KR102485863B1 - Transpatent substrate having multilayer thin film coating - Google Patents

Abstract

According to one embodiment of the present invention, a transparent substrate provided with a multilayer thin film coating is provided. According to one embodiment of the present invention, the multilayer thin film coating includes a first dielectric layer, a reflective layer, and a second dielectric layer in a direction away from the transparent substrate, and the reflective layer may be formed of a metal-based high refractive index layer.

Description

Transparent substrate with multi-layer thin film coating {TRANSPATENT SUBSTRATE HAVING MULTILAYER THIN FILM COATING}

The present invention relates to a transparent substrate equipped with a multilayer thin film coating having improved color and corrosion resistance, and more particularly, by forming a high refractive index reflective layer in the multilayer thin film coating to realize a desired color clearly and appropriately protecting the upper and lower surfaces of the reflective layer It relates to a transparent substrate configured to supplement corrosion resistance by positioning a layer.

Reflective glass is a translucent glass that reduces transparency by lowering visible light transmittance and increasing reflectance, and is widely used in glass covers of electronic products because it can provide aesthetic sense through colors implemented in translucent glass.

Since aesthetics is considered an important factor in reflective glass compared to other glass products, it is very important to accurately implement a desired color on glass by adjusting transmittance or reflectance.

As a representative method of implementing color in reflective glass, a method of forming a thin film layer including a reflective metal material such as silver (Ag) or aluminum (Al) on a transparent substrate may be considered.

However, a thin film layer formed of a reflective metal material is vulnerable to corrosion by external moisture or chemicals, so a separate protective film is essential. There is a difficult problem to fundamentally block.

As a method to solve this problem, a method of depositing a silicon nitride (SiNx) thin film layer instead of the above-described reflective metal thin film layer to impart reflective and translucent characteristics to glass has been proposed.

However, since silicon nitride has a characteristic in which the transmitted color changes sensitively according to the amount of nitrogen gas injected into the chamber during deposition, it is difficult to accurately implement the desired color on the glass, and the transmitted color is dark in the region of the highest reflection efficiency. It has a strong tendency to shift to yellow, so it is easy to implement bronze or yellow products, but there is a problem that it is not suitable for implementing gray colors, etc., which are preferred for glass doors of electronic products.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide a transparent substrate configured to prevent degradation of corrosion resistance while clearly implementing a desired color.

Representative configurations of the present invention for achieving the above object are as follows.

According to one embodiment of the present invention, a transparent substrate provided with a multilayer thin film coating is provided. According to one embodiment of the present invention, the multilayer thin film coating includes a first dielectric layer, a reflective layer, and a second dielectric layer in a direction away from the transparent substrate, and the reflective layer may be formed of a metal-based high refractive index layer.

According to one embodiment of the present invention, the reflective layer may include amorphous silicon (Si), zirconium (Zr), or an alloy thereof.

According to one embodiment of the present invention, the reflective layer may be doped with aluminum (Al).

According to an embodiment of the present invention, the reflective layer may include at least two reflective layers having different complex refractive index patterns.

According to one embodiment of the present invention, the reflective layer includes a first reflective layer and a second reflective layer, and at least one of the first reflective layer and the second reflective layer may include a silicon-zirconium alloy.

According to an embodiment of the present invention, one of the first reflective layer and the second reflective layer may include amorphous silicon (Si), and the other of the first reflective layer and the second reflective layer may include a silicon-zirconium (SiZr) alloy. can

According to an embodiment of the present invention, the first reflective layer and the second reflective layer may be doped with aluminum (Al).

According to one embodiment of the present invention, the first reflective layer may have a refractive index of 3.5 to 4.5 at a wavelength of 550 nm, and the second reflective layer may have a refractive index of 3.2 to 4.2 at a wavelength of 550 nm.

According to one embodiment of the present invention, the total physical thickness of the reflective layer may be 6 nm to 30 nm.

According to one embodiment of the present invention, a protective layer for protecting the reflective layer may be provided on at least one of the upper and lower surfaces of the reflective layer.

According to an embodiment of the present invention, a lower protective layer may be formed in contact with a lower surface of the reflective layer, and an upper protective layer may be formed in contact with an upper surface of the reflective layer.

According to one embodiment of the present invention, the lower passivation layer and the upper passivation layer may be formed to have a physical thickness of 1 nm to 5 nm, respectively.

According to an embodiment of the present invention, the lower protective layer and the upper protective layer may include one or more metals or alloys of nickel (Ni), chromium (Cr), titanium (Ti), and niobium (Nb). .

According to one embodiment of the present invention, the lower protective layer and the upper protective layer may include a nickel-chromium (NiCr) alloy.

According to an embodiment of the present invention, the first dielectric layer and the second dielectric layer include a metal nitride, and the metal included in the metal nitride is silicon (Si), aluminum (Al), titanium (Ti), and zirconium (Zr). It may be one or more types or alloys thereof.

According to one embodiment of the present invention, the first dielectric layer may be formed to a physical thickness of 5 nm to 30 nm, and the second dielectric layer may be formed to a physical thickness of 15 nm to 40 nm.

According to one embodiment of the present invention, the multilayer thin film coating may further include a light absorbing layer that absorbs light of a specific wavelength.

According to one embodiment of the present invention, the light absorption layer may include niobium nitride (NbN).

According to one embodiment of the present invention, the light absorption rate of the non-coated surface of the transparent substrate provided with the multilayer thin film coating may be 30% to 60%.

According to one embodiment of the present invention, the reflectance of the non-coated surface of the transparent substrate provided with the multilayer thin film coating may be 20% or more.

According to one embodiment of the present invention, the transmittance of the transparent substrate provided with the multilayer thin film coating may be 50% or less.

According to one embodiment of the present invention, the transmission color of the transparent substrate provided with the multilayer thin film coating may be -5 to +5 in a* and -5 to +10 in b* in the CIE L*a*b* color space. there is.

According to one embodiment of the present invention, the reflection color of the non-coated surface of the transparent substrate provided with the multilayer thin film coating is a* of -5 to +5 and b* is -10 to +5 in the CIE L*a*b* color space. may be 10

In addition to this, the transparent substrate provided with the multilayer thin film coating according to the present invention may further include other additional configurations within a range that does not impair the technical spirit of the present invention.

A transparent substrate with a multilayer thin film coating according to an embodiment of the present invention includes a reflective layer formed of a metal-based high refractive index layer within the multilayer thin film coating, so that a desired color can be clearly implemented on the transparent substrate through the high refractive index reflective layer. there will be

Specifically, the transparent substrate having a multilayer thin film coating according to an embodiment of the present invention shows a relatively even absorption wavelength band in the visible ray region and forms a reflective layer to include amorphous silicon and/or silicon zirconium having a relatively high refractive index. Since it is configured to impart reflective and translucent properties to the transparent substrate, it is possible to more clearly form a desired color on the transparent substrate while effectively suppressing the occurrence of yellow shift.

In addition, the transparent substrate having a multi-layer thin film coating according to an embodiment of the present invention is configured such that protective layers are formed on the upper and lower surfaces of the reflective layer, so that the characteristics of the reflective layer can be prevented from being changed during deposition of the thin film layer or during strengthening of heat treatment. As a result, it is possible to prevent a change in color implemented on the transparent substrate or a decrease in durability.

In addition, the transparent substrate equipped with a multilayer thin film coating according to an embodiment of the present invention more accurately implements the desired color on the transparent substrate by controlling the thickness of the reflective layer, which is the core of color implementation, or the protective layer protecting it within a predetermined range. And it is possible to further improve the mechanical and chemical properties of the transparent substrate and the multilayer thin film coating.

1 illustratively shows a cross-sectional structure of a transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention.
2 illustratively shows a cross-sectional structure of a transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention. (Embodiment in which protective layers are provided above and below the reflective layer)
3 illustratively illustrates a cross-sectional structure of a transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention. (Embodiment in which the reflective layer is formed of a plurality of reflective layers)
4 illustratively illustrates a cross-sectional structure of a transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention. (Embodiment in which a light absorption layer is additionally provided in the multilayer thin film coating)
5 illustratively illustrates optical properties of amorphous silicon and silicon zirconium that may be included in a reflective layer in a transparent substrate having a multilayer thin film coating according to an embodiment of the present invention. [In FIG. 5, (a) shows the optical properties of amorphous silicon and (b) shows the optical properties of silicon zirconium]
6 illustratively illustrates transmission and reflection characteristics of amorphous silicon and silicon zirconium that may be included in a reflective layer in a transparent substrate having a multilayer thin film coating according to an embodiment of the present invention.

The embodiments described below are exemplified for the purpose of explaining the technical idea of the present invention, and the scope of the present invention is not limited to the embodiments or specific description thereof presented below.

All technical terms and scientific terms used in this specification have meanings commonly understood by those of ordinary skill in the art to which the present invention belongs, unless defined otherwise, and all terms used in this specification represent the present invention. It is selected for the purpose of more clearly explaining, and is not selected to limit the scope of the present invention.

Expressions such as "comprising," "including," "having," and the like used herein are open-ended terms that imply the possibility of including other embodiments unless otherwise stated in the phrase or sentence in which the expression is included. -ended terms).

Singular expressions described in this specification may include plural meanings unless otherwise stated, and this applies equally to singular expressions written in the claims.

In this specification, when a component is referred to as being "located" or "formed" on one side of another component, this means that a component is positioned or formed in direct contact with one side of another component, Or it should be understood that it can be positioned or formed with other new components interposed therebetween.

As used herein, direction indicators such as "downward" and "lower" mean a direction toward the transparent substrate in the accompanying drawings, and direction indicators such as "upper" and "upper" indicate the opposite direction (ie, the transparent substrate). direction away from ).

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the present invention will be described in detail so that those skilled in the art can easily practice it. In the accompanying drawings, identical or corresponding components are indicated by the same reference numerals, and overlapping description of identical or corresponding components in the description of the following embodiments may be omitted. However, even if a description of a specific component is omitted in the description below, this does not mean that the component is not included in the embodiment.

Referring to FIGS. 1 to 4 , a cross-section laminated structure of a transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention is illustrated as an example. As will be described later, the transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention provides a desired color to the transparent substrate by placing one or more reflective layers having predetermined refractive index characteristics on the multilayer thin film coating, and upper and lower portions of the reflective layer It is characterized in that it is configured to form a protective layer to prevent the characteristics of the reflective layer from being altered or the durability of the coating layer from being lowered.

According to one embodiment of the present invention, the transparent substrate 100 may be formed of a hard inorganic material or polymer organic material, for example, it may be formed of a normal glass substrate such as soda lime glass.

According to one embodiment of the present invention, the multilayer thin film coating 200 is formed in a structure in which a plurality of thin film layers are stacked on the transparent substrate 100 to perform a function of imparting various optical and chemical properties required for the transparent substrate. can For example, the multilayer thin film coating 200 may be configured to be deposited and formed on the transparent substrate 100 using a physical vapor deposition (PVD) process such as a sputtering process.

According to one embodiment of the present invention, the thin film multilayer coating 200, as shown in the drawing, the first dielectric layer 210, the reflective layer 230, the second dielectric layer 250 in a direction away from the transparent substrate 100 can be configured to include

According to one embodiment of the present invention, the dielectric layer (in the case of the embodiment shown in the drawing, the first dielectric layer 210 and the second dielectric layer 250) prevents the reflection of light having a wavelength in the visible ray region and affects the reflected light. It can perform the function of removing interference or scattering by the coating layer and protecting the coating layer from moisture or foreign substances.

According to one embodiment of the present invention, each dielectric layer (in the case of the embodiment shown in the drawing, the first dielectric layer 210 and the second dielectric layer 250) is formed of one or more thin film layers or a structure in which a plurality of thin film layers are stacked. can be formed as

According to one embodiment of the present invention, the dielectric layer (in the case of the embodiment shown in the drawing, the first dielectric layer 210 and the second dielectric layer 250) may include a metal oxide, a metal nitride, a metal oxynitride, or the like, , The metal included in the dielectric layer may be one or more of silicon (Si), aluminum (Al), titanium (Ti), and zirconium (Zr) or an alloy thereof.

For example, according to a preferred embodiment of the present invention, the dielectric layers (first dielectric layer 210 and second dielectric layer 250) may be formed to include metal nitride, particularly silicon nitride (eg, Si ₃ N ₄ ), The dielectric layer may be formed in a doped state with zirconium (Zr) and/or aluminum (Al).

According to one embodiment of the present invention, as shown in the drawing, it may be preferable that the dielectric layer is provided on both the lower and upper portions of the reflective layer 230, and the thickness of the dielectric layer is half the thickness of the reflective layer while performing a protective function for the reflective layer. Contemplation can be set to an appropriate range that can be adjusted according to intention.

For example, when the thickness of the dielectric layer is adjusted, a phase difference occurs at each wavelength in the visible ray region due to a path difference due to a change in thickness, and constructive interference or destructive interference occurs for each wavelength accordingly, so the physical thickness of the dielectric layer is intervened. It may be appropriately set in consideration of protection for the reflective layer and/or color to be implemented.

According to one embodiment of the present invention, the first dielectric layer 210 located below the reflective layer 230 is formed to have a physical thickness of 5 nm to 30 nm, and the upper dielectric layer 270 located above the reflective layer 230 is It may be formed with a physical thickness of 15 nm to 40 nm.

If the physical thickness of the first dielectric layer 210 is less than 5 nm, it is difficult to ensure sufficient adhesion between the first dielectric layer 210 and the transparent substrate 100, and the physical thickness of the first dielectric layer 210 is less than 30 nm. If it is formed in excess, a problem of deterioration of the reflectance characteristics of the non-coated surface may occur, and if the physical thickness of the second dielectric layer 250 is formed to be less than 15 nm, it is difficult to faithfully protect the reflective layer located below, and the second dielectric layer 250 If the physical thickness exceeds 40 nm, there is a risk of surface peeling or the like occurring during the heat treatment process due to stress concentration. Therefore, it may be preferable that the physical thickness of the dielectric layer is formed within a controlled range as described above.

According to one embodiment of the present invention, the reflective layer 230 performs a function of imparting a desired color to the transparent substrate, and may be formed of a high refractive index layer capable of imparting appropriate reflective and translucent characteristics to the transparent substrate.

According to one embodiment of the present invention, the reflective layer [230; In the case of the embodiment shown in the drawing, the first reflective layer 232 and the second reflective layer 234] may be formed of a metal layer having a predetermined refractive index characteristic at a wavelength of 550 nm.

Specifically, according to one embodiment of the present invention, the reflective layer 230 may be configured to include amorphous silicon (Si), zirconium (Zr), or an alloy thereof. For example, according to a preferred embodiment of the present invention, the reflective layer 230 may include amorphous silicon (Si) and/or silicon zirconium (SiZr).

In this regard, referring to FIGS. 5 and 6 , the optics of amorphous silicon (Si) and silicon zirconium (SiZr) that may be included in the reflective layer 230 in a transparent substrate having a multilayer thin film coating according to an embodiment of the present invention. Characteristics are shown by way of example.

As shown in FIG. 5, since amorphous silicon (Si) and silicon zirconium (SiZr) exhibit relatively high refractive indices in the visible light region (e.g., amorphous silicon (Si) and silicon zirconium (SiZr) at a wavelength of 550 nm) represents a refractive index of about 4.1 and 3.8, respectively], when the reflective layer is formed using amorphous silicon (Si) and/or silicon zirconium (SiZr) like the transparent substrate according to an embodiment of the present invention, a reflective layer with high reflective efficiency is obtained. formation can be possible.

However, as shown in FIG. 5, amorphous silicon (Si) has an absorption region mainly concentrated in blue, whereas silicon zirconium (SiZr) has a more neutral absorption region evenly distributed over the entire visible ray wavelength range. Since silicon zirconium (SiZr) can exhibit absorptive properties, inclusion of silicon zirconium (SiZr) in the reflective layer may be more advantageous in forming a desired color, particularly a neutral color or gray color, compared to amorphous silicon (Si).

On the other hand, referring to FIG. 6, the results of depositing a thin film layer containing amorphous silicon (Si) and a thin film layer containing silicon zirconium (SiZr) to a thickness of 5.0 nm, respectively, and then testing their transmission and reflection characteristics are shown. there is.

Specifically, as disclosed in FIG. 6 and [Table 1] below, both the case of forming a thin film layer containing amorphous silicon (Si) and the case of forming a thin film layer containing silicon zirconium (SiZr) on a transparent substrate. It can be seen that the non-coated surface (glass surface) shows a similar reflective color, and the thin film layer containing silicon zirconium (SiZr) shows less yellow shift and more neutral color than the thin film layer containing amorphous silicon (Si) can confirm.

thickness (nm) permeation non-coated surface reflection % a* b* % a* b* Si thin layer 5.0 53 2.5 15.8 17 -2 -One SiZr thin layer 5.0 43 0.8 3.2 14 -One -2

According to an embodiment of the present invention, the reflective layer 230 may be formed by stacking a plurality of thin film layers having different complex refractive index patterns. For example, according to one embodiment of the present invention, the reflective layer 230 includes, for example, a first reflective layer 232 including amorphous silicon (Si) and a second reflective layer including silicon zirconium (SiZr), as shown in FIG. 3 . 234 may be configured to be formed by stacking.

However, in the transparent substrate provided with a multi-layer thin film coating according to an embodiment of the present invention, the reflective layer 230 does not have to be formed in a structure in which two thin film layers are stacked as shown in FIG. 3, but formed as a single thin film layer. Or it may be formed in a structure in which three or more thin film layers are stacked.

According to an embodiment of the present invention, the reflective layer 230 may preferably have a total physical thickness of 6 nm to 30 nm, and may be formed in an aluminum (Al) doped state.

If the physical thickness of the reflective layer 230 is formed to be less than 6 nm, the non-coated surface reflectance characteristics may deteriorate, and if the physical thickness of the reflective layer 230 is formed to exceed 30 nm, the transmitted color is CIE L Since it may have a b* value exceeding 10 in the *a*b color space, it may be preferable that the physical thickness of the reflective layer 230 is within the aforementioned range.

In addition, as described above, when the reflective layer 230 is formed in a structure in which the first reflective layer 232 containing amorphous silicon (Si) and the second reflective layer 234 containing silicon zirconium (SiZr) are stacked, A ratio (t1/t2) between the physical thickness t1 of the first reflective layer and the physical thickness t2 of the second reflective layer may be in the range of 0.5 to 1.5.

If the physical thickness t1 of the first reflective layer is formed to be thicker than the physical thickness t2 of the second reflective layer, it may be advantageous to increase the reflectance. If it is formed too thick compared to t2), there is a risk of yellow shift in the transmitted color, and if the physical thickness (t2) of the second reflective layer is formed thicker than the physical thickness (t1) of the first reflective layer, neutral color can be realized. However, if the physical thickness t2 of the second reflective layer is too thick compared to the physical thickness t1 of the first reflective layer, the overall reflectance may decrease. The physical thickness t2 of the two reflective layers may be preferably formed to have the above-described predetermined ratio.

On the other hand, when the aforementioned reflective layer 230 is formed by directly contacting a dielectric layer formed of metal nitride or metal oxide, the reflective layer 230 is nitrided or oxidized during a deposition process or a heat treatment process. There is a concern that the characteristics may be altered, and accordingly, the desired transmittance, reflectance, transmitted color, and reflected color may not be accurately implemented by the reflective layer 230 .

In order to prevent this problem, the transparent substrate having a multilayer thin film coating according to an embodiment of the present invention may be configured to include a protective layer on top and/or bottom of the reflective layer 230 .

For example, in the transparent substrate provided with the multilayer thin film coating according to an embodiment of the present invention, the first protective layer 220 is formed by contacting the lower surface of the reflective layer 230 in the multilayer thin film coating 200, and the reflective layer 230 The upper surface of the second protective layer 240 may be configured to be formed in contact with.

According to one embodiment of the present invention, the protective layer (in the case of the embodiment shown in the drawing, the first protective layer 220 and the second protective layer 240) may perform a stable protective function for the reflective layer 230. Nickel (Ni), chromium (Cr), titanium (Ti), niobium (Nb), or one or more metals or alloys thereof, preferably including a nickel-chromium (NiCr) alloy. can be configured to

According to one embodiment of the present invention, the protective layer (first protective layer 220 and second protective layer 240) may be formed to have a physical thickness of 1 nm to 5 nm, respectively. If the protective layer is formed too thick in the multilayer thin film coating 200 deposited on the transparent substrate 100, it may cause deterioration of the optical properties of the transparent substrate, and conversely, if the protective layer is formed too thin, the protective function for the reflective layer Since this cannot be guaranteed, it may be desirable that the thickness of the protective layer is appropriately controlled within a predetermined range as described above.

Referring to [Table 2] below, test data for confirming the function of the protective layer positioned above and below the reflective layer in the transparent substrate provided with the multilayer thin film coating according to one embodiment of the present invention is exemplarily disclosed. .

lower protective layer upper protective layer Color difference before and after enhancement (ΔE) acid resistance alkali resistance moisture resistance
(ΔE) permeation reflect Comparative Example 1 - - 8.5 5.4 ○ ○ 5.1 Comparative Example 2 - - 10.4 6.2 × × 9.3 Example 1 0.5 0.5 5.3 4.5 ○ ○ 2.5 Example 2 One One 4.1 3.8 ○ ○ 1.8

In the test data disclosed in [Table 2], Comparative Example 1 formed a multilayer thin film coating with a reflective layer positioned between dielectric layers containing silicon nitride (Si ₃ N ₄ ), and Comparative Example 2 formed a multilayer thin film coating with titanium oxide (TiO ₂ ) Forming a multilayer thin film coating in a state in which a reflective layer is positioned between dielectric layers including, and Examples 1 and 2 according to an embodiment of the present invention are between dielectric layers including silicon nitride (Si ₃ N ₄ ) After placing the reflective layer and forming a multilayer thin film coating (refer to the laminated structure of FIG. 2) with a protective layer containing a nickel-chromium (NiCr) alloy interposed between the dielectric layer and the reflective layer, a test was performed.

Specifically, when the color change was observed after heat treatment of the transparent substrates of Comparative Examples and Examples formed as above at 650 ° C. for 10 minutes, as shown in [Table 2], in Comparative Example 1, a transmission color difference of 8.5 and a reflection color difference of 5.4 were observed. In Comparative Example 2, a transmission color difference of 10.4 and a reflection color difference of 6.2 occurred, whereas in Example 1, a transmission color difference of 5.3 and a reflection color difference of 4.5 occurred, and in Example 2, a transmission color difference of 4.1 and a reflection color difference of 3.8 occurred. It was found that a protective layer was formed on the top and bottom of the reflective layer, and it could be confirmed that the color difference could be suppressed during the heat treatment process. Comparing Example 1 and Example 2, the thicker the protective layer, the color difference. It can be seen that shows a decreasing trend.

In addition, when the transparent substrates of Comparative Examples and Examples were immersed in a 5% HCl solution at room temperature and then corrosion was observed, in Comparative Example 2, corrosion was observed on both the edge and the surface, whereas according to an embodiment of the present invention In Examples 1 and 2, it can be confirmed that excellent acid resistance is exhibited.

Next, when the transparent substrates of Comparative Examples and Examples were immersed in a 5% NaOH solution at room temperature and then corrosion was observed, in the case of Comparative Example 2, corrosion was observed on both the edge and the surface, similar to acid resistance, whereas the present invention In Example 1 and Example 2 according to one embodiment of the fact that exhibits excellent alkali resistance can be confirmed.

Finally, the transparent substrates of Comparative Examples and Examples were stored in a chamber at RH 100% and 40 ° C., and then the color difference was observed to check the moisture resistance. Comparative Examples 1 and 2 had high values of 5.1 and 9.3 respectively On the other hand, in Example 1 and Example 2 according to an embodiment of the present invention, low color differences of 2.5 and 1.8 levels occurred, respectively, and it can be confirmed that a large difference in moisture resistance appears depending on the presence or absence of the protective layer. It can be seen that the moisture resistance tends to improve as the thickness of the protective layer increases.

That is, referring to the test data disclosed in [Table 2], protective layers [lower protective layer 220 and upper When the protective layer 240] is formed, it is possible to prevent color difference or decrease in durability of the reflective layer 230 in a high-temperature or high-humidity environment where heat treatment is performed, thereby providing a desired color to the transparent substrate. You can check that it can be implemented correctly.

Meanwhile, according to one embodiment of the present invention, the multilayer thin film coating 200 deposited on the transparent substrate 100 may additionally include a light absorption layer 260 (see FIG. 4 ).

According to an embodiment of the present invention, the light absorbing layer 260 may include a metal material, an oxide of a metal material, a nitride of a metal material, an oxynitride of a metal material, preferably a nitride of a metal material, and the light absorbing layer ( 260) may be appropriately selected according to a color to be implemented on the transparent substrate. For example, according to one embodiment of the present invention, the light absorption layer 260 may be configured to include niobium nitride (NbN) for additional color control.

However, the light absorption layer 260 does not have to be formed to be positioned between the second dielectric layer and the upper protective layer, as shown in FIG. 4, and may be positioned at various arbitrary positions within the multilayer thin film coating 200. .

In addition, although not shown in the embodiment shown in the drawings, the transparent substrate according to one embodiment of the present invention has an overcoat layer and/or a light guide paint layer added thereon to improve surface properties and more stably protect the coating layer. can be provided with

According to the structure described above, the transparent substrate provided with the multilayer thin film coating according to an embodiment of the present invention can exhibit improved optical and chemical properties compared to the prior art due to the reflective layer, functional layer, and dielectric layer structure included in the multilayer thin film coating. there will be For example, the transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention has an uncoated surface light absorption of 30% to 60% (glass surface light absorption), an uncoated surface reflectance of 20% or more (glass surface reflectance), 50% The following transmittance, transmittance color with a* of -5 to +5 and b* of -5 to +10, reflection color of uncoated surface with a* of -5 to +5 and b* of -10 to +10 (Glass surface reflection color).

Although the present invention has been described with specific details and limited examples, such as specific components, these examples are provided only to help a more general understanding of the present invention, and the present invention is not limited thereto, and the present invention is not limited thereto. Those skilled in the art can make various modifications and variations from these descriptions.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments and should not be determined, and all things equivalent or equivalently modified in the claims as well as the claims described below belong to the scope of the spirit of the present invention. something to do.

100: transparent substrate
200: multi-layer thin film coating
210: first dielectric layer
220: lower protective layer
230: reflective layer
232: first reflective layer
234: second reflective layer
240: upper protective layer
250: second dielectric layer
260: light absorption layer

Claims (24)

A transparent substrate 100 equipped with a multilayer thin film coating 200,
The multilayer thin film coating 200 includes a first dielectric layer 210, a reflective layer 230 and a second dielectric layer 250 in a direction away from the transparent substrate 100,
The reflective layer 230 is formed of a metal-based high refractive index layer,
The reflective layer 230 includes a first reflective layer 232 and a second reflective layer 234 having different complex refractive index patterns,
At least one of the first reflective layer 232 and the second reflective layer 234 includes a silicon-zirconium (SiZr) alloy,
transparent substrate. delete delete delete delete According to claim 1,
One of the first reflective layer 232 and the second reflective layer 234 includes amorphous silicon (Si),
The other one of the first reflective layer 232 and the second reflective layer 234 includes a silicon-zirconium (SiZr) alloy,
transparent substrate. According to claim 6,
The first reflective layer 232 and the second reflective layer 234 are doped with aluminum (Al),
transparent substrate. According to claim 6,
The first reflection layer 232 has a refractive index of 3.5 to 4.5 at a wavelength of 550 nm,
The second reflective layer 234 has a refractive index of 3.2 to 4.2 at a wavelength of 550 nm,
transparent substrate. According to claim 8,
The ratio (t1 / t2) between the physical thickness (t1) of the first reflective layer 232 and the physical thickness (t2) of the second reflective layer 234 is 0.5 to 1.5,
transparent substrate. According to claim 1,
The total physical thickness of the reflective layer 230 is 6 nm to 30 nm,
transparent substrate. According to claim 1,
At least one of the upper and lower surfaces of the reflective layer 230 is provided with a protective layer for protecting the reflective layer 230,
transparent substrate. According to claim 11,
A lower protective layer 220 is formed in contact with the lower surface of the reflective layer 230,
An upper protective layer 240 is formed in contact with the upper surface of the reflective layer 230,
transparent substrate. According to claim 12,
The lower protective layer 220 and the upper protective layer 240 are formed to a physical thickness of 1 nm to 5 nm, respectively.
transparent substrate. According to claim 13,
The lower protective layer 220 and the upper protective layer 240 include one or more metals or alloys of nickel (Ni), chromium (Cr), titanium (Ti), and niobium (Nb),
transparent substrate. According to claim 14,
The lower protective layer 220 and the upper protective layer 240 include a nickel-chromium (NiCr) alloy,
transparent substrate. According to claim 15,
The first dielectric layer 210 and the second dielectric layer 250 include a metal nitride,
The metal included in the metal nitride is one or more of silicon (Si), aluminum (Al), titanium (Ti) and zirconium (Zr) or an alloy thereof,
transparent substrate. According to claim 16,
The first dielectric layer 210 is formed to a physical thickness of 5 nm to 30 nm,
The second dielectric layer 250 is formed to a physical thickness of 15 nm to 40 nm,
transparent substrate. According to claim 12,
The multilayer thin film coating 200 further includes a light absorbing layer 260 that absorbs light in a specific wavelength range.
transparent substrate. According to claim 18,
The light absorption layer 260 includes niobium nitride (NbN),
transparent substrate. The method of any one of claims 1 and 6 to 19,
The light absorption rate of the non-coated surface of the transparent substrate provided with the multilayer thin film coating is 30% to 60%,
transparent substrate. The method of any one of claims 1 and 6 to 19,
The non-coated surface reflectance of the transparent substrate equipped with a multilayer thin film coating is 20% or more,
transparent substrate. The method of any one of claims 1 and 6 to 19,
The transmittance of the transparent substrate provided with the multilayer thin film coating is 50% or less,
transparent substrate. The method of any one of claims 1 and 6 to 19,
The transmission color of the transparent substrate provided with the multilayer thin film coating is a* is -5 to +5 and b* is -5 to +10 in the CIE L*a*b color space,
transparent substrate. The method of any one of claims 1 and 6 to 19,
The reflection color of the non-coated surface of the transparent substrate equipped with a multilayer thin film coating has a* of -5 to +5 and b* of -10 to +10 in the CIE L*a*b color space,
transparent substrate.

Images