KR101896638B1 - 평판의 첩합 지그 및 평판 적층체의 제조방법 - Google Patents
평판의 첩합 지그 및 평판 적층체의 제조방법 Download PDFInfo
- Publication number
- KR101896638B1 KR101896638B1 KR1020137014400A KR20137014400A KR101896638B1 KR 101896638 B1 KR101896638 B1 KR 101896638B1 KR 1020137014400 A KR1020137014400 A KR 1020137014400A KR 20137014400 A KR20137014400 A KR 20137014400A KR 101896638 B1 KR101896638 B1 KR 101896638B1
- Authority
- KR
- South Korea
- Prior art keywords
- flat plate
- jig
- meth
- acrylate
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 44
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 124
- 239000000853 adhesive Substances 0.000 claims description 92
- 230000001070 adhesive effect Effects 0.000 claims description 91
- 238000000034 method Methods 0.000 claims description 28
- 238000005096 rolling process Methods 0.000 claims description 25
- -1 Hydroxy-3-phenoxypropyl Chemical group 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 22
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000003999 initiator Substances 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 10
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 9
- 230000001588 bifunctional effect Effects 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 8
- 239000013013 elastic material Substances 0.000 claims description 7
- VSXGXPNADZQTGQ-UHFFFAOYSA-N oxirane;phenol Chemical compound C1CO1.OC1=CC=CC=C1 VSXGXPNADZQTGQ-UHFFFAOYSA-N 0.000 claims description 6
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000005357 flat glass Substances 0.000 description 56
- 239000011521 glass Substances 0.000 description 47
- 239000000463 material Substances 0.000 description 18
- 239000002245 particle Substances 0.000 description 15
- 238000012545 processing Methods 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 238000001179 sorption measurement Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 239000005297 pyrex Substances 0.000 description 8
- 239000005060 rubber Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 230000004927 fusion Effects 0.000 description 7
- 239000011236 particulate material Substances 0.000 description 7
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- YWEJNVNVJGORIU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-hydroxy-2-phenylacetate Chemical compound OCCOCCOC(=O)C(O)C1=CC=CC=C1 YWEJNVNVJGORIU-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- PBMIETCUUSQZCG-UHFFFAOYSA-N n'-cyclohexylmethanediimine Chemical compound N=C=NC1CCCCC1 PBMIETCUUSQZCG-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- VBQMTEHUPQSMFY-UHFFFAOYSA-N (2-diethoxyphosphorylphenyl)-(2,4,6-trimethylphenyl)methanone Chemical compound CCOP(=O)(OCC)c1ccccc1C(=O)c1c(C)cc(C)cc1C VBQMTEHUPQSMFY-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- PLNRJAOPKDGABD-UHFFFAOYSA-N CC1=C(C(=O)C2=C(C=CC=C2)P(OC)(OC)=O)C(=CC(=C1)C)C Chemical compound CC1=C(C(=O)C2=C(C=CC=C2)P(OC)(OC)=O)C(=CC(=C1)C)C PLNRJAOPKDGABD-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- TZAMQIAPGYOUKF-UHFFFAOYSA-N diethoxyphosphoryl(phenyl)methanone Chemical compound CCOP(=O)(OCC)C(=O)C1=CC=CC=C1 TZAMQIAPGYOUKF-UHFFFAOYSA-N 0.000 description 1
- XVKKIGYVKWTOKG-UHFFFAOYSA-N diphenylphosphoryl(phenyl)methanone Chemical compound C=1C=CC=CC=1P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 XVKKIGYVKWTOKG-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011242 organic-inorganic particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000004205 trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10889—Making laminated safety glass or glazing; Apparatus therefor shaping the sheets, e.g. by using a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Laminated Bodies (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
도 2는 본 발명에 관한 지그의 구조의 일례를 설명하기 위한 모식도이다.
도 3은 본 발명에 관한 지그의 연통 수단의 일례를 도시하기 위한 모식도이다.
도 4는 제1 판유리를 받침대에 재치한 상태를 도시한 도면이다.
도 5는 제1 판유리의 지그에 대한 진공 흡착을 개시했을 때의 상태를 도시한 도면이다.
도 6은 제1 판유리의 지그에 대한 진공 흡착을 완료했을 때의 상태를 도시한 도면이다.
도 7은 제2 판유리를 받침대에 재치한 상태를 도시한 도면이다.
도 8은 제2 판유리에 접착제를 도포하는 모습을 도시한 도면이다.
도 9는 제1 판유리와 제2 판유리의 첩합을 개시했을 때의 상태를 도시한 도면이다.
도 10은 제1 판유리와 제2 판유리의 첩합을 완료했을 때의 상태를 도시한 도면이다.
도 11은 제1 판유리와 제2 판유리의 위치를 조정하는 모습을 도시한 도면이다.
도 12는 접착제 전체를 UV조사하여 경화시키는 모습을 도시한 도면이다.
광경화성 접착제 | 광경화성 접착제(I) |
광경화성 접착제(II) |
접착 강도(MPa) | 10.9 | 10.6 |
80℃온수 박리시간(분,초) | 30초 | 30초 |
절단시험편 10개 이면편의 이빠짐 최대폭(μm) | 51.3 | 51.2 |
절단시험편 10개 이면편의 이빠짐 최대폭의 표준편차(μm) | 5.8 | 5.6 |
11 지그의 상면
12 지그의 하면
13 본체부
14 흡인 구멍
16 연통 수단
17 연통 수단의 출구
18 고무 시트
19 중공실
20 흡인관
21 분기관
22 집합관
30 제1 판유리
31 제1 판유리의 한 끝테두리
32 제1 판유리의 다른 끝테두리
33 받침대
34 롤러
35 받침대
36 제2 판유리
37 접착제 공급 탱크
38 디스펜서
39 광경화성 접착제
40 받침대의 흡인 구멍
41 지그의 흡인 구멍
42 흡인관
43 CCD카메라
44 얼라이먼트 마크
45,46 UV램프
Claims (21)
- a) 제1 평판과 지그를 준비하되, 상기 지그는
(1) 제1 면,
제1면의 반대쪽에 있으며 평판을 흡인하기 위한 복수의 흡인 구멍을 가지고 바깥쪽으로 만곡된 제2 면,
제1 면과 제2 면을 연결하는 본체부,
본체부 속에 배치되어 흡인 구멍을 흡인 수단에 연통시키기 위한 연통 수단을 갖는 구성, 혹은
(2) 압력을 받기 위한 제1 면,
제1 면의 반대쪽에 있으며 평판을 진공 흡착하기 위한 복수의 흡인 구멍을 가지고 원호형으로 바깥쪽으로 만곡된 제2 면,
제1 면과 제2 면을 연결하는 본체부,
본체부 속에 배치되어 흡인 구멍을 흡인 수단에 연통시키기 위한 연통 수단을 가진 구성 중의 어느 것을 구비하는 공정,
b) 제1 평판의 한 끝테두리에 대해 상기 지그의 제2 면을 접촉시킨 후 해당 한 끝테두리에 대향하는 다른 끝테두리를 향해 상기 지그를 굴려 제1 평판의 한면 전체를 상기 지그의 제2 면의 만곡 형상을 따라 흡인하는 공정,
c) 제2 평판을 준비하는 공정,
d) 제1 평판 및 제2 평판 중 어느 한쪽 또는 양쪽의 첩합면에 접착제를 도포하는 공정,
e) 공정 b)에서 흡인시킨 제1 평판의 첩합면의 한 끝테두리에 대해 제2 평판의 첩합면을 접촉 후 해당 한 끝테두리에 대향하는 다른 끝테두리를 향해 상기 지그의 제1 면을 상기 지그를 굴림으로써 제1 평판 및 제2 평판의 첩합면끼리 첩합하는 공정을 포함한 평판 적층체의 제조방법. - a) 제1 평판과 지그를 준비하되, 상기 지그는
(1) 제1 면,
제1면의 반대쪽에 있으며 평판을 흡인하기 위한 복수의 흡인 구멍을 가지고 바깥쪽으로 만곡된 제2 면,
제1 면과 제2 면을 연결하는 본체부,
본체부 속에 배치되어 흡인 구멍을 흡인 수단에 연통시키기 위한 연통 수단을 갖는 구성, 혹은
(2) 압력을 받기 위한 제1 면,
제1 면의 반대쪽에 있으며 평판을 진공 흡착하기 위한 복수의 흡인 구멍을 가지고 원호형으로 바깥쪽으로 만곡된 제2 면,
제1 면과 제2 면을 연결하는 본체부,
본체부 속에 배치되어 흡인 구멍을 흡인 수단에 연통시키기 위한 연통 수단을 가진 구성 중의 어느 것을 구비하는 공정,
b) 제1 평판의 한 끝테두리에 대해 상기 지그의 제2 면을 접촉시킨 후, 해당 한 끝테두리에 대향하는 다른 끝테두리를 향해 상기 지그의 제1 면을 가압하면서 상기 지그를 굴려 제1 평판의 한면 전체를 상기 지그의 제2 면의 만곡 형상을 따라 진공 흡착하는 공정,
c) 제2 평판을 준비하는 공정,
d) 제1 평판 및 제2 평판 중 어느 한쪽 또는 양쪽의 첩합면에 접착제를 도포하는 공정,
e) 공정 b)에서 진공 흡착시킨 제1 평판의 첩합면의 한 끝테두리에 대해 제2 평판의 첩합면을 접촉 후, 해당 한 끝테두리에 대향하는 다른 끝테두리를 향해 상기 지그의 제1 면을 가압하면서 상기 지그를 굴림으로써 제1 평판 및 제2 평판의 첩합면끼리 첩합하는 공정을 포함한 평판 적층체의 제조방법. - 청구항 2에 있어서, 공정 b) 및 공정 e)에서의 제1 면으로의 가압은 가압 롤러를 제1 면상에서 굴림으로써 행하는 평판 적층체의 제조방법.
- 청구항 1 또는 청구항 2에 있어서, 공정 e)는 흡인 수단에 의한 제1 평판에 대한 흡인력을 유지한 채 실시하는 평판 적층체의 제조방법.
- 청구항 1 또는 청구항 2에 있어서, 상기 흡인 구멍은 지그의 굴림 방향으로 복수로 구획되고 구획마다 대응하는 흡인 수단에 연통되어 있으며, 공정 e)에서 지그가 구름에 따라 제1 평판 및 제2 평판의 첩합 개시 위치로부터 첩합 종료 위치를 향해 순서대로 구획마다 흡인 수단에 의한 제1 평판에 대한 흡인을 정지하는 평판 적층체의 제조방법.
- 청구항 1 또는 청구항 2에 있어서, 제1 평판 및 제2 평판은 투광성이며, 상기 접착제는 광경화성 접착제이고, 공정 e) 후에 접착제를 경화시키기 위한 광을 평판 적층체의 첩합면에 존재하는 접착제를 향해 조사하는 공정 f)를 더 행하는 평판 적층체의 제조방법.
- 청구항 6에 있어서, 공정 e) 후 또한 공정 f) 전에 첩합면 방향의 위치를 조정하는 평판 적층체의 제조방법.
- 청구항 1 또는 청구항 2에 기재된 평판 적층체의 제조방법에 의해 제조된 평판 적층체를 제2 평판으로 간주하여 공정(a) 내지 공정(e)를 반복하는 것을 포함하는 평판 적층체의 제조방법.
- 청구항 6에 있어서, 광경화성 접착제가 (A) 다관능(메타)아크릴레이트, (B) 단관능(메타)아크릴레이트, (C) 광중합 개시제를 함유하는 평판 적층체의 제조방법.
- 청구항 9에 있어서, (A) 다관능(메타)아크릴레이트가 다관능(메타)아크릴레이트 올리고머/폴리머 및/또는 2관능(메타)아크릴레이트 모노머를 함유하는 평판 적층체의 제조방법.
- 청구항 9에 있어서, (B) 단관능(메타)아크릴레이트가 페놀에틸렌옥사이드 2몰 변성(메타)아크릴레이트, 2-(1,2-시클로헥사카복시이미드)에틸(메타)아크릴레이트 및 2-히드록시-3-페녹시프로필(메타)아크릴레이트로 이루어진 군 중 1종 이상을 함유하는 평판 적층체의 제조방법.
- 청구항 9에 있어서, (B) 단관능(메타)아크릴레이트가 페놀에틸렌옥사이드 2몰 변성(메타)아크릴레이트 및 2-(1,2-시클로헥사카복시이미드)에틸(메타)아크릴레이트를 함유하는 평판 적층체의 제조방법.
- 청구항 9에 있어서, (B) 단관능(메타)아크릴레이트가 페놀에틸렌옥사이드 2몰 변성(메타)아크릴레이트 및 2-히드록시-3-페녹시프로필(메타)아크릴레이트를 함유하는 평판 적층체의 제조방법.
- 삭제
- 삭제
- 삭제
- 청구항 1 또는 청구항 2에 있어서, 상기 지그의 제1 면은 평탄하거나 또는 제2 면의 만곡 상태와 동일한 정도로 원호형으로 안쪽으로 만곡되어 있는 평판 적층체의 제조방법.
- 청구항 1 또는 청구항 2에 있어서, 상기 지그의 제2 면은 탄성 재료로 구성되어 있는 평판 적층체의 제조방법.
- 청구항 1 또는 청구항 2에 있어서, 상기 지그의 상기 복수의 흡인 구멍은 지그의 굴림 방향으로 복수로 구획되어 있고 구획마다 대응하는 흡인 수단에 연통되는 평판 적층체의 제조방법.
- 삭제
- 삭제
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010260260 | 2010-11-22 | ||
JPJP-P-2010-260260 | 2010-11-22 | ||
PCT/JP2011/076684 WO2012070495A1 (ja) | 2010-11-22 | 2011-11-18 | 平板の貼合わせ治具及び平板積層体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130128407A KR20130128407A (ko) | 2013-11-26 |
KR101896638B1 true KR101896638B1 (ko) | 2018-09-07 |
Family
ID=46145837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137014400A Active KR101896638B1 (ko) | 2010-11-22 | 2011-11-18 | 평판의 첩합 지그 및 평판 적층체의 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9844858B2 (ko) |
EP (1) | EP2644372A4 (ko) |
JP (1) | JP5925127B2 (ko) |
KR (1) | KR101896638B1 (ko) |
CN (1) | CN103221211B (ko) |
TW (1) | TWI603849B (ko) |
WO (1) | WO2012070495A1 (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101980764B1 (ko) * | 2012-12-24 | 2019-08-28 | 엘지디스플레이 주식회사 | 아치 형태의 드럼 패드를 구비한 탈착기 및 이를 이용한 경량 박형의 액정표시장치 제조방법 |
DE202013102624U1 (de) * | 2013-06-18 | 2014-09-19 | Kuka Systems Gmbh | Fertigungseinrichtung |
WO2015083029A1 (en) * | 2013-12-02 | 2015-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
JP6338903B2 (ja) * | 2014-03-24 | 2018-06-06 | リケンテクノス株式会社 | ポリ(メタ)アクリルイミド系積層体からなる物品 |
KR102345700B1 (ko) * | 2014-03-24 | 2021-12-30 | 리껭테크노스 가부시키가이샤 | 하드 코트 적층체로부터 물품을 제조하기 위한 프로세스, 및 폴리(메타)아크릴이미드계 수지 층을 포함하는 하드 코트 적층체로부터 형성된 물품 |
JP6403456B2 (ja) * | 2014-06-27 | 2018-10-10 | 住友化学株式会社 | 貼合装置、貼合方法、光学表示デバイスの生産システムおよび光学表示デバイスの生産方法 |
JP6384190B2 (ja) * | 2014-08-15 | 2018-09-05 | Agc株式会社 | 貼合方法及び貼合装置 |
JP6405786B2 (ja) * | 2014-08-15 | 2018-10-17 | Agc株式会社 | 貼合方法及び貼合装置 |
KR20160070876A (ko) | 2014-12-10 | 2016-06-21 | 삼성디스플레이 주식회사 | 표시장치의 제조장치 및 이를 이용한 표시장치의 제조방법 |
CN104483774B (zh) * | 2014-12-22 | 2017-07-21 | 合肥京东方光电科技有限公司 | 真空对盒装置及对盒方法 |
KR102494018B1 (ko) * | 2015-10-13 | 2023-02-01 | 삼성디스플레이 주식회사 | 라미네이션 장치 및 이를 이용한 라미네이션 방법 |
KR20180090818A (ko) * | 2015-12-08 | 2018-08-13 | 세메다인 가부시키 가이샤 | 광경화성 점착제를 이용하는 접착 방법 |
CN105655487B (zh) | 2016-01-05 | 2018-10-16 | 京东方科技集团股份有限公司 | 撕膜装置以及撕膜方法 |
CN106024759B (zh) * | 2016-05-25 | 2018-10-12 | 环旭电子股份有限公司 | 封装体电磁防护层的制造方法 |
CN105977169B (zh) * | 2016-05-25 | 2018-08-28 | 环旭电子股份有限公司 | 封装体电磁防护层的制造方法 |
CN109153249A (zh) * | 2016-06-17 | 2019-01-04 | 株式会社藤仓 | 校准方法及校准装置 |
CN106626696B (zh) * | 2016-11-16 | 2018-06-22 | 重庆兴宝兴玻璃制品有限公司 | 玻璃粘合系统 |
KR101827869B1 (ko) * | 2017-02-03 | 2018-03-22 | 동우 화인켐 주식회사 | 박리 접합 동시 수행 장치 및 방법 |
MA47901B1 (fr) * | 2017-03-22 | 2021-06-30 | Saint Gobain | Dispositif et procédé de réception, de formage et de pose d'une vitre mince |
WO2018179261A1 (ja) * | 2017-03-30 | 2018-10-04 | シャープ株式会社 | 貼り付け方法及び貼り付け装置 |
CN107016936B (zh) * | 2017-04-25 | 2019-05-28 | 武汉华星光电技术有限公司 | 柔性面板曲面贴合的装置及方法 |
KR102042808B1 (ko) * | 2017-12-13 | 2019-11-08 | 단국대학교 천안캠퍼스 산학협력단 | Oca 스크레치 발생률을 줄인 라미네이션 장치 및 이를 이용한 라미네이션 방법 |
CN108710454A (zh) * | 2018-08-02 | 2018-10-26 | 广州视源电子科技股份有限公司 | 电容屏贴合方法和装置 |
CN113463549B (zh) * | 2021-09-06 | 2021-11-05 | 徐州瑞达装备制造有限公司 | 一种街道路面绿化环保节能清扫清洗污物收集车 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088267A (ja) | 2003-09-16 | 2005-04-07 | Canon Inc | 熱圧着方法および熱圧着装置 |
JP2009256125A (ja) * | 2008-04-15 | 2009-11-05 | Shoda Techtron Corp | 板ガラスの加工方法 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55147612A (en) * | 1979-05-09 | 1980-11-17 | Toshiba Corp | Polarizing plate gluing device |
JPH029733A (ja) * | 1988-06-28 | 1990-01-12 | Nippon Sheet Glass Co Ltd | 合せガラスの製造方法及び装置 |
JPH03123038A (ja) | 1989-10-04 | 1991-05-24 | Nec Kyushu Ltd | 半導体素子の吸着治具 |
AT399867B (de) * | 1990-01-11 | 1995-08-25 | Lisec Peter | Anlage zur herstellung von isolierglasscheiben |
US5380387A (en) * | 1992-10-13 | 1995-01-10 | Loctite Corporation | Lens blocking/deblocking method |
US5624521A (en) * | 1993-09-21 | 1997-04-29 | Hed; P. Paul | Method of holding optical elements without deformation during their fabrication |
WO1997022473A1 (en) * | 1995-12-19 | 1997-06-26 | Couttenier Andre | Method for making a laminate and device for the application of this method |
JPH09278497A (ja) * | 1996-04-17 | 1997-10-28 | Tokai Rika Co Ltd | ガラス接着装置 |
US6309485B1 (en) * | 1996-04-19 | 2001-10-30 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for manufacture of laminated optical disc |
JP3725344B2 (ja) * | 1998-05-11 | 2005-12-07 | オリジン電気株式会社 | 光ディスクの貼り合わせ方法および装置 |
BR9906562A (pt) | 1998-06-26 | 2000-08-15 | Asahi Glass Co Ltd | Método e aparelho para a produção de uma placa trnsparente presa a uma estrutura |
JP4078499B2 (ja) | 1998-06-26 | 2008-04-23 | 旭硝子株式会社 | 枠体付き透明板状体の製造方法および枠体付き透明板状体製造用金型 |
JP2000053453A (ja) * | 1998-08-07 | 2000-02-22 | Sony Corp | 薄板ガラス貼りつけ方法及び貼りつけ治具 |
JP2000113530A (ja) * | 1998-10-02 | 2000-04-21 | Jsr Corp | 情報記録担体の製造方法および情報記録担体 |
JP2001222017A (ja) * | 1999-05-24 | 2001-08-17 | Fujitsu Ltd | 液晶表示装置及びその製造方法 |
US6475292B1 (en) * | 2000-07-31 | 2002-11-05 | Shipley Company, L.L.C. | Photoresist stripping method |
JP3742000B2 (ja) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | プレス装置 |
JP3930284B2 (ja) * | 2000-12-18 | 2007-06-13 | 株式会社東芝 | 平面表示素子の製造方法 |
JP2002214597A (ja) * | 2001-01-18 | 2002-07-31 | Shibaura Mechatronics Corp | 液晶表示素子用フィルムの貼り合せ装置 |
US20040094264A1 (en) * | 2001-01-30 | 2004-05-20 | Hiroaki Yamaguchi | Method for adhering substrates using light activatable adhesive film |
JP2002230854A (ja) * | 2001-02-05 | 2002-08-16 | Sony Corp | 光学記録媒体の製造方法および光学記録媒体の製造装置 |
US6627309B2 (en) * | 2001-05-08 | 2003-09-30 | 3M Innovative Properties Company | Adhesive detackification |
JP2002341323A (ja) * | 2001-05-18 | 2002-11-27 | Minolta Co Ltd | 曲面型表示パネルの製造方法 |
JP3737059B2 (ja) * | 2002-03-14 | 2006-01-18 | 芝浦メカトロニクス株式会社 | 基板貼り合わせ装置および基板貼り合わせ方法 |
JP2005297409A (ja) * | 2004-04-14 | 2005-10-27 | Hitachi Industries Co Ltd | フィルム貼付方法及びフィルム貼付装置 |
JP2007030435A (ja) * | 2005-07-29 | 2007-02-08 | Optrex Corp | フィルムの貼付方法およびその装置 |
US7988811B2 (en) * | 2006-08-10 | 2011-08-02 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive composition and method for temporarily fixing member by using the same |
JP4711354B2 (ja) * | 2007-07-17 | 2011-06-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 画像表示装置の製造方法 |
CN102725241B (zh) * | 2010-01-21 | 2014-12-03 | 电气化学工业株式会社 | 透光性硬质基板层叠体的制造方法和透光性硬质基板贴合装置 |
WO2011089964A1 (ja) * | 2010-01-21 | 2011-07-28 | 電気化学工業株式会社 | 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置 |
KR20130100927A (ko) * | 2010-06-15 | 2013-09-12 | 덴끼 가가꾸 고교 가부시키가이샤 | 투광성 경질 기판 적층체의 제조방법 |
WO2013011970A1 (ja) * | 2011-07-15 | 2013-01-24 | 電気化学工業株式会社 | 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置 |
JP6012601B2 (ja) * | 2011-07-15 | 2016-10-25 | デンカ株式会社 | 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置 |
-
2011
- 2011-11-18 EP EP11842689.9A patent/EP2644372A4/en not_active Withdrawn
- 2011-11-18 CN CN201180056161.7A patent/CN103221211B/zh not_active Expired - Fee Related
- 2011-11-18 KR KR1020137014400A patent/KR101896638B1/ko active Active
- 2011-11-18 US US13/988,689 patent/US9844858B2/en active Active
- 2011-11-18 WO PCT/JP2011/076684 patent/WO2012070495A1/ja active Application Filing
- 2011-11-18 JP JP2012545723A patent/JP5925127B2/ja not_active Expired - Fee Related
- 2011-11-21 TW TW100142523A patent/TWI603849B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088267A (ja) | 2003-09-16 | 2005-04-07 | Canon Inc | 熱圧着方法および熱圧着装置 |
JP2009256125A (ja) * | 2008-04-15 | 2009-11-05 | Shoda Techtron Corp | 板ガラスの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
US9844858B2 (en) | 2017-12-19 |
TWI603849B (zh) | 2017-11-01 |
CN103221211A (zh) | 2013-07-24 |
WO2012070495A1 (ja) | 2012-05-31 |
HK1184764A1 (zh) | 2014-01-30 |
EP2644372A4 (en) | 2014-07-30 |
CN103221211B (zh) | 2016-06-29 |
TW201233558A (en) | 2012-08-16 |
JPWO2012070495A1 (ja) | 2014-05-19 |
JP5925127B2 (ja) | 2016-05-25 |
US20130241128A1 (en) | 2013-09-19 |
KR20130128407A (ko) | 2013-11-26 |
EP2644372A1 (en) | 2013-10-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101896638B1 (ko) | 평판의 첩합 지그 및 평판 적층체의 제조방법 | |
JP5812990B2 (ja) | 透光性硬質基板積層体の製造方法 | |
KR101662183B1 (ko) | 투광성 경질 기판 적층체의 제조 방법 및 투광성 경질 기판 접합 장치 | |
JP5734876B2 (ja) | 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置 | |
CN103687725B (zh) | 透光性硬质基板层叠体的制造方法和透光性硬质基板贴合装置 | |
CN103648753B (zh) | 透光性硬质基板层叠体的制造方法及透光性硬质基板贴合装置 | |
KR101696331B1 (ko) | 투광성 경질 기판 적층체의 가공 방법 및 판상 제품의 제조 방법 | |
HK1184764B (en) | Flat-plate bonding jig and method of manufacturing flat-plate stacked body | |
HK1181030B (en) | Method for manufacturing a light-transmitting rigid-substrate laminate | |
HK1191614B (en) | Method for producing translucent rigid substrate laminate and device for pasting together translucent rigid substrates | |
HK1176052B (en) | Process for producing laminate of light-transmitting hard plates and device for laminating light-transmitting hard plates | |
HK1175747B (en) | Method for manufacturing hard translucent plate laminate and apparatus for bonding hard translucent plates | |
HK1191610B (en) | Method for producing translucent rigid substrate laminate and device for pasting together translucent rigid substrates |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20130604 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20160422 Comment text: Request for Examination of Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20170720 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20180720 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20180903 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20180904 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20210818 Start annual number: 4 End annual number: 4 |