KR102382843B1 - 스텔스 다이싱용 점착 시트 및 이를 사용하는 반도체 장치의 제조 방법 - Google Patents
스텔스 다이싱용 점착 시트 및 이를 사용하는 반도체 장치의 제조 방법 Download PDFInfo
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- KR102382843B1 KR102382843B1 KR1020197009728A KR20197009728A KR102382843B1 KR 102382843 B1 KR102382843 B1 KR 102382843B1 KR 1020197009728 A KR1020197009728 A KR 1020197009728A KR 20197009728 A KR20197009728 A KR 20197009728A KR 102382843 B1 KR102382843 B1 KR 102382843B1
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- adhesive sheet
- stealth dicing
- pressure
- sensitive adhesive
- meth
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- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-215206 | 2016-11-02 | ||
| JP2016215206 | 2016-11-02 | ||
| PCT/JP2017/037740 WO2018083987A1 (ja) | 2016-11-02 | 2017-10-18 | ステルスダイシング用粘着シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190076959A KR20190076959A (ko) | 2019-07-02 |
| KR102382843B1 true KR102382843B1 (ko) | 2022-04-05 |
Family
ID=62075603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197009728A Active KR102382843B1 (ko) | 2016-11-02 | 2017-10-18 | 스텔스 다이싱용 점착 시트 및 이를 사용하는 반도체 장치의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6980681B2 (zh) |
| KR (1) | KR102382843B1 (zh) |
| CN (1) | CN109997218B (zh) |
| TW (1) | TWI759345B (zh) |
| WO (1) | WO2018083987A1 (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7254669B2 (ja) * | 2019-09-20 | 2023-04-10 | リンテック株式会社 | ワーク加工用シートおよび半導体装置の製法方法 |
| JPWO2021200786A1 (zh) * | 2020-03-30 | 2021-10-07 | ||
| KR102809578B1 (ko) * | 2020-07-22 | 2025-05-20 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 백그라인드용 점착성 필름 및 전자 장치의 제조 방법 |
| WO2022019160A1 (ja) * | 2020-07-22 | 2022-01-27 | 三井化学東セロ株式会社 | 電子装置の製造方法 |
| KR102809585B1 (ko) * | 2020-07-22 | 2025-05-20 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 전자 장치의 제조 방법 |
| CN112635309B (zh) * | 2020-12-07 | 2024-07-12 | 福建晶安光电有限公司 | 衬底加工方法及利用该方法加工的衬底 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008222781A (ja) | 2007-03-09 | 2008-09-25 | Lintec Corp | 粘着シート |
| JP2011119548A (ja) | 2009-12-04 | 2011-06-16 | Lintec Corp | ステルスダイシング用粘着シート及び半導体装置の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH605065A5 (zh) | 1976-05-06 | 1978-09-29 | Fischer Ag Brugg Georg | |
| JP5554118B2 (ja) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | ウエハ加工用テープ |
| JP5978051B2 (ja) * | 2011-10-17 | 2016-08-24 | 日東電工株式会社 | 粘着テープ用フィルムおよび粘着テープ |
| WO2014199992A1 (ja) * | 2013-06-11 | 2014-12-18 | 電気化学工業株式会社 | 粘着シート及び粘着シートを用いた電子部品の製造方法 |
| JP6328397B2 (ja) | 2013-10-02 | 2018-05-23 | リンテック株式会社 | 電子部品加工用粘着シートおよび半導体装置の製造方法 |
| JP6306362B2 (ja) * | 2014-02-13 | 2018-04-04 | リンテック株式会社 | 伸長可能シートおよび積層チップの製造方法 |
| KR101886939B1 (ko) * | 2014-03-03 | 2018-08-08 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 가공용 점착 테이프 |
| JP5823591B1 (ja) * | 2014-10-01 | 2015-11-25 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法 |
-
2017
- 2017-10-18 CN CN201780067345.0A patent/CN109997218B/zh active Active
- 2017-10-18 JP JP2018548617A patent/JP6980681B2/ja active Active
- 2017-10-18 WO PCT/JP2017/037740 patent/WO2018083987A1/ja active Application Filing
- 2017-10-18 KR KR1020197009728A patent/KR102382843B1/ko active Active
- 2017-10-25 TW TW106136682A patent/TWI759345B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008222781A (ja) | 2007-03-09 | 2008-09-25 | Lintec Corp | 粘着シート |
| JP2011119548A (ja) | 2009-12-04 | 2011-06-16 | Lintec Corp | ステルスダイシング用粘着シート及び半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI759345B (zh) | 2022-04-01 |
| JP6980681B2 (ja) | 2021-12-15 |
| CN109997218B (zh) | 2023-08-08 |
| JPWO2018083987A1 (ja) | 2019-09-19 |
| WO2018083987A1 (ja) | 2018-05-11 |
| TW201817842A (zh) | 2018-05-16 |
| CN109997218A (zh) | 2019-07-09 |
| KR20190076959A (ko) | 2019-07-02 |
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