KR102241678B1 - Composition - Google Patents
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- Publication number
- KR102241678B1 KR102241678B1 KR1020167017094A KR20167017094A KR102241678B1 KR 102241678 B1 KR102241678 B1 KR 102241678B1 KR 1020167017094 A KR1020167017094 A KR 1020167017094A KR 20167017094 A KR20167017094 A KR 20167017094A KR 102241678 B1 KR102241678 B1 KR 102241678B1
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- composition
- mass
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims abstract description 78
- -1 dicarboxylic acid diester Chemical class 0.000 claims abstract description 71
- 239000000178 monomer Substances 0.000 claims abstract description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 15
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 14
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 10
- 125000003396 thiol group Chemical class [H]S* 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 134
- 239000000853 adhesive Substances 0.000 claims description 54
- 230000001070 adhesive effect Effects 0.000 claims description 54
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 29
- 239000011342 resin composition Substances 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 14
- 229920006295 polythiol Polymers 0.000 claims description 11
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 9
- 229920000515 polycarbonate Polymers 0.000 claims description 9
- 239000004417 polycarbonate Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 8
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 7
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229920005862 polyol Polymers 0.000 description 37
- 238000001723 curing Methods 0.000 description 33
- 238000012360 testing method Methods 0.000 description 32
- 150000003077 polyols Chemical class 0.000 description 26
- 150000001875 compounds Chemical class 0.000 description 25
- 239000005062 Polybutadiene Substances 0.000 description 22
- 229920002857 polybutadiene Polymers 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 239000000047 product Substances 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 14
- 229920001228 polyisocyanate Polymers 0.000 description 12
- 239000005056 polyisocyanate Substances 0.000 description 12
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 10
- 150000003573 thiols Chemical class 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 125000001931 aliphatic group Chemical group 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000004721 Polyphenylene oxide Substances 0.000 description 7
- 239000001361 adipic acid Substances 0.000 description 7
- 235000011037 adipic acid Nutrition 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 7
- 229920005906 polyester polyol Polymers 0.000 description 7
- 229920000570 polyether Polymers 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- 125000005442 diisocyanate group Chemical group 0.000 description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- 239000007859 condensation product Substances 0.000 description 4
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 3
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical class CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical group OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- JKRZOJADNVOXPM-UHFFFAOYSA-N Oxalic acid dibutyl ester Chemical compound CCCCOC(=O)C(=O)OCCCC JKRZOJADNVOXPM-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical group CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- ALOUNLDAKADEEB-UHFFFAOYSA-N dimethyl sebacate Chemical compound COC(=O)CCCCCCCCC(=O)OC ALOUNLDAKADEEB-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000008397 galvanized steel Substances 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VBQMTEHUPQSMFY-UHFFFAOYSA-N (2-diethoxyphosphorylphenyl)-(2,4,6-trimethylphenyl)methanone Chemical compound CCOP(=O)(OCC)c1ccccc1C(=O)c1c(C)cc(C)cc1C VBQMTEHUPQSMFY-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- JKVSAZTYCZKNDX-UHFFFAOYSA-N 1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C1=CC(C(=O)CCC)=CC=C1N1CCOCC1 JKVSAZTYCZKNDX-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- DFYQRCOZAAHDOU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;2-[2-(2-hydroxyethoxy)ethoxy]ethanol Chemical compound OCCOCCO.OCCOCCOCCO DFYQRCOZAAHDOU-UHFFFAOYSA-N 0.000 description 1
- YWEJNVNVJGORIU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-hydroxy-2-phenylacetate Chemical compound OCCOCCOC(=O)C(O)C1=CC=CC=C1 YWEJNVNVJGORIU-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical group CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
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- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Chemical class 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C08F2/00—Processes of polymerisation
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- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
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- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
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- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G—PHYSICS
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
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- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C08F222/10—Esters
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Abstract
심부 경화성이 뛰어난 조성물을 제공한다.
하기 (P) , (C) 내지 (F) 을 함유한 조성물.
(P) 중합성 비닐 모노머, (C) 광중합 개시제, (D) 산화방지제, (E)티올, (F) 디카르복실산 디에스테르.Provides a composition excellent in deep curing properties.
A composition containing the following (P), (C) to (F).
(P) Polymerizable vinyl monomer, (C) photoinitiator, (D) antioxidant, (E) thiol, (F) dicarboxylic acid diester.
Description
본 발명은 조성물에 관한 것이다 .The present invention relates to a composition.
LCD (액정 디스플레이) 등의 표시체 위에 탑재하는 터치패널로서 저항막식, 정전용량식, 전자유도식, 광학식 등이 있다. 이들의 터치패널의 표면에 외관의 디자인성을 부여하는 화장판이나 터치하는 위치를 지정하는 아이콘 시트를 첩합(貼合)하는 경우가 있다. 정전용량식 터치패널은 투명기판 위에 투명전극을 형성하고 그 위에 투명판이 첩합되는 구조를 가지고 있다.As a touch panel mounted on a display such as an LCD (liquid crystal display), there are a resistive film type, a capacitive type, an electromagnetic induction type, and an optical type. On the surface of these touch panels, a decorative plate for imparting the design of the external appearance or an icon sheet for designating a touch position may be attached to the surface of the touch panel. The capacitive touch panel has a structure in which a transparent electrode is formed on a transparent substrate and a transparent plate is bonded thereon.
종래, 화장판과 터치패널과의 첩합, 아이콘시트와 터치패널과의 첩합, 및 투명기판과 투명판과의 첩합에서는 접착제를 사용하고 있다.Conventionally, bonding of a decorative plate and a touch panel, bonding of an icon sheet and a touch panel, and bonding of a transparent substrate and a transparent plate are performed using an adhesive.
이러한 아이콘시트나 터치패널은 표시체의 구동용IC나 배선이나 LCD의 테두리 밀봉제를 감추고 표시 구역만을 드러나게 했고, 디자인성을 향상시키기 위하여, 차광 테두리를 인쇄 등으로 피복하는 경우가 있다. 이런 차광 테두리가 있으면 차광 테두리 아래의 광경화성 접착제 조성물은 차광 테두리에 의해 빛이 가려져 빛이 비추지 못함으로 인하여 경화되지 않기 때문에 접착이 불충분 하다.Such an icon sheet or touch panel hides only the display area by concealing the IC for driving the display, the wiring or the edge sealant of the LCD, and in order to improve the design, the shading edge is sometimes covered with printing or the like. If there is such a light-shielding edge, the photocurable adhesive composition under the light-shielding edge is not cured because the light is obscured by the light-shielding edge and the light does not shine, so adhesion is insufficient.
이러한 미경화에 의한 불충분한 접착문제를 해결하기 위하여 빛을 경사지게 혹은 옆으로부터 조사하는 등 빛의 조사각도를 조정하는 방법이나 광경화성 접착제 조성물에 열경화성 촉매를 첨가하여 광경화성 이외에 열경화성을 부여하고 빛과 열로 경화하는 방법 등이 사용되고 있다.In order to solve the insufficient adhesion problem due to uncuring, a method of adjusting the irradiation angle of light such as irradiating light from an angle or from the side, or adding a thermosetting catalyst to the photocurable adhesive composition to impart thermosetting properties in addition to photocuring properties and A method of curing by heat or the like is being used.
그러나 광선의 조사각도를 조정하는 방법에서는 차광 테두리의 폭이 넓어지므로 인해 차광 테두리 아래의 광경화성 접착제 조성물 전체를 충분히 경화시키는 것이 어려워지고, 미경화 부분이 잔존하기 쉽다는 과제가 존재한다. 광경화성 접착제 조성물에 열경화성을 부여하여 빛과 열로 경화하는 방법은 LCD, EL디스플레이, LED디스플레이 등의 표시패널을 60 내지 80℃에서 30 내지 60분 가열할 필요가 있기 때문에 품질의 악화, 상품수명을 짧게 하는 등의 우려가 있는 과제가 존재한다.However, in the method of adjusting the irradiation angle of the light beam, since the width of the shading edge becomes wide, it becomes difficult to sufficiently cure the entire photocurable adhesive composition under the shading edge, and there is a problem that the uncured portion is liable to remain. The method of imparting thermosetting to the photocurable adhesive composition and curing it with light and heat requires heating display panels such as LCD, EL display, and LED display at 60 to 80°C for 30 to 60 minutes, thus reducing quality and product life. There are challenges such as shortening.
특허문헌 1은 (A) 폴리이소프렌, 폴리부타디엔 또는 폴리우레탄을 골격으로 하는 (메타)아크릴레이트 올리고머, (B) 유연화성분, 및 (C1) 페녹시에틸(메타)아크릴레이트, 페녹시폴리에틸렌글리콜(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 노닐페놀EO부가물 (메타)아크릴레이트, 메톡시트리에틸렌글리콜(메타)아크릴레이트 및 테트라히드로푸르푸릴(메타)아크릴레이트에서 선택되는 (메타)아크릴레이트모노머를 포함하는 광경화형 수지 조성물이 개시되어 있다.Patent Document 1 describes (A) polyisoprene, polybutadiene, or a (meth)acrylate oligomer having a polyurethane as a skeleton, (B) a softening component, and (C1) phenoxyethyl (meth)acrylate, phenoxypolyethylene glycol ( Meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, nonylphenol EO adduct (meth)acrylate, methoxytriethylene glycol (meth)acrylate And a (meth)acrylate monomer selected from tetrahydrofurfuryl (meth)acrylate is disclosed.
최근 LCD 등의 표시체의 유리가 얇어지고 있다. 유리 두께가 엷어지면 외부응력에 의한 LCD의 변형도 쉬워진다. 얇은 유리를 이용한 LCD등의 표시체와, 아크릴판이나 폴리카보네이트판 등의 광학 기능 재료를 첩합시킬 경우, 유리와 아크릴 등의 선팽창의 차이나, 아크릴판이나 폴리카보네이트 등의 플라스틱 성형재료의 성형 시의 변형으로 인해 내열 시험과 내습(耐濕) 시험에서 성형 변형의 완화나 흡습/건조가 일어나고, 치수 변화나 휘어짐 등의 면정밀도(面精度)의 변화가 생긴다. 특허문헌 2는 우레탄계(메타)아크릴레이트, 폴리부타디엔계(메타)아크릴레이트 및 이소프렌계(메타)아크릴레이트를 성분으로 하는 경화수지가 개시되어 있다.Recently, the glass of display bodies such as LCDs has become thinner. When the glass thickness becomes thinner, it becomes easier to deform the LCD due to external stress. When a display body such as an LCD using thin glass and an optical functional material such as an acrylic plate or a polycarbonate plate are bonded together, the difference in linear expansion such as glass and acrylic, or when forming a plastic molding material such as an acrylic plate or polycarbonate Due to the deformation, in the heat-resistance test and the moisture-resistance test, the molding deformation is relieved and moisture absorption/drying occurs, and the surface accuracy such as dimensional change or warping occurs. Patent Document 2 discloses a cured resin containing urethane-based (meth)acrylate, polybutadiene-based (meth)acrylate, and isoprene-based (meth)acrylate as components.
화장판과 터치패널과의 첩합, 아이콘시트와 터치패널과의 첩합, 투명기판과 투명판자와의 첩합 등과 같은 용도에서는, 사용환경을 상정한 가온(加溫) 분위기에서의 피착체의 변형에 추수할수 있을 정도의 유연성을 갖는 것이 바람직하다.In applications such as bonding a decorative plate and a touch panel, bonding an icon sheet and a touch panel, bonding a transparent substrate and a transparent plate, etc., the deformation of the adherend in a warm atmosphere that assumes the usage environment is beneficial. It is desirable to have as much flexibility as possible.
한편, 사용환경을 상정한 가온 분위기에서의 피착체의 변형에 추수할수 있는 정도의 유연성을 가지는 경우, 내열시 험후의 착색과 변색, 내습시험 이후의 강도저하 등 과제가 있다는 것도 밝혀지고 있다. 상기 과제의 해결책으로서 특허문헌 4는 폴리이소프렌(메타)아크릴레이트올리고머, 폴리부타디엔(메타)아크릴레이트올리고머 및 폴리우레탄(메타)아크릴레이트올리고머로 이루어지는 군에서 선택되는1종 이상의 올리고머와 힌더드아민을 함유하는 광경화 접착조성물이 개시되어 있다.On the other hand, it has also been found that there are problems such as coloration and discoloration after a heat resistance test, and a decrease in strength after a moisture resistance test when the adherend has a degree of flexibility that can be harvested for the deformation of the adherend in a warm atmosphere assuming the use environment. As a solution to the above problems, Patent Document 4 discloses at least one oligomer and hindered amine selected from the group consisting of polyisoprene (meth)acrylate oligomer, polybutadiene (meth)acrylate oligomer, and polyurethane (meth)acrylate oligomer. A photocurable adhesive composition containing is disclosed.
특허문헌 5에는 (A) 특정의 유황함유 (메타)아크릴레이트 화합물 또는 이를 포함한 라디칼 반응성 조성물, (B) 자외선 흡수제, (C) 산화방지제, 및 (D) 중합개시제를 포함하는 것을 특징으로 하는 광경화 조성물이 개시되어 있다.Patent Document 5 includes (A) a specific sulfur-containing (meth)acrylate compound or a radical reactive composition containing the same, (B) an ultraviolet absorber, (C) an antioxidant, and (D) a polymerization initiator. The composition is disclosed.
특허문헌 6에는 아크릴폴리머 (E), 불포화 이중결합을 가지는 관능기를 2개이상 함유하는 우레탄(메타)아크릴레이트 (A), 불포화 이중결합을 함유하는 관능기를 1개 함유하는 단량체 (B), 광중합개시제 (C), 티올기를 2개이상 함유하는 폴리티올화합물 (D) 을 함유하는 조성물에 있어서, 상기 조성물 중의 우레탄(메타)아크릴레이트 (A) 의 중량 비율이 2중량% 내지 30중량%인 광경화성 투명 접착제 조성물이 기재되어 있다.Patent Document 6 includes an acrylic polymer (E), a urethane (meth)acrylate containing two or more functional groups having an unsaturated double bond (A), a monomer containing one functional group containing an unsaturated double bond (B), and photopolymerization In a composition containing an initiator (C) and a polythiol compound (D) containing two or more thiol groups, the weight ratio of the urethane (meth)acrylate (A) in the composition is 2% to 30% by weight A chemical conversion transparent adhesive composition is described.
특허문헌 7에는 말단에 알릴기를 가진 알릴에스테르올리고머에 있어서, 그 구성 성분중 10 내지 80몰%를 이타콘산으로부터 유도된 유기 잔기를 포함하는 지방족 디카르복시산이며, 잔부가 이타콘산 이외의 불포화기를 포함하는 지방족 및/또는 포화 지방족 및/또는 방향족 지방족 디카르복실다산으로부터 유도된 유기 잔기와 폴리올 로부터 유도되는 유기 잔기를 포함하는 아릴에스테르올리고머를 열경화성 수지 조성물로서 사용하는 것이 개시되어 있다.In Patent Document 7, in the allyl ester oligomer having an allyl group at the terminal, 10 to 80 mol% of the constituents are aliphatic dicarboxylic acids containing organic residues derived from itaconic acid, and the remainder contains unsaturated groups other than itaconic acid. It is disclosed to use an arylester oligomer comprising an organic moiety derived from an aliphatic and/or saturated aliphatic and/or aromatic aliphatic dicarboxylic dicarboxylic acid and an organic moiety derived from a polyol as a thermosetting resin composition.
그러나, 상기 문헌에 기재된 기존 기술은 다음과 같은 점에서 개선의 여지를 가지고 있다. However, the existing technology described in the above document has room for improvement in the following points.
특허문헌 2의 방법은 면정밀도 변화 등 변형을 억제할 경우 접착면이 벗겨지거나 LCD가 깨지거나 LCD 표시가 고르지 않는 문제가 존재한다.In the method of Patent Document 2, when deformation such as a change in surface precision is suppressed, the adhesive surface is peeled off, the LCD is broken, or the LCD display is uneven.
특허문헌 2의 과제의 해결책으로서 특허문헌 3의 UV경화형 수지를 들 수 있다. 그러나 특허문헌 3에서는 이소볼닐(메타)아크릴레이트처럼 강직한 골격단량체를 기반으로 하는 고탄성 수지를 사용하기 때문에 고온 신뢰성 시험 (내습열성 시험) 에서 피착체의 팽창수축에 견디지 못하고 벗겨짐이 생긴다.As a solution to the problem of patent document 2, the UV-curable resin of patent document 3 is mentioned. However, in Patent Document 3, since a highly elastic resin based on a rigid skeletal monomer such as isovolyl (meth)acrylate is used, it cannot withstand the expansion and contraction of the adherend in the high temperature reliability test (moist heat resistance test), and peeling occurs.
또한, 그 어느 문헌의 기술에서도 예를 들어 터치패널 등의 표시체에 사용되는 화장판이나 아이콘 시트를 첩합시킬 경우, 투명기판과 투명기판 사이를 첩합시킬 경우, 및 인쇄가공된 부분을 첩합시킬 등 경우에는, 피착체 정면의 인쇄 등으로 인해 차광 테두리의 정면으로부터 가시광선 또는 자외선이 닿지 않는 부분을 측면으로부터의 가시광선 또는 자외선을 통해 경화시킬 경우, 차광 테두리 아래의 경화성 수지 조성물이 경화 불량을 일으키는 과제가 있었다.In addition, in the description of any literature, for example, when bonding a decorative plate or icon sheet used for a display body such as a touch panel, when bonding between a transparent substrate and a transparent substrate, and bonding a printed portion, etc. In this case, when the part that is not exposed to visible or ultraviolet rays from the front side of the shading edge due to printing on the front side of the adherend is cured with visible light or ultraviolet rays from the side, the curable resin composition under the shading edge causes curing failure. There was an assignment.
본 발명은 상기 사정에 비추어 이뤄진 것이며, 예를 들면, 터치패널 등의 표시체에 사용되는 화장판이나 아이콘시트를 첩합시킬 경우, 투명기판과 투명기판 사이를 첩합시킬 경우, 및 표시체와 광학 기능재료를 첩합시킬 경우에 바람직하게사용할수 있는 조성물을 제공하고는것을 목적으로 한다.The present invention has been made in view of the above circumstances, for example, when a decorative plate or icon sheet used for a display body such as a touch panel is bonded, when a transparent substrate and a transparent substrate are bonded, and a display body and an optical function It is an object of the present invention to provide a composition that can be preferably used in the case of bonding materials.
즉, 본 발명에 의하면, 하기 (P), (C) 내지 (F) 을 함유하는 조성물이 제공된다.That is, according to the present invention, a composition containing the following (P), (C) to (F) is provided.
(P) 중합성 비닐 모노머(P) polymerizable vinyl monomer
(C) 광중합 개시제(C) photopolymerization initiator
(D) 산화방지제(D) antioxidant
(E) 티올(E) thiol
(F) 디카르복실산디에스테르(F) dicarboxylic acid diester
상기 (F) 가 식 (1)로 나타내는 디카르복실산디에스테르인 조성물인 것이 바람직하다.It is preferable that it is a composition in which said (F) is a dicarboxylic acid diester represented by Formula (1).
(R1, R2는 탄소수가 1 내지 18인 알킬기이며, R3는 탄소수가 1 내지 10 인 알킬렌기이며, R1, R2와 동일해도 되고 상이해도 된다.)(R 1 , R 2 is an alkyl group having 1 to 18 carbon atoms, R 3 is an alkylene group having 1 to 10 carbon atoms, and may be the same as or different from R 1 and R 2 .)
상기 (E) 티올이 폴리티올인것이 바람직하다.It is preferable that the (E) thiol is polythiol.
상기 (P) 중합성 모노머가 (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트를 함유하는 상기 조성물인것이 바람직하다.It is preferable that the (P) polymerizable monomer is the composition containing (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate.
또한, 상기 (A) 다관능(메타)아크릴레이트가 우레탄(메타)아크릴레이트인 상기 조성물인 것이 바람직하다.In addition, it is preferable that the (A) polyfunctional (meth)acrylate is the composition of urethane (meth)acrylate.
상기 (B) 단관능(메타)아크릴레이트가 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상을 포함하는 상기 조성물인것이 바람직하다.It is preferable that the (B) monofunctional (meth)acrylate is the composition comprising at least one selected from the group consisting of hydroxyalkyl (meth)acrylate and alkyl (meth)acrylate.
상기 (F) 디카르복실산디에스테르의 함유량은 (P) 중합성 비닐 모노머 및 (F) 디카르복실산디에스테르의 합계가 100질량부일 경우에 5 내지 50질량부인 상기 조성물인것이 바람직하다.The content of the (F) dicarboxylic acid diester is preferably 5 to 50 parts by mass when the total of (P) the polymerizable vinyl monomer and (F) dicarboxylic acid diester is 100 parts by mass.
또한, 본 발명에 의하면 상기 조성물을 포함하는 경화성수지조성물이 제공된다.In addition, according to the present invention, a curable resin composition comprising the composition is provided.
또한, 본 발명에 의하면 상기 조성물을 포함하는 접착제 조성물이 제공된다.In addition, according to the present invention, there is provided an adhesive composition comprising the composition.
또한, 본 발명에 의하면 상기 접착제 조성물의 경화체가 제공된다.Further, according to the present invention, a cured product of the adhesive composition is provided.
또한, 본 발명에 의하면 상기 경화체에 의해 피착체가 피복 또는 접합된 복합체가 제공된다.Further, according to the present invention, a composite is provided in which an adherend is coated or bonded by the cured body.
상기 피착체는 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속 등에서 1종 이상을 포함하는 복합체인것이 바람직하다.It is preferable that the adherend is a composite containing one or more of triacetyl cellulose, fluorine-based polymer, polyester, polycarbonate, polyolefin, glass, metal, and the like.
또한, 본 발명에 의하면 상기 접착제 조성물에 의한 피착체를 첩합시킨터치패널 적층체가 제공된다.Further, according to the present invention, a touch panel laminate is provided in which an adherend made of the adhesive composition is bonded to each other.
또한, 본 발명에 의하면 상기 접착제 조성물에 의한 피착체를 첩합시킨 액정패널 적층체가 제공된다.Further, according to the present invention, there is provided a liquid crystal panel laminate in which the adherend made of the adhesive composition is bonded.
또한, 본 발명에 의하면 상기 터치패널 적층체를 사용한 디스플레이가 제공된다.In addition, according to the present invention, a display using the touch panel laminate is provided.
또한, 본 발명에 의하면 상기 액정패널 적층체를 사용한 디스플레이가 제공된다.Further, according to the present invention, a display using the liquid crystal panel laminate is provided.
본 발명에 의하면 심부 경화성(深部硬化性)이 뛰어난 조성물을 제공할 수 있다.ADVANTAGE OF THE INVENTION According to this invention, the composition excellent in deep hardenability can be provided.
이하, 본 발명의 실시형태에 관하여 상세히 설명한다. 본 발명의 조성물은 하기 (P), (C) 내지 (F) 을 함유한다.Hereinafter, embodiments of the present invention will be described in detail. The composition of the present invention contains the following (P), (C) to (F).
(P) 중합성 비닐 모노머(P) polymerizable vinyl monomer
(C) 광중합 개시제(C) photopolymerization initiator
(D) 산화 방지제(D) antioxidant
(E) 티올(E) thiol
(F) 디카르복실산디에스테르(F) dicarboxylic acid diester
상기 조성에 따르면 터치패널 등의 표시체에 사용되는 화장판이나 아이콘시트를 접착시길 경우, 투명기판과 투명기판 사이를 첩합시킬 경우, 및 인쇄가공된 부분을 첩합시길 경우, 피착체 정면에서부터는 인쇄 등의 차광 테두리에 인해 정면으로부터 가시광선 또는 자외선이 조사되지 않는 부분을 측면으로부터의 가시광선 또는 자외선을 통해 경화하는 경화성 수지조성물을 제공할 수 있다.According to the above composition, when adhering a decorative plate or icon sheet used for a display such as a touch panel, when adhering between a transparent substrate and a transparent substrate, and when adhering a printed part, from the front of the adherend It is possible to provide a curable resin composition in which a portion not irradiated with visible light or ultraviolet rays from the front side due to a light-shielding edge such as printing is cured through visible light or ultraviolet rays from the side surface.
또한, 상기 조성에 따르면 심부 경화성이 뛰어난 조성물을 제공할수 있으므로 차광 테두리 아래 측의 경화성 수지 조성물의 경화가 가능하며 접착제의 경화 불량을 억제하는 효과를 가질수 있다.Further, according to the above composition, since a composition having excellent deep curing properties can be provided, the curable resin composition under the light-shielding edge can be cured, and the curing failure of the adhesive can be suppressed.
본 발명중의 한가지 실시형태의 조성물은 상기한 바와 같이 (P), (C) 내지 (F) 을 함유하고 있으므로 이소볼닐(메타)아크릴레이트와 같은 강직한 골격의 단량체를 사용하지 않더라도 신뢰성 시험에 견딜수 있다.The composition of one embodiment of the present invention contains (P), (C) to (F) as described above, so even if a rigid skeleton monomer such as isovolyl (meth)acrylate is not used, it can be tested for reliability. I can bear it.
<(P) 중합성 비닐 모노머><(P) Polymerizable vinyl monomer>
(P) 중합성 비닐 모노머로서 (메타)아크릴레이트를 사용하는 것이 바랍직하며, (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트를 함유하는 것이 보다 바람직하다.(P) It is preferable to use (meth)acrylate as a polymerizable vinyl monomer, and it is more preferable to contain (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate.
<(A) 다관능(메타)아크릴레이트><(A) polyfunctional (meth)acrylate>
(A) 다관능(메타)아크릴레이트란 (메타)아크릴로일기를 2개이상 가지고 있는 (메타)아크릴레이트를 가리킨다. 다관능(메타)아크릴레이트로서는 올리고머/폴리머 말단 혹은 측쇄에 2개 이상의 (메타)아크릴로일기화된 다관능(메타)아크릴레이트의 올리고머/폴리머 등이 있다.(A) Polyfunctional (meth)acrylate refers to a (meth)acrylate having two or more (meth)acryloyl groups. Examples of polyfunctional (meth)acrylates include oligomers/polymers of polyfunctional (meth)acrylates formed by two or more (meth)acryloyl groups at the end or side chain of the oligomer/polymer.
예를 들면, 다관능(메타)아크릴레이트의 올리고머/폴리머로서 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트 (예를 들면, 니폰 소다샤 제 "TEA-1000"), 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물 (예를 들면, 1,2-폴리부타디엔 골격 중의 탄소-탄소 결합에 수소가 부가된 수소화 폴리부타디엔의 양 말단에 (메타)아크릴로일옥시기를 가지는 우레탄(메타)아크릴레이트를 가리킨다. 예를 들면, 니폰 소다샤 제 "TEAI-1000", 다이셀ㅇ올넥스샤 (DAICEL-ALLNEX LTD.) 제 "KRM-8776", "KRM-8792"), 1,4-폴리부타디엔 말단 우레탄(메타)아크릴레이트 (예를 들면, 오사카 유기 가가쿠샤 제 "BAC-45"), 폴리이소프렌 말단 (메타)아크릴레이트, 폴리에스테르계 우레탄(메타)아크릴레이트 (예를 들면 니폰 고으세이샤 제 "UV-2000B", "UV-3000B", "UV-7000B", 네가미 고으교샤 제 "KHP-11", "KHP-17"), 폴리에테르계 우레탄(메타)아크릴레이트 (예를 들면 니폰 고으세이샤 제 "UV-3700B", "UV-6100B"), 비스페놀 A형 에폭시(메타)아크릴레이트 등이 있다. For example, as an oligomer/polymer of polyfunctional (meth)acrylate, 1,2-polybutadiene-terminated urethane (meth)acrylate (for example, "TEA-1000" manufactured by Nippon Soda Corporation), 1,2-poly Hydrogenated product of butadiene-terminated urethane (meth)acrylate (e.g., urethane having (meth)acryloyloxy groups at both ends of hydrogenated polybutadiene in which hydrogen is added to a carbon-carbon bond in a 1,2-polybutadiene skeleton Refers to (meth)acrylate, for example, "TEAI-1000" manufactured by Nippon Soda Corporation, "KRM-8776" manufactured by DAICEL-ALLNEX LTD., "KRM-8792"), 1 ,4-polybutadiene-terminated urethane (meth)acrylate (for example, "BAC-45" manufactured by Osaka Organic Chemical Co., Ltd.), polyisoprene-terminated (meth)acrylate, polyester-based urethane (meth)acrylate (e.g. For example, "UV-2000B", "UV-3000B", "UV-7000B" manufactured by Nippon Gooseisha, "KHP-11", "KHP-17" manufactured by Negami Kogyo Corporation), polyether urethane (meth)acrylic Rate (for example, "UV-3700B" and "UV-6100B" manufactured by Nippon Corporation), bisphenol A type epoxy (meth)acrylate, and the like.
또한 폴리부타디엔 말단 (메타)우레탄아크릴레이트는 분자 구조의 말단이 (메타)아크릴레이트 이다.In addition, in the polybutadiene terminal (meth)urethane acrylate, the terminal of the molecular structure is (meth)acrylate.
상기한 다관능(메타)아크릴레이트의 올리고머/폴리머 중 에서 효과가 크다는 관점으로부터 우레탄(메타)아크릴레이트가 바람직하다.Urethane (meth)acrylate is preferred from the viewpoint of having a large effect among the oligomers/polymers of the polyfunctional (meth)acrylate described above.
또한 우레탄(메타)아크릴레이트 중에서 폴리부타디엔계 우레탄(메타)아크릴레이트, 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물, 폴리에스테르계 우레탄(메타)아크릴레이트 및 폴리에테르계 우레탄(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종이상이 바람직하며, 폴리부타디엔계 우레탄(메타)아크릴레이트 및/또는 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물이 보다 마람직하며, 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물이 가장 바람직하다.In addition, among urethane (meth)acrylates, hydrogenated products of polybutadiene-based urethane (meth)acrylate, polybutadiene-terminated urethane (meth)acrylate, polyester-based urethane (meth)acrylate, and polyether-based urethane (meth)acrylate At least one selected from the group consisting of is preferable, and the hydrogenated product of polybutadiene-based urethane (meth)acrylate and/or polybutadiene-terminated urethane (meth)acrylate is more desirable, and polybutadiene-terminated urethane (meth) Hydrogenated acrylates are most preferred.
또한, 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물중에서 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물이 바람직하다. 폴리부타디엔계 우레탄(메타)아크릴레이트 중에서 1,4-폴리부타디엔 말단 우레탄(메타)아크릴레이트가 바람직하다.In addition, among the hydrogenated products of polybutadiene-terminated urethane (meth)acrylate, a hydrogenated product of 1,2-polybutadiene-terminated urethane (meth)acrylate is preferable. Among the polybutadiene-based urethane (meth)acrylates, 1,4-polybutadiene-terminated urethane (meth)acrylate is preferable.
그중, 우레탄(메타)아크릴레이트는 폴리올 화합물 (이후 X로 표시한다) 과 유기 폴리 이소시아네이트 화합물 (이후 Y로 표시한다) 과 히드록시(메타)아크릴레이트 (이후 Z로 표시한다) 를 반응 (예를 들면 중축합 반응) 시켜 얻은 분자 내에 우레탄 결합을 가지는 우레탄(메타)아크릴레이트를 가리킨다.Among them, urethane (meth)acrylate reacts with a polyol compound (hereinafter referred to as X) and an organic polyisocyanate compound (hereinafter referred to as Y) and hydroxy (meth)acrylate (hereinafter referred to as Z). For example, it refers to a urethane (meth)acrylate having a urethane bond in a molecule obtained by polycondensation reaction).
폴리올 화합물 (X) 로서 에틸렌글리콜, 디에틸렌글리콜 트리에틸렌글리콜, 테트라에틸렌글리콜, 폴리에틸렌글리콜, 프로필렌글리콜, 지프로필렌글리콜, 폴리프로필렌글리콜, 부틸렌글리콜, 1,4-부탄디올, 폴리부틸렌글리콜, 1,5-펜탄디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 3-메틸-1,5-펜탄디올, 2,4-디에틸1,5-펜탄디올, 2,2-부틸에틸-1,3-프로판디올, 네오펜칠글리콜, 시클로헥산지메탄올, 수소화비스페놀 A, 폴리카프로락톤, 트리메틸올에탄, 트리메틸올프로판, 폴리트리메틸올프로판, 펜타에리스리톨, 폴리펜타에리스리톨, 솔비톨, 만니톨, 글리세린, 폴리글리세린, 폴리테트라메틸렌글리콜 등의 다가 알코올이거나, 폴리에틸렌옥사이드, 폴리프로필렌옥사이드, 에틸렌옥사이드/프로필렌옥사이드의 블록 또는 랜덤 공중합의 적어도 1종의 구조를 가지는 폴리에테르폴리올, 상기 다가 알코올 또는 폴리에테르폴리올과, 말레산무수물, 말레산, 푸마르산, 무수이타콤산, 이타콤산, 아디핀산, 이소프탈산 등의 다염기산과의 축합물인 폴리에스테르폴리올, 카프로락톤 변성 폴리테트라메틸렌폴리올 등의 카프로락톤 변성 폴리올, 폴리올레핀계 폴리올,폴리카보네이트계 폴리올, 폴리부타디엔폴리올, 폴리이소프렌폴리올, 수소화폴리부타디엔폴리올, 수소화폴리이소프렌폴리올 등의 폴리디엔계 폴리올, 폴리디메틸실록산폴리올 등의 실리콘폴리올 등이 있다.As polyol compound (X), ethylene glycol, diethylene glycol triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, polypropylene glycol, butylene glycol, 1,4-butanediol, polybutylene glycol, 1 ,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl1,5-pentanediol , 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, trimethylolethane, trimethylolpropane, polytrimethylolpropane, pentaerythritol, polypenta Polyether polyol, which is a polyhydric alcohol such as erythritol, sorbitol, mannitol, glycerin, polyglycerin, and polytetramethylene glycol, or has at least one structure of block or random copolymerization of polyethylene oxide, polypropylene oxide, ethylene oxide/propylene oxide, Polyester polyol, which is a condensation product of polybasic acids such as polyhydric alcohol or polyether polyol, maleic anhydride, maleic acid, fumaric acid, itacomic anhydride, itaconic acid, adipic acid, isophthalic acid, caprolactone-modified polytetramethylene polyol, etc. Polydiene-based polyols such as caprolactone-modified polyol, polyolefin-based polyol, polycarbonate-based polyol, polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol, hydrogenated polyisoprene polyol, and silicone polyols such as polydimethylsiloxane polyol.
이들 중에서 폴리올화합물 (X) 로서 폴리부타디엔폴리올, 수소화폴리부타디엔폴리올, 폴리에테르폴리올과 폴리에스테르폴리올 중의 1종 이상을 포함하는 것이 바람직하며, 수소화 폴리부타디엔폴리올이 보다 바람직하다. 수소화 폴리부타디엔폴리올 중에서 식 (3) 으로 나타내는 화합물 (n은 정수) 이 바람직하다.Among these, as the polyol compound (X), it is preferable to contain at least one of polybutadiene polyol, hydrogenated polybutadiene polyol, polyether polyol and polyester polyol, and hydrogenated polybutadiene polyol is more preferable. Among hydrogenated polybutadiene polyols, the compound represented by formula (3) (n is an integer) is preferred.
여기에서 폴리부타디엔계 우레탄(메타)아크릴레이트는 예를 들면 폴리올 화합물 (X) 이 폴리부타디엔폴리올이다. 또한, 폴리에스테르계 우레탄(메타)아크릴레이트는 예를 들면 폴리 올 화합물 (X) 이 폴리에스테르폴리올이다. 또한, 폴리에테르계 우레탄(메타)아크릴레이트는 예를 들면 폴리올화합물 (X) 이 폴리에테르폴리올이다.Here, as for the polybutadiene-based urethane (meth)acrylate, for example, the polyol compound (X) is a polybutadiene polyol. In addition, as for the polyester-based urethane (meth)acrylate, for example, the polyol compound (X) is a polyester polyol. In addition, as for the polyether urethane (meth)acrylate, for example, the polyol compound (X) is a polyether polyol.
유기 폴리이소시아네이트 화합물 (Y) 로서 특히 한정되지는 않지만, 예를 들어 방향족계, 지방족계, 환식지방족계, 지방족고리계 등 폴리이소시아네이트를 사용할수 있다. The organic polyisocyanate compound (Y) is not particularly limited, but polyisocyanates such as aromatic, aliphatic, cyclic aliphatic, and alicyclic can be used.
폴리 이소시아네이트중에서도 톨릴렌디이소시아네이트 (TDI), 디페닐메탄디이소시아네이트 (MDI), 수소 첨가화 디페닐메탄디이소시아네이트 (H-MDI), 폴리페닐메탄폴리이소시아네이트 (크루드 MDI), 변성 디페닐메탄디이소시아네이트 (변성 MDI), 수소 첨가화 크실렌디이소시아네이트 (H-XDI), 크실렌디이소시아네이트 (XDI), 헥사디이소시아네이트 (HMDI), 트리메틸헥사디이소시아네이트 (TMXDI), 테트라메틸크실렌디이소시아네이트(m-TMXDI), 이소폴론디이소시아네이트 (IPDI), 노르보르넨디이소시아네이트 (NBDI), 1,3-비스(이소시아네이토메틸)시클로헥산 (H6XDI) 등의 폴리이소시아네이트랑, 이들의 폴리이소시아네이트의 삼량체 화합물이랑, 이들의 폴리이소시아네이트과 폴리올의 반응생성물 등이 바람직하게 사용된다. Among the polyisocyanates, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (crude MDI), modified diphenylmethane diisocyanate (Modified MDI), hydrogenated xylene diisocyanate (H-XDI), xylene diisocyanate (XDI), hexadiisocyanate (HMDI), trimethylhexadiisocyanate (TMXDI), tetramethylxylene diisocyanate (m-TMXDI), Polyisocyanates such as isopolone diisocyanate (IPDI), norbornene diisocyanate (NBDI), 1,3-bis (isocyanatomethyl) cyclohexane (H6XDI), trimer compounds of these polyisocyanates, and these The reaction product of polyisocyanate and polyol, etc. are preferably used.
상기 물질 중에서 유기폴리이소시아네이트 화합물 (Y) 로서 수소 첨가화 크실렌디이소시아네이트 (H-XDI) 및/또는 이소폴론디이소시아네이트 (IPDI) 가 바람직하며, 이소폴론디이소시아네이트 (IPDI) 가 보다 바람직하다.Among the above substances, hydrogenated xylene diisocyanate (H-XDI) and/or isopolone diisocyanate (IPDI) are preferable as the organic polyisocyanate compound (Y), and isopolone diisocyanate (IPDI) is more preferable.
히드록시(메타)아크릴레이트 (Z) 로서, 2-히드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴로일포스페이트, 4-히드록시부틸(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸-2-히드록시프로필프탈레이트, 글리세린디(메타)아크릴레이트, 2- 히드록시-3-(메타)아크릴로일옥시프로필아크릴레이트, 카프로락톤 변성 2-히드록시에틸(메타)아크릴레이트, 펜타에리트리톨트리(메타)아크릴레이트, 디펜타에리트리톨펜타(메타)아크릴레이트, 카프로락톤 변성 2-히드록시에틸(메타)아크릴레이트 등이 있다.As hydroxy (meth) acrylate (Z), 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxyethyl (Meth)acryloylphosphate, 4-hydroxybutyl (meth)acrylate, 2-(meth)acryloyloxyethyl-2-hydroxypropylphthalate, glycerindi(meth)acrylate, 2-hydroxy- 3-(meth)acryloyloxypropylacrylate, caprolactone-modified 2-hydroxyethyl(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, caprolactone Modified 2-hydroxyethyl (meth)acrylate and the like.
그중, 히드록시(메타)아크릴레이트 (Z) 로서, 히드록시알킬(메타)아크릴레이트가 바람직하다. 히드록시알킬(메타)아크릴레이트 중에서2-히드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하다.Among them, as the hydroxy (meth) acrylate (Z), hydroxyalkyl (meth) acrylate is preferred. At least one selected from the group consisting of 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate among hydroxyalkyl (meth)acrylates It is preferable to include.
다관능(메타)아크릴레이트의 중량 평균분자량은 특히 한정되지 않지만 1000 내지 60000이 바람직하며, 1500 내지 40000이 보다 바람직하다. 중량 평균분자량은 하기 조건에서 용제로서 테트라히드로푸란을 사용하고, GPC 시스템 (토소샤 제 SC-8010) 등을 사용하고, 시판의 표준 폴리스티렌에서 분석 곡선을 작성하여 구했다.The weight average molecular weight of the polyfunctional (meth)acrylate is not particularly limited, but is preferably 1000 to 60000, and more preferably 1500 to 40000. The weight average molecular weight was determined by using tetrahydrofuran as a solvent under the following conditions, using a GPC system (SC-8010 manufactured by Tosoh Corporation), etc., and preparing an analysis curve from commercially available standard polystyrene.
유속: 1.0ml/minFlow rate: 1.0ml/min
설정 온도: 40℃Set temperature: 40℃
컬럼 구성: 토소샤 제 "TSK guardcolumn MP(×L)"6.0mmID×4.0cm 1개 및 토소샤 제 "TSK-GELMULTIPOREHXL-M" 7.8mmID×30.0cm (이론 단수 16,000단) 2개, 합계 3개 (전체 이론 단수 32,000단)Column configuration: Tososha's "TSK guardcolumn MP(×L)" 6.0mmID×4.0cm 1 pc. and Tosohsha's "TSK-GELMULTIPOREHXL-M" 7.8mmID×30.0cm (theoretical level 16,000) 2 pcs., total 3 pcs. (32,000 total theoretical stages)
샘플 주입량: 100μl (시료 용액 농도 1mg/ml)Sample injection volume: 100μl (sample solution concentration 1mg/ml)
송액 압력: 39kg/cm2 Liquid feed pressure: 39kg / cm 2
검출기: RI 검출기Detector: RI detector
<(B) 단관능(메타)아크릴레이트><(B) monofunctional (meth)acrylate>
(B) 단관능(메타)아크릴레이트는 (메타)아크릴로일기를 1개 가지고 있는 (메타)아크릴레이트를 가리 킨다. (B) 단관능(메타)아크릴레이트 중에서 히드록시(메타)아크릴레이트와 알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상이 바람직하며, 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트를 병용하는 것이 보다 바람직하다. (B) Monofunctional (meth)acrylate refers to a (meth)acrylate having one (meth)acryloyl group. (B) Among monofunctional (meth)acrylates, at least one selected from the group consisting of hydroxy (meth)acrylate and alkyl (meth)acrylate is preferred, and hydroxyalkyl (meth)acrylate and alkyl (meth)acrylate ) It is more preferable to use an acrylate together.
또한, 본 발명중 한가지 실시형태로서 예를 들면 이소볼닐(메타)아크릴레이트와 같은 강직한 골격의 모노머를 사용하지 않아도 된다. 왜냐하면 본 발명중 한가지 실시형태는 이소볼닐(메타)아크릴레이트를 사용하지 않아도 내습성 시험에서 좋은 결과를 나타낼수 있다.In addition, as an embodiment of the present invention, it is not necessary to use a rigid skeleton monomer such as isovolyl (meth)acrylate. Because one embodiment of the present invention can exhibit good results in the moisture resistance test without using isovolyl (meth) acrylate.
히드록시알킬(메타)아크릴레이트 중에서 식 (2) 로 나타내는 (메타)아크릴레이트가 바람직하다. Among the hydroxyalkyl (meth)acrylates, (meth)acrylates represented by formula (2) are preferred.
(Z는 (메타)아크릴로일기, R1은 알킬렌기, p는 1 내지 10의 정수를 나타낸다.) (Z represents a (meth)acryloyl group, R 1 represents an alkylene group, and p represents an integer of 1 to 10.)
또한, 식 (2) 에서 R1의 알킬렌기의 탄소수는 1 내지 8이 바람직하고, 2 내지 6이 보다 바람직하다.Moreover, 1-8 are preferable and, as for the carbon number of the alkylene group of R 1 in Formula (2), 2-6 are more preferable.
히드록시알킬(메타)아크릴레이트로서 2-히드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 디에틸렌글리콜모노(메타)아크릴레이트 및 폴리 프로필렌글리콜(메타)아크릴레이트 등이 있다. 이들 중에서, 접착성이나 내습성의 관점으로부터 2-히드록시부틸(메타)아크릴레이트가 바람직하다.As hydroxyalkyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, diethylene glycol mono (meth)acrylic Rate and polypropylene glycol (meth)acrylate. Among these, 2-hydroxybutyl (meth)acrylate is preferable from the viewpoint of adhesiveness and moisture resistance.
알킬(메타)아크릴레이트 중에서 (메타)아크릴산알킬에스테르가 바람직하다. 알킬에스테르 중에서 알킬기의 탄소수 1 내지 16이 바람직하며, 탄소수 2 내지 14가 보다 바람직하며, 탄소수 4 내지 12가 가장 바람직하고, 탄소수 6 내지 10이 더욱 바람직하다. 알킬기는 포화 지방족탄화수소기가 바람직하다. 또한, 알킬기는 비치환인 것이 바람직하다.Among the alkyl (meth) acrylates, (meth) acrylate alkyl esters are preferred. Among the alkyl esters, the alkyl group preferably has 1 to 16 carbon atoms, more preferably 2 to 14 carbon atoms, most preferably 4 to 12 carbon atoms, and even more preferably 6 to 10 carbon atoms. The alkyl group is preferably a saturated aliphatic hydrocarbon group. In addition, it is preferable that the alkyl group is unsubstituted.
알킬(메타)아크릴레이트로서 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 노르말옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, 데실(메타)아크릴레이트, 이소데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 스테아릴(메타)아크릴레이트, 이소스테아릴(메타)아크릴레이트 등을 들 수 있다. 이들 중에서, 접착성이나 내습성의 관점으로부터 옥틸(메타)아크릴레이트가 바람직하며, 노르말옥틸(메타)아크릴레이트가 보다 바람직하다.As alkyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, normal octyl (meth) Acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate And the like. Among these, octyl (meth)acrylate is preferable from the viewpoint of adhesiveness and moisture resistance, and normal octyl (meth)acrylate is more preferable.
(P) 중합성 비닐 모노머의 함유량은 (P) 및 (F) 의 합계량이 100질량부일 경우에, 50 내지95질량부가 바람직하고, 55 내지 90질량부가 보다 바람직하고 60 내지 80질량부가 가장 바람직하다. (P) 중합성 비닐 모노머의 함유량이 50질량부 이상일 경우, 보다 우수한 경화성을 얻을수 있고, 95질량부 이하일 경우, 접착성의 저하를 보다 억제할수 있다. (P) 중합성 비닐 모노머의 함유량은 예를 들어 50, 51, 54, 55, 56, 59, 60, 61, 65, 69, 70, 71, 75, 79, 80, 81, 85, 89, 90, 91, 94 또는 95질량부 이여도 되고 그들 중 임의의 2개의 값의 범위내에 있어도 된다.(P) When the total amount of (P) and (F) is 100 parts by mass, the content of the (P) polymerizable vinyl monomer is preferably 50 to 95 parts by mass, more preferably 55 to 90 parts by mass, and most preferably 60 to 80 parts by mass. . (P) When the content of the polymerizable vinyl monomer is 50 parts by mass or more, more excellent curability can be obtained, and when the content is 95 parts by mass or less, a decrease in adhesiveness can be further suppressed. (P) The content of the polymerizable vinyl monomer is, for example, 50, 51, 54, 55, 56, 59, 60, 61, 65, 69, 70, 71, 75, 79, 80, 81, 85, 89, 90 , 91, 94, or 95 parts by mass may be sufficient, and any two of them may be in the range of values.
(P) 중합성 비닐 모노머가, (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트를 함유할 경우, (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트의 함유량은 (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트의 합계 100질량부 중, 질량비 (A):(B)=30 내지 95:5 내지70이 바람직하며, 40 내지 90:10 내지 60이 보다 바람직하며 50 내지 70:30 내지 50이 가장 바람직하다.(P) When the polymerizable vinyl monomer contains (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate, (A) polyfunctional (meth)acrylate and (B) short The content of the functional (meth)acrylate is in 100 parts by mass in total of (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate, mass ratio (A): (B) = 30 to 95: 5 to 70 are preferred, 40 to 90: 10 to 60 are more preferred, and 50 to 70:30 to 50 are most preferred.
(B) 단관능(메타)아크릴레이트가 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트를 병용하는 경우, 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트의 함유량은 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트의 합계 100질량부 중, 질량비로 히드록시알킬(메타)아크릴레이트:알킬(메타)아크릴레이트=5 내지 70:30 내지 95이 바람직하며, 10 내지 50:50 내지90이 보다 바람직하고, 20 내지 40:60 내지 80이 가장 바람직하다.(B) When monofunctional (meth)acrylate is used in combination with hydroxyalkyl (meth)acrylate and alkyl (meth)acrylate, the content of hydroxyalkyl (meth)acrylate and alkyl (meth)acrylate is hydroxy Hydroxyalkyl (meth) acrylate: alkyl (meth) acrylate = 5 to 70: 30 to 95 are preferable in a mass ratio of 100 parts by mass of the total of oxyalkyl (meth) acrylate and alkyl (meth) acrylate, 10 to 50:50 to 90 are more preferable, and 20 to 40:60 to 80 are most preferable.
<(C) 광중합 개시제><(C) Photoinitiator>
(C) 광중합 개시제는 가시광선이나 자외선의 활성 광선에 의해 증감시키고 수지 조성물의 광경화를 촉진하기 위해 사용된다.(C) The photoinitiator is used to increase or decrease by active light of visible or ultraviolet light and to accelerate photocuring of the resin composition.
광중합 개시제로서 벤조페논 및 그 유도체, 벤질 및 그 유도체, 안트라퀴논 및 그 유도체, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인프로필에테르, 벤조인이소부틸에테르 등의 벤조인 유도체, 벤질디메틸케탈, 1-히드록시시클로헥실페닐케톤, 2-히드록시-2-메틸-1-페닐-프로판-1-온 등의 알킬페놀 유도체, 디에톡시아세토페논, 4-t-부틸트리클로로아세토페논 등의 아세토페논 유도체, 2-디메틸아미노에틸벤조에이트, P-디메틸아미노에틸벤조에이트, 디페닐디설피드, 티옥산톤 및 그 유도체, 캄퍼퀴논, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복실산, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복시-2-브로모에틸에스테르, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복시-2-메틸에스테르, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복실산클로라이드 등의 캄퍼퀴논 유도체, 2-메틸-1[4-(메틸티올)페닐]-2-모르포리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르포리노페닐)-부타논-1 등의 α-아미노알킬페논 유도체, 벤조일디페닐포스핀옥사이드, 2,4,6-트리메틸벤조일디페닐포스핀옥사이드, 벤조일디에톡시포스핀옥사이드, 2,4,6- 트리메틸벤조일디메톡시페닐포스핀옥사이드, 2,4,6-트리메틸벤조일디에톡시페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드 등의 아실포스핀옥사이드 유도체, 옥시-페닐-아세틱애시드2-[2-옥소-2-페닐-아세톡시-에톡시]-에틸에스테르 및 옥시-페닐-아세틱애시드2-[2-히드록시-에톡시]-에틸에스테르 등이 있다. (C) 광중합 개시제는 1종 또는 2종 이상을 조합하여 사용할수 있다. 상기한 중에서 효과가 크다는 관점으로부터 (C) 광중합 개시제는 알킬페논 유도체와 아실포스핀옥사이드 유도체로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하며, 알킬페논 유도체와 아실포스핀옥사이드 유도체를 병용하는 것이 보다 바람직하다. As a photoinitiator, benzophenone and its derivatives, benzyl and its derivatives, anthraquinone and its derivatives, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin derivatives such as benzoin isobutyl ether, benzyl Alkylphenol derivatives such as dimethyl ketal, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, diethoxyacetophenone, 4-t-butyltrichloroacetophenone Acetophenone derivatives such as, 2-dimethylaminoethylbenzoate, P-dimethylaminoethylbenzoate, diphenyldisulfide, thioxanthone and derivatives thereof, camphorquinone, 7,7-dimethyl-2,3-dioxobi Cyclo[2.2.1]heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2-bromoethyl ester, 7, 7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2-methylester, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane Camphorquinone derivatives such as -1-carboxylic acid chloride, 2-methyl-1[4-(methylthiol)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- Α-aminoalkylphenone derivatives such as (4-morpholinophenyl)-butanone-1, benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, Acylphos, such as 2,4,6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide Pin oxide derivatives, oxy-phenyl-acetic acid 2-[2-oxo-2-phenyl-acetoxy-ethoxy]-ethyl ester and oxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy] -Ethyl ester and the like. (C) The photoinitiator can be used 1 type or in combination of 2 or more types. From the viewpoint of the high effect of the above, (C) the photopolymerization initiator preferably contains at least one selected from the group consisting of alkylphenone derivatives and acylphosphine oxide derivatives, and alkylphenone derivatives and acylphosphine oxide derivatives are used in combination. It is more preferable to do it.
알킬 페논 유도체와 아실포스핀옥사이드 유도체를 병용할 경우, 병용 비율은 아실포스핀옥사이드 유도체 100질량부에 대하여 알킬페논 유도체를 50 내지 400질량부인 것이 바람직하고, 100 내지 300질량부인 것이 보다 바람직하며, 150 내지 250질량부인 것이 가장 바람직하다.When the alkylphenone derivative and the acylphosphine oxide derivative are used in combination, the combination ratio is preferably 50 to 400 parts by mass, more preferably 100 to 300 parts by mass of the alkylphenone derivative based on 100 parts by mass of the acylphosphine oxide derivative, It is most preferably 150 to 250 parts by mass.
알킬 페논 유도체 중에서는 벤질디메틸케탈과 1-히드록시시클로헥실페닐케톤으로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하다. 또한, 아실포스핀옥사이드 유도체 중에서 2,4,6-트리메틸벤조일디페닐포스핀옥사이드와 비스(2,4,6-트리메치루 벤조일)-페닐포스핀옥사이드로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하다.Among the alkyl phenone derivatives, it is preferable to contain at least one selected from the group consisting of benzyl dimethyl ketal and 1-hydroxycyclohexylphenyl ketone. In addition, among the acylphosphine oxide derivatives, at least one selected from the group consisting of 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethyru benzoyl)-phenylphosphine oxide It is preferable to include.
(C) 광중합 개시제 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우에 0.01 내지 10질량부가 바람직하며, 0.05 내지 5질량부가 보다 바람직하며, 0.1 내지 1질량부가 가장 바람직하다. 광중합 개시제 함유량이 0.01질량부 이상일 경우 보다 우수한 경화성을 얻을수 있으며, 10질량부 이하일 경우 보다 우수한 심부 경화성을 얻을수 있다. (C) 광중합 개시제는 예를 들어 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.09, 1, 1.01, 1.5, 1.9, 2, 3, 4, 4.5, 4.9, 5, 6, 7, 8, 9 또는 10질량부이여도 되고, 그들 중의 임의의 2개의 값의 범위 내이여도 된다.(C) The photopolymerization initiator content is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and most preferably 0.1 to 1 part by mass when the sum of (P) and (F) is 100 parts by mass. When the content of the photoinitiator is 0.01 parts by mass or more, better curing properties can be obtained, and when the content is 10 parts by mass or less, better deep curing properties can be obtained. (C) The photopolymerization initiator is, for example, 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.09, 1, 1.01, 1.5, 1.9, 2, 3, 4, 4.5, 4.9, 5, 6, 7, 8, 9 Alternatively, it may be 10 parts by mass, or within the range of any two values among them.
<(D) 산화 방지제><(D) antioxidant>
(D) 산화 방지제는 저장 안전성을 향상시킬수 있다.(D) Antioxidants can improve storage safety.
산화방지제는 메틸히드로퀴논, 히드로퀴논, 2,2-메틸렌비스(4-메틸-6-터셔리부틸페놀), 6-tert-부틸-4-[3[(2,4,8,10-테트라-tert-부틸디벤조[d,f][1,3,2]디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀, 카테콜, 히드로퀴논모노메틸에테르, 모노터셔리부틸히드로퀴논, 2,5-디터셔리부틸히드로퀴논, p-벤조퀴논, 2,5-디페닐-p-벤조퀴논, 2,5-디터셔리부틸-p-벤조퀴논, 피크린산, 시트르산, 페노티아진, 터셔리부틸카테콜, 2-부틸-4-히드록시아니솔 및 2,6-터셔리부틸-p-크레졸 등이 있다.Antioxidants are methylhydroquinone, hydroquinone, 2,2-methylenebis(4-methyl-6-tertiarybutylphenol), 6-tert-butyl-4-[3[(2,4,8,10-tetra-tert -Butyldibenzo[d,f][1,3,2]dioxaphosphepin-6-yl)oxy]propyl]-2-methylphenol, catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2 ,5-diteributylhydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiarybutyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary butylcate Chol, 2-butyl-4-hydroxyanisole and 2,6-tertiary butyl-p-cresol.
(D) 항산화제의 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우, 0.001 내지 0.5질량부가 바람직하며, 0.005 내지 0.1질량부가 보다 바람직하다. 항산화제의 함유량이 0.001질량부 이상일 경우, 경화성 수지조성물의 열에 의한 착색이나 변색이 보다 적아지며, 0.5질량부 이하일 경우, 보다 우수한 심부 경화성을 얻을 수 있다. (D) 산화 방지제는 예를 들어, 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.009, 0.010, 0.011, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.20, 0.30, 0.40, 0.45, 0.49 또는 0.5질량부이여도 좋고, 그들 중의 임의의 2개의 값의 범위 내여도 된다.(D) When the total of (P) and (F) is 100 parts by mass, the content of the (D) antioxidant is preferably 0.001 to 0.5 parts by mass, more preferably 0.005 to 0.1 parts by mass. When the content of the antioxidant is 0.001 parts by mass or more, coloration or discoloration due to heat of the curable resin composition is less, and when it is 0.5 parts by mass or less, more excellent deep curing properties can be obtained. (D) Antioxidants are, for example, 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.009, 0.010, 0.011, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.20, 0.30, 0.40, 0.45, It may be 0.49 or 0.5 parts by mass, and may be in the range of any two values among them.
<(E) 티올><(E) Thiol>
(E) 티올은 1개 이상의 티올기를 가지는 화합물이다. 티올 중에서 심부 경화성의 관점으로부터 폴리 티올이 바람직하다. (E) 폴리 티올은 2개 이상의 티올기를 가지는 화합물을 가리킨다. 폴리 티올로서, 펜타에리트리톨테트라키스(3-메르캅토부티레이트), 펜타에리트리톨테트라키스(3-메르캅토프로피오네이트), 트리메틸올프로판트리스(3-메르캅토프로피오네이트), 트리메틸올프로판트리스티오프로피오네이트, 펜타에리트리톨테트라키스티오프로피오네이트, 디펜타에리트리톨헥사키스(3-메르캅토프로피오네이트), 트리스[(3-메르캅토프로피오닐옥시)-에틸]이소시아누레이트, 3-메르캅토부티레이트 유도체 등을 들 수 있다. 상기한 폴리티올에서 1종 이상 사용할 수 있다.(E) Thiol is a compound having one or more thiol groups. Among thiols, polythiols are preferred from the viewpoint of deep curing properties. (E) Polythiol refers to a compound having two or more thiol groups. As polythiols, pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptopropionate), trimethylolpropanetris (3-mercaptopropionate), trimethylolpropanetris Thiopropionate, pentaerythritol tetrakistiopropionate, dipentaerythritol hexakis (3-mercaptopropionate), tris[(3-mercaptopropionyloxy)-ethyl]isocyanurate, 3-mercaptobutyrate derivatives, etc. are mentioned. One or more of the above polythiols can be used.
폴리티올 중에서 3-메르캅토부티레이트 유도체가 바람직하다. 3-메르캅토부티레이트 유도체로서, 1,4-비스(3-메르캅토부티릴옥시)부탄, 1,3,5-트리스(3-메르캅토부틸옥시에틸)-1,3,5-토리아진-2,4,6-(1H, 3H, 5H)-트리온, 펜타에리트리톨테트라키스(3-메르캅토부티레이트) 등이 있다. 폴리티올 중에서 2급의 폴리티올이 바람직하다.Among polythiols, 3-mercaptobutyrate derivatives are preferred. As a 3-mercaptobutyrate derivative, 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazin- 2,4,6-(1H, 3H, 5H)-trione, pentaerythritol tetrakis (3-mercaptobutyrate), and the like. Among the polythiols, secondary polythiols are preferred.
(E) 티올의 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우 0.1 내지 10질량부가 바람직하며, 0.5 내지 5질량부가 보다 바람직하다. (E) 티올의 함유량이 (P) 및 (F) 의 합계 100질량부에 대하여 0.1질량부 이상일 경우, 보다 우수한 심부 경화성을 얻을수 있으며, 10질량부 이하일 경우, 경화성 수지조성물이 열에 의한 착색이나 변색이 보다 적어진다. 또한 (E) 티올은 예를 들어 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.9, 1.0, 2.0, 3.0, 4.0, 4.5, 4.9, 5.0, 6.0, 7.0, 8.0, 9.0, 9.9 또는 10질량부이여도 되고 그들 중의 임의의 2개의 값의 범위 내여도 된다.The content of (E) thiol is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, when the total of (P) and (F) is 100 parts by mass. (E) If the content of thiol is 0.1 parts by mass or more with respect to the total 100 parts by mass of (P) and (F), better deep curing properties can be obtained, and if less than 10 parts by mass, the curable resin composition is colored or discolored by heat. Less than this. In addition, (E) thiol is, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.9, 1.0, 2.0, 3.0, 4.0, 4.5, 4.9, 5.0, 6.0, 7.0, 8.0, 9.0, 9.9 or 10 parts by mass This may be sufficient, and it may be within the range of any two values among them.
<(F) 디카르복실산디에스테르><(F) Dicarboxylic acid diester>
(F) 디카르복실산디에스테르로서는, 지방족 이염기산의 디에스테르가 바람직하다. 지방족 이염기산의 디에스테르로는 식 (1) 로 나타내는 화합물이 바람직하다.(F) As dicarboxylic acid diester, diester of aliphatic dibasic acid is preferable. As a diester of an aliphatic dibasic acid, the compound represented by formula (1) is preferable.
[화학식 1][Formula 1]
식 (1)Equation (1)
(R1, R2는 탄소수가 1 내지 18인 알킬기이며, R3는 탄소수가 1 내지 10 일 알킬렌기이며, R1, R2와 동일해도 되고 상이부동해도 된다.)(R 1 , R 2 is an alkyl group having 1 to 18 carbon atoms, R 3 is an alkylene group having 1 to 10 carbon atoms, and may be the same as or different from R 1 and R 2 .)
식 (1)에 나타내는 화합물의 R1, R2는 포화지방족 탄화수소기가 바람직하다. 또한, 상기의 R1, R2는 비치환인 것이 바람직하다. 상기의 R1, R2는 탄소수 2 내지 12인 알킬기가 바람직하며, 탄소수 4 내지 10인 알킬기가 보다 바람직하며, 탄소수 8인 알킬기가 가장 바람직하다. 식 (1)에 나타내는 화합물에서 R3은 포화지방족 탄화수소기가 바람직하다. 또한, 상기 R3은 비치환인 것이 바람직하다. 상기 R3은 탄소수 4 내지 10인 알킬렌기가 바람직하며, 탄소수 7 내지 8인 알킬렌기가 보다 바람직하며, 탄소수 8인 알킬렌기가 가장 바람직하다.In the compound represented by formula (1), R 1 and R 2 are preferably saturated aliphatic hydrocarbon groups. In addition, it is preferable that R 1 and R 2 are unsubstituted. The above R 1 and R 2 are preferably an alkyl group having 2 to 12 carbon atoms, more preferably an alkyl group having 4 to 10 carbon atoms, and most preferably an alkyl group having 8 carbon atoms. In the compound represented by formula (1), R 3 is preferably a saturated aliphatic hydrocarbon group. In addition, it is preferable that R 3 is unsubstituted. R 3 is preferably an alkylene group having 4 to 10 carbon atoms, more preferably an alkylene group having 7 to 8 carbon atoms, and most preferably an alkylene group having 8 carbon atoms.
(F) 디카르복실산디에스테르는심부 경화성을 우수하게 하며 점도를 조정하기 위하여 사용되는 화합물이다. (F) 화학식 (1) 에 나타내는 디카르복실산디에스테르로서, 옥살산디메틸, 옥살산디에틸, 옥살산프로필, 옥살산디이소프로필, 옥살산디부틸, 옥살산디헥실, 옥살산디옥틸, 말론산디이소프로필, 말론산디부틸, 숙신산디에틸, 숙신산디프로필, 숙신산디이소프로필, 숙신산디부틸, 숙신산t-부틸, 숙신산비스(2-에틸헥실), 숙신산비스(2-에톡시에틸), 글루타르산디에틸, 글루타르산디부틸, 아디프산디메틸, 아디프산디에틸, 아디프산디프로필, 아디프산디이소프로필, 아디프산디부틸, 아디프산디t-부틸, 아디프산비스(2-에틸헥실),아디프산디옥틸, 피멜산디메틸, 피멜산디에틸, 피멜산디이소프로필, 피멜산디부틸, 수베르산디메틸, 수베르산디에틸, 수베르산디프로필, 수베르산디이소프로필, 아젤라산디메틸, 아젤라산디에틸, 아젤라산디프로필, 아젤라산디이소프로필, 아젤라산디부틸, 아젤라산비스(2-에틸헥실), 세바스산디메틸, 세바스산디에틸, 세바스산디프로필, 세바스산디이소프로필, 세바스산디부틸, 세바스산비스(2-에틸헥실) 등이 있다. 이들 디카르복실산디에스테르 중 1종 이상을 사용할 수 있다. (F) 디카르복실산디에스테르 중에서 세바스산비스(2-에틸헥실)이 가장 바람직하다.(F) Dicarboxylic acid diester is a compound used to improve the deep curing property and adjust the viscosity. (F) As the dicarboxylic acid diester represented by the general formula (1), dimethyl oxalate, diethyl oxalate, propyl oxalate, diisopropyl oxalate, dibutyl oxalate, dihexyl oxalate, dioctyl oxalate, diisopropyl malonate, di-malonate Butyl, diethyl succinate, dipropyl succinate, diisopropyl succinate, dibutyl succinate, t-butyl succinate, bis succinate (2-ethylhexyl), bis succinate (2-ethoxyethyl), diethyl glutarate, glutaric acid Dibutyl acid, dimethyl adipate, diethyl adipate, dipropyl adipate, diisopropyl adipate, dibutyl adipate, di-t-butyl adipate, bis adipic acid (2-ethylhexyl), diethyl adipic acid Octyl, Dimethyl Pimelate, Diethyl Pimelate, Diisopropyl Pimelate, Dibutyl Pimelate, Dimethyl Suberate, Diethyl Suberate, Dipropyl Suberate, Diisopropyl Suberate, Dimethyl Azelaate, Diethyl Azelalate, Di azelasan Propyl, diisopropyl azelaate, dibutyl azelaic acid, bis azelaic acid (2-ethylhexyl), dimethyl sebacate, diethyl sebacate, dipropyl sebacate, diisopropyl sebacate, dibutyl sebacate, bis sebacic acid ( 2-ethylhexyl) and the like. One or more of these dicarboxylic acid diesters can be used. (F) Among the dicarboxylic acid diesters, bis(2-ethylhexyl) sebacate is most preferred.
(F) 디카르복실산디에스테르의 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우, 5 내지 50질량부가 바람직하며, 10 내지 45질량부가 보다 바람직하며, 20 내지 40질량부가 가장 바람직하다. (F) 디카르복실산디에스테르의 함유량이 5질량부 이상일 경후, 보다 우수한 점도와 심부경화성을 얻을수 있고, 50질량부 이하일 경우, 보다 우수한 심부 경화성을 얻을 수 있다. (F) 디카르복실산디에스테르의 함유량은 예를 들어, 5, 6, 7, 8, 9, 10, 11, 15, 20, 21, 25, 29, 30, 31, 35, 39, 40, 41, 49 또는 50질량부 이여도 되고, 그것들 중 임의의 2개 값의 범위내여도 된다.(F) The content of the dicarboxylic acid diester is preferably 5 to 50 parts by mass, more preferably 10 to 45 parts by mass, and most preferably 20 to 40 parts by mass when the total of (P) and (F) is 100 parts by mass. Do. (F) When the content of the dicarboxylic acid diester is 5 parts by mass or more, more excellent viscosity and deep curing properties can be obtained, and when the content is 50 parts by mass or less, more excellent deep curing properties can be obtained. (F) The content of dicarboxylic acid diester is, for example, 5, 6, 7, 8, 9, 10, 11, 15, 20, 21, 25, 29, 30, 31, 35, 39, 40, 41 , 49 or 50 parts by mass may be sufficient, and any two of these may be in the range of values.
본 발명의 한가지 실시형태의 조성물은 본 발명의 목적을 방해하지 않는 범위에서 일반적으로 사용되고 있는 아크릴 고무, 우레탄 고무, 아크릴로니트릴-부타디엔-스티렌 고무 등의 각종 엘라스토머, 극성유기용매 등의 용제, 증량제, 보강재, 가소제, 증점제, 염료, 안료, 발화지연제, 실란 커플링제 및 계면활성제 등의 첨가제를 사용하여도 좋다.The composition of one embodiment of the present invention includes various elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, and solvents such as polar organic solvents, and extenders. , Additives such as reinforcing materials, plasticizers, thickeners, dyes, pigments, ignition retardants, silane coupling agents and surfactants may be used.
본 발명의 한가지 실시 형태의 조성물로 접착한 경화체는 완전히 경화시킨 후에 재작업 (재활용) 할 수 있다. 재작업의 방법으로서 특별한 제한은 없지만 접착시킨 1종 또는 2종의 피착체 사이에 0.01 내지 100N의 하중을 부하함으로써 피착체 끼리를 해체하고 해체 후의 피착체를 다시 이용할 수 있다.The cured product bonded with the composition of one embodiment of the present invention can be completely cured and then reworked (recycled). Although there is no particular limitation as a method of rework, the adherends can be disassembled and the adherends after disassembly can be reused by applying a load of 0.01 to 100N between the adhered one or two adherends.
본 발명의 한가지 실시형태의 조성물은경화성 수지조성물이며, 또한, 접착제 조성물로서 사용할 수 있다. 본 발명의 한가지 실시형태의 조성물은 가시광선 또는 자외선을 파장 365nm에서 100mJ/cm2로 조사할 경우 3mm보다 크며, 4mm이상의 심부경화가 가능한 조성물이 바람직하다. 본 발명의 한가지 실시형태의 조성물은 가시광선 또는 자외선을 피착체의 정면측 으로부터 조사한후 가시광선 또는 자외선이 투과하지 않는 개소(箇所)를 피착체의 측면으로부터 조사하여 피착체를 접착할수 있는 접착제 조성물이다.The composition of one embodiment of the present invention is a curable resin composition, and can also be used as an adhesive composition. The composition of one embodiment of the present invention is larger than 3 mm when irradiated with visible or ultraviolet rays at a wavelength of 365 nm at 100 mJ/cm 2 , and a composition capable of deep curing of 4 mm or more is preferable. The composition of one embodiment of the present invention is an adhesive composition capable of adhering to an adherend by irradiating visible or ultraviolet light from the front side of the adherend, and then irradiating a point where visible or ultraviolet light does not transmit from the side of the adherend. to be.
본 발명의 한가지 실시형태의 접착제 조성물은가시광선 또는 자외선을 조사함으로써 접착제 조성물의 경화체를 얻을수 있다.The adhesive composition of one embodiment of the present invention can obtain a cured product of the adhesive composition by irradiating with visible light or ultraviolet rays.
본 발명의 한가지 실시형태의 경화체로부터 피착체가 피복 또는 접합된 복합체를 얻을수 있다. 또한, 피착체는 특별히 한정되지 않지만, 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속으로 이루어지는 군에서 선택되는 1종 이상을 포함하는것이 바람직하다.A composite to which an adherend is coated or bonded can be obtained from the cured product of one embodiment of the present invention. In addition, the adherend is not particularly limited, but it is preferable to include at least one selected from the group consisting of triacetyl cellulose, fluorine-based polymer, polyester, polycarbonate, polyolefin, glass, and metal.
본 발명의 한가지 실시형태의 접착제 조성물을 사용하여 공지방법에 의해 피착체를 첩합시켜 터치 패널 적층체를 얻을 수 있다.A touch panel laminate can be obtained by bonding the adherends by a known method using the adhesive composition of one embodiment of the present invention.
또한, 본 발명의 한가지 실시형태의 접착제 조성물을 사용하여 공지 방법에 의해 피착체를 첩합시킨 터치 패널 적층체를 얻을수 있다. 또한, 상기 터치 패널 적층체를 사용하여 디스플레이를 얻을 수 있다.Further, it is possible to obtain a touch panel laminate obtained by bonding the adherends to each other by a known method using the adhesive composition of one embodiment of the present invention. In addition, a display can be obtained using the touch panel laminate.
또한, 본 발명의 한가지 실시형태의 접착제 조성물을 사용하여 공지 방법에 의해 피착체를 첩합시킨 액정패널 적층체를 얻을수 있다. 또한, 상기 액정패널 적층체를 사용하여 디스플레이를 얻을수 있다.Further, a liquid crystal panel laminate can be obtained in which the adherend is bonded by a known method using the adhesive composition of one embodiment of the present invention. In addition, a display can be obtained by using the liquid crystal panel laminate.
[실시예][Example]
이하는 실험예로부터 본 발명을 더욱 상세하게 설명하지만, 본 발명은 여기에 한정되는 것이 아니다.Hereinafter, the present invention will be described in more detail from the experimental examples, but the present invention is not limited thereto.
(실험예)(Experimental example)
특기하지 않는 한 23℃에서 실험을 진행했다. 표1, 표2에 나타내는 조성의 경화성 수지 조성물을 조제하여 평가했다. 그 결과는 표3, 표4에 나타낸다.Unless otherwise specified, the experiment was conducted at 23°C. Curable resin compositions of the compositions shown in Tables 1 and 2 were prepared and evaluated. The results are shown in Tables 3 and 4.
실험예에 기재된 경화성 수지조성물 중의 각 성분으로서, 이하의 화합물을 선택했다.As each component in the curable resin composition described in the experimental example, the following compounds were selected.
단, 표의 KRM-8776은, 다이셀싸이텍 제 "KRM-8776" 중에 함유된 우레탄아크릴레이트의 양을 기재한 것이다. 표의 NOAA는, 다이셀싸이텍 제 "KRM-8776" 중에 함유된 n-옥틸아크릴레이트의 양을 기재한 것이다. 다이세루싸이텍 제 "KRM-8776"을 사용하지 않은 경우, 오사카 유기 가가쿠샤 제 n-옥틸아크릴레이트 사용했다.However, KRM-8776 in the table describes the amount of urethane acrylate contained in "KRM-8776" manufactured by Daicel Cytec. NOAA in the table describes the amount of n-octyl acrylate contained in "KRM-8776" manufactured by Daicel Cytec. When "KRM-8776" manufactured by Daiserucitec was not used, n-octyl acrylate manufactured by Osaka Organic Chemicals Co., Ltd. was used.
<(P) 중합성 비닐 모노머 (A) 다관능(메타)아크릴레이트><(P) Polymerizable vinyl monomer (A) polyfunctional (meth)acrylate>
(A) 성분의 다관능(메타)아크릴레이트로서, 이하의 화합물을 선택했다.As the polyfunctional (meth)acrylate of the component (A), the following compounds were selected.
(A-1) 폴리에스테르계 우레탄아크릴레이트올리고머 (네가미 고으교샤 제 "KHP-11" 구조는 이하와 같이, 폴리올 화합물은 1,4-부탄디올과 아디프산 사이의 축합물인 폴리에스테르폴리올, 에틸렌글리콜, 및 아디프산과의 축합물인 폴리에스테르폴리올을 가지는 화합물 (1,4-부탄디올과 아디프산 사이의 축합물인 폴리에스테르폴리올과, 에틸렌글리콜과 아디프산 사이의 축합물인 폴리에스테르폴리올=2:3 (몰비), 유기 폴리이소시아네이트 화합물은 이소폴론디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸아크릴레이트, GPC에 의한 폴리스티렌 환산에 의한 중량 평균분자량 25000)(A-1) Polyester urethane acrylate oligomer (The structure of "KHP-11" manufactured by Negami Kogyo is as follows, and the polyol compound is polyester polyol, ethylene, which is a condensate between 1,4-butanediol and adipic acid. A compound having a glycol and a polyester polyol that is a condensation product of adipic acid (polyol polyol that is a condensation product between 1,4-butanediol and adipic acid, and a polyester polyol that is a condensation product between ethylene glycol and adipic acid = 2: 3 (molar ratio), the organic polyisocyanate compound is isopolone diisocyanate, the hydroxy (meth)acrylate is 2-hydroxyethyl acrylate, the weight average molecular weight in terms of polystyrene by GPC is 25000)
(A-2) 폴리에스테르계 우레탄아크릴레이트올리고마 (니폰 고으세이 가가쿠샤제 "UV-3000B", 구조는 이하와 같이, 폴리올 화합물은 수소화 폴리부타디엔폴리올과 아디프산 사이의 축합물인 폴리에스테르폴리올, 유기 폴리이소시아네이트 화합물은 이소폴론디이소시아네이트, 히드록시(메타)아크릴레이트는 4-히드록시부틸아크릴레이트, GPC에 의한 폴리스티렌 환산에 의한 중량평균분자량 15000, 수소화 폴리부타디엔폴리올은 식 (3) 에 나타내는 화합물 (n은 정수))(A-2) Polyester-based urethane acrylate oligomer ("UV-3000B" manufactured by Nippon Koosei Chemical, the structure is as follows, the polyol compound is a polyester polyol that is a condensate between hydrogenated polybutadiene polyol and adipic acid) , The organic polyisocyanate compound is isopolone diisocyanate, the hydroxy (meth) acrylate is 4-hydroxybutyl acrylate, the weight average molecular weight in terms of polystyrene by GPC is 15000, and the hydrogenated polybutadiene polyol is represented by formula (3). Compound (n is an integer))
(A-3) 폴리부타디엔계 우레탄아크릴레이트 (다이셀싸이텍 제 "KRM-8776", 수소화 폴리부타디엔 골격을 가지는 우레탄아크릴레이트 이다. 또한 구조는 이하와 같이, 폴리올화합물은 수소화 폴리부타디엔폴리올, 유기 폴리이소시아네이트 화합물은 이소폴론디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸아크릴레이트, GPC에 의한 폴리스티렌 환산에 의한 중량 평균분자량은 19000, 수소화 폴리부타디엔폴리올은 식 (3) 에 나타내는 화합물 (n은 정수), 다만 희석 모노머로서, n-옥틸아크릴레이트를 30질량% 함유)(A-3) Polybutadiene-based urethane acrylate ("KRM-8776" manufactured by Daicel-Cytech, a urethane acrylate having a hydrogenated polybutadiene skeleton. The structure is as follows, and the polyol compound is hydrogenated polybutadiene polyol, an organic organic compound). The polyisocyanate compound is isopolone diisocyanate, the hydroxy (meth)acrylate is 2-hydroxyethyl acrylate, the weight average molecular weight in terms of polystyrene by GPC is 19000, and the hydrogenated polybutadiene polyol is a compound represented by formula (3). (n is an integer), however, as a diluted monomer, containing 30% by mass of n-octyl acrylate)
<(P) 중합성 비닐 모노머의 단관능(메타)아크릴레이트><(P) Monofunctional (meth)acrylate of polymerizable vinyl monomer>
(B) 성분의 단관능(메타)아크릴레이트로서, 이하의 화합물을 선택했다.As the monofunctional (meth)acrylate of the component (B), the following compounds were selected.
(B-1) 라우릴아크릴레이트 (오사카 유기 가가쿠샤 제 "LA")(B-1) lauryl acrylate ("LA" manufactured by Osaka Organic Chemicals)
(B-2) 2-히드록시부틸아크릴레이트 (교에이 가가쿠샤 제 "HOB-A")(B-2) 2-hydroxybutyl acrylate ("HOB-A" manufactured by Kyei Chemical Co., Ltd.)
(B-3) n-옥틸아크릴레이트 (이하 "NOAA"로 생략한다)(B-3) n-octyl acrylate (hereinafter abbreviated as "NOAA")
<(C) 광중합 개시제><(C) Photoinitiator>
(C) 성분의 광중합 개시제로서, 이하의 화합물을 선택했다.As the photoinitiator of the component (C), the following compounds were selected.
(C-1) 1-히드록시-시클로헥실페닐케톤 (BASF샤 제 "Irgacure184", 이하 "I-184" 로 생략한다)(C-1) 1-hydroxy-cyclohexylphenyl ketone ("Irgacure184" manufactured by BASF, hereinafter abbreviated as "I-184")
(C-2) 2,4,6-트리메틸벤조일디페닐포스핀옥사이드 (BAS사 제 "LucirinTPO", 이하 "TPO"로 생략한다)(C-2) 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("LucirinTPO" manufactured by BAS Corporation, hereinafter abbreviated as "TPO")
<(D) 산화 방지제><(D) antioxidant>
(D) 성분의 산화 방지제로서, 이하의 화합물을 선택했다.As the antioxidant of the component (D), the following compounds were selected.
(D-1) 6-tert-부틸-4-[3-[(2,4,8,10-테트라-tert-부틸디벤조[d, f][1,3,2] 디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀 (스미토모 가가쿠 고으교샤 제 "수미라이저 GP") (이하 "GP"로 생략한다)(D-1) 6-tert-butyl-4-[3-[(2,4,8,10-tetra-tert-butyldibenzo[d, f][1,3,2] dioxaphosphepine- 6-yl)oxy]propyl]-2-methylphenol (Sumitomo Chemical Co., Ltd. "Sumilizer GP") (hereinafter abbreviated as "GP")
<(E) 티올><(E) Thiol>
티올 화합물로서, 이하의 화합물을 선택했다.As the thiol compound, the following compounds were selected.
(E-1) 펜타에리트리톨테트라키스(3-메르캅토부티레이트) (쇼와 덴코샤 제 "카렌즈 MT PE1") (이하 "MT-PE1"로 생략한다)(E-1) pentaerythritol tetrakis (3-mercaptobutyrate) (Showa Denko Corporation "Carenz MT PE1") (hereinafter abbreviated as "MT-PE1")
(E-2) 펜타 에리트 리톨 테트라 키스 ( 3- 머 캅토 프로 피오 네이트 ) (SC 유기 가가쿠 제 "PBMP")(E-2) Pentaerythritol tetrakis (3-mercaptopropionate) (SC Organic Chemicals "PBMP")
(E-3) 1- 도데칸 티올(시그마/올드리치샤 제"DDT")(E-3) 1- Dodecane Thiol ("DDT" by Sigma/Oldrichsha)
<(F) 디카르복실산디에스테르><(F) Dicarboxylic acid diester>
(F) 에 관하여 식 (1) 로 나타내는 디카르복실산디에스테르로서, 이하의 화합물을 선택했다.About (F) As the dicarboxylic acid diester represented by Formula (1), the following compounds were selected.
(F-1) 세바스산비스(2-에틸헥실) (신니폰 리카샤 제 "상서사이자 DOS") (이하 "DOS"로 생략한다)(F-1) Sebacic acid bis(2-ethylhexyl) ("Sciencer and DOS" manufactured by Shinnippon Likasha) (hereinafter abbreviated as "DOS")
(F-2) 세바스산디부틸 (와코 쥰야크샤 제) (이하 "DBS"로 생략한다)(F-2) Dibutyl sebacate (manufactured by Wako Pure Chemical Industries, Ltd.) (hereinafter abbreviated as "DBS")
(F-3) 아젤라산비스(2-에틸헥실) (와코 쥰야크샤 제) (이하 "DOZ"로 생략한다)(F-3) Azelaic acid bis(2-ethylhexyl) (manufactured by Wako Pure Chemical Industries, Ltd.) (hereinafter abbreviated as "DOZ")
(F-4) 아디핀산비스(2-에틸헥실) (와코 쥰야크샤 제) (이하 "DOA"로 생략한다)(F-4) Adipic acid bis(2-ethylhexyl) (manufactured by Wako Pure Chemical Industries, Ltd.) (hereinafter abbreviated as "DOA")
각 물성은 이하와 같이 측정했다.Each physical property was measured as follows.
[광경화성][Photocurable]
온도 23℃에서 측정했다. 광경화성에 관해서는 텐팍스 유리 (폭 25mm×길이 25mm×두께 2mm)의 표면에 경화성 수지 조성물을 두께 0.1mm가 되도록 도포했다. 그 후, 무전극 방전 램프를 사용한 퓨전사제 경화장치를 이용하여 파장 365nm의 UV광선을 적산광량 2000mJ/cm2의 조건에서 조사하여 경화시켰다.It measured at a temperature of 23°C. Regarding photocurability, a curable resin composition was applied to the surface of TEMPAX glass (25 mm in width x 25 mm in length x 2 mm in thickness) so as to have a thickness of 0.1 mm. Thereafter, using a curing apparatus manufactured by Fusion Corporation using an electrodeless discharge lamp, UV rays having a wavelength of 365 nm were irradiated and cured under conditions of a cumulative amount of light of 2000 mJ/cm 2.
경화율은 FT-IR를 사용하여 이하의 방식으로 산출했다. 탄소와 탄소의 이중결합의 흡수 스펙트럼은 1600cm- 1부근의 피크를 사용했다.The curing rate was calculated by the following method using FT-IR. Absorption spectrum of the carbon-carbon double bond is 1600cm - used the peak in the vicinity of 1.
(경화 비율)=100-(경화 후의 탄소와 탄소의 이중 결합의 흡수 스펙트럼의 강도)/(경화 전의, 탄소와 탄소의 이중 결합의 흡수 스펙트럼의 강도)×100(%)(Curing ratio) = 100-(the intensity of the absorption spectrum of the double bond of carbon and carbon after curing) / (the intensity of the absorption spectrum of the double bond of carbon and carbon before curing) × 100 (%)
[경화 수축률][Curing shrinkage rate]
비중병에 경화성 수지 조성물을 충전(充塡)하고 대기 중의 질량 및 순수(純水)에서의 질량을 측정하고, 액체 비중을 산출했다. 또한, 경화성 수지 조성물을 [광경화성]에 기재된 방법으로 경화시켜, 너비 25mm×길이 25mm×두께 2mm의 경화물을 제작하여, 대기 중에서의 질량 및 순수에서의 질량을 측정하여 경화물 비중을 산출했다. 액체 비중 및 경화물 비중의 비율로 경화 수축률을 산출했다.The curable resin composition was filled in a pycnometer, and the mass in the air and the mass in pure water were measured, and the liquid specific gravity was calculated. In addition, the curable resin composition was cured by the method described in [Photocurable] to prepare a cured product having a width of 25 mm x a length of 25 mm x a thickness of 2 mm, and the mass in the air and the mass in pure water were measured to calculate the specific gravity of the cured product. . The cure shrinkage was calculated from the ratio of the specific gravity of the liquid and the specific gravity of the cured product.
경화 수축률=(경화물 비중-액체 비중)/경화물 비중)×100(%)Curing shrinkage rate = (specific gravity of cured product-specific gravity of liquid) / specific gravity of cured product) × 100 (%)
[심부 경화성][Deep hardenability]
직경 5mmφ의 구멍이 뚫린 길이가 20mm 검정색 튜브에 경화성 수지 조성물을 충전시키고, 상부로부터 블랙 라이트로 1mW/cm2 (365nm)의 광선을 100초간 조사한다 (적산 광량은 100mJ/cm2). 그 후 검정색 튜브에서 경화물을 꺼내어 경화되지 못한 부분을 제거한 후 경화된 부분을 마이크로미터로 두께를 측정했다.The curable resin composition is filled in a black tube with a diameter of 5 mmφ and a hole of 20 mm, and a light beam of 1 mW/cm 2 (365 nm) is irradiated with a black light from the top for 100 seconds (the cumulative amount of light is 100 mJ/cm 2 ). After that, the cured product was removed from the black tube to remove the uncured part, and the cured part was measured in thickness with a micrometer.
[폴리에틸렌테레프탈레이트 (PET)의 접착성 평가 (폴리에틸렌테레프탈레이트 시험편 간의 박리 접착 강도)][Adhesion evaluation of polyethylene terephthalate (PET) (peel adhesion strength between polyethylene terephthalate test pieces)]
2축 연신 PET필름 (루미러 T60, 평균 두께 190μm, 도레이사 제)의 시험편 (너비 50mm×길이 10mm×두께 0.19mm)끼리를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 30μm로 접착면적을 세로 40mm×가로 10mm로 접착시켰다. 광조사에 의해 경화 시킨후 접착제 조성물로 접착한 상기 시험편의 밀착되지 않은 2개소의 필름 단부를 당겨서 필름 사이가 밀착된 부분을 박리시킴으로써 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은[광경화성]에서 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm)는 인장(引張) 시험기를 이용하여 온도 23℃, 습도 50%의 환경에서 인장 속도 50mm/분에서 측정했다.Biaxially stretched PET film (Lumor T60, average thickness 190 μm, manufactured by Toray Corporation) test pieces (width 50 mm × length 10 mm × thickness 0.19 mm) using a curable resin composition as an adhesive composition, and the adhesive area with a thickness of 30 μm of the adhesive layer Was adhered to a length of 40 mm × 10 mm in width. After curing by light irradiation, the initial 180° peel adhesion strength was measured by pulling the ends of the two non-adhered films of the test piece adhered with the adhesive composition to peel off the tightly adhered portions between the films. Light irradiation conditions followed the method described in [Photocurability]. Peel adhesion strength (unit: N/cm) was measured at a tensile speed of 50 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[유리 접착성 평가 (내열 유리 시험편 사이의 인장 접착 강도)][Glass adhesion evaluation (tensile adhesion strength between heat-resistant glass specimens)]
내열 유리 시험편 (폭 25mm×길이 25mm×두께 2.0mm)끼리를 두께 80μm×폭 11.5mm×길이 25mm의 테플론 (등록 상표) 테이프를 스페이서로 사용하고, 경화성 수지 조성물을 접착제 조성물로 사용하여 접착시켰다 (접착 면적 3cm2). 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 상기 조건에서 접착제 조성물을 경화 시킨 뒤, 시험편의 양면에 전기화학공업사 제 접착제 조성물 "G-55" 를 사용하여 아연 도금 강판 (폭 100mm×길이 25mm×두께 2.0mm, 엔지니어링 테스트 서비스샤 제)을 접착시켰다. 경화후 접착제 조성물로 접착시킨 시험편을 사용하여 아연 도금 강판을 체크하여, 초기의 인장 전단 접착 강도를 측정했다. 전단 접착 강도 (단위:MPa) 는 인장 시험기를 이용하여 온도 23℃, 습도 50%의 환경에서 인장 속도 10mm/분에서 측정했다.Heat-resistant glass test pieces (25 mm wide x 25 mm long x 2.0 mm thick) were bonded to each other using a Teflon (registered trademark) tape having a thickness of 80 μm x a width of 11.5 mm x a length of 25 mm as a spacer, and a curable resin composition as an adhesive composition ( Bonding area 3cm 2 ). Light irradiation conditions followed the method described in [Photocurability]. After curing the adhesive composition under the above conditions, a galvanized steel sheet (width 100 mm × length 25 mm × thickness 2.0 mm, manufactured by Engineering Test Service) is adhered to both sides of the test piece using the adhesive composition "G-55" manufactured by Electrochemical Industry Co., Ltd. Made it. After curing, the galvanized steel sheet was checked using a test piece bonded with the adhesive composition, and the initial tensile shear bonding strength was measured. Shear adhesion strength (unit: MPa) was measured at a tensile speed of 10 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[시클로올레핀 폴리머 (COP) 접착성 평가 (시클로올레핀 폴리머 시험편 사이의 박리 접착 강도)][Cycloolefin polymer (COP) adhesion evaluation (peel adhesion strength between cycloolefin polymer test pieces)]
COP 필름 (ZEONOR, 평균 두께 40μm, 일본제온사 제)의 시험편 (너비 50mm×길이 10mm×두께 0.04mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 10μm로 접착 면적을 세로 40mm×가로 10mm로 접착시켰다. 광조사에 의해 경화시킨후, 접착제로 접착된 해당 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은 [광경화성]에서 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm) 는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 50mm/분에서 측정했다.A curable resin composition was used as the adhesive composition between the test pieces (50mm width x 10mm length x 0.04mm thickness) of COP film (ZEONOR, average thickness 40μm, made by Japan Xeon Corporation), and the adhesive area was 40mm vertically with the thickness of the adhesive layer 10μm. It was adhered to a width of 10 mm. After curing by light irradiation, the initial 180° peel adhesion strength was measured by pulling the ends of the two non-closed films of the test piece adhered with an adhesive to separate the tightly adhered portions between the films. Light irradiation conditions followed the method described in [Photocurability]. Peel adhesive strength (unit: N/cm) was measured at a tensile speed of 50 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[트리아세틸셀룰로오스 접착성 평가 (트리아세틸셀룰로오스 시험편 사이의 박리 접착 강도)][Triacetyl cellulose adhesion evaluation (peel adhesion strength between triacetyl cellulose test pieces)]
트리아세틸셀룰로오스 (TAC) 필름 (평균 두께 40μm, 후지 필름샤 제)의 시험편 (너비 50mm×길이 10mm×두께 0.04mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 10μm로 접착 면적을 세로 40mm×가로 10mm로 접착시켰다. 접착제 조성물로 접착시킨 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사로 경화시킨 뒤, 접착제 조성물로 접착한 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm) 는 인장 시험기를 이용하여 온도 23℃, 습도 50%의 환경하에서 인장속도 50mm/분에서 측정했다.A curable resin composition was used as the adhesive composition between the specimens (50 mm width x 10 mm length x 0.04 mm thickness) of a triacetylcellulose (TAC) film (average thickness of 40 μm, manufactured by Fuji Film Corporation), and the adhesive area was adjusted to a thickness of 10 μm of the adhesive layer. It was bonded at a length of 40 mm x a width of 10 mm. The initial 180° peel adhesion strength was measured by pulling the ends of the two non-adhered films of the test piece bonded with the adhesive composition to separate the adhered portions between the films. After curing by light irradiation, the initial 180° peel adhesion strength was measured by pulling the ends of the two non-closed films of the test piece adhered with the adhesive composition to separate the tightly adhered portions between the films. Light irradiation conditions followed the method described in [Photocurability]. Peel adhesion strength (unit: N/cm) was measured at a tensile speed of 50 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[불소계 폴리머 접착성 평가 (불소 폴리머 시험편 사이의 박리 접착 강도)][Fluorine-based polymer adhesion evaluation (peel adhesion strength between fluorine polymer test pieces)]
PVDF (Polyvinylidene fluoride) 필름 (평균 두께 40μm, 덴키 가가쿠 고교샤 제 "DX필름") 의 시험편 (폭 50mm×길이 10mm×두께 0.04mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 10μm로 접착 면적을 세로 40mm×가로 10mm로 접착시켰다. 접착제 조성물로 접착시킨 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사로 경화시킨뒤, 접착제 조성물로 접착한 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로써 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm)는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 50mm/분에서 측정했다.PVDF (Polyvinylidene fluoride) film (average thickness 40μm, Denki Chemical Co., Ltd. "DX Film") between the test pieces (width 50mm × length 10mm × thickness 0.04mm) between the curable resin composition used as the adhesive composition, the thickness of the adhesive layer The adhesive area of 10 μm was adhered to a length of 40 mm x a width of 10 mm. The initial 180° peel adhesion strength was measured by pulling the ends of the two non-closed films of the test piece adhered with the adhesive composition to separate the tightly adhered portions between the films. After curing by light irradiation, the initial 180° peel adhesion strength was measured by pulling the ends of the two non-adhered films of the test piece adhered with the adhesive composition to separate the tightly adhered portions between the films. Light irradiation conditions followed the method described in [Photocurability]. Peel adhesion strength (unit: N/cm) was measured at a tensile speed of 50 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[폴리카보네이트 접착성 평가 (폴리카보네이트 시험편 사이의 인장 접착 강도)][Polycarbonate adhesion evaluation (tensile adhesion strength between polycarbonate specimens)]
폴리카보네이트 (테이진샤 제 "판라이트") 시험편 (폭 25mm×길이 25mm×두께 2.0mm) 사이를 두께 80μm×폭 12.5mm×길이 25mm의 테플론 (등록 상표) 테이프를 스페이서로 사용하고, 경화성 수지조성물을 접착제 조성물로 사용하여 접착시켰다 (접착 면적 3cm2). 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 전단 접착 강도 (단위:MPa)는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 10mm/분에서 측정했다.Polycarbonate ("Panlite" manufactured by Teijin Corporation) Test specimens (25mm wide x 25mm long x 2.0mm thick) are 80μm thick x 12.5mm wide x 25mm long Teflon (registered trademark) tape used as a spacer as a spacer, and curable resin composition Was adhered using the adhesive composition (adhesive area 3 cm 2 ). Light irradiation conditions followed the method described in [Photocurability]. Shear adhesion strength (unit: MPa) was measured at a tensile speed of 10 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[내습열성 평가 (고온 고습 폭로 후의 내열 유리 시험편 사이의 인장 접착 강도)][Moisture and heat resistance evaluation (tensile adhesion strength between heat-resistant glass specimens after exposure to high temperature and high humidity)]
텐팍스 (등록 상표) 유리 (폭 25mm×길이 25mm×두께 2mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 100μm로 접착 면적을 1.0cm2로 접착시킨 후 경화시켰다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 경화 후 접착제 조성물로 접착한 시험편을,항온 항습 장치를 사용하여 온도 85℃, 상대 습도 85%의 환경하에서 1000시간 폭로(暴露)했다. 폭로 후의 시험편을 이용하여 전단 접착 강도를 측정했다. 전단 접착 강도 (단위:MPa) 는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 10mm/분에서 측정했다.A curable resin composition was used as an adhesive composition between TEMPAX (registered trademark) glass (25 mm in width × 25 mm in length × 2 mm in thickness), and the adhesive area was bonded to 1.0 cm 2 with a thickness of 100 μm of the adhesive layer, followed by curing. Light irradiation conditions followed the method described in [Photocurability]. After curing, the test piece bonded with the adhesive composition was exposed for 1000 hours in an environment at a temperature of 85°C and a relative humidity of 85% using a thermo-hygrostat. Shear adhesive strength was measured using the test piece after exposure. Shear adhesive strength (unit: MPa) was measured at a tensile speed of 10 mm/min in an environment at a temperature of 23°C and a humidity of 50% using a tensile tester.
[내습열성(耐濕熱性) 평가 (외관관찰 (면정밀도 변화와 황변도(黃變度))][Moisture and heat resistance evaluation (appearance observation (change in surface precision and degree of yellowing))]
텐팍스 (등록 상표) 유리 (폭 25mm×길이 25mm×두께 2mm) 를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 100μm로 접착 면적을 1.0cm2로 접착, 경화시켰다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 경화 후 접착제 조성물로 접착한 시험편을 항온 항습 장치를 사용하여 온도 85℃, 상대습도 85%의 환경하에 1000시간 폭로했다. 폭로 후 접착제 조성물로 접착한 상기 시험편의 Δb값을 칼라 측정 장치 (SHIMADZU사 제 "UV-VISIBLE SPECTROPOHOTOMETER"로 황변도를 측정했다. 폭로 후 접착 부위의 외관을 눈으로 관찰하여 면정밀도 변화의 판단 기준으로서 치수변화나휘어짐 여부, 황변 여부를 조사했다.Tempax (registered trademark) glass (25 mm in width × 25 mm in length × 2 mm in thickness) was used as an adhesive composition, and the adhesive area was adhered to and cured to 1.0 cm 2 with a thickness of 100 μm of the adhesive layer. Light irradiation conditions followed the method described in [Photocurability]. After curing, the test piece bonded with the adhesive composition was exposed for 1000 hours in an environment at a temperature of 85°C and a relative humidity of 85% using a constant temperature and humidity device. After exposure, the Δb value of the test piece adhered with the adhesive composition was measured with a color measuring device ("UV-VISIBLE SPECTROPOHOTOMETER" manufactured by Shimadzu Corporation.) After exposure, the appearance of the bonded site was visually observed to determine the change in surface accuracy. As a result, dimensional change, warping, and yellowing were investigated.
실험예에서, 이하와 같은 점을 알수 있다. 본 발명의 실시예에 해당되는 경화성 수지 조성물은 심부 경화성이 뛰여나다. 예를 들면, 빛을 차광 테두리의 사선 방향이나 가로 방향에서 조사하는 경우에도, 차광 테두리 아래측 경화성 수지 조성물을 심부까지 경화시킬 수 있다.In the experimental example, it can be seen the following points. The curable resin composition according to the embodiment of the present invention has excellent deep curing properties. For example, even when light is irradiated in the oblique direction or the transverse direction of the light-shielding frame, the curable resin composition under the light-shielding frame can be cured to the core.
더욱이, 본 발명의 실시예에 해당되는 경화성 수지 조성물은 차광 테두리 아래 측에서도 미약한 빛 (예를 들면, 적산 광량 1000 내지 3000mJ/cm2의 빛) 으로 심부까지 경화시킬 수 있다.Moreover, the curable resin composition according to the embodiment of the present invention can be cured to the deep part with weak light (for example, light having an accumulated light amount of 1000 to 3000 mJ/cm 2) even under the shading edge.
본 발명의 실시예에 해당되는 경화성 수지 조성물의 실험예는 경화 수축률이 낮으므로 내습열성 시험 후의 치수변화나 휘어짐 등의 면정밀도의 변화가 보이지 않았다. 실험예 6은 (E) 성분의 티올기의 개수가 1개이기때문에, 실험예 2, 실험예 3의 폴리티올을 이용한 경화성 수지 조성물보다 심부 경화성이 작았다.In the experimental examples of the curable resin composition corresponding to the embodiment of the present invention, since the curing shrinkage rate was low, there was no change in surface precision such as dimensional change or warping after the heat-and-moisture test. In Experimental Example 6, since the number of thiol groups in the component (E) was one, deep curing properties were lower than those of the curable resin compositions using the polythiols of Experimental Examples 2 and 3.
본 발명의 실시예에 해당되는 경화성 수지 조성물은 내열시험 이후의 착색과 변색, 내습시험 이후의 강도 저하 등 문제가 일어나지 않았다.The curable resin composition corresponding to the example of the present invention did not cause problems such as coloring and discoloration after the heat resistance test, and decrease in strength after the moisture resistance test.
Claims (16)
(P) 중합성 비닐 모노머;
(C) 광중합 개시제;
(D) 산화방지제;
(E) 티올;
(F) 디카르복실산디에스테르,
상기 (D) 산화방지제의 함유량은 (P) 및 (F)의 합계를 100질량부로 한 경우, 0.001 내지 0.5질량부인 조성물.As a composition containing the following (P), (C) to (F),
(P) polymerizable vinyl monomer;
(C) a photoinitiator;
(D) antioxidants;
(E) thiol;
(F) dicarboxylic acid diester,
The content of the (D) antioxidant is 0.001 to 0.5 parts by mass when the total of (P) and (F) is 100 parts by mass.
식 (1)
(R1, R2는 탄소수가 1 내지 18인 알킬기이며, R3는 탄소수가 1 내지 10인 알킬렌기이며, R1, R2와 동일해도 되고 상이해도 된다.)The composition according to claim 1, wherein the (F) dicarboxylic acid diester is a dicarboxylic acid diester represented by formula (1).
Equation (1)
(R 1 , R 2 is an alkyl group having 1 to 18 carbon atoms, R 3 is an alkylene group having 1 to 10 carbon atoms, and may be the same as or different from R 1 and R 2 .)
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CN105764930B (en) | 2018-11-16 |
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JP6594208B2 (en) | 2019-10-23 |
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