KR102099538B1 - 이중경화형 점착 테이프 - Google Patents
이중경화형 점착 테이프 Download PDFInfo
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- KR102099538B1 KR102099538B1 KR1020190132298A KR20190132298A KR102099538B1 KR 102099538 B1 KR102099538 B1 KR 102099538B1 KR 1020190132298 A KR1020190132298 A KR 1020190132298A KR 20190132298 A KR20190132298 A KR 20190132298A KR 102099538 B1 KR102099538 B1 KR 102099538B1
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- adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C09J2201/128—
-
- C09J2201/622—
-
- C09J2205/31—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
경화방식 | 점착력(gf/25mm) | ||||
1회 | 2회 | 3회 | 평균값 | ||
실시예1 | 열경화 | 256 | 277 | 281 | 271 |
광경화 | 80 | 65 | 54 | 66 | |
실시예2 | 열경화 | 145 | 154 | 125 | 141 |
광경화 | 5 | 12 | 7 | 8 | |
실시예3 | 열경화 | 555 | 613 | 573 | 580 |
광경화 | 120 | 78 | 143 | 113 | |
실시예4 | 열경화 | 344 | 356 | 312 | 337 |
광경화 | 122 | 113 | 89 | 108 | |
실시예5 | 열경화 | 211 | 145 | 205 | 187 |
광경화 | 45 | 42 | 38 | 41 | |
실시예6 | 열경화 | 277 | 286 | 267 | 276 |
광경화 | 56 | 61 | 45 | 54 | |
실시예7 | 열경화 | 377 | 345 | 366 | 362 |
광경화 | 122 | 65 | 111 | 99 | |
실시예8 | 열경화 | 289 | 311 | 289 | 296 |
광경화 | 77 | 78 | 67 | 74 |
Claims (9)
- 열경화 후 피착제의 표면에 부착되어 피착제의 표면을 보호 또는 고정하고 사용 완료 후 광경화되어 피착제의 표면으로부터 제거되는 이중경화형 점착 테이프로서,
기재층; 및
상기 기재층의 일면 또는 양면에 점착 조성물을 도포 또는 코팅하여 형성되는 점착층을 포함하고,
상기 점착 조성물은 아크릴계 점착제, 경화제, UV 경화형 올리고머, UV 광개시제, 금속 입자 및 점착부여제를 포함하고,
상기 UV 경화형 올리고머는 비스페놀 A형 에폭시 아크릴레이트계 수지를 포함하며,
상기 금속 입자는 크기가 0.1 내지 1 μm인 니켈 입자를 포함하고,
상기 점착부여제는 텔펜 페놀 수지를 포함하고,
상기 아크릴계 점착제 100 중량부를 기준으로, 상기 경화제의 함량은 0.1 내지 10 중량부, 상기 UV 경화형 올리고머의 함량은 2 내지 7 중량부, 상기 UV 광개시제의 함량은 0.1 내지 5 중량부, 상기 금속 입자의 함량은 0.1 내지 5 중량부, 상기 점착부여제의 함량은 10 내지 15 중량부이고,
상기 이중경화형 점착 테이프의 열경화 및 광경화 후 점착력은 열경화 후 광경화 전 점착력을 기준으로 70% 이상까지 감소된 것을 특징으로 하는, 이중경화형 점착 테이프. - 제1항에 있어서,
상기 아크릴계 점착제는 중량평균분자량이 20만 내지 100만이고 하이드록시(OH) 또는 카르복실기(COOH) 구조를 갖는 아크릴계 점착제를 포함하고,
상기 경화제는 이소시아네이트계 경화제, 아질리딘계 경화제 및 에폭시계 경화제로 이루어진 그룹으로부터 선택된 1종 이상을 포함하는 것을 특징으로 하는, 이중경화형 점착 테이프. - 제2항에 있어서,
상기 UV 광개시제는 아조계 광개시제, 퍼옥사이드계 광개시제 및 아세탈계 광개시제로 이루어진 그룹으로부터 선택된 1종 이상의 UV 광개시제를 포함하는 것을 특징으로 하는, 이중경화형 점착 테이프. - 제3항에 있어서,
상기 UV 광개시제는 2,2'-아조-비스-이소부티릴니트릴(AIBN) 또는 벤조일 퍼옥사이드(BPO)를 포함하는 것을 특징으로 하는, 이중경화형 점착 테이프. - 삭제
- 삭제
- 삭제
- 제1항 내지 제4항 중 어느 한 항에 있어서,
상기 기재층은 폴리올레핀(PO), 폴리염화비닐(PVC) 및 폴리에틸렌테레프탈레이트(PET)로 이루어진 그룹으로부터 선택된 1종 이상의 필름 및 자외선 안정제를 포함하고,
상기 자외선 안정제는 상기 기재층의 총 중량을 기준으로 0.1 내지 3 중량%의 함량을 포함되는 것을 특징으로 하는, 이중경화형 점착 테이프. - 삭제
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102473112B1 (ko) * | 2022-10-24 | 2022-12-02 | 주식회사 국보화학 | 도트 형태로 코팅된 점착제층을 구비하는 자외선 경화형 보호 필름 및 이의 제조방법 |
KR102473108B1 (ko) * | 2022-10-24 | 2022-12-02 | 주식회사 국보화학 | 자외선 경화형 보호 필름 및 이의 제조방법 |
Citations (5)
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KR20120082773A (ko) * | 2011-01-14 | 2012-07-24 | 삼성전자주식회사 | 패턴형성 가능한 접착 조성물, 이를 이용한 반도체 패키지, 및 이의 제조방법 |
KR20130040591A (ko) * | 2011-10-14 | 2013-04-24 | 주식회사 케이씨씨 | 점착제 조성물, 반도체 웨이퍼용 다이싱 테이프 및 그 제조방법 및 장치 |
KR20140038858A (ko) * | 2012-09-21 | 2014-03-31 | 도레이첨단소재 주식회사 | 몰드 언더필 공정의 마스킹 테이프용 점착제 조성물 및 그를 이용한 마스킹 테이프 |
KR20160128748A (ko) * | 2015-04-29 | 2016-11-08 | 주식회사 티엠에스케미칼 | 감압 접착 테이프 |
KR20180045505A (ko) * | 2016-10-26 | 2018-05-04 | (주)에버켐텍 | Semi―IPN 구조를 도입한 무기재 타입 도전성 점착필름 |
-
2019
- 2019-10-23 KR KR1020190132298A patent/KR102099538B1/ko active Active
Patent Citations (5)
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KR20120082773A (ko) * | 2011-01-14 | 2012-07-24 | 삼성전자주식회사 | 패턴형성 가능한 접착 조성물, 이를 이용한 반도체 패키지, 및 이의 제조방법 |
KR20130040591A (ko) * | 2011-10-14 | 2013-04-24 | 주식회사 케이씨씨 | 점착제 조성물, 반도체 웨이퍼용 다이싱 테이프 및 그 제조방법 및 장치 |
KR20140038858A (ko) * | 2012-09-21 | 2014-03-31 | 도레이첨단소재 주식회사 | 몰드 언더필 공정의 마스킹 테이프용 점착제 조성물 및 그를 이용한 마스킹 테이프 |
KR20160128748A (ko) * | 2015-04-29 | 2016-11-08 | 주식회사 티엠에스케미칼 | 감압 접착 테이프 |
KR20180045505A (ko) * | 2016-10-26 | 2018-05-04 | (주)에버켐텍 | Semi―IPN 구조를 도입한 무기재 타입 도전성 점착필름 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102473112B1 (ko) * | 2022-10-24 | 2022-12-02 | 주식회사 국보화학 | 도트 형태로 코팅된 점착제층을 구비하는 자외선 경화형 보호 필름 및 이의 제조방법 |
KR102473108B1 (ko) * | 2022-10-24 | 2022-12-02 | 주식회사 국보화학 | 자외선 경화형 보호 필름 및 이의 제조방법 |
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