KR102074404B1 - Apparatus and method for supplying resin material, resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

[Problem] A resin material supply device for supplying a resin material to a supply object such as a cavity of a resin molding device so as to be more uniform than conventionally is provided.
RESOLUTION The resin material supply apparatus 10 is a supply object holding part (holding plate 16) holding a supply object (resin material feed tray 20) which is an object which supplies a resin material, and A resin material supply port 121 provided at an upper portion of the object to be supplied, and a moving part 17 for moving the relative position in the horizontal direction of the resin material supply port 121 with respect to the object to be supplied held by the object to be supplied; And a control unit for controlling the moving unit 17 such that the relative position returns from the starting position to the starting position through the entire supply target region of the supply object without passing through the same position two or more times in the movement path ( 19). By returning the relative position to the start position, immediately after the start of supply, the resin material P is again supplied to the vicinity of the start position 22 where the supply amount of the resin material P was small, and the resin near the start position 22 is supplied. The amount of material P approaches to equality.

Description

Resin material supply apparatus, resin material supply method, resin molding apparatus, and resin molded product manufacturing method {APPARATUS AND METHOD FOR SUPPLYING RESIN MATERIAL, RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD}

The present invention relates to a resin material supply device and method for supplying a resin material, a resin molding device having the resin material supply device, and a resin molded article manufacturing method using the resin material supply method.

In order to protect electronic components from the environment such as light, heat, moisture, and the like, electronic components are generally sealed by resins. The resin sealing method includes a compression molding method and a transfer molding method. In the compression molding method, a molding mold consisting of a lower mold and an upper mold is used, the resin material is supplied to the cavity of the lower mold, and the substrate on which the electronic component is mounted is mounted on the upper mold. Molding is performed by mold clamping both while heating the lower mold and the upper mold. In the transfer molding method, after attaching a board | substrate to either cavity of an upper mold | type and a lower mold | type, both are shape-molded while heating a lower mold | type and an upper mold | type, and shaping | molding is performed by press-fitting resin into a cavity by a plunger. In the transfer molding method, part of the resin remains in the path for feeding the resin from the plunger to the cavity, resulting in waste, and the problem of damage to the semiconductor substrate and wiring due to the flow of the resin causes the problem. Compression molding is the mainstream.

In compression molding, generally, a powder or granule (hereinafter, collectively referred to as "powder") or a liquid is used for the resin material to be supplied to the cavity. The powdered resin material does not flow freely in the cavity after the supply, and the liquid resin material does not flow very much in the cavity because of its high viscosity generally used in compression molding. Therefore, the resin flows in the cavity due to the decrease in viscosity due to the heating of the resin material during molding, so that the electronic component may be loaded, so that the resin material is supplied as uniformly as possible into the cavity before molding. It is desirable to put it. In the compression molding apparatus described in Patent Document 1, while the resin material is dropped from the resin material supply port of the slider to the cavity placed on the XY stage, the position of the resin material supply port is fixed to move the XY stage into a tortuous shape. By this, a resin material is supplied into the cavity. 11 shows the trajectory 92 of the relative movement of the resin material supply port with respect to the cavity 91 in this conventional compression molding apparatus. During this serpentine relative movement, the resin material in the cavity 91 depends on the position by supplying the resin material at a constant supply speed (feed amount of the resin material per unit time) while maintaining the movement speed at a constant value. Evenly.

Patent Document 1: Japanese Patent Application Laid-Open No. 2013-042017

In general, in the apparatus for injecting the resin material into the cavity, it takes time (slightly) from the start of the operation of supplying the resin material to the constant supply speed, and the supply speed immediately after the start of supply is the constant supply. It is lower than speed. Therefore, even if the moving speed of the cavity is made constant, in the cavity, the amount of the resin material at the position immediately after the start of supply (starting position) is smaller than the amount of the resin material at other positions. As a result, the resin material in the cavity becomes uneven.

The problem to be solved by the present invention is to provide a resin material supply device and a method capable of supplying a resin material to a supply object such as a cavity of the resin molding apparatus so as to be more uniform than conventionally.

The resin material supply apparatus which concerns on this invention made in order to solve the said subject,

a) a supply object holding | maintenance part which hold | maintains the supply object which is a object which supplies resin material,

b) a resin material supply port provided in an upper portion of the supply object holding portion;

c) a moving part for moving the relative position in the horizontal direction of the resin material supply port with respect to the object to be supplied held by the object to be supplied;

d) The supply object area | region which is the area | region to which the resin material is supplied of the said supply object is divided into two partial area | regions which are symmetric about an imaginary dividing line, and the said relative position returns to the said starting position from a single starting position. And a control unit for controlling the moving unit so that the moving path passes through the moving path, the moving path is symmetrical with respect to the dividing line, and does not pass through the same position two or more times, and bends a plurality of times in the two partial regions, respectively. It is done.

The resin material supplying method which concerns on this invention divides the supply object area | region which is the area | region which the resin material is supplied, of the supply object which supplies the resin material into two partial regions symmetrical with respect to an imaginary dividing line, and the said supply object And a relative position in the horizontal direction of the resin material supply port provided in the upper portion of the supply object pass through a moving path returning from the single starting position to the starting position, and the moving path is symmetrical with respect to the dividing line and has the same position. The resin material is supplied from the resin material supply port to the supply object while the relative position is moved in the supply object region so as not to pass more than times and to be bent a plurality of times in the two partial regions, respectively.

Resin molding apparatus according to the present invention,

The resin material supply device,

A compression molding portion having a first molding die, a second molding die having a cavity, and a mold clamping mechanism for clamping the first molding die and the second molding die;

And a conveying part for moving the supply object supplied with the resin material by the resin material supply device onto the cavity, and supplying the resin material from the supply object to the cavity.

Resin molded article manufacturing method according to the present invention,

Supplying a resin material to the supply object by the resin material supply method;

Transferring a supply object supplied with a resin material to a cavity of a second molding type, and supplying the resin material from the supply object to the cavity;

It has a process of clamping a 1st shaping | molding die and a 2nd shaping | molding die which supplied the resin material to the cavity.

Industrial Applicability According to the present invention, a resin material can be supplied to a supply object such as a cavity of a resin molding apparatus so as to be more uniform than conventionally.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram which shows one Embodiment of the resin material supply apparatus which concerns on this invention.
(A) is a figure which shows the state in which the resin material was supplied to the resin material conveyance tray, and (b) the state in which the resin material conveyance tray was lifted and the resin material accommodating space was formed.
3 is a top view showing an example of a trajectory in which a resin material feed tray and a resin material are supplied to the resin material feed tray in the resin material supply device of the present embodiment.
Fig. 4 is a graph showing the time change of the target value and the measured value of the supply speed of the resin material from the resin material supply port to the resin material receiving portion of the resin material transfer tray.
(A) is a longitudinal cross-sectional view parallel to the direction of movement of the relative position of the resin material supplied to the resin material accommodating part of a resin material conveyance tray, and is a figure which shows the state immediately after supply start, and (b) is It is a figure which shows the state at the end of supply.
6 is a longitudinal cross-sectional view perpendicular to the moving direction of the relative position of the resin material supplied to the resin material containing portion of the resin material conveying tray.
FIG. 7: is a top view which shows the other example of the track | orbit in which the resin material feed tray and a resin material are supplied to a resin material feed tray in the resin material supply apparatus of this embodiment.
8 is a schematic configuration diagram showing a modification of the resin material supply device of the present embodiment.
It is a longitudinal cross-sectional view which shows an example of the compression molding part which is a part of resin molding apparatus which concerns on this invention.
10 is a schematic view showing an example of a resin molding apparatus including a material receiving module, a molding module, and a dispensing module.
11 is a plan view showing a trajectory through which a resin material is supplied to a cavity in a conventional compression molding apparatus.

In the resin material supply apparatus and method which concern on this invention, the horizontal position of the resin material supply port with respect to the supply object hold | maintained by a supply object holding part does not pass the same position twice or more in a movement path from a starting position. The resin material is supplied to the supply object from the resin material supply port while moving in the supply object region of the supply object so as to return to the start position. In this way, since the relative position is moved so that the relative position returns to the starting position, part or all of the resin material supplied at the end of the movement is supplied to the starting position. As a result, even if the amount of the resin material supplied to the start position decreases because the supply speed of the resin material immediately after the start of supply of the resin material decreases, part or all of the resin material supplied at the end of the movement is the start position. Since it is replenished by supplying to the resin material, the resin material supplied to the object to be supplied becomes equal. Moreover, in the movement path, since the relative position does not pass through the same position two or more times, the resin material is supplied to the same position two or more times, and the supply amount of the resin material does not increase.

In the resin material supply device and method according to the present invention, the relative position "returns to the starting position" means that the relative position returns to the same position as the starting position, and that the resin material spreads to reach the starting position. It also includes reaching a position away from the starting position by a distance of.

The movement of the relative position may be caused by the movement of the supply object holding part, may be caused by the movement of the resin material supply port, or may be caused by the movement of both the supply object holding part and the resin material supply port.

The object to be supplied may be, for example, a cavity of a resin molding apparatus or a resin material conveying tray which conveys a resin material from a resin material supply apparatus to a cavity provided in the resin molding apparatus. Or the board | substrate with which the electronic component which is the object which performs resin molding may be mounted may be sufficient.

The resin material may be powdery or liquid.

In the resin material supply apparatus and method which concern on this invention, in order to supply a resin material to a supply object uniformly, the moving speed of a relative position and the supply speed which supplies a resin material to a supply target object from a resin material supply port are normally constant. Let's do it. However, for example, when it shows below, any one or both of the said moving speed and the said supply speed may be variable. In this case, since the control is easier in the movement speed than in the feed speed, it is preferable to make the movement speed variable and the feed speed constant.

Examples of the case where the moving speed and / or the supply speed are made variable include the following examples.

When supplying a resin material to a cavity having a corner portion such as a rectangle, if the relative position is moved in a curved trajectory in order to smoothly move the relative position, the resin material may not evenly spread evenly around the corner portion. Therefore, when moving the relative position in a curved shape near the corners, the supply amount of the resin material to the corners is reduced by slowing the moving speed (and / or increasing the feeding speed) than when moving in the straight shape. By increasing the number, the resin material can be more evenly distributed throughout the cavity.

In addition, when the relative position is moved along the edge of the cavity, the resin material does not spread outward from the edge, so that the amount of the resin material near the edge is larger than that of other positions. Therefore, when moving the relative position along the edge of the cavity, the amount of supply of the resin material to the vicinity of the edge is increased by making the moving speed faster (and / or lowering the feeding speed) than moving the inside of the cavity rather than the edge. In short, the resin material can be more evenly distributed throughout the cavity.

The supply speed of the resin material may become unstable due to a problem of an apparatus for sending the resin material to the resin material supply port, in addition to slowing immediately after the above-described supply start. Therefore, the supply speed detection part which detects the supply speed of a resin material can be provided in the resin material supply apparatus which concerns on this invention. In this case, when an abnormality (above or below a predetermined setting range) of the supply speed is detected by the supply speed detection unit, the manager of the device is displayed on the sound, light, or display device (display). You may further provide the resin material supply apparatus with the warning part which issues a warning by a burn. Alternatively, when the supply speed detection unit detects an abnormality in the supply speed, the operation of the moving unit and the supply of the resin material from the resin material supply port may be stopped. Similarly, in the resin material supply method according to the present invention, the supply speed of the resin material can be detected while supplying the resin material to the supply object, and a warning is issued when an abnormality in the supply speed is detected, or the supply of the resin material is performed. You can stop it.

Hereinafter, more specific embodiment of the resin material supply apparatus, the resin material supply method, the resin molding apparatus, and the resin molded article manufacturing method which concern on this invention is demonstrated using FIG.

(1) Structure of Resin Material Supply Device of Present Embodiment

The schematic structure of the resin material supply apparatus 10 of this embodiment is shown in FIG. The resin material supply apparatus 10 is an apparatus which supplies powdery resin material P to the resin material transfer tray 20 which is a supply object.

The resin material supply apparatus 10 has the resin material holding | maintenance part 11 which hold | maintains the resin material P, and the trough 12. As shown in FIG. One end of the trough 12 is connected to the resin material holding part 11, and the other end is provided with a resin material supply port 121, which is an opening for supplying the resin material P to the resin material transfer tray 20. . Moreover, the resin material supply apparatus 10 is a resin material holding | maintenance part containing the excitation part 13 which vibrates the resin material holding | maintenance part 11 and the trough 12, and the resin material P. FIG. And a weighing unit 14 for measuring the weight of the trough 12. In the upper part of the resin material holding | maintenance part 11, the source supply part 15 which supplies the resin material P to the said resin material holding | maintenance part 11 is provided. The source supply part 15 has a source supply part 151 which is an opening for supplying the resin material P to the resin material holding part 11 and a source supply part excitation part which vibrates the source supply part 15. 152 is provided. The resin material holding part 11 is arrange | positioned directly under the original supply port 151.

Immediately below the resin material supply port 121, a holder (supply object holding part) 16 holding the resin material transfer tray 20 is disposed. Under the holder 16, the moving part 17 which moves the said holder 16 in a horizontal direction is provided. The moving part 17 is any one within the range below the predetermined | prescribed maximum speed in either the X direction (the transverse direction of FIG. 1) and the Y direction (the direction perpendicular | vertical to the paper surface of FIG. 1). It can move at a speed, and can move simultaneously in both an X direction and a Y direction. Therefore, the relative position of the resin material supply port 121 and the holder 16 in the horizontal direction can also be moved at arbitrary speeds in arbitrary directions. Moreover, what combined the holding stand 16 and the moving part 17 is generally called "XY stage."

The resin material supply apparatus 10 also carries in the resin material conveyance tray 20 before the resin material P is supplied, mounts it on the holding stand 16, and after the resin material P is supplied. It has the conveyance part 18 which carries out the resin material conveyance tray 20 from the holding stand 16. As shown in FIG.

The resin material supply apparatus 10 further has the control part 19. The control unit 19 is embodied by computer hardware and software, and controls ON / OFF and supply speed when supplying the resin material P to the resin material transfer tray 20 from the resin material supply port 121. In addition to the control, the operation of the moving unit 17 is controlled. The detail of the control by the control part 19 is demonstrated below with the operation | movement of the whole resin material supply apparatus 10. FIG.

As shown in Fig. 2 (a), the resin material feed tray 20 has a shape size corresponding to the cavity of the molding die of the compression molding apparatus and corresponds to the above-described supply target region 21. It is provided. The resin material accommodating part 21 consists of the resin material accommodating frame 211 which is a frame material which has a rectangular opening, and the release film F which covers the lower surface of the opening part of the resin material accommodating frame 211. FIG. The lower surface of the resin material accommodating frame 211 is provided with an adsorption mechanism (not shown) which adsorbs the release film F to the lower surface by sucking air. Inside the opening of the resin material accommodating frame 211, the stop part 2111 by which the lower end part of an inner peripheral side protrudes inward is formed. Inside the resin material accommodating frame 211 is a rectangular frame member corresponding to the shape of the opening of the resin material accommodating frame 211. The film tension frame has a protrusion 2121 on the outer circumferential side and an inverted L-shaped cross section. Ash 212 is provided. The side surface of the resin material accommodating frame 211 is gripped by the transfer part 18. Under the conveyance part 18, the film holding part 213 which hold | grips the edge part of the release film F extended and provided in the lower surface of the resin material accommodating frame 211 is provided.

The resin material conveyance tray 20 receives the supply of the resin material P to the resin material accommodating part 21 by the resin material supply apparatus 10 as mentioned later (FIG. 2 (a)), and is then a conveyance part. When it is lifted up by (18), the film tension frame member 212 is relatively lowered relative to the resin material accommodating frame 211 by its own weight until the protrusion 2121 abuts against the stop 2111. Thereby, resin material accommodation space PA corresponding to the shape of a shaping cavity is formed (FIG. 2 (b)).

(2) Operation of the resin material supply apparatus of this embodiment and the resin material supply method of this embodiment

Hereinafter, operation | movement (resin material supply method of this embodiment) of the resin material supply apparatus 10 is demonstrated.

In advance, the operator supplies the resin material P to the original supply part 15. And the operation | movement of the resin material supply apparatus 10 is started by an operator performing predetermined operation using input devices (not shown), such as a touch panel provided in the resin material supply apparatus 10. FIG.

First, the conveyance part 18 carries in the resin material conveyance tray 20 before the resin material P is supplied on the holding stand 16, and mounts it. Subsequently, the moving part 17 is a resin just above the predetermined starting position 22 (refer FIG. 3) in the resin material accommodating part 21 of the resin material feed tray 20 by control of the control part 19. FIG. The holder 16 is moved in the horizontal direction so that the material supply port 121 is disposed. In the example of FIG. 3, although the position of the center side 245 of the said long side was made into the starting position 22 near the edge of the long side of the resin material accommodating part 21 which has a substantially rectangular top surface, the starting position is resin material. Any position in the accommodating part 21 may be sufficient.

Next, the measurement part 14 measures the weight which combined the resin material holding | maintenance part 11 and the trough 12, and the resin material P accommodated in them. Since the weight of the resin material holding | maintenance part 11 and the trough 12 is known, the resin material is obtained by subtracting the weight of those resin material holding | maintenance part 11 and the trough 12 from the weight measured here. The weight of the resin material P in the holding | maintenance part 11 and the trough 12 is calculated | required. When the weight of this resin material P is sufficiently larger than the weight of the resin material to be supplied to the resin material containing portion 21 of the resin material conveying tray 20, the resin material containing portion 21 described in the next paragraph. The supply operation of the resin material P to the furnace is started. On the other hand, when the weight of this resin material P is insufficient or zero, the control unit 19 supplies the source supply part excitation part 152 to give the source supply part 15 a vibration from the source supply part excitation part 152 for a predetermined time. ). Thereby, the resin material P in the original supply part 15 is supplied to the resin material holding | maintenance part 11 by predetermined amount through the original supply opening 151. As shown in FIG.

Next, the control part 19 controls the excitation part 13 so that vibration may be given to the resin material holding | maintenance part 11 and the trough 12 from the excitation part 13 by a fixed intensity | strength. Thereby, the resin material P is supplied from the resin material supply port 121 to the resin material accommodating part 21 of the resin material feed tray 20 at a constant supply speed. Simultaneously with the start of provision of the vibration, the control unit 19 controls the moving unit 17 to move the relative position in the horizontal direction of the resin material supply port 121 with respect to the resin material accommodation unit 21. .

In FIG. 3, the track 23 which the said relative position moves is shown as an example. The relative position is first moved from the starting position 22 to the vicinity of the edge 242 of one short side along the edge 241 of one long side of the resin material accommodating portion 21, so as to draw a U character there. That is, the U-turn is moved in the short side direction (the direction in which the short side extends) toward the edge 243 side of the other long side by a distance equal to the width of the resin material supply port 121, and the long side direction (the long side extends). Direction) is reversed. In addition, the movement distance of the short side direction here may be longer than the width | variety of the resin material supply port 121 as long as it exists in the range which the resin material P supplied from the resin material supply port 121 spreads. Then, when the relative position returns to the vicinity of the center 245 in the long side direction, the U-turn similarly moves to the vicinity of the edge 242 of the one short side. In this way, when the U turn near the edge of one short side and the center of the long side direction is repeated, the relative position is reached at the edge 243 of the other long side when the vicinity of the edge 243 of the other long side is reached. Along the edge and moves to near the edge 244 of the other short side. Therefore, the relative position reverses the direction of movement in the long side direction while moving in the short side direction toward the edge 241 side of the one long side by a distance approximately equal to the width of the resin material supply port 121 (U-turn). Let's do it. Thereafter, the relative position moves to the vicinity of one long side edge 241 while repeating a U-turn near the center 245 in the long side direction and near the edge 244 of the other short side. In this way, the relative position passes through the entire resin material accommodating portion 21 that is the supply target region, and finally returns to the starting position 22 along the edge 241 of one long side. During the movement of the relative position described so far, the supply of the resin material P from the resin material supply port 121 to the resin material accommodating portion 21 is continued.

Here, the relative position "passes through the entire supply target region of the supply object" means that the interval of the trajectory of the relative movement is densely (about the width of the resin material supply port) so that the resin material supply port passes through the entire supply object region. In addition to the case where the vehicle is full, the resin material supplied from the resin material supply port is spread so as to be evenly spaced so as to spread evenly over the entire area to be supplied. In addition, it also includes a space between the trajectory and the end of the supply target region so that the resin material supplied from the resin material supply port spreads and spreads evenly throughout the supply target region.

As shown in FIG. 4, the supply speed of resin material P does not reach a target value for a fixed period ("start period" in drawing) from immediately after supply start. Therefore, as shown to Fig.5 (a), the supply amount of the resin material P supplied in the vicinity of the starting position 22 at the time of a supply start becomes smaller than the position supplied later. In FIG. 5A, the resin material P exists on the side opposite to the moving direction of the relative position as seen from the start position 22, but this is because the resin material supply port 121 has a constant width. When the resin material P falls from the resin material supply port 121 to the resin material accommodating part 21, it spreads in a horizontal direction. Then, when the relative position has returned to the starting position 22 after passing through the entire resin material accommodating portion 21, immediately after the start of supply, the supply position of the resin material P is again close to the starting position 22 where the supply amount is small. Since the resin material P is supplied, the amount of the resin material P near the start position 22 is closer to the amount of the resin material P at other positions than that without this supply again (that is, Close to equality) (FIG. 5B).

Although the speed (moving speed) which moves a relative position may be constant, it can also be made variable according to a position, as illustrated below. In addition, the movement speed of the relative position is easier to control after moving slightly than the start period immediately after the start of movement. Therefore, in this embodiment, the moving speed of time after a start period is made variable. For example, in the U-turn in the track 23, the amount of the resin material P supplied to the area outside the curve (the area indicated by reference numeral 25 in Fig. 3) is less than that in the straight line. Therefore, the resin material P is sufficiently supplied to the part of the curve by slowing the moving speed of the relative position at the place where the U-turn is made. In this way, the resin material P generously supplied to the curve spreads to the outside of the curve having a small amount of the resin material P, so that the supply amount of the resin material P can be made close to equal.

6, since the resin material P1 supplied when the relative position moves along the edge 24 of the resin material accommodating portion 21 does not spread to the edge 24 side, the relative position is changed. When it moves at a constant speed, it will become more than resin material P2 supplied when it moves inward of the resin material accommodating part 21. FIG. Therefore, by supplying the moving speed when the relative position moves along the edge 24 of the resin material accommodating portion 21 faster than the moving speed at other positions, the supply amount of the resin material P can be made even. Can be.

The planar shape of the resin material accommodating part (and the cavity of the shaping | molding die of the compression molding apparatus corresponding to it) of the resin material feed tray which supplies resin material in the resin material supply apparatus 10 of this embodiment is shown in FIG. The present invention is not limited to the rectangle, and may be any shape such as a rectangle other than a rectangle, a polygon other than a rectangle, and a circle. For example, when 21 A of resin material accommodating parts use circular resin material feed trays, the relative position can be moved along the track | orbit 23A1 shown to Fig.7 (a). In this movement, the relative position sets the vicinity of the edge of the resin material accommodating portion 21A as the starting position 22A, first moves 90 degrees slightly shorter in an arc shape along the edge, and then moves toward the center of the circle. U-turn while moving by the width of the material supply port 121, and the U-turn is further moved after moving 90 degrees slightly in the reverse direction in the shape of a concentric circle (circular arc) to the vicinity of the center of the circle. Repeat until you reach it. The reason why the angle is slightly shorter than 90 degrees here is to secure the area required for the U-turn. Subsequently, the relative position moves slightly 180 degrees near the center of the circle, U-turns while moving toward the edge of the resin material accommodating portion 21A by the width of the resin material supply port 121, and the concentric circles ( After moving 90 degrees slightly shorter in the reverse direction in a circular arc shape, the additional U-turn operation is repeated until the edge is reached. In addition, the relative position moves slightly 180 degrees near the edge, and then performs the operation toward the center of the circle from the vicinity of the edge, which is the same as before, and then performs the operation toward the edge from the center of the circle. And when the relative position moves in the arc shape near the edge, it reaches the starting position 22A and completes a series of movements.

In the example of Fig. 7A, the relative position is U-turned every time it is slightly shortened by 90 °, and is slightly lowered by 180 ° when the center or edge of the circle is reached. As shown by 23A2), it may make a U-turn every time it moves 180 degrees a little short, and moves 360 degrees a little short when it reaches the center or edge of a circle.

The schematic structure of 10 A of resin material supply apparatuses of a modification is shown in FIG. The resin material supply apparatus 10A of a modification has the supply speed detection part 191 and the alert transmitter 192 in addition to the component which the above-mentioned resin material supply apparatus 10 has. While supplying the resin material to the supply object, the supply speed detection unit 191 acquires the weight measured by the metering unit 14, and detects the supply speed of the resin material to the supply object from the time change of the weight. The alarm transmitter 192 emits an alarm when the supply speed of the resin material detected by the feed speed detector 191 is out of a predetermined range. Instead of emitting an alarm sound, the alarm transmitting unit 192 may emit light or display an image on the screen. When the supply speed is out of the predetermined range, the amount of the resin material supplied to the supply object is out of the target value, so that the alarm is issued in this way, so that the resin molding can be prevented from being performed by the wrong amount of the resin material. . In addition, instead of providing the alarm transmission unit 192, a stop control unit for stopping the apparatus when the supply speed of the resin material detected by the supply speed detection unit 191 is out of a predetermined range may be provided.

In the above examples, the case where the resin material is supplied to the resin material transfer tray 20 has been described as an example. However, even if the resin material is supplied from the resin material supply device 10 to the resin material transfer tray having a configuration other than the above, the resin material may be supplied. Okay. In addition, the molding die may be transported, and the resin material may be supplied from the resin material supply device 10 to the cavity of the molding die, and the resin material may be supplied from the resin material supply device 10 to the surface of the substrate on which the electronic component is mounted. It is okay to supply. The resin material is not limited to a powdery one, but may be a liquid one.

(3) Embodiment of the resin molding apparatus (compression molding apparatus) and resin molded article manufacturing method of this embodiment

The resin molding apparatus of this embodiment has the above-mentioned resin material supply apparatus 10 and the compression molding part 30. Hereinafter, the structure of the compression molding part 30 is demonstrated using FIG.

Tie bars 32 (four in total) are formed in each of four corners of the lower fixing plate 311, and the compression molding unit 30 has a rectangular upper fixing plate 312 near the upper end of the tie bar 32. ) Is provided. A rectangular movable platen 33 is provided between the lower fixing plate 311 and the upper fixing plate 312. The movable platen 33 is provided with holes through which the tie bars 32 pass at four corners, and is movable up and down along the tie bars 32. On the lower fixing plate 311, a mold clamping device 34, which is a device for moving the movable platen 33 up and down, is provided.

The lower heater 351 is arrange | positioned at the upper surface of the movable platen 33, and the lower mold | type LM which is the said 2nd shaping | molding die is provided on the lower heater 351. As shown in FIG.

An upper heater 352 is disposed on a lower surface of the upper fixing plate 312, and an upper mold UM, which is the first molding type, is mounted below the upper heater 352. On the lower surface of the upper mold UM, the substrate S on which the semiconductor chip is mounted can be mounted. The upper mold | type UM and the lower mold | type LM are arrange | positioned facing each other.

The operation of the compression molding unit 30 is as follows. First, the board | substrate S in which the semiconductor chip was mounted is mounted on the lower surface of the upper mold UM by a board | substrate movement mechanism (not shown). Next, as mentioned above, the resin material feed tray 20 to which the resin material P was supplied by the resin material supply apparatus 10 is transferred to the upper part of the lower mold | type LM by the conveyance part 18 directly, and the resin material The resin material P in the accommodation space PA is accommodated in the cavity MC together with the release film F. As shown in FIG. In addition, the mounting of the substrate S on the upper mold UM and the storage of the resin material P in the lower mold LM may be performed in the reverse order.

In this state, the resin S is softened by heating the resin material P in the cavity MC by the lower heater 351, and the substrate S is heated by the upper heater 352. In the state in which the resin material P and the board | substrate S were heated, the movable platen 33 is raised by the mold clamping apparatus 34, and the mold clamping (upper mold UM and lower mold LM) is clamped. The resin material P is cured. After the resin material P hardens, the mold opening is performed by lowering the movable platen 33 by the mold clamping device 34.

By the operation (resin molded article manufacturing method) of the resin material supply apparatus 10 and the compression molding part 30 demonstrated above, the resin sealing article (resin molded article) by which the semiconductor chip was resin-sealed is manufactured. The obtained resin sealing article is smoothly mold-released from the lower mold | type LM by the inner surface of the lower mold | type LM being coat | covered with the release film F. FIG.

Next, another embodiment of the resin molding apparatus according to the present invention will be described with reference to FIG. 10. The resin molding apparatus 40 of this embodiment has the material acceptance module 41, the molding module 42, and the dispensing module 43. The material acceptance module 41 is an apparatus for receiving the resin material P and the substrate S from the outside and sending them to the molding module 42, and includes the resin material supply device 10 described above. It has a substrate receiving part 411. One shaping | molding module 42 is provided with one set of said compression shaping | molding part 30 mentioned above. Although three shaping | molding modules 42 are shown in FIG. 10, the number of shaping | molding modules 42 can be provided in the resin shaping | molding apparatus 40 arbitrary. Moreover, even after the resin molding apparatus 40 is assembled and the use is started, the molding module 42 can be increased or decreased. The dispensing module 43 carries in and holds the resin molded product manufactured by the shaping | molding module 42 from the shaping | molding module 42, and has the resin molded article holding | maintenance part 431. As shown in FIG.

Main conveying apparatus which conveys the board | substrate S, the resin material conveyance tray 20, and the resin molded article so that it may pass through the material acceptance module 41, one or several shaping | molding modules 42, and the dispensing module 43. 46 is provided. The above-mentioned conveyance part 18 comprises a part of main conveyance apparatus 46. As shown in FIG. Moreover, in each module, the conveyance apparatus 47 which conveys the board | substrate S, the resin material conveyance tray 20, and the resin molded article between the main conveyance apparatus 46 and the apparatus in the said module. Is provided.

In addition, the resin molding apparatus 40 has a power supply and a control part (all are not shown) for operating each said module.

The operation of the resin molding apparatus 40 will be described. The board | substrate S is hold | maintained at the board | substrate receiving part 411 of the material acceptance module 41 by an operator. The main conveying apparatus 46 and the sub conveying apparatus 47 convey the board | substrate S from the board | substrate receiving part 411 to the compression molding part 30 in one of the shaping | molding modules 42, and a board | substrate ( S) is attached to the upper mold UM of the compression-molded part 30. Next, the main conveyance apparatus 46 and the sub conveyance apparatus 47 carry the resin material conveyance tray 20 into the resin material supply apparatus 10. In the resin material supply device 10, the resin material P is supplied to the resin material transfer tray 20 as described above. The main conveying apparatus 46 and the sub conveying apparatus 47 of the shaping | molding module 42 with which the board | substrate S was attached to the upper mold UM with the resin material conveying tray 20 to which the resin material P was supplied. After conveying to the compression molding part 30 and arrange | positioning the resin material conveyance tray 20 on the lower mold | type LM of the said compression molding part 30, the cavity of the lower mold | type LM from the resin material conveyance tray 20 is carried out. Resin material P is supplied to MC. Then, after carrying out the resin material conveyance tray 20 from the compression molding part 30 with the main conveying apparatus 46 and the sub conveyance apparatus 47, the compression molding part 30 performs compression molding. While performing compression molding in the compression molding section 30, the same operation as before has been performed on the other compression molding sections 30, and in parallel while delaying time between the plurality of compression molding sections 30. Compression molding can be performed. The resin molded article obtained by compression molding is carried out from the compression molding unit 30 by the main transporting device 46 and the sub transporting device 47, and is carried in the resin molded product holding unit 431 of the dispensing module 43. maintain. The user takes out the resin molded article from the resin molded article holding part 431 suitably.

Needless to say, the present invention is not limited to the above embodiments, and various modifications are possible in addition to the points described in the above description.

10, 10A-resin material supply unit 11-resin material holding unit
12-Trough 121-Resin Material Feed Hole
13-aftershock part 14-weighing part
15-Source Supply Unit 151-Source Supply Port
152-aftersupply aftershock 16-support
17-moving part 18-moving part
19-Control unit 191-Feed rate detection unit
192-Alarm Transmitter 20, 20A-Resin Material Transfer Tray
21, 21A-Resin material accommodating part 211-Resin material accommodating frame
2111-Stop 212-Film Tension Frame Material
2121-Projection 213-Film Holding
22, 22A-starting position
23, 23A1, 23A2, 92-trajectories of movement of relative positions
24, 241, 242, 243, 244-edges of the resin material receptacle
245--center of the edge of the long side of the resin material receptacle
25-area outside the curve
30-compression molded part 311-lower fixing plate
312-Upper fixing plate 32-Tie bar
33-Operation Platen 34-Molding Device
351-Lower Heater 352-Upper Heater
40-resin molding unit 41-material acceptance module
411-Board Receptacle 42-Forming Module
43-dispensing module 431-resin molded part retainer
46-Main Carrier 47-Sub Carrier
91-Cavity F-Release Film
LM-Lower Form (2nd Form) MC-Cavity
P-resin material PA-resin material receiving space
S-Substrate UM-Upper Form (First Form)

Claims (12)

a) a supply object holding | maintenance part which hold | maintains the supply object which is a object which supplies resin material,
b) a resin material supply port provided in an upper portion of the supply object holding portion;
c) a moving part for moving the relative position in the horizontal direction of the resin material supply port with respect to the object to be supplied held by the object to be supplied;
d) The supply object area | region which is the area | region to which the resin material is supplied of the said supply object is divided into two partial area | regions which are symmetric about an imaginary dividing line, and the said relative position returns to the said starting position from a single starting position. And a control unit for controlling the moving unit so that the moving path passes through the moving path, the moving path is symmetrical with respect to the dividing line, and does not pass through the same position two or more times, and bends a plurality of times in the two partial regions, respectively. Resin material supply apparatus made of. The method according to claim 1,
One or both of the moving speed of the said relative position and the supply speed of the resin material supplied from the said resin material supply port are variable, The resin material supply apparatus characterized by the above-mentioned. The method according to claim 2,
The resin material supply device characterized in that the moving speed is variable and the supply speed is constant velocity. The method according to any one of claims 1 to 3,
And a feed rate detecting unit for detecting a feed rate of the resin material supplied from the resin material supply port. The resin material provided in the upper part of the said supply object and the said supply object by dividing the supply object area | region which is the object to which resin material is supplied, and the supply object area | region which is the area | region to which resin material is supplied, into two partial regions symmetrical about an imaginary dividing line. The relative position in the horizontal direction of the feed port passes through a moving path returning from the single starting position to the starting position, and the moving path is symmetric with respect to the dividing line and does not pass the same position more than once and the two parts. The resin material supply method characterized by supplying a resin material from the said resin material supply port to the said supply object, moving the said relative position in the said supply object area | region so that it may bend | folded each time multiple times in an area | region. The method according to claim 5,
One or both of the moving speed of the said relative position and the supply speed of the resin material supplied from the said resin material supply port are variable, The resin material supply method characterized by the above-mentioned. The method according to claim 6,
The moving speed is variable and the supply speed is constant velocity. The method according to any one of claims 5 to 7,
The supply speed of the resin material supplied from the said resin material supply port is detected, The resin material supply method characterized by the above-mentioned. The resin material supply apparatus in any one of Claims 1-3,
A compression molding portion having a first molding die, a second molding die having a cavity, and a mold clamping mechanism for clamping the first molding die and the second molding die;
And a conveying part for transferring a supply object supplied with a resin material by the resin material supply device onto the cavity, and supplying the resin material from the supply object to the cavity. The resin material supply apparatus of Claim 4,
A compression molding portion having a first molding die, a second molding die having a cavity, and a mold clamping mechanism for clamping the first molding die and the second molding die;
And a conveying section for moving the supply object supplied with the resin material by the resin material supply device onto the cavity, and supplying the resin material from the supply object to the cavity. The process of supplying a resin material to the said supply object by the resin material supply method in any one of Claims 5-7,
Transferring a supply object supplied with a resin material to a cavity of a second molding type, and supplying the resin material from the supply object to the cavity;
And a step of mold-fastening the first molding die and the second molding die supplied with the resin material to the cavity. Supplying a resin material to the supply object by the resin material supply method according to claim 8,
Transferring a supply object supplied with a resin material to a cavity of a second molding type, and supplying the resin material from the supply object to the cavity;
And a step of mold-fastening the first molding die and the second molding die supplied with the resin material to the cavity.

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