KR102296734B1 - 표시 장치 및 그 제조 방법 - Google Patents
표시 장치 및 그 제조 방법 Download PDFInfo
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- KR102296734B1 KR102296734B1 KR1020150013774A KR20150013774A KR102296734B1 KR 102296734 B1 KR102296734 B1 KR 102296734B1 KR 1020150013774 A KR1020150013774 A KR 1020150013774A KR 20150013774 A KR20150013774 A KR 20150013774A KR 102296734 B1 KR102296734 B1 KR 102296734B1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000002161 passivation Methods 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 51
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/13625—Patterning using multi-mask exposure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
도 2는 도 2에 도시한 표시 장치의 단면도이다.
도 3 및 도 4는 본 발명의 일 실시예에 따른 표시 장치의 제조 방법을 나타낸 단면도이다.
Claims (6)
- 기판,
상기 기판 위에 위치하는 게이트 전극 및 게이트선,
상기 기판 위에 상기 게이트선과 같은 층에 형성되어 있으며 상기 게이트선과 분리되어 있는 복수의 데이터선,
상기 게이트선, 상기 게이트 전극 및 상기 데이터선 위에 위치하는 게이트 절연막,
상기 게이트 절연막 위에 위치하는 반도체,
상기 반도체 및 상기 게이트 절연막 위에 위치하는 식각 저지막,
상기 식각 저지막 위에 위치하는 제1 보호막,
상기 제1 보호막 및 상기 식각 저지막 바로 위에 위치하며 상기 복수의 데이터선과 연결되어 있는 소스 전극,
상기 식각 저지막 바로 위에 위치하며 상기 소스 전극과 떨어져 있는 드레인 전극,
상기 제1 보호막 바로 위에 위치하며 상기 소스 전극 및 상기 드레인 전극과 떨어져 있는 공통 전극,
상기 소스 전극, 상기 드레인 전극 및 상기 공통 전극 바로 위에 위치하는 제2 보호막, 그리고
상기 제2 보호막 위에 위치하며 상기 드레인 전극과 연결되어 있는 화소 전극
을 포함하는 표시 장치. - 제1항에서,
상기 제1 보호막은 유기물을 포함하는 표시 장치. - 제1항에서,
상기 반도체는 금속 산화물을 포함하는 표시 장치. - 기판 위에 게이트 전극, 게이트선 및 데이터선을 형성하는 단계,
상기 게이트 전극, 상기 게이트선 및 상기 데이터선 위에 게이트 절연막을 형성하는 단계,
상기 게이트 절연막 위에 반도체를 형성하는 단계,
상기 게이트 절연막 및 상기 반도체 위에 식각 저지막 및 제1 보호막을 적층하는 단계,
상기 제1 보호막, 상기 식각 저지막 및 상기 게이트 절연막을 식각하여 상기 데이터선 및 상기 반도체를 드러내는 접촉 구멍을 형성하는 단계,
상기 제1 보호막 및 상기 식각 저지막 위에 상기 데이터선과 연결되는 소스 전극, 상기 소스 전극과 떨어져 있는 드레인 전극, 상기 소스 전극 및 상기 드레인 전극과 떨어져 있는 공통 전극을 형성하는 단계,
상기 소스 전극, 상기 드레인 전극 및 상기 공통 전극 위에 제2 보호막을 형성하는 단계, 그리고
상기 제2 보호막 위에 위치하며 상기 드레인 전극과 연결되는 화소 전극을 형성하는 단계
를 포함하며,
상기 소스 전극, 상기 드레인 전극 및 상기 공통 전극은 동일한 층으로 형성하는
표시 장치의 제조 방법. - 제4항에서,
상기 제1 보호막은 유기물을 포함하는 표시 장치의 제조 방법. - 제4항에서,
상기 반도체는 금속 산화물을 포함하는 표시 장치의 제조 방법.
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KR1020150013774A KR102296734B1 (ko) | 2015-01-28 | 2015-01-28 | 표시 장치 및 그 제조 방법 |
US14/958,011 US9647005B2 (en) | 2015-01-28 | 2015-12-03 | Display device and manufacturing method thereof |
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Citations (2)
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JP3193033B2 (ja) * | 1989-03-16 | 2001-07-30 | ローベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 目標値発生部材の調整位置を伝達する装置 |
US20140104527A1 (en) * | 2012-10-17 | 2014-04-17 | Apple Inc. | Process Architecture for Color Filter Array in Active Matrix Liquid Crystal Display |
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US5994155A (en) * | 1994-01-20 | 1999-11-30 | Goldstar Co., Ltd. | Method of fabricating a thin film transistor liquid crystal display |
KR20040045113A (ko) | 2002-11-22 | 2004-06-01 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 및 그 제조 방법 |
JP5477523B2 (ja) | 2006-06-15 | 2014-04-23 | 三国電子有限会社 | 低コスト大画面広視野角高速応答液晶表示装置 |
KR101497425B1 (ko) | 2008-08-28 | 2015-03-03 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 그 제조 방법 |
KR20110093113A (ko) | 2010-02-11 | 2011-08-18 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
KR101960371B1 (ko) * | 2012-02-29 | 2019-03-20 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
KR102071008B1 (ko) * | 2013-04-10 | 2020-01-30 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR102247048B1 (ko) | 2013-12-04 | 2021-05-03 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
KR20150066690A (ko) | 2013-12-09 | 2015-06-17 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
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JP3193033B2 (ja) * | 1989-03-16 | 2001-07-30 | ローベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 目標値発生部材の調整位置を伝達する装置 |
US20140104527A1 (en) * | 2012-10-17 | 2014-04-17 | Apple Inc. | Process Architecture for Color Filter Array in Active Matrix Liquid Crystal Display |
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US20160218116A1 (en) | 2016-07-28 |
US9647005B2 (en) | 2017-05-09 |
KR20160093185A (ko) | 2016-08-08 |
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