KR102120761B1 - Vertical led package and lighting device using the same - Google Patents

Abstract

The embodiment relates to a vertical type light emitting device package and a lighting device using the same.
A vertical type light emitting device package according to an embodiment includes a substrate including a first power supply lead and a second power supply lead electrically separated from each other; A vertical light emitting device disposed on the substrate and having a pair of first electrodes formed on two corners adjacent to the first power supply lead, and a second electrode formed on the bottom; And a phosphor plate attached to the vertical light emitting device by an adhesive to cover the light emitting part; and a bump surrounding an at least part of the pair of first electrodes is formed on the vertical light emitting device, , The first electrode of the pair is respectively connected to the first power supply lead through a pair of wires, the second electrode is directly connected to the second power supply lead, and the light emitting unit emits light of a vehicle lamp. It includes a first light emitting portion through which light is emitted through a sphere and a second light emitting portion excluding the first light emitting portion, wherein the light outlet is formed to correspond to the size of the first light emitting portion, and the second light emitting portion is the pair of the Located between the first upper electrodes, a light guide layer that refracts the light of the second light emitting part and sends it to the light exit port is formed on the second light emitting part. A reflective and wire protective layer surrounding the wire is formed, and the reflective and wire protective layer reflects at least a portion of light emitted from the phosphor plate or the light guide layer and protects the wire, and the refractive index of the light guide layer is An indentation space for accommodating the adhesive material may be formed on an adhesive surface of the phosphor plate to which the adhesive material is applied, which is greater than or equal to the refractive index of the phosphor plate, and less than or equal to the refractive index of the reflection and wire protection layer.

Description

Vertical light emitting device package and lighting device using the same{VERTICAL LED PACKAGE AND LIGHTING DEVICE USING THE SAME}

The embodiment relates to a vertical type light emitting device package and a lighting device using the same.

In general, a lamp is a device that supplies or controls light for a specific purpose. As a light source of the lamp, an incandescent light bulb, a fluorescent lamp, or a neon lamp may be used, and recently, an LED (Light Emitting Diode) is used.

LED is a device that converts an electric signal to infrared light or light by using compound semiconductor properties, and unlike fluorescent lamps, it does not use harmful substances such as mercury, so there is little cause of environmental pollution. In addition, LEDs have a longer lifespan and less power consumption than incandescent, fluorescent, and neon lamps. In addition, the LED may have advantages of excellent visibility and less glare due to its high color temperature.

The lamp unit using the LED is widely adopted by the above advantages, and is used, for example, in a backlight, a display device, a lighting lamp, or a head lamp.

The lamp unit using the LED is suitable for use in a vehicle lamp due to its excellent visibility and low glare. Because, the vehicle recognizes the vehicle by using the light emitted from the lamp unit, or the operating state of the vehicle can be known from the outside, so that the visibility of the lamp unit is excellent, and if there is little glare, the driver or pedestrian of another adjacent vehicle may recognize the vehicle or This is because the operation state can be clearly identified.

In general, the LED of a vehicle lamp is a flip type or a vertical type. A flip-type light emitting device refers to a chip that forms a bump on a light emitting device without wire bonding and then connects the circuit between the chip and the substrate by making the bump contact the mounting substrate. The flip-type light emitting device has a package size equal to that of the light emitting device, which is advantageous for small size and light weight, but has poor light emission efficiency compared to a vertical type light emitting device. On the other hand, the vertical type light emitting device has a structure suitable for high output and has good heat dissipation properties, but the mass production yield is not yet high, and in particular, there is a problem that the electrode is contaminated due to the adhesive used for bonding the plate to the light emitting device.

Embodiments provide a vertical type light emitting device package with improved reliability and reduced emission unevenness by alleviating concentration of current.

In addition, the embodiment provides a vertical light emitting device package with low heat resistance and improved luminous flux retention.

In addition, the embodiment provides a vertical light emitting device package having a uniform color distribution.

In addition, the embodiment provides a vertical type light emitting device package that can prevent contamination of the light emitting device by the adhesive material.

In addition, it provides a vertical light-emitting sofa package that can protect the resin sealing properties and wire bonding.

In addition, the embodiment provides a vertical type light emitting device package with low light loss and capable of alleviating stress applied to the wire neck portion.

The vertical light-emitting sofa package according to the embodiment includes: a substrate including a first power supply lead and a second power supply lead electrically separated from each other; A vertical light emitting device disposed on the substrate and having a pair of first electrodes formed on two corners adjacent to the first power supply lead, and a second electrode formed on the bottom; And a phosphor plate attached to the vertical light emitting device by an adhesive to cover the light emitting part; and a bump surrounding an at least part of the pair of first electrodes is formed on the vertical light emitting device, , The first electrode of the pair is respectively connected to the first power supply lead through a pair of wires, the second electrode is directly connected to the second power supply lead, and the light emitting unit emits light of a vehicle lamp. It includes a first light emitting portion through which light is emitted through a sphere and a second light emitting portion excluding the first light emitting portion, wherein the light outlet is formed to correspond to the size of the first light emitting portion, and the second light emitting portion is the pair of the Located between the first upper electrodes, a light guide layer that refracts the light of the second light emitting part and sends it to the light exit port is formed on the second light emitting part, and a side surface of the phosphor plate and the light guide layer are formed on the upper part of the substrate. A reflective and wire protective layer surrounding the wire is formed, and the reflective and wire protective layer reflects at least a portion of light emitted from the phosphor plate or the light guide layer and protects the wire, and the refractive index of the light guide layer is An indentation space for accommodating the adhesive material may be formed on an adhesive surface of the phosphor plate to which the adhesive material is applied, which is greater than or equal to the refractive index of the phosphor plate, and less than or equal to the refractive index of the reflection and wire protection layer.

Here, the bump may have a spherical or polyhedral shape. The vertical type light emitting device package according to this embodiment can more effectively prevent contamination of the upper electrode of the light emitting device by the adhesive material.

Here, the bump may be formed by bump plating. The vertical type light emitting device package according to this embodiment is more efficient in preventing contamination of the upper electrode of the light emitting device by the adhesive material.

Here, the bump may be formed of gold. The vertical type light emitting device package according to this embodiment is more efficient in preventing contamination of the upper electrode of the light emitting device by the adhesive material.

Here, the height of the phosphor plate may be 10 times the height of the inlet space. The vertical type light emitting device package according to this embodiment is more efficient in preventing contamination of the upper electrode of the light emitting device by the adhesive material.

Here, the height of the phosphor plate may be 0.8 mm, and the height of the inlet space may be 0.08 mm. The vertical type light emitting device package according to this embodiment can improve resin sealing property and protect wire bonding.

Here, the bottom portion of the phosphor plate may have a smaller area than the upper portion of the vertical light emitting element, and may have a larger area than the light emitting portion of the light emitting element. The vertical light emitting device package according to this embodiment can reduce a non-light emitting portion and achieve uniform color distribution.

Here, the phosphor plate may be a glass plate containing a phosphor. The vertical type light emitting device package according to this embodiment improves the luminous flux retention rate and enables expression of a desired color.

Here, the adhesive material may include at least one of silicone, fluororesin, and inorganic paste. The vertical type light emitting device package according to this embodiment can improve reliability while improving light flux retention.

Here, the wire may include at least one of gold (Au), silver (Ag), copper (Cu), and aluminum (Al). The vertical type light emitting device package according to this embodiment can improve electrical conductivity while improving light flux retention.

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The vertical type light emitting device package according to the embodiment can reduce concentration of electric current to improve reliability and reduce light emission unevenness.

In addition, the thermal resistance is low and the luminous flux retention rate is improved.

Also, the color distribution is uniform.

In addition, contamination of the light emitting device by the adhesive material can be prevented.

In addition, it is possible to protect the resin sealing property and wire bonding.

Further, light loss is small, and stress applied to the wire neck portion can be relieved.

1 is a perspective view of a vertical type light emitting device package according to a first embodiment.
FIG. 2 is a perspective view of the light emitting device package shown in FIG. 1, separated from the light emitting device and the phosphor plate.
3 is a table showing the appearance and luminance distribution of a double wire vertical light emitting element, a single wire vertical light emitting element, and a flip type light emitting element.
4A and 4B are side and plan views of the vertical light emitting device package illustrated in FIG. 1.
5A is a bottom perspective view of the phosphor plate of the vertical type light emitting device package shown in FIG. 1, and FIGS. 5B to 5E illustrate various embodiments of an inlet space that can accommodate an adhesive.
6A and 6B are side and plan views of the phosphor plate shown in FIG. 5A.
7A is a configuration diagram of a general lighting device, and FIG. 7B is a configuration diagram of a lighting device including a vertical light emitting device package according to an embodiment.
8 is a plan view showing a state after a test before a test of a vertical type light emitting device package including a resin type phosphor.
9A and 9B are perspective and side views of the vertical light emitting device package according to the second embodiment.
10A is a perspective view of a vertical light emitting device package used in a general lighting device, and FIGS. 10B and 10C are plan views of the vertical light emitting device package of FIG. 10A.
11A is a perspective view of a vertical light emitting device package according to a third embodiment used in a lighting device, and FIGS. 11B and 11C are plan views of the vertical light emitting device package of FIG. 11A.
12A is a perspective view of a vertical light emitting device package according to a fourth embodiment used in a lighting device, and FIGS. 12B and 12C are plan and side views of the vertical light emitting device package of FIG. 11A.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity. Also, the size of each component does not entirely reflect the actual size.

In the description of the embodiment according to the present invention, when it is described that one element is formed on the "on (up) or down (down)" (on or under) of another element, the upper (up) or lower (On or under) includes both two elements directly contacting each other or one or more other elements formed indirectly between the two elements. Also, when expressed as “on (up) or down (on or under)”, it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a light emitting module according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a vertical light emitting device package according to a first embodiment, and FIG. 2 is an exploded perspective view of a light emitting device and a phosphor separated from the vertical light emitting device package shown in FIG. 1.

1 and 2, the vertical light emitting device package 10 according to the first embodiment may include a substrate 100, a vertical light emitting device 200, and a phosphor plate 300.

1 and 2, at least one vertical light emitting device 200 may be disposed on the substrate 100. The phosphor plate 300 may be attached to each light emitting device 200 by an adhesive 500.

The substrate 100 serves as a body of the light emitting device package 10 and may be various things such as a printed circuit board (PCB), a silicon wafer, and a resin. In addition, depending on the material used as the substrate 100, it may be classified into a plastic package, a ceramic package, and a metal package.

An insulating layer (not shown) may be disposed on the substrate 100. The insulating layer serves to block the electrical connection between the substrate 100 and other components. However, when the substrate 100 is made of a non-conductive material, an insulating layer may not be disposed.

The first power supply lead 110 and the second power supply lead 120 may be disposed on the substrate 100. The first power supply lead 110 and the second power supply lead 120 are electrically separated from each other and are respectively electrically connected to the vertical light emitting device 200. Since there is more than one vertical type light emitting device 200, the first power supply lead 110 and the second power supply lead 120 may also be formed of one or more so that each vertical light emitting device 200 is connected. .

The vertical light emitting device 200 may be disposed on the substrate 100. The vertical light emitting device 200 may be a light emitting diode (LED), but is not limited thereto. The light emitting diode may be a red, green, blue, or white light emitting diode that emits red, green, blue, or white light, respectively, but is not limited to that type.

A light emitting diode is a kind of solid element that converts electrical energy into light, and generally includes an active layer of a semiconductor material interposed between two opposing doped layers. When a bias is applied to both ends of the two doped layers, holes and electrons are injected into the active layer and then recombined there to generate light, and light generated in the active layer is emitted in all directions or in specific directions to emit light through the exposed surface. Will be released.

The vertical light emitting device 200 may include an upper electrode 210 and a lower electrode 220. The upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 and the lower electrode 220 may be connected to the second power supply lead 120. Conversely, although not shown in the drawing, the upper electrode 210 may be connected to the second power supply lead 120 and the lower electrode 220 may be connected to the first power supply lead 120.

The upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 by a wire 400, and the lower electrode 220 may be directly connected to the second power supply lead 120. .

In the vertical light emitting device 200 of the vertical light emitting device package 10 according to the first embodiment, the double electrode vertical light emitting in which the upper electrode 210 is connected to the first power supply lead 110 by two wires It can be a device. When the double wire vertical light emitting element is used, it is possible to prevent the current from being concentrated than the single wire vertical light emitting element or flip type light emitting element. Thereby, there is an effect that the reliability is improved and the unevenness due to light emission can be reduced.

The double wire vertical light emitting element, the single wire vertical light emitting element, and the flip type light emitting element will be described in detail. Tables 1 and 3 show flip type light emitting devices, single wire vertical light emitting devices, and double wire vertical light emitting devices.

Vertical light emitting device
(Double wire) Vertical light emitting device
(Single wire) Flip type light emitting device Plate mounting X △ O Resistance O O X Current spread O X O

As can be seen from Table 1 and FIG. 3, it can be seen that the double wire vertical light emitting device has a more even distribution of luminance than the single wire vertical light emitting device and the flip type light emitting device. Therefore, there is an advantage that the reliability of light emission is increased and the color deviation is reduced. In addition, the double wire vertical light emitting device has excellent heat dissipation, light emission efficiency, and good heat resistance. For example, the thermal resistance of the flip-type light emitting device is 2.3°C/W, but the vertical resistance of the vertical type light emitting device 200 is 1.5°C/W. Therefore, the vertical type light emitting device 200 has an effect of improving reliability compared to the flip type light emitting device.

1 and 2, the upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 and the wire 400. That is, the upper electrode 210 includes two electrodes 210a and 210b, and may be connected to the first power supply lead 110 and two wires 400a and 400b.

The phosphor plate 300 is a plate containing a phosphor that disperses light generated in the active layer of the vertical light emitting device 200 and is disposed on the vertical light emitting device 200. The adhesive material 500 is applied to the lower portion of the phosphor plate 300, and the phosphor plate 300 is disposed on the vertical light emitting device 200 by the adhesive material 500.

1 and 2, the phosphor plate 300 may be formed to cover the remaining portions of the vertical light emitting device 200 except for the two upper electrodes 210a and 210b. Two upper electrodes 210a and 210b of the vertical light emitting device 200 may be formed at corners close to the first power supply lead 110. When the two upper electrodes 210a and 210b are formed at corners close to the first power supply lead 110, there is an effect of reducing the length of the wire connecting the first power supply lead 110. Among the corners of the phosphor plate 300, two corners close to the first power supply lead 110 may be formed so as not to cover the upper electrodes 210a and 210b.

4A and 4B are side views and plan views showing specifications of the vertical light emitting device 200 and the phosphor plate 300 according to the first embodiment.

4A and 4B, when the horizontal and vertical sizes of the vertical light emitting device 200 are 1, the height of the vertical light emitting device 200 may be 0.12, and the height of the phosphor plate 300 may be 0.2. have. Further, the light emitting device 200 may have a square shape, and the phosphor plate 300 is basically a square shape having a horizontal and vertical 0.98, but the two corners of the phosphor plate 300 do not cover the upper electrodes 210a and 210b. Concave recesses 320a and 320b may be formed toward the center of. In addition, the light emitting unit 240 in which light is substantially emitted from the vertical light emitting device 200 may also be formed to be concave toward the center of the light emitting unit 240 in the square of 0.935 horizontally and vertically. .

4A and 4B, the size of the light emitting device 200, the phosphor plate 300, and the light emitting unit 240 may be the light emitting device 200> phosphor plate 300> light emitting unit 240 However, it is not necessarily limited to the above-described values.

As in the first embodiment, when the size of the light emitting element 200 is larger than the size of the phosphor plate 300, the light emitting element 200 can stably support the phosphor plate 300. In addition, when the size of the phosphor plate 300 is larger than the size of the light emitting unit 240, the entire light generated in the active layer of the light emitting device 200 may be emitted through the phosphor plate 300. Therefore, according to the first embodiment, there is an effect of achieving uniformity of color distribution while achieving stability of the overall structure. Therefore, the light emitting device package according to the first embodiment has high reliability and little color deviation. Further, the light emitting device package according to the first embodiment can implement an LED light source with low heat resistance.

The wire 400 may be selected in consideration of product reliability, productivity, cost, performance, and the like. As the material of the wire 400, metals such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al) may be used.

The adhesive material 500 may be formed of a heat-resistant or light-resistant material. For example, it may be silicone, fluorine resin, or inorganic (glass) paste.

When the heat resistance and light resistance of the adhesive material 500 are increased, reliability of the light emitting device package is improved, and thus there is an effect of improving the luminous flux retention rate.

By attaching the phosphor plate 300 to the vertical light emitting device 200 by the adhesive material 500, the phosphor plate 300 is lighted through the gap between the phosphor plate 300 and the vertical light emitting device 200. It can prevent leakage. By attaching the phosphor plate 300 to the vertical light emitting device 200, the phosphor plate 300 can stably guide the light of the vertical light emitting device 200.

5A is a bottom perspective view of the phosphor plate 300 according to the first embodiment, and FIGS. 6A and 6B are side and plan views of the phosphor plate.

5A, 6A, and 6B, spaces may be formed along the sides of the phosphor plate 300. When the phosphor plate 300 is applied by the adhesive material 500 in the space formed along the sides, the adhesive material 500 may be introduced. According to the embodiment shown in FIG. 5A, a groove 310 as an inlet space for the adhesive material is processed on the adhesive surface of the phosphor plate 300 to which the adhesive material 500 is applied. The groove 310 is formed concave along the side of the bottom of the phosphor plate 300. The adhesive material 500 may be accommodated in the groove 310. The lead-in space of the phosphor plate 300 according to the first embodiment is not limited to the shape of the groove 310 shown in FIG. 5A and has various types of structures capable of forming a space for accommodating the adhesive material 500. Includes. 5B to 5E show various embodiments of the inlet space that can accommodate the adhesive material. As shown in FIG. 5B, the cross section of the lead-in space has a square shape. Since the cross section is square, the storage efficiency of the adhesive material is high compared to the area. As shown in FIG. 5C, the lead-in space has a circular cross-section. When the cross section is arc-shaped, there is no angle, so there is little risk of cracking. As shown in FIG. 5D, the lead-in space has a straight line with a slanted cross section as if cut with a knife. That is, the cross section has a shape of a right triangle. The cross-section of the lead-in space is straight, making it easy to process. As illustrated in FIG. 5E, a plurality of lead-in spaces may be formed at regular or irregular intervals on the bottom side of the phosphor plate 300. Since the inlet space may not be formed entirely on the bottom side, it is possible to design a design that conflicts with the effect of lowering the efficiency due to the formation of the inlet space and receiving the adhesive.

The inlet space 310 may be formed along the rim of the bottom surface of the phosphor plate 300. Further, the inlet space 310 may be formed with a predetermined width, and the predetermined width may be a constant value. For example, when the width and length of the light emitting device 200 are 1, the height of the phosphor plate 300, that is, the thickness is 0.2, the width and height are 0.98, the height of the inlet space 310 is 0.02, and the width is 0.04. When the height of the lead-in space 310 is 0.01 and the width is 0.04, it is stable and efficient in accommodating the adhesive. For example, since the thickness of the adhesive material 500 is about 0.003 mm to 0.006 mm, the height of the inlet space in which the adhesive material 500 is accommodated is preferably 0.01 mm or more. When the phosphor plate 300 is mounted, the width of the inlet space 1 may be 0.04 mm such that it is approximately equal to the amount of the adhesive 500 exceeded. However, the sizes of the phosphor plate 300 and the inlet space 310 are not limited to the above-described values, and may vary depending on the size of the light emitting device 200 and the characteristics of the adhesive material 500.

The lead-in space 310 according to the first embodiment may be formed to accommodate the adhesive material 500. When the amount of the applied adhesive material 500 is greater than the appropriate amount or the adhesive material 500 is not properly applied, before bonding the wire 400 to the upper electrode 200, the phosphor plate 300 is vertical The adhesive 500 may contaminate the upper electrodes 210a and 210b of the vertical light emitting device 200 in the process of being disposed on the upper part of the light emitting device 200. The lead-in space 310 may receive the adhesive material 500 or the adhesive material 500 that is not properly applied in an amount exceeding an appropriate amount to prevent the adhesive material 500 from leaking to the outside of the phosphor plate 300. Therefore, the upper electrodes 210a and 210b may be protected from the adhesive material 500 applied to the plate 300. In addition, by preventing contamination of the electrodes of the vertical light emitting device 200, there is an effect that the wire bonding performance (W/B) is improved.

On the other hand, as shown in Figures 4a to 6b, the size of the vertical light emitting device 200, the size of the phosphor plate 300 and the size of the light emitting unit 240 between the size of the light emitting unit 240 <phosphor plate 300 ) Size <relationship of the size of the vertical light emitting device 200 can be established. Therefore, the sealing property of the resin is improved, and W/B performance is guaranteed.

Meanwhile, the phosphor plate 300 according to the first embodiment may be a glass plate containing phosphor. Therefore, since the phosphor is dispersed in the plate or the glass plate 300 contains the phosphor without using the encapsulant containing the phosphor, the luminous flux maintenance rate can be improved. Therefore, there is an effect that the reliability of the light emitting device package is improved.

7A is a simplified diagram of a lighting device including a general vertical light emitting device package 1, and FIG. 7B is a simplified view of a lighting device including a vertical light emitting device package 10 according to the first embodiment.

Referring to FIG. 7A, in the vertical type light emitting device package 1 used in a lighting device, a light emitting device is disposed on a substrate, an AR (anti glare) glass is disposed on the top of the light emitting device package, and the light emitting device package 1 The inside is filled with phosphor resin.

However, referring to FIG. 7B, the phosphor plate 300 according to the first embodiment may have a thickness of 80 μm or more, and may have a resin bag without permeability. Therefore, since there is no need to use AR glass, the cost can be reduced, and since the light emitting element 200 and the phosphor plate 300 are in close contact, there is an effect of preventing the leakage of blue light.

Additionally, an antistatic treatment may be performed on the glass surface of the phosphor plate 300 according to the first embodiment. The surface resistance value may be 1010 Ω or less by the antistatic treatment. For reference, the surface resistance of typical glass is 1010~1012Ω. Therefore, the phosphor plate 300 according to the first embodiment can prevent contaminants such as dust from adhering to the glass surface.

8 shows a resin type phosphor used in a general light emitting device package.

When tested for 1000 hours under test conditions with ambient temperature Ta = 85°C, junction temperature Tj = 150°C, humidity = 85%, forward current If = 1000mA, (a) the phosphor before the test is (b) the phosphor after the test As can be seen from, it can be seen that cracks are generated in the phosphor layer. However, the phosphor plate 300 according to the first embodiment may be a glass plate, not a resin, and in this case, cracks do not occur in the phosphor layer, thereby improving reliability.

Next, the second embodiment will be described.

<Second Embodiment>

The light emitting device package 11 according to the second embodiment may include a substrate 100, a vertical light emitting device 200, and a phosphor plate 300.

Since the substrate 100, the vertical light emitting device 200, and the phosphor plate 300 are as described in the first embodiment, detailed descriptions thereof will be omitted.

9A and 9B are perspective and side views of the light emitting device package 11 according to the second embodiment.

1, 2, 9A and 9B, a bump 230 is provided on the upper electrode 210 of the vertical light emitting device 200 to prevent contamination of the upper electrode 210 by the adhesive material 500. Can be formed.

1, 2, 9A and 9B, bumps 230a and 230b may be formed on two upper electrodes 210a and 210b formed on the vertical light emitting device 200. When the amount of the adhesive material 500 applied to the bottom surface of the phosphor plate 300 is greater than an appropriate amount or the adhesive material 500 is not properly applied, the phosphor plate 300 is disposed on the top of the vertical light emitting device 200 In the process, the adhesive material 500 may contaminate the upper electrodes 210a and 210b of the vertical light emitting device 200. The bump 230 may prevent the upper electrode 210 from being contaminated by the adhesive material 500 by enclosing the upper electrode 210 to which the wire 400 is connected. The bump 230 may be formed to surround a portion of the upper electrode 210, and in order to completely prevent contamination by the adhesive material 500, the bump 230 may be formed to surround the entire upper electrode 210. It might be.

The vertical light emitting device package according to the second embodiment is attached to the upper electrode 210 of the vertical light emitting device 200 to which the wire 400 is connected before attaching the phosphor plate 300 to the vertical light emitting device 200. A bump 230 is formed to surround the bonding portion. Therefore, the upper electrode 210 is prevented from being contaminated by the adhesive material 500 in the process of attaching the phosphor plate 300 to the light emitting device 200. In addition, since contamination of the electrodes of the vertical light emitting device 200 is prevented, there is an effect that the wire bonding performance (W/B) is improved.

The bump 230 may be formed in various shapes. For example, the bump 230 may be spherical or polyhedral. For example, the bump may be spherical or a regular polyhedron structure having a regular polygonal cross section. The bump 230 may be formed by bump plating, but is not limited thereto. The bump 230 may be made of metal. In particular, the bump 230 may be formed of gold having good oxidation resistance, but is not limited thereto.

Next, a third embodiment, which is a lighting device including vertical light emitting elements according to the first and second embodiments, will be described.

<Third embodiment>

10A to 10C show the vertical type light emitting device package 1 when the lighting device according to the third embodiment is used for a vehicle lamp.

10A to 10C, a short side of a light exit of a vehicle lamp used as a headlamp in optical design is 1 mm and a long side of 4 to 6 mm is suitable, and the specification is determined according to the vehicle. In this specification, the case where the light exit port has a short side of 1 mm and a long side of 5 mm will be described.

On the other hand, since the vehicle lamp is driven at a high temperature, the inorganic material of the vertical light emitting device package, in particular, the phosphor layer is being inorganic, and the size of the phosphor plate is also increasing.

Referring to FIGS. 10A to 10C, it can be seen that the general vehicle lamp 1 may have a shape in which five light emitting elements of a square having a width and a height of 1 mm are arranged in a row. That is, the vertical type light emitting device package 1 is mounted according to the size of a light exit port through which light is emitted from a vehicle lamp. However, in this case, light is not emitted from the upper electrodes 2a and 2b of the light emitting element. This can also be seen from the luminance distribution of the double wire vertical light emitting device of Table 1 and FIG. 3. That is, in the vertical light emitting device package 1 used for a general vehicle lamp, light is emitted from the upper electrodes 2a and 2b of each light emitting device to which wires are connected in the process in which light generated from the light emitting device is emitted through a phosphor. Can't. Therefore, in the vertical light emitting device package 1 used in a general vehicle lamp, light is not emitted from the entire light exit. In addition, electrode mounting and a precision mounting device of the vertical type light emitting device are required for mounting the phosphor plate.

11A to 11F show a vertical type light emitting device package 10 according to the third embodiment.

The vertical light emitting device package 10 according to the third embodiment may mount a light emitting device having a larger size than the light emitting devices shown in FIGS. 10A to 10C as shown in FIGS. 11A to 11C to increase light efficiency. have. That is, the vertical light emitting device package according to the third embodiment may have a form in which four vertical light emitting devices are arranged.

11A to 11C, an upper portion of the vertical light emitting device 200 may be formed in a square shape. The upper portion of each of the vertical light emitting devices 200 according to the embodiment of the present invention may have a square shape, and a long side of the light exit port standard may be approximately an integer multiple of the square side of the upper vertical light emitting device 200. In addition, the short side of the light exit port specification may be longer than the square side. In addition, the phosphor plate 300 is attached to the upper portion of the light emitting device 200. The second light emitting unit 242 except for the first light emitting unit 241 and the first light emitting unit 241 through which the light is emitted through the light exit of the vehicle lamp to the light emitting unit 240 of the vertical light emitting device 200 Dividing by, since the phosphor plate 300 of the vertical light emitting device package 10 according to the third embodiment is sufficient to be formed only on the upper portion of the first light emitting portion 241, there is no need for electrode processing and precision mounting.

11A to 11C, the second light emitting unit 242 is located between the first upper electrodes 210a and 210b, and the first light emitting unit 241 includes the second light emitting unit 242 and the first It may have a rectangular shape excluding the upper electrodes 210a and 210b. Since the light exit port of the vehicle lamp according to the third embodiment is formed to fit the first light emission section 241, light emitted from all regions of the first light emission section 241 is emitted through the light exit port, so that the light efficiency is high. There is. In addition, in the vertical light emitting device package 1 of FIGS. 10A to 10C, since there are 5 light emitting devices, the interval between the light emitting devices, which are parts in which light is not emitted, is 4, however, the vertical light emitting device according to the third embodiment Since the package 10 has four light-emitting elements, the distance between the light-emitting elements is also reduced to four, so that the light efficiency is higher.

Meanwhile, FIGS. 11A to 11C illustrate an embodiment in which the vertical light emitting device 200 has a square shape, but is not necessarily limited to a square shape. That is, as illustrated in FIGS. 11D and 11E, the vertical light emitting device 200 may have a rectangular shape. For example, as illustrated in FIGS. 11D and 11E, the vertical light emitting device 200 may be a rectangle having a long side in a long side direction of a light exit or a rectangular side having a long side in a short side direction. At this time, the number of light emitting devices may also vary depending on the shape of the light emitting device. Also, as illustrated in FIG. 11F, the vertical light emitting device of FIG. 11D and the vertical light emitting device of FIG. 11E may be mixed and arranged.

<Fourth embodiment>

12A to 12C show a vertical light emitting device package 10 in which a light guide layer is formed on the second light emitting unit 242 of the vertical light emitting device package 10 shown in FIGS. 11A to 11C. In the vertical light emitting device package 10 according to FIGS. 11A to 11C, the light of the first light emitting part 241 of the phosphor plate 300 is emitted through the light exit hole, but the light of the second light emitting part 242 is It cannot be released.

Meanwhile, the vertical light emitting device package 10 according to the fourth embodiment may be a fluorescent layer 300 that disperses light on the light emitting device 200, and is not necessarily limited to a plate.

12A to 12C, the vertical light emitting device package 10 according to the fourth embodiment further includes a light guide layer 700 for guiding light from the second light emitting unit 242 to be emitted through a light exit hole. It can contain. The light guide layer 700 may be formed on the second light emitting unit 242. Therefore, since light emitted from the second light emitting unit 242 is stably emitted by the light guide layer 700, light efficiency is further increased.

12A to 12C, the vertical light emitting device package 10 according to the fourth embodiment is disposed on the substrate 100, and the side surface of the phosphor plate 300 and the light guide layer 700 ) And a reflective and wire protective layer 800 surrounding the wire 400. The reflective and wire protection layer 800 may reflect at least a portion of light emitted from the phosphor plate 300 or the light guide layer 700 and protect the wire 400.

12C, the vertical light emitting device package 10 includes a substrate 100, a vertical light emitting device 200 positioned on the substrate, and a phosphor plate 300 formed on the vertical light emitting device 200. ), and the vertical light emitting device 200 may be connected to the first power supply lead 110 and the second power supply lead 120 formed on the substrate 100. The upper electrode 210 is formed on the upper electrode 200, and the wire 400 may connect the upper electrode 210 and the first power supply lead 110. Since the structure of the vertical light emitting device package 10 is as described above, detailed description thereof will be omitted.

The light guide layer 700 may reflect or refract light emitted from the second light emitting unit 242 and send it to the light exit port. The phosphor plate 300 may include gallium nitride (GaN). Therefore, when the refractive index of the light guide layer 700 is greater than the refractive index of the reflection and wire protection layer 800, the light guide layer 700 may totally reflect light incident from the second light emitting unit 242. For example, since the refractive index of the phosphor plate 300 is 1.4 and the refractive index of gallium nitride (GaN) constituting the reflective and wire protective layer 800 is 2.5, the range of the refractive index of the light guide layer 700 is 1.4 or more and 2.5 or less. desirable. The angle of incidence from the second light emitting unit 242 to the light guide layer 700 may be greater than or equal to a predetermined angle according to a refractive index ratio between the light guide layer 700 and the reflection and wire protection layer 800.

In addition, the light guide layer 700 may be formed in an arc shape, as illustrated in FIG. 12C, but is not limited thereto. For example, since the light guide layer 700 needs only to totally reflect light from the second light emitting unit 242 to the light exit, the cross section may be an inclined straight line having a slope.

The light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment may be formed to have high ductility. Therefore, stress applied to the wire 400 positioned in the light guide layer 700 can be reduced.

The light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment may be formed of a flexible material. For example, the light guide layer 700 may be made of at least one of high refractive index silicone gel and silicone rubber. The light guide layer 700 made of a flexible material may be formed on the upper electrode 210 and the second light emitting unit 242 to relieve stress applied to the wire neck portion.

For example, the light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment uses a resin having a low hardness to prevent problems such as wire breakage due to stress that may occur in the wire. It is preferred. The hardness of the resin may vary depending on the configuration of the package, but it is generally preferred that the shore hardness A is 50 or less.

In general, the wire for bonding with the upper electrodes 210a and 210b is vulnerable to breaking, and in particular, the stress applied to the wire neck portion is highest. Therefore, the vertical light emitting device package 10 according to the fourth embodiment can reduce the stress applied to the wire neck portion by increasing the ductility of the light guide layer 700. Therefore, there is an effect of preventing the breakage of the wire to increase the life of the wire.

On the other hand, forming the flexible light guide layer 700 on the vertical light emitting device 200 is not necessarily applied to the vertical light emitting device. As long as the light-emitting element on which the light guide layer is formed, it can be applied to other types of light-emitting elements other than the vertical light-emitting element. That is, by adding a resin having a low hardness, the stress applied to the wire bonded to the electrode of the light emitting element can be relieved.

For example, the light emitting device package, a substrate including at least one power supply lead, a light emitting device including at least one electrode disposed on the substrate and connected to the at least one power supply lead through a wire, and A light guide layer disposed on the light emitting element may guide light from the light emitting element, and may include a light guide layer including a resin having a low hardness.

The embodiments have been mainly described above, but this is merely an example and does not limit the present invention, and those skilled in the art to which the present invention pertains are not exemplified above in the range that does not depart from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to these modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

100: substrate
200: vertical light emitting device
300: phosphor plate
400: wire
500: adhesive
700: light guide layer
800: reflective layer and wire protection layer

Claims (12)

A substrate including a first power supply lead and a second power supply lead electrically separated from each other;
A vertical light emitting device disposed on the substrate and having a pair of first electrodes formed on two corners adjacent to the first power supply lead, and a second electrode formed on the bottom; And
Includes a phosphor plate attached to the vertical light emitting element by an adhesive material to cover the light emitting portion;
A bump surrounding at least a portion of the pair of first electrodes is formed on the vertical light emitting device,
The pair of first electrodes are respectively connected to the first power supply lead through a pair of wires, and the second electrode is directly connected to the second power supply lead,
The light emitting unit includes a first light emitting unit through which light is emitted through a light exit port of a vehicle lamp and a second light emitting unit excluding the first light emitting unit,
The light exit port is formed to correspond to the size of the first light emitting portion,
The second light emitting portion is located between the pair of first upper electrodes,
A light guide layer that refracts the light of the second light emitting part and sends it to the light exit port is formed on the second light emitting part,
A reflection and wire protection layer is formed on the upper surface of the substrate to surround the side of the phosphor plate and the light guide layer and the wire,
The reflection and wire protection layer reflects at least a portion of light emitted from the phosphor plate or the light guide layer and protects the wire,
The refractive index of the light guide layer is greater than or equal to the refractive index of the phosphor plate, and less than or equal to the refractive index of the reflective and wire protective layer,
A vertical light emitting device package in which an inlet space for accommodating the adhesive material is formed on an adhesive surface of the phosphor plate to which the adhesive material is applied. According to claim 1,
The bump is spherical or polyhedral,
Vertical light emitting device package. According to claim 1,
The bump is formed by bump plating,
Vertical light emitting device package. According to claim 1,
The bump is formed of gold,
Vertical light emitting device package. According to claim 1,
The height of the phosphor plate is 10 times the height of the inlet space,
Vertical light emitting device package. The method of claim 5,
The height of the phosphor plate is 0.8mm, the height of the inlet space is 0.08mm,
Vertical light emitting device package. According to claim 1,
The bottom of the phosphor plate has a smaller area than the top of the vertical light emitting device, and a larger area than the light emitting part of the vertical light emitting device.
Vertical light emitting device package. According to claim 1,
The phosphor plate is a glass plate containing a phosphor,
Vertical light emitting device package. According to claim 1,
The adhesive material,
Containing at least one of silicone, fluorine resin, inorganic paste,
Vertical light emitting device package. delete According to claim 1,
The wire includes at least one of gold (Au), silver (Ag), copper (Cu), and aluminum (Al),
Vertical light emitting device package. A lighting device comprising the vertical type light emitting device package according to any one of claims 1 to 9 and 11.

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