KR102023772B1 - electronic device of lamination structure based on through poles - Google Patents

Abstract

The present invention is in the field of fast-changing hybrid (eg IoT sensor) electronic device (eg, set-top box) by additionally stacking one or more sub-function boards while maintaining the main board pattern of the proven standard mounted on the electronic device. As a technology for optimum compatibility, one or more sub-function boards equipped with separate function chips (e.g. IoT chips) are stacked on the main board mounted in the electronic device, and each sub-function board and the main board are continuously penetrated. And a through-pole group for energizing, thereby ensuring fast response of signals / data transmitted and received between the main board and the sub function board and improving power consumption. According to the present invention, there is also an advantage of having a concise appearance of the board by eliminating wire bonding as in the conventional interface between boards.

Description

Electronic device of lamination structure based on through poles}

The present invention is in the field of fast-changing hybrid (eg IoT sensor) electronic device (eg, set-top box) by additionally stacking one or more sub-function boards while maintaining the main board pattern of the proven standard mounted on the electronic device. The present invention relates to a technique for optimum compatibility.

More specifically, the present invention stacks one or more sub-function boards equipped with a separate function chip (eg IoT chip) with respect to the main board mounted in the electronic device, and continuously penetrates and passes each sub-function board and the main board. By providing a through-pole group that is energized, it is a technology for ensuring fast response of signals / data transmitted and received between the main board and the sub function board and improving power consumption.

FIG. 1 is an exemplary view showing a general PCB installed in an electronic device, and FIG. 2 is an exemplary view showing a state in which a piece board is mounted in FIG.

First, referring to FIG. 1, a main board 10 mounted in an electronic device includes a plurality of function chips 11a through 11e corresponding to various operations that an electronic device should basically perform.

Here, the main board 10 has been improved for a long time to have a pattern that has been verified in the standard and function of the electronic device.

However, since electronic devices (eg, set-top boxes and home gateways) that perform such specific functions have recently been incorporating various hybrid functions (eg, IoT sensors), they have maintained the standard of the main board 10 that has been verified. It's hard to add new hybrid features in a state.

As a result, as shown in FIG. 2, the fragment boards 21 and 22 equipped with the separate functional chips 21a to 21c and 22a to 22c which are in charge of the hybrid function while maintaining the specifications of the main board 10 as they are. ) Is mounted on top of the main board (10).

However, in order to add a hybrid function (for example, an IoT chip) that develops very quickly in a short time, a technology of bonding the plurality of pieces of boards 21 and 22 to the wires 21c and 22c on the main board 10 is very limited. There is a problem.

For example, wire bonding the piece boards 21 and 22 to the main board 10 has a problem that the board itself becomes very dizzy, and wire bonding between the boards has a connector and a piece board 21 and 22 of the main board 10. ), There is a disadvantage that it is impossible to secure fast response between boards because the communication speed must go through a connector of a very limited type.

In addition, if the length of the wire connecting the main board 10 and the piece boards 21 and 22 becomes longer, the operation clock speed transmitted from the main board 10 to the pieces boards 21 and 22 cannot be increased, so the quick response is possible even here. There is a problem in that it is not possible to secure the castle, the length of the wire connecting the main board 10 and the piece board (21, 22) has a disadvantage in that the power consumption increases in proportion to it.

SUMMARY OF THE INVENTION The present invention has been proposed in view of the above, and an object of the present invention is to provide a method for efficiently arranging a sub-function board having a rapidly changing hybrid function with respect to a main board of a predetermined pattern mounted on a specific electronic device. An electronic device having a pole-based PCB stack structure is provided.

In addition, an object of the present invention is to provide an electronic device having a through-pole based PCB laminated structure that can ensure a quick response by eliminating the same connector in the board-to-board communication interface.

In addition, an object of the present invention is to implement a communication interface between the main board and the sub-function board in the form of a through-pole to ensure fast response between boards and to reduce the power consumption of electronics having a through-pole based PCB laminated structure In providing a device.

In order to achieve the above object, an electronic device having a through-pole based PCB stacking structure according to the present invention includes a main board on which one or more function chips for controlling the operation of the electronic device are patterned and mounted on the electronic device; A sub function board group including one or more sub function boards on which one or more function chips for controlling the operation of the electronic device are patterned and stacked on the main board; And a through-pole group having one or more power through-poles for continuously supplying and energizing the main board and the sub-function board group to supply power from the main board to the sub-function board group.

The through-pole group may further include one or more signal through-poles for continuously passing and energizing the main board and the sub-function board group to transfer signals or data transmitted and received between the main board and the sub-function board. have.

On the other hand, the sub-function board group is configured to include a plurality of sub-function board, the insulating sheet is inserted between the main board and the sub-function board and between the sub-function board to insulate adjacent boards; The plurality of sub-function boards may be stacked in a plurality of stages on one surface of the main board to form a fixed state with the through-pole group, and may be configured to selectively connect electrical lines to power through poles and signal through poles in the through pole group. .

On the other hand, the sub-function board group comprises a plurality of sub-function boards, each spacer is inserted into a through-pole group corresponding between the main board and the sub-function board and between the sub-function boards to insulate adjacent boards; The plurality of sub-function boards are stacked in a plurality of stages on one surface of the main board to form a fixed state with the through-pole group, and optionally the electric line for the power through pole and signal through pole in the through pole group. It can be configured to be connected.

In addition, the sub-function board group is preferably configured to selectively respond to signals or data provided from the main board.

In addition, the sub-function board group may be configured to include one or more of the Bluetooth engraving board, WLAN engraving board, Zigbee carving board, Z-wave carving board, hard disk controller slice board, IoT communication slice board.

According to the present invention, since one or more sub-function boards stacked on the main board communicate with each other as one or more through poles pass through and conduct electricity, the present invention exhibits advantages of ensuring fast response between boards and reducing power consumption.

In addition, the present invention also shows the advantage that can be secured faster response by eliminating the same connector as the existing in the board-to-board communication interface.

In addition, the present invention also shows the advantage of having a concise appearance of the board by eliminating the wire bonding as in the conventional interface between boards.

In addition, the present invention also provides an advantage that the internal space of the electronic device can be efficiently utilized by efficiently arranging the main board and the plurality of sub-function boards.

In addition, the present invention also shows the advantage that the external shape of the electronic device can be variously implemented by stacking the main board and the sub-function board group through the through-pole group. (In other words, in the prior art, the shape of the electronic device should be configured in a horizontally or vertically oriented shape, and if it is made in another shape, the space waste factor is very cut.)

1 is an exemplary view showing a general PCB installed in the electronic device,
FIG. 2 is an exemplary view showing a state in which a engraving board is mounted in FIG. 1;
3 is an exploded perspective view showing a group of sub-function boards stacked on the main board according to the present invention;
4 is an exploded perspective view showing a state where the through-pole group penetrates the main board and the sub function board of FIG. 3;
5 is a cross-sectional view showing a part of the combined state of [4],
6 is an exemplary view showing a state in which an insulation sheet is stacked between a main board and a sub function board of FIG. 5 and a sub function board according to the first embodiment of the present invention;
FIG. 7 is a diagram illustrating a state in which spacers are respectively sandwiched in a through-pole group corresponding between a main board and a sub function board and a sub function board of FIG. 5 according to the second embodiment of the present invention. ,

Hereinafter, the present invention will be described in detail with reference to the drawings.

3 is an exploded perspective view illustrating a sub-function board group stacked on a main board according to the present invention, and FIG. 4 shows a state where the through-pole group penetrates the main board and the sub-function board of FIG. 3. 5 is an exploded perspective view showing, and [FIG. 5] is a cross-sectional view showing a part of the combined state of [FIG. 4].

3 to 5, an electronic device having a through-pole based PCB stacking structure according to the present invention includes a main board 110, a sub-function board group, and a through pole group 130. do.

The main board 110 is patterned with one or more function chips 111a to 111c for controlling the operation of the electronic device (eg, set-top box) and mounted on the electronic device.

On the other hand, since the main board 110 has been improved for a long time and has a proven pattern in its specifications and functions for the corresponding electronic device, the standard at that time in response to a rapidly changing hybrid function (for example, an IoT chip) It is in an environment that is difficult to change.

That is, in order to overcome the limitations of the main board 110, the main board 110 needs to include a sub function board mounted with a separate function chip. For this purpose, the sub function board group preferably includes a plurality of sub function boards. The sub function boards 121 to 126 are configured to be included.

Here, the sub-function board group may include one or more of a Bluetooth engraving board, a WLAN engraving board, a Zigbee carving board, a wave wave carving board, a hard disk controller carving board, IoT communication slice board.

Meanwhile, the function chips 121a to 126c mounted on each of the sub function boards 121 to 126 are configured to perform a corresponding hybrid function (for example, IoT function) which is in charge of each electronic device.

In addition, the plurality of sub-function boards 121 to 126 employed for the main board 110 is a very important issue that does not significantly increase the power consumption while maintaining fast response in relation to the main board 110.

To this end, the through-pole group 130 continuously penetrates and energizes the main board 110 and the sub-function board group to provide a power through-pole 131 for supplying power to the sub-function board group from the main board 110. One or more.

The through-pole group 130 continuously passes and energizes the main board 110 and the sub function board group to transmit and receive signals or data transmitted and received between the main board 110 and the sub function boards 121 to 126. It further comprises one or more signal through poles 132 to transmit.

As such, the through-pole group 130 penetrates and energizes one or more sub-function boards 121 to 126 stacked on the main board 110 to communicate with each other, thereby communicating the main board 110 and the sub-function boards 121 to 126. It is possible to reduce the power consumption while ensuring quick response time between

For example, shortening the length of the connection line connecting the main board 110 and each sub function board 121 to 126 increases the operation clock speed transmitted from the main board 110 to each sub function board 121 to 126. As a result, fast response can be secured, and a shorter connection line connecting the main board 110 and the sub function boards 121 to 126 reduces power consumption in proportion thereto.

In addition, by removing the same connector from the communication interface between the main board 110 and the sub-function board (121 ~ 126) it can also ensure a faster response.

Meanwhile, the signal through pole 132 may be divided into an address line and a data line. The address line indicates a path through which the controller mounted on the main board 110 transmits a designated signal to the plurality of sub function boards 121 to 126.

The data line is configured such that the sub-function board corresponding to the designation signal transmitted through the address line outputs an electrical signal and responds to the designation signal through the address line.

On the other hand, the sub-function boards 121 to 126 belonging to the sub-function board group may be configured to selectively react by identifying signals or data provided from the main board 110, respectively.

In detail, each of the sub-function boards 121 through 126 is connected to the board through a function chip mounted on the board and electrical line patterning of the through-pole group 130 penetrating to the board. Unnecessary through poles can be held fixed by soldering only.

As a result, each of the sub-function boards 121 to 126 identifies and responds to signals or data transmitted through the through-poles patterned by the electric chip and the function chip mounted on the board of the through-pole group 130 penetrating the board. Done.

FIG. 6 is an exemplary diagram illustrating a state in which insulating sheets are stacked between the main board and the sub function board of FIG. 5 and the sub function boards according to the first embodiment of the present invention.

Referring to FIG. 6, as a first embodiment of the present invention, the sub function board group may include a plurality of sub function boards 121 to 126, and may further include an insulating sheet 140. have.

The insulating sheet 140 is inserted between the main board 110 and the sub function board 121 and the sub function boards 121 to 126 to insulate the boards adjacent to each other. As a result, the main board 110 and each of the sub-function boards 121 to 126 are energized only through the through-pole group 130 and signal or data transmission is performed.

At this time, the plurality of sub-function boards 121 to 126 are stacked in a plurality of stages on one surface of the main board 110 to form a fixed state with the through-pole group 130 and the power through-pole in the through-pole group 130 ( An electrical line is optionally connected to 131 and signal through pole 132.

That is, each sub-function board 121 through 126 is a through-pole necessary for its board among the through-pole groups 130 penetrating to its own board, and is connected to the functional chip mounted on its board by electric line patterning, and is unnecessary for its own board. Through-poles can remain fixed by soldering only.

FIG. 7 is a diagram illustrating a state in which spacers are respectively sandwiched in a through-pole group corresponding between a main board and a sub function board and a sub function board of FIG. 5 according to the second embodiment of the present invention. to be.

Referring to FIG. 7, as a second embodiment of the present invention, the sub-function board group may include a plurality of sub-function boards 121 to 126, and may further include a spacer 150. .

The spacer 150 is inserted into the through-pole group 130 corresponding to each other between the main board 110 and the sub function board 121 and between the sub function boards 121 to 126 to insulate the boards adjacent to each other.

That is, the spacer 150 supports the empty space while maintaining the empty space between the main board 110 and the sub function board 121 and the sub function boards 121 to 126.

Here, the main board 110 and each of the sub-function boards 121 to 126 are energized through the through-pole group 130 and a signal or data transmission is performed through the through-pole group 130.

At this time, the plurality of sub-function boards 121 to 126 are stacked in a plurality of stages on one surface of the main board 110 to form a fixed state with the through-pole group 130 and the power-through pole in the through-pole group 130. An electrical line is optionally connected to 131 and signal through pole 132.

That is, each sub-function board 121 through 126 is a through-pole necessary for its board among the through-pole groups 130 penetrating to its own board, and is connected to the functional chip mounted on its board by electric line patterning, and is unnecessary for its own board. Through-poles can remain fixed by soldering only.

10: main board
11a ~ 11e: function chip
12a to 12c: connector
21, 22: engraving board
21a, 21b, 22a, 22b: function chip
21c, 22c: wire
110: main board
111a ~ 111c: function chip
121 ~ 126: Sub function board
121a ~ 121c: function chip
122a to 122c: function chip
123a ~ 123c: function chip
124a ~ 124c: function chip
125a ~ 125c: function chip
126a ~ 126c: function chip
130: Throughfall Group
131: power through pole
132: signal through pole
140: insulation sheet
150: spacer

Claims (6)

A main board 110 having one or more function chips for controlling the operation of the electronic device and mounted on the electronic device;
A sub-function board group including a plurality of sub-function boards each including one or more function chips for hybrid functions of the electronic device;
A plurality of spacers 150 disposed between and supported by the main board and the sub function board 121 and between the plurality of sub function boards, respectively, to form an empty space between adjacent boards and to be spaced apart from each other;
A through-pole group 130 each comprising a conductive long pole and having a plurality of through poles continuously passing through the main board, the sub-function board group, and an empty space between the boards. At least one power through pole 131 for selectively supplying power from the main board to the sub-function board group, and selectively energizing the main board and the sub-function board group. A through-pole group 130 including one or more signal through-poles 132 for transmitting signals or data transmitted and received between the main board and the sub-function boards;
It is configured to include,
The plurality of spacers 150 are configured to be spaced apart from each other by forming empty spaces between the boards adjacent to each other by being fitted in the pole portions exposed between the boards adjacent to each other in the through-pole group.
The plurality of sub function boards 121 to 126 are stacked in a plurality of stages in a state spaced apart by the plurality of spacers 150 to one surface of the main board 110 to form a fixed state with the through-pole group. The through poles required for the board for the power through pole 131 and the signal through pole 132 in the through pole group are connected to a function chip mounted on the board by electrical line patterning and unnecessary through poles on the board. An electronic device having a through-pole based PCB laminate structure, characterized in that it is configured to remain fixed only by soldering fixing.
delete delete delete The method according to claim 1,
And the sub function board group selectively reacts by identifying a signal or data provided from the main board.
The method according to claim 5,
The sub-function board group is a through-pol based board, characterized in that it comprises one or more of the Bluetooth engraving board, WLAN engraving board, Zigbee engraving board, Z-wave engraving board, hard disk controller engraving board, IoT communication engraving board Electronic device having a PCB stack structure.

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