KR102535758B1 - 광경화형 점착 시트, 화상 표시 장치 구성용 적층체, 화상 표시 장치의 제조 방법 및 도전부재의 부식 억제 방법 - Google Patents
광경화형 점착 시트, 화상 표시 장치 구성용 적층체, 화상 표시 장치의 제조 방법 및 도전부재의 부식 억제 방법 Download PDFInfo
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- KR102535758B1 KR102535758B1 KR1020207001359A KR20207001359A KR102535758B1 KR 102535758 B1 KR102535758 B1 KR 102535758B1 KR 1020207001359 A KR1020207001359 A KR 1020207001359A KR 20207001359 A KR20207001359 A KR 20207001359A KR 102535758 B1 KR102535758 B1 KR 102535758B1
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- Prior art keywords
- meth
- adhesive sheet
- conductive member
- sensitive adhesive
- acrylate
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- 230000007797 corrosion Effects 0.000 title claims abstract description 80
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- 239000000178 monomer Substances 0.000 claims abstract description 91
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- 125000000524 functional group Chemical group 0.000 claims description 30
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- 238000002161 passivation Methods 0.000 claims description 3
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 2
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
- C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
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- Adhesives Or Adhesive Processes (AREA)
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- Non-Insulated Conductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (12)
- (메타)아크릴산 에스테르 (공)중합체, 광을 수광하면 라디칼을 발생하는 광개시제, 및, 365㎚의 흡광 계수가 20㎖/g·㎝ 이하의 금속 부식 방지제를 함유하는 점착제층을 가지고,
또한, 상기 (메타)아크릴산 에스테르 (공)중합체는, 카르복실기 함유 모노머를 포함하지 않는 (공)중합체이며,
상기 광개시제의 함유량은, 상기 (메타)아크릴산 에스테르 (공)중합체 100질량부에 대하여 0.1질량부 이상 10질량부 이하이고,
상기 금속 부식 방지제는 1,2,3-트리아졸 및 1,2,4-트리아졸에서 선택되는 1종 또는 2종인 것을 특징으로 하는 광경화형 점착 시트. - 제 1 항에 있어서,
상기 광개시제가 개열형 광개시제인 것을 특징으로 하는 광경화형 점착 시트. - 제 1 항에 있어서,
상기 금속 부식 방지제의 25℃에 있어서의 수용해도가 20g/L 이상인 것을 특징으로 하는 광경화형 점착 시트. - 제 1 항에 있어서,
상기 광개시제 100중량부에 대하여 10~200질량부의 비율로 금속 부식 방지제를 함유하는 것을 특징으로 하는 광경화형 점착 시트. - 제 1 항에 있어서,
상기 (메타)아크릴산 에스테르 (공)중합체가, 아미드기와 카르복실기, 및, 히드록실기와 이소시아네이트기 중에서 선택되는 어느 하나의 관능기의 조합에 의한 화학적인 결합을 가지거나, 또는, 가지 성분으로서 매크로 모노머를 구비한 그래프트 공중합체인 것을 특징으로 하는 광경화형 점착 시트. - 제 1 항 내지 제 5 항 중 어느 한 항에 기재된 광경화형 점착 시트와, 은을 포함하는 금속 재료를 구비한 도전부재를 가지는 광경화형 점착 시트를 구비한 도전부재.
- 제 1 항 내지 제 5 항 중 어느 한 항에 기재된 광경화형 점착 시트에 있어서,
은을 포함하는 금속 재료를 구비한 도전부재에 첩합하기 위하여 이용하는 것을 특징으로 하는 도전부재용 광경화형 점착 시트. - 제 7 항에 있어서,
상기 도전부재는, 은을 포함하는 금속 재료를 구비한 투명 도전층을 가지는 것을 특징으로 하는 도전부재용 광경화형 점착 시트. - 제 7 항에 있어서,
상기 도전부재는, 절연 보호막(패시베이션막)을 가지는 것을 특징으로 하는 도전부재용 광경화형 점착 시트. - 은을 포함하는 금속 재료를 구비한 도전부재를 구비한 화상 표시 장치용 구성 부재와, 다른 화상 표시 장치용 구성 부재를 구비한 화상 표시 장치 구성용 적층체의 제조 방법에 있어서,
제 1 항 내지 제 5 항 중 어느 항에 기재된 광경화형 점착 시트를 개재하여, 상기 2개의 화상 표시 장치 구성 부재를 적층한 후, 적어도 일방의 화상 표시 장치 구성 부재측으로부터 광을 조사하여, 상기 광경화형 점착 시트를 광경화하는 것을 특징으로 하는 화상 표시 장치 구성용 적층체의 제조 방법. - 은을 포함하는 금속 재료를 구비한 도전부재에 광경화형 점착 시트를 적층한 후, 광조사하여 당해 점착 시트를 경화시킨 후의 상기 도전부재의 부식 억제 방법에 있어서,
상기 도전부재에, 제 1 항 내지 제 5 항 중 어느 한 항에 기재된 광경화형 점착 시트를 적층한 후, 광조사 할 때에, 당해 점착 시트 중의 금속 부식 방지제로 도전부재의 은의 일부 또는 전부를 피복함으로써, 상기 광조사에 의해 광개시제로부터 발생한 라디칼이 도전부재의 은과 반응하는 것을 억제하는 것을 특징으로 하는 도전부재의 부식 억제 방법. - 삭제
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PCT/JP2018/022589 WO2018235696A1 (ja) | 2017-06-23 | 2018-06-13 | 光硬化型粘着シート、画像表示装置構成用積層体、画像表示装置の製造方法及び導電部材の腐食抑制方法 |
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CN (2) | CN116004127A (ko) |
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KR101903906B1 (ko) * | 2017-09-22 | 2018-10-02 | 주식회사 엘지화학 | 편광판 보호층용 무용제형 광경화성 수지 조성물, 이의 경화물을 포함하는 편광판 및 화상표시장치 |
US20210122947A1 (en) * | 2018-03-29 | 2021-04-29 | Mitsubishi Chemical Corporation | Adhesive sheet, conductive member-layered product using same, and image display device |
CN112513212B (zh) * | 2018-08-09 | 2022-11-18 | 三菱化学株式会社 | 光固化性粘合片、图像显示装置用层叠体和图像显示装置 |
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CN114846402A (zh) * | 2019-12-18 | 2022-08-02 | 富士胶片株式会社 | 感光性转印材料及其制造方法、带图案的金属导电性材料的制造方法、膜、触控面板、劣化抑制方法、以及层叠体 |
US11445619B2 (en) * | 2020-10-28 | 2022-09-13 | Matrix Electronics Limited | System and method for high-temperature lamination of printed circuit boards |
KR20220143215A (ko) * | 2021-04-15 | 2022-10-25 | 삼성디스플레이 주식회사 | 결합 부재 및 이를 포함하는 표시 장치 |
US20230365840A1 (en) * | 2022-05-16 | 2023-11-16 | 3M Innovative Properties Company | High temperature and high humidity stable optically clear adhesive |
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