KR102488296B1 - APPARATUS FOR COATING, jig structure and jig apparatus - Google Patents

Abstract

A plating apparatus is disclosed, comprising: a plating bath that is open upward and has an interior space in which a panel can be accommodated, and in which a plating liquid is accommodated in the interior space so that the panel can be immersed in the plating liquid; a jig structure supporting the panel in the inner space; and a sacrificial electrode disposed on one side of the jig structure.

Description

Plating device and jig structure and jig device applied thereto {APPARATUS FOR COATING, jig structure and jig apparatus}

The present application relates to a plating device, a jig structure and a jig device applied thereto, and a plating method using the same.

In general, plating refers to an operation of coating a thin film of metal or alloy on the surface of an electrolytic material, and is used for various purposes such as decorative beautification, anti-corrosion, improvement in abrasion resistance, improvement in contact resistance, and prevention of carburization. being used in the field.

Such plating can be classified in various ways depending on its method or purpose, but today, in particular, electroplating is in an important position, and plating often means electroplating.

Here, briefly explaining the principle of electroplating, in electroplating, the object to be plated (electrolyte) is used as the cathode (cathode), and the metal to be electrodeposited (metal for plating) is used as the anode (anode). ), the electrolytic material and the plating metal are placed in an electrolyte solution containing the metal ion to be electrodeposited, and the two electrodes are ionized by energizing the metal ion to deposit the metal ion on the surface of the electrolytic material. to use the phenomenon.

However, in the past, a jig-type vertical electrophoresis facility was used to copper-plate the panel. In the conventional jig-type vertical electrophoresis facility, when the distance between jig increases, the plating thickness formed on each of the left and right sides of the panel due to the increase in the distance value between the panels. had an increasing aspect.

The background technology of the present application is disclosed in Patent Application No. 10-2013-0070795.

The present invention is to solve the problems of the prior art described above, to provide a plating device capable of preventing the plating thickness deviation that occurs when the interval between jig increases according to the size of the panel, and a jig structure and jig device applied thereto aims to

However, the technical problems to be achieved by the embodiments of the present application are not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above technical problem, the plating apparatus according to one embodiment of the present application is opened upward and has an inner space in which a panel can be accommodated, but a plating solution in the inner space so that the panel can be immersed in the plating solution. a plating bath in which it is accommodated; a jig structure supporting the panel in the inner space; and a sacrificial electrode disposed on one side of the jig structure.

In the plating device according to an exemplary embodiment of the present disclosure, the sacrificial electrode may be provided to prevent the plating thickness of one edge portion of the panel from being thicker than a predetermined range compared to the plating thickness of the central portion of the panel.

In the plating apparatus according to the exemplary embodiment of the present disclosure, the sacrificial electrode is plated as a replacement, and when the sacrificial electrode is not disposed, the plating thickness of one edge portion of the panel may be reduced.

In the plating device according to one embodiment of the present application, the sacrificial electrode may be metal.

In the plating apparatus according to one embodiment of the present application, the jig structure may support one panel.

In the plating apparatus according to an exemplary embodiment of the present disclosure, when a plurality of jig structures are provided, the sacrificial electrode may be disposed between the jig structure and a jig structure adjacent to one side of the jig structure.

A jig structure according to one embodiment of the present application includes a main frame extending in one side and the other side of a panel; a plurality of jig units provided at intervals on the main frame and capable of gripping the upper portion of the panel; a pair of pillars provided on one side and the other side of the main frame and coupled to one end and the other end of the main frame, respectively; and a sacrificial electrode provided on one of the pair of pillar parts.

In the jig structure according to one embodiment of the present application, the jig structure may support one panel.

The jig device according to one embodiment of the present application includes a plurality of jig structures according to the above-described one embodiment of the present application, and the sacrificial electrode is provided on the one side pillar portion of the jig structure having a jig structure adjacent to one side. It can be.

The plating method according to one embodiment of the present application includes a plating bath that is opened upward and has an inner space in which a panel can be accommodated, and a plating solution is accommodated in the inner space so that the panel can be immersed in the plating solution, and the panel is placed in the inner space. It may include plating using a plating device including a jig structure supported by and a sacrificial electrode disposed on one side of the jig structure.

In the plating method according to one embodiment of the present invention, the sacrificial electrode may be provided to prevent the plating thickness of one side edge portion of the panel from being thicker than a predetermined range compared to the plating thickness of the central portion of the panel.

In the plating method according to the exemplary embodiment of the present disclosure, the sacrificial electrode is plated as a substitute, and the plating thickness of one edge portion of the panel may be reduced when the sacrificial electrode is not disposed.

In the plating method according to one embodiment of the present application, the sacrificial electrode may be metal.

In the plating method according to one embodiment of the present application, the jig structure may support one panel.

In the plating method according to one embodiment of the present application, when the jig structure is provided in plurality, the sacrificial electrode may be disposed between the jig structure and one side neighboring jig structure adjacent to one side of the jig structure.

The plating method according to one embodiment of the present disclosure may further include recovering the metal plated on the sacrificial electrode.

The plating method according to one embodiment of the present application includes preparing a jig structure supporting a panel and having a sacrificial electrode; mounting a panel to the jig structure; immersing the jig structure on which the panel is mounted in a plating bath that opens upward and has an interior space in which the panel can be accommodated and a plating solution is accommodated in the interior space; and plating the panel by applying a voltage to the jig structure immersed in the plating bath.

The above-described problem solving means are merely exemplary and should not be construed as intended to limit the present disclosure. In addition to the exemplary embodiments described above, additional embodiments may exist in the drawings and detailed description of the invention.

According to the above-described problem solving means of the present application, as one panel is supported on one jig structure according to the size of the panel, even if the gap between the panel and one neighboring panel is widened, the sacrificial electrode is provided on one side of the panel The sacrificial electrode causes at least a portion of metal ions to be plated on one side portion of the panel to be plated so that the plating thickness of the front or rear surface of the one side portion is within a preset range compared to the central portion of the front or rear surface (a range that is not judged as defective). Excess deviation occurrence can be prevented.

1 is a schematic conceptual internal view of a plating apparatus according to an embodiment of the present disclosure.
2 to 4 are diagrams illustrating effects of a plating apparatus according to an embodiment of the present application and a plating method according to an embodiment of the present application.
5 is a schematic flow chart of a plating method according to an embodiment of the present disclosure.
6 is a schematic flow chart of a plating method according to another embodiment of the present application.

Hereinafter, embodiments of the present application will be described in detail so that those skilled in the art can easily practice with reference to the accompanying drawings. However, the present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. And in order to clearly describe the present application in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout this specification, when a part is said to be "connected" to another part, this includes not only the case of being "directly connected" but also the case of being "electrically connected" with another element in between. do.

Throughout the present specification, when a member is referred to as being “on,” “above,” “on top of,” “below,” “below,” or “below” another member, this means that a member is located in relation to another member. This includes not only the case of contact but also the case of another member between the two members.

Throughout the present specification, when a part "includes" a certain component, it means that it may further include other components without excluding other components unless otherwise stated.

The present application relates to a plating device, a jig structure and a jig device applied thereto, and a plating method using the same.

First, a plating device (hereinafter referred to as 'this plating device') according to an embodiment of the present application will be described.

1 is a schematic conceptual internal view of a plating apparatus according to an embodiment of the present application, and FIGS. 2 to 4 illustrate effects of a plating apparatus according to an embodiment of the present application and a plating method according to an embodiment of the present application. It is a drawing to

Referring to FIG. 1 , the plating apparatus includes a plating bath 1 . The plating bath 1 is opened upward and has an inner space 11 in which the panel 9 can be accommodated, and the plating liquid is accommodated in the inner space 11 so that the panel 9 can be immersed in the plating liquid.

Also, referring to FIG. 1 , the present plating apparatus includes a jig structure 2 supporting the panel 9 in an inner space 11 .

The jig structure 2 can support one panel 9 .

For example, the jig structure 2 may include a main frame 21 extending in one direction and the other direction of the panel 9 . The main frame 21 may be provided on the upper side of the panel 9 .

In addition, the jig structure 2 may include a plurality of upper jig units 22 provided on the main frame 21 at intervals to grip the upper portion of the panel 9 . The upper jig unit 22 can grip or release the panel 9 . For example, the upper jig unit 22 may include a pair of gripping units disposed between the panels 9 and a gap adjusting unit for adjusting a gap between the pair of gripping units (front-to-rear gap), the gap adjusting unit By adjusting the distance between the pair of gripping units, the panel 9 can be gripped or released.

In addition, the jig structure 2 may include a pair of pillar parts 23 provided on one side and the other side of the main frame 21 and coupled to one end and the other end of the main frame 21, respectively. A pair of pillar parts 23 may support the main frame 21 .

In addition, the jig structure 2 may include a lower frame 24 . The lower frame 24 may extend from the lower side of the panel 9 toward one side and the other side of the panel 9 . In addition, each of one end and the other end of the lower frame 24 may be connected to each of the pair of pillar parts 23 . In addition, the jig structure 2 may include a plurality of lower jig units 25 provided on the lower frame 24 at intervals to grip the lower portion of the panel 9 . The lower jig unit 25 can grip or release the panel 9 . Since the lower jig unit 25 corresponds to the upper jig unit 22, a detailed description thereof will be omitted.

Due to the gripping of the panel by the upper jig unit 22 and the lower jig unit 25, the upper and lower ends of the panel are fixed to prevent shaking. Also, by removing the guides, there may be no guide marks in the panel. In addition, since the shaking of the panel 9 is improved, there may be no deviation between the front and rear surfaces of the panel 9, and warping of the panel 9 and tearing of the panel 9 may be improved.

Also, the jig structure 2 can support one panel 9 .

In addition, in order to prevent bending, the jig structure 2 needs to be manufactured with a certain width or more, for example, the main frame 21, the upper jig unit 22, the lower frame 24, the lower jig unit 25 ) and one or more of the pillar parts 23 may have a width (thickness) of 8 mm or more. In addition, conventionally, the width of one side and the other side of the jig structure 2 can be set to 493 mm inside and 509 mm outside based on two panels 9 with a width of 250 mm in one side and the other side direction.

On the other hand, in the present application, the jig structure 2 may support one panel 9, and the panel 9 may have a width of, for example, 500 mm, and the entire panel according to trimming after plating Size reduction may occur, and thus, a difference in size between the central portion and one edge portion or the other edge portion may occur.

In addition, the plating thickness of one edge portion or the other edge portion may increase due to the widening of the gap between the panels. More specifically, for example, when two 250mm panels are fixed side by side to the jig structure 2 to be plated, a predetermined internal distance between the 250mm panels is required (eg, 5mm) , the external distance with the panel fixed by the adjacent jig structure 2 is required, for example, about 9 mm. On the other hand, as in the present invention, when a 500 mm single panel is fixed to the jig structure 2 and the plating process is performed, there is no predetermined internal gap between the panels, and the adjacent jig structure 2 by that much or a similar amount The outer spacing from the fixed panel is increased (eg, 500mm wide multi standard outer spacing 19mm). In this way, as the distance between the jig structure 2 and the panels supported by the adjacent jig structures increases, the copper plating is concentrated on the outer portion of the panel 9 to that extent, and the plating thickness between the central portion of the panel 9 and one side and the other side increases. difference will occur.

For example, referring to FIG. 2, during the automatic inspection, excessive defects occurred on one side and the other (left and right) outer edges of the panel 9 (matching the left and right sides based on electrophoresis), and the thickness of the abnormal area and the normal area During the analysis, plating thickness deviation occurred. In addition, circuit realization ability was lowered due to plating thickness variation.

However, in this plating apparatus, the problem can be solved by arranging the sacrificial electrode 3 therefor.

Specifically, the plating apparatus includes a sacrificial electrode 3 disposed on one side of the jig structure 2 . The sacrificial electrode 3 may be metal. Current is also applied to the sacrificial electrode 3 so that an over-plating phenomenon concentrated on one side and the other side of the panel 9 can be improved. In other words, replacement plating can be achieved to improve the spacing.

In addition, the sacrificial electrode 3 may be provided on one side of the pair of pillars 23 .

In addition, the sacrificial electrode 3 may be provided to prevent the plating thickness of at least a portion of the edge portion of one side of the panel 9 from being thicker than a predetermined range compared to the plating thickness of the central portion of the panel.

In addition, the sacrificial electrode is alternately plated to reduce the plating thickness of at least a portion of the edge portion of one side of the panel 9 compared to the case where the sacrificial electrode is not disposed.

In addition, when a plurality of jig structures 2 are provided, the sacrificial electrode 3 may be disposed between the jig structure 2 and the jig structure 2 adjacent to one side of the jig structure 2 . Accordingly, according to the plating on the panel 9 of 500 mm with one side left width, the interval between the panels is 19 mm, and the interval between the panel 9 and the sacrificial electrode 3 is 7 mm, resulting in an effect of improving the interval of 12 mm. may occur. That is, according to the present application, since the distance between the sacrificial electrode 3 and the panel 9 is smaller than the distance between the panel 9 and the panel 9 of the neighboring jig structure 2, also, the sacrificial electrode 3 Since the distance between the panel 9 and the panel 9 of the adjacent jig structure 2 is reduced by this, the side portion of the panel 9 is plated by plating the sacrificial electrode 3 instead of the side portion of the panel 9. This concentration can be at least partially reduced.

Referring to FIG. 3 , according to the present device, process capability can be increased (from Cp1.13 to 1.74). In addition, when the sacrificial electrode 3 is used, a non-peeling phenomenon does not occur in the copper deposited portion.

Also, referring to FIG. 4 , according to the present apparatus, the deviation of the thickness in the plane direction of the plating formed on the front or rear surface of the panel 9 can satisfy a preset condition.

Hereinafter, a jig device (hereinafter referred to as 'this jig device') 2 according to an embodiment of the present disclosure will be described.

This jig device 2 is applied to the above-described present device, and shares the same or corresponding technical features and configurations of the above-described present device. Therefore, descriptions overlapping with those described above will be simplified or omitted, and the same reference numerals will be used for the same or similar components.

The jig structure 2 may include a main frame 21 extending in directions of one side and the other side of the panel 9 . The main frame 21 may be provided on the upper side of the panel 9 .

In addition, the present jig structure 2 may include a plurality of upper jig units 22 provided on the main frame 21 at intervals to grip the upper portion of the panel 9 . The upper jig unit 22 can grip or release the panel 9 . For example, the upper jig unit 22 may include a pair of gripping units disposed between the panels 9 and a gap adjusting unit for adjusting a gap between the pair of gripping units (front-to-rear gap), the gap adjusting unit By adjusting the distance between the pair of gripping units, the panel 9 can be gripped or released.

In addition, the present jig structure 2 may include a pair of pillar parts 23 provided on one side and the other side of the main frame 21 and coupled to one end and the other end of the main frame 21, respectively. A pair of pillar parts 23 may support the main frame 21 .

In addition, the present jig structure 2 may include a lower frame 24 . The lower frame 24 may extend from the lower side of the panel 9 toward one side and the other side of the panel 9 . In addition, each of one end and the other end of the lower frame 24 may be connected to each of the pair of pillar parts 23 . In addition, the jig structure 2 may include a plurality of lower jig units 25 provided on the lower frame 24 at intervals to grip the lower portion of the panel 9 . The lower jig unit 25 can grip or release the panel 9 . Since the lower jig unit 25 corresponds to the upper jig unit 22, a detailed description thereof will be omitted.

Due to the gripping of the panel by the upper jig unit 22 and the lower jig unit 25, the upper and lower ends of the panel are fixed to prevent shaking. Also, by removing the guides, there may be no guide marks in the panel. In addition, since the shaking of the panel 9 is improved, there may be no deviation between the front and rear surfaces of the panel 9, and warping of the panel 9 and tearing of the panel 9 may be improved.

Also, this jig structure 2 can support one panel 9 .

The present jig structure 2 includes a sacrificial electrode 3 disposed on one side pillar part 23 of a pair of pillar parts 23 . The sacrificial electrode 3 may be metal.

In addition, the present application provides a jig device according to an embodiment of the present application. A jig device according to an embodiment of the present application may include a plurality of the jig structures 2 described above. A sacrificial electrode 3 is provided on one side pillar 23 of the present jig structure 2 having the jig structure 2 adjacent to one side.

Hereinafter, a plating method (hereinafter, referred to as 'this first plating method') according to an embodiment of the present application will be described.

The first plating method uses the above-described apparatus, and shares the same or corresponding technical features and configurations as the above-described apparatus, the present jig structure, and the jig apparatus according to an embodiment of the present application. Therefore, descriptions overlapping with those described above will be simplified or omitted, and the same reference numerals will be used for the same or similar components.

5 is a schematic flow chart of a plating method according to an embodiment of the present disclosure.

Referring to FIG. 5 , the first plating method includes plating using the plating device (step S100). In step S100, the present plating apparatus includes a plating bath 1. The plating bath 1 is opened upward and has an inner space 11 in which the panel 9 can be accommodated, and the plating liquid is accommodated in the inner space 11 so that the panel 9 can be immersed in the plating liquid.

Further, this plating apparatus includes a jig structure 2 supporting the panel 9 in the inner space 11 . The jig structure 2 can support one panel 9 .

In addition, the present plating apparatus includes a sacrificial electrode 3 disposed on one side of the jig structure 2 . The sacrificial electrode 3 may be metal. In addition, the sacrificial electrode 3 may be provided to prevent the plating thickness of at least a portion of the edge portion of one side of the panel 9 from being thicker than a predetermined range compared to the plating thickness of the central portion of the panel. In addition, the sacrificial electrode is alternately plated to reduce the plating thickness of at least a portion of the edge portion of one side of the panel 9 compared to the case where the sacrificial electrode is not disposed.

In addition, when a plurality of jig structures 2 are provided, the sacrificial electrode 3 may be disposed between the jig structure 2 and the jig structure 2 adjacent to one side of the jig structure 2 .

Also, referring to FIG. 5 , the first plating method may include recovering the metal plated on the sacrificial electrode 3 (S300). As described above, in step S100, metal may be plated on the sacrificial electrode 3, and in step S300, the metal plated on the sacrificial electrode 3 may be recovered, and the recovered metal may be used for another panel 9. Can be used for plating.

Hereinafter, a plating method (hereinafter referred to as 'this second plating method') according to another embodiment of the present application will be described.

The second plating method uses the above-described apparatus, and shares the same or corresponding technical characteristics and configurations as the above-described apparatus, the present jig structure, and the jig apparatus according to an embodiment of the present application. Therefore, descriptions overlapping with those described above will be simplified or omitted, and the same reference numerals will be used for the same or similar components.

6 is a schematic flow chart of a plating method according to another embodiment of the present application.

Referring to FIG. 6 , the second plating method includes preparing a jig structure 2 supporting the panel 9 and having the sacrificial electrode 3 (S100).

Also, referring to FIG. 6 , the second plating method includes mounting the panel 9 on the jig structure 2 (S300). In step S300 , the panel 9 may be mounted on the jig structure 2 so that the upper jig unit 22 grips the upper portion of the panel 9 . At this time, the lower portion of the panel 9 may be gripped by the lower jig unit 25 . Accordingly, the panel 9 is mounted on the jig structure 2 and the panel 9 can be supported by the jig structure 2 .

Also, referring to FIG. 6 , the second plating method includes a step of immersing the jig structure 2 on which the panel 9 is mounted in the plating bath 1 (S500). The plating bath 1 is opened upward and has an inner space 11 in which the panel 9 can be accommodated, and the plating solution is accommodated in the inner space 11 . In step S500 , the jig structure 2 may be immersed in the plating bath 1 so that the entire panel 9 mounted on the jig structure 2 is immersed in the plating solution of the plating bath 1 .

Further, referring to FIG. 6 , the second plating method includes a step of plating the panel 9 by applying a voltage to the jig structure 2 immersed in the plating bath 1 (S700). To this end, the jig structure 2 may be provided so that a voltage can be applied so that the metal ions of the entire plating solution can be plated on the panel 9 . In addition, since the sacrificial electrode 3 is provided in the jig structure 2 at step S700, the deviation of the plating thickness in the plane direction of the front or rear surface of the panel 9 can be formed within a range that is not judged to be defective.

Also, the second plating method may include recovering the metal plated on the sacrificial electrode 3 . As described above, in step S700, metal may be plated on the sacrificial electrode 3, and in the step of recovering the metal, the plated metal may be recovered on the sacrificial electrode 3, and the recovered metal may be used for other panels ( 9) can be used for plating.

The above description of the present application is for illustrative purposes, and those skilled in the art will understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present application. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present application is indicated by the following claims rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts thereof should be construed as being included in the scope of the present application.

1: plating bath
2: jig structure
21: main frame
22: upper jig unit
23: column part
24: lower frame
25: upper jig unit
3: sacrificial electrode
9: panel

Claims (9)

a plating tank that is open upward and has an inner space in which a panel can be accommodated, and a plating solution is accommodated in the inner space so that the panel can be immersed in the plating solution;
a plurality of jig structures supporting the panel in the inner space; and
Including a sacrificial electrode disposed on one side of the jig structure,
The jig structure supports one panel,
A plurality of jig structures supporting the one panel are provided, and the sacrificial electrode is formed such that a gap between the sacrificial electrode and the panel is smaller than a gap between the panel and a panel supported by a neighboring jig structure. and a plating apparatus disposed between a jig structure adjacent to one side of the jig structure. According to claim 1,
Wherein the sacrificial electrode is provided to prevent the plating thickness of one edge portion of the panel from being thicker than a predetermined range compared to the plating thickness of the central portion of the panel. According to claim 1,
Wherein the sacrificial electrode is alternately plated to reduce the plating thickness of one edge portion of the panel when the sacrificial electrode is not disposed. According to claim 1,
Wherein the sacrificial electrode is metal. delete delete delete delete In the jig device,
A main frame supporting one panel and extending in one side and the other side of the panel, a plurality of jig units provided at intervals on the main frame and capable of gripping the upper part of the panel, and provided on one side and the other side of the main frame, respectively. It includes a plurality of jig structures including a pair of pillar parts coupled to one end and the other end of the main frame and a sacrificial electrode provided on one pillar part of the pair of pillar parts,
The sacrificial electrode is between the jig structure and one neighboring jig structure on one side of the jig structure so that the distance between the sacrificial electrode and the panel is smaller than the distance between the panel and the panel supported by the neighboring jig structure. placed in,
The jig device, wherein the sacrificial electrode is provided on the one side pillar portion of the jig structure having a jig structure adjacent to one side.

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