KR102731257B1 - Display device - Google Patents

Abstract

The present invention provides a display device capable of preventing cracks from occurring in an edge area of a substrate. According to one embodiment of the present invention, a display device includes a first substrate including a display area in which pixels are arranged and a non-display area surrounding the display area, a second substrate disposed on the first substrate and formed to cover the display area of the first substrate and have a smaller area than the first substrate, a first adhesive layer disposed between the first substrate and the second substrate, and a protective film disposed on an edge of the first substrate and formed in contact with a side surface of the first adhesive layer.

Description

DISPLAY DEVICE

The present invention relates to a display device.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Accordingly, various display devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting displays (OLEDs) are being utilized recently.

Among display devices, organic light-emitting display devices are self-luminous, and have superior viewing angles and contrast ratios compared to liquid crystal displays (LCDs). They do not require a separate backlight, so they can be made thin and light, and have the advantage of low power consumption. In addition, organic light-emitting display devices can be driven by low DC voltage, have a fast response speed, and have the advantage of low manufacturing costs.

An organic light-emitting display device includes pixels, each including an organic light-emitting element, and a bank that partitions the pixels to define the pixels. The bank can serve as a pixel definition film. The organic light-emitting element includes an anode electrode, a hole transporting layer, an organic light emitting layer, an electron transporting layer, and a cathode electrode. In this case, when a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes and electrons move to the organic light-emitting layer through the hole transporting layer and the electron transporting layer, respectively, and combine with each other in the organic light-emitting layer to emit light.

Organic light-emitting diodes have the disadvantage of being easily deteriorated by external factors such as moisture and oxygen. To prevent this, organic light-emitting display devices form a sealing film to prevent external moisture and oxygen from penetrating the organic light-emitting diode.

Figure 1 is a cross-sectional view schematically showing a conventional display device.

Referring to Fig. 1, a conventional display device forms a sealing film (30) on a first substrate (10) on which an organic light-emitting element (20) is formed. At this time, the sealing film (30) includes a first inorganic film (30a), an organic film (30b), and a second inorganic film (30c), thereby preventing oxygen or moisture from penetrating into the organic light-emitting layer and electrode.

The first substrate (10) on which the sealing film (30) is formed is bonded to the second substrate (50) by the adhesive layer (40). At this time, if the first substrate (10) and the second substrate (50) are not formed with exactly the same area, as shown in Fig. 1, the edge area (E) of the first substrate (10) may be exposed to the outside.

The exposed edge area (E) may crack if it is subjected to external impact during subsequent processing or transportation. The crack may propagate inward, and there is a problem that moisture or oxygen flowing in along the propagated crack causes black spots and black line stains.

The present invention provides a display device capable of preventing cracks from occurring in an edge area of a substrate.

A display device according to one embodiment of the present invention includes a first substrate including a display area in which pixels are arranged and a non-display area surrounding the display area, a second substrate disposed on the first substrate and formed to cover the display area of the first substrate and have a smaller area than the first substrate, a first adhesive layer disposed between the first substrate and the second substrate, and a protective film disposed at an edge of the first substrate and formed in contact with a side surface of the first adhesive layer.

A display device according to another embodiment of the present invention includes a first substrate including a display area in which pixels are arranged and a non-display area surrounding the display area, a polarizing plate disposed on the first substrate and formed to cover the display area of the first substrate and have a smaller area than the first substrate, a first adhesive layer disposed between the first substrate and the polarizing plate, and a protective film disposed at an edge of the first substrate and formed in contact with a side surface of the first adhesive layer.

According to the present invention, by forming a side protective film on an edge region of a substrate, impact applied to the side of the substrate can be absorbed, and the display device can be prevented from being damaged by external impact.

In addition, the present invention can enhance the sealing effect of the side because the side of the display panel is additionally surrounded by a side protective film.

In addition, the present invention can prevent cracks from occurring in the touch panel or polarizing plate due to external moisture or oxygen penetrating or external impact by forming an adhesive layer between the side protective film and the touch panel.

In addition, the present invention can reduce the contact area between the display panel and the touch panel by forming an adhesive layer only on the side protective film. Accordingly, the present invention can easily proceed with the rework process of detaching and attaching the touch panel from the display panel without damaging the touch panel and the display panel.

In addition, the present invention can improve the side moisture penetration prevention effect by forming the side protective film with an insulating polymer material and graphene flakes.

Figure 1 is a cross-sectional view schematically showing a conventional display device.
FIG. 2 is a perspective view showing a display device according to one embodiment of the present invention.
Figure 3 is a plan view schematically showing the display panel of Figure 2.
Figure 4 is a cross-sectional view showing an example of pixels in the display area of Figure 3.
Figure 5 is a cross-sectional view schematically showing the cross-section of line II-II' shown in Figure 3.
Figure 6 is a cross-sectional view showing a modified embodiment of Figure 5.
FIG. 7 is a perspective view showing a display device according to another embodiment of the present invention.
Figure 8 is a plan view schematically showing the display panel of Figure 7.
Figure 9 is a cross-sectional view schematically showing a cross-section of line II-II' shown in Figure 8.
Fig. 10 is a cross-sectional view showing a modified embodiment of Fig. 9.

The advantages and features of the present invention, and the methods for achieving them, will become clear with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and the embodiments are provided only to make the disclosure of the present invention complete and to fully inform a person having ordinary skill in the art to which the present invention belongs of the scope of the invention, and the present invention is defined only by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and the present invention is not limited to the matters illustrated. The same reference numerals refer to the same components throughout the specification. In addition, in explaining the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

In the present specification, when the words "includes," "has," and "consists of," are used, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes the plural unless there is a special explicit description.

When interpreting a component, it is interpreted as including the error range even if there is no separate explicit description.

When describing a positional relationship, for example, when the positional relationship between two parts is described as 'on ~', 'upper ~', 'lower ~', 'next to ~', etc., one or more other parts may be located between the two parts, unless 'right' or 'directly' is used.

When describing a temporal relationship, for example, when describing a temporal relationship using phrases such as 'after', 'following', 'next to', or 'before', it can also include cases where there is no continuity, as long as 'right away' or 'directly' is not used.

Although the terms first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, a first component referred to below may also be a second component within the technical concept of the present invention.

“X-axis direction”, “Y-axis direction” and “Z-axis direction” should not be interpreted as merely geometric relationships in which the relationship between them is perpendicular to each other, but may mean a wider directionality within the range in which the configuration of the present invention can function functionally.

The term "at least one" should be understood to include all combinations that can be represented from one or more of the associated items. For example, the meaning of "at least one of the first, second, and third items" can mean not only each of the first, second, or third items, but also all combinations of items that can be represented from two or more of the first, second, and third items.

The features of each of the various embodiments of the present invention may be partially or wholly combined or combined with one another, and may be technically linked and driven in various ways, and each embodiment may be implemented independently of one another or may be implemented together in a related relationship.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

1st Example

FIG. 2 is a perspective view showing a display device according to one embodiment of the present invention. Hereinafter, the display device according to one embodiment of the present invention is described mainly as an organic light emitting display, but is not limited thereto. That is, the display device according to one embodiment of the present invention may be implemented as any one of a liquid crystal display, a field emission display, and an electrophoresis display, in addition to an organic light emitting display.

Referring to FIG. 2, a display device (100) according to one embodiment of the present invention includes a display panel (110), a source drive integrated circuit (hereinafter referred to as “IC”) (140), a flexible film (150), a circuit board (160), and a timing control unit (170).

The display panel (110) includes a first substrate (111) and a second substrate (112). The second substrate (112) may be a sealing substrate. The first substrate (111) may be a plastic film or a glass substrate. The second substrate (112) may be a plastic film, a glass substrate, a sealing film, or a polarizing plate.

Gate lines, data lines, and pixels are formed on one surface of the first substrate (111) facing the second substrate (112). The pixels are provided in an area defined by the intersection structure of the gate lines and data lines.

Each of the pixels may include an organic light-emitting element having a thin film transistor, a first electrode, an organic light-emitting layer, and a second electrode. Each of the pixels supplies a predetermined current to the organic light-emitting element according to a data voltage of a data line when a gate signal is input from a gate line using the thin film transistor. Accordingly, the organic light-emitting element of each of the pixels can emit light with a predetermined brightness according to a predetermined current. A description of the structure of each of the pixels will be described below with reference to FIGS. 3 and 4.

The display panel (110) can be divided into a display area (DA) where pixels are formed to display an image and a non-display area (NDA) where no image is displayed. Gate lines, data lines, and pixels can be formed in the display area (DA). Gate drivers and pads can be formed in the non-display area (NDA).

The gate driver supplies gate signals to the gate lines according to the gate control signal input from the timing control unit (170). The gate driver may be formed in a non-display area (DA) outside one side or both sides of the display area (DA) of the display panel (110) in a GIP (gate driver in panel) manner. Alternatively, the gate driver may be manufactured as a driving chip, mounted on a flexible film, and attached to a non-display area (DA) outside one side or both sides of the display area (DA) of the display panel (110) in a TAB (tape automated bonding) manner.

The source drive IC (140) receives digital video data and a source control signal from the timing control unit (170). The source drive IC (140) converts digital video data into analog data voltages according to the source control signal and supplies the same to data lines. When the source drive IC (140) is manufactured as a driving chip, it can be mounted on a flexible film (150) in a COF (chip on film) or COP (chip on plastic) manner.

Pads such as data pads may be formed in the non-display area (NDA) of the display panel (110). Wires connecting the pads and the source drive IC (140) and wires connecting the pads and the wires of the circuit board (160) may be formed in the flexible film (150). The flexible film (150) is attached onto the pads using an anisotropic conducting film, thereby connecting the pads and the wires of the flexible film (150).

The circuit board (160) may be attached to the flexible films (150). The circuit board (160) may have a plurality of circuits implemented with driving chips mounted thereon. For example, a timing control unit (170) may be mounted on the circuit board (160). The circuit board (160) may be a printed circuit board or a flexible printed circuit board.

The timing control unit (170) receives digital video data and a timing signal from an external system board through a cable of the circuit board (160). The timing control unit (170) generates a gate control signal for controlling the operation timing of the gate driving unit and a source control signal for controlling the source drive ICs (140) based on the timing signal. The timing control unit (170) supplies the gate control signal to the gate driving unit and supplies the source control signal to the source drive ICs (140).

Figure 3 is a plan view schematically showing the display panel of Figure 2.

Referring to FIG. 3, the first substrate (111) is divided into a display area (DA) and a non-display area (NDA), and a pad area (PA) where pads are formed, a side protective film (120), and a dam (130) can be formed in the non-display area (NDA).

Pixels (P) for displaying an image are formed in the display area (DA). Each of the pixels may include an organic light-emitting element having a thin film transistor, a first electrode, an organic light-emitting layer, and a second electrode. Each of the pixels supplies a predetermined current to the organic light-emitting element according to a data voltage of a data line when a gate signal is input from a gate line using the thin film transistor. Accordingly, the organic light-emitting element of each of the pixels can emit light with a predetermined brightness according to a predetermined current.

Hereinafter, the structure of a pixel (P) of a display area (DA) according to embodiments of the present invention will be examined in detail with reference to FIG. 4.

Figure 4 is a cross-sectional view showing an example of pixels in the display area of Figure 3.

Referring to FIG. 4, thin film transistors (210) and capacitors (220) are formed on one surface of the first substrate (111) facing the second substrate (112).

To protect the thin film transistors (210) from moisture penetrating through the first substrate (111) which is vulnerable to moisture penetration, a buffer film may be formed on the first substrate (111).

Each of the thin film transistors (210) includes an active layer (211), a gate electrode (212), a source electrode (213), and a drain electrode (214). In FIG. 5, the gate electrodes (212) of the thin film transistors (210) are formed in a top gate manner in which they are positioned above the active layer (211), but it should be noted that the present invention is not limited thereto. That is, the thin film transistors (210) may be formed in a bottom gate manner in which the gate electrodes (212) are positioned below the active layer (211), or in a double gate manner in which the gate electrodes (212) are positioned both above and below the active layer (211).

An active layer (211) is formed on the buffer film of the first substrate (110). The active layer (211) may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light-blocking layer may be formed on the first substrate (110) to block external light incident on the active layer (211).

A gate insulating film (230) may be formed on the active layer (211). The gate insulating film (230) may be formed of an inorganic film, for example, a silicon oxide film, a silicon nitride film, or a multi-film thereof.

A gate electrode (212) may be formed on the gate insulating film (230). The gate electrode (212) may be a single layer or multiple layers made of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), but is not limited thereto.

An interlayer insulating film (240) may be formed on the gate electrode (212). The interlayer insulating film (240) may be formed of an inorganic film, for example, a silicon oxide film, a silicon nitride film, or a multi-film thereof.

A source electrode (213) and a drain electrode (214) may be formed on the interlayer insulating film (240). Each of the source electrode (213) and the drain electrode (214) may be connected to the active layer (211) through a contact hole (CH1, CH2) penetrating the gate insulating film (230) and the interlayer insulating film (240). Each of the source electrode (213) and the drain electrode (214) may be a single layer or multiple layers made of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), but is not limited thereto.

Each of the capacitors (220) includes a lower electrode (221) and an upper electrode (222). The lower electrode (221) is formed on a gate insulating film (230) and may be formed of the same material as the gate electrode (212). The upper electrode (222) is formed on an interlayer insulating film (240) and may be formed of the same material as the source electrode (223) and the drain electrode (224).

A protective film (250) may be formed on the thin film transistor (210) and capacitor (220). The protective film (250) may function as an insulating film. The protective film (250) may be formed of an inorganic film, for example, a silicon oxide film, a silicon nitride film, or a multi-film thereof.

A planarization film (260) may be formed on the protective film (250) to level the steps caused by the thin film transistor (210) and the capacitor (220). The planarization film (260) may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

An organic light-emitting element (280) and a bank (284) are formed on a flat film (260). The organic light-emitting element (280) includes a first electrode (282), an organic light-emitting layer (283), and a second electrode (281). The first electrode (282) may be a cathode electrode, and the second electrode (281) may be an anode electrode. An area where the first electrode (282), the organic light-emitting layer (283), and the second electrode (281) are laminated may be defined as a light-emitting portion (EA).

The second electrode (281) may be formed on the planarization film (260). The second electrode (281) is connected to the drain electrode (214) of the thin film transistor (210) through a contact hole (CH3) penetrating the protective film (250) and the planarization film (260). The second electrode (281) may be formed of a metal material having a high reflectivity, such as a laminated structure of aluminum and titanium (Ti/Al/Ti), a laminated structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a laminated structure of an APC alloy and ITO (ITO/APC/ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

A bank (284) may be formed to cover an edge of a second electrode (281) on a planarizing film (260) to partition the light-emitting portions (EA). The bank (284) may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

An organic light-emitting layer (283) is formed on the second electrode (281) and the bank (284). The organic light-emitting layer (283) may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when voltage is applied to the second electrode (281) and the first electrode (282), holes and electrons move to the light-emitting layer through the hole transporting layer and the electron transporting layer, respectively, and combine with each other in the light-emitting layer to emit light.

The organic light-emitting layer (283) may be formed as a white light-emitting layer that emits white light. In this case, it may be formed to cover the second electrode (281) and the bank (284). In this case, a color filter (not shown) may be formed on the second substrate (112).

Alternatively, the organic light-emitting layer (283) may be formed of a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, or a blue light-emitting layer that emits blue light. In this case, the organic light-emitting layer (283) may be formed in an area corresponding to the second electrode (281), and a color filter may not be formed on the second substrate (112).

The first electrode (282) is formed on the organic light-emitting layer (283). When the organic light-emitting display device is formed with a top emission structure, the first electrode (282) may be formed of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive metal material (Semi-transmissive Conductive Material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). A capping layer may be formed on the first electrode (282).

A sealing film (290) is formed on the organic light-emitting element (280). The sealing film (290) serves to prevent oxygen or moisture from penetrating into the organic light-emitting layer (283) and the first electrode (282). To this end, the sealing film (290) may include at least one inorganic film and at least one organic film.

For example, the sealing film (290) may include a first inorganic film (291), a first organic film (292), and a second inorganic film (293). In this case, the first inorganic film (291) is formed to cover the first electrode (282). The first organic film (292) is formed on the first inorganic film (291). It is preferable that the first organic film (292) be formed to have a sufficient thickness to prevent foreign substances (particles) from penetrating the first inorganic film (291) and entering the organic light-emitting layer (283) and the first electrode (282). The second inorganic film (293) is formed to cover the first organic film (292).

First to third color filters (not shown) and a black matrix (not shown) may be formed on the sealing film (290). A red color filter may be formed on the red light-emitting portion, a blue color filter may be formed on the blue light-emitting portion, and a green color filter may be formed on the green light-emitting portion.

The sealing film (290) of the first substrate (111) and the color filters (not shown) of the second substrate (112) are bonded using an adhesive layer (295), thereby allowing the first substrate (111) and the second substrate (112) to be bonded together. The adhesive layer (295) may be a transparent adhesive resin.

Referring again to FIG. 3, the pad area (PA) may be arranged on one edge of the first substrate (111). The pad area (PA) includes a plurality of pads, and the plurality of pads may be electrically connected to the wires of the flexible film (150) using an anisotropic conducting film.

The dam (130) is arranged in the non-display area (NDA) to block the flow of the organic film (292) forming the sealing film (290) of the pixel (P) so that the organic film (292) forming the sealing film (290) of the pixel (P) is not exposed to the outside. In addition, the dam (130) is arranged between the display area (DA) and the pad area (PA) so that the flow of the organic film (292) forming the sealing film (290) of the pixel (P) is not invaded by the pad area (PA).

The side protection film (120) is placed in the non-display area (NDA), particularly at the edge of the first substrate (111), to protect the first substrate (111) from external impact.

Below, the side protection film (120) and dam (130) will be examined in detail with reference to FIGS. 5 and 6.

FIG. 5 is a cross-sectional view schematically showing a cross-section of line Ⅱ-Ⅱ' shown in FIG. 3, and FIG. 6 is a cross-sectional view showing a modified embodiment of FIG. 5.

For convenience of explanation, FIGS. 5 and 6 illustrate a TFT substrate (200) including thin film transistors (210) and capacitors (220) without showing the specific configurations thereof. As can be seen from FIG. 4, the TFT substrate (200) represents a substrate in which thin film transistors (210) and capacitors (220) are formed on a first substrate (111).

The display device (100) includes a second substrate (112) bonded to a first substrate (111) by a sealing film (290), a side protection film (120), a dam (130), and an adhesive layer (295) formed on a TFT substrate (200).

At this time, the first substrate (111) includes a display area (DA) in which pixels (P) are formed and a pad area (PA) in which a plurality of pads are formed. In addition, the second substrate (112) is placed on the first substrate (111) and covers the display area (DA) of the first substrate (111) while having a smaller area than the first substrate (111). Accordingly, the display device (100) has a structure in which the first substrate (111) protrudes more than the second substrate (112).

The sealing film (290) is formed to cover the organic light-emitting element (280) formed in the display area (DA) to prevent oxygen or moisture from penetrating into the organic light-emitting element (280). At this time, the sealing film (290) includes at least one inorganic film and at least one organic film. For example, the sealing film (290) may include a first inorganic film (291), an organic film (292), and a second inorganic film (293). In this case, the first inorganic film (291) is formed to cover the first electrode (282). The organic film (292) is formed on the first inorganic film (291), and the second inorganic film (293) is formed to cover the organic film (292).

Each of the first and second inorganic films (291, 293) may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first and second inorganic films (291, 293) may be deposited by, but are not limited to, a CVD (Chemical Vapor Deposition) technique or an ALD (Atomic Layer Deposition) technique.

The organic film (292) may be formed transparently to transmit light emitted from the organic light-emitting layer (283). The organic film (292) may be formed of an organic material capable of transmitting 99% or more of light emitted from the organic light-emitting layer (283), such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. The organic film (292) may be formed by a vapor deposition, printing, or slit coating technique using an organic material, but is not limited thereto, and the organic film (292) may also be formed by an ink-jet process.

The dam (130) is formed to surround the periphery of the display area (DA) and blocks the flow of the organic film (292) forming the sealing film (290). In addition, the dam (130) is arranged between the display area (DA) and the pad area (PA) and blocks the flow of the organic film (292) forming the sealing film (290) so as to prevent the organic film (292) from encroaching on the pad area (PA). Through this, the dam (130) can prevent the organic film (292) from being exposed to the outside of the display device or encroaching on the pad area (PA).

Although FIGS. 5 and 6 illustrate one dam (130), the present invention is not limited thereto. In another embodiment, the dam (130) may include a first dam and a second dam positioned in a non-display area (NDA) spaced apart from the first dam. The second dam blocks the flow of the organic film (292) overflowing beyond the periphery of the first dam.

This dam (130) can be formed simultaneously with the flattening film (260) or bank (284) of the pixel (P), and can be made of the same material as the flattening film (260) or bank (284). In this case, the dam (130) can be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

The side protection film (120) is arranged at the edge of the TFT substrate (200) to absorb impact applied to the TFT substrate (200) from the outside. More specifically, the side protection film (120) may be formed at the edge of the side except for the edge of the side where the pad area (PA) is formed. Since a plurality of pads are formed in the pad area (PA) and the distance from the edge to the organic light-emitting element (280) is relatively far, there is a low risk of the organic light-emitting element (280) being damaged by an external impact. In addition, if the side protection film (120) is formed at a position adjacent to the pad area (PA), there is a possibility that the side protection film (120) covers the pad area (PA), and thus, another problem may occur in which electrical contact is not made and thus a driving failure occurs. Accordingly, it is preferable that the side protection film (120) is not formed at the edge of the side where the pad area (PA) is formed.

This side protection film (120) is formed on the upper surface of the edge of the TFT substrate (200), as illustrated in FIG. 5. Accordingly, the edge of the TFT substrate (200), which is exposed when the second substrate (112) is formed with a smaller area than the TFT substrate (200), is covered by the side protection film (120). The side protection film (120) can prevent the TFT substrate (200) from being damaged by absorbing impact applied to the edge of the TFT substrate (200). Meanwhile, since the side protection film (120) is intended to protect the edge of the TFT substrate (200) which is exposed when the second substrate (112) is formed with a smaller area than the TFT substrate (200) as described above, it is formed only on the edge of the TFT substrate (200) which is exposed and does not overlap with the second substrate (112).

In addition, the side protection film (120) extends along the side of the adhesive layer (295) from the upper surface of the TFT substrate (200). Accordingly, the side protection film (120) can absorb impact applied to the side of the display device (100) and reduce penetration of external oxygen or moisture into the side of the display device (100).

In one embodiment, the side protection film (120) may extend only from the upper surface of the TFT substrate (200) to the side surface of the adhesive layer (295), as illustrated in FIG. 5. The display device (100) may be transported to another location while the protection film is attached to the second substrate (112) for a subsequent process in the manufacturing process. At this time, if the side protection film (120) is formed to the side surface of the second substrate (112), the side protection film (120) may be formed on the protection film attached to the second substrate (112). The side protection film (120) formed on the protection film may make it difficult to remove the protection film during the subsequent process, which may cause unnecessary pressure to be applied to the display device (100), and the side protection film (120) or the protection film may be torn off. To prevent this, the side protection film (120) may not be formed on the side surface of the second substrate (112).

In another embodiment, the side passivation film (120) may extend along the side of the adhesive layer (295) from the upper surface of the TFT substrate (200) as illustrated in FIG. 6 to contact the side of the second substrate (112). The display device (100) may form the side passivation film (120) up to the side of the second substrate (112) when the protective film is attached after the side passivation film (120) is formed or when attachment of the protective film is unnecessary due to a continuous process or other reasons. The side passivation film (120) may absorb impact applied to the side of the second substrate (112) by being formed up to the side of the second substrate (112). In particular, such a side passivation film (120) is highly effective in protecting the second substrate (112) from external impact when the second substrate (112) uses a material that is weak to impact, such as glass. Additionally, the side protective film (120) can also reduce the penetration of external oxygen or moisture through the interface between the second substrate (112) and the adhesive layer (295).

The side protection film (120) is not limited in material as long as it is an insulating material capable of absorbing external impact. The side protection film (120) may be made of an insulating polymer material. At this time, the insulating polymer material may be selected from the group consisting of a thermosetting resin, a photocurable resin, and a combination thereof, but is not limited thereto. For example, polymer materials include thermoplastic resins such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), polymethyl methacrylate (PMMA), polyamide/nylon (PA), polyacetal (POM), polycarbonate (PC), polyethylene terephthalate (PET), cyclic polyolefin (COP), polyphenylene sulfide (PPS), polytetrafluoroethylene (PTFE), polysulfone (PSF), polyamideimide (PAI), thermoplastic polyimide (PI), polyetheretherketone (PEEK), liquid crystal polymer (LCP), epoxy resin (EP), phenol resin (PF), melamine resin (MF), polyurethane (PUR), unsaturated polyester resin (UP), fibers such as nylon, polyester, acrylic, vinylon, polyolefin, polyurethane, and rayon, and elastomers such as isoprene rubber (IR). Examples of thermosetting resin elastomers include butadiene rubber (BR), styrene-butadiene rubber (SBR), chloroprene rubber (CR), nitrile rubber (NBR), polyisobutylene rubber/butyl rubber (IIR), ethylene propylene rubber (EPM/EPDM), chlorosulfonated polyethylene (CSM), acrylic rubber (ACM), epichlorohydrin rubber (CO/ECO), and some urethane rubber (U), silicone rubber (Q), fluororubber (FKM), and thermoplastic elastomers include styrene-based, olefin-based, vinyl chloride-based, urethane-based, and amide-based elastomers.

Meanwhile, the side protection film (120) may be formed of an insulating polymer material and graphene flakes to improve the side moisture penetration prevention effect of the display device (100). More specifically, the side protection film (120) may be formed by mixing graphene flakes separated from graphite through chemical exfoliation into an insulating polymer material.

The moisture-proofing effect of the side protective film (120) can be improved as the amount of graphene flakes contained in the insulating polymer material increases. The graphene flakes can delay the penetration of moisture or oxygen into the organic light-emitting element by increasing the path for moisture or oxygen to penetrate into the insulating polymer material. That is, as the amount of graphene flakes increases, the penetration path increases, and the moisture-proofing effect can be improved.

The moisture-proofing characteristic level required by the display device should be a WVTR (Water Vapor Transmission Rate) value of 10 ^-6 g/m ² ·day or less. To achieve this, the side passivation film (120) can be formed at a weight content ratio of graphene flakes of 0.15 wt% or more with respect to the insulating polymer material. When the weight content ratio of the graphene flakes is increased in this way, the moisture-proofing effect of the side passivation film (120) can be improved, but since the graphene flakes are not transparent, the light transmittance decreases. However, since the side passivation film (120) is formed only in the non-display area (NDA), even if the light transmittance is less than 95%, it does not affect the performance of the display device at all.

2nd Example

FIG. 7 is a perspective view showing a display device according to another embodiment of the present invention. Hereinafter, the display device according to another embodiment of the present invention is described mainly as an organic light emitting display, but is not limited thereto. That is, the display device according to one embodiment of the present invention may be implemented as any one of a liquid crystal display, a field emission display, and an electrophoresis display, in addition to an organic light emitting display.

The display device (300) illustrated in Fig. 7 differs from the display device (100) illustrated in Fig. 2 in that a touch panel (332) and a cover window (334) are formed on the display panel (310). Hereinafter, these differences will be mainly described, and identical content will be omitted.

Referring to FIG. 7, a display device (300) according to another embodiment of the present invention includes a display panel (310), a touch panel (332), a cover glass (334), a source drive integrated circuit (hereinafter referred to as “IC”) (340), a flexible film (350), a circuit board (360), and a timing control unit (370).

The display panel (310) can be divided into a display area (DA) where pixels are formed to display an image and a non-display area (NDA) where no image is displayed. Gate lines, data lines, and pixels can be formed in the display area (DA). Gate drivers and pads can be formed in the non-display area (NDA).

The touch panel (332) is arranged on the display panel (310) and includes electrodes configured to generate touched location information as a detection signal according to a user's touch. A detection unit (not shown) is connected to the electrodes included in the touch panel (332) and detects the touched location when the user touches the touch panel (332). The detection unit (not shown) is configured of a capacitive type that detects a touched location by recognizing a change in electrostatic capacity according to the structure of the electrodes included in the touch panel (332) and a resistive type that detects a touched location by recognizing a change in resistance.

The cover window (334) is placed on the touch panel (332) and may be formed of a material such as plastic, glass, or film, but is not limited thereto.

FIG. 8 is a plan view schematically showing a display device according to another embodiment of the present invention.

Referring to FIG. 8, the first substrate (311) is divided into a display area (DA) and a non-display area (NDA), and a pad area (PA) where pads are formed, a side protective film (320), and a dam (330) can be formed in the non-display area (NDA).

Pixels (P) for displaying an image are formed in the display area (DA). Each of the pixels may include an organic light-emitting element having a thin film transistor, a first electrode, an organic light-emitting layer, and a second electrode. Each of the pixels supplies a predetermined current to the organic light-emitting element according to a data voltage of a data line when a gate signal is input from a gate line using the thin film transistor. Accordingly, the organic light-emitting element of each of the pixels can emit light with a predetermined brightness according to a predetermined current.

The pad area (PA) may be arranged at one edge of the first substrate (311). The pad area (PA) includes a plurality of pads, and the plurality of pads may be electrically connected to wires of the flexible film (350) using an anisotropic conducting film.

The dam (330) is arranged in the non-display area (NDA) to block the flow of the organic film (292) forming the encapsulation film (290) of the pixel (P) so that the organic film (292) forming the encapsulation film (290) of the pixel (P) is not exposed to the outside. In addition, the dam (330) is arranged between the display area (DA) and the pad area (PA) so that the organic film (292) forming the encapsulation film (290) of the pixel (P) is not exposed to the pad area (PA) so that the flow of the organic film (292) is blocked.

The side protection film (320) is placed in the non-display area (NDA), particularly at the edge of the first substrate (311), to protect the first substrate (311) from external impact.

Below, the side protection film (320) and dam (330) will be examined in detail with reference to FIGS. 9 and 10.

Fig. 9 is a cross-sectional view schematically showing a cross-section of line II-II' shown in Fig. 8, and Fig. 10 is a cross-sectional view showing a modified embodiment of Fig. 9.

For convenience of explanation, FIGS. 9 and 10 illustrate a TFT substrate (200) including thin film transistors (210) and capacitors (220) without showing the specific configurations thereof. As can be seen in FIG. 4, the TFT substrate (200) represents a substrate on which thin film transistors (210) and capacitors (220) are formed on a first substrate (111, 311).

The display panel (310) includes a sealing film (290), a side protective film (320), a dam (330), and a polarizing plate (312) formed on a TFT substrate (200).

At this time, the first substrate (311) includes a display area (DA) in which pixels (P) are formed and a pad area (PA) in which a plurality of pads are formed. In addition, a polarizing plate (312) is disposed on the TFT substrate (200) to block external light incident from the outside in the transmission direction of light emitted through the organic light-emitting element (280). This polarizing plate (312) is bonded to the TFT substrate (200) by the first adhesive layer (295). Meanwhile, the polarizing plate (312) covers the display area (DA) of the first substrate (311) and has a smaller area than the first substrate (311). Accordingly, the display panel (310) has a structure in which the TFT substrate (200) protrudes more than the polarizing plate (312).

The dam (330) is formed to surround the periphery of the display area (DA) and blocks the flow of the organic film (292) forming the sealing film (290). In addition, the dam (330) is arranged between the display area (DA) and the pad area (PA) and blocks the flow of the organic film (292) forming the sealing film (290) so as to prevent the organic film (292) from encroaching on the pad area (PA). Through this, the dam (330) can prevent the organic film (292) from being exposed to the outside of the display device or encroaching on the pad area (PA).

Although FIGS. 9 and 10 illustrate one dam (330), the present invention is not limited thereto. In another embodiment, the dam (330) may include a first dam and a second dam located in a non-display area (NDA) spaced apart from the first dam. The second dam blocks the flow of the organic film (292) overflowing beyond the periphery of the first dam.

The side protection film (320) is arranged at the edge of the TFT substrate (200) to absorb impact applied to the TFT substrate (200) from the outside. More specifically, the side protection film (320) may be formed at the edge of the side except for the edge of the side where the pad area (PA) is formed. Since a plurality of pads are formed in the pad area (PA) and the distance from the edge to the organic light-emitting element (280) is relatively far, there is a low risk of the organic light-emitting element (280) being damaged by an external impact. In addition, if the side protection film (320) is formed at a position adjacent to the pad area (PA), there is a possibility that the side protection film (320) covers the pad area (PA), and thus, another problem may occur in which electrical contact is not made and thus a driving failure occurs. Accordingly, it is preferable that the side protection film (320) is not formed at the edge of the side where the pad area (PA) is formed.

This side protection film (320) is formed on the upper surface of the edge of the TFT substrate (200). Accordingly, since the polarizing plate (312) is formed with a smaller area than the first substrate (111), the edge of the TFT substrate (200) that is exposed is covered by the side protection film (320). The side protection film (320) can prevent the TFT substrate (200) from being damaged by absorbing impact applied to the edge of the TFT substrate (200). Meanwhile, since the side protection film (320) is for protecting the edge of the TFT substrate (200) as described above, it is formed only on the exposed edge of the TFT substrate (200) and does not overlap with the polarizing plate (312).

In addition, the side protection film (320) extends along the side of the first adhesive layer (295) from the upper surface of the TFT substrate (200). Accordingly, the side protection film (320) can absorb impact applied to the side of the display device (100) and reduce penetration of external oxygen or moisture into the side of the display device (300).

In one embodiment, the side protection film (320) may extend only from the upper surface of the TFT substrate (200) to the side surface of the first adhesive layer (295). The display device (300) may be transported to another location with the protection film attached to the polarizing plate (312) for a subsequent process in the manufacturing process. At this time, if the side protection film (320) is formed to the side surface of the polarizing plate (312), the side protection film (320) may be formed even on the protection film attached to the polarizing plate (312). The side protection film (320) formed on the protection film may make it difficult to remove the protection film during the subsequent process, which may cause unnecessary pressure to be applied to the display device (300), and the side protection film (120) or the protection film may be torn off. To prevent this, the side protection film (120) may not be formed on the side surface of the second substrate (112).

The side protection film (320) is not limited in material as long as it is an insulating material capable of absorbing external impact. The side protection film (320) may be made of an insulating polymer material. At this time, the insulating polymer material may be selected from the group consisting of a thermosetting resin, a photocurable resin, and a combination thereof, but is not limited thereto. For example, polymer materials include thermoplastic resins such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), polymethyl methacrylate (PMMA), polyamide/nylon (PA), polyacetal (POM), polycarbonate (PC), polyethylene terephthalate (PET), cyclic polyolefin (COP), polyphenylene sulfide (PPS), polytetrafluoroethylene (PTFE), polysulfone (PSF), polyamideimide (PAI), thermoplastic polyimide (PI), polyetheretherketone (PEEK), liquid crystal polymer (LCP), epoxy resin (EP), phenol resin (PF), melamine resin (MF), polyurethane (PUR), unsaturated polyester resin (UP), fibers such as nylon, polyester, acrylic, vinylon, polyolefin, polyurethane, and rayon, and elastomers such as isoprene rubber (IR). Examples of thermosetting resin elastomers include butadiene rubber (BR), styrene-butadiene rubber (SBR), chloroprene rubber (CR), nitrile rubber (NBR), polyisobutylene rubber/butyl rubber (IIR), ethylene propylene rubber (EPM/EPDM), chlorosulfonated polyethylene (CSM), acrylic rubber (ACM), epichlorohydrin rubber (CO/ECO), and some urethane rubber (U), silicone rubber (Q), fluororubber (FKM), and thermoplastic elastomers include styrene-based, olefin-based, vinyl chloride-based, urethane-based, and amide-based elastomers.

Meanwhile, the side protection film (320) may be formed of an insulating polymer material and graphene flakes to improve the side moisture penetration prevention effect of the display device (300). More specifically, the side protection film (320) may be formed by mixing graphene flakes separated from graphite through chemical exfoliation into an insulating polymer material.

The moisture-proofing effect of the side protective film (320) can be improved as the amount of graphene flakes contained in the insulating polymer material increases. The graphene flakes can delay the penetration of moisture or oxygen into the organic light-emitting element by increasing the path for moisture or oxygen to penetrate into the insulating polymer material. That is, as the amount of graphene flakes increases, the penetration path increases, and the moisture-proofing effect can be improved.

Meanwhile, the display panel (310) on which the polarizing plate (312) and the side protective film (320) are formed is bonded to the touch panel (332) by the second adhesive layer (331). The second adhesive layer (331) is placed between at least one of the polarizing plate (312) and the side protective film (320) and the touch panel (332).

In one embodiment, the second adhesive layer (331) may be disposed between the polarizing plate (312) and the touch panel (332), and between the side protection film (320) and the touch panel (332). More specifically, the second adhesive layer (331) may be disposed on one side and one side of the polarizing plate (312) that do not face the pixels (P), that is, on the entire one side of the display panel (310) that faces the touch panel (332). Accordingly, the second adhesive layer (331) may be in contact with the upper surface of the side protection film (320). As described above, the side protection film (320) may not cover the side of the polarizing plate (312). In this case, a space may be created between the side of the polarizing plate (312), that is, the side protective film (320) and the touch panel (332), and external moisture or oxygen may penetrate into the space, or cracks may occur in the touch panel (332) or the polarizing plate (312) due to external impact. To prevent this, a second adhesive layer (331) may be formed between the side protective film (320) and the touch panel (332) to fill the space. In addition, the second adhesive layer (331) may fix the touch panel (332) on the display panel (310) by bonding the side protective film (320) and the touch panel (332).

In another embodiment, the second adhesive layer (331) may be arranged in a border shape between the side protection film (320) and the touch panel (332). More specifically, the second adhesive layer (331) may be arranged only on the edge of the side of the polarizing plate (312), that is, on one side of the display panel (310) facing the touch panel (332). In this way, by applying the second adhesive layer (331) only to the edge of the display panel (310), the bonding area between the display panel (310) and the touch panel (332) may be reduced. Accordingly, the present invention according to another embodiment may be advantageous in a rework process of detaching and attaching the touch panel (332) from the display panel (310).

Although the embodiments of the present invention have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical idea of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain it, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are exemplary in all aspects and not restrictive. The protection scope of the present invention should be interpreted by the claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

100, 300: Display device 110, 310: Display panel
111, 3111: 1st substrate 112: 2nd substrate
312: Polarizing plate 332: Touch panel
120, 320: Side shield 130, 330: Dam
140: Source Drive IC 150: Flexible Film
160: Circuit board 170: Timing control unit
210: Thin film transistor 211: Active layer
212: Gate electrode 213: Source electrode
214: Drain electrode 220: Capacitor
221: Lower electrode 222: Upper electrode
230: Gate insulating film 240: Interlayer insulating film
250: Shield 260: Flattening Shield
280: Organic light-emitting device 281: First electrode
282: Organic light-emitting layer 283: Second electrode
284: Bank 290: Closing
291: 1st weapon membrane 292: Organic membrane
293: Second layer of armor 295: First layer of adhesive
331: Second adhesive layer

Claims (12)

A first substrate including a display area in which pixels are arranged and a non-display area surrounding the display area;
A second substrate disposed on the first substrate and formed to have a smaller area than the first substrate while covering the display area of the first substrate;
a first adhesive layer disposed between the first substrate and the second substrate; and
A side protective film is formed by being placed on the edge of the first substrate and contacting the side surface of the first adhesive layer,
The above side protective film does not overlap with the second substrate,
The above side protective film is made of an insulating polymer material and graphene flakes,
A display device in which an end of the side protective film is aligned with an end of the first substrate. A first substrate including a display area in which pixels are arranged and a non-display area surrounding the display area;
A polarizing plate disposed on the first substrate and formed to have a smaller area than the first substrate while covering a display area of the first substrate;
A first adhesive layer disposed between the first substrate and the polarizing plate; and
A side protective film is formed by being placed on the edge of the first substrate and contacting the side surface of the first adhesive layer,
The above side protective film does not overlap with the above polarizing plate,
The above side protective film is made of an insulating polymer material and graphene flakes,
A display device in which an end of the side protective film is aligned with an end of the first substrate. delete delete In paragraph 1 or 2,
A display device, characterized in that the side protective film extends along the side of the first adhesive layer from the upper surface of the first substrate. In the first paragraph,
A display device in which the side protective film extends along the side of the first adhesive layer from the upper surface of the first substrate and contacts the side of the second substrate. In the second paragraph,
A display device in which the side protective film extends along the side of the first adhesive layer from the upper surface of the first substrate and contacts the side of the polarizing plate. In paragraph 1 or 2,
The above non-displayed area includes a pad area in which a plurality of pads are formed spaced apart from any one of the four edges,
A display device characterized in that the side protective film is formed on an edge of a side other than an edge of a side where the `pad area is formed. In the second paragraph,
A touch panel disposed on the above polarizing plate; and
A display device further comprising a second adhesive layer disposed between the polarizing plate and the touch panel. In Article 9,
The above touch panel has a larger area than the above polarizing plate,
A display device, characterized in that the second adhesive layer is disposed between the side protective film and the touch panel. In the second paragraph,
A touch panel disposed on the polarizing plate and having a larger area than the polarizing plate; and
A display device characterized by further comprising a second adhesive layer arranged in a frame shape between the side protective film and the touch panel. delete

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