KR101571655B1 - 열가소성 중합체 조성물 및 이것으로 이루어지는 성형품 - Google Patents
열가소성 중합체 조성물 및 이것으로 이루어지는 성형품 Download PDFInfo
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Abstract
Description
도 2는 실시예 4의 열가소성 중합체 조성물 시트의 모폴로지를 관찰한 전자현미경 사진이다.
도 3은 실시예 5의 열가소성 중합체 조성물 시트의 모폴로지를 관찰한 전자현미경 사진이다.
도 4는 실시예 8의 열가소성 중합체 조성물 시트의 모폴로지를 관찰한 전자현미경 사진이다.
도 5는 실시예 1의 유리 접착 계면의 모폴로지를 관찰한 주사형 프로브 현미경 사진이다.
도 6은 실시예 4의 유리 접착 계면의 모폴로지를 관찰한 주사형 프로브 현미경 사진이다.
도 7은 실시예 5의 유리 접착 계면의 모폴로지를 관찰한 주사형 프로브 현미경 사진이다.
도 8은 실시예 8의 유리 접착 계면의 모폴로지를 관찰한 주사형 프로브 현미경 사진이다.
Claims (17)
- 열가소성 탄성중합체(A)와 폴리비닐아세탈(B)을 함유하는 열가소성 중합체 조성물로서, 상기 열가소성 탄성중합체(A)가 방향족 비닐 화합물로 이루어지는 중합체 블록과 공액 디엔 화합물로 이루어지는 중합체 블록을 갖는 블록 공중합체 또는 이의 수소첨가물이며, JIS K6253의 JIS-A법에 의한 상기 열가소성 중합체 조성물의 경도가 20 내지 93인, 열가소성 중합체 조성물.
- 제1항에 있어서, 상기 열가소성 탄성중합체(A) 100질량부에 대해, 상기 폴리비닐아세탈(B)을 0.1 내지 100질량부 함유하는, 열가소성 중합체 조성물.
- 제1항 또는 제2항에 있어서, 상기 폴리비닐아세탈(B)의 입자가 상기 열가소성 탄성중합체(A)의 매트릭스 중에 분산되어 있는, 열가소성 중합체 조성물.
- 제3항에 있어서, 상기 폴리비닐아세탈(B)의 평균 입자 직경이 5㎛ 이하인, 열가소성 중합체 조성물.
- 제1항 또는 제2항에 있어서, 상기 폴리비닐아세탈(B)이 평균 중합도 100 내지 4000의 폴리비닐알콜을 아세탈화하여 수득된 것인, 열가소성 중합체 조성물.
- 제1항 또는 제2항에 있어서, 상기 폴리비닐아세탈(B)의 아세탈화도가 55 내지 88몰%인, 열가소성 중합체 조성물.
- 제1항 또는 제2항에 있어서, 상기 폴리비닐아세탈(B)이 폴리비닐부티랄인, 열가소성 중합체 조성물.
- 제1항 또는 제2항에 있어서, 상기 열가소성 탄성중합체(A)로서, 극성 관능기를 포함하지 않는 열가소성 탄성중합체(A1)와, 극성 관능기를 포함하는 열가소성 탄성중합체(A2)의 양자를 포함하고, 그 중량비(A2/A1)가 0.1/100 내지 100/0.1인, 열가소성 중합체 조성물.
- 제1항 또는 제2항에 따르는 열가소성 중합체 조성물로 이루어지는 성형품.
- 제9항에 있어서, 상기 열가소성 중합체 조성물이 세라믹스 또는 금속에 접착되어 이루어지는, 성형품.
- 제10항에 있어서, 상기 열가소성 중합체 조성물이 유리에 접착되어 이루어지는, 성형품.
- 제10항에 있어서, 상기 열가소성 중합체 조성물과 세라믹스 또는 금속과의 계면에, 폴리비닐아세탈(B)로 이루어지는 연속층이 존재하는, 성형품.
- 제9항에 있어서, 상기 열가소성 중합체 조성물이 아미드기, 에스테르기, 카보네이트기, 아세탈기, 에테르기, 설피드기, 니트릴기, 하이드록실기, 카보닐기, 카복실기, 아미노기 및 설폰산기로 이루어지는 그룹으로부터 선택되는 관능기를 갖는 극성 중합체에 접착되어 이루어지는, 성형품.
- 제13항에 있어서, 상기 극성 중합체가 폴리아미드, 폴리에스테르, 폴리카보네이트, 폴리아세탈, 폴리페닐렌설파이드 및 ABS 수지(아크릴로니트릴-부타디엔-스티렌 공중합체), 폴리비닐알콜, 에틸렌-비닐알콜 공중합체, 폴리비닐아세탈, 폴리아세트산비닐, 폴리(메트)아크릴레이트, 폴리에테르, 폴리케톤, 아이오노머, 폴리우레탄 및 폴리우레아로 이루어지는 그룹으로부터 선택되는 적어도 1종인, 성형품.
- 제1항 또는 제2항에 따르는 열가소성 중합체 조성물로 이루어지는 접착제.
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EP (1) | EP2223965B1 (ko) |
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US20130008506A1 (en) * | 2010-02-02 | 2013-01-10 | Zeon Corporation | Resin composition for encapsulating solar cell and solar module |
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- 2008-12-19 WO PCT/JP2008/073232 patent/WO2009081877A1/ja active Application Filing
- 2008-12-19 US US12/809,462 patent/US10385202B2/en active Active
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ES2402843T3 (es) | 2013-05-09 |
JP5567834B2 (ja) | 2014-08-06 |
EP2223965A1 (en) | 2010-09-01 |
JPWO2009081877A1 (ja) | 2011-05-06 |
US20100273012A1 (en) | 2010-10-28 |
KR20100099308A (ko) | 2010-09-10 |
CN101945943B (zh) | 2014-07-09 |
EP2223965B1 (en) | 2013-03-27 |
WO2009081877A1 (ja) | 2009-07-02 |
US10385202B2 (en) | 2019-08-20 |
CN101945943A (zh) | 2011-01-12 |
EP2223965A4 (en) | 2010-12-08 |
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