는 이들의 조합을 포함할 수 있다.The photosensitive resin composition according to one embodiment may further include dye. The dye may include red dye, yellow dye, violet dye, or a combination thereof.
적색 염료, 황색 염료, 바이올렛 염료 또는 이들의 조합을 추가로 사용할 경우, 패턴 표면 거칠기와 직진성을 훼손하지 않으면서, 광학밀도를 더욱 상승시킬 수 있다.When red dye, yellow dye, violet dye, or a combination thereof is additionally used, optical density can be further increased without damaging the pattern surface roughness and straightness.
상기 적색 염료로는 예컨대, 크산텐계 염료, 아조(피리돈계, 바르비투르산계 등)계 염료, 디스아조계 염료, 안트라퀴논계 염료, 메틴계 염료 등을 들 수 있으며, 반드시 이에 한정되는 것은 아니다. 또 이러한 염료를 레이크화한 레이크 안료, 술폰산 또는 카르복실산 등의 산성기를 갖는 산성 염료의 무기염, 산성 염료와 질소 함유 화합물과의 조염 화합물, 산성 염료의 술폰산아미드 화합물 등의 형태여도 무방하다.Examples of the red dye include, but are not limited to, xanthene-based dyes, azo (pyridone-based, barbituric acid-based, etc.)-based dyes, disazo-based dyes, anthraquinone-based dyes, and methine-based dyes. Additionally, it may be in the form of a lake pigment obtained by laking such a dye, an inorganic salt of an acidic dye having an acidic group such as sulfonic acid or carboxylic acid, a salt-formation compound of an acidic dye and a nitrogen-containing compound, or a sulfonic acid amide compound of an acidic dye.
상기 황색 염료로는 예컨대, 퀴놀린계 염료, 아조계(피리돈계, 바르비투르산계 금속 착물 계 등) 염료, 디스아조계 염료, 메틴계 염료 등을 들 수 있으며, 반드시 이에 한정되는 것은 아니다.Examples of the yellow dye include, but are not limited to, quinoline-based dyes, azo-based (pyridone-based, barbituric acid-based metal complex-based, etc.) dyes, disazo-based dyes, and methine-based dyes.
상기 바이올렛 염료로는 예컨대, C.I. 솔벤트 바이올렛 2, C.I. 솔벤트 바이올렛 10 등의 크산텐계 지용성 염료, C.I. 솔벤트 바이올렛 2 등의 로다민계 지용성 염료, C.I. 베이직 바이올렛 10 등의 크산텐계 염기성 염료, C.I. 애시드 바이올렛 9 등의 크산텐계 산성 염료 등을 들 수 있으며, 반드시 이에 한정되는 것은 아니다.Examples of the violet dye include C.I. Solvent Violet 2, C.I. Xanthene-based fat-soluble dyes such as Solvent Violet 10, C.I. Rhodamine-based fat-soluble dyes such as Solvent Violet 2, C.I. Xanthene basic dyes such as Basic Violet 10, C.I. Examples include xanthene-based acid dyes such as Acid Violet 9, but are not necessarily limited thereto.
상기 염료는 상기 흑색 무기안료 분산액보다 적은 함량으로 포함될 수 있다. 예컨대, 상기 염료가 상기 흑색 무기안료 분산액보다 많은 함량으로 포함될 경우, 상기 흑색 무기안료 분산액의 상대적인 함량의 감소로 인해 오히려 광학밀도를 저하시키게 되어 바람직하지 않을 수 있다.The dye may be included in a smaller amount than the black inorganic pigment dispersion. For example, when the dye is included in a larger amount than the black inorganic pigment dispersion, the relative content of the black inorganic pigment dispersion is reduced, which may not be desirable because the optical density is lowered.
상기 염료는 상기 감광성 수지 조성물 총량 대비 잔부량, 예컨대 1 중량% 내지 10 중량%, 예컨대 3 중량% 내지 8 중량%로 포함될 수 있다. 상기 염료가 상기 범위 내로 포함될 경우 감광성 수지 조성물의 광학밀도의 추가적인 상승과 함께, 저반사 특성 및 우수한 패턴성을 꾀할 수 있다.The dye may be included in a residual amount, for example, 1% to 10% by weight, for example, 3% to 8% by weight, relative to the total amount of the photosensitive resin composition. When the dye is included within the above range, the optical density of the photosensitive resin composition can be further increased, and low-reflection characteristics and excellent patterning properties can be achieved.
(H) 기타 첨가제(H) Other additives
한편, 상기 감광성 수지 조성물은 말론산, 3-아미노-1,2-프로판디올, 실란계 커플링제, 레벨링제, 계면활성제 또는 이들의 조합의 첨가제를 더 포함할 수 있다.Meanwhile, the photosensitive resin composition may further include additives such as malonic acid, 3-amino-1,2-propanediol, silane-based coupling agent, leveling agent, surfactant, or a combination thereof.
상기 실란계 커플링제는 기판과의 밀착성 등을 개선하기 위해 비닐기, 카르복실기, 메타크릴옥시기, 이소시아네이트기, 에폭시기 등의 반응성 치환기를 가질 수 있다. The silane-based coupling agent may have a reactive substituent such as a vinyl group, carboxyl group, methacryloxy group, isocyanate group, or epoxy group in order to improve adhesion to the substrate.
상기 실란계 커플링제의 예로는, 트리메톡시실릴벤조산, γ메타크릴옥시프로필트리메톡시실란, 비닐트리아세톡시실란, 비닐트리메톡시실란, γ이소시아네이트프로필트리에톡시실란, γ글리시독시프로필트리메톡시실란, β에폭시사이클로헥실)에틸트리메톡시실란 등을 들 수 있으며, 이들을 단독 또는 2종 이상 혼합하여 사용할 수 있다. Examples of the silane-based coupling agent include trimethoxysilylbenzoic acid, γmethacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γisocyanatepropyltriethoxysilane, and γglycidoxypropyl. Trimethoxysilane, β-epoxycyclohexyl)ethyltrimethoxysilane, etc. can be used, and these can be used alone or in combination of two or more.
상기 실란계 커플링제는 상기 감광성 수지 조성물 총량 대비 0.01 중량부 내지 10 중량부로 포함될 수 있다. 상기 실란계 커플링제가 상기 범위 내로 포함될 경우 밀착성, 저장성 등이 우수하다. The silane-based coupling agent may be included in an amount of 0.01 to 10 parts by weight based on the total amount of the photosensitive resin composition. When the silane-based coupling agent is included within the above range, adhesion, storage, etc. are excellent.
또한 상기 감광성 수지 조성물은 필요에 따라 코팅성 향상 및 결점생성 방지효과를 위해 계면활성제, 예컨대 불소계 계면활성제 및/또는 실리콘계 계면활성제를 더 포함할 수 있다. In addition, the photosensitive resin composition may further include a surfactant, such as a fluorine-based surfactant and/or a silicone-based surfactant, if necessary, to improve coating properties and prevent defects.
상기 불소계 계면활성제로는, BM Chemie社의 BM-1000®, BM-1100®등; 다이닛폰잉키가가꾸고교(주)社의 메카팩 F 142D®, 메카팩 F 172®, 메카팩 F 173®, 메카팩 F 183®, 메카팩 F 554® 등; 스미토모스리엠(주)社의 프로라드 FC-135®, 프로라드 FC-170C®, 프로라드 FC-430®, 프로라드 FC-431® 등; 아사히그라스(주)社의 사프론 S-112®, 사프론 S-113®, 사프론 S-131®, 사프론 S-141®, 사프론 S-145®등; 도레이실리콘(주)社의 SH-28PA®, SH-190®, SH-193®, SZ-6032®, SF-8428® 등의 명칭으로 시판되고 있는 것을 사용할 수 있다.Examples of the fluorine-based surfactants include BM-1000 ® and BM-1100 ® from BM Chemie; Mechapack F 142D ® , Mechapack F 172 ® , Mechapack F 173 ® , Mechapack F 183 ® , Mechapack F 554 ® , etc. from Dainippon Inki Chemicals Co., Ltd.; Sumitomo 3M Co., Ltd.'s Prorad FC-135 ® , Prorad FC-170C ® , Prorad FC-430 ® , Prorad FC-431 ® , etc.; Asahi Grass Co., Ltd.'s Saffron S-112 ® , Saffron S-113 ® , Saffron S-131 ® , Saffron S-141 ® , Saffron S-145 ® , etc.; Those commercially available under names such as SH-28PA ® , SH-190 ® , SH-193 ® , SZ-6032 ® , and SF-8428 ® from Toray Silicone Co., Ltd. can be used.
상기 실리콘계 계면활성제로는 BYK Chem社의 BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325등의 명칭으로 시판되고 있는 것을 사용할 수 있다.The silicone-based surfactants include BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, manufactured by BYK Chem. You can use one that is commercially available under names such as BYK-325.
상기 계면활성제는 상기 감광성 수지 조성물 총량 대비 0.001 중량부 내지 5 중량부로 사용될 수 있다. 상기 계면활성제가 상기 범위 내로 포함될 경우 코팅 균일성이 확보되고, 얼룩이 발생하지 않으며, IZO 기판 또는 유리기판에 대한 습윤성(wetting)이 우수하다.The surfactant may be used in an amount of 0.001 to 5 parts by weight based on the total amount of the photosensitive resin composition. When the surfactant is contained within the above range, coating uniformity is ensured, stains do not occur, and wetting on an IZO substrate or glass substrate is excellent.
또한 상기 감광성 수지 조성물은 물성을 저해하지 않는 범위 내에서 산화방지제, 안정제 등의 기타 첨가제가 일정량 첨가될 수도 있다. Additionally, a certain amount of other additives such as antioxidants and stabilizers may be added to the photosensitive resin composition within the range that does not impair the physical properties.
일 구현예에 따른 감광성 수지 조성물은 포지티브형일 수도 있고, 네가티브형일 수도 있으나, 차광성을 가지는 조성물의 노광 및 현상 후 패턴이 노출되는 영역의 잔기(residue)를 보다 완벽하게 제거하기 위해서는 네가티브형인 것이 보다 바람직하다.The photosensitive resin composition according to one embodiment may be a positive type or a negative type, but in order to more completely remove residues in the area where the pattern is exposed after exposure and development of the composition having light blocking properties, it is better to use the negative type. desirable.
다른 일 구현예는 전술한 감광성 수지 조성물을 노광, 현상 및 경화하여 제조된 감광성 수지막, 예컨대 블랙 매트릭스 또는 차광용 격벽을 제공한다. Another embodiment provides a photosensitive resin film, such as a black matrix or a light blocking partition, manufactured by exposing, developing, and curing the above-described photosensitive resin composition.
상기 감광성 수지막 제조방법은 다음과 같다.The photosensitive resin film manufacturing method is as follows.
(1) 도포 및 도막 형성 단계(1) Application and film formation stage
차광용 격벽 조성물을 소정의 전처리를 한 유리 기판 또는 ITO 기판 등의 기판 상에 스핀 또는 슬릿 코트법, 롤 코트법, 스크린 인쇄법, 어플리케이터법 등의 방법을 사용하여 원하는 두께로 도포한 후, 70℃내지 110℃에서 1분 내지 10분 동안 가열(프리베이킹)하여 용제를 제거함으로써 도막을 형성한다.After applying the light-shielding barrier composition to a desired thickness using a method such as spin or slit coating, roll coating, screen printing, or applicator method on a substrate such as a glass substrate or ITO substrate that has undergone a predetermined pretreatment, 70 A coating film is formed by removing the solvent by heating (prebaking) at ℃ to 110℃ for 1 to 10 minutes.
(2) 노광 단계(2) exposure step
상기 얻어진 도막에 필요한 패턴 형성을 위해 마스크를 개재한 뒤, 200 nm 내지 500 nm의 활성선을 조사하여 노광을 진행한다. 조사에 사용되는 광원으로는 저압 수은등, 고압 수은등, 초고압 수은등, 금속 할로겐화물 램프, 아르곤 가스 레이저 등을 사용할 수 있으며, 경우에 따라 X선, 전자선 등도 이용할 수 있다.In order to form the necessary pattern on the obtained coating film, a mask is interposed, and then exposure is performed by irradiating active rays of 200 nm to 500 nm. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
노광량은 조성물 각 성분의 종류, 배합량 및 건조 막 두께에 따라 다르지만, 고압 수은등을 사용하는 경우에는 500 mJ/cm2(365 nm 센서에 의함) 이하이다.The exposure amount varies depending on the type, mixing amount, and dry film thickness of each component of the composition, but when using a high-pressure mercury lamp, it is 500 mJ/cm 2 (based on a 365 nm sensor) or less.
(3) 현상 단계(3) Development stage
알칼리성 수용액을 현상액으로 이용하여 불필요한 부분을 용해, 제거함으로써 노광 부분만을 잔존시켜 패턴을 형성시킨다. An alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts remaining to form a pattern.
(4) 후처리 단계(4) Post-processing step
현상에 의해 수득된 화상 패턴을 내열성, 밀착성, 내화학성 등의 측면에서 우수한 패턴을 얻기 위한 후가열 공정이 있다. 예컨대, 현상 후 250℃의 컨벡션 오븐에 현상에 의해 수득된 화상 패턴을 넣은 후 1시간 동안 가열(포스트베이킹)할 수 있다.There is a post-heating process to obtain an image pattern obtained through development that is excellent in terms of heat resistance, adhesion, chemical resistance, etc. For example, after development, the image pattern obtained by development can be placed in a convection oven at 250°C and then heated (post-baking) for 1 hour.
또 다른 일 구현예는 상기 감광성 수지막을 포함하는 디스플레이 장치를 제공한다. Another embodiment provides a display device including the photosensitive resin film.
이하, 본 발명의 바람직한 실시예를 기재한다. 다만, 하기의 실시예는 본 발명의 바람직한 일실시예일 뿐, 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, preferred embodiments of the present invention will be described. However, the following example is only a preferred example of the present invention, and the present invention is not limited by the following example.
(감광성 수지 조성물 제조)(Photosensitive resin composition production)
실시예 1 내지 실시예 3, 비교예 1 내지 비교예 3 및 참조예 1Examples 1 to 3, Comparative Examples 1 to 3, and Reference Example 1
하기 표 1에 나타낸 조성으로 혼합 후, 6시간 동안 교반하여, 실시예 1 내지 실시예 3, 비교예 1 내지비교예 3 및 참조예 1에 따른 감광성 수지 조성물을 제조하였다. 구체적으로 광중합 개시제 함량을 정확히 측정한 뒤, 용제를 투입한 후 개시제가 다 녹을 때까지 충분히 교반하였다. 이 후, 바인더 수지와 광중합성 단량체를 순차적으로 첨가한 뒤, 다시 1시간 가량 교반하였다. 이 후, 무기산란체 함유 분산액 및 기타 첨가제를 투입하고, 흑색 무기안료 분산액을 넣은 후, 최종적으로 조성물 전체를 2시간 이상 교반하여, 감광성 수지 조성물을 제조하였다.After mixing the composition shown in Table 1 below and stirring for 6 hours, photosensitive resin compositions according to Examples 1 to 3, Comparative Examples 1 to 3, and Reference Example 1 were prepared. Specifically, the photopolymerization initiator content was accurately measured, the solvent was added, and the mixture was sufficiently stirred until the initiator was completely dissolved. Afterwards, the binder resin and photopolymerizable monomer were sequentially added, and then stirred for another hour. Afterwards, the inorganic scatterer-containing dispersion and other additives were added, the black inorganic pigment dispersion was added, and finally the entire composition was stirred for more than 2 hours to prepare a photosensitive resin composition.
(A) 바인더 수지(A) Binder resin
(A-1) 제1 바인더 수지(A-1) First binder resin
카도계 바인더 수지(KBR101, 경인양행社, 굴절율 1.6)Cardo-based binder resin (KBR101, Kyungin Corporation, refractive index 1.6)
(A-2) 제2 바인더 수지(A-2) Second binder resin
아크릴계 바인더 수지(RY-25, Showadenko社, 굴절율 1.52)Acrylic binder resin (RY-25, Showadenko, refractive index 1.52)
(B) 광중합성 단량체(B) Photopolymerizable monomer
디펜타에리트리톨 헥사(메타)아크릴레이트 (DPHA, 일본화약社)Dipentaerythritol hexa(meth)acrylate (DPHA, Japan Explosives)
(C) 광중합 개시제(C) Photopolymerization initiator
(C-1) 옥심계 개시제 (SPI-02, 삼양社)(C-1) Oxime-based initiator (SPI-02, Samyang Co., Ltd.)
(C-2) 아세토페논계 개시제 (IRG-369, BASF社)(C-2) Acetophenone initiator (IRG-369, BASF)
(D) 흑색 무기안료 분산액(D) Black inorganic pigment dispersion
(D-1) 카본블랙 포함 Mill base (SAKATA社; 카본블랙 1차 입경 30nm, 카본블랙 함량: 25중량%)(D-1) Mill base containing carbon black (SAKATA company; carbon black primary particle size 30nm, carbon black content: 25% by weight)
(D-2) 카본블랙 포함 Mill base (SAKATA社; 카본블랙 1차 입경 45nm, 카본블랙 함량: 25중량%)(D-2) Mill base containing carbon black (SAKATA company; carbon black primary particle size 45nm, carbon black content: 25% by weight)
(D-3) 카본블랙 포함 Mill base (SAKATA社; 카본블랙 1차 입경 50nm, 카본블랙 함량: 25중량%)(D-3) Mill base containing carbon black (SAKATA company; carbon black primary particle size 50nm, carbon black content: 25% by weight)
(D-4) 카본블랙 포함 Mill base (SAKATA社; 카본블랙 1차 입경 70nm, 카본블랙 함량: 25중량%)(D-4) Mill base containing carbon black (SAKATA company; carbon black primary particle size 70nm, carbon black content: 25% by weight)
(E) 무기산란체 함유 분산액(E) Dispersion containing inorganic scatterers
ZrO2 함유 분산액 (Mikuni社; ZrO2 함량: 20중량%)ZrO 2 -containing dispersion (Mikuni; ZrO 2 content: 20% by weight)
(F) 용매(F) Solvent
프로필렌 글리콜 모노메틸에테르 아세테이트 (PGMEA, 비룡社)Propylene glycol monomethyl ether acetate (PGMEA, Biryong Co., Ltd.)
(G) 염료(G) dye
(G-1) Xanthene 계열 Red 염료 (경인양행, RD-503)(G-1) Xanthene-based red dye (KISCO, RD-503)
(G-2) Azo 계열 Yellow 염료 (경인양행, YDP-301)(G-2) Azo series yellow dye (Kyungin Corporation, YDP-301)
(H) 기타 첨가제(H) Other additives
γ글리시독시 프로필 트리메톡시실란 (S-510, Chisso社)γGlycidoxypropyl trimethoxysilane (S-510, Chisso)
(평가)(evaluation)
반사율 평가Reflectance evaluation
실시예 1 내지 실시예 3, 비교예 1 내지 비교예 3 및 참고예 1에서 제조된 감광성 수지 조성물을 각각 유리기판 상에 스핀 코팅하고, 약 100℃에서 90초 동안 pre-bake하여 약 1.3㎛의 두께로 도포하였다. 그 다음 실온(23℃)에서 60초 동안 냉각한 후, 초고압 수은 램프로 40mJ/㎠의 자외선을 조사하여 감광 부분의 광경화 반응을 유도하였다. 상기 노광된 기판을 실온에서 0.043% KOH 수용액에서 스프레이 방식으로 현상한 후, 순수 용매로 60초 동안 세정하였다. 그 후 실온에서 건조한 후 230℃의 컨벡션 오븐에서 30분간 post-bake하여 패턴 시편을 얻었다. 상기 패턴 시편 형성 후, 반사율을 측정하기 위해 100% 반사율을 가지고 있는 Cr 기판을 기준으로, 각각의 패턴 시편의 반사율을 MCPD(오츠카社) 장비를 이용하여 측정하고, 그 결과를 하기 표 2에 나타내었다.The photosensitive resin compositions prepared in Examples 1 to 3, Comparative Examples 1 to 3, and Reference Example 1 were spin-coated on a glass substrate and pre-baked at about 100°C for 90 seconds to form a thickness of about 1.3㎛. It was applied thickly. Then, after cooling at room temperature (23°C) for 60 seconds, ultraviolet rays of 40 mJ/cm2 were irradiated with an ultra-high pressure mercury lamp to induce a photocuring reaction of the photosensitive portion. The exposed substrate was developed by spraying in a 0.043% KOH aqueous solution at room temperature and then washed with pure solvent for 60 seconds. Afterwards, it was dried at room temperature and then post-baked in a convection oven at 230°C for 30 minutes to obtain a patterned specimen. After forming the pattern specimen, in order to measure the reflectance, the reflectance of each pattern specimen was measured using MCPD (Otsuka) equipment based on a Cr substrate with 100% reflectance, and the results are shown in Table 2 below. It was.
광학밀도 평가Optical density evaluation
실시예 1 내지 실시예 3, 비교예 1 내지 비교예 3 및 참고예 1의 감광성 수지 조성물을 코팅, 노광, 현상 및 포스트 베이크까지 완료하여 패터닝된 시편을 OD meter를 사용하여, 1㎛당 광학밀도를 측정하였고, 그 결과를 하기 표 3에 나타내었다.The photosensitive resin compositions of Examples 1 to 3, Comparative Examples 1 to 3, and Reference Example 1 were coated, exposed, developed, and post-baked, and the patterned specimen was measured for optical density per 1㎛ using an OD meter. was measured, and the results are shown in Table 3 below.
상기 표 2, 표 3 및 도 1 내지 도 6으로부터, 일 구현예에 따른 감광성 수지 조성물은 차광성과 저반사 특성을 동시에 구현함과 동시에, 패턴성 또한 매우 우수함을 확인할 수 있다.From Table 2, Table 3, and Figures 1 to 6, it can be seen that the photosensitive resin composition according to one embodiment simultaneously implements light-shielding properties and low-reflection characteristics, and also has very excellent patterning properties.
본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.The present invention is not limited to the above-mentioned embodiments, but can be manufactured in various different forms, and those skilled in the art will be able to form other specific forms without changing the technical idea or essential features of the present invention. You will be able to understand that this can be implemented. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.
Claims (13)
(B) 광중합성 단량체,
(C) 광중합 개시제,
(D) 흑색 무기안료,
(E) 무기산란체 및
(F) 용매
를 포함하고,
상기 제1 바인더 수지는 상기 제2 바인더 수지보다 높은 굴절율을 가지고,
상기 제2 바인더 수지의 함량은 상기 제1 바인더 수지 함량의 2배 이상이고,
상기 바인더 수지는 감광성 수지 조성물 총량에 대하여 1 중량% 내지 20 중량%로 포함되고,
상기 흑색 무기안료의 1차 입경은 45nm 이하인 감광성 수지 조성물.
(A) a binder resin comprising a first binder resin and a second binder resin,
(B) photopolymerizable monomer,
(C) photopolymerization initiator,
(D) black inorganic pigment,
(E) inorganic scatterers and
(F) Solvent
Including,
The first binder resin has a higher refractive index than the second binder resin,
The content of the second binder resin is more than twice the content of the first binder resin,
The binder resin is included in an amount of 1% to 20% by weight based on the total amount of the photosensitive resin composition,
A photosensitive resin composition wherein the primary particle size of the black inorganic pigment is 45 nm or less.
상기 제2 바인더 수지는 1.55 이하의 굴절율을 가지는 감광성 수지 조성물.
According to paragraph 1,
The second binder resin is a photosensitive resin composition having a refractive index of 1.55 or less.
상기 제1 바인더 수지는 카도계 바인더 수지이고,
상기 제2 바인더 수지는 아크릴계 바인더 수지인 감광성 수지 조성물.
According to paragraph 1,
The first binder resin is a cardo-based binder resin,
The photosensitive resin composition wherein the second binder resin is an acrylic binder resin.
상기 흑색 무기안료의 1차 입경은 30nm 이하인 감광성 수지 조성물.
According to paragraph 1,
A photosensitive resin composition wherein the primary particle size of the black inorganic pigment is 30 nm or less.
상기 흑색 무기안료는 카본블랙을 포함하는 감광성 수지 조성물.
According to paragraph 1,
The black inorganic pigment is a photosensitive resin composition containing carbon black.
상기 무기산란체는 SiO2, TiO2, ZrO2, BaSO3 또는 이들의 조합을 포함하는 감광성 수지 조성물.
According to paragraph 1,
The inorganic scattering material is a photosensitive resin composition comprising SiO 2 , TiO 2 , ZrO 2 , BaSO 3 or a combination thereof.
상기 감광성 수지 조성물은 염료를 더 포함하는 감광성 수지 조성물.
According to paragraph 1,
The photosensitive resin composition further includes a dye.
상기 염료는 적색 염료, 황색 염료, 바이올렛 염료 또는 이들의 조합을 포함하는 감광성 수지 조성물.
According to clause 8,
A photosensitive resin composition wherein the dye includes red dye, yellow dye, violet dye, or a combination thereof.
상기 감광성 수지 조성물은, 상기 감광성 수지 조성물 총량에 대해,
상기 (A) 바인더 수지 1 중량% 내지 20 중량%,
상기 (B) 광중합성 단량체 0.5 중량% 내지 10 중량%,
상기 (C) 광중합 개시제 0.1 중량% 내지 5 중량%,
상기 (D) 흑색 무기안료 1 중량% 내지 20 중량%,
상기 (E) 무기산란체 0.1 중량% 내지 5 중량% 및
상기 (F) 용매 40 중량% 내지 80 중량%
을 포함하는 감광성 수지 조성물.
According to paragraph 1,
The photosensitive resin composition is, with respect to the total amount of the photosensitive resin composition,
1% to 20% by weight of (A) binder resin,
(B) 0.5% to 10% by weight of photopolymerizable monomer,
(C) 0.1% to 5% by weight of photopolymerization initiator,
(D) 1% to 20% by weight of black inorganic pigment,
(E) 0.1% to 5% by weight of inorganic scattering agent, and
40% to 80% by weight of the (F) solvent
A photosensitive resin composition containing a.
상기 감광성 수지 조성물은 말론산, 3-아미노-1,2-프로판디올, 실란계 커플링제, 레벨링제, 계면활성제 또는 이들의 조합을 더 포함하는 감광성 수지 조성물.
According to paragraph 1,
The photosensitive resin composition further includes malonic acid, 3-amino-1,2-propanediol, a silane-based coupling agent, a leveling agent, a surfactant, or a combination thereof.
A photosensitive resin film manufactured using the photosensitive resin composition according to any one of claims 1 to 3 and 5 to 11.
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