KR102576371B1 - Heat dissipation composition comprising strontium-based fluorescent filler and solvent-free epoxy resin - Google Patents
Heat dissipation composition comprising strontium-based fluorescent filler and solvent-free epoxy resin Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 51
- 239000000945 filler Substances 0.000 title claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 21
- 229910052712 strontium Inorganic materials 0.000 title abstract description 3
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 title abstract description 3
- 239000005084 Strontium aluminate Substances 0.000 claims abstract description 21
- FNWBQFMGIFLWII-UHFFFAOYSA-N strontium aluminate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Sr+2].[Sr+2] FNWBQFMGIFLWII-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910003668 SrAl Inorganic materials 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 16
- 229910052692 Dysprosium Inorganic materials 0.000 claims abstract description 6
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 6
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 claims abstract description 6
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims abstract description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 13
- 229910052582 BN Inorganic materials 0.000 claims description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 239000002518 antifoaming agent Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 239000013538 functional additive Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- -1 sheet Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 229920001971 elastomer Polymers 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000806 elastomer Substances 0.000 abstract 1
- 239000011231 conductive filler Substances 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005274 electronic transitions Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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- C09K11/7738—Phosphates with alkaline earth metals
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Abstract
본 발명은 스트론튬 계열 형광소재 전기절연성 필러 및 무용제 에폭시 수지를 포함하는 방열 조성물의 제조와 열전도 기능성 계면소재, 충진제, 시트 및 탄성체 응용에 관한 것으로, 본 발명에 따른 전기절연성 방열 조성물은 1액형 무용제 에폭시 수지를 사용하고, 전기절연성 필러로서 종래에 알려진 알루미나, 질화붕소와 함께 해당 기술분야에서 전기 절연성 필러로서 사용된 바 없는 스트론튬 알루미네이트, 스트론튬 마그네슘 알루미네이트, 유로피움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+), 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Dy3+) 및/또는 유로피움 및 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+,Dy3+)를 추가로 포함함에 따라, 방열 성능이 현저히 향상되는 효과가 있다.The present invention relates to the manufacture of a heat-dissipating composition containing a strontium-based fluorescent material electrically insulating filler and a solvent-free epoxy resin, and to the application of a thermally conductive functional interface material, filler, sheet, and elastomer. Strontium aluminate, strontium magnesium aluminate, and europium-doped strontium aluminate (SrAl 2 O 4 :Eu 2+ ), strontium aluminate doped with dysprosium (SrAl 2 O 4 :Dy 3+ ) and/or strontium aluminate doped with europium and dysprosium (SrAl 2 O 4 : As Eu 2+ , Dy 3+ ) are further included, there is an effect of remarkably improving heat dissipation performance.
Description
본 발명은 스트론튬 계열 형광소재 전기절연성 필러 및 무용제 에폭시 수지를 포함하는 방열 조성물의 제조와 열전도 기능성 계면소재, 충진제, 시트 및 탄성체 응용에 관한 것이다.The present invention relates to the manufacture of a heat-dissipating composition containing a strontium-based fluorescent material electrically insulating filler and a solvent-free epoxy resin, and to the application of a heat-conductive functional interface material, filler, sheet, and elastic body.
최근 LED 조명을 포함한 전자기기의 고성능화, 소형화 및 고기능화로 인해 전자부품 회로에서의 발열량이 증가되고 이로 인해 기기의 내부온도가 상승하여 반도체 소자의 오작동, 저항체 부품의 특성변화 및 부품의 수명이 저하되는 문제점들이 발생하고 있다. 따라서 이러한 문제점을 해결하기 위한 방열대책으로 다양한 열전도성 기능성 계면소재(Gap Filler) 기술이 개발되고 있다.Recently, due to the high performance, miniaturization and high functionality of electronic devices including LED lighting, the amount of heat generated in electronic component circuits increases, which causes the internal temperature of the device to rise, resulting in malfunction of semiconductor devices, change in characteristics of resistive components, and reduced lifespan of components. Problems are arising. Therefore, as a heat dissipation measure to solve these problems, various thermally conductive functional interfacial materials (Gap Filler) technologies are being developed.
일례로 LED는 입력된 에너지를 빛과 열에너지로 변환하게 되며, 변환된 열에 의하여 발광부 온도가 상승하게 된다. LED의 고유한 장점인 고효율, 장수명 특성은 발광부 온도를 효과적으로 낮추는 방열 기술이 뒷받침되었을 때 비로소 우수한 특성이 나타나므로 고효율 방열 시스템 개발을 위한 핵심 기술이 필요하다.For example, an LED converts input energy into light and heat energy, and the temperature of the light emitting part rises due to the converted heat. High efficiency and long lifespan characteristics, which are the unique advantages of LED, are excellent only when supported by heat dissipation technology that effectively lowers the temperature of the light emitting part. Therefore, a core technology for the development of a high efficiency heat dissipation system is required.
다른 예로 PCB기판 또는 방열판과 같이 두 개의 고체 표면이 서로 접촉할 때 각각의 계면이 갖는 고유한 표면 거칠기 때문에 두 면이 만나는 계면에는 미세한 공극 (void)이 존재하게 되고, 이러한 공극은 열저항의 주요한 원인이 된다. 계면 사이의 공극은 열전도가 낮은 공기로 채워지고 계면을 통한 열의 전도에 악영향을 주게 된다. 이를 해결하고자 열전도 특성이 우수한 기능성 소재를 사용하는 열전도성 충진제 (TIM, Thermal interface material)가 개발되고 있다.As another example, when two solid surfaces such as a PCB board or a heat sink are in contact with each other, fine voids exist at the interface where the two surfaces meet due to the inherent surface roughness of each interface, and these voids are the main factor in thermal resistance. cause The air gap between the interface is filled with air with low heat conduction and adversely affects the conduction of heat through the interface. To solve this problem, a thermal interface material (TIM) using a functional material with excellent thermal conductivity is being developed.
열전도성 갭 필러 (Gap Filler)와 관련된 종래 기술들의 경우 통상적으로 2액형 실리콘 수지를 사용하여 약 3 W/mK 수준의 높은 열전도도 특성을 구현되고 있지만, 이는 고출력, 고성능 전기/전자제품에서 발생하는 발열온도가 120~150℃ 수준이어서 일반적인 TIM(열전도 구리스)의 재료나 2액형 타입은 사용이 불가능하다. 여기서, 2액형 타입의 실리콘 수지를 사용한 열전도성 갭 필러의 경우 전기/전자제품에 사용했을 때 제품의 열화로 인한 용제 휘발로 제품 특성에 악영향을 끼친다. 용제 휘발에 따른 필름막 구조 변형(파괴)와 열화(deterioration), 그리고 입자 응집(agglomeration)이 진행되고 필연적으로 열전도 특성의 저하가 발생한다.In the case of conventional technologies related to thermally conductive gap fillers, a high thermal conductivity of about 3 W/mK is usually implemented using a two-component silicone resin, but this is Since the heating temperature is around 120~150℃, it is impossible to use general TIM (thermal conductive grease) materials or two-component type. Here, in the case of a thermally conductive gap filler using a two-component type silicone resin, when used in electrical/electronic products, solvent volatilization due to product deterioration adversely affects product characteristics. Structural deformation (destruction) and deterioration of the film film due to volatilization of the solvent, and particle aggregation (agglomeration) proceed, and thermal conductivity inevitably deteriorates.
전자기기 또는 전자부품에 적용되는 열전도성 갭 필러의 경우 우수한 방열 성능과 전기절연성이 요구되어, 열전도성 갭 필러의 구성 요소로 전기 비절연성 필러(예를 들어, 흑연, 금속류 등)는 사용할 수 없고, 전기 절연성 필러(예를 들어, 알루미나, 질화붕소, 질화알루미늄 등의 세라믹 필러)만 선택적으로 사용하여야 한다.In the case of thermally conductive gap fillers applied to electronic devices or electronic parts, excellent heat dissipation performance and electrical insulation are required, so electrical non-insulating fillers (eg, graphite, metals, etc.) cannot be used as components of the thermally conductive gap filler , only electrical insulating fillers (for example, ceramic fillers such as alumina, boron nitride, aluminum nitride, etc.) should be selectively used.
이에, 본 발명자는 1액형 무용제 에폭시 수지를 사용하고, 전기절연성 필러로서 종래에 알려진 알루미나, 질화붕소와 함께 해당 기술분야에서 전기 절연성 필러로서 사용된 바 없는 스트론튬 알루미네이트, 스트론튬 마그네슘 알루미네이트, 유로피움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+), 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Dy3+) 및/또는 유로피움 및 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+,Dy3+)를 추가로 구성할 경우, 방열 성능이 현저히 향상될 뿐만 아니라, 전기절연성을 만족함을 확인하고 본 발명을 완성하였다.Therefore, the present inventors use a one-component, solvent-free epoxy resin, and strontium aluminate, strontium magnesium aluminate, and europium, which have not been used as electrically insulating fillers in the art, along with alumina and boron nitride, which are conventionally known as electrically insulating fillers. This doped strontium aluminate (SrAl 2 O 4 :Eu 2+ ), dysprosium doped strontium aluminate (SrAl 2 O 4 :Dy 3+ ) and/or europium and dysprosium doped When strontium aluminate (SrAl 2 O 4 : Eu 2+ , Dy 3+ ) is additionally formed, heat dissipation performance is remarkably improved and electrical insulation properties are satisfied, thereby completing the present invention.
본 발명의 목적은 전기절연성 방열 조성물을 제공하는 것이다.An object of the present invention is to provide an electrically insulating heat dissipating composition.
본 발명의 다른 목적은 전기절연성 방열 조성물을 포함하는 열전도 기능성 계면소재(시트, 탄성체 등), 전자부품, 전자기기, 전력기기, 히트싱크, LED 조명기기 등을 제공하는 것이다.Another object of the present invention is to provide a thermally conductive functional interface material (sheet, elastic body, etc.) containing an electrically insulating heat-dissipating composition, electronic components, electronic devices, power devices, heat sinks, LED lighting devices, and the like.
전기절연성 방열 조성물Electrical insulating heat dissipation composition
본 발명은 에폭시 수지 조성물;The present invention is an epoxy resin composition;
전기절연성 열전도 제1필러; 및an electrically insulative thermally conductive first filler; and
전기절연성 열전도 제2필러;를 포함하고,Including; electrically insulating thermally conductive second filler,
상기 전기절연성 열전도 제1필러는 스트론튬 알루미네이트, 스트론튬 마그네슘 알루미네이트, 유로피움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+), 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Dy3+) 및 유로피움 및 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+,Dy3+) 중 1종 이상이고,The electrically insulating heat-conducting first filler includes strontium aluminate, strontium magnesium aluminate, europium-doped strontium aluminate (SrAl 2 O 4 :Eu 2+ ), and dysprosium-doped strontium aluminate (SrAl 2 O 4 :Dy 3+ ) and at least one of europium and dysprosium-doped strontium aluminate (SrAl 2 O 4 :Eu 2+ ,Dy 3+ );
상기 전기절연성 열전도 제2필러는 알루미늄옥사이드 및 질화붕소를 포함하는 것을 특징으로 하는,Characterized in that the electrically insulating heat-conducting second filler contains aluminum oxide and boron nitride,
전기절연성 방열 조성물을 제공한다.An electrically insulating heat dissipating composition is provided.
본 발명에 따른 전기절연성 방열 조성물은 용제를 포함하지 않는 1액형 무용제 타입으로 사용할 수 있다.The electrically insulating heat-dissipating composition according to the present invention can be used as a one-component, non-solvent type that does not contain a solvent.
본 발명에 따른 전기절연성 방열 조성물에 있어서, 상기 에폭시 수지 조성물은 점착제 용도의 에폭시 수지 조성물이라면 아무런 제약없이 사용가능하다.In the electrical insulating heat dissipation composition according to the present invention, the epoxy resin composition can be used without any restrictions as long as it is an epoxy resin composition for use as an adhesive.
일반적으로, 점착제 용도의 에폭시 수지 조성물에는 에폭시계 수지, 점도조절 및 탄성기능성 첨가제, 소포제, 분산제, 경화제 등이 포함될 수 있다.In general, an epoxy resin composition for use as an adhesive may include an epoxy resin, a viscosity control and elastic functional additive, an antifoaming agent, a dispersing agent, a curing agent, and the like.
바람직하게, 상기 에폭시 수지 조성물은,Preferably, the epoxy resin composition,
에폭시계 수지 15.3 중량부 기준,Based on 15.3 parts by weight of epoxy resin,
점도조절 및 탄성기능성 첨가제로서 butadiene acrylonitrile 계열의 diepoxy rubber 72.78-80.11 중량부,As a viscosity control and elastic functional additive, butadiene acrylonitrile-based diepoxy rubber 72.78-80.11 parts by weight,
소포제로서 실리콘 계열 소포제 0.38-0.42 중량부,As an antifoaming agent, 0.38-0.42 parts by weight of a silicone-based antifoaming agent;
분산제로서 carboxylic acid, amine, 또는 isocyanate 작용기를 갖는 PEO block copolymer 0.38-0.42 중량부, 및0.38-0.42 parts by weight of a PEO block copolymer having a carboxylic acid, amine, or isocyanate functional group as a dispersant, and
경화제로서 이미다졸 계열 경화제 7.22-7.98 중량부 포함할 수 있다.As the curing agent, 7.22-7.98 parts by weight of an imidazole-based curing agent may be included.
상기 에폭시계 수지의 일례로는 비스페놀 A 또는 비스페놀 F 기반의 에폭시 수지를 사용할 수 있다.As an example of the epoxy-based resin, a bisphenol A or bisphenol F-based epoxy resin may be used.
상기 전기절연성 열전도 제1필러는 종래에 형광소재로서 잘 알려져 있으나, 전기절연성 열전도 필러로서는 사용된 적이 없다. 본 발명에서 사용하는 열전도 제1필러는 방열 성능 개선에 주요 구성요소이다. 전자의 이동이 배제된 상태의 열전도 소재(전기절연성 열전도 소재)에서, 열에너지가 전달되는 매질을 구성하는 분자 또는 원자의 격자진동이 열에너지를 전달하는 주요한 원인이 된다. 형광소재는 일반적으로 가시광선, 근자외선, 근적외선 영역의 빛에너지를 흡수하여 형광소재 원소의 내부전자를 여기시킨 후 다시 기저상태로 내려오는 과정에서 형광빛을 방출하는 효과를 보인다. 이러한 전자전이의 진동효과는 격자진동의 형태로 발현되는데 열에너지의 흡수과정에서도 이러한 효과가 크게 나타나서 다른 원소에 비해 격자진동이 효과적이라, 열전도 성능 개선에 주요한 역할을 하는 것으로 사료된다.The electrically insulating, heat-conducting first filler is conventionally well known as a fluorescent material, but has never been used as an electrically insulating, heat-conducting filler. The first thermally conductive filler used in the present invention is a major component for improving heat dissipation performance. In a heat conductive material (electric insulating heat conductive material) in a state in which the movement of electrons is excluded, the lattice vibration of molecules or atoms constituting the medium through which heat energy is transmitted is the main cause of transferring heat energy. Fluorescent materials generally absorb light energy in the visible, near-ultraviolet, and near-infrared regions to excite internal electrons of fluorescent material elements, and then emit fluorescent light in the process of descending back to the ground state. The vibration effect of these electronic transitions is expressed in the form of lattice vibration, and this effect appears greatly in the process of absorbing thermal energy, so lattice vibration is more effective than other elements, and it is considered to play a major role in improving thermal conductivity performance.
바람직하게,Preferably,
상기 에폭시 수지 조성물 8.5 중량부 기준,Based on 8.5 parts by weight of the epoxy resin composition,
전기절연성 열전도 제1필러 13-17 중량부,13-17 parts by weight of electrical insulating thermally conductive first filler,
알루미늄옥사이드 37.2-43.6 중량부, 및37.2-43.6 parts by weight of aluminum oxide, and
질화붕소 1.2-2.0 중량부 포함할 수 있다.1.2-2.0 parts by weight of boron nitride may be included.
더욱 바람직하게,more preferably,
상기 에폭시 수지 조성물 8.5 중량부 기준,Based on 8.5 parts by weight of the epoxy resin composition,
전기절연성 열전도 제1필러 14-16 중량부,14-16 parts by weight of electrically insulating thermally conductive first filler,
알루미늄옥사이드 39.2-41.6 중량부, 및39.2-41.6 parts by weight of aluminum oxide, and
질화붕소 1.4-1.8 중량부 포함할 수 있다.1.4-1.8 parts by weight of boron nitride may be included.
특히 바람직하게,particularly preferably,
상기 에폭시 수지 조성물 8.5 중량부 기준,Based on 8.5 parts by weight of the epoxy resin composition,
전기절연성 열전도 제1필러 14.8-15.2 중량부,14.8-15.2 parts by weight of electrical insulating thermally conductive first filler;
알루미늄옥사이드 40.2-40.6 중량부, 및40.2-40.6 parts by weight of aluminum oxide, and
질화붕소 1.5-1.7 중량부 포함할 수 있다.It may contain 1.5-1.7 parts by weight of boron nitride.
만약, 상기 구성요소의 함량비를 벗어날 경우, 방열 성능이 저하하는 문제가 있을 수 있고, 전기절연성 방열 조성물 총중량 중에서 제1필러 및 제2필러의 중량이 88 중량%를 초과할 경우 믹싱이 어려운 문제가 있을 수 있다.If the content ratio of the above components is out of range, heat dissipation performance may deteriorate, and mixing is difficult when the weight of the first filler and the second filler exceeds 88% by weight of the total weight of the electrically insulating heat dissipating composition there may be
본 발명에 따른 전기절연성 방열 조성물은 점착제 형태일 수 있다.The electrically insulating heat-dissipating composition according to the present invention may be in the form of an adhesive.
전자부품, 전자기기, 전력기기, 히트싱크, LED 조명기기Electronic parts, electronic devices, power devices, heat sinks, LED lighting devices
본 발명은 상기 전기절연성 방열 조성물을 포함하는 열전도 기능성 계면소재(시트, 탄성체 등), 전자부품, 전자기기, 전력기기, 히트싱크, LED 조명기기 등을 제공한다.The present invention provides a thermally conductive functional interface material (sheet, elastic body, etc.), electronic parts, electronic devices, power devices, heat sinks, LED lighting devices, etc. containing the electrically insulating heat dissipating composition.
본 발명에 따른 전기절연성 방열 조성물은 1액형 무용제 에폭시 수지를 사용하고, 전기절연성 필러로서 종래에 알려진 알루미나, 질화붕소와 함께 해당 기술분야에서 전기 절연성 필러로서 사용된 바 없는 스트론튬 알루미네이트, 스트론튬 마그네슘 알루미네이트, 유로피움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+), 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Dy3+) 및 유로피움 및 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+,Dy3+) 중 1종 이상을 추가로 포함함에 따라, 방열 성능이 현저히 향상되는 효과가 있다.The electrically insulating heat-dissipating composition according to the present invention uses a one-component, solvent-free epoxy resin, and strontium aluminate and strontium magnesium aluminate, which have not been used as electrically insulating fillers in the art, along with alumina and boron nitride, which are conventionally known as electrically insulating fillers. nate, europium-doped strontium aluminate (SrAl 2 O 4 :Eu 2+ ), dysprosium-doped strontium aluminate (SrAl 2 O 4 :Dy 3+ ) and europium and dysprosium As one or more of doped strontium aluminate (SrAl 2 O 4 :Eu 2+ , Dy 3+ ) is additionally included, heat dissipation performance is remarkably improved.
이하, 본 발명을 하기의 실시예에 의하여 더욱 상세하게 설명한다. 단, 하기의 실시예는 본 발명을 예시하는 것일 뿐, 본 발명의 내용이 하기의 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail by the following examples. However, the following examples are merely illustrative of the present invention, and the contents of the present invention are not limited by the following examples.
<제조예 1> 에폭시 수지 조성물의 제조<Preparation Example 1> Preparation of epoxy resin composition
에폭시 수지(제조사: 국도화학, 모델명: YDF-170) 15.3 중량부 기준,Based on 15.3 parts by weight of epoxy resin (manufacturer: Kukdo Chemical, model name: YDF-170),
점도조절 및 탄성기능성 첨가제로서 butadiene acrylonitrile 계열의 diepoxy rubber 76.3 중량부,As a viscosity control and elastic functional additive, butadiene acrylonitrile-based diepoxy rubber 76.3 parts by weight,
소포제로서 실리콘 계열 소포제 0.4 중량부,0.4 parts by weight of a silicone-based antifoaming agent as an antifoaming agent;
분산제로서 carboxylic acid, amine, 또는 isocyanate 작용기를 갖는 PEO block copolymer 0.4 중량부,0.4 parts by weight of a PEO block copolymer having a carboxylic acid, amine, or isocyanate functional group as a dispersing agent;
경화제로서 이미다졸 계열 경화제 7.6 중량부,As a curing agent, 7.6 parts by weight of an imidazole-based curing agent,
를 paste mixer(제조사: 일신오토클레이브)에 넣고 3 step으로 1회 믹싱하여 에폭시 수지 조성물을 제조하였다.into a paste mixer (manufacturer: Ilshin Autoclave) and mixed once in 3 steps to prepare an epoxy resin composition.
<실시예> 전기절연성 방열 조성물의 제조<Example> Preparation of electrical insulating heat dissipation composition
전기절연성 방열 조성물의 구성요소 출처를 하기 표 1에 나타내었다.The component sources of the electrically insulating heat-dissipating composition are shown in Table 1 below.
에폭시 수지 조성물과 전기절연성 열전도 필러를 paste mixer(제조사: 일신오토틀레이브)에 넣고 3 step으로 5회 믹싱하여 전기절연성 방열 조성물 sample을 제조하였다.The epoxy resin composition and the electrically insulating heat-conductive filler were put in a paste mixer (manufacturer: Ilshin Autoclave) and mixed 5 times in 3 steps to prepare a sample of the electrically insulating heat-dissipating composition.
<실험예 1> 방열 성능 평가<Experimental Example 1> Heat dissipation performance evaluation
수직 방열 특성을 평가하기 위하여, 에폭시 수지 조성물에 전기절연성 열전도 필러 3종의 함량비를 달리하여 제조한 전기절연성 방열 조성물 샘플을 준비하여 수직 열확산도 및 수직 열전도도를 측정하였다.In order to evaluate vertical heat dissipation characteristics, samples of an electrically insulating heat dissipating composition prepared by varying the content ratio of three types of electrically insulating thermally conductive fillers in an epoxy resin composition were prepared and vertical thermal diffusivity and vertical thermal conductivity were measured.
Laser flash 법에 기반을 둔 열확산도 분석 장비(모델명: LFA 447, 제조사: Netzsch, Germany)를 사용하여 시료의 수직 열확산도를 측정하였고, 그 결과를 표 2에 나타내었다. 수직 열전도도는 측정된 수직 열확산도 값을 이용하여 공지의 방법으로 계산하였다.The vertical thermal diffusivity of the sample was measured using a thermal diffusivity analyzer (model name: LFA 447, manufacturer: Netzsch, Germany) based on the laser flash method, and the results are shown in Table 2. Vertical thermal conductivity was calculated by a known method using the measured vertical thermal diffusivity value.
상기 표 2에 나타난 바와 같이, 실시예 1 내지 3에서 에폭시 수지 조성물의 함량이 줄어듬에 따라 스트론튬 알루미네이트(Sr aluminate) 함량이 증가할수록 수직 열확산도가 증가함을 확인하여, 방열 성능에 핵심적인 구성요소로서 제1필러가 중요함을 알 수 있었다. As shown in Table 2, as the content of the epoxy resin composition decreased in Examples 1 to 3, as the content of strontium aluminate (Sr aluminate) increased, the vertical thermal diffusivity was confirmed to increase, which is a key component for heat dissipation performance As an element, it was found that the first filler was important.
실시예 1의 경우 총 중량 67g 중에 전기절연성 열전도 필러의 함량이 85.07 중량%이고,In the case of Example 1, the content of the electrically insulating heat conductive filler was 85.07% by weight in the total weight of 67g,
실시예 2의 경우 총 중량 66g 중에 전기절연성 열전도 필러의 함량이 86.36 중량%이며,In the case of Example 2, the content of the electrically insulating heat conductive filler is 86.36% by weight in the total weight of 66g,
실시예 3 및 4의 경우 총 중량 65.5g 중에 전기절연성 열전도 필러의 함량이 87.02 중량%이다.In the case of Examples 3 and 4, the content of the electrically insulating heat conductive filler was 87.02% by weight in the total weight of 65.5 g.
필러의 함량이 88 중량%를 초과하면 믹싱이 불가하여 샘플 제조가 어려운 문제가 있을 수 있다.When the content of the filler exceeds 88% by weight, mixing is not possible, and thus sample preparation may be difficult.
<실험예 2> 수직 방열 성능 개선을 위한 에폭시 수지 조성물 및 전기절연성 열전도 필러 최적 함량비 도출<Experimental Example 2> Derivation of optimal content ratio of epoxy resin composition and electrically insulating heat-conductive filler for improving vertical heat dissipation performance
상술한 실험예 1의 결과를 통해 전기절연성 방열 조성물 중에 전기절연성 열전도 필러의 함량이 약 87 중량%인 샘플이 수직 방열 성능이 가장 우수하고, 또한 물성 역시 만족함을 확인하였다.Through the results of Experimental Example 1 described above, it was confirmed that the sample in which the content of the electrically insulating heat-conductive filler in the electrically insulating heat-dissipating composition was about 87% by weight had the best vertical heat dissipation performance and also satisfied physical properties.
이에, 본 실험예 2에서는 수직 방열 성능 개선을 위한 에폭시 수지 조성물과 전기절연성 열전도 필러의 최적 함량비를 도출하기 위해, 3종 필러의 함량을 달리하여 실험을 실시하였고, 그 결과를 표 3 및 표 4에나타내었다.Therefore, in this Experimental Example 2, in order to derive the optimal content ratio of the epoxy resin composition and the electrically insulating heat-conductive filler for improving vertical heat dissipation performance, an experiment was conducted by varying the content of the three types of fillers, and the results are shown in Tables 3 and 4. shown in 4.
(W/mK)vertical thermal conductivity
(W/mK)
(W/mK)vertical thermal conductivity
(W/mK)
상기 표 3 및 4에 나타난 바와 같이, 에폭시 수지 조성물 8.5 중량부 기준, 제1필러 14.8-15.2 중량부, 알루미늄옥사이드 40.2-40.6 중량부, 및 질화붕소 1.5-1.7 중량부 포함하는 실시예에서 수직 열전도도 값이 현저히 높게 나타남을 확인할 수 있었다.As shown in Tables 3 and 4, vertical heat conduction in an embodiment including 14.8 to 15.2 parts by weight of the first filler, 40.2 to 40.6 parts by weight of aluminum oxide, and 1.5 to 1.7 parts by weight of boron nitride based on 8.5 parts by weight of the epoxy resin composition. It was confirmed that the values were significantly higher.
이상에서 본 발명의 바람직한 실시예에 대하여 상세하게 설명하였지만, 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명에 속하는 것이다.Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also present. belonging to the invention.
Claims (13)
전기절연성 열전도 제1필러 14.8-15.2 중량부; 및
전기절연성 열전도 제2필러로서 알루미늄옥사이드 40.2-40.6 중량부 및 질화붕소 1.5-1.7 중량부;를 포함하고,
상기 전기절연성 열전도 제1필러는 스트론튬 알루미네이트, 또는 유로피움 및 디스프로시움이 도핑된 스트론튬 알루미네이트(SrAl2O4:Eu2+,Dy3+)인 것을 특징으로 하는,
전기절연성 방열 조성물.
Based on 8.5 parts by weight of the epoxy resin composition;
14.8-15.2 parts by weight of electrically insulating heat-conducting first filler; and
40.2-40.6 parts by weight of aluminum oxide and 1.5-1.7 parts by weight of boron nitride as an electrically insulating heat-conducting second filler;
Characterized in that the electrically insulating heat-conducting first filler is strontium aluminate or strontium aluminate doped with europium and dysprosium (SrAl 2 O 4 : Eu 2+ , Dy 3+ ),
An electrically insulating heat dissipating composition.
상기 전기절연성 방열 조성물은 용제를 포함하지 않는 무용제 타입인 것을 특징으로 하는 전기절연성 방열 조성물.
According to claim 1,
The electrically insulating heat-dissipating composition is an electrically insulating heat-dissipating composition, characterized in that it is a solvent-free type that does not contain a solvent.
상기 에폭시 수지 조성물은 에폭시계 수지, 점도조절 및 탄성기능성 첨가제, 소포제, 분산제 및 경화제를 포함하는 것을 특징으로 하는 전기절연성 방열 조성물.
According to claim 1,
The epoxy resin composition is an electrical insulating heat dissipation composition, characterized in that it comprises an epoxy-based resin, a viscosity control and elastic functional additives, a defoaming agent, a dispersing agent and a curing agent.
상기 에폭시계 수지는 비스페놀 A 또는 비스페놀 F 기반의 에폭시 수지인 것을 특징으로 하는 전기절연성 방열 조성물.
According to claim 3,
The epoxy-based resin is an electrical insulating heat dissipation composition, characterized in that the bisphenol A or bisphenol F-based epoxy resin.
상기 전기절연성 방열 조성물은 점착제 형태인 것을 특징으로 하는 전기절연성 방열 조성물.
According to claim 1,
The electrically insulating heat-dissipating composition is an electrically insulating heat-dissipating composition, characterized in that in the form of an adhesive.
A thermally conductive functional interface material comprising the electrically insulating heat-dissipating composition of claim 1.
상기 열전도 기능성 계면소재는 시트(sheet) 또는 탄성체인 것을 특징으로 하는 열전도 기능성 계면소재.
According to claim 9,
The heat-conductive functional interface material is a heat-conductive functional interface material, characterized in that the sheet (sheet) or elastic body.
An electronic component comprising the electrically insulating heat-dissipating composition of claim 1.
A heat sink comprising the electrically insulating heat-dissipating composition of claim 1.
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