KR102373326B1 - 증착 장치 및 증착 장치 내 기판 정렬 방법 - Google Patents
증착 장치 및 증착 장치 내 기판 정렬 방법 Download PDFInfo
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- KR102373326B1 KR102373326B1 KR1020140191113A KR20140191113A KR102373326B1 KR 102373326 B1 KR102373326 B1 KR 102373326B1 KR 1020140191113 A KR1020140191113 A KR 1020140191113A KR 20140191113 A KR20140191113 A KR 20140191113A KR 102373326 B1 KR102373326 B1 KR 102373326B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
도 2는 본 발명의 일 실시예에 따른 기판 정렬 방법을 나타내는 순서도이다.
도 3a 내지 도 3d는 본 발명의 일 실시예에 따른 기판 정렬 방법을 나타내는 공정 단면도이다.
도 4a 내지 도 4c는 본 발명의 다른 실시예에 따른 기판 정렬 방법을 나타내는 공정 단면도이다.
7: 증착 물질 공급원 10: 금속 시트
15: 시트 프레임 17: 시트 구동부
20: 금속 마스크 25: 마스크 프레임
27: 마스크 스테이지 29: 지지구
30: 정전척 40: 마그넷 플레이트
45: 마그넷 플레이트 구동부 S: 기판
Claims (8)
- 시트 프레임과 테두리부가 일체로 결합된 금속 시트;
상기 금속 시트의 하면에 부착되고 기판을 정전기력에 의해 흡착하는 필름 형태의 정전척;
상기 정전척의 하측에 배치되고, 마스크 프레임과 테두리부가 결합되며 상기 기판이 상면에 안착되는 기 설정된 패턴의 개구가 형성된 금속 마스크; 및
상기 금속 시트의 상측에 배치되고, 상기 금속 마스크를 자력에 의해 당겨 상기 기판을 상기 정전척에 밀착시키는 마그넷 플레이트를 포함하는 증착 장치. - 제 1 항에서,
상기 시트 프레임을 상부 또는 하부로 이송하는 시트 프레임 구동부; 및
상기 마그넷 플레이트를 상부 또는 하부로 이송하는 마그넷 플레이트 구동부를 더 포함하는 증착 장치. - 삭제
- 제 1 항에서,
상기 정전척은 하측으로 볼록한 형태로 상기 금속 시트에 부착되는 증착 장치. - 제 1 항에서,
상기 마그넷 플레이트는 영구 자석 또는 전자석으로 형성되는 증착 장치. - 제 1 항에서,
상기 금속 마스크는 파인메탈마스크(Fine Metal Mask; FMM)인 증착 장치. - 마스크 프레임과 테두리부가 결합된 금속 마스크에 기판을 장착하는 기판 장착 단계;
필름 형태의 정전척이 부착되고 시트 프레임과 테두리부가 일체로 결합된 금속 시트를 상기 금속 마스크를 향해 하측으로 이동시켜 상기 정전척에 상기 기판을 부착시키는 기판 부착 단계;
상기 정전척에 기판이 부착된 채로 상기 금속 시트를 상측으로 이동시켜 상기 금속 시트의 상측에 배치된 마그넷 플레이트에 부착시키는 금속 시트 이동 단계; 및
상기 금속 시트와 부착된 상기 마그넷 플레이트를 상기 금속 마스크를 향해 하측으로 이동시켜 자력에 의해 상기 기판을 상기 금속 마스크에 밀착시키는 마그넷 플레이트 이동 단계를 포함하는 기판 정렬 방법. - 마스크 프레임과 테두리부가 결합된 금속 마스크에 기판을 장착하는 단계;
필름 형태의 정전척이 부착되고 시트 프레임과 테두리부가 일체로 결합된 금속 시트를 상기 금속 마스크를 향해 하측으로 이동시켜 상기 정전척에 상기 기판을 부착시키는 기판 부착 단계; 및
상기 금속 시트의 상측에 배치된 마그넷 플레이트를 상기 금속 마스크를 향해 하측으로 이동시켜 자력에 의해 상기 기판을 상기 금속 마스크에 밀착시키는 마그넷 플레이트 이동 단계를 포함하는 기판 정렬 방법.
Priority Applications (2)
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KR1020140191113A KR102373326B1 (ko) | 2014-12-26 | 2014-12-26 | 증착 장치 및 증착 장치 내 기판 정렬 방법 |
US14/792,443 US9771645B2 (en) | 2014-12-26 | 2015-07-06 | Apparatus for deposition and substrate alignment method in the same |
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KR1020140191113A KR102373326B1 (ko) | 2014-12-26 | 2014-12-26 | 증착 장치 및 증착 장치 내 기판 정렬 방법 |
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KR20160082557A KR20160082557A (ko) | 2016-07-08 |
KR102373326B1 true KR102373326B1 (ko) | 2022-03-11 |
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KR (1) | KR102373326B1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10289007B2 (en) * | 2014-07-10 | 2019-05-14 | Nikon Corporation | Lithography tool having a reticle stage capable of dynamic reticle bending to compensate for distortion |
US11220736B2 (en) | 2016-11-18 | 2022-01-11 | Dai Nippon Printing Co., Ltd. | Deposition mask |
JP6925711B2 (ja) * | 2017-04-12 | 2021-08-25 | 株式会社ディスコ | フレームユニット及び被加工物のレーザー加工方法 |
KR102072893B1 (ko) * | 2017-12-26 | 2020-02-03 | 주식회사 야스 | 터치 플레이트와 일체로 되고 스위칭 마그넷을 구비한 마그넷 플레이트 및 이를 적용한 얼라인먼트 시스템 |
KR20220004880A (ko) * | 2020-07-03 | 2022-01-12 | 삼성디스플레이 주식회사 | 마스크 어셈블리 및 이를 포함하는 증착 설비 |
US20220006015A1 (en) * | 2020-07-03 | 2022-01-06 | Samsung Display Co., Ltd. | Apparatus and method of manufacturing display apparatus |
US11326246B2 (en) * | 2020-07-27 | 2022-05-10 | Rockwell Collins, Inc. | Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition |
KR102702270B1 (ko) | 2021-11-17 | 2024-09-04 | 주식회사 선익시스템 | 기판 정렬 장치, 기판 정렬 방법 및 박막 증착 시스템 |
KR20230072037A (ko) | 2021-11-17 | 2023-05-24 | 주식회사 선익시스템 | 기판 정렬 장치 및 이를 포함하는 박막 증착 시스템 |
KR102642160B1 (ko) * | 2022-07-12 | 2024-03-04 | 주식회사 이에스티 | 대면적 디스플레이 제조용 기판 처리 장치 및 그의 구동 방법 |
KR20240176794A (ko) | 2023-06-16 | 2024-12-24 | (주)아이씨디 | 초미세 패턴 마스크 및 이의 제조방법 |
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KR100884029B1 (ko) * | 2005-02-23 | 2009-02-17 | 미쯔이 죠센 가부시키가이샤 | 마스크 유지 기구 및 성막 장치 |
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JP2004235563A (ja) | 2003-01-31 | 2004-08-19 | Tomoegawa Paper Co Ltd | 静電チャック装置用電極シート及びこれを用いた静電チャック装置 |
JP5297046B2 (ja) * | 2008-01-16 | 2013-09-25 | キヤノントッキ株式会社 | 成膜装置 |
KR100994490B1 (ko) * | 2008-04-11 | 2010-11-15 | 엘아이지에이디피 주식회사 | 척 및 이를 이용한 증착장치 |
US8246748B2 (en) * | 2008-07-09 | 2012-08-21 | Raytheon Canada Limited | Method and apparatus for coating surfaces |
KR101307153B1 (ko) | 2011-06-20 | 2013-09-17 | 주식회사 아이.엠.텍 | 대면적 글라스의 얼라이너 구동장치 및 방법 |
JP2014065959A (ja) | 2012-09-27 | 2014-04-17 | Hitachi High-Technologies Corp | 蒸着装置、および、蒸着装置における基板設置方法 |
KR101310336B1 (ko) | 2013-03-28 | 2013-09-23 | 주식회사 아이.엠.텍 | 대면적 글라스의 얼라인 구동장치 |
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KR100884029B1 (ko) * | 2005-02-23 | 2009-02-17 | 미쯔이 죠센 가부시키가이샤 | 마스크 유지 기구 및 성막 장치 |
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US20160186305A1 (en) | 2016-06-30 |
KR20160082557A (ko) | 2016-07-08 |
US9771645B2 (en) | 2017-09-26 |
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