KR102176282B1 - PCB(Printed Circuit Board) loading/unloading apparatus - Google Patents

Abstract

The PCB loading/unloading device according to the present invention is provided on both sides of a laser facility and the laser facility, a loading unit for loading a PCB to be supplied to the laser facility, and are provided on both sides of the laser facility, respectively, and the laser facility An unloading unit for unloading a PCB having via holes formed thereon, a PCB alignment unit provided on both sides of the laser equipment and receiving the PCB from each of the loading units on both sides to align the position of the PCB, and the loading Move the PCB located in the part to the PCB alignment part, the PCB aligned in the PCB alignment part is seated on the table of the laser equipment, and the PCBs with via holes formed by the laser equipment are placed in the unloading part. It may include a loader to seat.
According to the present invention, the PCB loading/unloading unit is provided on both sides of the laser facility, so that the loading/unloading of the PCB can be performed at the same time on both sides to shorten the work time, and by simplifying the process of adsorption/moving the PCB It can prevent damage caused by falling of the PCB.

Description

PCB loading/unloading apparatus {Printed Circuit Board (PCB) loading/unloading apparatus}

The present invention relates to a PCB loading/unloading device, and in particular, to a PCB loading/unloading device capable of reducing the time required for loading/unloading a PCB and preventing damage caused by the falling of the PCB. will be.

Recently, as portable information and communication devices are rapidly changing due to high density and high integration, the number of micro via holes in the PCB is increasing rapidly. In addition, as the number of micro-via holes increases, the time required to process via holes in laser equipment is also increasing.

In connection with the above-described via hole processing, a series of processes of PCB loading, via hole processing, and unloading by a conventional PCB loading/unloading facility will be described as follows.

Conventional PCB loading/unloading equipment vertically loads a PCB substrate on a PCB loading unit. Then, the loader comes down and vacuum-adsorbs the PCB substrate to lift it. Then, after moving the PCB substrate to the PCB substrate alignment portion, the PCB substrate is seated on the PCB substrate alignment portion. The PCB board seated on the PCB board alignment part is aligned, and the loader moves to its original position. The loader, which has returned to its original position, descends again, vacuum-sucks the PCB board in the PCB board alignment part and the PCB loading part, lifts it, and moves the position.

Thereafter, the loader moves the second PCB board to the PCB board alignment part, places the PCB board on the PCB board alignment part, aligns the PCB board, lifts the PCB board, moves it to the laser equipment table, and mounts it on the table. The laser equipment then irradiates the laser to process the via hole in the PCB.

After completing the processing of the via hole, the loader moves to the PCB substrate alignment unit and the unloading unit to place the PCB substrate on the PCB substrate alignment unit and the unloading unit. Then, the unloader moves to the PCB substrate alignment portion, lifts the PCB substrate in the PCB substrate alignment portion, and transfers the PCB substrate to the unloading portion.

However, in the conventional PCB loading/unloading facility as described above, there is a problem that an excessive amount of time is required for the loading/unloading of the PCB. In addition, during loading and unloading of the PCB, there is a problem that the PCB substrate is not properly adsorbed during movement, resulting in a situation in which the PCB substrate falls and is damaged.

Korean Patent Application Publication No. 10-2009-0030873 Korean Patent Application Publication No. 10-2012-0039695

The present invention was created in consideration of the above, and by installing the PCB loading/unloading unit on both sides of the laser facility, the time required for PCB loading/unloading when processing via holes on the PCB is shortened, and the PCB adsorption / The purpose of this is to provide a PCB loading/unloading device that can prevent damage caused by falling of the PCB by simplifying the moving process.

In order to achieve the above object, the PCB loading/unloading apparatus according to the present invention includes: a laser facility; A loading unit provided on both sides of the laser facility and loading a PCB to be supplied to the laser facility; An unloading unit provided on both sides of the laser equipment and for unloading a PCB having via holes formed by the laser equipment; PCB alignment units provided on both sides of the laser equipment, each receiving the PCB from the loading units on both sides to align the position of the PCB; And moving the PCB located in the loading unit to the PCB alignment unit, placing the PCB aligned in the PCB alignment unit on a table of the laser facility, and removing the PCB having a via hole formed by the laser facility. Including; a loader seated on the loading unit, wherein the laser facility processes a via hole in the two PCBs supplied from the PCB alignment unit, and the table of the laser facility on which the PCB having the via hole processed is mounted The loader moves to the side of the unloading unit, and the loader vacuum-sucks the PCBs having via holes formed thereon when the table of the laser equipment arrives at the side of the unloading unit, thereby seating the PCBs on the unloading unit.

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Here, the table of the laser facility may be configured to be movable back and forth, left and right.

In addition, the loader may be configured to simultaneously vacuum suction the PCBs from the loading units disposed on both sides and supply them to the PCB alignment unit.

In addition, the loader may be configured to simultaneously vacuum-adsorb the PCBs positioned in the PCB alignment units disposed on both sides and supply them to the laser equipment.

In addition, the laser facility may be configured to simultaneously form via holes in PCBs supplied from both sides.

In addition, the loader may be configured to simultaneously pick up the PCBs on which via holes are formed in the laser facility and unload the unloading units on both sides at the same time.

According to the present invention, the PCB loading/unloading unit is provided on both sides of the laser facility, so that the loading/unloading of the PCB can be performed at the same time on both sides to shorten the work time, and by simplifying the process of adsorption/moving the PCB It can prevent damage caused by falling of the PCB.

1A is a front view schematically showing the configuration of a PCB loading/unloading apparatus according to an embodiment of the present invention.
1B is a plan view schematically showing the configuration of a PCB loading/unloading apparatus according to an embodiment of the present invention.
2A to 2I are views showing a series of working processes of PCB loading, PCB alignment, via hole formation, and PCB unloading by the PCB loading/unloading device according to the present invention.

Terms or words used in this specification and claims are limited to their usual or dictionary meanings and should not be interpreted, and that the inventor can appropriately define the concept of terms in order to describe his own invention in the best way. Based on the principle, it should be interpreted as a meaning and concept consistent with the technical idea of the present invention.

Throughout the specification, when a part "includes" a certain component, it means that other components may be further included rather than excluding other components unless specifically stated to the contrary. In addition, terms such as "...unit", "...group", "module", and "device" described in the specification mean units that process at least one function or operation, which is a combination of hardware or software or hardware and software. It can be implemented as

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B schematically show the configuration of a PCB loading/unloading apparatus according to an embodiment of the present invention, and FIG. 1A is a front view and FIG. 1B is a plan view.

1A and 1B, the PCB loading/unloading apparatus according to the present invention includes a laser facility 110, a PCB loading/unloading unit 120, and a PCB alignment unit 130.

The laser facility 110 is a facility for processing (forming) a via hole in a PCB. Here, the table of the laser facility 110 may be configured to be movable back and forth, left and right. In addition, the laser facility 110 may be configured to simultaneously form via holes in the PCB 140 supplied from both sides. In addition, the laser facility 110 may be configured to simultaneously pick up the PCBs 140 on both sides of the via hole and unload the PCBs 140 on both sides of the PCB unloading unit 120b at the same time. In addition, as such a laser facility 110, a CO ₂ laser facility or an excimer laser facility may be used.

The PCB loading/unloading unit 120 is provided on both sides of the laser equipment 110, respectively, and the PCB 140 to be supplied to the laser equipment 110 is loaded by the loader 150 and the laser equipment 110 The PCB in which the via hole is formed is unloaded. Here, the PCB loading/unloading unit 120 (more precisely, the loading unit 120a) may be configured to supply the PCB 140 from both sides to the PCB alignment unit 130 at the same time.

The PCB alignment units 130 are provided on both sides of the laser equipment 110, respectively, receive the PCB 140 from the PCB loading/unloading units 120 on both sides, and align the position, and then align the position. Each of the PCB 140 is supplied to the laser equipment 110. Here, the PCB alignment unit 130 may be configured to align the position of the supplied PCB 140 and then supply the position-aligned PCB 140 from both sides to the laser facility 110 at the same time.

Then, the operation of the PCB loading/unloading apparatus according to the present invention having the above configuration will be described with reference to FIGS. 2A to 2I.

As shown in FIGS. 2A and 2B, first, the loaders 150 of the PCB loading/unloading units 120 provided on both sides of the laser facility 110 are respectively lowered and the PCB 140 loaded on the loading unit 120a. At the same time, vacuum suction and lift.

Then, as shown in Figs. 2c and 2d, the lifted PCB 140 is moved to the PCB alignment unit 130 provided on both sides of the laser facility 110, respectively, and then simultaneously to the PCB alignment unit 130. Settle. Then, the PCB alignment unit 130 aligns the seated PCB 140.

Then, as shown in Figs. 2E to 2G, the loaders 150 on both sides of the PCB 140 aligned by the respective PCB alignment units 130 are simultaneously lowered and vacuum-adsorbed and lifted, and then laser equipment ( 110) and place it on the table. Then, the laser facility 110 processes and forms a via hole at a preset position of the PCB 140 mounted on the table. At this time, the laser facility 110 simultaneously forms via holes in the two PCBs 140 mounted on the table.

In this way, when the formation of the via hole in the PCB 140 is completed, the laser equipment 110 table moves to the unloading unit 120b to move the PCB 140 to the unloading unit 120b, as shown in FIGS. 2H and 2I. To be transported and settled. That is, as shown in FIG. 1B, the laser equipment 110 table on which the PCB 140 having the via hole formed is mounted is once moved backward and located on the same horizontal line as the unloading unit 120b, and then the laser equipment ( 110) The table moves simultaneously toward both unloading units 120b. At this time, each of the tables of the laser equipment 110 moving to both sides has one PCB 140 having via holes formed thereon. Here, such a table of the laser equipment 110 is one (one) table in this drawing, and its size is also substantially the same size as the PCB loading/unloading units 120a and 120b and the PCB alignment unit 130 Although shown as, this is only illustrated so as to schematically show the configuration for convenience. That is, in reality, the table of the laser facility 110 is relatively larger than the size of the adjacent PCB alignment unit 130 (for example, about twice the size), and consists of two tables to process the PCB loading and via hole formation. Until then, when the PCB is unloaded after the via hole is formed and the PCB is unloaded, the structure may be divided into two tables.

On the other hand, when each table of the laser equipment 110 above arrives at each of the unloading units 120b on both sides, the loaders 150 come down from both sides to remove the PCB 140 from each table of the laser equipment 110 At the same time, after vacuum adsorption and lifting, they move to both unloading units 120b and are respectively seated on the unloading units 120b. In this way, a series of operations starting from the loading of the PCB 140 to the alignment of the PCB, formation of via holes, and unloading of the PCB are completed.

As described above, in the PCB loading/unloading apparatus according to the present invention, the PCB loading/unloading unit is provided on both sides of the laser facility, so that the PCB loading/unloading operation can be performed simultaneously on both sides. Can be shortened, and by simplifying the process of adsorption/movement of the PCB, it is possible to prevent damage caused by the falling of the PCB.

Above, although the present invention has been described in detail through preferred embodiments, the present invention is not limited thereto, and various changes and applications can be made without departing from the technical spirit of the present invention. It is self-explanatory to the technician. Therefore, the true scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

110...Laser equipment 120...PCB loading/unloading part
130...PCB alignment 140...PCB
150...loader

Claims (6)

Laser equipment;
A loading unit provided on both sides of the laser facility and loading a PCB to be supplied to the laser facility;
An unloading unit provided on both sides of the laser equipment and for unloading a PCB having via holes formed by the laser equipment;
PCB alignment units provided on both sides of the laser equipment, each receiving the PCB from the loading units on both sides to align the position of the PCB; And
Moving the PCB located in the loading unit to the PCB alignment unit, placing the PCB aligned in the PCB alignment unit on a table of the laser facility, and unloading the PCB having a via hole formed by the laser facility A loader seated in the unit;
Including,
The laser equipment,
Processing via holes in the two PCBs supplied from the PCB alignment unit,
The table of the laser facility on which the PCB having the via hole processed is mounted is moved next to the unloading unit,
The loader is a PCB loading/unloading device that vacuum-sucks the PCBs having via holes formed thereon when the table of the laser equipment arrives next to the unloading unit and seats the PCBs on the unloading unit.
The method of claim 1,
The table of the laser equipment is a PCB loading/unloading device configured to be movable back and forth, left and right.
The method of claim 1,
The laser equipment is a PCB loading/unloading device configured to simultaneously form via holes in PCBs supplied from both sides.
The method of claim 1,
The loader is a PCB loading/unloading device configured to simultaneously pick up the PCBs in which via holes are formed in the laser facility and unload the unloading units at both sides at the same time.
The method of claim 1,
The loader is a PCB loading/unloading device configured to simultaneously vacuum suction the PCBs from the loading portions disposed on both sides and supply them to the PCB alignment portion.
The method of claim 1,
The loader is a PCB loading/unloading device configured to simultaneously vacuum suction the PCBs aligned in the PCB alignment portions disposed on both sides and supply them to the laser equipment.

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