KR102339014B1 - Manufacturing method for semiconductor package test socket and semiconductor package test socket - Google Patents

Abstract

Disclosed is a method for manufacturing a semiconductor package test socket. The method for manufacturing the semiconductor package test socket comprises: (a) a step of preparing a plate wherein a plurality of main holes are formed upward and downward; (b) a step of forming an insulation unit including a plurality of hole arrangement units formed inside each of the plurality of main holes; (c) a step of forming an inside hole penetrating each of the plurality of hole arrangement units upward and downward; and (d) a step of forming an elastomer contact pin in the inside hole.

Description

Socket manufacturing method for semiconductor package test and socket for semiconductor package test

The present application relates to a method of manufacturing a socket for testing a semiconductor package and a socket for testing a semiconductor package.

Semiconductor finished products undergo a final electrical performance test before shipment. The socket for semiconductor test is a consumable part that connects the finished semiconductor product and the test board during this test process.

In particular, coaxial sockets are used to minimize power loss, minimize electromagnetic cladding, and minimize impedance changes.

Conventionally, in relation to a coaxial socket, a spring probe pin is used as a coaxial socket, a signal is separated by an insulator action between a pin and a socket cavity, or a metal body or a plastic body is used.

However, since the coaxial socket has to make a coaxial structure in very small fine holes, the manufacturing process was difficult.

The technology that is the background of the present application is disclosed in Korean Patent Publication No. 10-1955269.

An object of the present application is to solve the problems of the prior art described above, and to provide a method for manufacturing a socket for testing a semiconductor package that can be easily manufactured, and a socket for testing a semiconductor package.

However, the technical problems to be achieved by the embodiment of the present application are not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above technical problem, a method for manufacturing a socket for testing a semiconductor package according to an aspect of the present application includes the steps of: (a) preparing a plate in which a plurality of main holes are formed in the top and bottom; (b) forming an insulating part including a plurality of hole arranging parts formed inside each of the at least one first main hole among the plurality of main holes and a cover part covering an upper surface of the plate; (c) forming a plurality of inner holes vertically penetrating each of the plurality of hole arrangement parts in each of the plurality of hole arrangement parts, and a first upper hole communicating with each of the plurality of inner holes in the cover part up and down and forming a second upper hole communicating vertically with each of the at least one second main hole among the plurality of main holes. and (d) forming a first elastomeric contact pin in a first pin arrangement hole formed by the inner hole and the first upper hole, and in a second pin arrangement hole formed by the second main hole and the second upper hole. and forming a second elastomeric contact pin.

In the method for manufacturing a socket for testing a semiconductor package according to an aspect of the present application, the plate, the first elastomeric contact pin, and the second elastomeric contact pin may be made of a conductive material.

In the method for manufacturing a socket for semiconductor package test according to an aspect of the present application, the step (d) is to fill each of the first pin placement hole and the second pin placement hole with a mixed solution containing metal powder and liquid silicon and harden and can act magnetically.

In the method of manufacturing a socket for testing a semiconductor package according to an aspect of the present application, in step (b), the insulating material is applied to the plate so that the insulating material is filled in the first main hole, and the insulating material is cured and planarizing the insulating material to form the insulating part.

In the method for manufacturing a socket for testing a semiconductor package according to an aspect of the present application, the step (b) includes disposing a mask having a hole for opening the first main hole upwardly on an upper surface of the plate, and forming the insulating material can be spread

In the method of manufacturing a socket for testing a semiconductor package according to an aspect of the present disclosure, a first elastomeric contact pin may electrically connect an object and a test unit, and a second elastomeric contact pin may electrically interact with the plate.

A socket for testing a semiconductor package according to an aspect of the present application includes: a plate having a plurality of main holes formed therein; A plurality of hole arranging parts formed inside each of the at least one first main hole among the plurality of main holes and a cover part covering an upper surface of the plate, wherein the plurality of hole arranging parts are provided in each of the plurality of hole arranging parts An inner hole penetrating each of the upper and lower portions is formed, and the cover portion communicates vertically with each of a first upper hole communicating with each of the plurality of inner holes and a second main hole of at least one of the plurality of main holes. an insulating portion having a second upper hole formed therein; a first elastomeric contact pin disposed in a first pin arrangement hole formed by the inner hole and the first upper hole; and a second elastomeric contact pin disposed in a second pin placement hole formed by the second main hole and the second upper hole.

In the socket for testing a semiconductor package according to an aspect of the present application, the plate, the first elastomeric contact pin, and the second elastomeric contact pin may be made of a conductive material.

In the socket for testing a semiconductor package according to an aspect of the present disclosure, the first elastomeric contact pin and the second elastomeric contact pin may be formed of a material including metal powder and liquid silicon.

In the socket for testing a semiconductor package according to an aspect of the present disclosure, the insulating part may be made of an insulating material.

In the socket for testing a semiconductor package according to an aspect of the present disclosure, the first elastomeric contact pin may electrically connect the object and the test unit, and the second elastomeric contact pin may electrically interact with the plate.

A method for manufacturing a socket for testing a semiconductor package according to another aspect of the present application includes the steps of: (a) preparing a plate in which a plurality of main holes are formed vertically; (b) forming an insulating part including a plurality of hole arranging parts formed inside each of the plurality of main holes; (c) forming an inner hole penetrating each of the plurality of hole arrangement parts up and down; and (d) forming an elastomeric contact pin in the inner hole.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present disclosure, the plate and the elastomeric contact pin may be made of a conductive material.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present application, the step (d) may include filling the inner hole with a mixed solution including metal powder and liquid silicon, curing the mixture, and applying a magnetic force.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present application, in step (b), an insulating material may be filled in the plurality of main holes and the insulating material may be cured to form the insulating part.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present disclosure, the elastomeric contact pin may electrically connect the object and the test unit.

A socket for testing a semiconductor package according to another aspect of the present application includes: a plate having a plurality of main holes formed therein; an insulating part including a plurality of hole arranging parts formed inside each of the plurality of main holes, wherein each of the plurality of hole arranging parts has an inner hole penetrating each of the plurality of hole arranging parts up and down; and an elastomeric contact pin disposed in the inner hole.

In the socket for testing a semiconductor package according to another aspect of the present application, the plate and the elastomeric contact pin may be formed of a conductive material.

In the socket for testing a semiconductor package according to another aspect of the present disclosure, the elastomeric contact pin may be formed of a material including metal powder and liquid silicon.

In the socket for testing a semiconductor package according to another aspect of the present disclosure, the insulating part may be made of an insulating material.

In the socket for testing a semiconductor package according to another aspect of the present disclosure, the elastomeric contact pin may electrically connect the object and the test unit.

A method for manufacturing a socket for testing a semiconductor package according to another aspect of the present application includes the steps of: (a) preparing a plate in which a plurality of main holes are formed vertically; (b) forming an insulating part including a plurality of hole arranging parts formed inside each of the plurality of main holes; (c) forming a first inner hole penetrating the center of some of the plurality of hole arrangement parts vertically and a second inner hole passing vertically through another part of the plurality of hole arrangement parts in a radial direction ; and (d) forming a first elastomeric contact pin in the first inner hole and forming a second elastomeric contact pin in the second inner hole.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present application, the plate, the first elastomeric contact pin, and the second elastomeric contact pin may be made of a conductive material.

In the method for manufacturing a socket for testing a semiconductor package according to another aspect of the present application, in the step (d), the first and second inner holes are filled with a mixed solution containing metal powder and liquid silicon, cured, and magnetic force can be applied. have.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present application, in step (b), an insulating material may be filled in the plurality of main holes and the insulating material may be cured to form the insulating part.

In the method of manufacturing a socket for testing a semiconductor package according to another aspect of the present application, the first elastomeric contact pin electrically connects the object and the test unit, and the second elastomeric contact pin has one end and the other end of the plate in the radial direction. is in contact with, and may be electrically interlocked with the plate.

A socket for testing a semiconductor package according to another aspect of the present application includes: a plate having a plurality of main holes formed therein; A first inner hole including a plurality of hole arranging units formed inside each of the plurality of main holes, a first inner hole penetrating a part of the plurality of hole arranging units vertically through a central portion, and another part of the plurality of hole arranging units an insulating portion having a second inner hole that crosses in the radial direction and penetrates vertically; a first elastomeric contact pin formed in the first inner hole; and a second elastomeric contact pin formed in the second inner hole.

In the socket for testing a semiconductor package according to another aspect of the present application, the plate, the first elastomeric contact pin, and the second elastomeric contact pin may be made of a conductive material.

In the socket for testing a semiconductor package according to another aspect of the present disclosure, the first elastomeric contact pin and the second elastomeric contact pin may be formed of a material including metal powder and liquid silicon.

In the socket for testing a semiconductor package according to another aspect of the present disclosure, the insulating part may be made of an insulating material.

In the socket for testing a semiconductor package according to another aspect of the present application, the first elastomeric contact pin electrically connects the object and the test unit, and the second elastomeric contact pin has one end and the other end in contact with the plate in the radial direction, respectively. and may be electrically interlocked with the plate.

The above-described problem solving means are merely exemplary, and should not be construed as limiting the present application. In addition to the exemplary embodiments described above, additional embodiments may exist in the drawings and detailed description.

According to the above-described problem solving means of the present application, a hole arrangement made of an insulating material is formed in a first main hole among a plurality of main holes, a first elastomeric contact pin is formed in an inner hole of the hole arrangement part, and a plurality of main holes are formed. By forming the second elastomeric contact pin in the second main hole, the first elastomeric contact pin electrically connects the object and the test board, and the second elastomeric contact pin is electrically interlocked with the plate to serve as a grounding socket for semiconductor testing. can be manufactured. At this time, since the first elastomeric contact pin and the second elastomeric contact pin can be formed by injecting and curing a mixture containing metal powder and liquid silicon into each of the first and second pin placement holes and applying a magnetic force, the semiconductor test The socket for use can be easily manufactured.

In addition, according to the above-described problem solving means of the present application, by forming a hole arrangement made of an insulating material in the plurality of main holes and forming an elastomeric contact pin in the inner hole of the hole arrangement portion, the elastomeric contact pin electrically connects the object and the test board. connected to and the plate acts as a ground to manufacture a socket for semiconductor testing. In this case, since the elastomeric contact pin may be formed by injecting and curing a mixture containing metal powder and liquid silicon into the inner hole (pin arrangement hole) and applying a magnetic force, a socket for semiconductor test can be easily manufactured.

In addition, according to the above-described problem solving means of the present application, the first elastomeric contact pins disconnected from the plate are formed in the first inner holes formed in some of the plurality of hole arrangement portions formed in the plurality of main holes, and the plurality of holes are formed. By forming a second elastomeric contact pin electrically connected to the plate in the second inner hole formed in another part of the arrangement portion, the first elastomeric contact pin electrically connects the object and the test board, and the second elastomeric contact pin It is possible to manufacture a socket for semiconductor testing that functions as a ground by electrically interlocking with the plate. At this time, since the first elastomeric contact pin and the second elastomeric contact pin can be formed by injecting and curing a mixture containing metal powder and liquid silicon into the first and second inner holes, respectively, and applying a magnetic force, for semiconductor testing The socket can be easily manufactured.

1 is a schematic conceptual cross-sectional view for explaining a step of preparing a plate of a method for manufacturing a socket for testing a semiconductor package according to a first embodiment of the present application.
2 is a schematic conceptual cross-sectional view for explaining the step of forming an insulating portion of the method for manufacturing a socket for testing a semiconductor package according to the first embodiment of the present application.
3 is a schematic conceptual cross-sectional view of a plate on which an insulating portion is formed in the method for manufacturing a socket for testing a semiconductor package according to the first embodiment of the present application.
4 is a schematic conceptual cross-sectional view for explaining the steps of forming an inner hole, a first upper hole, and a second upper hole of the socket manufacturing method for a semiconductor package test according to the first embodiment of the present application.
5 is a semiconductor package test according to the first embodiment of the present application for explaining the steps of forming a first elastomeric contact pin and a second elastomeric contact pin of the method for manufacturing a socket for testing a semiconductor package according to the first embodiment of the present application As a schematic conceptual cross-sectional view of the socket, it may be a cross-sectional view taken along line AA′ of FIG. 6 .
6 is a schematic conceptual plan view of a socket for testing a semiconductor package according to the first embodiment of the present application.
7 is a schematic conceptual cross-sectional view for explaining a step of preparing a plate of a method for manufacturing a socket for testing a semiconductor package according to a second embodiment of the present application.
8 is a schematic conceptual cross-sectional view for explaining a step of forming an insulating portion of a method for manufacturing a socket for testing a semiconductor package according to a second embodiment of the present application.
9 is a schematic conceptual cross-sectional view for explaining the step of forming an inner hole of a method for manufacturing a socket for testing a semiconductor package according to a second embodiment of the present application.
10 is a schematic conceptual cross-sectional view of a socket for testing a semiconductor package according to a second embodiment of the present application for explaining the step of forming an elastomeric contact pin of a method for manufacturing a socket for testing a semiconductor package according to the second embodiment of the present application; It may be a cross-sectional view taken along line AA′ of FIG. 11 .
11 is a schematic conceptual plan view of a socket for testing a semiconductor package according to a second embodiment of the present application.
12 is a schematic conceptual plan view of a socket for testing a semiconductor package according to a third embodiment of the present application.
13 is an enlarged view of A of FIG. 12 , and is a conceptual diagram.
FIG. 14A is a cross-sectional view taken along line BB of FIG. 12 , and FIG. 14B is a cross-sectional view taken along CC of FIG. 12 .
Figure 15 (a) is a cross-sectional view of Figure 12 of the semiconductor package test socket according to the third embodiment of the present application provided with an insulating film layer, Figure 15 (b) is a product of the present application provided with an insulating film layer A cross-sectional view taken along line CC of FIG. 12 of a socket for testing a semiconductor package according to the third embodiment.
16 (a) is a schematic conceptual cross-sectional view illustrating a step of preparing a plate of a method for manufacturing a socket for semiconductor package test according to a third embodiment of the present application by using the cross section BB of FIG. 12 , FIG. (b) is a schematic conceptual cross-sectional view illustrating the step of preparing a plate of a method for manufacturing a socket for semiconductor package testing according to a third embodiment of the present application using the CC section of FIG. 12,
FIG. 17A is a schematic conceptual cross-sectional view illustrating a step of forming an insulating part of a method for manufacturing a socket for semiconductor package test according to a third embodiment of the present application by using the cross-section BB of FIG. 12 , and FIG. 17 (b) is a schematic conceptual cross-sectional view illustrating the step of forming an insulating part of a method for manufacturing a socket for semiconductor package test according to a third embodiment of the present application using the CC section of FIG. 12 ,
Figure 18 (a) is a schematic view for explaining the step of forming the first and second inner holes of the socket manufacturing method for a semiconductor package test according to the third embodiment of the present application by using the cross section BB of Figure 12 It is a conceptual cross-sectional view, and (b) of FIG. 18 is to explain the step of forming the first and second inner holes of the method for manufacturing a socket for semiconductor package test according to the third embodiment of the present application using the CC cross-section of FIG. 12 . It is a schematic conceptual cross-sectional view shown.
Figure 19 (a) is to explain the step of forming the first elastomeric contact pin and the second elastomeric contact pin of the method for manufacturing a socket for semiconductor package test according to the third embodiment of the present application by using the cross section BB of Figure 12. It is a schematic conceptual cross-sectional view, and FIG. 18 (b) is a first elastomeric contact pin and a second elastomeric contact pin of a method for manufacturing a socket for semiconductor package test according to the third embodiment of the present application using the CC cross-section of FIG. 12 . It is a schematic conceptual cross-sectional view shown to explain the step of forming the .
FIG. 20 (a) is a schematic conceptual cross-sectional view illustrating the step of forming an insulating film layer of a method for manufacturing a socket for semiconductor package test according to a third embodiment of the present application by using the cross section BB of FIG. 12 , 18B is a schematic conceptual cross-sectional view illustrating a step of forming an insulating film layer of a method for manufacturing a socket for semiconductor package test according to a third embodiment of the present application by using the CC cross-section of FIG. 12 .

Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement them. However, the present application may be implemented in several different forms and is not limited to the embodiments described herein. And in order to clearly explain the present application in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout this specification, when a part is "connected" with another part, it is not only "directly connected" but also "indirectly connected" or "electrically connected" with another element interposed therebetween. "Including cases where

Throughout this specification, when a member is positioned “on”, “on”, “on”, “on”, “under”, “under”, or “under” another member, this means that a member is positioned on the other member. It includes not only the case where they are in contact, but also the case where another member exists between two members.

Throughout this specification, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated.

In addition, terms (upper, upper, upper, lower, lower, etc.) related to directions or positions in the description of the embodiments of the present application are set based on the arrangement state of each component shown in the drawings. For example, when looking at FIGS. 1 to 4 , the overall direction toward the 12 o'clock direction is the upper side, the overall side toward the 12 o'clock direction is the upper surface, the overall direction toward the 12 o'clock direction is the upper side, and the overall direction toward the 6 o'clock direction is the upper side. A direction toward the bottom may be a lower portion, and a portion generally oriented toward the 6 o'clock direction toward the 12 o'clock direction may be the lower portion.

The present application relates to a method of manufacturing a socket for testing a semiconductor package and a socket for testing a semiconductor package.

First, a method of manufacturing a socket for testing a semiconductor package according to a first embodiment of the present application (hereinafter referred to as 'this first manufacturing method') will be described.

Referring to FIG. 1 , the first manufacturing method includes a step (first step) of preparing a plate 1 in which a plurality of main holes 11 are formed vertically. The plurality of main holes 11 may be formed at intervals in the direction of the surface of the plate 1 . The plate 1 may be made of a conductive material. For example, the plate 1 may be made of a metal material.

Also, referring to FIGS. 2 and 3 , the first manufacturing method includes a step (second step) of forming the insulating part 2 . The insulating part 2 includes a plurality of hole arranging parts 21 formed inside each of at least one (part of) first main hole 11a among the plurality of main holes 11 . In addition, the insulating portion 2 includes a cover portion 22 that covers the upper surface of the plate (1). That the cover part 22 covers the upper surface of the plate 1 may mean that it is formed while covering not only the upper area (upper surface) of the plate 1 but also the upper area of the plurality of main holes 11 . Accordingly, the cover part 22 may be formed on the upper side of the plate 1 and the upper side of the first main hole 11a and the second main hole 11b. For reference, as will be described later, the hole arranging part 21 is formed in the first main hole 11a and the inner hole 23 in which the first elastomeric contact pin 3a is disposed is formed in the hole arranging part 21 . , 1 , the diameter of the cross-section of the first main hole 11a may be relatively larger than the diameter of the cross-section of the second main hole 11b.

For example, referring to FIGS. 2 and 3 , the second step may be referred to as a molding operation. An insulating material is formed on the upper surface of the plate 1 so that the insulating material is filled in the inside of the first main hole 11a. By coating, curing the insulating material, and planarizing the insulating material, the insulating portion 2 can be formed. Specifically, in the second step, an insulating material is filled in the inside of the first main hole 11a and an insulating material is applied to the upper surface of the plate 1 and the entire upper surface of the plurality of main holes 11, and the plate 1 At least a portion of the upper surface of the insulator and the upper surface of the insulating material remaining on the upper side of the plurality of main holes 11 may be planarized so as to be flat.

Accordingly, the insulating part 2 may be made of an insulating material. For example, the insulating material may include one or more of silicone, rubber, and the like. Accordingly, the insulating part 2 may include one or more of silicone, rubber, and the like.

Also, in the second step, a mask having a hole for opening the first main hole 11a upward may be disposed on the upper surface of the plate 1 , and an insulating material may be applied thereto. Accordingly, the upper surface of the plate 1 by the mask and the upper side of the second main hole 11b that is a part of the plurality of main holes 11 (for example, it may be a hole other than the first main hole 11a) is Therefore, when the insulating material is applied, the insulating material does not flow into the second main hole 11b and fills the inside of the first main hole 11a and can be applied while covering the upper surface of the plate 1 .

In addition, referring to FIG. 4 , in the first manufacturing method, an inner hole 23 penetrating each of the plurality of hole arranging parts 21 up and down is formed in each of the plurality of hole arranging parts 21 , and a cover part is formed. In 22, a first upper hole 24 communicating vertically with each of the plurality of inner holes 23 and a second main hole 11b of at least one of the plurality of main holes 11 communicating vertically with each other and 2 forming the upper hole 25 (a third step). In this third step, the first pin arrangement hole 26 formed by the inner hole 23 and the first upper hole 24 is formed, and the second main hole 11b and the second upper hole 15 are formed. It can be said that the second pin arrangement hole 27 to be formed is formed.

For example, in the third step, the holes 23 , 24 , and 25 may be formed by irradiating a laser.

In addition, when the above-described mask is used in the second step, in the third step, a hole may be formed in the mask so that the second main hole 11b and the second upper hole 25 communicate with each other.

Also, referring to FIG. 5 , in the first manufacturing method, the first elastomeric contact pins 3a are formed in the first pin placement holes 26 formed by the inner hole 23 and the first upper hole 24 . and forming the second elastomeric contact pin 3b in the second pin placement hole 27 formed by the second main hole 11b and the second upper hole 25 (a fourth step).

The first elastomeric contact pin 3a and the second elastomeric contact pin 3b may be formed of a conductive material. For example, the first elastomeric contact pin 3a and the second elastomeric contact pin 3b may be formed of a material (material) including metal powder and liquid silicon.

For example, in the fourth step, each of the first pin placement hole 26 and the second pin placement hole 27 is filled with a mixed solution containing metal powder and liquid silicone, cured, and magnetic force is applied to the first elastomeric contact A fin 3a and a second elastomeric contact fin 3b may be formed. Since the metal powder is conductive, the first and second elastomeric contact pins 3a and 3b made of a material including the metal powder may be conductive (conductive). For example, the metal powder may be a gold powder. In addition, the upper and lower portions of each of the first elastomeric contact pin 3a and the second elastomeric contact pin 3b protrude to the upper and lower sides of the first pin placement hole 26 and the second pin placement hole 27, respectively. The mixed solution filled in the first pin arrangement hole 26 and the second pin arrangement hole 27 by the action of a magnetic force is the upper portion of each of the first pin arrangement hole 26 and the second pin arrangement hole 27 And each of the lower portions may be cured in a form that protrudes upward and downward, respectively. For reference, after the mixture solution is filled in the first pin arrangement hole 26 and the second pin arrangement hole 27 , each of the plurality of first pin arrangement holes 26 and the plurality of second pin arrangement holes 27 is By positioning the magnets on the upper and lower sides, magnetic force may act on the mixed solution filled in each of the plurality of first pin arrangement holes 26 and the plurality of second pin arrangement holes 27 . In addition, at this time, each of the first elastomeric contact pins 3a and the second elastomeric contact pins 3b to be formed to be in contact with the inner surfaces of the first pin arrangement hole 26 and the second pin arrangement hole 27, respectively. can

In addition, the portion (upper portion) protruding upward of each of the first pin placement hole 26 and the second pin placement hole 27 of the first elastomeric contact pin 3a and the second elastomeric contact pin 3b is the upper end It may have a shape in which the cross-sectional area decreases as it goes toward the lower side of each of the first and second pin placement holes 26 and 27 of the first elastomeric contact pin 3a and the second elastomeric contact pin 3b. The protruding portion (lower portion) may have a shape in which the cross-sectional area decreases toward the bottom.

For reference, since the material constituting each of the first and second elastomeric contact pins 3a and 3b may include gold powder, the first and second elastomeric contact pins 3a and 3b are each formed of first and second gold It can also be called a powder contactor.

According to the first present manufacturing method described above, the plate 1 and the second elastomeric contact pin 3b can be energized. In addition, the second elastomeric contact pin 3b is formed to be in contact with the inner surface of the second pin arrangement hole 27, and the portion in the second main hole 11b of the second elastomeric contact pin 3b is a plate ( 1) can be in contact with. Accordingly, the second elastomeric contact pin 3b may be electrically integrated with the plate 1 . In other words, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 .

In addition, according to the first manufacturing method described above, the first elastomeric contact pin 3a may be energized. In addition, the first elastomeric contact pin 3a may be surrounded by the insulating part 2 . Accordingly, the first elastomeric contact pin 3a may not be electrically interlocked with the plate 1 .

Also, referring to FIG. 6 , the first manufacturing method includes forming the PREVENTION LEAKED LINE 9 along the perimeter of the manufactured semiconductor test socket in the plane direction. The PREVENTION LEAKED LINE 9 may be formed to surround the periphery of the manufactured semiconductor test socket.

Accordingly, when the semiconductor package of the socket for semiconductor package test manufactured by the first manufacturing method is tested on the semiconductor package, the first elastomeric contact pin 3a is an object (finished semiconductor product, such as a semiconductor package) in contact with the lower portion thereof. and a test board (printed circuit board) in contact with the upper portion thereof may be electrically connected. Accordingly, an electrical signal between the object positioned below the first elastomeric contact pin 3a and the test board positioned above the first elastomeric contact pin 3a may pass through the first elastomeric contact pin 3a. In addition, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 . Accordingly, when testing the semiconductor package, the second elastomeric contact pin 3b may serve as a ground together with the plate 1 through the plate 1 electrically connected to the ground.

Hereinafter, a socket for a semiconductor package test (hereinafter referred to as a 'this first test socket') according to a first embodiment of the present application will be described. However, the first test socket may be manufactured by the first manufacturing method described above. Accordingly, in the description of the first test socket, descriptions that overlap with those described in the first manufacturing method will be simplified or omitted, and the same reference numerals will be used for the same or similar components.

Referring to FIG. 5 , the first test socket includes a plate 1 in which a plurality of main holes 11 are formed vertically. The plurality of main holes 11 may be formed at intervals in the direction of the surface of the plate 1 . The plate 1 may be made of a conductive material. For example, the plate 1 may be made of metal.

In addition, referring to FIGS. 5 and 6 , the first test socket includes an insulating part 2 . The insulating part 2 includes a plurality of hole arrangement parts 21 formed in each of the first main holes 11a of some of the plurality of main holes 11 . In addition, the insulating portion 2 includes a cover portion 22 that covers the upper surface of the plate (1). The cover part 22 may be formed on the upper side of the plate 1 and above the first main hole 11a and the second main hole 11b. The insulating part 2 may be made of an insulating material. For example, the insulating material may include one or more of silicone, rubber, and the like.

In addition, referring to FIG. 5 , an inner hole 23 penetrating each of the plurality of hole arrangement parts 21 up and down is formed in each of the plurality of hole arrangement parts 21 . In addition, the cover part 22 has a first upper hole 24 communicating vertically with each of the plurality of inner holes 23 and a second main hole 11b of some of the plurality of main holes 11 vertically and vertically. A second upper hole 25 to communicate is formed. The inner hole 23 and the first upper hole 24 form a first pin placement hole 26 , and the second main hole 11b and the second upper hole 15 are a second pin placement hole 27 . can form.

In addition, if necessary, the first test socket may include a mask provided between the plate 1 and the cover part 22 by having a hole for opening the first main hole 11a upward. When a mask is included, a hole may be formed in the mask to connect the second main hole 11b and the second upper hole 25 .

5 and 6 , in the first test socket, the first elastomeric contact is disposed in the first pin placement hole 26 formed by the inner hole 23 and the first upper hole 24 . and a pin 3a. The first elastomeric contact pins 3a may be disposed to vertically cross the first pin placement hole 26 .

In addition, referring to FIGS. 5 and 6 , in the first test socket, the second test socket is disposed in the second pin placement hole 27 formed by the second main hole 11b and the second upper hole 25 . and an elastomeric contact pin (3b). The second elastomeric contact pin 3b may be disposed to vertically cross the first pin arrangement hole 27 .

The first elastomeric contact pin 3a and the second elastomeric contact pin 3b may be formed of a conductive material. For example, the first elastomeric contact pin 3a and the second elastomeric contact pin 3b may be formed of a material (material) including metal powder and liquid silicon. Since the metal powder is conductive, the first and second elastomeric contact pins 3a and 3b made of a material including the metal powder may be conductive (conductive).

Each of the first elastomeric contact pin 3a and the second elastomeric contact pin 3b may be formed to contact inner surfaces of the first pin arrangement hole 26 and the second pin arrangement hole 27 , respectively.

Also, the plate 1 and the second elastomeric contact pin 3b may be energized. In addition, the second elastomeric contact pin 3b is formed to be in contact with the inner surface of the second pin arrangement hole 27, and the portion in the second main hole 11b of the second elastomeric contact pin 3b is a plate ( 1) can be in contact with. Accordingly, the second elastomeric contact pin 3b may be electrically integrated with the plate 1 . In other words, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 .

Also, the first elastomeric contact pin 3a may be energized. In addition, the first elastomeric contact pin 3a may be surrounded by the insulating part 2 . Accordingly, the first elastomeric contact pin 3a may not be electrically interlocked with the plate 1 .

Accordingly, the first elastomeric contact pin 3a may electrically connect an object (a finished semiconductor product, such as a semiconductor package) in contact with a lower portion thereof and a test board contacting an upper portion thereof. Accordingly, an electrical signal between the object positioned below the first elastomeric contact pin 3a and the test board positioned above the first elastomeric contact pin 3a may pass through the first elastomeric contact pin 3a. In addition, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 . Accordingly, when testing the semiconductor package, the second elastomeric contact pin 3b may serve as a ground together with the plate 1 .

In addition, the first test socket can be mounted on the test boat. This first test socket is applicable to performing a test on the semiconductor package by electrically connecting the semiconductor package and the test board.

Also, referring to FIG. 6 , a PREVENTION LEAKED LINE 9 may be formed around the first test socket in the plane direction. The PREVENTION LEAKED LINE 9 may be formed of an insulator (insulator).

Hereinafter, a method for manufacturing a socket for testing a semiconductor package according to a second embodiment of the present application (hereinafter referred to as 'this second manufacturing method') will be described. However, the second manufacturing method may share the configuration of the first manufacturing method described above. Accordingly, in the description of the second manufacturing method, descriptions overlapping with those described in the above-described first manufacturing method and the first test socket will be simplified or omitted, and the same reference numerals will be used for the same or similar components. do.

Referring to FIG. 7 , the second manufacturing method includes a step (first step) of preparing a plate 1 in which a plurality of main holes 11 are formed vertically. The plurality of main holes 11 may be formed at intervals in the direction of the surface of the plate 1 . The plate 1 may be made of a conductive material. For example, the plate 1 may be made of metal.

Also, referring to FIG. 8 , the second manufacturing method includes a step (second step) of forming the insulating portion 2 . The insulating part 2 includes a plurality of hole arrangement parts 21 formed inside each of the plurality of main holes 11 . For example, the second step may be referred to as a molding operation, and the insulating part 2 may be formed by filling the plurality of main holes 11 with an insulating material and curing the insulating material.

Accordingly, the insulating part 2 may be made of an insulating material. For example, the insulating material may include one or more of silicone, rubber, and the like. Accordingly, the insulating part 2 may include one or more of silicone, rubber, and the like.

In addition, referring to FIG. 9 , the second manufacturing method includes the steps of forming an inner hole 23 penetrating each of the plurality of hole arranging parts 21 up and down in each of the plurality of hole arranging parts 21 (the second) step 3). The inner hole 23 may form a pin arrangement hole. For example, in the third step, the inner hole 23 may be formed using a laser.

Also, referring to FIG. 10 , the second manufacturing method includes forming an elastomeric contact pin 3 in the inner hole 23 (a fourth step). The elastomeric contact pin 3 may be made of a conductive material. For example, the elastomeric contact pin 3 may be made of a material (material) including metal powder and liquid silicon. Since the metal powder is conductive, the elastomeric contact pin 3 made of a material including the metal powder may be conductive (conductive). For example, the metal powder may be a gold powder.

For reference, since the material constituting the elastomeric contact pin 3 may include gold powder, the elastomeric contact pin 3 may also be referred to as a gold powder contactor.

For example, in the fourth step, the elastomeric contact pin 3 may be formed by filling the inner hole 23 with a mixed solution including metal powder and liquid silicone, curing it, and applying a magnetic force. In addition, the elastomeric contact pin 3 may protrude upward and downward of the inner hole 23 , respectively, and the mixed solution filled in the inner hole 23 by the action of magnetic force moves to the upper and lower sides of the inner hole 23 , respectively. It can be cured in a protruding form. Also, at this time, the formed elastomeric contact pin 3 may be formed to contact the inner surface of the inner hole 23 . For reference, after the inner hole 23 is filled with the liquid mixture, magnets are positioned above and below each of the plurality of inner holes 23 , so that magnetic force can act on the liquid mixture filled in each of the plurality of inner holes 23 . .

In addition, the portion protruding upward of the inner hole 23 of the elastomeric contact pin 3 may have a shape in which the cross-sectional area decreases toward the top, and protruding downward of the inner hole 23 of the elastomeric contact pin 3 . The portion may have a shape in which the cross-sectional area decreases toward the bottom.

According to the second manufacturing method described above, the elastomeric contact pin 3 can be energized. In addition, the elastomeric contact pin 3 may be surrounded by the insulating portion 2 . Accordingly, the elastomeric contact pin 3 may not be electrically interlocked with the plate 1 .

Accordingly, when testing the semiconductor package of the socket for semiconductor package test manufactured by the second manufacturing method, the elastomeric contact pin 3 is in contact with the lower portion of the object (semiconductor finished product, such as a semiconductor package) and its The test board in contact with the upper part can be electrically connected. Accordingly, an electrical signal between the object positioned below the elastomeric contact pin 3 and the test board positioned above the elastomeric contact pin 3 may pass through the elastomeric contact pin 3 . Also, at this time, the plate 1 may serve as a ground.

Hereinafter, a socket for a semiconductor package test (hereinafter referred to as a 'this second test socket') according to a second embodiment of the present application will be described. However, the second test socket may be manufactured by the second manufacturing method described above. Accordingly, in the description of the second test socket, descriptions overlapping with those described in the first manufacturing method, the first test socket, and the second manufacturing method described above will be simplified or omitted, and the same or similar configuration will be omitted. The same reference numerals will be used for them.

Referring to FIG. 10 , the second test socket includes a plate 1 in which a plurality of main holes 11 are formed vertically. The plurality of main holes 11 may be formed at intervals in the direction of the surface of the plate 1 . The plate 1 may be made of a conductive material.

Also, referring to FIGS. 10 and 11 , the second test socket includes an insulating part 2 . The insulating part 2 includes a plurality of hole arrangement parts 21 formed inside each of the plurality of main holes 11 . The insulating part 2 may be made of an insulating material. For example, the insulating material may include one or more of silicone, rubber, and the like.

Also, referring to FIG. 10 , an inner hole 23 penetrating each of the plurality of hole arrangement parts 21 up and down is formed in each of the plurality of hole arrangement parts 21 .

Also, referring to FIGS. 10 and 11 , the second test socket includes an elastomeric contact pin 3 disposed in the inner hole 23 . The elastomeric contact pins 3 may be disposed to vertically cross the inner hole 23 . In addition, upper and lower portions of the elastomeric contact pin 3 may protrude upward and downward of the inner hole 23 , respectively. In addition, the portion protruding upward of the inner hole 23 of the elastomeric contact pin 3 may have a shape in which the cross-sectional area decreases toward the top, and protruding downward of the inner hole 23 of the elastomeric contact pin 3 . The portion may have a shape in which the cross-sectional area decreases toward the bottom.

In addition, the elastomeric contact pin 3 may be made of a conductive material. For example, the elastomeric contact pin 3 may be made of a material (material) including metal powder and liquid silicon.

Since the metal powder is conductive, the elastomeric contact pin 3 made of a material including the metal powder may conduct electricity (conductivity). In addition, the elastomeric contact pin 3 may be surrounded by the insulating portion 2 . Accordingly, the elastomeric contact pin 3 may not be electrically interlocked with the plate 1 .

Accordingly, the elastomeric contact pin may electrically connect an object (finished semiconductor product, such as a semiconductor package) in contact with the lower portion thereof and the test board contacting the upper portion thereof. Accordingly, an electrical signal between the object positioned below the elastomeric contact pin 3 and the test board positioned above the elastomeric contact pin 3 may pass through the elastomeric contact pin 3 . Also, the plate 1 may serve as a ground.

In addition, the second test socket can be mounted on the test boat. This second test socket is applicable to performing a test on the semiconductor package by electrically connecting the semiconductor package and the test board.

For reference, the socket for semiconductor test (this first test socket and the second test socket) according to the present disclosure may also be referred to as an elastomeric coaxial socket. More specifically, the first test socket may be referred to as a semi-type rubber coaxial rubber, and the second test socket may be referred to as a full type coaxial rubber.

For reference, the difference between the first test socket and the second test socket is that the first test socket has a second elastomeric contact pin 3b in contact with the object (contacting the test environment) to serve as a ground. On the other hand, in the second test socket, the plate 1 directly contacts the object (contacts the test environment) to serve as a ground.

Hereinafter, a socket for a semiconductor package test (hereinafter referred to as 'this third test socket') according to a third embodiment of the present application will be described. However, the third test socket may be manufactured by the third manufacturing method described above. Accordingly, in the description of the third test socket, the first manufacturing method, the first test socket, the second manufacturing method, the second test socket, and the third embodiment of the present application described later Descriptions overlapping with those described in the semiconductor package test socket will be simplified or omitted, and the same reference numerals will be used for the same or similar components.

12 to 14 , the third test socket includes a plate 1 in which a plurality of main holes 11 are formed vertically. The plurality of main holes 11 may be formed at intervals in the direction of the surface of the plate 1 . The plate 1 may be made of a conductive material. The plate 1 may serve as a ground.

In addition, referring to FIGS. 13 and 14 , the third test socket includes an insulating part 2 . The insulating part 2 includes a plurality of hole arrangement parts 21 formed inside each of the plurality of main holes 11 . The insulating part 2 may be made of an insulating material. For example, the insulating material may include one or more of silicone, rubber, and the like.

In addition, referring to FIGS. 13 and 14 , a first inner hole 23a penetrating the center of the hole arranging part 21 up and down is formed in some of the plurality of hole arranging parts 21 . In addition, a second inner hole 23b that crosses in the radial direction and penetrates vertically is formed in another part of the plurality of hole arrangement parts 21 . The second inner hole 23b is formed transversely in the radial direction, and a portion of the inner surface of the main hole 11 in which the second inner hole 23b is formed is inwardly formed (in the radial direction of the second inner hole 23b). one end and the other end) can be exposed.

Also, referring to FIGS. 13 and 14 , the third test socket may include a first elastomeric contact pin 3a formed in the first inner hole 23a. Referring to FIG. 14 , the first elastomeric contact pin 3a may be disposed to vertically cross the inner hole 23a. Also, a lower portion of the first elastomeric contact pin 3a may protrude below the first inner hole 23a. In addition, the first elastomeric contact pin 3a may have a shape in which the cross-sectional area decreases toward the lower end.

In addition, the first elastomeric contact pin 3a may be made of a conductive material. For example, the first elastomeric contact pin 3a may be formed of a material (material) including metal powder and liquid silicon.

Since the metal powder is conductive, the first elastomeric contact pin 3a made of a material including the metal powder may conduct electricity (conductivity). In addition, the first elastomeric contact pin 3a may be surrounded by the insulating part 2 . Accordingly, the first elastomeric contact pin 3a may not be electrically interlocked with the plate 1 .

Accordingly, the first elastomeric contact pin 3a may electrically connect an object (a finished semiconductor product, such as a semiconductor package) in contact with a lower portion thereof and a test board contacting an upper portion thereof. Accordingly, an electrical signal between the object positioned below the elastomeric contact pin 3a and the test board positioned above the elastomeric contact pin 3a may pass through the elastomeric contact pin 3 .

Also, referring to FIGS. 13 and 14 , the third test socket may include a second elastomeric contact pin 3b formed in the second inner hole 23b. Referring to FIG. 14 , the second elastomeric contact pin 3b may be disposed to vertically cross the inner hole 23b. Also, a lower portion of the second elastomeric contact pin 3b may protrude below the first inner hole 23b. In addition, the second elastomeric contact pin 3b may have a shape in which the cross-sectional area decreases toward the lower end.

Also, the second elastomeric contact pin 3b may be in contact with the plate 1 . As described above, the second inner hole 23b is formed to cross in the radial direction, and a portion of the inner surface of the main hole 11 in which the second inner hole 23b is formed is formed into the second inner hole 23b. may be exposed, and thus, each of the radially one end and the other end of the second elastomeric contact pin 3b formed in the second inner hole 23b may contact the plate 1 .

In addition, the second elastomeric contact pin 3b may be made of a conductive material. For example, the second elastomeric contact pin 3b may be formed of a material (material) including metal powder and liquid silicon.

Since the metal powder is conductive, the second elastomeric contact pin 3b made of a material including the metal powder may conduct electricity (conductivity). In addition, the second elastomeric contact pin 3b is formed to be in contact with the inner surface (plate 1) of the main hole 11 , and the second elastomeric contact pin 3b may be electrically integrated with the plate 1 . have. In other words, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 .

As described above, when the semiconductor package of the third test socket is tested, the first elastomeric contact pin 3a is in contact with an object (finished semiconductor product, such as a semiconductor package) in contact with the lower portion thereof and the upper portion thereof. A test board (printed circuit board) can be electrically connected. Accordingly, an electrical signal between the object positioned below the first elastomeric contact pin 3a and the test board positioned above the first elastomeric contact pin 3a may pass through the first elastomeric contact pin 3a. In addition, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 . Accordingly, when testing the semiconductor package, the second elastomeric contact pin 3b may serve as a ground together with the plate 1 through the plate 1 electrically connected to the ground.

Also, referring to FIG. 15 , an insulating film layer 4 may be formed on a lower surface of the plate 1 . In this case, an electrical signal between the object positioned below the first elastomeric contact pin 3a and the test board positioned above the first elastomeric contact pin 3a may pass through the first elastomeric contact pin 3a, and the second elastomeric contact pin (3b) serves as a ground, so that the grounding role of the plate 1 may be performed by the second elastomeric contact pin 3b.

Hereinafter, a method for manufacturing a socket for testing a semiconductor package according to a third embodiment of the present application (hereinafter referred to as 'this third manufacturing method') will be described. However, the third manufacturing method may share the configuration of the first manufacturing method and the second manufacturing method described above. Therefore, in the description of the third manufacturing method, the descriptions of the first manufacturing method, this first test socket, this second manufacturing method, this second test socket, and this third test socket are duplicated in the description of the third manufacturing method. The description will be simplified or omitted, and the same reference numerals will be used for the same or similar components.

Referring to FIG. 16 , the third manufacturing method includes a step (first step) of preparing a plate 1 in which a plurality of main holes 11 are formed vertically. The plurality of main holes 11 may be formed at intervals in the direction of the surface of the plate 1 . The plate 1 may be made of a conductive material. For example, the plate 1 may be made of a metal material.

Also, referring to FIG. 17 , the second manufacturing method includes a step (second step) of forming the insulating portion 2 . The insulating part 2 includes a plurality of hole arrangement parts 21 formed inside each of the plurality of main holes 11 . For example, the second step may be referred to as a molding operation, and the insulating part 2 may be formed by filling the plurality of main holes 11 with an insulating material and curing the insulating material.

Accordingly, the insulating part 2 (the hole arrangement part 21) may be made of an insulating material. For example, the insulating material may include one or more of silicone, rubber, and the like. Accordingly, the insulating part 2 may include one or more of silicone, rubber, and the like.

In addition, referring to FIG. 18 , the third manufacturing method includes a step (third step) of forming the first inner hole 23a and the second inner hole 23b in each of the plurality of hole arranging units 21 . include Each of the first and second inner holes 23a and 23b may form a pin arrangement hole. For example, in the third step, the first and second inner holes 23 may be formed using a laser.

Specifically, in the third step, a first inner hole 23a penetrating the center (radial center) up and down is formed in some of the plurality of hole arrangement units 21 . In addition, in the third step, a second inner hole 23b that extends vertically (through) while crossing in a radial direction is formed in another part of the plurality of hole arranging units 21 .

Also, referring to FIG. 19 , in the second manufacturing method, the first elastomeric contact pin 3a is formed in the first inner hole 23a and the second elastomeric contact pin 3b is formed in the second inner hole 23b. ) to form a (fourth step). The first and second elastomeric contact pins 3a and 3b may be formed of a conductive material. For example, the first and second elastomeric contact pins 3a and 3b may be formed of a material (material) including metal powder and liquid silicon. Since the metal powder is conductive, the first and second elastomeric contact pins 3a and 3b made of a material including the metal powder may be conductive (conductive). For example, the metal powder may be a gold powder.

For reference, since the material constituting the first and second elastomeric contact pins 3a and 3b may include gold powder, the first and second elastomeric contact pins 3a and 3b may also be referred to as gold powder contactors. .

For example, in the fourth step, the first and second elastomeric contact pins ( 3a, 3b) can be formed, respectively. In addition, each of the first and second elastomeric contact pins 3a and 3b may protrude below each of the first and second inner holes 23a and 23b, respectively, and the first and second inner holes ( The mixed solution filled in each of 23a and 23b may be cured to protrude downward of the first and second inner holes 23a and 23b. Also, at this time, the formed first and second elastomeric contact pins 3a and 3b may be formed to contact the inner surfaces of the first and second inner holes 23a and 23b, respectively, and the second elastomeric contact pins 3b may be formed. may be formed to be in contact with the inner surface of the main hole 11 of the plate 1 exposed through the second inner hole 23b, that is, the plate 1 . For reference, after the mixture solution is filled in each of the first and second inner holes 23a and 23b, a magnet is positioned under each of the plurality of first and second inner holes 23a and 23b, so that the plurality of first And magnetic force may act on the mixed solution filled in each of the second inner holes 23a and 23b.

Also, the first and second elastomeric contact pins 3a and 3b may have a shape in which the cross-sectional area decreases toward the bottom.

As described above, according to the third manufacturing method, the first elastomeric contact pin 3a may be energized. Also, the first elastomeric contact pin 3a may not be electrically interlocked with the plate 1 by an insulating part.

Accordingly, when the semiconductor package of the socket for semiconductor package test manufactured by the third manufacturing method is tested on the semiconductor package, the first elastomeric contact pin 3a is an object (finished semiconductor product, such as a semiconductor package) in contact with the lower portion thereof. and a test board (printed circuit board) in contact with the upper part thereof may be electrically connected. Accordingly, an electrical signal between the object positioned below the first elastomeric contact pin 3a and the test board positioned above the first elastomeric contact pin 3a may pass through the first elastomeric contact pin 3a.

In addition, the second elastomeric contact pin 3b may be electrically interlocked with the plate 1 . Accordingly, when testing the semiconductor package, the second elastomeric contact pin 3b may serve as a ground together with the plate 1 through the plate 1 electrically connected to the ground.

Also, referring to FIG. 20 , the third manufacturing method may include forming the insulating film layer 4 on the lower surface of the plate 1 . The step of forming the insulating film layer 4 may be performed after the fourth step. In this case, an electrical signal between the object positioned below the first elastomeric contact pin 3a and the test board positioned above the first elastomeric contact pin 3a may pass through the first elastomeric contact pin 3a, and the second elastomeric contact pin (3b) serves as a ground, so that the grounding role of the plate 1 may be performed by the second elastomeric contact pin 3b.

For reference, the third test socket may also be referred to as an elastomeric coaxial socket. More specifically, the third test socket may be referred to as a semi-type rubber coaxial.

For reference, the difference between this third test socket and this second test socket is that the third test socket has a second elastomeric contact pin 3b in contact with the object (contacting the test environment) to serve as a ground. On the other hand, in the second test socket, the plate 1 directly contacts the object (contacts the test environment) to serve as a ground.

The above description of the present application is for illustration, and those of ordinary skill in the art to which the present application pertains will understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present application. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a dispersed form, and likewise components described as distributed may also be implemented in a combined form.

The scope of the present application is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present application.

1: plate
11: Main Hall
11a: first main hall
11b: second main hall
2: Insulation
21: hole arrangement part
22: cover part
23: inner hole
24: first upper hole
25: second upper hole
26: first pin placement hole
27: second pin placement hole
3: Elastomer contact pins
3a: first elastomeric contact pin
3b: second elastomeric contact pin

Claims (10)

A method for manufacturing a socket for semiconductor package testing, comprising:
(a) preparing a plate in which a plurality of main holes are formed vertically;
(b) forming an insulating part including a plurality of hole arranging parts formed inside each of the plurality of main holes;
(c) forming an inner hole penetrating each of the plurality of hole arrangement parts up and down; and
(d) forming an elastomeric contact pin in the inner hole;
The plate and the elastomeric contact pin are made of a conductive material,
Step (d) is,
A mixture containing metal powder and liquid silicone is filled in the inner hole, and magnets are placed on the upper and lower sides of the inner hole so that the elastomeric contact pins protrude to the upper and lower sides of the inner hole, respectively, and in the liquid mixture filled in the inner hole It hardens by applying magnetic force,
A portion protruding upward of the inner hole of the elastomeric contact pin has a cross-sectional area that decreases toward the upper side, and a portion that protrudes downward of the inner hole decreases in cross-sectional area toward the lower side,
The inner hole includes a first inner hole vertically penetrating a central portion of a portion of the plurality of hole placement units and a second inner hole vertically passing through another portion of the plurality of hole placement portions in a radial direction and
The method of claim 1, wherein the elastomeric contact pin includes a first elastomeric contact pin formed in the first inner hole and a second elastomeric contact pin formed in the second inner hole. delete delete According to claim 1,
The step (b) is,
The method for manufacturing a socket for semiconductor package testing, wherein an insulating material is filled in the plurality of main holes and the insulating material is cured to form the insulating part. According to claim 1,
The method of claim 1, wherein the first elastomeric contact pin electrically connects the object and the test unit. In the socket for semiconductor package test,
a plate in which a plurality of main holes are formed vertically;
an insulating part including a plurality of hole arranging parts formed inside each of the plurality of main holes, wherein each of the plurality of hole arranging parts has an inner hole penetrating each of the plurality of hole arranging parts up and down; and
an elastomeric contact pin disposed in the inner hole;
The plate and the elastomeric contact pin are made of a conductive material,
The elastomeric contact pin,
It consists of a material containing metal powder and liquid silicone,
A mixture containing metal powder and liquid silicone is filled in the inner hole, and magnets are placed on the upper and lower sides of the inner hole so that the elastomeric contact pins protrude to the upper and lower sides of the inner hole, respectively, and in the liquid mixture filled in the inner hole formed by the action of a magnetic force,
The portion protruding upward of the inner hole has a cross-sectional area that decreases toward the upper side, and the portion that protrudes toward the lower side of the inner hole decreases in cross-sectional area toward the lower side,
The inner hole includes a first inner hole vertically penetrating a central portion of a portion of the plurality of hole placement units and a second inner hole vertically passing through another portion of the plurality of hole placement portions in a radial direction and
The elastomeric contact pin may include a first elastomeric contact pin formed in the first inner hole and a second elastomeric contact pin formed in the second inner hole. delete delete 7. The method of claim 6
The insulating part is made of an insulating material, a socket for semiconductor package testing. 7. The method of claim 6,
The first elastomeric contact pin electrically connects the object to the test unit.

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