KR102455478B1 - 열전도 아크릴 시트, 이의 제조방법 및 이를 포함하는 배터리 모듈 - Google Patents
열전도 아크릴 시트, 이의 제조방법 및 이를 포함하는 배터리 모듈 Download PDFInfo
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- KR102455478B1 KR102455478B1 KR1020220007079A KR20220007079A KR102455478B1 KR 102455478 B1 KR102455478 B1 KR 102455478B1 KR 1020220007079 A KR1020220007079 A KR 1020220007079A KR 20220007079 A KR20220007079 A KR 20220007079A KR 102455478 B1 KR102455478 B1 KR 102455478B1
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- South Korea
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- heat
- thermally conductive
- acrylic sheet
- acrylic
- resin
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 131
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- 239000000203 mixture Substances 0.000 claims abstract description 56
- 239000004925 Acrylic resin Substances 0.000 claims description 50
- 229920000178 Acrylic resin Polymers 0.000 claims description 50
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 44
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 44
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 44
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
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- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
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- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- QKTWWGYCVXCKOJ-UHFFFAOYSA-N 2-methoxy-1-(2-methoxyphenyl)-2-phenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1OC QKTWWGYCVXCKOJ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
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- 150000008062 acetophenones Chemical class 0.000 description 1
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- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
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- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- NZYLTTOTIRRHQA-UHFFFAOYSA-N decyl-diethoxy-methylsilane Chemical compound CCCCCCCCCC[Si](C)(OCC)OCC NZYLTTOTIRRHQA-UHFFFAOYSA-N 0.000 description 1
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
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- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
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- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- HMDRAGZZZBGZJC-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine Chemical compound NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 HMDRAGZZZBGZJC-UHFFFAOYSA-N 0.000 description 1
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- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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Abstract
Description
도 2는 구현예에 따른 열전도 아크릴 시트의 제조방법을 나타낸 흐름도이다.
도 3은 구현예에 따른 열전도 아크릴 시트가 적용된 배터리 모듈을 나타낸 단면도이다.
도 4는 시험예 4에 따른 열전도 아크릴 시트의 DSC 분석 결과를 나타낸 것이다.
구분 | 실시예 1 | 실시예 2 | 실시예 3 | 실시예 4 | 실시예 5 | 실시예 6 |
무기 필러 (구상알루미나 입자) |
84 | 84 | 84 | 84 | 84 | 84 |
아크릴 수지 (3-A, 삼화) |
14.4 | 14.4 | 13.44 | 12.8 | 13.28 | 13.28 |
점착부여 수지 (이스트만社/산가 14 mgKOH/g, 연화점 101℃) |
1.6 | - | 1.12 | 1.6 | 1.12 | 1.6 |
점착부여 수지 (아라카와社/산가 2-10 mgKOH/g, 연화점 90-100℃) |
- | 1.6 | 1.44 | 1.6 | 1.6 | 1.12 |
합계(중량%) | 100 | 100 | 100 | 100 | 100 | 100 |
구분 | 비교예 1 | 비교예 2 |
실란 커플링제로 코팅되지 않은 무기 필러(구상알루미나 입자) |
- | 84 |
실란 커플링제로 코팅된 무기 필러(구상알루미나 입자) |
84 | - |
아크릴 수지(3-A, 삼화) | 16 | 16 |
합계(중량%) | 100 | 100 |
구분 | 점착력(kgf/cm) | 열전도도(W/mK) | 압축력(%) |
실시예 1 | 1.01 | 1.6 | 22 |
실시예 2 | 1.1 | 1.6 | 22 |
실시예 3 | 1.1 | 1.6 | 22 |
실시예 4 | 1.1 | 1.6 | 22 |
실시예 5 | 1.7 | 1.6 | 22 |
실시예 6 | 1.3 | 1.6 | 22 |
비교예 1 | 0.4 | 1.6 | 22 |
비교예 2 | 0.3 | 1.6 | 22 |
101: 하우징
102: 배터리 셀
103: 열전도 아크릴 시트
104: 완충 패드
105: 냉각핀
Claims (12)
- 아크릴 수지, 점착부여 수지, 실란 커플링제로 코팅된 무기 필러 및 광 개시제를 포함하는 열전도 아크릴 조성물로부터 제조되고,
상기 점착부여 수지는 서로 다른 산가를 가지는 2종의 수첨계 로진에스터를 포함하며,
점착력이 1 kgf/㎝ 이상인, 열전도 아크릴 시트.
- 제 1 항에 있어서,
상기 수첨계 로진에스터가 불포화 결합이 없고, 결합된 6원 고리 구조를 둘 이상 포함하며, 하나 이상의 작용기를 갖는 화합물을 포함하는, 열전도 아크릴 시트.
- 제 1 항에 있어서,
상기 수첨계 로진에스터는 산가가 2 내지 20 mgKOH/g이고 연화점이 80 내지 110 ℃인, 열전도 아크릴 시트.
- 제 3 항에 있어서,
상기 수첨계 로진에스터는 산가가 2 내지 10 mgKOH/g인 제1 수첨계 로진에스터와 산가가 11 내지 20 mgKOH/g인 제2 수첨계 로진에스터를 포함하는, 열전도 아크릴 시트.
- 제 4 항에 있어서,
상기 제1 수첨계 로진에스터와 상기 제2 수첨계 로진에스터의 혼합 비율이 1:0.5 내지 1:4의 중량비인, 열전도 아크릴 시트.
- 제 1 항에 있어서,
상기 아크릴 수지 및 상기 점착부여 수지의 총 중량을 기준으로 상기 점착부여 수지의 함량이 3 내지 30 중량%인, 열전도 아크릴 시트.
- 제 1 항에 있어서,
상기 아크릴 수지, 상기 점착부여 수지 및 상기 무기 필러의 총 중량을 기준으로 상기 무기 필러의 함량이 83 중량% 이상인, 열전도 아크릴 시트.
- 제 1 항에 있어서,
상기 열전도 아크릴 조성물이 침강 방지제를 더 포함하는, 열전도 아크릴 시트.
- 제 1 항에 있어서,
시차 주사 열량 측정에 의해 20 ℃/분의 승온 속도로 -100 ℃에서 300 ℃까지 승온시켰을 때에 얻어지는 1 회째 DSC 곡선에서 1개의 흡열 피크를 나타내며,
상기 흡열 피크를 나타내는 온도가 95 내지 105 ℃인, 열전도 아크릴 시트.
- 무기 필러 원료를 실란 커플링제로 코팅하고 분쇄하여 실란 커플링제로 코팅된 무기 필러를 준비하는 단계;
아크릴 수지와 점착부여 수지가 혼합된 수지 혼합물을 제조하는 단계;
상기 무기 필러와 상기 수지 혼합물을 혼합하여 분산액을 제조하는 단계;
상기 분산액에 침강 방지제를 혼합하여 분산 조액을 제조하는 단계;
상기 분산 조액에 광 개시제를 혼합하여 열전도 아크릴 조성물을 제조하는 단계; 및
상기 열전도 아크릴 조성물을 이형필름에 코팅하고 광경화시키는 단계를 포함하고,
상기 점착부여 수지는 서로 다른 산가를 가지는 2종의 수첨계 로진에스터를 포함하는, 열전도 아크릴 시트의 제조방법.
- 하우징; 배터리 셀; 및 열전도 아크릴 시트를 포함하고,
상기 열전도 아크릴 시트는 아크릴 수지, 점착부여 수지, 실란 커플링제로 코팅된 무기 필러 및 광 개시제를 포함하는 열전도 아크릴 조성물로부터 제조되고,
상기 점착부여 수지는 서로 다른 산가를 가지는 2종의 수첨계 로진에스터를 포함하며,
상기 열전도 아크릴 시트는 점착력이 1 kgf/㎝ 이상인, 배터리 모듈.
- 제 11 항에 있어서,
상기 열전도 아크릴 시트가 상기 배터리 모듈 내부의 하단부에 위치하는, 배터리 모듈.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011162586A (ja) * | 2010-02-04 | 2011-08-25 | Sekisui Chem Co Ltd | 両面粘着シート |
KR20110122144A (ko) * | 2009-01-30 | 2011-11-09 | 닛토덴코 가부시키가이샤 | 열전도성 점착제 조성물 및 열전도성 점착 시트 |
KR20120129531A (ko) * | 2011-05-20 | 2012-11-28 | 동우 화인켐 주식회사 | 열전도성 점착제 조성물 |
KR20170140693A (ko) | 2016-06-13 | 2017-12-21 | 주식회사 엘지화학 | 배터리 모듈 및 이를 포함하는 배터리 팩, 자동차 |
KR20210039121A (ko) * | 2019-10-01 | 2021-04-09 | 주식회사 엘지화학 | 열전도성 시트 조성물 및 열전도성 시트 |
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JP5812754B2 (ja) * | 2011-02-11 | 2015-11-17 | 日東電工株式会社 | 難燃性熱伝導性粘着シート |
JP6378533B2 (ja) * | 2013-06-01 | 2018-08-22 | 日東電工株式会社 | 熱伝導性粘着シート |
EP3425019A4 (en) * | 2016-03-02 | 2019-08-07 | JNC Corporation | COMPOSITION FOR HEAT REMOVAL ELEMENTS, HEAT EXTRACTION ELEMENT, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING A COMPOSITION FOR A HEAT REMOVAL ELEMENT, AND METHOD FOR PRODUCING A HEAT REMOVAL |
JP6807234B2 (ja) * | 2017-01-10 | 2021-01-06 | 日東電工株式会社 | 粘着シート |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110122144A (ko) * | 2009-01-30 | 2011-11-09 | 닛토덴코 가부시키가이샤 | 열전도성 점착제 조성물 및 열전도성 점착 시트 |
JP2011162586A (ja) * | 2010-02-04 | 2011-08-25 | Sekisui Chem Co Ltd | 両面粘着シート |
KR20120129531A (ko) * | 2011-05-20 | 2012-11-28 | 동우 화인켐 주식회사 | 열전도성 점착제 조성물 |
KR20170140693A (ko) | 2016-06-13 | 2017-12-21 | 주식회사 엘지화학 | 배터리 모듈 및 이를 포함하는 배터리 팩, 자동차 |
KR20210039121A (ko) * | 2019-10-01 | 2021-04-09 | 주식회사 엘지화학 | 열전도성 시트 조성물 및 열전도성 시트 |
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