KR102443158B1 - High-precision cutting apparatus for electronic components - Google Patents

Abstract

The present invention provides a table module configured to allow a base and an MLCC base material to be seated on an upper surface, and a pair of table modules configured to be horizontally movable on the base, provided between the base and the table module, and guide the table module so that it can move in a straight line. It relates to a high-precision cutting device for electronic components including a linear motor provided adjacent to any one of a linear guide and a pair of linear guides, and one side of which is connected to a table module so as to move the table module horizontally.
The high-precision cutting device for electronic components according to the present invention can improve driving precision by employing a linear motor. In addition, even if the linear motor is provided, it is possible to prevent the wire harness from interfering with the base, so that durability can also be improved.

Description

High-precision cutting apparatus for electronic components

The present invention relates to a device for a cutting process essential in an electronic component production process, and more particularly, to an MLCC cutting device that can move with high precision to cut an MLCC base material (or green sheet) into chips.

MLCC (Multi Layer Ceramic Capacitor, multilayer ceramic capacitor) has a function of supplying electricity to a semiconductor constantly. The MLCC is recognized as an essential component in a semiconductor circuit. MLCC can function as a capacitor by stacking several layers. Recently, as circuits including semiconductors are miniaturized, MLCCs have also been miniaturized, and in order to mass-produce small-sized MLCCs, a method of manufacturing and cutting a single sheet is widely used.

In relation to such an MLCC manufacturing apparatus, Korean Patent Registration No. 1827479 is disclosed. However, such a conventional MLCC manufacturing apparatus has a problem in that there is a limit in precision with respect to the position movement of the table on which the MLCC base material is seated.

Republic of Korea Patent No. 1827479

An object of the present invention is to provide a high-precision cutting device for electronic components for solving the problem that the precision of the conventional MLCC cutting device cannot be increased.

As a means of solving the above problems, the base and the MLCC base material are configured so that they can be seated on the upper surface, the table module is configured to move horizontally on the base, is provided between the base and the table module, and guides the table module so that it can move in a straight line A pair of linear guides and a pair of linear guides are provided adjacent to any one of the pair, and a high-precision cutting device for electronic components including a linear motor having one side connected to the table module so as to move the table module horizontally can be provided. have.

Meanwhile, the base may be provided with a through-groove configured to allow a wire harness connected to the table module to be disposed.

On the other hand, the through-groove may be formed to a predetermined length in the linear movement direction so as not to interfere with the base during linear movement of the table module.

On the other hand, the table module is provided on the upper side of the base and is provided in the table frame and the table frame configured to be movable in the horizontal direction, and the center of the vertical direction on the table unit and the table frame on which the MLCC base material to be cut is seated on the upper surface. It may be configured to include a rotation drive unit configured to rotate the table unit based on the axis.

Meanwhile, the pair of linear guides may be provided to be spaced apart from each other by a predetermined distance, and the through-groove may be formed adjacent to the other one of the pair of linear guides.

Furthermore, the wire harness may include a plurality of wires and pneumatic tubes.

In addition, one side of the wire harness may be connected to the lower side of the table module in the central axis direction.

On the other hand, the through groove may include a horizontal movement path of the central axis to prevent interference with the wire harness when the table module moves immediately before.

On the other hand, the linear motor includes a stator and a mover, the stator may be connected to the base, and the mover may be connected to the table frame.

In addition, the mover and the driver may be provided at positions that do not overlap with the linear movement path of the central axis to prevent interference with the wire harness during linear movement of the table module.

On the other hand, the linear motor and the through-groove may be provided at left and right asymmetrical positions on the base.

On the other hand, it may be configured to further include a cutting module that is connected to the base, is vertically reciprocable from the upper side of the table module, and includes a blade configured to cut the MLCC base material.

The high-precision cutting device for electronic components according to the present invention can improve driving precision by employing a linear motor. In addition, even if the linear motor is provided, it is possible to prevent the wire harness from interfering with the base, so that durability can also be improved.

1 is a perspective view of a prior art MLCC cutting device.
2 is a perspective view of a high-precision cutting device for electronic components according to an embodiment of the present invention.
3 is an exploded perspective view of a high-precision cutting device for electronic components according to an embodiment of the present invention.
4 is a partially enlarged perspective view illustrating the periphery of the wire harness in FIG. 3 .
5 is a partially enlarged perspective view of the wire harness when viewed from another angle.
6 is a plan view of the base;
7 is a cross-sectional view of a high-precision cutting device for electronic components.
8A, 8B and 8C are operational state diagrams of a high-precision cutting device for electronic components according to the present invention.
9A, 9B, and 9C are enlarged views of the periphery of the wire harness in the state of FIGS. 8A, 8B and 8C, respectively.

Hereinafter, a high-precision cutting device for electronic components according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. And in the description of the embodiments below, the name of each component may be called another name in the art. However, if they have functional similarity and identity, even if a modified embodiment is employed, it can be viewed as an equivalent configuration. In addition, the code added to each component is described for convenience of description. However, the content shown in the drawings in which these symbols are indicated does not limit each component to the range within the drawings. Similarly, even if an embodiment in which the configuration in the drawings is partially modified is employed, if there is functional similarity and sameness, it can be regarded as an equivalent configuration. In addition, in view of the level of a general engineer in the art, if it is recognized as a component to be included of course, a description thereof will be omitted.

Meanwhile, in the following description, a 'wire harness' will be described on the premise that it is a broad concept that includes a wire for transmitting power, a signal line for control, and a pneumatic tube for supplying air pressure.

1 is a perspective view of a prior art MLCC cutting device.

Referring to FIG. 1 , the MLCC cutting device is configured to cut the MLCC base material into MLCC chips of a predetermined size.

The MLCC cutting device may be provided with a table on which the MLCC base material transferred from the outside, that is, a green sheet, is seated, and may be provided with a blade capable of cutting while reciprocating in a vertical direction.

The MLCC cutting device performs primary cutting at regular intervals while moving the MLCC base material in the horizontal direction. After that, after changing the direction of the MLCC base material by 90 degrees, the second cut is performed at regular intervals while moving it in the horizontal direction.

At this time, the conventional MLCC cutting device) received power to the ball screw driving unit 1000 to move the table in the horizontal direction, and the rotational force was received from the motor to finally move the horizontal position of the table.

However, there is a limit in that it is difficult to improve the precision when the table is moved by applying the ball screw type horizontal driving unit 1000 in the conventional MLCC cutting device.

Hereinafter, the configuration of the high-precision cutting device 10 for electronic components according to the present invention will be described in detail with reference to FIGS. 2 to 7 .

2 is a perspective view of a high-precision cutting device 10 for electronic components according to an embodiment according to the present invention, and FIG. 3 is an exploded perspective view of a high-precision cutting device 10 for electronic components according to an embodiment according to the present invention.

Referring to FIG. 2 , the high-precision cutting device 10 for electronic components according to an embodiment of the present invention is configured to improve the horizontal movement precision in the existing MLCC cutting device to adjust the position of the green sheet.

The high-precision cutting device 10 for electronic components according to the present invention may include a base 100 , a table module 200 , a linear guide 300 , and a linear motor 400 . The high-precision cutting device for electronic components according to the present invention determines the cutting portion by adjusting the horizontal position of the green sheet while the horizontal position of the blade of the cutting module is fixed. Therefore, the linear motor 400 is provided as a horizontal driving unit in order to precisely adjust the horizontal position.

The base 100 becomes a base on which other components can be provided. The base 100 is provided with an upper surface extending in the horizontal direction, and a linear guide 300 , a linear motor 400 , a table module 200 , and a cutting module to be described later may be provided above the base 100 . The base 100 may be provided with a through groove 110 in which the linear direction in which the table module 200 moves is long. The through groove 110 may be configured so that the wire harness 500 to be described later does not interfere with the base 100 module during movement and rotation of the table module 200 . The shape and position of the through hole 110 will be described in detail later.

The table module 200 may be configured to adjust the horizontal position and direction of the MLCC base material while the MLCC base material is seated on the upper side.

The table module 200 may include a table frame 210 , a table unit 220 , and a rotation driving unit 230 .

The table frame 210 may be slidably connected to the base 100 in the lower side, and serves as a base on which the rotation driving unit 230 and the table unit 220 may be provided in the upper side. A hole configured to allow a wire harness 500 to be described later to pass through may be provided in the center portion of the table frame 210 in the horizontal direction.

The table unit 220 may be configured such that the MLCC base material is seated on the upper surface, and the MLCC base material can be stably fixed during cutting. The table unit 220 may have an upper surface of a rigid material to ensure stability during cutting, and may have a slightly larger area than the MLCC base material to be cut. The table unit 220 may be provided with a plurality of suction holes formed on the upper surface and spaced apart from each other by a predetermined distance. The adsorption hole can adsorb and fix the MLCC base material with negative pressure when the MLCC base material is seated on the upper surface of the table unit 220 .

The table unit 220 may be rotatably connected to the table frame 210 . The table unit 220 may be configured to be rotatable on the table frame 210 , and may be configured to rotate by at least 90 degrees by driving a rotation driving unit 230 , which will be described later. The table unit 220 first aligns the MLCC base material in the first direction so that it can be cut in a grid shape to the MLCC base material seated on the upper surface, and then rotates in the second direction when the cutting is finished to divide the MLCC base material do. Meanwhile, a wire harness 500 may be provided at the lower rotation center of the table unit 220 . The wire harness 500 may be configured to include wires for various power and control signals connected to the table module 200 , and a pneumatic tube 510 , so that the overall diameter may be somewhat larger. The wire harness 500 has a length greater than the linear movement distance of the table module 200 and may be connected to the outside via the base 100 .

The rotation driving unit 230 may be provided between the table unit 220 and the table frame 210 to rotate the table unit 220 . The rotation driving unit 230 may be configured to be connected to a plurality of wires provided in the above-described wire harness 500 to receive power and to receive a control signal.

The linear guide 300 may be configured to constrain the direction in which the table module 200 moves in the horizontal direction. The linear guide 300 is configured as a pair, and may be provided in parallel at a predetermined interval corresponding to the width of the table module 200 . A pair of linear guides 300 may be provided at positions adjacent to both ends of the table frame 210 in the width direction so that the table module 200 can move stably in a straight line.

The linear motor 400 is configured to move the table module 200 in a linear direction. The linear motor 400 may include a stator 410 provided on the upper surface of the base 100 and a mover 420 provided on the lower side of the table frame 210 . The linear motor 400 is composed of a permanent magnet and an electromagnet, so that the position in the horizontal direction can be adjusted using attractive and repulsive forces. However, since the configuration of the linear motor 400 is widely used, its own configuration will be omitted.

Meanwhile, the linear motor 400 may be configured to have a slightly wider width than the conventional ball screw type actuator 1000 for driving due to structural characteristics. The linear motor 400 may be provided between a pair of linear guides 300 . The linear motor 400 is most preferably provided at an intermediate point between the pair of linear guides 300 for stable driving. However, in the central portion of the pair of linear guides 300, a space in which the above-described wire harness 500 is to be arranged must be secured. Therefore, the linear motor 400 may be provided at a position biased toward any one of the pair of linear guides 300 . 2 and 3 , the linear motor 400 may be provided at a position adjacent to the linear guide 300 disposed on the right side in the drawing.

On the other hand, although not shown, in the present invention, the high-precision cutting device 10 for electronic components is vertically moved in the direction facing the table unit 220 from the upper side of the table module 200 to cut the MLCC base material. It may be configured to include a cutting module. However, since the configuration of such a cutting module is a widely used configuration, further detailed description will be omitted.

4 is a partially enlarged perspective view illustrating the periphery of the wire harness 500 in FIG. 3 .

Referring to FIG. 4 , the linear motor 400 is provided adjacent to the linear guide 300 disposed on the right side, and may be provided at a position that does not overlap the center line X' of the pair of linear guides 300 . have. Here, the center line X ′ refers to a virtual line parallel to the pair of linear guides 300 and having the same distance to each of the linear guides 300 .

In this case, the through groove 110 in which at least a portion of the wire harness 500 is disposed may be formed at a point adjacent to the linear guide 300 disposed on the left side. In this case, the through groove 110 may be configured to overlap the center line X ′ between the pair of linear guides 300 .

5 is a partially enlarged perspective view of the wire harness 500 when viewed from another angle.

Referring to FIG. 5 , a state in which the wire harness 500 is connected to the center of the table module 200 is shown. One side of the wire harness 500 may be connected to the table module 200 at substantially the same position as the rotation center axis Y ′ of the table unit 220 . That is, the central axis (Y') may be located on the cross-section of the portion where the wire harness 500 is connected to the table unit 220 .

Therefore, when the wire harness 500 is provided to extend to the lower side of the table module 200 , the horizontal movement path of the central axis Y ′ on the base 100 is not interfered with by the through groove 110 .

6 is a plan view of the base 100 .

Referring to FIG. 6 , the base 100 may have a configuration provided on the upper surface asymmetrically to each other in the left and right directions. As described above, the through groove 110 is provided at a position skewed to the left adjacent to the linear guide 300 on the left side, and the linear motor 400 is adjacent to the linear guide 300 on the right side and skewed to the right. provided In this case, the arrangement position may be determined according to the minimum width of the linear guide 300 . In this case, the linear guide 300 may be provided at a position biased to the right that does not overlap the center line X'. On the other hand, the through groove 110 is provided at a position skewed to the left, but the center line X' may be formed in the through groove 110, and the width formed from the center line X' to the right linear guide 300 side is the wire harness. It may be formed to correspond to the outer radius of 500 .

7 : is sectional drawing of the high-precision cutting device 10 for electronic components.

Referring to FIG. 7 , a state in which the wire harness 500 connected to the table module 200 is disposed inside the base 100 is shown. When the wire harness 500 extends vertically downward from the table module 200 , at least a portion thereof may maintain a disposed state via the through groove 110 . In this case, the width of the through groove 110 may be determined to such an extent that interference does not occur when the wire harness 500 moves.

Hereinafter, the operation of the high-precision cutting device 10 for electronic components according to the present invention will be described in detail with reference to FIGS. 8A to 9C .

8a, 8b and 8c are diagrams of the operation of the high-precision cutting device 10 for electronic components according to the present invention, and FIGS. 9a, 9b and 9c are enlarged periphery of the wire harness 500 in the state of FIGS. 8a, 8b and 8c, respectively. It is a drawing shown.

Referring to FIG. 8A , first, the table module 200 is moved to receive the MLCC base material 1 from the outside. At this time, referring to FIG. 9A , the wire harness 500 is towed and pulled according to the position of the table module 200 , and the wire harness 500 is at least partially disposed along the central axis Y'. It is linearly moved along the center line (X') together with the table module 200 . Even if the wire harness 500 is arranged to extend downward from the table module 200 , the through hole 110 is formed with a predetermined width so that the wire harness 500 does not interfere with the base 100 .

Referring to FIG. 8B , a state in which the seated MLCC base material 1 is moved toward the cutting module is shown. At this time, in a state in which the MLCC base material is fixed to the table unit 220 , the table module 200 is moved linearly on the base 100 . At this time, the linear motor 400 may be driven to precisely horizontally move the table module 200 . The linear motor 400 is driven to precisely determine the cutting position of the MLCC base material 1 . On the other hand, the rotation center axis (Y') of the table unit 220 is linearly moved along the center line (X') inside the through groove (110).

Referring to FIG. 9B , since the wire harness 500 is connected to the table unit 220 in substantially the same manner as the rotational center axis Y', when the table module 200 moves in a straight line, the inside of the through groove 110 The shape can be deformed as it is moved. Even at this time, at least a portion of the wire harness 500 is disposed along the central axis (X'), and moves along the center line (Y') even when moving in the horizontal direction, so the outer surface of the harness 500 and the through groove 110 There is no interference with the interior.

Referring to FIG. 8C , the table module 200 moves the MLCC base material 1 in the first direction while cutting in parallel, and then returns the table unit 220 by 90 degrees. Thereafter, the high-precision cutting device 10 for electronic components cuts the MLCC base material in the second direction.

Referring to FIG. 9C , when the table unit 220 is rotated by 90 degrees, the wire harness 500 is also twisted by 90 degrees. However, even in this case, since the through groove 110 is formed to have a width with a predetermined margin from the horizontal movement distance of the central axis Y', the wire harness 500 is connected to the upper surface of the base 100 or the inner surface of the through groove 110. Interference does not occur.

As described above, the high-precision cutting device 10 for electronic components according to the present invention can improve driving precision by employing the linear motor 400 . In addition, even if the linear motor 400 is provided, it is possible to prevent the wire harness 500 from interfering with the base 100 , thereby improving durability.

1: MLCC base material
10: MLCC chip cutting device
1000: ball screw drive unit
100: base
110: through groove
X': center line
Y': central axis
200: table module
210: table frame
220: table unit
230: rotation drive unit
300: linear guide
400: linear motor
410: stator
420: mover
500: wire harness
510: pneumatic tube

Claims (12)

Base;
a table module configured so that the electronic component base material can be seated on the upper surface and horizontally movable on the base;
a pair of linear guides provided between the base and the table module and guiding the table module to move in a straight line;
A linear motor provided adjacent to any one of the pair of linear guides and having one side connected to the table module so as to horizontally move the table module,
The high-precision cutting device for electronic components, characterized in that the base is provided with a through groove configured to allow a wire harness connected to the table module to be disposed. delete The method of claim 1,
The high-precision cutting device for electronic components, characterized in that the through-groove is formed to have a predetermined length in the linear movement direction so as not to interfere with the base during linear movement of the table module. 4. The method of claim 3,
The table module is
a table frame provided on the upper side of the base and configured to be movable in a horizontal direction;
a table unit provided on the table frame, on which the electronic component base material to be cut is seated on an upper surface; and
High-precision cutting device for electronic parts, characterized in that it comprises a rotary drive unit configured to rotate the table unit on the basis of the central axis in the vertical direction on the table frame. 5. The method of claim 4,
The pair of linear guides are provided spaced apart by a predetermined distance,
The high-precision cutting device for electronic components, characterized in that the through-groove is formed adjacent to the other one of the pair of linear guides. 6. The method of claim 5,
The wire harness is a high-precision cutting device for electronic components, characterized in that it includes a plurality of wires and a pneumatic tube. 7. The method of claim 6,
One side of the wire harness is a high-precision cutting device for electronic components, characterized in that connected to the lower side of the table module in the central axis direction. 8. The method of claim 7,
The through-groove is a high-precision cutting device for electronic components, characterized in that it is formed to include a horizontal movement path of the central axis to prevent interference with the wire harness when the table module moves in a straight line. 9. The method of claim 8,
The linear motor includes a stator and a mover,
The stator is connected to the base,
The mover is a high-precision cutting device for electronic components, characterized in that connected to the table frame. 10. The method of claim 9,
The high-precision cutting device for electronic components, characterized in that the mover and the stator are provided at positions that do not overlap with the linear movement path of the central axis to prevent interference with the wire harness when the table module moves in a straight line. The method of claim 1,
The high-precision cutting device for electronic components, characterized in that the linear motor and the through-groove are provided at left and right asymmetrical positions on the base. The method of claim 1,
connected to the base,
It is possible to reciprocate vertically from the upper side of the table module,
High-precision cutting device for electronic components further comprising a cutting module configured to include a blade configured to cut the electronic component base material.

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