KR102297838B1 - Method for continuously inspecting electric properties of electronic chip component - Google Patents

Abstract

[Problem] A chip electronic component is temporarily accommodated in a hole in the carrier plate so that one end electrode is positioned at the top and the other at the bottom, and the carrier plate is moved along the plate plane to a position for measuring electrical properties, and the chip A voltage is applied to both electrodes of the electronic component by contacting a terminal for measuring electrical characteristics including a roller electrode terminal to measure the electrical characteristics of the chip electronic component, and by further moving a conveying plate, the chip electronic component is electrically By a plurality of steps including separation from the characteristic measurement position, friction scratches on the electrode surface that occur when measuring electrical characteristics of chip electronic components are reduced, and at the same time, reliability of electrical characteristic measurement is improved.
[Solutions] When the chip electronic component moves and comes into contact with the roller electrode terminal, the roller electrode terminal is positioned so as to be in contact with one corner portion of the top electrode of the chip electronic component, and after measuring the electrical properties, the chip electronic component Move the roller electrode terminal in a direction away from the surface of the conveying plate so that the top of the electrode does not come into contact with the other corner of the electrode.

Description

METHOD FOR CONTINUOUSLY INSPECTING ELECTRIC PROPERTIES OF ELECTRONIC CHIP COMPONENT

The present invention relates to a method for continuously inspecting electrical characteristics of a large number of chip electronic components at high speed using an automated chip electronic component inspection and sorting device.

With the increase in production of small electronic devices such as mobile phones, smart phones, liquid crystal TVs, and electronic game machines, the production of micro-chip electronic components inserted into such electronic devices is remarkably increased. Most of the chip electronic components are formed of a main body portion and an electrode provided on each of opposite end surfaces of the main body portion. Examples of the chip electronic component having such a configuration include a chip capacitor (also called a chip capacitor), a chip resistor (including a chip varistor), and a chip inductor.

Recently, with the further miniaturization of electronic devices into which chip electronic components are inserted and the increase in the number of chip electronic components inserted into electronic devices, chip electronic components have become extremely small. For example, for chip capacitors, chip capacitors with a very small size (eg, a size of 0.2 mm × 0.2 mm × 0.4 mm, called 0402 chips) have come to be used in recent years. By production, one lot is produced in units of tens of thousands to hundreds of thousands of pieces.

In an electronic device into which a chip electronic component is inserted, in order to reduce the defect rate of the electronic device resulting from a defect in the chip electronic component to be inserted, it is common to perform a complete inspection on a chip electronic component mass-produced. For example, with respect to a chip capacitor used as a product, electrical characteristics, such as electrostatic capacity and leakage current, are inspected for the total number.

Inspection of the electrical characteristics of a large number of chip electronic components needs to be performed at high speed, and as a device for automatically performing the high-speed inspection, in recent years, a chip electronic component conveyance disk (original BACKGROUND ART An automated apparatus (ie, chip electronic component inspection apparatus) for inspection of electrical characteristics of chip electronic components provided with a semi-shaped chip electronic component conveying plate) is generally used. In a chip electronic component conveyance disk (hereinafter, sometimes simply referred to as a conveying disk), a plurality of perforations for temporarily receiving and holding the chip electronic component to be inspected are usually formed in a state in which three or more rows are arranged along the circumference. has been And, when using this chip electronic component inspection and sorting apparatus, after temporarily receiving and holding a chip electronic component in the hole of the conveyance disk under intermittent rotation, rotation of the conveyance disk to the chip electronic component hold|maintained by the conveyance disk. A pair of electrode terminals (inspection contact) laid along the path is brought into contact with each electrode of the chip electronic component, a predetermined voltage is applied, and the operation of measuring the electrical characteristics of the chip electronic component is performed.

For example, in the case of testing the capacitance of the chip capacitor, in the electrical characteristic inspection unit, the predetermined value is applied to the chip capacitor from the inspection machine (electrical characteristic measuring device) provided in the chip electronic component inspection and sorting device through the electrode terminal for inspection. Apply a test voltage having a frequency of Then, the current value of the current generated in the chip capacitor by the application of the test voltage is detected by the tester, and the capacitance of the chip capacitor to be inspected is measured based on the detected current value and the voltage value of the test voltage. do.

That is, the apparatus for inspecting electrical properties of chip electronic components described above includes a chip electronic component conveyance disk having at least three rows of perforations formed on the surface in concentric circles, and a row of concentric perforations so that the conveying disk can be intermittently rotated. A chip comprising: a base supported by the center; and an electrical characteristic inspection unit having a chip electronic component supply receiving unit each disposed at positions along the surface of the conveying disc, and an electrode terminal set including roller electrode terminals and fixed electrode terminals; It can be said that it is an electronic component electrical property inspection device.

When the inspection of the chip electronic component held on the conveyance disk is finished, based on the inspection result, the chip electronic component is discharged from the through hole of the conveyance disk, and the operation of sorting (or sorting) so that it is accommodated in a predetermined container is performed. For this reason, in a normal chip electronic component inspection apparatus, the chip electronic component classification part (sorting area) for further performing selection (or classification) of the chip electronic component after an examination is attached, and the chip electronic component electrical property test selection It is often commercialized as a device.

The apparatus described in patent document 1 is mentioned as an example of said chip electronic component test|selection apparatus. That is, in Patent Document 1, using the chip electronic component inspection and sorting device having the above-described configuration, the chip electronic components to be inspected, manufactured based on the same standard, each exhibiting predetermined and identical electrical characteristics are arranged adjacent to each other. is accommodated and held (temporarily accommodated) in the hole of the conveying disk, then the tester is electrically connected to the electrode of the chip electronic component, and a voltage for inspection is applied from the tester to each chip electronic component, and generated in each chip electronic component A method of improving a method of continuously inspecting electrical characteristics of a chip electronic component including a step of detecting a current value to be applied by an inspection device is disclosed.

In the chip electronic component electrical property inspection unit of the above-described chip electronic component inspection and sorting device, a fixed probe electrode (generally simply referred to as a fixed electrode) disposed on the back (or lower side) of the transfer disk and the front side of the transfer disk ( Alternatively, a plurality of sets of electrical property inspection tools configured by combining movable probe electrodes (generally, simply referred to as movable electrodes) disposed on the upper side) are provided along the radial direction of the conveyance disk.

As a movable probe provided in the electronic component electrical property inspection unit of the chip electronic component inspection and sorting device, the tip of the probe (the portion in contact with the electrode surface of the chip electronic component) is conventionally processed into a rod shape or a brush shape, Or by installing a rotatable roller at the tip of the probe, research has been made to ensure reliable contact between the tip of the probe and the electrode of the chip electronic component. It is common to use a roller electrode terminal with little damage to the electrode (that is, an electrode terminal with a roller installed at the tip).

About the example of the roller electrode terminal with which the electronic component electrical property inspection part of a chip electronic component inspection and sorting apparatus is equipped, the detailed description is described with the example of a block diagram in patent documents 2-6.

Among the above Patent Documents 2 to 6, Patent Document 2 discloses a configuration example of a known roller electrode terminal provided in a chip electronic component inspection and sorting device, and furthermore, the electrical characteristics of a chip electronic component having electrodes at both ends. The problem that partial damage (contact flaw) of the electrode of a chip electronic component occurs when a test|inspection is performed using a roller electrode terminal is described. And patent document 2 has explanation that the contact flaw of the electrode of this chip electronic component arises at the time of the contact between the electrode of a chip electronic component, and a roller electrode terminal, and at the time of contact release. Moreover, in patent document 2, as a means for suppressing the contact flaw which generate|occur|produces in the electrode of a chip electronic component by contact with this roller electrode terminal, laying of the ring-shaped elastic body with respect to the front-end|tip roller part of a roller electrode is proposed. .

In Patent Document 3 and Patent Document 4, which is an international publication corresponding to Patent Document 3, and Patent Document 6, which is an international publication corresponding to Patent Document 5 and Patent Document 5, there is another A configuration example is disclosed. And, the conventional method for preventing the damage of the electrode which arises at the time of the test|inspection of the electrical characteristic of the chip electronic component mentioned above is described. In this conventional method, when the conveying disk is rotated, the roller electrode terminals are arranged at a position away from the surface of the conveying disk so that the roller electrode terminals are accommodated in the through holes of the conveying disk and do not contact the electrodes of the conveyed chip electronic component. Then, by the rotation of the conveying disk, when the chip electronic component in the hole is conveyed to the electrical property inspection unit and rotation is stopped, the roller electrode terminal is moved (lowered) to contact the electrode of the chip electronic component, and the electrical property is inspected. , after completion of the subsequent inspection, this time, a method of moving (raised) the roller electrode terminal away from the electrode of the chip electronic component, followed by rotation of the conveying disk, is described. However, in these patent documents, generation|occurrence|production of the problem that productivity of an inspection work falls (time required for an inspection work becomes long) is pointed out by this method that the raising/lowering operation of a roller electrode terminal is applied.

Japanese Laid-Open Patent Publication No. 2015-213121 Japanese Laid-Open Patent Publication No. 2008-224418 Japanese Patent Publication No. 2010-511865 WO2008/067129 A2 Japanese Patent Publication No. 2010-517058 WO2008/094831 A1

The inventor of the present invention uses a chip electronic component inspection and sorting apparatus provided with a roller electrode terminal exemplified as a prior art in Patent Document 2 as a movable probe electrode of a contactor for inspection, and conducts an inspection test of continuous electrical properties of chip electronic components. was carried out. As a result, when the inspection of the electrical characteristics of the chip electronic component provided with electrodes at both ends described as a prior art in patent document 2 is performed using a roller electrode terminal, like the description of referenced document 2, a chip electronic component It was confirmed that contact scratches occurred on the electrodes of In addition, the presence of a contact flaw in the electrode of the chip electronic component observed after the inspection of such electrical characteristics is a necessary chip electronic component when inserting (mounting) the inspected chip electronic component into a printed wiring board using solder. Wetting of the solder to the electrode of the electrode tends to be non-uniform, which causes trouble at the time of mounting the chip electronic component. Therefore, it is desirable to make the contact flaw of the electrode surface of the chip electronic component that has been inspected for the electrical characteristics as small as possible.

The inventor of the present invention further relates to the known method described in Patent Documents 3 to 6, i.e., the retraction of the roller electrode terminals (movement away from the surface of the conveying disk) in synchronization with the intermittent rotation of the conveying disk in which the chip electronic component is accommodated in the through hole; It was also confirmed that the occurrence of contact scratches on the electrode of the chip electronic component that has been inspected can be suppressed by the method of repeating the advance (movement for contact with the electrode surface of the chip electronic component accommodated in the hole of the conveying disk). . However, according to the examination by the inventor of the present invention, when the inspection operation of the electrical characteristics of the chip electronic component by the above method is performed, the test result of the electrical characteristic of the chip electronic component tends to have insufficient reproducibility (that is, both are good products (passed products) In the case of measuring the electrical characteristics of a chip electronic component, which should have been, it has been found that there is a tendency for a considerable error to occur in the measured value, although the measured value would be even within a narrow error range. If such an error occurs in the measurement result of the electrical characteristics of the electronic component of the chip of the accepted product, where the measurement value is supposed to be even within a certain error range, the reliability of the measurement value is not guaranteed, and depending on the level of the error, the chip The suitability as a method for measuring the electrical properties of electronic components is a problem.

That is, according to the studies made by the inventor of the present invention, in a known chip electronic component inspection apparatus using a conveyance disk, the generation of a contact flaw of the electrode of the chip electronic component that has been inspected is suppressed and the electricity required for determination of the inspection result It turned out that it is difficult to implement|achieve the coexistence of all important requirements of maintaining the reliability of the measured value of a characteristic at the level which can satisfy|fill.

In addition, in the description so far in this specification, the continuous inspection method of a chip electronic component using the chip electronic component inspection apparatus using a conveyance disk has been demonstrated, but the continuous inspection method of a chip electronic component is other than a disk shape. Various methods using the chip electronic component conveyance plate (Hereinafter, it may simply be called a conveyance plate) of a shape are known.

That is, it can be said that the general continuous inspection method of a chip electronic component is the measuring method of the electrical characteristic of the following chip electronic component including those well-known inspection methods.

In the chip electronic component temporary accommodation hole of the carrier plate having a plurality of chip electronic component temporary accommodation holes, a chip electronic component having electrodes at opposite ends thereof is placed, an electrode of one end is at the top, and the other end is provided with electrodes. a process of temporarily accommodating the distal end of the electrode so that it is located at the bottom; moving the conveying plate along the plane of its surface to an electrical characteristic measurement position; A process of measuring the electrical characteristic of a chip electronic component by making the terminal for electrical characteristic measurement contact each of the electrode of the top part and the electrode of a bottom part of a chip electronic component, and applying a voltage; and a step of moving the chip electronic component carrying plate further along the plane of the surface thereof to separate the chip electronic component whose electrical characteristic measurement has been completed from the electrical characteristic measurement position.

Therefore, the subject of the present invention is to occur when using a chip electronic component inspection apparatus using a carrier plate provided with a plurality of temporary accommodating holes for chip electronic components and using a roller electrode terminal as one terminal for measuring electrical characteristics. To provide an inspection method for chip electronic components capable of realizing all of the important requirements of suppressing the occurrence of contact scratches between electrodes of chip electronic components that have been easily inspected, and maintaining the reliability of measured values of electrical characteristics required for determination of inspection results. is in doing

MEANS TO SOLVE THE PROBLEM As a result of repeating examination in order to solve the said subject, the inventor of this invention uses a conveyance disk, and uses a chip electronic component inspection apparatus using a roller electrode terminal as a movable probe provided in a chip electronic component electrical property inspection part. In the inspection method, in synchronization with the intermittent rotation of the conveyance disk, the roller electrode terminals are positioned at a position in contact with the surface of the conveying disk or in the vicinity of the surface of the conveying disk when the conveying disk is rotated. When the chip electronic component accommodated in the through hole of the transfer disk moves to the electrical property inspection unit by rotation of the conveyance disk, it is placed at the position where the electrode of the chip electronic component and the roller electrode terminal contact, and the chip electronic component accommodated in the conveying disk is transferred to the electrical property inspection unit After moving, the rotation of the conveying disk is stopped, and the measurement of the electrical properties is carried out in a state where the roller electrode terminal is in contact with the electrode of the chip electronic component. After the electronic component is moved out of the electrical property inspection unit by rotation of the conveying disk, the roller electrode terminal is moved back to the position in contact with the conveying disk or to a position near the surface of the conveying disk. By doing it, it discovered that the said subject could be solved to the extent that it could be satisfied in a practical use level.

Accordingly, the present invention resides in the following continuous inspection method for electrical characteristics of chip electronic components.

In the chip electronic component temporary accommodation hole of the carrier plate having a plurality of chip electronic component temporary accommodation holes, a chip electronic component having electrodes at opposite ends thereof is placed, an electrode of one end is at the top, and the other end is provided with electrodes. a process of temporarily accommodating the distal end of the electrode so that it is located at the bottom;

moving the conveying plate along the plane of its surface to an electrical characteristic measurement position;

A terminal for measuring electrical characteristics is applied to each of the top electrode and the bottom electrode of the chip electronic component by contacting the terminal for measuring electrical characteristics, provided that the terminal for measuring electrical characteristics brought into contact with the top electrode is a roller electrode terminal, whereby process of measuring electrical properties;

and

a step of moving the conveying plate further along the plate plane, whereby the chip electronic component whose electrical property measurement has been completed is separated from the electrical property measurement position;

A method of measuring electrical properties of a chip electronic component comprising:

Until the chip electronic component moves and the top electrode starts contacting the roller electrode terminal, the roller electrode terminal is placed at a position in contact with one corner of the top electrode, and then, after measuring the electrical properties, , A method for measuring electrical properties of a chip electronic component, characterized in that the roller electrode terminal is moved in a direction away from the surface of the chip carrying plate so as not to come into contact with the other corner portion of the top electrode.

In addition, the present invention can be particularly advantageously used in the measurement of electrical characteristics of a chip electronic component conveying disk in which the conveying plate rotates intermittently about the center.

By using the continuous inspection method of the electrical properties of the chip electronic component of the present invention, the occurrence of a contact flaw of the electrode of the chip electronic component that has been inspected is suppressed using a chip electronic component inspection apparatus using a conveying disk and a roller electrode terminal And it is possible to realize both important requirements of maintaining high reliability of measured values of electrical characteristics necessary for judgment of inspection results.

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view which shows the example of the whole structure of a chip electronic component inspection and sorting apparatus.
2 is a cross-sectional view showing a state in which the inspection unit inspects the electrical characteristics of the chip electronic component accommodated in the through hole of the conveyance disk.
It is a figure which shows the structure of the roller electrode terminal described in patent document 2.
It is a figure which shows the contact state in the electric characteristic test|inspection of the chip electronic component accommodated in the conveyance disk disclosed by patent document 2, and the roller part of a roller electrode terminal before and behind.
It is a figure which shows the contact state in the electrical characteristic test before and behind the chip electronic component accommodated in the conveyance master in the continuous inspection method of the electrical characteristic of the chip electronic component of this invention, and the roller part of a roller electrode terminal.
6 is a view showing the elevating mechanism of the roller electrode terminal used in the continuous inspection method of the electrical characteristics of the chip electronic component of the present invention (the roller is the electrode of the chip electronic component after the electric characteristic inspection from the state in which the roller is in contact with the surface of the conveying disk) It is a diagram explaining an example of a mechanism to move away from the surface).

First, a chip electronic component inspection and sorting apparatus using a conveying disc as a conveying plate advantageously used in the implementation of the continuous inspection method of the electrical characteristics of chip electronic components of the present invention (that is, a chip electronic component having a chip electronic component sorting means) A structural example of a parts inspection apparatus) is demonstrated, referring FIG. 1 and FIG. 2 of an accompanying drawing.

A chip capacitor of a typical example of a chip electronic component to be inspected includes a capacitor body made of a dielectric and a pair of electrodes (or electrode surfaces) formed to face both ends. A typical chip capacitor is a chip ceramic capacitor using ceramic as a dielectric. Moreover, the electrode of the chip electronic component currently used generally is formed of tin, and the solder layer for mounting on the board|substrate of the chip electronic component to the various board|substrates is formed on the surface.

Although the chip electronic component to be inspected is of the same production lot in many cases, the chip electronic component of another lot may be mixed with the chip electronic component of such a same production lot. However, it is common that the chip electronic components of both production lots are manufactured according to the same standard so as to exhibit the same electrical characteristics as each other (generally, those manufactured for the purpose of being sold as mutually identical products).

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view which shows the structural example of the chip electronic component inspection and sorting apparatus using a conveyance master. In the chip electronic component inspection and sorting apparatus 10 shown in FIG. 1, a plurality of through holes 11a capable of temporarily accommodating chip electronic components on the surface of a conveyance disk (disk-shaped conveying plate) are arranged along the circumference. The formed chip electronic component conveyance disk (hereinafter, simply referred to as a conveyance disk) 11 is axially supported by the base 41 so that rotation along the plane of the disk is possible. In the rotation path of the conveyance disk 11, the supply receiving part (supply receiving area) 101 of a chip electronic component, the inspection part (inspection area) 102 of the chip electronic component electrical characteristic, and the sorting part (sorting area) of a chip electronic component. ) (103) is set. In the inspection part 102, the electrode terminal for electrical characteristic measurement (terminal for electrical characteristic measurement) is provided in the position adjacent to both openings of each through hole 11a of each row of the conveyance master 11. The electrode terminal is provided with a controller 15 to which the testers 14a and 14b are electrically connected, and which is electrically connected to the tester so as to supply a signal related to the inspection process to the tester. In addition, the chip electronic component to be inspected is put in the hopper 47 and is supplied from the chip electronic component supply port 31 to the through hole of the conveyance master 11 through a bucket.

The through-hole 11a of the conveyance disk 11 is normally arrange|positioned on the surface of the conveyance disk on the several concentric circles, and it arrange|positions at the position which divided this concentric circle into equal parts.

In the chip electronic component inspection and sorting apparatus 10 shown in the accompanying drawings, six perforations are formed in total arranged in a radial direction between the center and the peripheral edge of the conveyance master 11, and a total of 6 accommodated in each perforation For every chip electronic component, the inspection of the electrical characteristic of a chip electronic component is performed. It is preferable to exist in the range of 3-20, and, as for the number of the through-holes arranged in a radial direction between the center of the conveyance master 11 and the peripheral edge, it is more preferable to exist in the range of 3-12.

The conveyance disk 11 is rotatably installed (fixed) on the base 41 via, for example, a base plate (a reference stand) and a central shaft 42, and is a rotational drive device arranged and formed on the rear surface side. By operating (43), the periphery of the central axis (42) is intermittently rotated.

In the through hole 11a of the conveyance master 11, the chip electronic component to be inspected is temporarily accommodated in the chip electronic component supply accommodating part 101 in order to inspect the electrical characteristics thereof.

As shown in FIG. 2, in the inspection part (electrical characteristic measurement position) 102, the electrodes 22a, 22b of each both ends of the chip electronic components 19a, 19b, 19c, 19d, 19e, 19f are connected to the inspection machine. In order to electrically connect, the electrode terminals 12a, 13a, 12b, 13b, 12c, 13c, 12d, 13d, 12e, 13e each configured as a pair at positions adjacent to both openings of the through-holes 11a of the conveyance disk 11. , 12f, 13f) are arranged. The roller electrode terminal used by this invention corresponds to the electrode terminal shown by 13a, 13b, 13c, 13d, 13e, 13f.

The electrode terminals 12a other than the roller electrode terminals are being fixed to the base plate 45 through an electrically insulating cylinder disposed and formed around it.

By moving the electrode terminal support plate which supports the roller electrode terminal to the side of the conveyance disk 11, the roller electrode terminals 13a supported by the electrode terminal support plate and others also move to the side of the conveyance disk 11 also. By the movement of this roller electrode terminal (13a etc.), a chip electronic component is pinched|interposed between the electrode terminals (12a, 13a etc. made into a pair), and it will be in a contact state. For this reason, the electrode of a chip electronic component is electrically connected to the fixed electrode terminal (12a outside) and the roller electrode terminal (13a outside).

And in the inspection part (electrical characteristic measurement position) 102, each of the six chip electronic components 19a, 19b, 19c, 19d, 19e, 19f accommodated and arrange|positioned so that it may line up in the radial direction of the conveyance disk 11, respectively. A predetermined electrical characteristic is checked for

The chip electronic component whose electrical characteristics were inspected is then transferred to the chip electronic component sorting unit 103 shown in FIG. 1 by intermittent rotational movement of the conveyance disk 11, and the chip electronic component is based on the inspection result. classification (screening) of

Next, the movement of the roller electrode terminal which is a characteristic operation in the continuous inspection method of the electrical characteristic of a chip electronic component of this invention is demonstrated in detail.

First, an example of a well-known roller electrode terminal is demonstrated with reference to the figure which shows the structure of the roller electrode terminal shown in FIG. Fig. 3(a) is a front view of the roller electrode terminal, and Fig. 3(b) is a side view showing the internal structure of the roller electrode terminal.

In the example of the roller electrode terminal shown in (a) and (b) of FIG. 3, the roller electrode terminal 13 is a case 131, the connection terminal 132 to an inspection machine, the roller electrode 133, and a roller electrode. It includes a rotating shaft 134 , a roller electrode holder 135 , a swing support point 136 , a coil spring 137 , and a connection cable 138 .

4(a), (b), and (c) are a chip electronic component 19 and a roller electrode 133 in an inspection unit (electrical characteristic measurement position) shown in Patent Document 2, which is a document showing the prior art. It is a diagram showing the change of the contact state of That is, the roller electrode 133 is the chip electronic component 19 accommodated (temporarily accommodated) in the through hole of the conveyance master 11 by the movement of the conveyance master 11 in the direction of the arrow shown in Fig.4 (a). ) and one of the corners of the top electrode are in contact with each other, and then, it is in a state where it sits on the surface of the top electrode. At this point, the conveyance master 11 is temporarily stopped, and a voltage is applied between the upper roller electrode 133 and the lower fixed electrode terminal during the stop, and the electrical characteristics of the chip electronic component 19 are measured. And after the electrical measurement is finished, the conveyance disk 11 moves again in the direction of the arrow, and as a result, the roller electrode 133 is in contact with the other corner part of the electrode of the top part of a chip electronic component, going down from the top The damage (contact flaw) of the top electrode of the chip electronic component at the electrical property measurement position described above is mainly caused by the start of contact with the roller electrode (the roller electrode as the top electrode as shown in FIGS. 4A and 4B ). It rises) and occurs when contact is lost.

5 : is a figure which shows the change of the contact state of the chip electronic component 19 and the roller electrode 133 in the electrical property measuring position in the electrical property measuring method of a chip electronic component of this invention.

In Fig. 5 (1), both the fixed electrode terminal 12 and the roller electrode 133 of the roller electrode terminal are in contact with the chip electronic component 19 accommodated in the conveyance disk 11 and rotating in the direction of the arrow. Indicates a state that is not being done. In this state, the roller electrode 133 is in contact with the surface of the conveyance master 11, or exists in the position adjacent to the surface of the conveyance master 11.

Fig. 5 (2) is a diagram showing a state in which the roller electrode is in contact with one corner of the top electrode of the chip electronic component and is about to sit on the surface of the electrode.

In FIG.5(3), the roller electrode sits on the surface of the top electrode of a chip electronic component, and the measurement of the electrical characteristic of a chip electronic component is performed in this state. In addition, in the process of the roller electrode moving from the state of (2) in FIG. 5 to the state of (3), damage ( friction scratches). At the same time, the metal oxide film (eg, the tin oxide film, which is an oxide of tin, which is an electrode material) formed on the surface of the top electrode of the chip electronic component is partially peeled off, and the electrode material (usually tin) is exposed. In addition, non-conductive contaminants such as metal oxide such as tin oxide deposited on the surface of the roller electrode by repeated contact of the roller electrode with the top electrode of the chip electronic component are also partially peeled off. For this reason, the electrical contact of the top electrode of a chip electronic component and a roller electrode is performed more smoothly.

That is, in the process from the state of (2) in Fig. 5 to the state of (3), damage (friction scratch) occurs in one corner portion of the top electrode of the chip electronic component and the region around it, but at the same time, the chip Since the non-conductive contaminants generated on the top electrode of the electronic component and the non-conductive contaminants deposited on the surface of the roller electrode are peeled off and removed, smooth electrical contact between the top electrode of the chip electronic component and the roller electrode is realized with high reliability. Incidentally, the process from the state of (2) in Fig. 5 to the state (3) is substantially the same as the process from (a) to (b) in Fig. 4 .

After the measurement of the electrical characteristics of the chip electronic component in the state of FIG. 5 (3) is finished, the roller electrode is moved away from the top electrode and the conveying disk of the chip electronic component as shown in FIG. 5 (4) ( In the drawing, it moves upward).

After the roller electrode is separated from the top electrode of the chip electronic component and becomes the state of Fig. 5 (4), as shown in Fig. 5 (5), the conveying disk rotates again, and the chip electronic component has electrical characteristics away from the measurement position. Accordingly, when the method for measuring electrical characteristics of a chip electronic component of the present invention is used, damage to the corner portion on the other side of the electrode surface of the chip electronic component observed in the states of FIG. 4 (b) to (c) does not occur. .

When the chip electronic component moves away from the electrical property measurement position, the roller electrode descends, and as shown in FIG. ) to (6) are repeated.

As described above, by measuring the electrical properties of the chip electronic component according to the method of the present invention, damage to the electrode of the chip electronic component (contact flaw) occurring before and after the measurement operation of the electrical property is reduced This makes it possible to remove non-conductive contaminants such as metal oxides formed on the surface of the electrode of the chip electronic component and non-conductive contaminants accumulated on the roller electrode of the roller electrode terminal. In addition, there is no substantial extension of the time required for the measurement of the electrical characteristics.

Fig. 6 shows the lifting mechanism of the roller electrode terminal used in the continuous inspection method of the electrical characteristics of the chip electronic component of the present invention (the roller is in contact with the surface of the conveying disk, after the electrical characteristic inspection, the roller moves the chip electronic component It is a figure explaining an example of the mechanism which moves in order to separate from an electrode surface). Fig. 6(a) shows a state in which the roller electrode is in a lowered position (a position in contact with or close to the conveying disk 11), and Fig. 6(b) is a state in which the roller electrode is in a raised position (of the chip electronic component). position away from the top electrode).

The lifting mechanism of the roller electrode terminal shown in FIG. 6 includes a case 131 , a roller electrode 133 , a roller electrode holder 135 , a coil spring 137 , and a cam 139 . In addition, illustration of the connection terminal to a connection cable and an inspection machine is abbreviate|omitted. If the raising/lowering mechanism of the roller electrode terminal of FIG. 6 is used, the raising and lowering of the roller electrode 133 can be controlled by rocking|fluctuating the cam 139 up and down.

In addition, in this specification, the description of the configuration of the chip electronic component inspection and sorting apparatus and the effects of the present invention have been described by taking as an example a chip electronic component inspection and sorting apparatus in which the chip electronic component conveyance disk is arranged in the vertical direction and operates. The chip electronic component inspection and sorting apparatus used by the electrical property measuring method of a chip electronic component of this invention may be the apparatus by which the chip electronic component conveyance disk is axially supported in the state inclined to a base. Moreover, as mentioned above, instead of the conveyance disk which moves rotationally, even if it is a chip electronic component inspection and sorting apparatus using the conveyance plate which moves by going straight, it does not interfere.

10: chip electronic component inspection and sorting device
11: Chip electronic component conveyance disk (transfer disk)
11a: hole
12, 12a, 12b, 12c, 12d, 12e, 12f: fixed electrode terminals
13: roller electrode terminal
13a, 13b, 13c, 13d, 13e, 13f: movable electrode terminals
14a, 14b: checker (capacity meter)
15: controller
19: chip electronic components
19a, 19b, 19c, 19d, 19e, 19f: Chip Electronic Components
22a, 22b: electrode
31: chip electronic component supply port
41 : Expectation
42: central axis
43: rotary drive device
45: base plate (standard stand)
133: roller electrode

Claims (2)

In the chip electronic component temporary accommodation hole of the carrier plate having a plurality of chip electronic component temporary accommodation holes, a chip electronic component having electrodes at opposite ends thereof is placed, an electrode of one end is at the top, and the other end is provided with electrodes. a process of temporarily accommodating the distal end of the electrode so that it is located at the bottom;
moving the conveying plate along the plane of its surface to an electrical characteristic measurement position;
A terminal for measuring electrical characteristics is applied to each of the top electrode and the bottom electrode of the chip electronic component by contacting the terminal for measuring electrical characteristics, provided that the terminal for measuring electrical characteristics brought into contact with the top electrode is a roller electrode terminal, whereby process of measuring electrical properties;
and
a step of moving the conveying plate further along the plate plane, whereby the chip electronic component whose electrical characteristic measurement has been completed is separated from the electrical characteristic measurement position;
A method of measuring electrical properties of a chip electronic component comprising:
Until the chip electronic component moves and the top electrode starts contacting the roller electrode terminal, the roller electrode terminal is placed at a position in contact with one corner of the top electrode, and then, after measuring the electrical properties, , A method for measuring electrical properties of a chip electronic component, characterized in that the roller electrode terminal is moved in a direction away from the surface of the chip carrying plate so as not to come into contact with the other corner portion of the top electrode. The method of claim 1,
A method for measuring electrical properties of a chip electronic component, wherein the conveying plate is a chip electronic component conveying disk that intermittently rotates about a center.

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