KR102624971B1 - Carrier frame for electronic device handler - Google Patents

Abstract

The present invention relates to an opening device for an electronic component handler.
The opening device for an electronic component handler according to the present invention has a first opening bar and a second opening bar that can narrow or widen the gap between them, and has an opener that can open the loading module of the carrier frame or an electronic component with a low height. It has a support plate and an adjustment circle that support the bottom of the and assist in the unloading of the picking device.
According to the present invention, the versatility of the opening device is expanded, which has the effect of recycling resources, preventing resource waste, reducing replacement costs, and improving operation rate.

Description

Carrier frame for electronic component handler {CARRIER FRAME FOR ELECTRONIC DEVICE HANDLER}

It relates to a handler that handles electronic components, and especially to an opening device for opening a carrier frame that can load electronic components.

Module IC (also known as 'modulam') is an independent circuit formed by fixing a plurality of ICs and other elements on one or both sides of a board. It is an important electronic component required for the operation of computer devices, and its price is as follows. This is expensive.

Therefore, after completing a product, strict performance tests must be performed before shipping.

In order to test such a module IC, a handler that can electrically connect the module IC to the tester is required in addition to a tester.

The handler loads the module IC into the carrier frame using a pickup device in the loading section, and then transfers the carrier frame loaded with the module IC to the test chamber using the transfer device to test the module IC loaded on the carrier frame. The carrier frame on which the test of the loaded module ICs has been completed is transferred to the sorting unit by another transfer device, and then a series of tasks are performed to unload the module ICs while sorting them according to the test results.

In order to unload the module IC from the carrier frame in the above series of processes, the carrier frame must be opened using a separate opening device. Therefore, the handler must be equipped with an opening device to open the carrier frame.

Republic of Korea Patent Publication Nos. 10-2011-0136312 and 10-2014-0072847 present technologies related to the above-mentioned opening device (hereinafter referred to as 'prior art').

In the prior art, when the control plate is raised, the guide rod of the control plate is inserted into the guide groove of the pressure member in the carrier frame (named 'carrier board' in the prior art) and opens the carrier frame by pushing the pressure member to one side. has

However, the above prior art can be appropriately applied when the specifications of the electronic components to be tested are all the same, but there is a problem in that the manufacturing cost ultimately increases due to poor versatility as follows.

First, when an electronic component with a different width from the previously tested electronic component must be tested, the position of the guide rod must be changed, so the control plate equipped with the guide rod must be replaced. Because of this, resources are not recyclable, ultimately the production cost increases, and manpower is wasted due to replacement time and the operation rate decreases.

Second, in cases where electronic components that have a different height from those that were previously tested must be tested, there is virtually no other solution. In particular, if the height of the electronic component to be mounted on the carrier frame is lower than the height of the socket, there is a difficulty in having to replace the carrier frame or at least the socket.

The purpose of the present invention is to:

First, it provides technology for opening devices that can be applied to a wide range of electronic components.

Second, it provides technology for an opening device that can be applied to electronic components of various heights.

A carrier frame for an electronic component handler according to a first aspect of the present invention includes a loading module for loading electronic components, wherein the loading module includes a first loading member holding one side of the electronic component; a second loading member holding the other side of the electronic component; and a spring provided to correspond to the first loading member and the second loading member, respectively, to elastically support the first loading member and the second loading member in a direction in which the gap between them is narrowed.

The first loading member and the second loading member may further include guide grooves formed in the vertical direction on surfaces facing each other.

The lower ends of the first and second loading members may be configured to support the lower edge of the outer edge of the electronic component.

A carrier frame for an electronic component handler according to a second aspect of the present invention is paired with an opening device and is provided to be opened by the opening device to unload the electronic component, and the opening device opens the carrier frame. It has a lifting frame that can rise toward or lower in the opposite direction, and an opener installed on the lifting frame to open the carrier frame, and the loading module is connected to the first loading member and the second loading member by the opener when the lifting frame rises. 2 The gap between the loading members is widened and opened, ultimately allowing the carrier frame to be opened.
The opener has a first opening bar and a second opening bar that are opposed to each other and the gap between them is widened or narrowed, and the lifting frame rises toward the carrier frame and the first opening bar and the second opening bar When the gap between the first loading member and the second loading member is widened by the opening bar, the loading module is opened, thereby ultimately opening the carrier frame.
The opening device adjusts the height of the support plate so that when the lifting frame rises toward the carrier frame, the support plate supports the electronic components and the lower ends of electronic components of various standards with different heights. Additional coordinators may be provided.
The support plate and the adjusting member can be lifted and lowered together with the lifting frame.
The support plate has a grip groove for gripping the lower end of the electronic component, and the adjusting member raises the support plate so that the support plate can grip the lower end of the electronic component. The picking device adjusts the height of the support plate. It can help in gripping or releasing the electronic components.

According to the present invention, it is possible to handle electronic components of various widths and heights without replacing the components, thereby increasing versatility, which has the effect of recycling resources, preventing resource waste, reducing replacement costs, and improving operation rate.

Figure 1 is a perspective view of a carrier frame paired with an opening device according to the present invention.
Figure 2 is a perspective view of a loading module applied to the carrier frame of Figure 1.
Figure 3 is a perspective view of an opening device for an electronic component handler according to the present invention.
Figure 4 is an excerpted perspective view of an opener applied to the opening device of Figure 3.
Figure 5 is an excerpted perspective view of the support plate and adjustment source applied to the opening device of Figure 3.
Figures 6 and 7 are reference diagrams for explaining the operation of loading electronic components into a loading module.
Figure 8 is a reference diagram for explaining the state just before opening the loading module when handling tall electronic components.
Figure 9 is a reference diagram for explaining the state just before opening the loading module when handling low-height electronic components.
FIG. 10 is a reference diagram further from FIG. 9 to explain a state in which the loading module is opened.
Figure 11 is a reference diagram for explaining the operation of the support plate and the adjustment circle.

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but for brevity of explanation, descriptions of overlapping or substantially identical configurations will be omitted or compressed as much as possible.

<Description of carrier frame>

Before explaining the opening device for an electronic component handler (hereinafter abbreviated as 'opening device') according to the present invention, the carrier frame on which the electronic components are loaded will be described.

Figure 1 is a perspective view of a carrier frame (CF) paired with an opening device according to the present invention.

The carrier frame CF may be opened by an opening device to allow unloading of electronic components ED, or may be closed to maintain loaded electronic components.

As shown in detail in FIG. 2, the carrier frame (CF) is provided with a plurality of loading modules (LM) for loading electronic components (ED). The opening and closing of the loading module (LM) ultimately means the opening and closing of the carrier frame (CF).

Each loading module (LM) has a first loading member (L1) and a second loading member (L2), and the first loading member (L1) holds one side (the left side in the drawing) of the electronic component (ED). The second loading member L2 holds the other side (right side in the drawing) of the electronic component ED. That is, when the gap between the first loading member (L1) and the second loading member (L2) is widened by the opening device, the loading module (LM) is opened, and the first loading member (L1) and the second loading member (L2) are opened. When the gap between them narrows, the loading module (LM) closes and both sides of the electronic component (ED) are gripped. Here, to enable opening by the opening device, the first loading member (L1) and the second loading member (L2) are formed with a locking protrusion (J) that can be caught by opening bars to be described later, and the loading module (LM) is closed. For this purpose, the first loading member (L1) and the second loading member (L2) are elastically supported by the spring (S) in a direction that narrows the gap between them.

<Description of opening device>

Figure 3 is a perspective view of an opening device 100 (hereinafter abbreviated as 'opening device') for an electronic component handler according to the present invention.

The opening device 100 includes a lifting frame 110, a hoisting source 120, an opening 130, a support plate 140, and an adjusting member 150.

The lifting frame 110 is provided to ascend toward or descend toward the carrier frame CF.

The lifting source 120 may be provided as a cylinder and elevates the lifting frame 110.

The opener 130 is installed on the lifting frame 110 and opens the carrier frame (CF) so that the electronic component (ED) can be unloaded from the carrier frame (CF). To this end, as shown in the excerpt of FIG. 4, the opener 130 includes a first open bar 131, a second open bar 132, a gap adjustment belt 133, and a power source 134.

The first open bar 131 and the second open bar 132 are provided opposite to each other and are coupled to the gap adjustment belt 133 so that they can move in opposite directions, so that when the power source 134 operates, the guide rail ( As they move under the guidance of GL, the gap between them widens or narrows. Here, the first open bar 131 is provided with a first step (131a) for hanging the locking jaws (J) of the first loading members (L1) at once, and the second open bar 132 is a second loading member ( It is provided with a second step (132a) for hanging the locking steps (J) of the L2) at the same time.

The gap adjustment belt 133 transmits the driving force of the power source 134 to the first open bar 131 and the second open bar 132 by rotating forward and backward with the driving pulley (DP) and driven pulley (PP) as the rotation point. do.

The power source 134 provides power to widen the gap between the first open bar 131 and the second open bar 132, and allows the width to correspond to the width of various electronic components (ED) of various standards. It is equipped with a motor that can adjust the degree of the gap between the first opening bar 131 and the second opening bar 132. Therefore, the distance between the first opening bar 131 and the second opening bar 132 can vary depending on the rotation amount of the motor, which is the power source 134.

Next, the support plate 140 and the adjustment member 150 will be described with reference to the excerpt of FIG. 5.

The support plate 140 supports the electronic component (ED) mounted on the carrier frame (CF). This support plate 140 is formed with gripping grooves 141 for gripping lower ends of the electronic components ED equal to the number of electronic components ED to be supported.

The adjuster 150 adjusts the lifting height of the support plate 140 so that the support plate 140 can support the lower ends of electronic components (ED) of various standards with different heights. This adjustment source 150 may be provided as a cylinder, but is preferably provided as a motor to adjust the lifting height of the support plate 140 to help grip or release the electronic component (ED) by a picking device to be described later. .

Next, the operation of the opening device 100 as described above will be described.

For reference, when loading electronic components (ED) onto the carrier frame (CF), the picking device loads the electronic components (ED) into the loading module (LM). At this time, as the electronic components are loaded from the state of FIG. 6 to the state of FIG. 7, the first loading member L1 and the second loading member forming the loading module LM are moved by the downward force of the picking device PA. (L2) is opened in the direction of the arrow in FIG. 7 by the electronic component (ED), which is forcibly loaded while overcoming the elastic force of the spring (S), and is opened by the compressed spring (S) when the loading of the electronic component (ED) is completed. The loading module LM is closed as an elastic force is applied in a direction that narrows the gap between the first loading member L1 and the second loading member L2. Therefore, the operation (loading operation) of the picking device (PA) loading the electronic component (ED) onto the carrier frame (CF) can be performed independently of the opening device (100).

1. First operation example regarding unloading - when the height of electronic components is high

As shown in FIGS. 6 and 7, when the height of the electronic component (ED) is high, the picking device (PA) can grasp the electronic component (ED) even when the electronic component (ED) is loaded on the loading module (LM). Therefore, operation of the support plate 140 and the adjustment member 150 is not required.

In this operation example, when the lifting plate 110 rises toward the carrier frame CF, the step 131a of the first opening bar 131 and the step 132a of the second opening bar 132 are shown in FIG. 8. ) is located at a height that can be caught on the locking protrusion (J) of the first loading member (L1) and the second loading member (L2), respectively. And in the state of FIG. 8, the opener 130 operates to widen the gap between the first open bar 131 and the second open bar 132 in the direction of the arrow, thereby opening the loading modules LM, and in this state, picking The device (PA) unloads the electronic components (ED).

2. Second operation example regarding unloading - when the height of electronic components is low

When the height of the electronic component (ED) is low, there is not enough area for the picking device (PA) to grip. Therefore, operation of the support plate 140 and the adjustment member 150 is required.

In this operating example, when the lifting plate 110 rises toward the carrier frame CF, the step 131a of the first opening bar 131 and the step 132a of the second opening bar 132 are opened as shown in FIG. 9. ) is located at a height that can be caught on the locking protrusion (J) of the first loading member (L1) and the second loading member (L2), respectively. Then, the opener 130 operates to widen the gap between the first opening bar 131 and the second opening bar 132, thereby opening the loading modules LM as shown in FIG. 10, and in this state, as shown in FIG. 11. Likewise, the adjusting member 150 operates to raise the support plate 140. Accordingly, the picking device (PA) is in a state where it can grip both upper ends of the electronic component (ED), and in this state, an unloading operation is performed by the picking device (PA).

For reference, in this example, only the case when the picking device (PA) unloads the electronic component (ED) from the carrier frame (CF) is considered. However, depending on implementation, it may be fully considered that the opening device 100 is applied to the loading area for the loading operation of loading the electronic component (ED) into the carrier frame (CF). For example, an opening device 100 is provided in the loading area, the gap between the first loading member L1 and the second loading member L2 is widened by the opening device 100, and then the electronic component (ED) is loaded. This can be considered desirable. At this time, the electronic component ED has a downward flow while its position is aligned using the guide red portion formed in the vertical direction in the first loading member L1 and the second loading member L2 as a guide rail. Here, the lower end of each loading member (L1, L2) is configured to support the outer lower edge of the lower edge of the electronic component (ED). Of course, when the electronic component (ED) is loaded, the grip of the electronic component (ED) is released from the picking device (PA), so that when the electronic component (ED) falls, the support plate 140 is raised in advance and held at a certain position. It may also be desirable to receive the electronic component (ED) in advance and then allow the support plate 140 to descend so that the electronic component (ED) can be stably loaded on the loading module (LM).

For reference, there may be a state as shown in FIG. 11 even during loading. In this case, when the picking device (PA) releases the grip of the electronic component (ED), the electronic component (ED) falls freely, and the loading members (L1, L2) ) is slightly widened so that the loading members (L1, L2) have a gap sufficient to guide the downward movement of the electronic component (ED). This is because if the gap between the loading members (L1, L2) is too wide, the loading members (L1, L2) cannot guide the descent of the electronic component (ED), so the electronic component (ED) may deviate to another place or fall. Also, the impact of falling may be too strong. Therefore, it is desirable to ensure stable loading of the electronic component (ED) and minimize the impact of dropping the electronic component (ED) by allowing the guide grooves formed on the opposing sides of the loading members (L1, L2) to guide the downward movement of the electronic component (ED). do. Of course, it can be clearly seen from FIGS. 9 to 11 that the degree to which the gap between the loading members L1 and L2 is widened is the same even during unloading.

In this example, the electronic components (ED) are loaded in two rows on the carrier frame (CF), but even in cases where the electronic components (ED) are loaded in one row or three or more rows on the carrier frame (CF), It is fully apparent that the present invention can be applied appropriately.

In addition, although the background technology explains the module IC as an example, the present invention can be fully applied to any handler for handling electronic components (ED) in the form of a board in addition to the module IC.

As described above, the specific description of the present invention has been made by way of examples with reference to the accompanying drawings. However, since the above-described embodiments are only explained by referring to preferred examples of the present invention, the present invention is limited to the above-described embodiments. It should not be understood as limited, and the scope of rights of the present invention should be understood as the scope of the claims described later and their equivalents.

100: Opening device for electronic component handler
110: lifting frame
120: Hoistway
130: opener
131: first open bar 132: second open bar
131a: first step 132a: second step
134: power source
140: support plate
150: Jo Jeong-won

Claims (8)

Includes a loading module for loading electronic components;
The loading module is
a first loading member holding one side of the electronic component;
a second loading member holding the other side of the electronic component; and
In the carrier frame including; a spring provided to correspond to the first loading member and the second loading member, respectively, to elastically support the first loading member and the second loading member in a direction in which the gap between them is narrowed,
The carrier frame is paired with an opening device and is provided so that it can be opened by the opening device to unload the electronic component,
The opening device includes a lifting frame that can rise or fall toward the carrier frame, and an opener installed on the lifting frame to open the carrier frame,
When the lifting frame rises, the loading module is opened by widening the gap between the first loading member and the second loading member by the opener, thereby ultimately opening the carrier frame,
The opening device adjusts the height of the support plate so that when the lifting frame rises toward the carrier frame, the support plate supports the electronic components and the lower ends of electronic components of various standards with different heights. Equipped with more coordinators
Carrier frame. In paragraph 1
The first loading member and the second loading member further include guide grooves formed in the vertical direction on surfaces facing each other.
Carrier frame. In paragraph 1
The lower ends of the first and second loading members are configured to support the lower edge of the outer edge of the electronic component.
Carrier frame. delete According to clause 1,
The opener has a first opening bar and a second opening bar that are opposed to each other and the gap between them is widened or narrowed,
When the lifting frame rises toward the carrier frame and the gap between the first loading member and the second loading member is widened by the first opening bar and the second opening bar, the loading module is opened and ultimately the carrier frame This is open
Carrier frame. delete In paragraph 1
The support plate and the adjusting member are lifted and lowered together with the lifting frame.
Carrier frame. In paragraph 1
The support plate has a grip groove for gripping the lower end of the electronic component,
The adjuster raises the support plate so that the support plate can grip the lower end of the electronic component, and assists in gripping or releasing the electronic component by the picking device by adjusting the height of the support plate.
Carrier frame.

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