KR102354865B1 - Display apparatus - Google Patents

Abstract

The display device includes at least an organic light emitting display panel including a thin film encapsulation layer, a first conductive layer disposed directly on the thin film encapsulation layer, and directly disposed on the thin film encapsulation layer, and having a density of 2.05 g/cm 3 to 2.4 g/cm 3 . and one inorganic layer, an organic layer disposed on the at least one inorganic layer, and a window.

Description

display device {DISPLAY APPARATUS}

The present invention relates to a display device, and to a display device having a high-density inorganic film.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines have been developed. The input devices of the display devices include a keyboard or a mouse. Also, recently, display devices have a touch panel as an input device.

Before the display devices are put on the market, reliability evaluation under harsh conditions is performed on the display devices. Products that have passed the reliability evaluation are sold to consumers.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display device having improved reliability under severe cold conditions.

A display device according to an embodiment of the present invention includes an organic light emitting display panel, a window, a first conductive layer, a second conductive layer, at least one inorganic layer, and an organic layer. The organic light emitting display panel includes a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer. The first conductive layer is disposed directly on the thin film encapsulation layer, the second conductive layer is disposed directly on the thin film encapsulation layer, and is disposed on a layer different from the first conductive layer. The inorganic layer is disposed directly on the thin film encapsulation layer, has a density of 2.05 g/cm 3 to 2.4 g/cm 3 , and the organic layer is disposed on the at least one inorganic layer. The window faces the organic light emitting display panel with the first conductive layer, the at least one inorganic layer, and the organic layer interposed therebetween.

The at least one inorganic layer includes a silicon nitride layer having a density of 2.05 g/cm 3 to 2.4 g/cm 3 .

The thin film encapsulation layer includes a plurality of inorganic thin films and at least one organic thin film disposed between the plurality of inorganic thin films.

The at least one inorganic layer includes a first inorganic layer disposed between the first conductive layer and the second conductive layer, and a second inorganic layer disposed on the first conductive layer and the second conductive layer. .

The at least one inorganic layer is disposed between the first conductive layer and the second conductive layer, and the organic layer is disposed directly on the second conductive layer.

It further includes an organic adhesive layer for coupling the window to the organic light emitting display panel.

The at least one inorganic layer is disposed directly on the second conductive layer, and further includes an intermediate insulating layer disposed between the first conductive layer and the second conductive layer.

The organic layer may be an organic adhesive layer that couples the window to the organic light emitting display panel.

A polarizing film disposed between the at least one inorganic layer and the window may be further included.

The first conductive layer includes a bridge pattern, and the second conductive layer includes a connection part crossing the bridge pattern, first touch sensor parts connected by the connection part, and second touch sensor parts connected by the bridge pattern. may include

The light emitting device layer may include light emitting regions and a non-emission region adjacent to the light emitting regions, and each of the first touch sensor units and the second touch sensor units may have a mesh shape overlapping the non-emission region.

The first conductive layer may include a connection part, first touch sensor parts connected by the connection part, and second touch sensor parts spaced apart from the first touch sensor parts. The second conductive layer may include a bridge pattern that connects the second touch sensor parts and crosses the connection part.

The first conductive layer may include a first connection part and first touch sensor parts connected by the first connection part. The second conductive layer may include a second connection part crossing the first connection part and second touch sensor parts connected by the second connection part.

The first light reflected from the first conductive layer and the second light reflected from the second conductive layer may have a phase difference of 180 degrees.

The at least one inorganic layer may include a first inorganic layer disposed between the first conductive layer and the second conductive layer, and a second inorganic layer disposed on the first conductive layer and the second conductive layer. can

The window may include a plastic film. The organic layer may be an organic adhesive layer in contact with the window.

A display device according to an embodiment of the present invention includes an organic light emitting display panel, a touch sensing unit, an organic adhesive layer, and a window. The organic light emitting display panel includes a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer. The touch sensing unit is disposed directly on the thin film encapsulation layer, and the organic adhesive layer is disposed on the touch sensing unit. The window faces the organic light emitting display panel with the touch sensing unit and the organic adhesive layer interposed therebetween.

The touch sensing unit includes conductive patterns disposed directly on the thin film encapsulation layer and an insulating layer disposed directly on the thin film encapsulation layer and covering the conductive patterns. The insulating layer includes an inorganic layer having a density of 2.05 g/cm 3 to 2.4 g/cm 3 .

A display device according to an embodiment of the present invention includes a display panel including a first inorganic layer, first conductive patterns disposed directly on the first inorganic layer, directly disposed on the first inorganic layer, and the second inorganic layer. A first insulating layer covering the first conductive patterns, second conductive patterns disposed directly on the first insulating layer, and a second insulating layer disposed directly on the first insulating layer and covering the second conductive patterns , an organic adhesive layer disposed on the second insulating layer and a window facing the organic light emitting display panel with the organic adhesive layer interposed therebetween. At least one of the first insulating layer and the second insulating layer includes a second inorganic layer having a density of 2.05 g/cm 3 to 2.4 g/cm 3 .

According to the above description, the inorganic layer having a density of 2.05 g/cm 3 to 2.4 g/cm 3 can seal seeds that cause bubble generation. The seed may be sealed adjacent to the thin film encapsulation layer.

The inorganic layer may block the seed from accessing the organic layer. By preventing the seed from reacting with the organic layer, the generation of air bubbles can be suppressed. Accordingly, delamination between the organic adhesive member and the window is reduced.

1A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment.
1B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment.
1C is a perspective view illustrating a third operation of a display device according to an exemplary embodiment of the present invention.
2 is a cross-sectional view of a display device according to an exemplary embodiment.
3A to 3B are perspective views of a display device according to an exemplary embodiment.
4A is a cross-sectional view of a display module according to an embodiment of the present invention.
4B is a plan view of an organic light emitting display panel according to an exemplary embodiment.
4C is an equivalent circuit diagram of a pixel according to an embodiment of the present invention.
4D and 4E are partial cross-sectional views of an organic light emitting display panel according to an exemplary embodiment.
5A to 5C are cross-sectional views of a thin film encapsulation layer according to an embodiment of the present invention.
6A is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
6B to 6E are plan views of a touch sensing unit according to an embodiment of the present invention.
7A is a partially enlarged view of area AA of FIG. 6A .
Fig. 7B is a partial cross-sectional view of Fig. 7A;
Fig. 7c is a partial cross-sectional view of Fig. 6a;
8A is a cross-sectional view illustrating a bubble defect occurring in a display device.
8B is a photograph showing a bubble defect occurring in the display device.
9 is a graph showing the bubble defect according to the film density.
10A is a cross-sectional view of a display device according to an exemplary embodiment.
10B is an enlarged view of a cross-section of a display device according to an exemplary embodiment.
11 is a cross-sectional view of a display device according to an exemplary embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or region, layer, part, etc.) is referred to as being “on”, “connected to” or “coupled to” another component, it is directly connected/connected on the other component. It means that they may be coupled or that a third component may be disposed between them.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content. “and/or” includes any combination of one or more that the associated components may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In addition, terms such as “below”, “lower side”, “above”, and “upper side” are used to describe the relationship between the components shown in the drawings. The above terms are relative concepts, and are described based on directions indicated in the drawings.

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, and includes one or more other features, number, or step. , it should be understood that it does not preclude the possibility of the existence or addition of an operation, a component, a part, or a combination thereof.

1A is a perspective view illustrating a first operation of a display device DD according to an exemplary embodiment. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment. 1C is a perspective view illustrating a third operation of a display device DD according to an exemplary embodiment.

As shown in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to a surface defined by the first direction axis DR1 and the second direction axis DR2 . The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. The front surface (or upper surface) and the rear surface (or lower surface) of each member are divided by the third direction axis DR3 . However, the directions indicated by the first to third direction axes DR1 , DR2 , and DR3 are relative concepts and may be converted into other directions. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third direction axes DR1 , DR2 , and DR3 , respectively.

1A to 1C illustrate a foldable display as an example of a flexible display DD. However, the present invention may be a rollable display device or a banded display device that is rolled, and is not particularly limited. Also, although the flexible display device is illustrated in the present embodiment, the present invention is not limited thereto. The display device DD according to the present exemplary embodiment may be a flat rigid display device. The flexible display device DD according to the present invention may be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game machines, and smart watches.

As illustrated in FIG. 1A , the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display area DD-DA in which an image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which an image is not displayed. 1A shows a vase as an example of the image IM. As an example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the present invention is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be designed relatively.

1A to 1C , the display device DD may include a plurality of regions defined according to an operation type. The display device DD includes the bending area BA, the first non-bending area NBA1, and the second non-bending area NBA2 that are bent on the basis of the bending axis BX. may include As illustrated in FIG. 1B , the display device DD is inner bent so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As illustrated in FIG. 1C , the display device DD may be outer-bending so that the display surface IS is exposed to the outside.

In an embodiment of the present invention, the display device DD may include a plurality of bending areas BA. In addition, the bending area BA may be defined to correspond to a shape in which the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C , the bending area BA may be defined in parallel to the first direction axis DR1 or may be defined in a diagonal direction. The area of the bending area BA is not fixed and may be determined according to a radius of curvature. In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes shown in FIGS. 1A and 1B .

2 is a cross-sectional view of a display device DD according to an exemplary embodiment. 2 illustrates a cross-section defined by the second direction axis DR2 and the third direction axis DR3.

As shown in Figure 2, The display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member. (AM3). The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, the second adhesive member AM2 couples the display module DM and the optical member LM, and the third adhesive member (AM3) combines the optical member (LM) and the window (WM).

The protective film PM protects the display module DM. The protective film PM provides the first outer surface OS-L exposed to the outside, and provides an adhesive surface that is adhered to the first adhesive member AM1 . The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external shocks.

The protective film PM may include a plastic film as a base layer. The protective film (PM) is polyethersulfone (PES, polyethersulphone), polyacrylate (PAR, polyacrylate), polyether imide (PEI, polyetherimide), polyethylene naphthalate (PEN, polyethyelenen napthalate), polyethylene terephthalate (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS, polyphenylene sulfide), polyarylate (polyallylate), polyimide (PI, polyimide), polycarbonate (PC, polycabonate), polyarylene ether sulfone (poly(aryleneether sulfone)) and It may include a plastic film including any one selected from the group consisting of combinations thereof.

The material constituting the protective film PM is not limited to plastic resins, and may include an organic/inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In an embodiment of the present invention, the protective film PM may be omitted.

The window WM may protect the display module DM from external impact and may provide an input surface to the user. The window WM provides the second outer surface OS-U exposed to the outside, and provides an adhesive surface that is adhered to the second adhesive member AM2 . The display surface IS illustrated in FIGS. 1A to 1C may be the second outer surface OS-U.

The window WM may include a plastic film. The window WM may have a multi-layered structure. The window WM may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window WM may further include a bezel pattern. The multi-layer structure may be formed through a continuous process or an adhesion process using an adhesive layer.

The optical member LM reduces external light reflectance. The optical member LM may include at least a polarizing film. The optical member LM may further include a retardation film. In an embodiment of the present invention, the optical member LM may be omitted.

The display module DM may include an organic light emitting display panel DP and a touch sensing unit TS . The touch sensing unit TS is directly disposed on the organic light emitting display panel DP. In the present specification, "directly disposed" means that it is formed by a continuous process, except for attachment using a separate adhesive layer.

The organic light emitting display panel DP generates an image IM (refer to FIG. 1A ) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing in the thickness direction DR3. Although the organic light emitting display panel DP has been exemplarily described in this embodiment, the display panel is not limited thereto.

The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may sense an external input in a capacitive manner.

Although not shown separately, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a stacked structure of a conductive layer/insulating layer/conductive layer. The anti-reflection layer absorbs or destructively interferes with or polarizes light incident from the outside to reduce the reflectance of external light. The anti-reflection layer may replace the function of the optical member LM.

Each of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 is an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). Alternatively, it may be an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as polyurethane, polyacrylic, polyester, polyepoxy, or polyvinyl acetate. Consequently, the organic adhesive layer corresponds to one of the organic layers. As will be described later, the organic adhesive layer may cause bubbles.

Although not shown separately, the display device DD may further include a frame structure supporting the functional layers to maintain the state illustrated in FIGS. 1A to 1C . The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of a display device DD-1 according to an exemplary embodiment. FIG. 3A shows the display device DD-1 in an unfolded state, and FIG. 3B shows the display device DD-1 in a bent state.

The display device DD-1 may include one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD-1 may be bent. However, in an embodiment of the present invention, the bending area of the display device DD-1 may be changed.

Unlike the display device DD illustrated in FIGS. 1A to 1C , the display device DD-1 according to the present exemplary embodiment may be fixed in a single shape to operate. The display device DD-1 may operate in a bent state as shown in FIG. 3B . The display device DD-1 may be fixed to a frame or the like in a bent state, and the frame may be coupled to a housing of the electronic device.

The display device DD-1 according to the present exemplary embodiment may have the same cross-sectional structure as shown in FIG. 2 . However, the non-bending area NBA and the bending area BA may have different stacked structures. The non-bending area NBA may have the same cross-sectional structure as shown in FIG. 2 , and the bending area BA may have a different cross-sectional structure from that illustrated in FIG. 2 . The optical member LM and the window WM may not be disposed in the bending area BA. That is, the optical member LM and the window WM may be disposed only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may also not be disposed in the bending area BA.

4A is a cross-sectional view of a display module DM according to an embodiment of the present invention. 4B is a plan view of an organic light emitting display panel DP according to an exemplary embodiment. 4C is an equivalent circuit diagram of a pixel PX according to an embodiment of the present invention. 4D and 4E are partial cross-sectional views of an organic light emitting display panel DP according to an exemplary embodiment.

As shown in FIG. 4A , the organic light emitting display panel DP includes a base layer SUB, a circuit layer DP-CL disposed on the base layer SUB, a light emitting device layer DP-OLED, and a thin film. and an encapsulation layer (TFE). The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite substrate.

The circuit layer DP-CL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL may constitute signal lines or a control circuit of a pixel. The light emitting device layer DP-OLED includes organic light emitting diodes. The thin film encapsulation layer TFE seals the light emitting device layer DP-OLED. The thin film encapsulation layer (TFE) includes at least two inorganic thin films and at least one organic thin film disposed therebetween. The inorganic thin film protects the light emitting device layer (DP-OLED) from moisture/oxygen, and the organic thin film protects the light emitting device layer (DP-OLED) from foreign substances such as dust particles.

The touch sensing unit TS is directly disposed on the thin film encapsulation layer TFE. The touch sensing unit TS includes touch sensors and touch signal lines. The touch sensors and the touch signal lines may have a single-layer or multi-layer structure.

The touch sensors and the touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The touch sensors and the touch signal lines may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensors and the touch signal lines may have the same layer structure or different layer structures. Specific details of the touch sensing unit TS will be described later.

As shown in FIG. 4B , the organic light emitting display panel DP includes a display area DA and a non-display area NDA in a plan view. The display area DA and the non-display area NDA of the organic light emitting display panel DP correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP are not necessarily the same as the display area DD-DA and the non-display area DD-NDA of the display device DD. , may be changed according to the structure/design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of signal lines SGL and a plurality of pixels PX. An area in which the plurality of pixels PX are disposed is defined as the display area DA. In the present exemplary embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The plurality of signal lines SGL include gate lines GL, data lines DL, a power line PL, and a control signal line CSL. The gate lines GL are respectively connected to a corresponding pixel PX of the plurality of pixels PX, and the data lines DL are respectively connected to a corresponding pixel PX of the plurality of pixels PX. do. The power line PL is connected to the plurality of pixels PX. A gate driving circuit DCV to which the gate lines GL are connected may be disposed on one side of the non-display area NDA. The control signal line CSL may provide control signals to the gate driving circuit DCV.

Some of the gate lines GL, data lines DL, power line PL, and control signal line CSL are disposed on the same layer, and some are disposed on different layers. Each of the gate lines GL, data lines DL, power line PL, and control signal line CSL may include a signal line unit and a signal pad unit connected to an end of the signal line unit. As examples of the signal pad unit, a control pad unit CSL-P, a data pad unit DL-P, and a power pad unit PL-P are illustrated. Although not shown, the gate pad part overlaps the gate driving circuit DCV and may be connected to the gate driving circuit DCV.

4C exemplarily illustrates a pixel PX connected to any one gate line GL, any one data line DL, and a power supply line PL. The configuration of the pixel PX is not limited thereto and may be modified and implemented.

The pixel PX includes an organic light emitting diode OLED as a display device. The organic light emitting diode (OLED) may be a top light emitting diode or a bottom light emitting diode. The pixel PX is a circuit unit for driving the organic light emitting diode OLED and includes a first transistor TFT1 or a switching transistor, a second transistor TFT2 or a driving transistor, and a capacitor CAP.

The first transistor TFT1 outputs a data signal applied to the data line DL in response to the scan signal applied to the gate line GL. The capacitor CAP is charged with a voltage corresponding to the data signal received from the first transistor TFT1 .

The second transistor TFT2 is connected to the organic light emitting diode OLED. The second transistor TFT2 controls the driving current flowing through the organic light emitting diode OLED in response to the amount of charge stored in the capacitor CAP. The organic light emitting diode OLED emits light during the turn-on period of the second transistor TFT2.

FIG. 4D is a cross-sectional view of a portion corresponding to the first transistor TFT1 and the capacitor CAP of the equivalent circuit shown in FIG. 4C . FIG. 4E is a cross-sectional view of a portion corresponding to the second transistor TFT2 and the organic light emitting diode OLED of the equivalent circuit shown in FIG. 4C .

As shown in FIGS. 4D and 4E , a circuit layer DP-CL is disposed on the base layer SUB. A semiconductor pattern AL1 (hereinafter, referred to as a first semiconductor pattern) of the first transistor TFT1 and a semiconductor pattern AL2 (hereinafter, a second semiconductor pattern) of the second transistor TFT2 are disposed on the base layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be selected to be the same as or different from each other in amorphous silicon, polysilicon, and metal oxide semiconductors.

Although not shown separately, functional layers may be further disposed on one surface of the base layer SUB. The functional layers include at least one of a barrier layer and a buffer layer. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be disposed on a barrier layer or a buffer layer.

A first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the base layer SUB. The first insulating layer 12 includes an organic layer and/or an inorganic layer. In particular, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

A control electrode GE1 (hereinafter, first control electrode) of the first transistor TFT1 and a control electrode GE2 (hereinafter, hereinafter, second control electrode) of the second transistor TFT2 are disposed on the first insulating layer 12 . do. The first electrode E1 of the capacitor CAP is disposed on the first insulating layer 12 . The first control electrode GE1 , the second control electrode GE2 , and the first electrode E1 may be manufactured according to the same photolithography process as the gate lines GL (refer to FIG. 4C ). In other words, the first electrode E1 may be made of the same material as the gate lines GL, have the same stacked structure, and be disposed on the same layer.

A second insulating layer 14 is disposed on the first insulating layer 12 to cover the first control electrode GE1 , the second control electrode GE2 , and the first electrode E1 . The second insulating layer 14 includes an organic layer and/or an inorganic layer. In particular, the second insulating layer 14 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

Data lines DL (refer to FIG. 4C ) may be disposed on the second insulating layer 14 . An input electrode SE1 (hereinafter, referred to as a first input electrode) and an output electrode DE1 (hereinafter, referred to as a first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14 . An input electrode SE2 (hereinafter, referred to as a second input electrode) and an output electrode DE2 (hereinafter, a second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14 . The first input electrode SE1 is branched from a corresponding data line among the data lines DL. The power line PL (refer to FIG. 4C ) may be disposed on the same layer as the data lines DL. The second input electrode SE2 may be branched from the power line PL.

The second electrode E2 of the capacitor CAP is disposed on the second insulating layer 14 . The second electrode E2 may be manufactured according to the same photolithography process as the data lines DL and the power line PL, may be made of the same material, have the same stacked structure, and may be disposed on the same layer. have.

The first input electrode SE1 and the first output electrode DE1 form a first through hole CH1 and a second through hole CH2 passing through the first insulating layer 12 and the second insulating layer 14 . are respectively connected to the first semiconductor pattern AL1 through the The first output electrode DE1 may be electrically connected to the first electrode E1 . For example, the first output electrode DE1 may be connected to the first electrode E1 through a through hole (not shown) penetrating the second insulating layer 14 . The second input electrode SE2 and the second output electrode DE2 form a third through hole CH3 and a fourth through hole CH4 passing through the first insulating layer 12 and the second insulating layer 14 . are respectively connected to the second semiconductor pattern AL2 through the Meanwhile, in another embodiment of the present invention, the first transistor TFT1 and the second transistor TFT2 may be modified into a bottom gate structure.

A third insulating layer 16 covering the first input electrode SE1 , the first output electrode DE1 , the second input electrode SE2 , and the second output electrode DE2 on the second insulating layer 14 . ) is placed. The third insulating layer 16 includes an organic layer and/or an inorganic layer. In particular, the third insulating layer 16 may include an organic material to provide a flat surface.

Any one of the first insulating layer 12 , the second insulating layer 14 , and the third insulating layer 16 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 14 and the third insulating layer 16 may be defined as an interlayer. The interlayer insulating layer is disposed between the conductive pattern disposed below and the conductive pattern disposed above the interlayer insulating layer to insulate the conductive patterns.

A light emitting device layer DP-OLED is disposed on the third insulating layer 16 . A pixel defining layer PXL and an organic light emitting diode OLED are disposed on the third insulating layer 16 . An anode AE is disposed on the third insulating layer 16 . The anode AE is connected to the second output electrode DE2 through the fifth through hole CH5 penetrating the third insulating layer 16 . An opening OP is defined in the pixel defining layer PXL. The opening OP of the pixel defining layer PXL exposes at least a portion of the anode AE.

The light emitting device layer DP-OLED includes a light emitting area PXA and a non-emission area NPXA adjacent to the light emitting area PXA. The non-emission area NPXA may surround the light emission area PXA. In this embodiment, the light emitting area PXA is defined to correspond to the anode AE. However, the light emitting area PXA is not limited thereto, and it is sufficient if the light emitting area PXA is defined as an area in which light is generated. The emission area PXA may be defined to correspond to a partial area of the anode AE exposed by the opening OP.

The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-emission area NPXA. Although not shown separately, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (refer to FIG. 4B ).

An organic emission layer EML is disposed on the hole control layer HCL. The organic emission layer EML may be disposed only in a region corresponding to the opening OP. That is, the organic emission layer EML may be formed separately in each of the plurality of pixels PX.

An electronic control layer ECL is disposed on the organic emission layer EML. A cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

Although the patterned organic light emitting layer EML is illustrated as an example in this embodiment, the organic light emitting layer EML may be commonly disposed on the plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. In addition, the organic light emitting layer EML may have a multilayer structure.

In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In an embodiment of the present invention, a capping layer covering the cathode CE may be further disposed. In this case, the thin film encapsulation layer TFE directly covers the capping layer.

5A to 5C are cross-sectional views of thin film encapsulation layers TFE1, TFE2, and TFE3 according to an embodiment of the present invention. Hereinafter, the thin film encapsulation layers TFE1 , TFE2 , and TFE3 according to embodiments of the present invention will be described with reference to FIGS. 5A to 5C .

As shown in FIG. 5A , the thin film encapsulation layer TFE1 may include n inorganic thin films IOL1 to IOLn including the first inorganic thin film IOL1 in contact with the cathode CE (refer to FIG. 8B ). . The first inorganic thin film IOL1 may be defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film IOL1 among the n inorganic thin films IOL1 to IOLn may be defined as upper inorganic thin films.

The thin film encapsulation layer TFE1 includes n-1 organic thin films OL1 to OLn, and the n-1 organic thin films OL1 to OLn are alternately disposed with n inorganic thin films IOL1 to IOLn. can be The n-1 organic thin films OL1 to OLn may have a thickness greater than that of the n inorganic thin films IOL1 to IOLn on average.

Each of the n inorganic thin films IOL1 to IOLn may have a single layer including one material or a multilayer each including a different material. Each of the n-1 organic thin films OL1 to OLn may be formed by depositing organic monomers. The organic monomers may include acrylic monomers. In an embodiment of the present invention, the thin film encapsulation layer TFE1 may further include an n-th organic thin film.

5B and 5C , the inorganic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may have the same or different inorganic materials, and may have the same or different thicknesses. The organic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may have the same or different organic materials, and may have the same or different thicknesses.

As shown in FIG. 5B , the thin film encapsulation layer TFE2 is a sequentially stacked first inorganic thin film IOL1 , a first organic thin film OL1 , a second inorganic thin film IOL2 , and a second organic thin film OL2 . , and a third inorganic thin film IOL3 .

The first inorganic thin film IOL1 may have a two-layer structure. The first sub-layer S1 may be a lithium fluoride layer, and the second sub-layer S2 may be an aluminum oxide layer. The first organic thin film OL1 is a first organic monomer layer, the second inorganic thin film IOL2 is a first silicon nitride layer, the second organic thin film OL2 is a second organic monomer layer, and a third inorganic thin film (IOL3) may be a second silicon nitride layer.

As illustrated in FIG. 5C , the thin film encapsulation layer TFE3 may include a first inorganic thin film IOL10 , a first organic thin film OL1 , and a second inorganic thin film IOL20 sequentially stacked. The first inorganic thin film IOL10 may have a two-layer structure. The first sub-layer S10 may be a lithium fluoride layer, and the second sub-layer S20 may be a silicon oxide layer. The first organic thin film OL1 may be an organic monomer layer, and the second inorganic thin film IOL20 may have a two-layer structure. The second inorganic thin film IOL20 may include a first sub-layer S100 and a second sub-layer S200 deposited in different deposition environments. The first sub-layer S100 may be deposited under a low-power condition, and the second sub-layer S200 may be deposited under a high-power condition. Each of the first sub-layer S100 and the second sub-layer S200 may be a silicon nitride layer.

6A is a cross-sectional view of a touch sensing unit TS according to an embodiment of the present invention. 6B to 6E are plan views of a touch sensing unit TS according to an embodiment of the present invention.

As shown in FIG. 6A , the touch sensing unit TS includes a first conductive layer TS-CL1, a first insulating layer TS-IL1 (hereinafter, referred to as a first touch insulating layer), and a second conductive layer TS-CL2. ), and a second insulating layer (TS-IL2, hereinafter referred to as a second touch insulating layer). The first conductive layer TS-CL1 is directly disposed on the thin film encapsulation layer TFE. A plastic film, a glass substrate, and a plastic substrate are not disposed between the first conductive layer TS-CL1 and the thin film encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a single-layer structure or a multi-layer structure stacked along the third direction axis DR3 . The multi-layered conductive layer may include at least two or more of transparent conductive layers and metal layers. The multi-layered conductive layer may include metal layers including different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, it will be described that the first conductive layer TS-CL1 includes first conductive patterns and the second conductive layer TS-CL2 includes second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include touch electrodes and touch signal lines.

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic material or an organic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material is at least one of acrylic resins, methacrylic resins, polyisoprene, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins. may include

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may have a single-layer or multi-layer structure. Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include at least one of an inorganic layer and an organic layer. The inorganic layer and the organic layer may be formed by a chemical vapor deposition method.

In the present embodiment, at least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 includes at least one inorganic layer having a density of 2.05 g/cm 3 to 2.4 g/cm 3 . do. A detailed description thereof will be given later.

For the first touch insulating layer TS-IL1 , it is sufficient to insulate the first conductive layer TS-CL1 and the second conductive layer TS-CL2 , and the shape thereof is not limited. The shape of the first touch insulating layer TS-IL1 may be changed according to the shapes of the first conductive patterns and the second conductive patterns. The first touch insulating layer TS-IL1 may entirely cover the thin film encapsulation layer TFE or may include a plurality of insulating patterns. It is sufficient if the plurality of insulating patterns overlap the first connection parts CP1 or second connection parts CP2 to be described later.

Although the two-layer type touch sensing unit is illustrated as an example in this embodiment, the present invention is not limited thereto. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and touch signal lines connected to the touch sensors. The tomographic touch sensing unit may acquire coordinate information in a self-cap method.

As shown in FIG. 6B , the touch sensing unit TS includes first touch electrodes TE1-1 to TE1-3 and first touch signal lines SL1-1 to SL1- connected to the first touch electrodes. 3), the second touch electrodes TE2-1 to TE2-3, and the second touch signal lines SL2-1 to SL2-3 connected to the second touch electrodes TE2-1 to TE2-3. may include The touch sensing unit TS including three first touch electrodes TE1-1 to TE1-3 and three second touch electrodes TE2-1 to TE2-3 is illustrated as an example.

Each of the first touch electrodes TE1-1 to TE1-3 may have a mesh shape in which a plurality of touch openings are defined. Each of the first touch electrodes TE1-1 to TE1-3 includes a plurality of first touch sensor parts SP1 and a plurality of first connection parts CP1. The first touch sensor units SP1 are arranged in the first direction DR1 . Each of the first connection parts CP1 connects two adjacent first touch sensor parts SP1 among the first touch sensor parts SP1 . Although not specifically illustrated, the first touch signal lines SL1-1 to SL1-3 may also have a mesh shape.

The second touch electrodes TE2-1 to TE2-3 insulate and cross the first touch electrodes TE1-1 to TE1-3. Each of the second touch electrodes TE2-1 to TE2-3 may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-3 includes a plurality of second touch sensor parts SP2 and a plurality of second connection parts CP2. The second touch sensor units SP2 are arranged in the second direction DR2 . Each of the second connection parts CP2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2 . The second touch signal lines SL2-1 to SL2-3 may also have a mesh shape.

The first touch electrodes TE1-1 to TE1-3 and the second touch electrodes TE2-1 to TE2-3 are electrostatically coupled. As touch sensing signals are applied to the first touch electrodes TE1-1 to TE1-3, capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2.

A plurality of first touch sensor units SP1, a plurality of first connection units CP1, and first touch signal lines SL1-1 to SL1-3, a plurality of second touch sensor units SP2, a plurality of Some of the second connection parts CP2 and the second touch signal lines SL2-1 to SL2-3 are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A , and other parts are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A . may be formed by patterning the second conductive layer TS-CL2 illustrated in FIG. 6A .

In order to electrically connect the conductive patterns disposed on different layers, a contact hole passing through the first touch insulating layer TS-IL1 shown in FIG. 6A may be formed. Hereinafter, a touch sensing unit TS according to an exemplary embodiment will be described with reference to FIGS. 6C to 6E .

As shown in FIG. 6C , first conductive patterns are disposed on the thin film encapsulation layer TFE. The first conductive patterns may include bridge patterns CP2. The bridge patterns CP2 are directly disposed on the thin film encapsulation layer TFE. The thin film encapsulation layer TFE covering the display area DA is illustrated as an example. The bridge patterns CP2 correspond to the second connection parts CP2 illustrated in FIG. 6B .

As shown in FIG. 6D , a first touch insulating layer TS-IL1 covering the bridge patterns CP2 is disposed on the thin film encapsulation layer TFE. Contact holes CH partially exposing the bridge patterns CP2 are defined in the first touch insulating layer TS-IL1 . Contact holes CH may be formed by a photolithography process.

As shown in FIG. 6E , second conductive patterns are disposed on the first touch insulating layer TS-IL1 . The second conductive patterns include a plurality of first touch sensor units SP1, a plurality of first connection units CP1, first touch signal lines SL1-1 to SL1-3, and a plurality of second touch sensor units. It may include SP2 and second touch signal lines SL2-1 to SL2-3. Although not shown separately, the second touch insulating layer TS-IL2 covering the second conductive patterns is disposed on the first touch insulating layer TS-IL1 .

In an embodiment of the present invention, the first conductive patterns may include first touch electrodes TE1-1 to TE1-3 and first touch signal lines SL1-1 to SL1-3. The first conductive patterns may include second touch electrodes TE2-1 to TE2-3 and second touch signal lines SL2-1 to SL2-3. In this case, the contact holes CH are not defined in the first touch insulating layer TS-IL1 .

Also, in an embodiment of the present invention, the first conductive patterns and the second conductive patterns may be interchanged. That is, the second conductive patterns may include the bridge patterns CP2 .

7A is a partially enlarged view of area AA of FIG. 6A . FIG. 7B is a partial cross-sectional view of FIG. 7A . Fig. 7c is a partial cross-sectional view of Fig. 6a; Hereinafter, the display module DM will be described in more detail with reference to FIGS. 7A to 7C .

7A , the first touch sensor unit SP1 overlaps the non-emission area NPXA. The first touch sensor unit SP1 includes a plurality of first vertical parts SP1-C extending in a first direction DR1 and a plurality of first horizontal parts SP1-L extending in a second direction DR2. includes The plurality of first vertical parts SP1-C and the plurality of first horizontal parts SP1-L may be defined as mesh lines. The line width of the mesh line may be several micrometers.

The plurality of first vertical parts SP1-C and the plurality of first horizontal parts SP1-L are connected to each other to form a plurality of touch openings TS-OP. In other words, the first touch sensor unit SP1 has a mesh shape including a plurality of touch openings TS-OP. Although it is illustrated that the touch openings TS-OP correspond to the emission areas PXA one-to-one, the present invention is not limited thereto. One touch opening TS-OP may correspond to two or more light emitting areas PXA.

Although not shown separately, the first connection parts CP1 , the first touch signal lines SL1-1 to SL1-3 , the second touch sensor parts SP2 , the second connection parts CP2 , and the second touch The signal lines SL2-1 to SL2-3 may also include horizontal portions and vertical portions.

7B and 7C , the second connection parts CP2 are directly disposed on the thin film encapsulation layer TFE. The first touch insulating layer TS-IL1 covering the second connection parts CP2 is directly disposed on the thin film encapsulation layer TFE. The first touch insulating layer TS-IL1 overlaps at least the display area DA. The first touch sensor parts SP1 , the second touch sensor parts SP2 , and the second connection parts CP2 are directly disposed on the first touch insulating layer TS-IL1 .

The second touch insulating layer TS-IL2 is directly disposed on the first touch insulating layer TS-IL1 and includes the first touch sensor units SP1 , the second touch sensor units SP2 , and the second connection units ( SP2 ). CP2) is covered. The second touch insulating layer TS-IL2 overlaps at least the display area DA.

7B and 7C , first touch sensor units SP1 , first connection units CP1 , second touch sensor units SP2 , and second connection units CP2 each having a three-layer structure are exemplary was shown as Each of the first touch sensor parts SP1 , the first connection parts CP1 , the second touch sensor parts SP2 , and the second connection parts CP2 may have a three-layer structure of titanium/aluminum/titanium.

8A is a cross-sectional view illustrating a bubble defect occurring in the display device DD. 8B is a photograph showing a bubble defect occurring in the display device DD. 9 is a graph showing the bubble defect according to the film density.

Reliability evaluation under severe cold conditions was performed on the same display device as the display device DD shown in FIG. 2 . Reliability evaluation was performed at a temperature of 80 to 90 degrees and a humidity of 80% to 90%.

As shown in FIGS. 8A and 8B , air bubbles were collected at the interface between the window WM and the third adhesive member AM3. Most of the bubbles were found to be nitrogen and hydrogen. Nitrogen and hydrogen made up about 80% to about 90% of the bubbles. The bubbles were analyzed to contain trace amounts of carbon dioxide, carbon monoxide and methane.

Samples according to Experiments 1 to 8 were prepared and the reliability of the harsh conditions was evaluated. The experimental results are shown in Table 1 below.

first conductive layer First touch insulating layer (inorganic layer) second conductive layer 2nd touch insulating layer (organic layer) bubble generation Experiment 1 X X X X X Experiment 2 O O O O O Experiment 3 O O O X O Experiment 4 O O X X O Experiment 5 O X X X X Experiment 6 X O X X O Experiment 7 X O X X X Experiment 8 X X X O X

Experiments 1 to 6 were performed based on the display device shown in FIG. 2 . However, only the structure of the touch sensing unit (TS, see FIG. 6A ) was different from each other. In Experiment 1, the touch sensing unit (TS) was omitted, and in Experiments 2 to 6, some of the first conductive layer, the first touch insulating layer (inorganic layer), the second conductive layer, and the second touch insulating layer (organic layer) were was omitted.

In Experiment 7, a glass substrate on which a single-layer inorganic layer was formed was applied instead of the display module (DM, see FIG. 2), and in Experiment 8, a glass substrate on which a single-layered organic layer was formed was applied instead of the display module (DM).

1.90 g/cm 3 silicon nitride layer formed through chemical vapor deposition (PECVD) was applied to the first touch insulating layer (inorganic layer) of Experiments 1 to 8, and the organic layer was formed through a slit coating method An acrylic organic layer was applied.

In light of the bubble generation in Experiments 2-4 and 6, it can be seen that the bubble generation is related to the inorganic layer. Comparing Experiments 6 and 7, it can be seen that the bubbles are not generated by the inorganic film under a single condition, but are related to the thin film encapsulation layer.

Based on the amount of bubbles generated in Experiments 2-4 and 6, it is assumed that the bubbles did not enter from the outside and were generated by reacting the seeds generated during the formation of the inorganic layer with organic matter.

Additional experiments were performed on the samples according to Experiment 2 and Experiment 3. Bubbling time was measured for the samples according to Experiment 2 and Experiment 3.

24 hours) 120 (hours) 168 (hours) 264 (hours) 336 (hours) 500 (hours) Experiment 3 0/4 3/4 4/4 4/4 4/4 4/4 Experiment 2 3/4 4/4 4/4 4/4 4/4 4/4

Reliability was evaluated for each of 4 samples. The samples of Experiment 3 did not generate bubbles after 24 hours, but 3 of the 4 samples of Experiment 2 did bubble.

According to the experimental results in Table 2, it can be seen that the organic layer promotes the generation of air bubbles. It is assumed that the seed reacts with the organic layer.

As shown in Table 3 below, additional experiments were performed on the samples according to Experiments 9 and 10. Bubbling time was measured for the samples according to Experiment 9 and Experiment 10.

24 hours 48 hours 72 hours 196 hours 360 hours 500 hours Experiment 9 0/5 0/5 1/5 1/5 2/5 2/5 Experiment 10 0/5 1/5 1/5 2/5 2/5 2/5

Each sample of Experiment 9 and Experiment 10 had the same structure as the sample of Experiment 2 in Table 1. That is, each sample of Experiment 9 and Experiment 10 has the same structure as the display device shown in FIG. 2 . In sample 9, 3M manufacturer's OCA was applied to the second adhesive member (AM2) and the third adhesive member (AM3), and in sample 10, the TMS manufacturer's OCA was applied to the second adhesive member (AM2) and the third adhesive member (AM3). was applied. Each manufacturer has a different composition of OCA.

According to the experimental results of Table 3, it can be seen that the time of the bubbles generated varies according to the composition of the adhesive member. Although not separately attached, it can be seen that the amount of air bubbles generated during the same time also differs depending on the composition of the adhesive member.

Samples having different densities of the inorganic layer were prepared and reliability evaluation was performed. A sample having the same structure as in Experiment 2 was prepared, but only the density of the inorganic layer was different for each sample.

In general, the silicon nitride layer is formed through a chemical vapor deposition process using a mixed gas _{of silane (SiH 4} ), nitrogen (N ₂ ), hydrogen (H ₂ ), and ammonia (NH _{3 ).} The flow rates of silane (SiH ₄ ) and hydrogen (H ₂ ) affect the density of the silicon nitride layer. In addition, power and atmospheric pressure in the chamber may affect the density of the silicon nitride layer. Other factors were adjusted in the same way, and _{the flow rate of silane (SiH 4} ) was adjusted to form inorganic layers having different densities depending on the samples.

The graph of FIG. 9A shows the bubble defect according to the film density. In the display device sample in which the film density of the silicon nitride layer was 2.05 g/cm 3 or more, no bubbles were generated.

Since the seed generated in the process of forming the silicon nitride layer is sealed by the high-density silicon nitride layer, the seed and the organic material do not react in the display device sample having a film density of 2.05 g/cm 3 or more, so that bubbles do not occur. It is estimated.

In a display device including an inorganic film having a film density of less than 2.05 g/cm 3 , the seeds penetrate the low-density inorganic film to the second touch insulating layer (TS-IL2) and the organic adhesive layers (AM2, AM3, see FIG. 2). reach It is estimated that bubbles are generated as the seeds react with the second touch insulating layer TS-IL2 and the organic adhesive layers AM2 and AM3.

The bubbles generated in the second touch insulating layer TS-IL2 pass through the second adhesive member AM2, the optical member LM, and the third adhesive member AM3 to form the window WM and the third adhesive member AM3. ) is collected at the interface of Air bubbles generated by the second adhesive member AM2 and the third adhesive member AM3 are also collected at the interface between the window WM and the third adhesive member AM3.

On the other hand, since flexibility decreases as the density of the inorganic layer increases, the density of the inorganic layer is preferably 2.4 g/cm 3 or less. This is to prevent cracks in the inorganic layer due to externally applied stress.

In an embodiment of the present invention, at least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 described with reference to FIG. 6A has a density of 2.05 g/cm 3 to 2.4 g/cm 3 . It is preferable to include an inorganic layer having While suppressing the above-described bubble generation, it is possible to prevent cracks in the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2.

In an embodiment of the present invention, each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include a silicon nitride layer having the above-described density.

In an embodiment of the present invention, the first touch insulating layer TS-IL1 may include the silicon nitride layer having the above-described density. In this case, the second touch insulating layer TS-IL2 is preferably an organic layer. When an inorganic layer having a density less than the above-described density is formed on the second touch insulating layer TS-IL2 , bubbles may be generated in the process of forming the second touch insulating layer TS-IL2 . The second touch insulating layer TS-IL2 is preferably an organic layer in order to prevent bubbles from being generated and to improve flexibility.

In an embodiment of the present invention, the second touch insulating layer TS-IL2 may include a silicon nitride layer having the above-described density. When the second touch insulating layer TS-IL2 has a multilayer structure, it is preferable that a silicon nitride layer having the above-described density is disposed on the uppermost layer. In this case, the first touch insulating layer TS-IL1 may include an organic layer and/or an inorganic layer.

10A is a cross-sectional view of a display device DD-2 according to an exemplary embodiment. 10B is an enlarged view of a cross-section of a display device DD-2 according to an exemplary embodiment. 11 is a cross-sectional view of a display device DD-3 according to an exemplary embodiment. A detailed description of the same configuration as that described with reference to FIGS. 1 to 9 will be omitted.

10A and 10B , the display device DD-2 includes a protective film PM, a display module DM-1, a touch panel TSP, a window WM, and a first adhesive member AM1. ), a second adhesive member AM2 , and a third adhesive member AM3 . The display module DM-1 may include an organic light emitting display panel DP and an anti-reflection layer RPL. The anti-reflection layer RPL is directly disposed on the organic light emitting display panel DP.

The antireflection layer RPL includes conductive layers RPL-ML1 and RPL-ML2 overlapping the display area DA and the non-display area NDA, respectively, and in the display area DA and the non-display area NDA, respectively. It may include overlapping insulating layers RPL-IL1 and RPL-IL2. An anti-reflection layer RPL including two conductive layers RPL-ML1 and RPL-ML2 and two insulating layers RPL-IL1 and RPL-IL2 is illustrated as an example.

The conductive layers RPL-ML1 and RPL-ML2 and the insulating layers RPL-IL1 and RPL-IL2 may be alternately stacked. The stacking order is not particularly limited. The first conductive layer RPL-ML1 may include a metal having an absorption rate of about 30% or more. The first conductive layer PRL-ML1 may be formed of a material having a refractive index n of about 1.5 to 7 and an absorption coefficient k of about 1.5 to 7. The first conductive layer RPL-ML1 includes chromium (Cr), molybdenum (Mo), tungsten (W), titanium (Ti), nickel (Ni), cobalt (Co), copper oxide (CuO), and titanium nitride (TiNx). ) and may include any one or more of nickel sulfide (NiS). The first conductive layer RPL-ML1 may be a metal layer including any one of the above-described materials. The second conductive layer RPL-ML2 may also include the aforementioned metals.

The first insulating layer (RPL-IL1) and the second insulating layer (RPL-IL2) are silicon oxide (SiO2), titanium oxide (TiO2), lithium fluoride (LiF), calcium fluoride (CaF2), magnesium fluoride (MaF2), Silicon nitride (SiNx), tantalum oxide (Ta2O5), niobium oxide (Nb2O5), silicon carbon nitride (SiCN), molybdenum oxide (MoOx), iron oxide (FeOx) and chromium oxide (CrOx) can The light OL incident from the outside is partially reflected from the first conductive layer RPL-ML1 (hereinafter, referred to as first reflected light RL1 ) and partially reflected from the second conductive layer RPL-ML2 (second reflected light). (RL2)).

The first insulating layer RPL-IL1 adjusts the phase of the light passing through the first insulating layer RPL-IL1 so that the phase difference between the first reflected light RL1 and the second reflected light RL2 is about 180°. Accordingly, the first reflected light RL1 and the second reflected light RL2 are canceled.

The thickness and material of the first conductive layer RPL-ML1, the second conductive layer RPL-ML2, the first insulating layer RPL-IL1, and the second insulating layer RPL-IL2 are the first reflected light ( RL1) and the second reflected light RL2 may be selected to satisfy the destructive interference condition, and are not particularly limited. Although not shown separately, the anti-reflection layer RPL may further include a black matrix BM.

At least one of the first insulating layer (RPL-IL1) and the second insulating layer (RPL-IL2) is 2.05 g/cm 3 to 2.4 g/cm 3 to prevent bubbles from being generated in the process of forming the anti-reflection layer (RPL). It may include an inorganic layer having a density of. The first insulating layer RPL-IL1 and the second insulating layer RPL-IL2 may include the silicon nitride layer having the above-described density.

11 , the display device DD-2 includes a protective film PM, a display module DM-2, a window WM, a first adhesive member AM1, and a second adhesive member AM2. ) is included. The display module DM-2 may include an organic light emitting display panel DP, a touch sensing unit TS, and an anti-reflection layer RPL. The touch sensing unit TS is disposed directly on the organic light emitting display panel DP, and the anti-reflection layer RPL is disposed directly on the touch sensing unit TS.

The touch sensing unit TS may have the same configuration as described with reference to FIGS. 1 to 9 , and the anti-reflection layer RPL may have the same configuration as described with reference to FIGS. 10A and 10B .

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art or those having ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be defined by the claims.

DD: Display device DA: Display area
NDA: Non-display area WM: Window
DM: Display module PM: Protective film

Claims (20)

an organic light emitting display panel comprising a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer; and
A touch sensing unit disposed on the uppermost inorganic thin film of the thin film encapsulation layer,
The touch sensing unit,
a first conductive layer disposed directly on the thin film encapsulation layer;
a second conductive layer disposed directly on the thin film encapsulation layer and disposed on a layer different from the first conductive layer;
at least one inorganic layer disposed directly on the thin film encapsulation layer and having a density of 2.05 g/cm 3 to 2.4 g/cm 3 ;
an organic layer disposed on the at least one inorganic layer; and
and a window facing the organic light emitting display panel with the first conductive layer, the at least one inorganic layer, and the organic layer interposed therebetween. According to claim 1,
The at least one inorganic layer includes a silicon nitride layer having a density of 2.05 g/cm 3 to 2.4 g/cm 3 . According to claim 1,
The thin film encapsulation layer,
a plurality of inorganic thin films; and
and at least one organic thin film disposed between the plurality of inorganic thin films. 4. The method of claim 3,
The at least one inorganic layer,
A display device comprising: a first inorganic layer disposed between the first conductive layer and the second conductive layer; and a second inorganic layer disposed on the first conductive layer and the second conductive layer. 4. The method of claim 3,
The at least one inorganic layer is disposed between the first conductive layer and the second conductive layer, and the organic layer is disposed directly on the second conductive layer. 6. The method of claim 5,
and an organic adhesive layer coupling the window to the organic light emitting display panel. According to claim 1,
the at least one inorganic layer is disposed directly on the second conductive layer,
The touch sensing unit further includes an intermediate insulating layer disposed between the first conductive layer and the second conductive layer. According to claim 1,
The organic layer is an organic adhesive layer that couples the window to the organic light emitting display panel. According to claim 1,
The display device further comprising a polarizing film disposed between the at least one inorganic layer and the window. According to claim 1,
The first conductive layer includes a bridge pattern,
The second conductive layer may include a connection part crossing the bridge pattern, first touch sensor parts connected by the connection part, and second touch sensor parts connected by the bridge pattern. 11. The method of claim 10,
The light emitting device layer includes light emitting regions and a non-light emitting region adjacent to the light emitting regions,
Each of the first touch sensor units and the second touch sensor units has a mesh shape overlapping the non-emission area. According to claim 1,
The first conductive layer includes a connection part, first touch sensor parts connected by the connection part, and second touch sensor parts spaced apart from the first touch sensor parts,
The second conductive layer connects the second touch sensor parts and includes a bridge pattern that crosses the connection part. According to claim 1,
The first conductive layer includes a first connection part and first touch sensor parts connected by the first connection part,
The second conductive layer includes a second connection part crossing the first connection part and second touch sensor parts connected by the second connection part. According to claim 1,
The display device of claim 1, wherein the first light reflected from the first conductive layer and the second light reflected from the second conductive layer have a phase difference of 180 degrees. 15. The method of claim 14,
The at least one inorganic layer,
A display device comprising: a first inorganic layer disposed between the first conductive layer and the second conductive layer; and a second inorganic layer disposed on the first conductive layer and the second conductive layer. According to claim 1,
The window is a display device including a plastic film. 17. The method of claim 16,
The organic layer is an organic adhesive layer in contact with the window. According to claim 1,
The thin film encapsulation layer,
a first inorganic thin film;
an organic thin film disposed on the first inorganic thin film; and
and a second inorganic thin film disposed on the organic thin film. According to claim 1,
The thin film encapsulation layer,
a first inorganic thin film;
an organic thin film disposed on the first inorganic thin film;
a second inorganic thin film disposed on the organic thin film;
a third inorganic thin film disposed on the second inorganic thin film;
and the third inorganic thin film is the uppermost inorganic thin film.
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