KR102042617B1 - 점착제 조성물 및 이로부터 형성되는 점착 패턴 - Google Patents
점착제 조성물 및 이로부터 형성되는 점착 패턴 Download PDFInfo
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- KR102042617B1 KR102042617B1 KR1020170017951A KR20170017951A KR102042617B1 KR 102042617 B1 KR102042617 B1 KR 102042617B1 KR 1020170017951 A KR1020170017951 A KR 1020170017951A KR 20170017951 A KR20170017951 A KR 20170017951A KR 102042617 B1 KR102042617 B1 KR 102042617B1
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- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
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- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
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- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
패턴형성 | 점착력 | |
실시예 1 | ○ | 강점착 |
실시예 2 | ○ | 강점착 |
비교예 1 | ○ | 불량 (접합이 되지 않음) |
비교예 2 | × | 약점착 |
비교예 3 | × | 약점착 |
Claims (10)
- 아크릴계 공중합체;
다관능 아크릴레이트계 화합물; 및
광개시제를 포함하고,
상기 아크릴계 공중합체는 Tg가 -20℃ 이하인 아크릴레이트계 단량체 유래의 반복단위 및 불포화 카르복시산 단량체 유래의 반복단위를 포함하며,
상기 아크릴계 공중합체 전체 100 중량부에 대하여 상기 불포화 카르복시산 단량체 유래의 반복단위는 10 내지 50 중량부로 포함되는 패턴 형성용 점착제 조성물. - 제1항에 있어서,
상기 다관능 아크릴레이트계 화합물은 분자 내에 2 이상의 제1 광경화성 관능기; 및
산기 및 에틸렌글리콜기로 이루어진 군에서 선택되는 1 이상의 관능기를 포함하는 것인 패턴 형성용 점착제 조성물. - 제1항에 있어서,
상기 아크릴계 공중합체는 중량평균분자량이 1만 내지 10만인 것인 패턴 형성용 점착제 조성물. - 제1항에 있어서,
상기 아크릴계 공중합체 전체 100 중량부에 대하여 상기 아크릴레이트계 단량체 유래의 반복단위는 50 내지 90 중량부로 포함되는 것인 패턴 형성용 점착제 조성물. - 제1항에 있어서,
상기 아크릴계 공중합체는 제2 광경화성 관능기를 더 포함하는 것인 패턴 형성용 점착제 조성물. - 제6항에 있어서,
상기 제2 광경화성 관능기는 상기 아크릴계 공중합체 내 전체 반복단위 100 중량부에 대하여 1 내지 20 중량부로 포함되는 것인 패턴 형성용 점착제 조성물. - 제1항에 있어서,
상기 다관능 아크릴레이트계 화합물은 상기 점착제 조성물 전체 100 중량부에 대하여 10 내지 60 중량부로 포함되는 것인 패턴 형성용 점착제 조성물. - 제1항 내지 제8항 중 어느 한 항에 따른 패턴 형성용 점착제 조성물의 경화물을 포함하고, Tg가 0℃ 이하인 점착 패턴.
- 제9항에 있어서,
상기 점착 패턴은 포토레지스트 패턴인 것인 점착 패턴.
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KR1020170017951A KR102042617B1 (ko) | 2017-02-09 | 2017-02-09 | 점착제 조성물 및 이로부터 형성되는 점착 패턴 |
TW107103986A TW201835275A (zh) | 2017-02-09 | 2018-02-05 | 壓敏性黏著劑組成物及從該組成物形成之壓敏性黏著劑圖案 |
CN201810121428.XA CN108410368B (zh) | 2017-02-09 | 2018-02-07 | 压敏粘合剂组合物以及由其形成的压敏粘合剂图案 |
JP2018020893A JP2018127621A (ja) | 2017-02-09 | 2018-02-08 | 粘着剤組成物及びそれによって形成される粘着パターン |
US15/893,267 US10336924B2 (en) | 2017-02-09 | 2018-02-09 | Pressure sensitive adhesive composition and pressure sensitive adhesive pattern formed therfrom |
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JP (1) | JP2018127621A (ko) |
KR (1) | KR102042617B1 (ko) |
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CA2115673C (en) * | 1991-09-12 | 2003-04-08 | Clyde D. Calhoun | Patterned pressure sensitive adhesive transfer tape |
JP2922036B2 (ja) * | 1991-10-31 | 1999-07-19 | 日東電工株式会社 | 耐熱性にすぐれた感圧性接着剤およびその接着シート類の製造方法 |
US5415971A (en) * | 1993-04-02 | 1995-05-16 | The Chromaline Corporation | Photoresist laminate including photoimageable adhesive layer |
KR100238332B1 (ko) | 1995-11-28 | 2000-07-01 | 구광시 | 감광성 수지 조성물 |
KR0150344B1 (ko) | 1995-12-21 | 1998-10-01 | 이웅열 | 감광성 수지 조성물 |
JP4636513B2 (ja) * | 1996-05-30 | 2011-02-23 | 日東電工株式会社 | 熱硬化型感圧性接着剤とその接着シ―ト類 |
KR100476798B1 (ko) * | 1996-05-30 | 2006-01-27 | 닛토덴코 가부시키가이샤 | 열경화형감압성접착제와이의접착시트류 |
KR100247706B1 (ko) | 1997-11-07 | 2000-06-01 | 구광시 | 드라이 필름 포토레지스트 |
JP2001240842A (ja) * | 2000-02-28 | 2001-09-04 | Nitto Denko Corp | 紫外線硬化型粘着剤組成物とその粘着シ―ト類 |
JP5137662B2 (ja) * | 2008-03-31 | 2013-02-06 | 富士フイルム株式会社 | 硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子 |
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