KR101712034B1 - 턴 오버 모듈 및 이를 구비한 레이저 리프트 오프 장치 - Google Patents
턴 오버 모듈 및 이를 구비한 레이저 리프트 오프 장치 Download PDFInfo
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
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Abstract
Description
도 2는 회전되기 전 상태의 글라스가 흡착된 턴 오버 모듈의 사시도.
도 3은 글라스가 제1거치대에 거치된 상태를 도시하는 단면도.
도 4는 도 2의 A부분의 확대도.
도 5는 도 4의 턴 오버 모듈의 종단면도.
도 6는 회전된 후 상태의 글라스가 거치된 턴 오버 모듈의 사시도.
도 7은 도 6의 B부분의 확대도.
도 8은 도 7의 턴 오버 모듈의 종단면도.
도 9a는 턴 오버 모듈 및 챔버 간 배치의 일 예를 도시하는 개념도.
도 9b는 턴 오버 모듈 및 챔버 간 배치의 다른 일 예를 도시하는 개념도.
Claims (9)
- 베이스부에 설치되고, 글라스를 거치 가능하도록 이루어지는 복수 개의 제1가이드핀을 구비하는 제1거치부;
상기 베이스부에 설치되며, 상기 글라스를 정렬시키는 제1얼라인부;
상기 베이스부에 연결되고, 회전축을 구비하여 상기 정렬된 글라스를 상기 회전축을 중심으로 회동 가능하게 하는 회전부재;
상기 회전부재에 연결되어 상기 글라스를 상기 회전축을 중심으로 회전 가능하게 흡착시키는 흡착부재; 및
상기 베이스부에 설치되고, 복수 개의 제2가이드핀을 구비하여 상기 회전된 글라스를 거치시키는 제2거치부를 포함하고,
상기 흡착부재는,
상기 회전부재에 설치되어 함께 회동하는 판부; 및
상기 판부의 일 측에 복수 개로 설치되고, 부압을 형성하여 상기 글라스를 흡착시키는 흡착유닛을 포함하며,
상기 판부는, 상기 제1가이드핀을 이동 가능하게 하는 이동 공간을 구비하고,
상기 제1가이드핀은, 상기 글라스가 거치된 상태에서 상기 글라스를 상기 흡착유닛에 흡착 가능하도록 상기 판부와 교차하는 방향으로 상기 이동 공간에서 이동되는 것을 특징으로 하는 턴 오버 모듈.
- 제1항에 있어서,
상기 제1거치부는,
상기 베이스부에 고정되는 제1지지판; 및
상기 제1가이드핀이 결합되고, 상기 제1지지판에 대해 상대 이동하도록 상기 제1지지판에 설치되는 제1연결판을 더 구비하는 턴 오버 모듈.
- 베이스부에 설치되고, 글라스를 거치 가능하도록 이루어지는 복수 개의 제1가이드핀을 구비하는 제1거치부;
상기 베이스부에 설치되며, 상기 글라스를 정렬시키는 제1얼라인부;
상기 베이스부에 연결되고, 회전축을 구비하여 상기 정렬된 글라스를 상기 회전축을 중심으로 회동 가능하게 하는 회전부재;
상기 회전부재에 연결되어 상기 글라스를 상기 회전축을 중심으로 회전 가능하게 흡착시키는 흡착부재; 및
상기 베이스부에 설치되고, 복수 개의 제2가이드핀을 구비하여 상기 회전된 글라스를 거치시키는 제2거치부를 포함하고,
상기 제2가이드핀에 인접하여 지그카세트가 설치되고,
상기 지그카세트에 수용된 지그는 이송 로봇에 의해 상기 제2거치부로 이송되어 상기 제2거치부에 거치되며,
상기 회전된 글라스는 상기 지그에 지지되어 상기 제2거치부에 거치되는 것을 특징으로 하는 턴 오버 모듈.
- 제3항에 있어서,
상기 베이스부에 설치되며, 상기 제2거치부에 거치된 상기 지그를 기결정된 위치로 정렬시키는 제2얼라인부를 더 포함하는 것을 특징으로 하는 턴 오버 모듈.
- 삭제
- 삭제
- 제1항에 있어서,
상기 흡착유닛은 상기 회전부재에 의해 상기 판부가 회전된 상태에서, 상기 부압의 형성을 해제하여서 상기 회전된 글라스를 상기 흡착유닛으로부터 이탈시키고 상기 제2가이드핀에 거치 가능하도록 하는 것을 특징으로 하는 턴 오버 모듈.
- 제1항에 있어서,
상기 제2거치부는 내부에서 레이저가 조사되는 반응챔버의 내부에 배치되는 것을 특징으로 하는 턴 오버 모듈.
- 제1항, 제2항, 제3항, 제4항, 제7항 및 제8항 중 어느 한 항의 턴 오버 모듈;
상기 턴 오버 모듈에 의해 회전된 글라스를 수용하도록 이루어지는 반응챔버; 및
상기 반응챔버에 설치되고, 상기 글라스를 향해서 레이저를 조사하는 레이저 발생부를 포함하는 레이저 리프트 오프 장치.
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KR1020160091364A KR101712034B1 (ko) | 2016-07-19 | 2016-07-19 | 턴 오버 모듈 및 이를 구비한 레이저 리프트 오프 장치 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108054130A (zh) * | 2018-01-22 | 2018-05-18 | 广安市嘉乐电子科技有限公司 | 一种mb桥堆自动翻片机 |
CN111778559A (zh) * | 2020-08-17 | 2020-10-16 | 中国工程物理研究院总体工程研究所 | 石墨盘翻转式GaN单晶衬底激光预剥离集成腔 |
CN117302979A (zh) * | 2023-10-11 | 2023-12-29 | 深圳市晓诚电子有限公司 | 偏光片贴附设备 |
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KR20030012104A (ko) * | 2001-07-30 | 2003-02-12 | 한국디엔에스 주식회사 | 반도체 세정설비에서의 웨이퍼 반전 유닛 |
KR100528810B1 (ko) * | 2004-05-19 | 2005-11-15 | 주식회사 디엠에스 | 기판 이송장치 |
KR20060047409A (ko) * | 2004-05-27 | 2006-05-18 | 퀀타 디스플레이 인크 | 기판 이송 장치 |
KR20130135651A (ko) * | 2012-06-01 | 2013-12-11 | 엘지디스플레이 주식회사 | 액정표시장치 제조라인 |
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- 2016-07-19 KR KR1020160091364A patent/KR101712034B1/ko active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20030012104A (ko) * | 2001-07-30 | 2003-02-12 | 한국디엔에스 주식회사 | 반도체 세정설비에서의 웨이퍼 반전 유닛 |
KR100528810B1 (ko) * | 2004-05-19 | 2005-11-15 | 주식회사 디엠에스 | 기판 이송장치 |
KR20060047409A (ko) * | 2004-05-27 | 2006-05-18 | 퀀타 디스플레이 인크 | 기판 이송 장치 |
KR20130135651A (ko) * | 2012-06-01 | 2013-12-11 | 엘지디스플레이 주식회사 | 액정표시장치 제조라인 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108054130A (zh) * | 2018-01-22 | 2018-05-18 | 广安市嘉乐电子科技有限公司 | 一种mb桥堆自动翻片机 |
CN108054130B (zh) * | 2018-01-22 | 2023-07-21 | 广安市嘉乐电子科技有限公司 | 一种mb桥堆自动翻片机 |
CN111778559A (zh) * | 2020-08-17 | 2020-10-16 | 中国工程物理研究院总体工程研究所 | 石墨盘翻转式GaN单晶衬底激光预剥离集成腔 |
CN117302979A (zh) * | 2023-10-11 | 2023-12-29 | 深圳市晓诚电子有限公司 | 偏光片贴附设备 |
CN117302979B (zh) * | 2023-10-11 | 2024-06-11 | 深圳市晓诚电子有限公司 | 偏光片贴附设备 |
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