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KR102172680B1 - 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치 - Google Patents

취성 재료 기판의 브레이크 방법 그리고 브레이크 장치 Download PDF

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Publication number
KR102172680B1
KR102172680B1 KR1020140061302A KR20140061302A KR102172680B1 KR 102172680 B1 KR102172680 B1 KR 102172680B1 KR 1020140061302 A KR1020140061302 A KR 1020140061302A KR 20140061302 A KR20140061302 A KR 20140061302A KR 102172680 B1 KR102172680 B1 KR 102172680B1
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KR
South Korea
Prior art keywords
substrate
brake
brittle material
material substrate
scribe line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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KR1020140061302A
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English (en)
Korean (ko)
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KR20150037481A (ko
Inventor
유마 이와츠보
켄지 무라카미
마사카즈 다케다
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20150037481A publication Critical patent/KR20150037481A/ko
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Publication of KR102172680B1 publication Critical patent/KR102172680B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
KR1020140061302A 2013-09-30 2014-05-22 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치 Active KR102172680B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013203709A JP6154713B2 (ja) 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置
JPJP-P-2013-203709 2013-09-30

Publications (2)

Publication Number Publication Date
KR20150037481A KR20150037481A (ko) 2015-04-08
KR102172680B1 true KR102172680B1 (ko) 2020-11-02

Family

ID=52788133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140061302A Active KR102172680B1 (ko) 2013-09-30 2014-05-22 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치

Country Status (4)

Country Link
JP (1) JP6154713B2 (zh)
KR (1) KR102172680B1 (zh)
CN (1) CN104511973B (zh)
TW (1) TWI619588B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106514884A (zh) * 2015-09-09 2017-03-22 三星钻石工业股份有限公司 用于脆性衬底的切割方法及切割设备
TWI632040B (zh) * 2017-07-10 2018-08-11 煜峰投資顧問有限公司 脆性材料基板裂片裝置及使用該裝置之裂片方法
JP6967276B2 (ja) * 2017-12-28 2021-11-17 三星ダイヤモンド工業株式会社 ブレーク装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010159187A (ja) 2009-01-09 2010-07-22 Epson Imaging Devices Corp 基板ブレイク方法、基板ブレイク装置及びブレイクバー
JP2012193080A (ja) 2011-03-17 2012-10-11 Seiko Epson Corp ブレーク方法、及びブレーク装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121906U (zh) * 1986-01-24 1987-08-03
JPH01210295A (ja) * 1988-02-19 1989-08-23 Ngk Insulators Ltd 脆性材の切断方法及び切断装置
JP4482328B2 (ja) * 2001-06-28 2010-06-16 三星ダイヤモンド工業株式会社 ブレイク装置及びマザー貼合基板の分断システム
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
JP2004216729A (ja) * 2003-01-15 2004-08-05 Seishin Shoji Kk 分割溝付き基板の分割装置
KR101165982B1 (ko) * 2008-04-14 2012-07-18 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 가공 방법
JP5167161B2 (ja) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
TWI488824B (zh) * 2011-12-05 2015-06-21 Mitsuboshi Diamond Ind Co Ltd The method and scribing device of glass substrate
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010159187A (ja) 2009-01-09 2010-07-22 Epson Imaging Devices Corp 基板ブレイク方法、基板ブレイク装置及びブレイクバー
JP2012193080A (ja) 2011-03-17 2012-10-11 Seiko Epson Corp ブレーク方法、及びブレーク装置

Also Published As

Publication number Publication date
JP6154713B2 (ja) 2017-06-28
KR20150037481A (ko) 2015-04-08
TWI619588B (zh) 2018-04-01
CN104511973B (zh) 2017-09-22
CN104511973A (zh) 2015-04-15
JP2015066831A (ja) 2015-04-13
TW201511907A (zh) 2015-04-01

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