KR102050354B1 - Lighting device - Google Patents

Abstract

Embodiments relate to a lighting device.
According to one or more exemplary embodiments, a lighting apparatus includes: a heat sink including a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit coupled to the first heat dissipation unit and having a second heat conductivity; And a light source module disposed on the heat sink, the light source module including a substrate and a plurality of light emitting elements disposed on the substrate, wherein the first thermal conductivity is greater than the second thermal conductivity, and the second heat dissipation part is an inner portion. And an outer side portion surrounding the inner side portion and a first accommodating portion formed between the inner side portion and the outer side portion, wherein the first heat dissipation portion is disposed on an outer side portion of the second heat dissipation portion, and a plurality of upper portions at which the light source module is disposed; 2 includes a lower portion disposed in the first housing portion of the heat dissipation unit. According to the illuminating device which concerns on such embodiment, manufacturing cost can be reduced and heat dissipation performance can be improved.

Description

Lighting device {LIGHTING DEVICE}

Embodiments relate to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace conventional light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors. .

Embodiments provide a lighting device that can reduce manufacturing costs.

Moreover, embodiment provides the illuminating device which can improve heat dissipation performance.

Moreover, embodiment provides the illuminating device which can improve external appearance quality.

In addition, the embodiment provides a lighting device capable of satisfying the flame retardant rating.

Moreover, embodiment provides the illuminating device which can improve a breakdown voltage characteristic.

Moreover, embodiment provides the illuminating device which can improve intensity | strength.

According to one or more exemplary embodiments, a lighting apparatus includes: a heat sink including a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit coupled to the first heat dissipation unit and having a second heat conductivity; And a light source module disposed on the heat sink, the light source module including a substrate and a plurality of light emitting elements disposed on the substrate, wherein the first thermal conductivity is greater than the second thermal conductivity, and the second heat dissipation part is an inner portion. And an outer side portion surrounding the inner side portion and a first accommodating portion formed between the inner side portion and the outer side portion, wherein the first heat dissipation portion is disposed on an outer side portion of the second heat dissipation portion, and a plurality of upper portions at which the light source module is disposed; 2 includes a lower portion disposed in the first housing portion of the heat dissipation unit. According to the illuminating device which concerns on such embodiment, manufacturing cost can be reduced and heat dissipation performance can be improved.

The lighting apparatus according to the embodiment includes a heat sink including a first heat dissipation part of a non-insulating material and a second heat dissipation part of an insulating material; A light source module including a substrate and a plurality of light emitting elements disposed on the substrate; And a power supply unit disposed inside the heat sink and configured to provide a power signal to the light source module, wherein the second heat radiation unit includes an inner part accommodating the power supply part and an outer part surrounding the inner part. The first heat dissipation part includes a lower part disposed between an inner part of the second heat dissipation part and an outer part of the second heat dissipation part and a plurality of upper parts disposed on the outer part of the second heat dissipation part. According to the illuminating device which concerns on such embodiment, manufacturing cost can be reduced and heat dissipation performance can be improved.

Use of the lighting device according to the embodiment has the advantage of reducing the manufacturing cost.

In addition, there is an advantage that can improve the heat dissipation performance.

In addition, there is an advantage that can improve the appearance quality.

In addition, there is an advantage that can improve the withstand voltage characteristics.

In addition, there is an advantage that can improve the strength.

In addition, there is an advantage that can satisfy the flame retardant grade.

1 is a perspective view from above of a lighting apparatus according to a first embodiment;
2 is a perspective view from below of the lighting device shown in FIG. 1;
3 is an exploded perspective view of the lighting apparatus shown in FIG.
4 is an exploded perspective view of the lighting apparatus shown in FIG. 2;
5 is a cross-sectional view of the lighting apparatus shown in FIG. 1.
6 is a perspective view showing a state in which the light source module and the power supply unit shown in FIG.
FIG. 7 is a perspective view illustrating a state in which the light source module and the power supply unit illustrated in FIG. 4 are coupled; FIG.
8 is a conceptual diagram illustrating the electrical connection of the substrate and the extension substrate shown in FIGS. 3 and 4.
9 is a view for explaining a coupling structure of the connection unit and the power supply unit.
10 to 11 are views for explaining the coupling structure of the support substrate and the heat sink.
12 is a perspective view from above of the lighting apparatus according to the second embodiment;
FIG. 13 is a perspective view of the lighting apparatus shown in FIG. 12 viewed from below. FIG.
14 is an exploded perspective view of the lighting apparatus shown in FIG. 12.
15 is an exploded perspective view of the lighting apparatus shown in FIG. 13.
16 is a cross-sectional view of the lighting apparatus shown in FIG. 12.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In the description of the embodiment according to the present invention, when one element is described as being formed on the "on or under" of another element, it is either above or below. (On or under) includes both two elements are directly in contact with each other (directly) or one or more other elements are formed indirectly between the two elements (indirectly). In addition, when expressed as 'on' or 'under', it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First embodiment

1 is a perspective view from above of a lighting device according to a first embodiment, FIG. 2 is a perspective view from below of a lighting device shown in FIG. 1, FIG. 3 is an exploded perspective view of the lighting device shown in FIG. 1, and FIG. 4 is an exploded perspective view of the lighting device shown in FIG. 2, and FIG. 5 is a cross-sectional view of the lighting device shown in FIG. 1.

1 to 5, the lighting apparatus according to the first embodiment may include a cover 100, a light source module 200, a heat sink 300, a power supply unit 400, and a socket 500. Can be. Hereinafter, each component will be described in detail.

<Cover 100>

The cover 100 has a bulb shape or hemispherical shape, and has an opening 130 which is hollow and partially open.

The cover 100 is optically coupled to the light source module 200. For example, the cover 100 may diffuse, scatter, or excite light emitted from the light source module 200.

The cover 100 is coupled to the heat sink 300. In detail, the cover 100 may be coupled to the second heat dissipation part 330 of the heat dissipator 300.

The cover 100 may have a coupling part 110. The coupling part 110 may be coupled to the heat sink 300. In detail, the coupling part 110 protrudes from an end of the cover 100 forming the opening 130, and may be a plurality of coupling parts 110. The plurality of coupling units 110 may be spaced apart from each other without being connected to each other. When the plurality of coupling parts 110 are spaced apart from each other by a predetermined interval, damage due to a force (lateral pressure or tension) generated when the coupling part 110 is fitted to the heat sink 300 may be prevented.

Although not shown in the drawing, the coupling part 110 may have a screw-shaped fastening structure corresponding to the screw groove structure of the heat sink 300. By the thread structure of the heat sink 300 and the screw groove structure of the coupling part 110, the coupling of the cover 100 and the heat sink 300 may be facilitated, and workability may be improved.

The material of the cover 100 may be a light diffusion PC (polycarbonate) to prevent glare of a user due to light emitted from the light source module 200. In addition, the cover 100 may be any one of glass, plastic, polypropylene (PP), and polyethylene (PE).

An inner surface of the cover 100 may be corroded, and an outer surface thereof may be applied with a predetermined pattern to scatter light emitted from the light source module 200. Therefore, glare of the user can be prevented.

The cover 100 may be manufactured by blow molding for later light distribution.

<Light source module 200>

The light source module 200 includes the light source module 200 disposed on the heat dissipation member 300 and emitting light to the cover 100.

More specifically, the light source module 200 may include a substrate 210 and a light emitting device 230 disposed on the substrate 210.

The substrate 210 may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like may be used. It may include. In addition, the substrate 210 may be a circuit pattern printed with a transparent or opaque resin. Here, the resin may be a thin insulating sheet having the circuit pattern.

The surface of the substrate 210 may be a material that efficiently reflects light, or may be coated with a color that efficiently reflects light, for example, white, silver, or the like.

The substrate 210 may have a first hole H1 for coupling with the power supply unit 400. Specifically, it will be described with reference to FIGS. 6 to 8.

FIG. 6 is a perspective view illustrating a state in which the light source module 200 and the power supply unit 400 shown in FIG. 3 are coupled, and FIG. 7 is a view showing the light source module 200 and the power supply unit 400 shown in FIG. 8 is a perspective view illustrating a coupled state, and FIG. 8 is a conceptual diagram for describing electrical connection between the substrate 210 and the extended substrate 450 illustrated in FIGS. 3 and 4.

3 to 8, the substrate 210 has a first hole H1, and an extension substrate 450 of the power supply unit 400 is inserted into the first hole H1.

Here, as shown in FIG. 8, the height D1 or the extended substrate 450 from the upper surface of the substrate 210 to the end of the extended substrate 450 penetrating through the first hole H1 of the substrate 210. The length D1 of the portion penetrating the first hole H1 of the substrate 210 may be 1.5 mm or more and 2.0 mm or less. When D1 is smaller than 1.5 mm, electrical connection between the substrate 210 and the extended substrate 450 may be difficult, resulting in poor contact between the substrate 210 and the extended substrate 450. Specifically, the electrical connection between the substrate 210 and the extended substrate 450 is possible by a soldering process. For this soldering process, the terminal 211 of the substrate 210 and the terminal 451 of the extended substrate 450 are soldered. Must be in contact with the part 700. At this time, if the D1 is smaller than 1.5mm, it may be difficult for the terminal 451 of the extended substrate 450 to be in sufficient contact with the soldering part 700. In this case, contact failure may occur between the substrate 210 and the extended substrate 450. Therefore, it is preferable that D1 is 1.5 mm or more. When the D1 is larger than 2.0 mm, a dark part may be generated when the light source module 200 is driven. Specifically, an arm portion may be formed around the extension substrate 450. Such a dark portion may lower the light efficiency of the lighting device and may cause inconvenience to the user. Therefore, it is preferable that D1 is 2.0 mm or less.

The shape of the first hole H1 may correspond to the shape of the extended substrate 450. Here, the diameter of the first hole H1 may be larger than the diameter of the extension substrate 450. That is, the first hole H1 may be large enough to allow the extension substrate 450 to be inserted. Therefore, the extended substrate 450 inserted into the first hole H1 may not directly contact the substrate 210. In the first hole H1, the distance D2 between the substrate 210 and the extended substrate 450 may be greater than zero and less than or equal to 0.2 mm. When D2 is 0, it is difficult to insert the extended substrate 450 into the first hole H1 of the substrate 210 and an unintended electrical short circuit between the extended substrate 450 and the substrate 210 may occur. On the other hand, if the D2 exceeds 0.2mm, the solder material may flow through the first hole (H1) to the support substrate 410 during soldering, in which case the printed circuit formed on the support substrate 410 is soldered Problems that may cause electrical shorts may occur due to the material, and it may be difficult to accurately position the extension substrate 450 where it should be located in the first hole H1. Therefore, the D2 is preferably greater than 0 and less than or equal to 0.2 mm.

3 to 5 again, the substrate 210 has a second hole H2 for confirming the correct position of the substrate 210 when the substrate 210 is mounted on the heat sink 300. Can be. The protrusion P1 of the heat sink 300 is inserted into the second hole H2. The protrusion P1 is disposed on the upper surface of the inner side 331 of the heat sink 300, and may guide the position of the substrate 210 in the heat sink 300.

The substrate 210 may have a third hole H3 for fixing the substrate 210 to the radiator 300. The fastening means such as a screw may be inserted into the seventh hole H7 of the heat sink 300 by passing through the third hole H3 of the substrate 210, so that the substrate 210 may be fixed to the heat sink 300. .

The light emitting devices 230 may be disposed on one surface of the substrate 210 in plurality. Here, the light emitting device 230 may be disposed on a predetermined region of the substrate 210 disposed on the upper portion 311 of the heat sink 300. That is, the light emitting device 230 may be disposed on the upper portion 311 of the heat dissipator 300, in particular, in the substrate 210. When the light emitting device 230 is disposed on the top 311 of the heat sink 300, the heat emitted from the light emitting device 230 is the top 311 of the heat sink 300 disposed directly below the substrate 210. Can move quickly. Therefore, heat dissipation performance can be improved.

The number of light emitting elements 230 may be equal to or smaller than the number of upper portions 311 of the heat sink 300. Specifically, the light emitting device 230 may correspond one-to-one with the top 311 of the heat dissipator 300, and may be smaller than the number of the top 311 of the heat dissipator 300.

The light emitting device 230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits ultraviolet light. Here, the light emitting diode may be a horizontal type or a vertical type.

The light emitting device 230 may be a high-voltage LED package. The HV LED chip in the HV LED package is powered by a DC power supply and turned on at voltages greater than 20 volts (V). In addition, the high-voltage LED package has a high power consumption of approximately 1W. For reference, a conventional general LED chip is turned on at 2 to 3 (V). If the light emitting device 230 is a HV LED package, since it has a high power consumption of about 1W level, it can have the same or similar performance as the existing one in a small quantity, thereby reducing the production cost of the lighting device according to the embodiment. .

A lens may be disposed on the light emitting device 230. The lens is disposed to cover the light emitting element 230. Such a lens may adjust a direction or direction of light emitted from the light emitting element 230. The lens is hemispheric type and may be a translucent resin such as a silicone resin or an epoxy resin with no void space. The light transmissive resin may comprise phosphors which are wholly or partially dispersed.

When the light emitting device 230 is a blue light emitting diode, phosphors included in the translucent resin may include garnet-based (YAG, TAG), silicate-based, nitride-based, and oxynitride. It may include at least one or more of the system.

Natural light (white light) may be realized by including only a yellow phosphor in the translucent resin, but may further include a green phosphor or a red phosphor in order to improve the color rendering index and reduce the color temperature.

When several kinds of phosphors are mixed in the light-transmissive resin, the addition ratio according to the color of the phosphor may use more green phosphors than red phosphors, and more yellow phosphors than green phosphors. Yellow phosphors include garnet-based YAG, silicate and oxynitrides. Green phosphors include silicate and oxynitrides. Red phosphors can be nitrides. have. In addition to mixing various kinds of phosphors in the light-transmissive resin, a layer having a red phosphor, a layer having a green phosphor, and a layer having a yellow phosphor may be separately divided.

<Radiator 300>

The radiator 300 receives heat from the light source module 200 to radiate heat. In addition, the radiator 300 may receive heat from the power supply unit 400 to radiate heat.

The radiator 300 may include a first radiator 310 and a second radiator 330.

The material of the first heat dissipation unit 310 may be different from the material of the second heat dissipation unit 330. In detail, the first heat dissipation part 310 may be a non-insulating material, and the second heat dissipation part 330 may be an insulating material. When the first heat dissipation unit 310 is a non-insulating material, it is possible to quickly dissipate heat emitted from the light source module 200, and when the second heat dissipation unit 330 is an insulating material, the outer surface of the heat dissipating member 300 becomes an insulator. It is possible to improve the withstand voltage characteristics and protect the user from electrical energy. For example, the material of the first heat dissipation unit 310 may be a metal material such as aluminum, copper, and magnesium, and the second heat dissipation unit 330 may be made of polycarbonate (PC), acrylonitrile (AN), Butadiene (BD), Styrene (SM)) and the like may be a resin material. Here, the second heat dissipation part 330 of the resin material may include metal powder. If the second heat dissipation unit 330 is made of a resin, appearance molding is easier than the conventional one in which the entire heat dissipation body is a metal material, and appearance defects due to painting or anodizing of the conventional heat dissipation are not generated. There is this.

The first thermal conductivity W / (mk) or W / m ° C. of the material constituting the first heat dissipation part 310 may be greater than the second thermal conductivity of the material constituting the second heat dissipation part 330. Since the light source module 200 is disposed closer to the first heat dissipation unit 310 than the second heat dissipation unit 330, the thermal conductivity of the first heat dissipation unit 310 is greater than that of the second heat dissipation unit 330. This is because it is advantageous to improve the heat radiation performance. For example, the first heat dissipation unit 310 may be aluminum having high thermal conductivity, and the second heat dissipation unit 330 may be a PC having a thermal conductivity lower than that of the first heat dissipation unit 310. Here, the first heat dissipation unit 310 is not limited to aluminum, and the second heat dissipation unit 330 is not limited to the PC.

The light source module 200 is disposed on the first heat radiating unit 310. In detail, the substrate 210 and the light emitting device 230 of the light source module 200 may be disposed on the upper portion 311 of the first heat radiating part 310.

The first heat dissipation part 310 may include an upper portion 311 and a lower portion 313.

The upper portion 311 has a flat plate shape, and the substrate 210 and the light emitting element 230 of the light source module 200 are disposed on the upper portion 311 to receive heat directly from the light source module 200. In addition, the upper portion 311 may discharge the received heat from the light source module 200 to the outside or transfer the lower portion 313.

The shape of the upper portion 311 is not limited to the flat plate shape. For example, the shape of the upper portion 311 may be a plate in which the central portion is convex upward or downward, or may be a hemispherical plate. In addition, the shape of the upper portion 311 may be a variety of forms, such as circular or elliptic form.

The upper portion 311 may extend in a direction substantially perpendicular to the longitudinal direction of the lower portion 313 at the upper end of the lower portion 313. Here, the upper portion 311 and the lower portion 313 may be vertical, may form an acute angle, and may also form an obtuse angle.

The upper portion 311 may be a plurality. Specifically, the number of the top 311 may be equal to or greater than the number of the light emitting devices 230. The substrate 210 and the light emitting device 230 may be disposed on each upper portion 311.

A fourth hole H4 may be formed in at least two upper portions 311 of the plurality of upper portions 311 to fix the first radiating portion 310 to the second radiating portion 330. A fastening means (not shown) such as a screw may pass through the fourth hole H4 and be inserted into the sixth hole H6 of the second heat dissipation part 330.

The upper portion 311 may be disposed on the outer side portion 335 of the second heat dissipation portion 330. In detail, the upper portion 311 may be disposed on an upper surface of the outer side portion 335 of the second heat dissipation portion 330.

In addition, the upper portion 311 may be disposed in the cavity 335a of the second heat dissipation part 330. The number of upper portions 311 and the number of cavities 335a may be the same.

Between the top 311 and the substrate 210 of the light source module 200, a heat sink (not shown) or heat dissipation grease (grease) for conducting heat from the light source module 200 to the top 311 can be disposed. have.

The lower portion 313 may be disposed inside the second heat dissipation portion 330. In detail, the lower portion 313 may be disposed in the first accommodating portion 333 of the second heat dissipating portion 330. When the lower portion 313 is disposed in the first accommodating portion 333 of the second heat dissipation portion 330, since the lower portion 313 of the metallic material is not disposed in the appearance of the lighting apparatus according to the first embodiment, the power supply is made. It can protect the user from the electrical energy generated in the study (400). Since the radiator of the conventional lighting device is entirely made of metal and the appearance of the existing lighting device is also metallic, electrical energy by the internal power supply unit may affect the user.

The lower portion 313 may be disposed between the inner portion 331 and the outer portion 335 of the second heat dissipation portion 330. When the lower portion 313 is disposed between the inner portion 331 and the outer portion 335 of the second heat dissipation portion 330, the lower portion 313 of the metallic material is not disposed on the exterior of the lighting apparatus according to the first embodiment. The user may be protected from electric energy generated by the power supply unit 400.

The lower portion 313 may have a hollow barrel shape. Alternatively, the lower portion 313 may have a pipe shape. Specifically, the lower portion 313 may have a cylindrical, elliptic or polygonal shape. The diameter of the lower portion 313 having a cylindrical shape may be constant. In detail, the diameter of the lower portion 313 may be constant from the upper end to the lower end. When the diameter of the lower portion 313 is constant, when manufacturing the lighting apparatus according to the first embodiment, the first heat dissipation portion 310 is coupled to the second heat dissipation portion 330 and the first heat dissipation portion 310 is formed. Separation from the second heat dissipation unit 330 may be easy.

The lower portion 313 may have a predetermined length along the length direction of the second heat dissipation portion 330. The length of the lower portion 313 may extend from the upper end to the lower end of the second heat dissipation part 330, or may extend only from the upper end to the middle part of the second heat dissipation part 330. Thus, the length of the lower portion 313 is not limited to that shown in the figure. As the length of the lower portion 313 is longer, heat dissipation performance may be further improved.

A pin or embossing structure may be further disposed on at least one of an outer surface or an inner surface of the lower portion 313. When the fin or embossing structure is disposed on the lower portion 313, the surface area of the lower portion 313 itself is widened, and thus, the heat dissipation area is increased. When the heat dissipation area is widened, the heat dissipation performance of the heat dissipator 300 may be improved.

The upper 311 and the lower 313 may be integral. In the present specification, the upper part 311 and the lower part 313 mean that the upper part 311 and the lower part 313 are respectively separate, and the joint part of the upper part 311 and the lower part 313 is welded, gluing, etc. Rather than being connected in a manner, it means that the upper portion 311 and the lower portion 313 are continuous in one without physical breakage. If the upper part 311 and the lower part 313 are integrated, the heat transfer rate from the upper part 311 to the lower part 313 is almost zero since the contact resistance between the upper part 311 and the lower part 313 is close to zero. There is a better advantage than not at all. In addition, if the upper portion 311 and the lower portion 313 are integrated, a process for combining the two with each other, for example, a press process or the like, is unnecessary, and thus there is an advantage of cost reduction in the manufacturing process.

The total surface area of the plurality of upper portions 311 may be equal to or greater than the surface area of the lower portion 313. Specifically, the total surface area of the plurality of upper parts 311 may be one or more times and two times or less based on the surface area of the lower part 313. If the total surface area of the plurality of upper portions 311 is less than one time based on the surface area of the lower portion 313, the total surface area of the upper portions 311 that receives heat directly from the light source module 200 is larger than the surface area of the lower portion 313. Since it is small, the heat transfer efficiency may be lowered. On the other hand, if the total surface area of the plurality of upper portions 311 exceeds twice the surface area of the lower portion 313, most of the heat is concentrated in the upper portion 311, the heat radiation efficiency may deteriorate.

The first heat dissipation part 310, that is, the upper part 311 and the lower part 313 may be manufactured by the following method.

A cylindrical aluminum (Al) pipe is prepared and the pipe is cut to the length desired by the designer. Then, the cutting is cut by one length from one end of the cut aluminum pipe in the other end direction. The cutting process is repeated according to the number of upper portions 311. Finally, when the cut portions of the aluminum pipe are folded outwardly, the first heat dissipation part 310 of the lighting apparatus according to the first embodiment may be manufactured.

The second heat dissipation unit 330 together with the cover 100 forms an exterior of the lighting apparatus according to the first embodiment, and may accommodate the first heat dissipation unit 310 and the power supply unit 400.

The first heat dissipation part 310 is disposed in the second heat dissipation part 330. In detail, the second heat dissipation part 330 may have a cavity 335a accommodating the upper portion 311 of the first heat dissipation part 310 and a first accommodating part 333 accommodating the lower part 313. The cavity 335a may be formed in plural to accommodate each of the plurality of upper portions 311, and the first accommodating part 333 may have an inner part 331 and an outer part 335 of the second heat dissipating part 330. As formed therebetween, it may have a predetermined depth as long as the length of the lower portion 313. The cavity 335a may be formed at the outer side portion 335 of the second heat dissipation portion 330.

The second heat dissipation part 330 may have a second accommodating part 331a accommodating the power supply part 400. Here, since the second accommodating part 331a is formed of a non-insulated resin material, unlike the accommodating part of the heat sink of the conventional lighting device, the power supply part 400 accommodated in the second accommodating part 331a is provided. Can be used as a non-insulated PSU. Since the non-insulated PSU is lower in cost than the insulated PSU, the manufacturing cost of the lighting apparatus according to the embodiment can be lowered.

The second heat dissipation part 330 may include an inner part 331, an outer part 335, and a connection part 337.

The inner part 331 of the second heat dissipation part 330 is surrounded by the first heat dissipation part 310. Here, the inner part 331 of the second heat dissipation part 330 has a shape corresponding to the external shape of the first heat dissipation part 310.

The substrate 210 of the light source module 200 is disposed on the inner part 331.

The inner part 331 may be disposed inside the lower part 313 of the first heat dissipation part 310 and may have a second accommodating part 331a for accommodating the power supply part 400.

The inner part 331 may have a fifth hole H5 through which the extension substrate 450 of the power supply part 400 disposed in the second accommodating part 331a passes.

A protrusion P1 inserted into the second hole H2 of the substrate 210 may be formed on an upper surface of the inner part 331.

The outer side part 335 of the second heat dissipation part 330 surrounds the first heat dissipation part 310. Here, the outer portion 335 of the second heat dissipation unit 330 may have a shape corresponding to the external shape of the first heat dissipation unit 310.

The upper part of the first heat dissipation part 310, the substrate 210 of the light source module 200, and the light emitting device 230 are sequentially disposed on the outer part 335.

The outer portion 335 may have a cavity 335a in which the upper portion 311 of the first heat dissipation portion 310 is disposed.

The outer portion 335 has a sixth hole H6 for fixing the upper portion 311 of the first heat dissipation portion 310 and a seventh hole H7 for fixing the substrate 210 of the light source module 200. Can be.

The outer portion 335 may have pins 335b. Since the fin 335b widens the surface area of the outer side portion 335 of the second heat dissipation portion 330, the heat dissipation performance of the heat dissipation member 300 may be improved.

The connection part 337 of the second heat dissipation part 330 may be connected to the lower ends of the inner part 331 and the outer part 335. The connection part 337 couples with the socket 500. The connection part 337 may have a thread structure corresponding to the screw groove formed in the socket 500. The connection part 337 may form the second accommodating part 331a together with the inner part 331.

The connection unit 337 may be coupled to the power supply unit 400 to fix the power supply unit 400 to the inside of the second storage unit 331a. Hereinafter, a description will be given with reference to FIG. 9.

9 is a view for explaining a coupling structure of the connection unit 337 and the power supply unit 400.

9, the connection part 337 has a fastening groove 337h. The fastening groove 337h has a predetermined diameter so that the protrusion 470 of the support substrate 410 can be inserted therein. The fastening groove 337h may be formed in accordance with the number of protrusions 470 of the support substrate 410.

The support substrate 410 of the power supply unit 400 has a protrusion 470 that is coupled to the fastening groove 337h of the connecting portion 337. The protrusion 470 may extend outwardly from both bottom edges of the support substrate 410. The protrusion 470 may have a shape in which the support substrate 410 is easily accommodated in the second accommodating part 331a, and conversely, the support substrate 410 may be difficult to escape from the second accommodating part 331a. For example, the protrusion 470 may have a hook shape.

When the protruding portion 470 of the supporting substrate 410 is coupled to the fastening groove 337h of the connecting portion 337, the supporting substrate 410 is hard to come out of the second accommodating portion 331a and the supporting substrate 410 is removed. The inside of the second accommodating part 331a may be firmly fixed. Therefore, no additional work, for example, a molding process of the power supply unit 400 is unnecessary, thereby reducing the manufacturing cost of the lighting apparatus.

1 to 5, the first accommodating part 333 of the second heat dissipating part 330 is formed between the inner part 331 and the outer part 335 of the second heat dissipating part 330. 1 The lower portion 313 of the heat dissipation unit 310 is accommodated. The first accommodating part 333 may have a predetermined depth as long as the length of the lower part 313 of the first heat dissipating part 310. Here, the first accommodating part 333 does not completely separate the inner part 331 and the outer part 335. That is, since the first accommodating part 333 is not formed at the lower end of the inner part 331 and the lower part of the outer part 335, the inner part 331 and the outer part 335 may be connected to each other.

After the first heat dissipation unit 310 and the second heat dissipation unit 330 are manufactured separately, the first heat dissipation unit 310 may be coupled to the second heat dissipation unit 330. Specifically, the lower part 313 of the first heat dissipation part 310 is inserted into the first accommodating part 333 of the second heat dissipation part 330, and the upper part 311 of the first heat dissipation part 310 is the second. After being inserted into the cavity 335a of the heat dissipation unit 330, the first heat dissipation unit 310 and the second heat dissipation unit 330 may be coupled to each other through an adhesive process or a fastening process.

Meanwhile, the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrally formed, and separation of the first heat dissipation unit 310 and the second heat dissipation unit 330 coupled to each other may be limited. Specifically, the first heat dissipation unit 310 and the second heat dissipation unit 330 are fixed to each other as a result of a predetermined process. Therefore, the first heat dissipation unit 310 and the second heat dissipation unit 330 are difficult to separate from each other. 3 to 4 illustrate that the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated from each other for convenience of description. In the present specification, the first heat dissipation part 310 and the second heat dissipation part 330 are integrally formed, or the fact that the separation is limited does not mean that they are not separated from each other by any force, but rather are relative to human forces. It is possible to separate by a large predetermined force, for example, a mechanical force, but if the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated by the predetermined force, It should be understood as meaning that it is difficult to return to a state.

When the first heat dissipation part 310 and the second heat dissipation part 330 are integrally formed or when the first heat dissipation part 310 and the second heat dissipation part 330 are restricted from being separated, the first heat dissipation of a metal material The contact resistance between the part 310 and the second heat dissipation part 330 of the resin material may be lower than that when the first heat dissipation part 310 and the second heat dissipation part 330 are not integrated. Since the contact resistance is lowered, the same or similar heat dissipation performance as that of the conventional heat dissipator (the whole is made of metal) can be ensured. In addition, when the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrated, the second heat dissipation unit due to external impact is more effective than when the first heat dissipation unit 310 and the second heat dissipation unit 330 are not integrated. Damage or damage to the 330 can be further reduced.

In order to integrally form the first heat dissipation unit 310 and the second heat dissipation unit 330, an insert injection molding method may be used. In the insert injection processing method, the first heat dissipation part 310 prepared in advance is put into a mold (frame) for molding the second heat dissipation part 330, and then the material constituting the second heat dissipation part 330 is melted. It is a method of inserting into the mold and injection.

<Power supply unit 400>

The power supply unit 400 may include a support substrate 410 and a plurality of components 430.

The support substrate 410 may have a printed pattern that mounts the plurality of components 430, receives a power signal provided through the socket 500, and provides a predetermined power signal to the light source module 200.

The support substrate 410 may have a rectangular plate shape. The support substrate 410 is accommodated in the second accommodating part 331a of the second heat dissipating part 330. Specifically, it will be described with reference to FIGS. 10 to 11.

10 to 11 are views for explaining the coupling structure of the support substrate 410 and the heat sink 300.

10 to 11, the first and second guide parts 338a and 338b for guiding one side of the support substrate 410 on both sides are respectively inside the second accommodating part 331a of the heat dissipator 300. Can have A guide groove 338g into which one side of the support substrate 410 is inserted may be formed between the first guide part 338a and the second guide part 338b.

The intervals W1 and W2 between the first guide part 338a and the second guide part 338b may become narrower as they enter the second accommodating part 331a. Alternatively, the diameters W1 and W2 of the guide groove 338g may be narrower as they enter the second accommodating part 331a. When the gaps W1 and W2 or the diameters W1 and W2 of the guide grooves 338g between the first guide part 338a and the second guide part 338b become narrower as they enter the second accommodating part 331a. In this case, the process of inserting the support substrate 410 into the second accommodating portion 331a may be facilitated, and the support substrate 410 may be precisely coupled to the inside of the radiator 300.

At the entrance of the second accommodating part 331a, the interval W1 between the first guide part 338a and the second guide part 338b is easy to insert the support substrate 410 into the second accommodating part 331a. In order to improve the working efficiency of the operator, the thickness of the support substrate 410 may be larger than the value added by 1mm. That is, the distance between one surface of the support substrate 410 and the first guide portion 338a may be 0.5 mm or more.

On the bottom surface of the second accommodating portion 331a, the gap W2 between the first guide portion 338a and the second guide portion 338b is used to accurately position the supporting substrate 410 at the designed position. It is better than the thickness of 410 and less than the thickness of the support substrate 410 plus 0.1mm. That is, the distance between one surface of the support substrate 410 and the first guide portion 338a is preferably 0.05 mm or less.

A connection groove 337h into which the protrusion 470 of the support substrate 410 is inserted is formed between the first guide part 338a and the second guide part 338b. A connection groove 337h is formed between the first guide portion 338a and the second guide portion 338b, so that the support substrate 410 can be disposed at a more accurate position, and the separation of the support substrate 410 can be prevented. Can be.

The support substrate 410 may include an extension 450. The extension part 450 extends from the upper end of the support substrate 410 to the outside, passes through the fifth hole H5 of the heat sink 300 and the first hole H1 of the substrate 210, and then solders. The process is electrically connected to the substrate 210.

The support substrate 410 may include a protrusion 470. The protrusion 470 extends outward from both sides of the lower end of the support substrate 410, and is coupled to the connection part 337 of the heat sink 300.

The plurality of components 430 are mounted on the support substrate 410. The plurality of components 430 may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling driving of the light source module 200, and a light source module 200 to protect the light source module 200. An electrostatic discharge (ESD) protection element may be included, but is not limited thereto.

The power supply unit 400 may be a non-insulated PSU since the inner walls defining the second accommodating part 331a of the second heat dissipation part 330 are an insulating material, for example, a resin material. If the power supply unit 400 is a non-insulated PSU, the manufacturing cost of the entire lighting device may be lowered.

<Socket 500>

The socket 500 is coupled to the connection portion 337 of the heat sink 300 and electrically connected to the power supply unit 400. The socket 500 delivers external AC power to the power supply unit 400.

The socket 500 may be the same size and shape as a socket of a conventional incandescent bulb. Since the socket 500 is the same size and shape as the socket of the conventional incandescent bulb, the lighting device according to the first embodiment can replace the conventional incandescent bulb.

2nd embodiment

12 is a perspective view from above of the lighting apparatus according to the second embodiment, FIG. 13 is a perspective view from below of the lighting apparatus shown in FIG. 12, FIG. 14 is an exploded perspective view of the lighting apparatus illustrated in FIG. 12, and FIG. 15 is an exploded perspective view of the lighting device shown in FIG. 13, and FIG. 16 is a cross-sectional view of the lighting device shown in FIG. 12.

In the lighting apparatus according to the second embodiment shown in FIGS. 12 to 16, the same components as those of the lighting apparatus according to the first embodiment shown in FIGS. 1 to 5 used the same reference numerals. Therefore, in the lighting apparatus according to the second embodiment illustrated in FIGS. 12 to 16, detailed descriptions of the same components as the lighting apparatus according to the first embodiment illustrated in FIGS. 1 to 5 are replaced with those described above. In the following, the heat sink 300 'will be described in detail. In the description of the heat dissipation body 300 ', the description will be made mainly on a part distinguished from the heat dissipation body 300 according to the first embodiment, and the characteristics of the heat dissipation body 300 according to the first embodiment are the second embodiment. It should be understood that the heat sink 300 'according to the shape is included as it is. In addition, the lighting apparatus according to the second embodiment illustrated in FIGS. 12 to 16 may further include the matters illustrated in FIGS. 6 to 11.

The heat sink 300 'includes a first heat dissipation part 310' and a second heat dissipation part 330 '. The first heat dissipation part 310 ′ includes an upper part 311 ′ and a lower part 313 ′, and the second heat dissipation part 330 ′ has an inner part 331 ′, a first accommodating part 333 ′, and an outer part ( 335 ') and connector 337.

The substrate 210 of the light source module 200 is disposed on the upper portion 311 ′ of the first heat radiating part 310 ′. The upper portion 311 ′ may have a flat circular plate shape. However, the present invention is not limited thereto, and the upper portion 311 ′ may be convex upward or downward, and the upper portion 311 ′ may be elliptical or polygonal.

The upper portion 311 ′ is disposed on the inner portion 331 ′ of the second heat dissipation portion 330 ′. The upper portion 311 ′ may have an eighth hole H8 through which the extension substrate 450 of the power supply unit 400 passes.

The lower portion 313 ′ of the first heat dissipation part 310 ′ may be a plate having a predetermined length. The top width and the bottom width of the lower portion 313 ′ may be different from each other. In detail, the upper width of the lower portion 313 ′ may be greater than the lower width of the lower portion 313 ′. If the upper width of the lower portion 313 'is larger than the lower width of the lower portion 313', the shapes of the plurality of lower portions 313 'may correspond to the shape of the outer portion 335' of the second heat dissipation portion 330 '. have.

The lower portion 313 'extends downward from the edge of the upper portion 311', and may be plural. The plurality of lower portions 313 'may be spaced apart from each other, and a predetermined gap 313d' may be formed between two adjacent lower portions 313 '. The gap 313d 'may be generated during the manufacturing of the first heat dissipation part 310'. If the lower part of the first heat dissipation part without the gap 313d 'needs to be manufactured, a drawing process in which manufacturing cost and time are not required is small, and the lower part 313' of the first heat dissipation part 310 'is a gap 313d. ') Has a merit that the lower portion 313' of the first heat dissipation part 310 'can be manufactured by a bending method that requires less cost and time. In detail, the method of manufacturing the first heat dissipation part 310 ′ will be described in detail. After manufacturing the developed view of the upper part 311 ′ and the plurality of lower parts 313 ′ in the aluminum disc, the plurality of lower parts 313 ′ may be prepared. Can be bent and produced.

The plurality of lower portions 313 'and the gaps 313d' may implement a cylindrical shape having different diameters between the upper end and the lower end.

The number of lower portions 313 'may vary depending on the shape and size of the upper portion 311'. For example, if the shape of the upper portion 311 ′ is circular as shown in the drawing, an appropriate number of lower portions 313 ′ may be selected according to its size, and if the shape of the upper portion 311 ′ is polygonal, The number of lower portions 313 'may be selected according to the number of sides.

The surface area of the upper portion 311 ′ may be equal to or greater than the total surface area of the plurality of lower portions 313 ′. In detail, the surface area of the upper portion 311 ′ may be one or more times and two times or less based on the total surface area of the plurality of lower portions 313 ′. When the surface area of the upper portion 311 ′ is less than 1 times based on the total surface area of the plurality of lower portions 313 ′, the surface area of the upper portion 311 ′ that receives heat directly from the light source module 200 is provided in the plurality of lower portions 313. Since it is smaller than the total surface area of the ') s, the heat transfer efficiency may be degraded. On the other hand, if the surface area of the upper portion 311 ′ exceeds twice the total surface area of the plurality of lower portions 313 ′, most of the heat is concentrated in the upper portion 311, which may lower heat dissipation efficiency.

The lower portion 313 'is accommodated in the first accommodating portion 333' of the second heat dissipation portion 330 '.

The shape of the lower portion 313 ′ may correspond to the outer surface shape of the outer portion 335 ′ of the second heat dissipation portion 330 ′. In detail, the lower portion 313 ′ may have a predetermined curvature according to the shape of the outer portion 335 ′. The lower portion 313 ′ may be disposed adjacent to the outer side portion 335 ′ of the second heat dissipation portion 330 ′ as illustrated in FIG. 16.

If the shape of the lower portion 313 'corresponds to the outer surface shape of the outer portion 335' of the second heat dissipation portion 330 ', and the lower portion 313' is disposed adjacent to the outer portion 335 ', the lower portion 313' ), The heat radiation path from the outer surface 335 'to the outer surface is shortened, so that the heat radiation performance of the heat radiation body 300' can be further improved.

The lower portion 313 ′ may have a thickness of 1.0 T (mm) or more and 2.0 T or less. When the thickness of the lower portion 313 'is 1.0 T or more and 2.0 T or less, the formability of the lower portion 313' has the best advantage. That is, when the thickness of the lower portion 313 'is thinner than 1.0T or thicker than 2.0T, it may be difficult to process the lower portion 313' and it may be difficult to maintain the shape of the lower portion 313 '.

The thickness of the outer portion 335 ′ may be 0.5 T or more and 2.0 T or less. If the thickness of the outer portion 335 'is less than 0.5T, the lower portion 313' of the first heat dissipation portion 310 'and the external heat dissipation path become thinner, so that the withstand voltage characteristics deteriorate and the flame retardant grade ), There is a problem that is difficult to match, and if the thickness of the outer portion 335 'is thicker than 2.0T, there is a problem that the heat dissipation performance of the heat sink 300' is inferior.

The ratio of the thickness of the lower portion 313 ′ of the first heat dissipation portion 310 ′ and the thickness of the outer portion 335 ′ of the second heat dissipation portion 330 ′ may be 1: 1 or more and 2: 1 or less. If the thickness of the lower portion 313 'of the first heat dissipation portion 310' is thinner than the thickness of the outer portion 335 'of the second heat dissipation portion 330', the heat dissipation performance of the heat dissipation member 300 'is poor. When the thickness of the lower portion 313 'of the first heat dissipation portion 310' is greater than twice the thickness of the outer portion 335 'of the second heat dissipation portion 330', the withstand voltage characteristics deteriorate. There is.

Although not illustrated in the drawing, the outer portion 335 ′ of the second heat dissipation portion 330 ′ may have a fin 335b illustrated in FIGS. 1 to 5.

The substrate 210, the first heat dissipation part 310 ′, and the second heat dissipation part 330 ′ of the light source module 200 may be coupled to each other using a fastening means (not shown) such as a screw. Specifically, the fastening means is connected to the third hole H3 of the substrate 210, the fourth hole H4 of the first heat dissipation part 310 ′, and the sixth hole H6 of the second heat dissipation part 330 ′. By combining, the substrate 210, the first heat dissipation part 310 ′, and the second heat dissipation part 330 ′ of the light source module 200 may be firmly coupled to each other.

The first heat dissipation unit 310 ′ and the second heat dissipation unit 330 ′ are integrally formed, and separation of the first heat dissipation unit 310 ′ and the second heat dissipation unit 330 ′ coupled to each other may be restricted. . Specifically, the first heat dissipation unit 310 'and the second heat dissipation unit 330' are fixed to each other as a result of a predetermined process. Therefore, the first heat dissipation part 310 'and the second heat dissipation part 330' are hardly separated from each other. 14 to 15, the first heat dissipation part 310 ′ and the second heat dissipation part 330 ′ are separated from each other for convenience of description.

If the first heat dissipation unit 310 'and the second heat dissipation unit 330' are integrally formed, or if the separation of the first heat dissipation unit 310 'and the second heat dissipation unit 330' is restricted, the metal material Contact resistance between the first heat dissipation unit 310 ′ and the second heat dissipation unit 330 ′ of the resin material is greater than that of the first heat dissipation unit 310 ′ and the second heat dissipation unit 330 ′. Can be lowered. Since the contact resistance is lowered, the same or similar heat dissipation performance as that of the conventional heat dissipator (the whole is made of metal) can be ensured. In addition, when the first heat dissipation unit 310 'and the second heat dissipation unit 330' are integrated together, the first heat dissipation unit 310 'and the second heat dissipation unit 330' may not be integrated. Damage or damage to the second heat dissipation unit 330 'may be further reduced.

In order to integrally form the first heat dissipation unit 310 ′ and the second heat dissipation unit 330 ′, an insert injection molding method may be used.

Although the above has been described with reference to the embodiments, these are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains are not illustrated above in the range without departing from the essential characteristics of the present embodiment. It will be understood that various modifications and applications are possible. For example, each component specifically shown in embodiment can be modified and implemented. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100: cover
200: light source module
300, 300 ': radiator
400: power supply unit
500: socket

Claims (16)

A heat sink comprising a first heat dissipation unit having a first heat conductivity and a second heat dissipation unit coupled to the first heat dissipation unit and having a second heat conductivity; And
And a light source module disposed on the heat sink and including a substrate and a plurality of light emitting elements disposed on the substrate.
The first thermal conductivity is greater than the second thermal conductivity,
The second heat dissipation part has an inner part, an outer part surrounding the inner part, a connection part connected to a lower end of the inner part and the outer part, and a first accommodating part formed between the inner part and the outer part,
The first heat dissipation part includes a plurality of upper parts disposed on an outer side of the second heat dissipation part and the light source module is disposed, and a lower part disposed on the first accommodating part of the second heat dissipation part.
The outer side of the second heat dissipation unit has a plurality of cavities, each receiving a plurality of upper portions of the first heat dissipation unit. The method of claim 1,
A power supply unit disposed inside the heat sink and providing power to the light source module;
The inner side of the second heat dissipating unit further includes a second accommodating unit accommodating the power supply unit. A heat sink comprising a first heat dissipation part of a non-insulating material and a second heat dissipation part of an insulating material;
A light source module including a substrate and a plurality of light emitting elements disposed on the substrate; And
A power supply unit disposed inside the heat sink and providing a power signal to the light source module;
The second heat dissipation part includes an inner part accommodating the power supply part, an outer part surrounding the inner part, and a connection part connected to a lower end of the inner part and the outer part,
The first heat dissipation part includes a lower part disposed between an inner part of the second heat dissipation part and an outer part of the second heat dissipation part, and a plurality of upper parts disposed on an outer part of the second heat dissipation part.
The outer side of the second heat dissipation unit has a plurality of cavities, each receiving a plurality of upper portions of the first heat dissipation unit. The method according to claim 1 or 3,
The substrate is disposed on an inner side of the second heat dissipation unit,
On the outer side of the second heat dissipation portion, the upper portion of the first heat dissipation portion, the substrate of the light source module and the plurality of light emitting elements are sequentially arranged. The method according to claim 1 or 3,
A lower portion of the first heat dissipation portion is a hollow cylinder, and the plurality of upper portions of the first heat dissipation portion extend in a direction perpendicular to the lower portion at an upper end of the cylinder. delete delete The method according to claim 1 or 3,
And the number of the plurality of light emitting elements is less than or equal to the number of the plurality of upper portions of the first heat dissipation unit. The method according to claim 1 or 3,
Wherein the total surface area of the plurality of upper portions of the first heat dissipation portion is equal to or greater than the surface area of the lower portion of the first heat dissipation portion. delete delete The method according to claim 1 or 3,
Lighting device of the first heat dissipation portion and the second heat dissipation portion is limited. delete delete delete The method according to claim 1 or 3,
The outer side of the second heat dissipating unit further includes a plurality of fins.

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