KR101570899B1 - Method for manufacturing device having hole injection/transport layer - Google Patents

Abstract

The present invention relates to a device material for a hole injecting and transporting layer capable of forming a hole injecting and transporting layer by a solution coating method, which has a high process resistance and excellent hole injecting and transporting ability by being changed in wettability by energy irradiation, Thereby providing an ink for the transport layer. A device capable of patterning a layer stacked on a hole injection and transport layer and achieving a long life can be provided, and a method of manufacturing the device. The device material for a hole injection transport layer of the present invention is characterized in that a fluorine-containing organic compound is attached to an organic-transition metal oxide complex which is a reaction product of an organic transition metal complex. Also provided is an ink, a device, and a manufacturing method thereof for a hole injection transport layer using the device material.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a device having a hole injection and transport layer,

The present invention relates to a device material for a hole injecting and transporting layer having a hole injecting and transporting ability which is changed in wettability by energy irradiation, a device having a hole injecting and transporting layer forming ink using the device material, a device having a hole injecting and transporting layer, will be.

As a device having a hole injection and transport layer, organic devices such as organic electroluminescence devices (hereinafter referred to as organic EL devices), organic transistors, organic solar cells, and organic semiconductors, quantum dot light emitting devices, Etc., are expected to be developed in a wide range of basic devices and applications.

For example, the organic EL element is a charge injecting type self-luminescent device using light emitted when electrons reaching the luminescent layer are recombined with holes. As the element structure of the organic EL element, various multi-layer structures such as a five-layer structure including an electron injection layer / electron transport layer / light emitting layer / hole transport layer / hole injection layer to obtain high light emitting efficiency and long drive life have been proposed.

The effect of facilitating the injection and transport of charges into the light-emitting layer or the effect of blocking the electron current and the hole current by maintaining the balance between the electron current and the hole current can be provided to the layers other than the light-emitting layer such as the electron injecting layer, the electron transporting layer, the hole transporting layer, It is known that there is an effect of suppressing the diffusion of energy excitons.

For the purpose of improving the charge transporting ability and the charge injecting ability, it has been attempted to increase the electric conductivity by mixing an oxidizing compound with a hole transporting material.

In Patent Documents 1 to 4, oxidative compounds, that is, metal oxides which are compound semiconductors as electron-accepting compounds are used. For example, a thin film is formed by a vapor deposition method using a metal oxide such as vanadium pentoxide or molybdenum trioxide, or a mixed film is formed by co-deposition of molybdenum oxide and an amine type low molecular weight compound.

In the non-patent reference 1, a solution in which oxovanadium (V) tri-i-propoxide oxide is dissolved as an oxidizing compound, that is, an electron-accepting compound is used for attempting formation of a vanadium pentoxide film, There has been proposed a production method of forming a charge transfer complex with vanadium oxide by hydrolysis in water vapor after the formation of a mixed coating film with a polymer. However, in Non-Patent Document 1, since the film is solidified by a hydrolysis-polycondensation reaction, vanadium tends to flocculate, film quality control becomes difficult, and a good film can not be obtained. Also, since oxo-vanadium (V) tri-i-propoxide oxide alone does not form a film and is mixed with the hole-transporting polymer, the coating film of Non-Patent Document 1 necessarily has an organic component concentration inevitably high, The conceivable concentration of vanadium becomes insufficient. As described above, non-patent document 1 requires further improvement in lifetime characteristics and device characteristics.

In Patent Document 5, for the purpose of attempting to form a coating film of molybdenum trioxide, it is described that fine particles prepared by physically pulverizing molybdenum trioxide are dispersed in a solution to prepare a slurry, and coating the slurry to form a hole injection layer.

However, even when an oxidative material as disclosed in Patent Documents 1 to 5 and Non-Patent Document 1 is used for a hole-transporting material, it has been difficult to realize a long-life device and to further improve the lifetime. In the metal oxides disclosed in Patent Documents 1 to 4, the hole injecting property is improved to some extent, but the adhesion of the interface with the adjacent organic compound layer becomes insufficient, which is considered to have an adverse effect on the lifetime characteristics.

Patent Document 5 discloses a technique of manufacturing a charge injection layer by a screen printing method using a slurry in which molybdenum oxide fine particles having an average particle diameter of 20 nm are dispersed in a solvent. However, according to the method of pulverizing the MoO ₃ powder as in Patent Document 5, it is very difficult actually to prepare fine particles having a particle size aligned with a scale of 10 nm or less, for example, in order to form a hole injection layer of about 10 nm. It is also very difficult to stably disperse the molybdenum oxide fine particles produced by pulverization in a solution without causing aggregation. If the solubilization of the fine particles is unstable, it is possible to form only a film having large unevenness and deteriorated smoothness at the time of production of a coating film, which causes a device short circuit. If a thin film can be formed only by a vapor deposition method, there is a problem that the advantage of the solution coating method can not be taken advantage of even if the light emitting layer is separately formed and applied by a solution coating method such as an ink jet method. That is, it is necessary to deposit a hole injection layer or a hole transport layer containing a molybdenum oxide of an inorganic compound using a high-precision mask in order to prevent the lyophobicity of the partition (bank) between each light emitting layer from being affected by the lyophilic molybdenum oxide And consequently, the advantage of the solution coating method can not be utilized in view of cost and yield. Molybdenum oxide, which is an inorganic compound, is an oxygen-deficient oxide semiconductor, and Mo ₂ O ₅ having an oxidation number of +5 than that of MoO ₃ having an oxidation number of +6 is electrically conductive. However, Compounds are limited to oxide compounds having a stable valence such as MoO ₃ or MoO ₂ .

The film forming property and the stability of the thin film are largely related to the lifetime characteristics of the device. In general, the lifetime of the organic EL element refers to the half-life of brightness when continuously driven by constant current drive or the like, and the longer the half-life of the element with a longer half-life of brightness.

On the other hand, in the manufacture of a display using an EL element or the like, patterning of a light emitting layer or the like is generally performed. As a patterning method of a light emitting layer and the like, various patterning methods such as a method of depositing a material through a shadow mask, a dividing method by an ink jet, a method of transferring a luminous color, a flexo printing method, and a gravure printing method have been proposed. In the partitioning application method using an ink jet, partition walls (banks) are formed to obtain high-precision fine patterns, and the surface of the partition walls is subjected to ink treatment by plasma treatment such as fluorine gas (see, for example, Patent Document 6) (See, for example, Patent Document 7) using a liquid-repellent material has been proposed. As a method of patterning the light emitting layer, there are proposed a method (for example, Patent Document 8) using a photocatalyst capable of forming a pattern with high precision and a method using vacuum ultraviolet light (for example, Patent Document 9) .

According to the method of treating the surface of the partition wall by the plasma treatment such as the fluorine gas or the like, the heat resistance of the ink treatment is low and problems arise in subsequent processes. For example, by heating at relatively high temperatures (for example, 200 占 폚) applied at the time of forming a layer in the opening of the barrier rib after the step of ink-repelling treatment, the fluorine introduced into the barrier ribs is removed, The characteristics of the device are lowered. Further, even when the barrier ribs are formed using a lyophobic material, many of the lyophobic materials are susceptible to fluorine desorption by heating at relatively high temperatures, and have the same problems as those described above. Further, in such a partition, the top of the partition is ink-repellent, but the side can not be ink-philic.

Further, in the method using the photocatalyst and the method using vacuum ultraviolet light, the wettability is changed so that the contact angle of the liquid is lowered at the portion irradiated with the action of the photocatalyst or irradiated with the vacuum ultraviolet light . That is, the portion where the action of the photocatalyst accompanies the energy irradiation or the portion irradiated with the vacuum ultraviolet light becomes the lyophilic region, and the portion where the action of the photocatalyst accompanying the energy irradiation is insufficient or the portion where the ultraviolet- And a liquid-repellent region is used. As a result, the light emitting layer or the like is formed on the portion where the action of the photocatalyst accompanies the energy irradiation or the portion irradiated with the vacuum ultraviolet light. However, when the layer in which the wettability is changed has hole transportability, there is a problem that the material is deteriorated in the portion where the action of the photocatalyst accompanies the energy irradiation or the portion irradiated with the vacuum ultraviolet light, and the hole transportability is damaged .

Japanese Patent Application Laid-Open No. 2006-155978 Japanese Patent Application Laid-Open No. 2007-287586 Japanese Patent No. 3748110 Japanese Patent No. 2824411 Japanese Patent Application Laid-Open No. 2008-041894 Japanese Patent No. 3951445 Japanese Patent Application Laid-Open No. 59-75205 Japanese Patent Application Laid-Open No. 2004-71286 Japanese Patent Laid-Open No. 2007-178783

 SID 07 DIGEST p.1840-1843 (2007)

The method using the above-described photocatalyst and the method using vacuum ultraviolet light can form a pattern corresponding to the difference in wettability only by energy irradiation, so that labor required for patterning of a light emitting layer or the like can be largely omitted . However, even when applied to a method using a conventional photocatalyst and a method using vacuum ultraviolet light, it is a material which has high resistance to energy irradiation of ultraviolet light and does not impair hole injection transportability, And a material that does not deteriorate the lyophobic property of patterning was not present.

At the same time, there has been a demand for a hole injecting and transporting material capable of forming a hole injecting and transporting layer by a solution coating method, facilitating the production process, having excellent hole injecting and transporting ability, and achieving a long life of the device.

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above problems and provides a device for a hole injection and transport layer capable of forming a hole injection and transport layer by a solution coating method with high wettability by energy irradiation and high process resistance, And an ink for a hole injection and transport layer using the device material.

Another object of the present invention is to provide a device capable of patterning a layer stacked on a hole injection and transport layer by forming a pattern composed of a lyophilic area and a lyophobic area by using the device material for a hole injection and transport layer, And a manufacturing method thereof.

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that an organic-transition metal oxide complex, which is a reaction product of an organic transition metal complex having a fluorine-containing organic compound adhered on its surface, But also the process resistance is high and the layer can be formed by the solution coating method, so that the manufacturing process is easy and the hole injection property is improved and the adhesion with the adjacent electrode or the organic layer is also excellent and the film has high stability The present invention has been accomplished on the basis of these findings.

That is, the device material for a hole injection and transport layer of the present invention is characterized in that a fluorine-containing organic compound is attached to the surface of an organic-transition metal oxide composite which is a reaction product of an organic transition metal complex.

In the device material for a hole injection transport layer of the present invention, it is preferable that at least one kind of metal selected from the group consisting of molybdenum, tungsten and vanadium is contained as a transition metal in the transition metal oxide contained in the organic-transition metal oxide composite This is preferable in that the drive voltage is reduced or the device life is improved.

In the device material for a positive hole injection transport layer of the present invention, the organic-transition metal oxide composite is preferably a reaction product of the organic transition metal complex and an organic solvent in that the drive voltage is reduced or the device life is improved.

In the device material for a hole injection and transport layer of the present invention, it is preferable that the organic-transition metal oxide composite includes two or more kinds of transition metal oxides having the same transition metal and different oxidation number, .

In the device material for a hole injection and transport layer of the present invention, it is preferable that the fluorine-containing organic compound contains a fluorinated alkyl group from the viewpoint of good wettability change by energy irradiation and excellent patterning.

The ink for forming a hole injection transport layer of the present invention is characterized by containing a device material for a hole injection transport layer according to the present invention and an organic solvent. The ink is produced by dissolving or dispersing a fluorine-containing organic compound containing an organic transition metal complex and a linking group generating an action of linking with a transition metal and / or a transition metal oxide in an organic solvent having a carbonyl group and / or a hydroxyl group, It is preferable to be one produced by oxidizing the transition metal in the organic transition metal complex.

The ink for forming a positive hole injection transport layer of the present invention is a mixture of an organic-transition metal oxide complex which is a reaction product of an organic transition metal complex and a fluorine-containing compound containing a linking group which generates an action of linking with a transition metal and / An organic compound, and an organic solvent.

The ink for forming a positive hole injection transport layer of the present invention preferably contains an organic transition metal complex, a fluorine-containing organic compound containing a linking group which generates an action of linking with a transition metal and / or a transition metal oxide, and a carbonyl group and / Containing organic solvent.

A first embodiment of a manufacturing method of a device according to the present invention is a manufacturing method of a device having two or more electrodes opposing to a substrate and a hole injection transport layer disposed between two of the electrodes,

A hole injecting and transporting layer forming step of forming a hole injecting and transporting layer containing a device material for a hole injecting and transporting layer according to the present invention on a substrate having a first electrode layer formed in a pattern shape,

A photocatalyst-containing layer substrate on which a photocatalyst-containing layer containing at least a photocatalyst is formed on a substrate is placed on the hole injecting and transporting layer with a gap that can act as a photocatalyst accompanied by energy irradiation, And a wettability change pattern forming step of forming a wettability change pattern whose wettability is changed on the surface of the hole injection transport layer by irradiation.

A second embodiment of a manufacturing method of a device according to the present invention is a manufacturing method of a device having two or more electrodes opposing to a substrate and a hole injection transport layer disposed between two of the electrodes,

A hole injecting and transporting layer forming step of forming a hole injecting and transporting layer containing a device material for a hole injecting and transporting layer according to the present invention on a substrate having an electrode layer formed in a pattern shape;

And a wettability change pattern forming step of forming a wettability change pattern whose wettability is changed on the surface of the hole injection transport layer by irradiating vacuum ultraviolet rays in a pattern shape.

According to the device and the manufacturing method of the present invention, since the hole injecting and transporting layer contains a material having a lyophobic fluorine-containing organic compound adhered thereto, the fluorine-containing organic compound is decomposed and removed by the action of a photocatalyst or irradiation of vacuum ultraviolet rays , It is possible to generate a large difference in wettability between the irradiated portion of the energy and the unirradiated portion of the energy. A wettability change pattern is formed by irradiating energy or irradiating vacuum ultraviolet rays through a photocatalyst-containing layer to a hole injection transport layer whose wettability can be changed, and by using the wettability difference of the wettability change pattern, A patterned layer can be laminated.

According to the device and the manufacturing method of the present invention, the organic-transition metal oxide complex contained in the hole injection transport layer-related device material of the present invention contained in the hole injection transport layer is resistant to ultraviolet light used in the wettability- It has an advantage that excellent hole injection transportability is not deteriorated even through the wettability change pattern forming step and is not damaged. Further, since the device material for a hole injection and transport layer according to the present invention is resistant to heating at a relatively high temperature (for example, 200 DEG C), the wettability change pattern is not damaged during the heating process, Or in the form of a pattern. Further, since the device material for the hole injection transport layer according to the present invention has high heat resistance and light resistance and is not easily deteriorated, the lifetime of the device manufactured by the manufacturing method of the present invention is also improved.

In the manufacturing method of the device of the present invention, it is preferable to have the step of applying the ink for forming the positive hole injection transport layer according to the present invention in the step of forming the positive hole injection transport layer, since the manufacturing process is easy and the hole injection transportability is good Do. In the step of forming the positive hole injection transport layer, it is preferable that the step of heating or light irradiation in the presence of oxygen is preferable in that hole injection transportability is improved.

In the first embodiment of the manufacturing method of the device of the present invention, before the hole injection transporting layer forming step, a partitioning portion such as an insulating layer or a partition wall is formed between the patterns of the first electrode layer on the substrate on which the first electrode layer is formed in the pattern shape Or may have a partition forming step for forming a partition.

In the first embodiment of the manufacturing method of the device of the present invention, the substrate on which the first electrode layer is formed is a light-transmitting substrate, and the partitioning portion is a partitioning portion for reflecting or absorbing the energy ray irradiated in the wettability- , It is preferable that in the wettability change pattern forming step, the wettability change pattern in which the wettability is changed on the surface of the hole injection transport layer is formed by irradiating the energy from the side of the transparent substrate. In this case, the partitioning part for reflecting or absorbing the energy ray to be irradiated performs the same function as the mask, and it is possible to irradiate the hole injection transporting layer with energy in a pattern form without preparing a mask separately. Since the device material for the hole injection and transport layer used in the hole injection transport layer of the present invention has high transmittance and the device characteristics are not easily deteriorated even under UV irradiation, energy irradiation from the back surface of the hole injection transport layer becomes possible.

In the first embodiment of the manufacturing method of the device of the present invention, the method of energy irradiation in a pattern shape in the wettability change pattern forming step may be a method of energy irradiation using a mask, It may be a method of energy irradiation.

A first embodiment of the device of the present invention is a device having two or more electrodes opposing to a substrate and a hole injection transport layer disposed between two of the electrodes,

Wherein the hole injection and transport layer contains the device material for a hole injection transport layer according to the present invention and the fluorine containing organic compound of the device material for the hole injection transport layer in the surface layer portion of the hole injection transport layer is decomposed and removed.

A second embodiment of the device of the present invention is a device having two or more electrodes opposing a substrate and a hole injection transport layer disposed between two of the electrodes,

And a hole injection and transport layer which has a partition between patterns of the first electrode layer on the substrate on which the first electrode layer is formed in a pattern shape and which is continuous over the first electrode layer and the partition in the opening of the partition,

At least a part of the fluorine-containing organic compound in the device material for a hole injection transport layer according to the present invention is decomposed and removed in the hole injection and transport layer on the first electrode layer and the side of the partition in the opening of the partition, And the hole injection transport layer on the top of the layer contains the device material for the hole injection transport layer according to the present invention.

Since the device of the present invention contains the device material for a hole injection transport layer according to the present invention in which at least a part of the fluorine-containing organic compound is decomposed and removed, the hole injection and transport layer is excellent in the production process and is excellent in hole injection transportability, . The device of the present invention can be obtained by the above-described method of manufacturing a device according to the present invention.

The device of the present invention is suitably used as an organic EL element containing at least an organic layer including a light emitting layer.

According to the present invention, there is provided a device material for a hole injection and transport layer capable of forming a hole injecting and transporting layer by a solution coating method, which has wettability changed by energy irradiation, has high process resistance, It is possible to provide an ink for a hole injection transport layer.

According to the manufacturing method of a device according to the present invention, it is possible to provide a device capable of achieving a long lifetime since a manufacturing process is easy and a good wettability change pattern of the hole injection transport layer can be used and a good hole injection transport layer can be obtained .

The device according to the present invention is easy to manufacture and has excellent hole injecting and transporting ability and can achieve a long life.

1 (A) to 1 (C) are process drawings showing an example of a manufacturing method of a device of the present invention.
2 (A) to 2 (C) are process drawings showing another example of a manufacturing method of a device of the present invention.
3 (A) to 3 (C) are process drawings showing another example of a manufacturing method of a device of the present invention.
4 (A) to 4 (C) are process drawings showing another example of the manufacturing method of the device of the present invention.
5 is a schematic cross-sectional view showing an example of a substrate for a part of a device according to the present invention.
6A and 6B are schematic cross-sectional views showing an example of a photocatalyst-containing layered substrate used in the present invention.
7A and 7B are schematic cross-sectional views showing examples of a substrate for a part of a device according to the present invention.
8 is a schematic cross-sectional view showing an example of the device of the present invention.
9 is a schematic cross-sectional view showing another example of the device of the present invention.
10 is a schematic cross-sectional view showing an example of the organic EL device of the present invention.
11 is a schematic cross-sectional view showing an experiment of the wettability change in the organic EL device of the present invention.
12A and 12B show an example of an ITO substrate having an insulating layer and barrier ribs used in the present invention. FIG. 12A shows a partially enlarged schematic sectional view, FIG. Shows a partially enlarged schematic plan view.
13 is a 1 H NMR spectrum of the fluorine-containing organic compound F-1 obtained in Synthesis Example 1. Fig.
14 is a 1 H NMR spectrum of the fluorine-containing organic compound F-2 obtained in Synthesis Example 2. Fig.
15 is a 1 H NMR spectrum of the fluorine-containing organic compound F-3 obtained in Synthesis Example 3. Fig.
16 is a 1 H NMR spectrum of the fluorine-containing organic compound F-4 obtained in Synthesis Example 4. Fig.

I. Device material for hole injection transport layer

The device material for a hole injection transport layer of the present invention is characterized in that a fluorine-containing organic compound is attached to an organic-transition metal oxide complex which is a reaction product of an organic transition metal complex.

The device material for a hole injection and transport layer of the present invention is an organic-transition metal oxide composite having a fluorine-containing organic compound adhered on the surface thereof, and is thus adhered to the surface by the action of a photocatalyst accompanied by energy irradiation or irradiation of vacuum ultraviolet light Containing organic compound can be decomposed and removed to thereby change the wettability from lyophobic to lyophilic. When the device material for a hole injection and transport layer of the present invention is used, a portion where the action of the photocatalyst accompanies the energy irradiation or a portion irradiated with the vacuum ultraviolet light becomes the lyophilic region, and the function of the photocatalyst accompanying the energy irradiation is insufficient Portion or the portion to which the vacuum ultraviolet light is not irradiated becomes a lyophobic region. In the device material for the hole injection and transport layer of the present invention, the fluorine-containing organic compound adhering to the surface is decomposed and removed by the action of a photocatalyst accompanied by energy irradiation, irradiation of vacuum ultraviolet light, etc., Since the organic-transition metal oxide composite itself is resistant to ultraviolet light or heating at a relatively high temperature, excellent hole injection transportability of the organic-transition metal oxide composite can be improved by irradiation of energy, during photocatalytic action, There is an advantage that it is not damaged. Further, the device material for a hole injection and transport layer of the present invention is advantageous in that it is oxidized by a treatment such as a photocatalytic treatment for decomposing fluorine, thereby increasing the ionization potential and improving hole injectability.

Further, the device material for the hole injection transport layer of the present invention is an organic-transition metal oxide complex unlike the case of using molybdenum oxide of an inorganic compound and contains an organic moiety including at least a fluorine-containing organic compound on its surface, The adhesion of the interface with the organic layer becomes good. Since at least the fluorine-containing organic compound in the surface layer portion of the hole injection transport layer using the device material for a hole injection and transport layer of the present invention is decomposed to form a lyophilic region and another organic layer is laminated thereon, The influence of the liquid repellency derived from the fluorine-containing organic compound is eliminated and the adhesion at the interface is excellent.

In addition, the organic-transition metal oxide complex, which is a reaction product of the organic transition metal complex, is considered to be easy to form a charge transfer complex because of the high reactivity of the transition metal oxide included therein. Therefore, the device material for a hole injection and transport layer of the present invention can form a hole injection and transport layer capable of realizing devices with low voltage driving, high power efficiency, and long life.

The organic-transition metal oxide composite used in the device material for the hole injection and transport layer of the present invention is a composite of an organic material and a transition metal oxide, unlike the case of using molybdenum oxide of an inorganic compound or the like, And thus has a dispersibility in a solvent. Therefore, from the viewpoint that the thin film can be formed by the solution coating method, the steps from the hole injection transporting layer to the organic layer in which the light emitting layer and the like are stacked on the substrate can be formed successively by the coating process alone. Therefore, as in the case of the molybdenum oxide of the inorganic compound, the hole injection layer is deposited by high-precision mask evaporation or the like, and then the hole transport layer or the light emitting layer is formed by a vapor deposition method or a solution coating method. Further, And it is advantageous in that the device can be manufactured at low cost.

Hereinafter, the constitution of a device material for a hole injecting and transporting layer of the present invention will be described in order.

<Organic-transition metal oxide complex>

The organic-transition metal oxide complex used in the device material for a hole injection and transport layer of the present invention is a reaction product of an organic transition metal complex and includes a transition metal oxide. Examples of the reaction product of the organic transition metal complex include a reaction product of the organic transition metal complexes, a reaction product of the organic transition metal complex and the organic solvent, an organic or inorganic compound having an organic transition metal complex and a functional group capable of reacting with the organic metal complex , And reaction products of these compounds.

The organic-transition metal oxide complex, which is a reaction product of the organic transition metal complex, can be used in a process for forming a hole injection transport layer, for example, in an ink for forming a hole injection transport layer (coating solution) , A reaction product produced by reaction of an organic transition metal complex carried out at the time of light irradiation, driving of a device, and the like.

The organic-transition metal oxide complex may contain various valence transition metals or compounds such as carbides, sulfides, borides, selenides, halides and the like of the transition metals depending on processing conditions.

The transition metal in the transition metal oxide contained in the organic-transition metal oxide composite is a generic name of the metal element existing between Groups 3 to 11 in the periodic table. Specific examples of the transition metal include molybdenum, tungsten, vanadium, rhenium, nickel, copper, titanium, platinum and silver.

Among them, the transition metal in the transition metal oxide contained in the organic-transition metal oxide composite preferably contains at least one kind of metal selected from the group consisting of molybdenum, tungsten and vanadium, It is easy to form, and it is preferable in that it lowers the driving voltage and improves the lifetime of the device.

The metal contained in the organic-transition metal oxide composite may be a single metal or two or more metals. As the form in which two or more metals are contained, two or more metals or metal oxides may be contained in combination, or two or more metals may be contained as an alloy. A heterogeneous bimetallic metal complex may also be used.

In addition, the metal contained in the organic-transition metal oxide composite may include a non-transition metal if it contains at least a transition metal.

By including two or more kinds of metals, it is possible to form a hole injecting and transporting layer having other functions such as complementing the hole transporting property and the hole injecting property, imparting photocatalytic property, controlling the refractive index or transmittance of the thin film, and the like.

The organic transition metal complex used in the present invention is a coordination compound containing a transition metal and contains a ligand containing an organic compound in addition to the transition metal described above.

For example, as the organic molybdenum complex, there is a complex having an oxidation number of -2 to +6. Also, as an organic tungsten complex, there is a complex having an oxidation number of -2 to +6. The tungsten complex tends to be a molybdenum complex and tends to be polynuclear and easily attached to an oxo ligand, and the coordination number may be 7 or more. As the organic vanadium complex, there is a complex having an oxidation number of from -3 to +5.

The kind of the ligand is appropriately selected and is not particularly limited, but the ligand containing organic moiety (carbon atom) is used in view of solvent solubility and adhesiveness with the adjacent organic layer. It is also preferable that the ligand is decomposed from the complex at a relatively low temperature (for example, 200 DEG C or less).

Examples of the monocyclic ligands include acyl, carbonyl, thiocyanate, isocyanate, cyanate, isocyanate, and halogen atoms. Among them, carbonyl which is easily decomposed at a relatively low temperature is preferable. Examples of the bidentate ligand include various carboxylic acids and the like.

Specific examples of the structure containing an aromatic ring and / or a heterocyclic ring include benzene, triphenylamine, fluorene, biphenyl, pyrene, anthracene, carbazole, phenylpyridine, trithiophene, phenyloxadiazole , Phenyltriazole, benzimidazole, phenyltriazine, benzodiathiazine, phenylquinoxaline, phenylene vinylene, phenylsilole, and combinations of these structures.

Further, as long as the effect of the present invention is not impaired, the structure containing an aromatic ring and / or a heterocyclic ring may have a substituent. Examples of the substituent include a linear or branched alkyl group having 1 to 20 carbon atoms, a halogen atom, an alkoxy group having 1 to 20 carbon atoms, a cyano group, and a nitro group. Among straight or branched alkyl groups having 1 to 20 carbon atoms, straight chain or branched alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group and a dodecyl group.

Further, as the ligand, it is preferable that the monodentate ligand or the bidentate ligand has high reactivity of the organic transition metal complex. If the complex itself becomes too stable, the reactivity may deteriorate.

As the molybdenum complex of oxidation number less than or equal to 0, for example, metal carbonyl _{^{[Mo -II (CO) 5]}} 2-, [(CO) 5 Mo - I Mo -I (CO) 5] 2-, [Mo (CO) ₆ ].

Examples of molybdenum (I) complexes having an oxidation number of +1 include non-Werner type complexes including diphosphane and eta ⁵ -cyclopentadienide, and specifically Mo ^I (侶⁶ -C ₆ H ₆ ) _2] ^+, can be [MoCl (N ₂₎ (di-phosphine) ₂ (di-phosphine, the ligand L 2 _{(C 6 H 5) 2 PCH} 2 CH 2 P (C 6 H 5) 2) a.

As the molybdenum (II) complex having an oxidation number of +2, there can be mentioned a Mo ₂ compound in which molybdenum becomes a bicyclic complex and exists in a state of (Mo ₂ ) ⁴⁺ ion, for example, [Mo ₂ (RCOO) ₄ ] And [Mo ₂ X ₂ L ₂ (RCOO) ₄ ]. In the above RCOO, R is a hydrocarbon group which may have a substituent, and various carboxylic acids may be used. Examples of the carboxylic acid include fatty acid such as formic acid, acetic acid, propionic acid, butyric acid and valeric acid, halogenated alkylcarboxylic acid such as trifluoromethanecarboxylic acid, benzoic acid, naphthalenecarboxylic acid, anthracenecarboxylic acid, 2 Hydroxycarboxylic acid, thiophenecarboxylic acid, and pyridinecarboxylic acid, and the like, and the like can be given. Further, a carboxylic acid having a carboxyl group in the hole-transporting compound (an arylamine derivative, a carbazole derivative, a thiophene derivative, a fluorene derivative, a distyrylbenzene derivative, etc.) described below may be used. Among them, a structure containing an aromatic ring and / or a heterocyclic ring as described above is suitably used in the carboxylic acid. The carboxylic acid is a ligand suitable for optimizing the interaction with the hole-transporting compound to be mixed, optimizing the hole-injecting transport function, or optimizing the adhesion with the adjacent layer. In addition, X is halogen or alkoxide, and chlorine, bromine, iodine, methoxide, ethoxide, isopropoxide, sec-butoxide or tert-butoxide can be used. L is a neutral ligand, and trialkylphosphines such as P (nC ₄ H ₉ ) ₃ and P (CH ₃ ) ₃ and triarylphosphines such as triphenylphosphine can be used.

As the molybdenum (II) complex having an oxidation number of +2, halogen complexes such as [Mo ^II ₂ X ₄ L ₄ ] and [Mo ^II X ₂ L ₄ ] can be used, and for example, [Mo ^II Br _{4 P (nC 4 H 9) 3} ) 4] and [Mo ^II I ₂ (di-Ars) ₂ (di-Ars is Dia Rezin _{(CH 3) 2 As-C} 6 H 4 -As (CH 3) 2) , etc. .

Examples of the molybdenum (III) complex having an oxidation number of +3 include [(RO) ₃ Mo≡Mo (OR) ₃ ] and [Mo (CN) ₇ (H ₂ O)] ^4- . R is a straight or branched alkyl group having 1 to 20 carbon atoms. Among straight or branched alkyl groups having 1 to 20 carbon atoms, straight chain or branched alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group and a dodecyl group.

In addition, as a molybdenum (IV) complex a +4 oxidation state, such as _{[Mo {N (CH 3)} 2} 4], [Mo (CN) 8] 4-, where the MoO ^{2 +} having an oxo ligand And a complex of Mo ₂ O ₂ ^{4 +} _double- crosslinked with O ^{2 -} .

Examples of the molybdenum (V) complex is +5 oxidation state, such as _{Mo (OCH 2 CH 3) 5} , [Mo (CN) 8] 3- or, Mo = O is O ² in the transport position ^- the cross-linked with 2 core of Mo ₂ O ₃ as the oxo complex having a ^{4 +,} for example xanthic acid complex _{Mo 2 O 3 (S 2 COC} 2 H 5) 4, Mo = O is O ² in the cis position ^- of the second nuclear crosslinking of 2 to As the oxo complex having Mo ₂ O ₄ ^{2 +} , for example, a histidine complex [Mo ₂ O ₄ (L-histidine) ₂ ] 3H ₂ O and the like can be given.

As the molybdenum (VI) complex having an oxidation number of +6, for example, MoO ₂ (acetylacetonate) ₂ ] can be mentioned. In the case of a complex having two or more nuclei, there is also a mixed atom valency complex.

Examples of the tungsten complex of oxidation number less than or equal to 0, for example, metal carbonyl _{^{[W -II (CO) 5]}} 2-, [(CO) 5 W - I W -I (CO) 5] 2-, [W ( CO) ₆ ] and the like.

Examples of tungsten (I) complexes having an oxidation number of +1 include non-Werner-type complexes including diphosphane and? ⁵ -cyclopentadienide, specifically W ^I (侶⁶ -C ₆ H ₆ ) _2] ^+, can be [WCl (N ₂₎ (di-phosphine) ₂ (di-phosphine, the ligand L 2 _{(C 6 H 5) 2 PCH} 2 CH 2 P (C 6 H 5) 2) a.

As the tungsten (II) complex, the oxidation number +2, is a tungsten-2 core complex (W ₂₎ ⁴⁺ include W ₂ compounds present in the state of ions and, for example, [W ₂ (RCOO) _4] And [W ₂ X ₂ L ₂ (RCOO) ₄ ]. In the above-mentioned RCOO, R may be the same as those described for the molybdenum complex. As the tungsten (II) complex having an oxidation number of +2, other halogen complexes such as [W ^II ₂ X ₄ L ₄ ] and [W ^II X ₂ L ₄ ] can be used. For example, [W ^II Br _{4 P (nC 4 H 9) 3} ) 4] and [W ^II I ₂ (di-Ars) ₂ (di-Ars is Dia Rezin _{(CH 3) 2 As-C} 6 H 4 -As (CH 3) 2) , etc. .

Examples of the tungsten (III) complex having an oxidation number of +3 include [(RO) ₃ W? W (OR) ₃ ] and [W (CN) ₇ (H ₂ O)] ^4- . R is a straight or branched alkyl group having 1 to 20 carbon atoms.

Examples of the tungsten (IV) complex having an oxidation number of +4 include [W {N (CH ₃ ) ₂ } ₄ ], [W (CN) ₈ ] ^4- , and WO ^{2 +} having an oxo ligand And a complex of W ₂ O ₂ ^{4 +} which is double-crosslinked with O ^{2 -} .

Examples of a tungsten (V) complex oxidation number +5, for example, [W (CN) _8] ^3- or _{W (OCH 2 CH 3) 5} , W = O the O ² in the ^{trans-position-2} of the nuclear cross-linked with oxo complex with the W ₂ O ₃ ^{4 +} as the example xanthic acid complex _{W 2 O 3 (S 2 COC} 2 H 5) 4, W = O the O ² in the cis position ^- of the second nuclear crosslinking of 2 to W Examples of the oxo complex having ₂ O ₄ ^{2 +} include a histidine complex [W ₂ O ₄ (L-histidine) ₂ ] 3 H ₂ O and the like.

Examples of tungsten (VI) complexes having an oxidation number of +6 include W (OCH ₂ CH ₃ ) ₆ , WO ₂ (acetylacetonate) ₂ ] and tungsten (VI) pentoxide. In the case of a complex having two or more nuclei, there is also a mixed atom valency complex.

Examples of the vanadium complex having an oxidation number of 0 or less include metal carbonyl [V ⁰ (CO) ₆ ] and V ^III O oxytriisopropoxide as a metal oxide complex.

Examples of the vanadium (II) complex having an oxidation number of +2 include a cyclopentadienyl complex [V ^II (η ⁵ -C ₅ H ₅ ) ₂ ] and the like.

Examples of the vanadium (III) complex having an oxidation number of +3 include [V ^III Cl ₃ {N (CH ₃ ) ₃ } ₂ ] and V ^III O acetylacetonate as the metal oxide complex.

(VOCl ₂ {N (CH ₃ ) ₃ } ₂ ), VCl ₄ (diars)] and 8 ([VCl ₄ (diaryl) ₂ ] octahedral of the tetrahedron, ) And the like.

In the present invention, the transition metal oxide is necessarily included in the organic-transition metal oxide complex which is the reaction product of the organic transition metal complex. It is possible to improve the driving voltage and the element life span by necessarily including the transition metal oxide so that the value of the ionization potential is optimized or the change due to the oxidation from the unstable oxidation number +0 is suppressed in advance. Among them, it is preferable that the organic-transition metal oxide composite contains a transition metal oxide having a different oxidation number. The transition metal oxides having different oxidation numbers coexist and are always contained. Therefore, the hole transporting and the hole injecting property are appropriately controlled by the balance of the oxidation water, whereby the drive voltage can be lowered and the device life can be improved.

For example, as a reaction product of a molybdenum complex or a tungsten complex, a composite having an oxidation number of molybdenum of +5 and +6 or a composite of tungsten having an oxidation number of +5 and +6, respectively, . Also, it is preferable that the reaction product of the molybdenum complex or the reaction product of the tungsten complex exists in an anion state of the composite having molybdenum oxidation numbers of +5 and +6, respectively, or oxidation states of tungsten of +5 and +6, It is preferable from the viewpoint of improving the life.

Molybdenum having an oxidation number of +5 and +6, or tungsten having an oxidation number of +5 and +6, the molar ratio of molybdenum or tungsten having oxidation number of +5 to molybdenum or tungsten having oxidation number of +6 is 10 mol or more Is preferable in that it lowers the driving voltage and improves the device life. On the other hand, in the case of ordinary molybdenum oxide such as MoO ₃ , most of the molybdenum is Mo ^VI and the composition formula is Mo _n O _3n . However, Mo _n O _{3n -m} may be formed due to oxygen defects at the time of vapor deposition or oxygen defects existing on the surface of particles generated by physical grinding at the time of slurry formation, and Mo ^V may be present somewhat. However, since Mo ^V introduced into MoO ₃ is generated by oxygen defects, it is uneven and unstable.

In the case of vanadium, the oxidation number +5 is stable (V ₂ O ₅ ) and the oxidation number + 4 is unstable (V ₂ O ₄ ). The reaction products of the vanadium complexes are preferably in the anion state of the complexes in which the oxidation number of vanadium is +5 and +4, respectively, from the viewpoint of reducing the driving voltage and improving the lifetime of the device.

The organic-transition metal oxide complex used in the present invention is preferably a reaction product of at least an organic transition metal complex and an organic solvent and is preferably a reaction product of an organic transition metal complex and an organic solvent capable of performing a redox reaction with the organic transition metal complex The reaction product is preferably a reaction product of an organic transition metal complex and an organic solvent having a carbonyl group and / or a hydroxyl group. Since the organic transition metal complex has high reactivity, when the hole injection transport layer is formed, for example, by heating or light irradiation in the ink for forming the hole injection transport layer or during the formation of the layer using the ink, A redox reaction is carried out with an organic solvent contained in the ink for use, and at least a part of the transition metal complex becomes a transition metal oxide. When the organic solvent is an organic solvent having a carbonyl group and / or a hydroxyl group, the reactivity for producing the transition metal oxide is high.

For example, when an organic molybdenum complex or an organic tungsten complex is used, an anion state of a composite having an oxidation number of molybdenum of +5 and +6 or a composite of tungsten having an oxidation number of +5 and +6 is formed, and an inherently unstable oxidation number is + 5 molybdenum or tungsten can be stably maintained even in a relatively large number of states, which is preferable in terms of lowering the driving voltage and improving the device life.

The organic solvent used in the present invention is not particularly limited as long as it is an organic solvent capable of performing a redox reaction suitably with an organic transition metal complex.

Examples of the organic solvent having a carbonyl group and / or hydroxyl group suitably used include an aldehyde type, a ketone type, a carboxylic acid type, an ester type, an amide type, an alcohol type and a phenol type. Is appropriately used. Specific examples of the organic solvent having a carbonyl group and / or hydroxyl group include acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, Ketone solvents such as isopropyl ketone, diisobutyl ketone, acetonyl acetone, isophorone and cyclohexanone; aldehyde type solvents such as acetaldehyde, propionaldehyde, furfural and benzaldehyde; Carboxylic acid solvents such as acetic acid, propionic acid, butyric acid and valeric acid; Esters such as ethyl acetate, n-propyl acetate, i-propyl acetate, n-butyl acetate, i-butyl acetate, n-amyl acetate, ethyl benzoate and butyl benzoate; Amide solvents such as N-methylformamide, N, N-dimethylformamide and N-ethylacetamide; For example, alcohols such as methyl alcohol, ethyl alcohol, propyl alcohol, isopropyl alcohol, glycerin, ethylene glycol, propylene glycol, 1,2-butylene glycol, cyclohexanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Alcohol-based solvents such as glycol monoethyl ether; Phenol type solvents such as phenol, cresol, xylenol, ethyl phenol, trimethyl phenol, isopropyl phenol, t-butyl phenol and the like.

<Fluorine-containing organic compound attached to the surface>

In the device material for a hole injection transporting layer of the present invention, a fluorine-containing organic compound is attached to the organic-transition metal oxide composite.

In the device material for the hole injection transport layer of the present invention, "adhesion" means that the fluorine-containing organic compound is fixed to the surface of the organic-transition metal oxide composite to such an extent that even if dispersed in the organic solvent, the organic solvent does not peel off. The &quot; attachment &quot; includes adsorption and coordination, but is preferably a chemical bond such as ionic bond or covalent bond. The form of "attachment" may be a form in which the entire surface of the organic-transition metal oxide composite is attached so as to cover the fluorine-containing organic compound, or a form in which a fluorine-containing organic compound is adhered to a part of the surface.

In the device material for a hole injection and transport layer of the present invention, an organic compound containing at least a fluorine-containing organic compound is adhered to the organic-transition metal oxide complex in particular. Therefore, , Dispersion stability is greatly improved and a thin film of nm order having high uniformity can be formed. Therefore, the thin film formed from the device material for hole injection and transport layer of the present invention is difficult to be short-circuited because of its high temporal stability and uniformity. In addition, adhesion between the adjacent electrodes and the organic layer is improved.

The kind of the fluorine-containing organic compound attached to the surface is appropriately selected and is not particularly limited. Examples of the fluorine-containing organic compound include organic compounds in which some or all of hydrogen contained in linear, branched, or cyclic saturated or unsaturated hydrocarbons which may contain heteroatoms are substituted with fluorine. Or an organic compound in which some or all of the hydrogen contained in the organic compound which may be contained in the hetero atom which has been conventionally used as the hole injection transporting material is substituted with fluorine may be used. Alternatively, a compound having a substituent containing a fluorine-containing organic compound may be introduced into an organic compound which may be contained in a heteroatom, which has been conventionally used as a hole injection transporting material.

Specific examples of the fluorine-containing organic compound include a linear, branched or cyclic alkyl group, a fluorinated alkyl group or a fluorinated aryl group in which a part or all of hydrogen of an aryl group is fluorinated, and combinations thereof. The number of carbon atoms of the fluorinated alkyl group is not particularly limited, but is preferably 2 to 10, more preferably 4 to 6. The carbon number of the combination of a fluorinated alkyl group such as a fluorinated aryl group or a fluorinated aryl group and a fluorinated aryl group is not particularly limited, but is preferably 6 to 12, more preferably 6 to 9.

As the fluorine-containing organic compound, it is preferable that the fluorine-containing organic compound contains a fluorinated alkyl group because the change of the wettability by energy irradiation is good and excellent patterning is obtained.

Further, as the fluorine-containing organic compound -NH-, -N =, -S-, -O- , -NH (C = O) -, -O- (C = O) -, -O- (SO 2) - (C = O) -O-, -S- (C = O) -O-, -SiR ₂ - (C = O) -O-, -SiR ₂ - Since the fluorine organic compound is easily decomposed by energy irradiation, the sensitivity is improved in the wettability change pattern forming step.

Among them, the fluorinated alkyl group represented by C _n F _{2n +} C _m H _2m - [m is an integer of 0 to 20, n is an integer of 1 to 20 and m + n is 1 to 30] And when m is 1 or more, it is preferable to bond C _m H _2m rather than directly to C _n F _{2n + 1 in} the case of binding to another element such as an ether bond, because the stability of the compound is enhanced . On the other hand, when bonding to C _n F _{2n + 1} directly in the case of bonding to other elements such as an ether bond, the fluorine organic compound is easily decomposed by energy irradiation, so that the sensitivity is improved in the wettability change pattern forming step, The residual organic component of the thin film is decreased, so that the adhesion of the thin film interface is improved and the device characteristics are improved. n is preferably an integer of 2 to 10, and more preferably an integer of 4 to 6. m is an integer of 0 to 10, and more preferably an integer of 2 to 8.

The fluorine-containing alkyl group preferably has a fluorine atom (fluorine atom content in the alkyl group) of preferably 50 to 100%, more preferably 80 to 100%. In particular, the fluorine- Is expressed.

Further, the fluorine-containing organic compound containing an aromatic hydrocarbon and / or a heterocycle is preferable in that the boiling point of the fluorine-containing organic compound can be raised. For example, there is an advantage that it is possible to extend the restriction of the synthesis temperature of a device material for a hole injection transport layer to which the fluorine-containing organic compound of the present invention is adhered, or to set a high-temperature process temperature in the case of manufacturing a device.

In addition, since the aromatic hydrocarbon and / or heterocyclic ring often has charge transportability, it is possible to maintain the charge mobility in the hole injection and transport layer formed by the fluorine-containing organic compound containing an aromatic hydrocarbon and / or a heterocycle high, There is an advantage in terms of high efficiency such as fire. The fluorine-containing organic compound in the surface layer of the film is removed by the treatment for decomposing the fluorine-containing organic compound to be described later, but since the fluorine-containing organic compound containing an aromatic hydrocarbon and / or a heterocyclic ring remains in the inside of the film, . &Lt; / RTI &gt;

Further, since each layer of an organic device such as an organic EL device usually includes an aromatic hydrocarbon and / or a heterocyclic charge transporting material, considering the improvement in adhesion between the adjacent organic layer and the hole injection transporting layer, the aromatic hydrocarbon and / Or a structure of a heterocyclic ring is preferable in that it contributes to long drive life.

Examples of the fluorinated alkyl group include the following structures.

_{CF 3 -, CF 3 CF 2} -, CHF 2 CF 2 -, CF 3 (CF 2) 2 -, CF 3 (CF 2) 3 -, CF 3 (CF 2) 4 -, CF 3 (CF 2) 5 _{-, CF 3 (CF 2)} 6 -, CF 3 (CF 2) 7 -, CF 3 (CF 2) 8 -, CF 3 (CF 2) 9 -, CF 3 (CF 2) 11 -, CF 3 ( _{CF 2) 15 -, CF 3} CH 2 CH 2 -, CF 3 CF 2 CH 2 CH 2 -, CHF 2 CF 2 CH 2 CH 2 -, CF 3 (CF 2) 2 CH 2 CH 2 -, CF 3 ( _{CF 2) 3 CH 2 CH 2} -, CF 3 (CF 2) 4 CH 2 CH 2 -, CF 3 (CF 2) 5 CH 2 CH 2 -, CF 3 (CF 2) 6 CH 2 CH 2 -, CF _{3 (CF 2) 7 CH 2} CH 2 -, CF 3 (CF 2) 8 CH 2 CH 2 -, CF 3 (CF 2) 9 CH 2 CH 2 -, CF 3 (CF 2) 11 CH 2 CH 2 - _{, CF 3 (CF 2) 15} CH 2 CH 2 -, CF 3 (CF 2) 5 O (CF 3) CF-, CF 3 (CF 2) 2 O (CF 3) CFCF 2 O (CF 3) CF- _{, CF 3 (CF 2) 2} O (CF 3) CFCF 2 O (CF 3) CFCF 2 O (CF 3) CFCF 2 O (CF 3) CF-, CF 3 (CF 2) 5 O (CF 3) CF -. Although the straight chain structure has been exemplified above, it may be branched structure such as isopropyl group.

Examples of the fluorine-containing organic compound containing an aromatic hydrocarbon and / or a heterocycle include a pentafluorophenyl group, a 2,3,5,6-tetrafluorophenyl group, a 3,4,5-trifluorophenyl group, a 2,4- Difluorophenyl group, 3,4-difluorophenyl group, 3,5-difluorophenyl group, nonafluorobiphenyl group,?,?,?, 2,3,5,6-heptafluoro-p- (Trifluoromethyl) phenyl group, 3,5-bis (trifluoromethyl) phenyl group, pentafluorophenylmethyl group, 2,3,5,6-tetrafluorophenylmethyl group, Difluorophenylmethyl group, nonafluorobiphenylmethyl group,?,?,?,?,?,?, And? (trifluoromethyl) phenylmethyl group, 3,5-bis (trifluoromethyl) phenylmethyl group, 4,6-heptafluoro-p-tolylamethyl group, heptafluoronaphthylmethyl group, , 4 ', 4 "-trifluorotrityl group and the like The can.

As the fluorine-containing organic compound, from the viewpoints of surface protection and dispersion stability of the organic-transition metal oxide composite, it is preferable to use a linking group that generates an action to link the transition metal and / or the transition metal compound to the surface of the organic- . That is, it is preferable that the fluorine-containing organic compound is attached to the surface of the organic-transition metal oxide composite by a protective agent containing a linking group at the terminal of the fluorine-containing organic compound.

The linking group is not particularly limited as long as it has an action of linking with a transition metal and / or a transition metal compound. The connection includes adsorption and coordination, but is preferably a chemical bond such as ionic bond or covalent bond. The number of the linking groups in the protecting agent may be one or more in the molecule. However, in consideration of the solubility in solution, dispersion stability and oil repellency, it is preferable that the linking group is one in one molecule of the protecting agent. When the number of the linking groups is one in one molecule, the protective agent binds to the organic-transition metal oxide complex or the dimer is formed by a two-molecule reaction to stop the reaction. Since the dimer has weak adhesion with the organic-transition metal oxide composite, it can be easily removed by providing a step of washing and removing in the production process of the organic-transition metal oxide composite. If there are two or more linking groups in one molecule, the nanoparticles may be connected to each other, and particles may easily aggregate in the ink.

Examples of the linking group include a hydrophilic group or an ammonium salt such as a carboxyl group, an amino group, a hydroxyl group, a thiol group, an aldehyde group, a sulfonic acid group, an amide group, a sulfonamide group, a phosphoric acid group, a phosphinic acid group and a P = O group, an imidazolium salt, And ionic liquids such as sulfonium salts, sulfonium salts, phosphonium salts, morpholinium salts and piperidinium salts. The linking group is preferably at least one selected from the functional groups represented by the following formulas (1a) to (1n).

(Wherein Z ₁ , Z ₂ and Z ₃ each independently represents a halogen atom or an alkoxy group)

Examples of the protective agent containing a linking group at the terminal of the fluorine-containing organic compound suitably used for the device material for a hole injection and transport layer according to the present invention include a protective agent represented by the following general formula (I).

(I)

(Wherein Y represents the above linking group and Q represents a straight chain, branched or cyclic aliphatic hydrocarbon group, aromatic hydrocarbon group, aliphatic heterocyclic group, aromatic heterocyclic group, or a combination thereof or a direct bond, A and A 'are each independently a -NH-, -N =, -S-, -O- , -NH (C = O) -, -O- (C = O) -, -O- (SO 2) -, - (C = O) -O-, -S- (C = O) -O-, -SiR ₂ - (C = O) -O-, -SiR ₂ - or a direct bond, Branched or cyclic aliphatic hydrocarbon group, FQ and FQ 'each independently represent the fluorine-containing organic compound, and n is 0 or an integer of 1 or more)

Wherein A and / or A 'are -NH-, -N =, -S-, -O- , -NH (C = O) -, -O- (C = O) -, -O- (SO 2) -, -O- (C = O) -O-, -S- (C = O) -O-, -SiR ₂ - (C = O) -O- or -SiR ₂ - Is easily cleaved at the A and / or A 'portion, and the fluorine organic compound represented by FQ is easily decomposed, so that the sensitivity of the wettability change pattern forming step is improved.

When Q contains an aromatic hydrocarbon group or an aromatic heterocyclic group, since Q can contribute to enhancement of charge mobility in the hole injecting and transporting layer, there is an advantage in high efficiency including low voltage. When the fluorine-containing organic compound FQ is decomposed and removed in the case of A and / or A 'being cleaved by the treatment for decomposing the fluorine-containing organic compound described later, the portion of Q containing an aromatic hydrocarbon and / -Transition metal oxide complex, Q can contribute to higher efficiency of the device when the charge transporting property is high.

FQ is a monovalent fluorine-containing organic compound group, and FQ 'is a divalent fluorine-containing organic compound group.

When n is 1 or more, it is likely to be cleaved at the A 'portion by energy irradiation, and the fluorine organic compound represented by FQ tends to be decomposed. The case where n is 1 or more includes, for example, -O- (CH ₂ ) _p -O- (CH ₂ ) ₂ - (CF ₂ ) _q -CF ₃ .

n is preferably not more than 5, and preferably not more than 4 because the decomposition rate is increased.

Examples of the protective agent represented by the above formula (I) include, but are not limited to, the following structures.

(wherein n and n 'are integers of 1 to 5, m and m' are 0 or an integer of 1 to 5, 1 is 0 or an integer of 1 to 5, and Y is a group represented by the above formulas (1a) to Functional group)

The fluorine-containing organic compound attached to the surface may be a polymer compound, but preferably has a molecular weight of 1000 or less. When the molecular weight is increased, the ratio of the linking group to the organic component in one molecule of the fluorine-containing organic compound becomes smaller, so that the probability of bonding with the nanoparticles becomes smaller and the dispersibility becomes worse, the control of the uniformity of the particle diameter becomes difficult, . Further, if the molecular weight of the fluorine-containing organic compound adhered to the surface increases, the proportion of the organic component remaining in the device becomes large, which may adversely affect properties such as high voltage. Further, it takes time to decompose the organic component in the photocatalytic treatment, and the throughput may be deteriorated.

The molecular weight of the fluorine-containing organic compound adhered to the surface means the molecular weight of the compound itself when it has no molecular weight distribution, and the polystyrene reduced value measured by gel permeation chromatography (GPC) Means the weight average molecular weight.

In the device material for a hole injection and transport layer of the present invention, the content ratio of the organic-transition metal oxide complex, which is the reaction product of the organic transition metal complex, and the organic compound including the fluorine-containing organic compound adhered to the surface thereof, And, although not particularly limited, it is preferable that in the organic-transition metal oxide composite, fluorine atoms attached to the surface are added in an amount of 10 to 200 parts by weight based on 100 parts by weight of transition metal atoms. In the organic-transition metal oxide composite, the molar ratio of the transition metal atom to the fluorine atoms attached to the surface is preferably 5: 1 to 1: 5. In the organic-transition metal oxide composite, the molar ratio of the transition metal atom to the carbon atom is preferably 1: 2 to 1: 200, more preferably 1: 5 to 1:20. These ratios can be obtained by, for example, NMR or X-ray photoelectron spectroscopy.

The amount of the fluorine-containing organic compound adhering to the surface of the device material for the hole injection transport layer according to the present invention is appropriately selected depending on the requirement for the liquid repellency of the layer formed using the device material for the hole injection transport layer It is also good.

For example, the contact angle of the liquid having a surface tension of 28.5 mN / m is selected to be 25 ° or more, more preferably 45 ° or more, furthermore preferably 55 ° or more.

The method for producing a device material for a hole injection and transport layer used in the present invention is not particularly limited as long as it is a method capable of obtaining a material in which a fluorine-containing organic compound is attached to the surface of an organic-transition metal oxide composite which is a reaction product of the organic transition metal complex But is not limited thereto. The organic-transition metal oxide complex in which the fluorine-containing organic compound is attached to the surface includes, for example, an organic transition metal complex and a protective agent having a linking group at the terminal of the fluorine-containing organic compound in an organic solvent, In an organic solvent having a carbonyl group and / or a hydroxyl group. Alternatively, the organic transition metal complex may be reacted in the presence of oxygen in an organic solvent, preferably an organic solvent having a carbonyl group and / or a hydroxyl group to obtain an organic-transition metal oxide complex, and the organic-transition metal oxide complex and fluorine Containing organic compound is allowed to act on the surface of the organic-transition metal oxide composite by reacting a protective agent having a linking group at the terminal of the organic-transition metal oxide complex.

II. Ink for hole injection transport layer

The first embodiment of the ink for forming a hole injection transport layer according to the present invention is characterized by containing a device material for a hole injection transport layer according to the present invention and an organic solvent.

The second embodiment of the ink for forming a hole injection transport layer according to the present invention includes an organic-transition metal oxide complex which is a reaction product of an organic transition metal complex and a linking group which generates an action of linking with a transition metal and / or a transition metal oxide Containing organic compound and an organic solvent.

The third embodiment of the ink for forming a hole injection transport layer according to the present invention is characterized in that it contains an organic transition metal complex and a fluorine-containing organic compound containing a linking group which generates an action of linking with a transition metal and / or a transition metal oxide, Or an organic solvent having a hydroxyl group.

The second and third embodiments of the ink for forming a hole injection transport layer can be used in the process of forming the hole injection transport layer, for example, in the ink for forming a hole injection transport layer (coating solution) , A fluorine-containing organic compound is attached to the organic-transition metal oxide complex which is a reaction product of an organic transition metal complex, which is a device material for a hole injection and transport layer according to the present invention, upon reaction at the time of light irradiation, Material can be generated.

The ink for forming a positive hole injection transport layer according to the present invention may contain another compound as necessary. An additive such as a binder resin or a coating improver that does not become a trap of a hole-transporting compound and a hole as described later is added to the device material and the organic solvent for the hole injection and transport layer according to the present invention and dissolved or dispersed An ink for forming a hole injection transport layer may be produced.

As the organic solvent used in the first and second types of ink, an organic-transition metal oxide complex which is a reaction product of a device material for a hole injection transport layer according to the present invention or an organic transition metal complex and a transition metal and / There is no particular limitation as long as the fluorine-containing organic compound containing a linking group generating an action of linking with the transition metal oxide and other components contained as necessary are dissolved or dispersed well. Examples thereof include toluene, xylene, dodecylbenzene, Cyclohexanone, tetralin, mesitylene, anisole, methylene chloride, tetrahydrofuran, dichloroethane, chloroform, ethyl benzoate, butyl benzoate, diphenyl ether, cyclohexylbenzene, 1- .

Further, in the present invention, since the fluorine-containing organic compound is attached to the surface of the organic-transition metal oxide composite, a fluorine-based solvent is suitably used. For example, trifluoromethylbenzene, ethyl heptafluoro-n-butyrate, methyl heptafluoro-n-butyrate, 1,1,3,3-hexafluoro-2-propanol, All of the above solvents such as 3-hexafluoro-2-phenyl-2-propanol, 1H, 1H-trifluoroethanol, 1H, 1H, 3H-tetrafluoropropanol, 1H, 1H, Or a partially fluorinated one may be used. The above solvent may be used alone or as a co-solvent in which a plurality of solvents are mixed.

As the organic solvent having a carbonyl group and / or a hydroxyl group used in the third ink, the same organic solvent as described in the portion of the device material for a hole injection and transport layer according to the present invention can be used.

The ink of the first form may be produced by mixing the organic solvent for the hole injection transport layer-related device material according to the present invention. Further, it is also possible to dissolve or disperse a fluorine-containing organic compound containing an organic transition metal complex and a linking group which generates an action of linking with a transition metal and / or a transition metal oxide in an organic solvent having a carbonyl group and / or a hydroxyl group, The transition metal in the metal complex may be oxidized to obtain the positive hole injection transport layer ink of the present invention. Examples of the oxidizing method include heating in the presence of oxygen or light irradiation.

The organic-transition metal oxide complex in the second type of ink is preferably obtained by dissolving or dispersing an organic transition metal complex in an organic solvent having a carbonyl group and / or a hydroxyl group and oxidizing the transition metal in the organic transition metal complex .

In the case of heating as a method of oxidizing, examples of the heating means include a method of heating on a hot plate or a method of heating in an oven. The heating temperature is preferably 50 to 250 占 폚.

In the case of irradiating light as a method of oxidizing, a method of exposing ultraviolet rays may be mentioned as the light irradiating means.

It is preferable to appropriately control the interaction between the organic transition metal complex and the organic-transition metal oxide complex depending on the heating temperature or the light irradiation amount.

The content of the hole injection transporting layer-related device material according to the present invention in the ink for forming a positive hole injection transport layer according to the present invention can be appropriately adjusted according to the object and is not particularly limited. For example, the content may be 0.1 to 10.0 By weight is preferable.

III. Method of manufacturing device

A first aspect of a manufacturing method of a device according to the present invention is a manufacturing method of a device having two or more electrodes opposing to a substrate and a hole injection transport layer disposed between two of the electrodes,

A hole injecting and transporting layer forming step of forming a hole injecting and transporting layer containing a device material for a hole injecting and transporting layer according to the present invention on a substrate having a first electrode layer formed in a pattern shape,

A photocatalyst-containing layer substrate on which a photocatalyst-containing layer containing at least a photocatalyst is formed on a substrate is disposed on the hole injection and transport layer with a gap that can act as a photocatalyst accompanied by energy irradiation, And a wettability change pattern forming step of forming a wettability change pattern in which the wettability is changed on the surface of the hole injection transport layer.

A second aspect of a method of manufacturing a device according to the present invention is a method of manufacturing a device having two or more electrodes opposing to a substrate and a hole injecting and transporting layer disposed between two of the electrodes,

A hole injecting and transporting layer forming step of forming a hole injecting and transporting layer containing a device material for a hole injecting and transporting layer according to the present invention on a substrate having an electrode layer formed in a pattern shape;

And a wettability change pattern forming step of forming a wettability change pattern whose wettability is changed on the surface of the hole injection transport layer by irradiating vacuum ultraviolet rays in a pattern shape.

According to the present invention, since the hole injecting and transporting layer contains a material to which a liquid-repellent fluorine-containing organic compound is adhered, the fluorine-containing organic compound is decomposed by the action of a photocatalyst or irradiation of vacuum ultraviolet rays to remove fluorine, It is possible to generate a large difference in wettability between the irradiated portion and the unirradiated portion. A wettability change pattern is formed by irradiating energy or irradiating vacuum ultraviolet rays through a photocatalyst-containing layer to a hole injection transport layer whose wettability can be changed, and by utilizing the difference in wettability of the wettability change pattern, A device layer having a pattern shape necessary for the device can be laminated on the substrate by a coating method.

According to the present invention, since the organic-transition metal oxide complex contained in the hole injection transport layer-related device material of the present invention contained in the hole injection transport layer has resistance to ultraviolet light used in the wettability change pattern formation process, It has an advantage that the injection transportability is not deteriorated even through the wettability change pattern forming step and is not damaged. Further, by passing through the wettability change pattern formation step such as photocatalytic treatment, the device material for the hole injection transport layer according to the present invention has an increased ionization potential and an improved hole injection property. The device material for a hole injection and transport layer according to the present invention has a high heat resistance and light resistance and is therefore hard to deteriorate and the hole injecting property is improved by passing through the wettability change pattern forming step so that the device manufactured by the manufacturing method of the present invention has an improved lifetime .

Further, since the device material for the hole injection transport layer according to the present invention is resistant to heating at a relatively high temperature (for example, 200 DEG C), the wettability change pattern is not impaired during the heating process, Can be performed.

A device according to the present invention is a device having two or more electrodes opposed to each other on a substrate and a hole injecting and transporting layer disposed between two of the electrodes.

The device according to the present invention also includes a quantum dot light emitting element having a hole injecting and transporting layer, an oxide compound solar cell, and the like in addition to organic devices including organic EL elements, organic transistors, dye-sensitized solar cells, organic thin film solar cells and organic semiconductors do.

A method of manufacturing a device of the present invention will be described with reference to the drawings.

1 (A) to 1 (C) are process drawings showing an example of a manufacturing method of a device of the present invention. First, as shown in Fig. 1A, a first electrode layer 3 is formed in a pattern on a substrate 2, and on the first electrode layer 3, a hole injection and transport layer device A hole injection and transport layer 4 containing a material is formed (hole injection and transport layer formation step). 1B, a base body 22, a light-shielding portion 23 formed in a pattern on the base body 22, and a light-shielding portion 23 formed on the base 22 so as to cover the light-shielding portion 23, And a photocatalyst-comprising layer substrate 21 having a photocatalyst-containing layer 24 containing a photocatalyst are prepared. Next, the photocatalyst-comprising layer substrate 21 is disposed on the hole injection and transport layer 4 with a space that can act as a photocatalyst accompanied by energy irradiation, and then the hole injection and transport layer 4 The energy ray 27 is irradiated in a pattern shape. The irradiation of the energy ray 27 causes the hole injecting and transporting layer 4 to be in contact with the hole injecting and transporting layer 4 in the exposure portion of the hole injecting and transporting layer 4 from the action of the photocatalyst contained in the photocatalyst- The fluorine decomposing portion 5 of the hole injecting and transporting layer in which the fluorine-containing organic compound present on the surface of at least the surface layer of the hole injection transporting layer device material of the hole injection transporting layer is decomposed and removed, (11) is formed. On the other hand, in the unexposed portion of the hole injecting and transporting layer 4, the fluorine-containing organic compound existing on the surface of the hole injection transporting layer device material in the surface layer portion of the hole injecting and transporting layer 4 remains as it is and becomes the lyophobic region 12 Pattern forming process). In this manner, the substrate 1 for a device is obtained. Thereafter, the device can be manufactured by laminating at least the layer of the pattern shape necessary for the device on the lyophilic area 11 on the device substrate 1, and laminating the second electrode layer.

2 (A) to 2 (C) are process drawings showing another example of a manufacturing method of a device of the present invention.

First, as shown in Fig. 2A, a first electrode layer 3 is formed in a pattern on a substrate 2, a partition (partition wall 6a) is formed in an opening of the pattern, A hole injecting and transporting layer 4 containing a device material for a hole injecting and transporting layer according to the present invention is formed on the electrode layer 3 and the partition (partition wall 6a) (the hole injecting and transporting layer forming step). Here, the substrate 2 is a light-transmitting substrate, and the partition (partition 6a) is a partition for reflecting or absorbing the energy ray irradiated in the wettability change pattern forming step. Next, as shown in Fig. 2 (B), a photocatalyst-comprising layered substrate 21 having a base body 22 and a photocatalyst-containing layer 24 containing a photocatalyst formed on the base body 22 is prepared. Then, the photocatalyst-containing layer substrate 21 is disposed on the hole injection and transport layer 4 with a space that can act as a photocatalyst accompanied by energy irradiation. Then, the energy ray 27 is emitted from the substrate 2, . In this case, since the partition (partition wall 6a) reflects or absorbs the energy ray, the portion where the partition (partition wall 6a) is not formed is irradiated with the energy ray 27, The part where the barrier rib 6a is formed is not irradiated with the energy ray 27. [ The irradiation of the energy ray 27 causes the hole injecting and transporting layer 4 to emit light in the exposure portion of the hole injecting and transporting layer 4 from the action of the photocatalyst contained in the photocatalyst containing layer 24 as shown in Figure 2 (C) The fluorine decomposing portion 5 of the hole injecting and transporting layer in which the fluorine-containing organic compound present on the surface of at least the surface layer of the hole injection transporting layer device material of the hole injection transporting layer is decomposed and removed, (11) is formed. On the other hand, in the unexposed portion of the hole injecting and transporting layer 4, the fluorine-containing organic compound existing on the surface of the hole injection transporting layer device material in the surface layer portion of the hole injecting and transporting layer 4 remains as it is and becomes the lyophobic region 12 Pattern forming process). Thus, the substrate 1 for a device is obtained. Thereafter, a device layer having a pattern shape necessary for the device can be laminated on the lyophilic area 11 on the device substrate 1 by the application method, and then the device can be manufactured by laminating the second electrode layer have.

2 (A) to 2 (C), since the partition for reflecting or absorbing the energy ray to be irradiated functions as a mask, it is unnecessary to deliberately prepare a light shielding portion or a separate photomask in the photocatalyst- The hole injection transport layer can be subjected to energy irradiation in a pattern shape, which has a great advantage in the manufacturing process. Since the hole injection transport layer used in the hole injection transport layer of the present invention has a higher transmittance in the ultraviolet light wavelength region than the conventional organic hole injection transport material, energy irradiation from the back surface of the hole injection transport layer is also possible It becomes.

3 (A) to 3 (C) are process drawings showing another example of a manufacturing method of a device of the present invention.

3 (A), a first electrode layer 3 is formed in a pattern on the substrate 2, a partition (partition wall 6a) is formed in the opening of the pattern, A hole injection and transport layer 4 containing the device material for a hole injection and transport layer according to the present invention is formed on the substrate 3 and the partition (partition wall 6a) (hole injection and transport layer formation step). Next, as shown in Fig. 3 (B), a photocatalyst-comprising layered substrate 21 having a base 22 and a photocatalyst-containing layer 24 containing a photocatalyst formed on the base 22 is prepared. Next, the photocatalyst-comprising layer substrate 21 is disposed on the hole injection and transport layer 4 with a space that can act as a photocatalyst accompanied by energy irradiation, and then the hole injection and transport layer 4 The ultraviolet laser beam 28 is scanned and irradiated in a pattern. As shown in FIG. 3C, the photocatalyst contained in the photocatalyst-containing layer 24 is irradiated with the ultraviolet laser light 28, so that in the exposure portion of the hole injecting and transporting layer 4, the hole injecting and transporting layer 4 ) Is formed on the surface of the hole injection transporting layer device material of at least the surface layer of the hole injection transporting layer (4), and the surface of the hole injection transporting layer device Regions 11 are formed. On the other hand, in the unexposed portion of the hole injecting and transporting layer 4, the fluorine-containing organic compound existing on the surface of the hole injection transporting layer device material in the surface layer portion of the hole injecting and transporting layer 4 remains as it is and becomes the lyophobic region 12 Pattern forming process). Thus, the substrate 1 for a device is obtained. Thereafter, a device layer having a pattern shape necessary for the device can be laminated on the lyophilic area 11 on the device substrate 1 by the application method, and then the device can be manufactured by laminating the second electrode layer have.

4 (A) to 4 (C) are process drawings showing another example of the manufacturing method of the device of the present invention.

First, as shown in Fig. 4 (A), a first electrode layer 3 is formed in a pattern on a substrate 2, a partition (partition wall 6a) is formed in the opening of the pattern, A hole injection and transport layer 4 containing the device material for a hole injection and transport layer according to the present invention is formed on the substrate 3 and the partition (partition wall 6a) (hole injection and transport layer formation step). 4 (B), a metal mask 30 is disposed on the surface of the hole injection and transport layer 4, and vacuum ultraviolet light (not shown) is applied to the hole injection and transport layer 4 via the metal mask 30, (29). As shown in FIG. 4C, by the irradiation of the vacuum ultraviolet light 29, the surface of the hole injection transporting layer device material of at least the surface layer portion of the hole injection transporting layer 4 in the exposure portion of the hole injection transporting layer 4 The fluorine decomposing portion 5 of the hole injecting and transporting layer in which the fluorine-containing organic compound existing in the hole injecting and transporting layer 4 is decomposed and removed is formed and the lyophilic region 11 is formed on the surface of the exposure portion of the hole injecting and transporting layer 4. On the other hand, in the unexposed portion of the hole injecting and transporting layer 4, the fluorine-containing organic compound existing on the surface of the hole injection transporting layer device material in the surface layer portion of the hole injecting and transporting layer 4 remains as it is and becomes the lyophobic region 12 Pattern forming process). Thus, the substrate 1 for a device is obtained. Thereafter, a device layer having a pattern shape necessary for the device can be laminated on the lyophilic area 11 on the device substrate 1 by the application method, and then the device can be manufactured by laminating the second electrode layer have.

As described above, the lyophilic region 11 is formed at least on the surface layer portion of the hole injection and transport layer 4 in the portion where the action of the photocatalyst accompanies the energy irradiation or the portion where the vacuum ultraviolet light is irradiated. This is because the fluorine-containing organic compound present on the surface of the hole injection transporting layer device material in at least the surface layer portion of the hole injecting and transporting layer 4 is decomposed and removed by the action of a photocatalyst accompanied by energy irradiation or irradiation of vacuum ultraviolet light, And is considered to be a region having lyophilicity to the liquid repellency of the hole injection transport layer in which the fluorine-containing organic compound is present on the surface. Therefore, as illustrated in Fig. 1 (C), Fig. 2 (C), Fig. 3 (C), and Fig. 4 (C), in the constituent material of the hole injection and transport layer 4, The lyophilic area 11 composed of the surface of the fluorine decomposition part 5 of the injection transport layer and the lyophobic area 11 which is a region other than the lyophilic area 11 in which the fluorine in the constituent material of the hole injection transport layer 4 is not decomposed and removed, A pattern composed of the region 12 can be formed.

The term "lyophilic region" refers to a region having a liquid contact angle smaller than that of the liquid-repellent region, and is a region having good wettability with respect to the layer-forming ink or the like formed adjacent to the hole- The term "liquid-repellent region" refers to a region having a liquid contact angle larger than that of the lyophilic region, and is a region where the wettability with respect to the layer-forming ink or the like is deteriorated.

When a liquid having a surface tension of 28.5 mN / m is used, the contact angle of the liquid in the liquid-repellent region is preferably 10 ° or more, more preferably 20 ° or more, more preferably 40 ° or more High.

Further, in the liquid repellent region, the contact angle of the liquid having a surface tension of 28.5 mN / m is preferably 25 degrees or more, more preferably 45 degrees or more, still more preferably 55 degrees or more. If the contact angle of the liquid is too small, the liquid repellency is not sufficient, and there is a possibility that the layer forming ink or the like adheres to the liquid repellent region.

On the other hand, in the lyophilic region, the contact angle of liquid having a surface tension of 28.5 mN / m is preferably 20 ° or less, more preferably 10 ° or less, further preferably 5 ° or less. If the contact angle of the liquid is too high, there is a possibility that the layer-forming ink or the like becomes difficult to spread, and there is a possibility that the layer formed adjacent thereto becomes incomplete.

The contact angle of the liquid can be measured by measuring the contact angle of the liquid having various surface tensions using a contact angle meter (CA-Z type, manufactured by Kyowa Chemical Industry Co., Ltd.) (after 5 seconds by dropping droplets from the microsyringe) From the result, or the result thereof can be obtained as a graph. In this measurement, a wetting index standard solution made by Junsei Kagaku Co., Ltd. is used as a liquid having various surface tensions.

1. Formation process of hole injection transport layer

The first hole injecting and transporting layer forming step in the present invention is a step of forming a hole injecting and transporting layer containing a device material for a hole injecting and transporting layer according to the present invention on a substrate having a first electrode layer formed in a pattern shape.

(Formation method of hole injection and transport layer)

The method of forming the hole injection and transport layer is not particularly limited as long as it is a method capable of forming the device material for the hole injection and transport layer according to the present invention on the entire surface of the substrate on which the first electrode layer is formed in a pattern. For example, the wet process for forming the layer by forming the hole injection transport layer-forming ink of the first, second, or third aspect of the present invention and applying the ink using the ink is preferable in terms of process superiority Do. It is also possible to use a transfer method in which a layer formed by applying the ink is transferred. In addition, the hole injection / transport layer of the present invention may be formed on the first electrode layer, for example, a separate hole injection layer is formed on the substrate on which the first electrode layer is formed in a pattern.

The ink for forming a positive hole injection transport layer according to the present invention contains the above-mentioned &quot; II. Ink for forming a positive hole injection transport layer &quot;. By appropriately adding other components as described above to the ink for forming a hole injection transport layer, a hole injection transport layer further containing other components can be formed.

It may also have a step of heating the hole injection transport layer forming ink in the presence of oxygen before application. In this case, the amount of the transition metal oxide in the device material for the positive hole injection transport layer is increased, and the hole injection transportability is sometimes improved.

As a method of applying the ink for forming the hole injection transport layer, a method capable of forming the above-mentioned material uniformly on the entire surface of the substrate may be used. For example, a die coating method, a spin coating method, a dip coating method, A spray coating method, a bar coating method, a gravure coating method, a blade coating method, a casting method, an ink jetting method, a nozzle printing method, an aerosol method, a flexographic printing method, a screen printing method and an offset printing method .

After the ink for forming the hole injection transport layer is applied, the drying treatment may be performed. As the drying method, a general drying method can be used, and for example, a method of heating can be mentioned. Examples of the heating method include a method of passing or standing in a device for heating a specific whole space such as an oven, a method of blowing hot air, a method of directly heating by far infrared rays, a method of heating on a hot plate, etc. Can be used. When heated in the presence of oxygen, the content of the transition metal oxide in the device material for hole injection and transport layer according to the present invention contained in the layer increases, and hole injection transportability is sometimes improved.

The step of forming the hole injection transport layer may include a step of irradiating light in the presence of oxygen in addition to heating in the presence of oxygen.

The film thickness of the hole injection transport layer can be appropriately determined depending on the purpose or the adjacent layer, but is usually from 0.1 to 1000 nm, preferably from 1 to 500 nm.

The work function of the hole injection transport layer is preferably 5.0 to 6.0 eV, more preferably 5.0 to 5.8 eV in terms of hole injection efficiency.

(Board)

The substrate may be light-transmitting or non-light-transmitting. For example, in the case of taking out light from the substrate side in the device of the present invention or in the process of manufacturing the device of the present invention, when forming a pattern composed of the lyophilic area and the lyophobic area, It is preferable that the substrate is translucent. Examples of the translucent substrate include quartz and glass. As the substrate when light transmittance is not required, metals such as aluminum and alloys thereof, plastics, woven fabrics, and nonwoven fabrics can be used.

(First electrode layer)

The first electrode layer used in the present invention is formed on the substrate in a pattern shape.

The material for forming the first electrode layer is not particularly limited as long as it is a conductive material.

In addition, the material for forming the first electrode layer may or may not have transparency. For example, in the device of the present invention, in the case of taking out light from the substrate side or in the process of manufacturing the device of the present invention, when a pattern composed of the lyophilic area and the lyophobic area is formed, When irradiated, the first electrode layer preferably has transparency. Preferable examples of the material having conductivity and transparency include In-Zn-O (IZO), In-Sn-O (ITO), ZnO-Al and Zn-Sn-O. On the other hand, for example, in the device of the present invention, when light is extracted from the opposite side of the substrate, transparency is not required for the first electrode layer. In this case, metals having conductivity can be used. Specific examples thereof include Au, Ta, W, Pt, Ni, Pd, Cr, or an Al alloy, Ni or Cr alloy.

The first electrode layer is formed in a pattern shape. As a method for forming the first electrode layer, a general electrode film forming method can be used, and examples thereof include a sputtering method, an ion plating method, and a vacuum deposition method. As a patterning method of the first electrode layer, a photolithography method can be used.

2. Wettability Change Pattern Formation Process

The wettability change pattern forming step in the present invention is a step of forming a wettability change pattern in which the wetting is changed on the surface of the hole injection transporting layer.

The method of energy irradiation in the form of a pattern for forming a wettability change pattern on the surface of the hole injection transport layer is not particularly limited as long as it is a method capable of decomposing the material contained in the hole injection transport layer into a pattern shape, A method capable of generating an active oxygen species such as a radical is used. This is because the fluorine-containing organic compound attached to the surface of the material contained in the hole injection and transport layer can be decomposed by the strong oxidizing and reducing power of the active oxygen species.

The wettability change pattern forming step in the present invention includes the steps of: (1) using a photocatalyst-containing layer substrate having a photocatalyst-containing layer and irradiating energy in a pattern shape by the action of a photocatalyst, A step of forming a pattern composed of a lyophilic area in which fluorine is decomposed and removed and a lyophobic area in which fluorine is not decomposed and removed by decomposing and removing fluorine of the material, and (2) a step of irradiating vacuum ultraviolet light in a pattern shape, A step of forming a pattern comprising a lyophilic region in which fluorine is decomposed and removed and a liquid-repellent region in which fluorine is not decomposed and removed by decomposing and removing fluorine in the material contained in the transport layer. Further, for example, a method of irradiating an electron beam or a plasma through a mask having an opening in a pattern shape, a method of spraying oxygen radicals in a vacuum through a mask, or the like may be used.

The lyophilic region is a portion in which the action of the photocatalyst accompanies the energy irradiation or the portion irradiated with the ultraviolet ray of the vacuum, and the fluorine-containing organic compound attached to the surface of the device material for the hole injection and transport layer contained in the hole injection- Decomposable portion of the hole injection transport layer in which fluorine is removed.

The lyophilic area is a region in which the fluorine-containing organic compound attached to the surface of the device material for the hole injection and transport layer is not contained or the amount of the fluorine-containing organic compound adhered to the surface of the material originally contained in the hole injection- The liquid region contains a small amount of the fluorine-containing organic compound.

Further, the fact that the fluorine-containing organic compound attached to the surface of the hole injection transport layer-containing device material contained in the hole injection and transport layer of the lyophilic area is decomposed to remove fluorine means that the hole injection transport layer It can be confirmed by analyzing the distribution of fluorine by TOF-SIMS and comparing them.

The lyophilic area and the lyophobic area are not particularly limited as long as the functional layer of a device such as a light emitting layer can be patterned in a desired pattern. For example, when the first electrode layer is formed in a pattern shape, the lyophilic area is disposed on the pattern of the first electrode layer, and the lyophobic area is disposed over the opening of the pattern of the first electrode layer as shown in Fig. .

5, when the partition (partition 6a) is formed on the substrate 2 on which the first electrode layer 3 is formed, the partition (partition 6a) The liquid-repellent region 12 is disposed on the top P1 and the lyophilic region 11 is formed on the side portion P2 of the partition (partition 6a) and on the partition P3 (partition 6a) It is preferable to arrange them. When an adjacent layer is formed on such a hole injection transport layer, the ink on the adjacent layer is not deposited on the liquid-repellent region disposed on the top of the partition, so that the layer is not formed. Therefore, the layer adjacent to the hole- I can do it.

In addition, in the partition wall using the liquid-repellent material and the lyophobicity-imparted partition wall as in the conventional art, since not only the top portion but also the side portion of the partition wall have lyophobicity, the luminescent layer is physically peeled from the side portion of the partition, Emitting layer or the like is not formed. On the other hand, according to the present invention, since the lyophilic area can be arranged on the side of the partition, it is possible to physically peel the light-emitting layer from the side of the partition, or to make thin portions such as the light- .

When the partition is formed, the lyophobic area may be formed on the top of the partition and the lyophobic area 12 may be formed only at the top P1 of the partition (partition wall 6a) as shown in Fig. 5 The liquid repellent region 12 may be disposed on a part of the top P1 and side P2 of the partition (partition wall 6a). In the case of the former, the liquid-repellent region may be formed on the entire top of the dividing section, or may be formed on a part of the top of the dividing section. In the latter case, the liquid-repellent region 12 may be formed to a position lower than the assumed height in the case where the surface of the laminated ink layered on the positive hole injection transport layer is flattened according to the design of the device, The liquid-repellent region 12 may be formed to a position higher than the height.

The pattern shape of the lyophilic area and the liquid-repellent area is not particularly limited as long as the layer laminated in a desired pattern shape can be patterned on the hole injection transport layer. For example, when the first electrode layer is formed in a pattern shape, the pattern shape of the lyophilic region and the liquid-repellent region is appropriately selected in accordance with the pattern shape of the first electrode layer. Specifically, when the first electrode layer is formed in a stripe shape, the lyophilic area corresponding to the stripe pattern of the first electrode layer is also formed in a stripe shape. Further, when the first electrode layer is formed in a mosaic shape corresponding to the pixel, the lyophilic area may be formed in a stripe shape, or may be formed in a lattice shape or a mosaic shape.

Hereinafter, each of the methods (1) and (2) will be described with respect to the wettability change pattern forming step.

(1) Method using photocatalytic action

A method of using the action of a photocatalyst accompanying energy irradiation is a method of using a photocatalyst-containing layer substrate on which a photocatalyst-containing layer containing at least a photocatalyst is formed, and the photocatalyst-containing layer substrate is irradiated with energy A method of irradiating energy in a pattern shape after disposing a gap which can act as a photocatalyst.

The mechanism of the decomposition of the fluorine-containing organic compound attached to the surface of the hole injection transport layer-use device material by the material contained in the hole injection transport layer due to the action of the photocatalyst accompanying the energy irradiation is not necessarily clarified, Containing layer, the oxidation-reduction reaction is caused by the photocatalyst contained in the fluorine-containing organic compound, and the resulting active oxygen species such as the generated superoxide radical (.O ^2- ) or hydroxy radical (.OH) The fluorine-containing organic compound becomes a decomposition product, and this decomposition product is volatilized and removed, whereby the fluorine-containing organic compound attached to the surface of the hole injection transport layer-containing device material contained in the hole injection transport layer is decomposed to form a fluorine- .

Hereinafter, a method of causing the photocatalyst-containing layer substrate and the photocatalyst-containing layer substrate to act on the hole injection transport layer will be described.

(Photocatalyst-containing layer substrate)

The photocatalyst-comprising layered substrate used in the present invention is formed with a photocatalyst-containing layer containing at least a photocatalyst on a base.

The photocatalyst-containing layer may be formed on the entire surface of the substrate 22 as shown in Fig. 2 (B) or may be formed on the entire surface of the substrate 22, as shown in Fig. 6 (A) The photocatalyst-containing layer 24 may be formed in a pattern on the photocatalyst-containing layer 22.

When the photocatalyst-containing layer is formed in a pattern, the photocatalyst-containing layer is disposed with a predetermined gap with respect to the hole injection and transport layer, and it is not necessary to irradiate the pattern with a photomask when irradiating energy, Whereby the liquid-repellent region in which the material contained in the hole injection and transport layer is decomposed can be formed in a pattern shape. In this case, as the energy irradiation direction, any direction may be employed as long as energy is irradiated to a portion where the photocatalyst-containing layer and the hole injection transport layer face each other. Further, the energy to be irradiated is not limited to being parallel, such as parallel light.

The light-shielding portion may be formed in a pattern shape on the photocatalyst-containing layered substrate. When a photocatalyst-containing layered substrate having a pattern-shaped light-shielding portion is used, it is not necessary to use a photomask or irradiate with laser light in energy irradiation. Therefore, in this case, since the alignment of the photocatalyst-containing layer substrate and the photomask is not necessary, a simple process can be performed, and an expensive apparatus required for the imaging inspection is unnecessary, which is advantageous in terms of cost.

1B, the light shielding portion 23 is formed in a pattern on the substrate 22, and the photocatalyst-containing layer 24 is formed on the light shielding portion 23 The photocatalyst-containing layer 24 may be formed on the base body 22 as shown in Fig. 6 (B), and the light-shielding portion 23 may be formed in a pattern on the photocatalyst-containing layer 24, The light shielding portion may be formed in a pattern on the surface of the substrate on which the photocatalyst-containing layer is not formed.

In the case where the light shielding portion is formed on the substrate and the light shielding portion is formed on the photocatalyst-containing layer, the light shielding portion is disposed in the vicinity of the portion where the photocatalyst-containing layer and the hole injection transport layer are disposed with a gap Therefore, the influence of scattering of energy in the gas or the like can be reduced. As a result, it is possible to carry out the energy pattern inspection very accurately.

When the light shielding portion is formed on the surface of the substrate on which the photocatalyst-containing layer is not formed, for example, the photomask can be adhered to the surface of the light shielding portion to such an extent as to be removable. It is suitable for the case of changing.

The photocatalyst-containing-layer substrate can be the same as the photocatalyst-containing-layer-side substrate specifically described in JP-A-2000-249821.

(Arrangement of photocatalyst-containing layer substrate and hole injection transport layer)

In the present invention, the photocatalyst-comprising layered substrate is disposed on the hole injecting and transporting layer with a gap that can act as a photocatalyst accompanied by energy irradiation. Incidentally, the gap also includes a state in which the photocatalyst-containing layer and the hole injection transport layer are in contact with each other.

The gap between the photocatalyst-containing layer and the hole injection transport layer is preferably 200 mu m or less. And the photocatalyst-containing layer and the hole injecting / transporting layer are disposed at a predetermined interval, so that oxygen, water, and active oxygen species generated by photocatalytic action are likely to be desorbed.

Considering the fact that the pattern accuracy is very good, the photocatalyst is high in sensitivity, and the efficiency of decomposition and removal is good, the interval is more preferably in the range of 0.2 탆 to 20 탆, more preferably in the range of 1 탆 to 10 탆 Lt; / RTI &gt;

On the other hand, for example, in the case of manufacturing a device having a large area exceeding 300 mm x 300 mm, it is very difficult to provide a fine gap as described above between the photocatalyst-containing layer substrate and the hole injection transport layer. In addition, the productivity of the contaminants adhered to the photocatalyst-containing layer is also lowered. Therefore, in the case of manufacturing a relatively large-area device, the gap is preferably in the range of 50 탆 to 150 탆, more preferably in the range of 80 탆 to 120 탆. By setting the gap to the above range, deterioration of the pattern accuracy such as blurring or deviation of the pattern can be suppressed, deterioration of the photocatalytic sensitivity and deterioration of decomposition removal efficiency can be suppressed.

When energy is irradiated to the relatively large area as described above, the setting of the gap in the positioning apparatus between the photocatalyst-containing layer substrate in the energy irradiation apparatus and the hole injection transport layer is set within the range of 10 to 200 mu m, To 75 m. This is because, by setting the set value of the gap within the above range, the photocatalyst-containing layer substrate and the hole injection transport layer can be arranged without contacting each other without significantly deteriorating the pattern accuracy or significantly deteriorating the photocatalyst sensitivity.

Further, the arrangement state having the gap as described above may be maintained only during at least the energy irradiation.

(Energy survey)

The wavelength of light used for energy irradiation is usually set to a range of 450 nm or less, preferably 380 nm or less. This is because the preferred photocatalyst used in the photocatalyst-containing layer as described above is titanium dioxide, and light of the above wavelength is preferable as the energy for activating the photocatalytic action by the titanium dioxide.

Examples of the light source that can be used for the energy irradiation include a mercury lamp, a metal halide lamp, a xenon lamp, an excimer lamp, and various light sources.

As a method of irradiating energy in a pattern shape, a method of irradiating a pattern with a laser such as an excimer or YAG may be used in addition to a method of irradiating the pattern with a light source through a photomask.

The amount of energy to be irradiated at the time of energy irradiation is set to a dose necessary for changing the wettability of the surface of the charge injection and transport layer by the action of the photocatalyst in the photocatalyst-containing layer.

At this time, it is preferable to perform energy irradiation while heating the photocatalyst-containing layer. The sensitivity can be increased and the wettability can be changed efficiently. Concretely, it is preferable to heat the substrate and the mask within the range of 30 占 폚 to 80 占 폚. The temperature difference between the substrate and the mask is preferably as small as possible from the viewpoint of exposure accuracy, but is preferably within 1 캜.

The energy irradiation direction is determined depending on whether or not the light shielding portion is formed on the photocatalyst-containing-layer substrate, the extraction direction of the light of the device, and the like. For example, when the light shielding portion is formed on the photocatalyst-containing layer substrate and the base body of the photocatalyst-containing layer substrate is transparent, energy irradiation is performed from the side of the photocatalyst-containing layer substrate. In the case where the photocatalyst-containing layer is formed in a pattern, for example, the energy irradiation direction may be any direction as long as energy is irradiated to the portion where the photocatalyst-containing layer and the hole injection transport layer face each other as described above. Further, for example, when a photomask is used, energy is irradiated from the side where the photomask is disposed. In this case, the side on which the photomask is disposed needs to be transparent.

As a method of utilizing the action of the photocatalyst accompanying the energy irradiation, specific examples of the form of irradiating energy in a pattern shape using the photocatalyst-containing layered substrate include the following.

When the photocatalyst-containing layer 24 is formed on the entire surface on the substrate 22, the energy is irradiated in a pattern form via the photomask, or as shown in Fig. 2 (B) From the side of the translucent substrate (the back side of the hole injection transport layer) having a partition for reflecting or absorbing a line, and irradiating energy in a pattern shape. When the photocatalyst-containing layer 24 is formed on the entire surface of the substrate 22 as shown in Fig. 3 (B), it may be irradiated with a pattern in a pattern using a laser. When the photocatalyst-containing layer 24 is formed in a pattern on the substrate 22 as shown in Fig. 6 (A), the photocatalyst-containing layer substrate is used as a mask to irradiate energy in a pattern. When the light-shielding portion 23 is formed in a pattern as shown in Fig. 1 (B), the photocatalyst-containing layered substrate is used as a mask to irradiate energy in a pattern.

As a method of using the photocatalyst-containing layer substrate to give the action of the photocatalyst to the hole injection transport layer, there is a method of acting the photocatalyst on the characteristic-modifiable layer using the photocatalyst-containing layer side substrate specifically described in Japanese Patent Application Laid-Open No. 2000-249821 .

(2) Method of irradiating vacuum ultraviolet light in a pattern shape

A method of irradiating vacuum ultraviolet light in a pattern shape includes a method of using a vacuum ultraviolet mask as a mask and irradiating vacuum ultraviolet light as energy.

The mechanism for decomposing the fluorine-containing organic compound attached to the surface of the hole injection transport layer-use device material by the material contained in the hole injection transport layer by the irradiation of the vacuum ultraviolet light is not necessarily clarified, but vacuum ultraviolet light When irradiated, the molecular bond of the fluorine-containing organic compound contained in the hole injection transport layer is cut off by the action of ultraviolet rays of ultraviolet rays, or when oxygen is excited in the presence of oxygen, ozone or an oxygen atom radical acts on the fluorine-containing organic compound It is considered that the fluorine-containing organic compound becomes a decomposition product by volatilization, and the decomposition product of the fluorine-containing organic compound is volatilized and removed, thereby forming a fluorine decomposition part in which fluorine is removed.

The wavelength of vacuum ultraviolet light is not particularly limited as long as it is in a range capable of generating oxygen radicals by acting with oxygen, but it is preferably within a range of 100 nm to 250 nm, and more preferably within a range of 150 nm to 200 nm. If the wavelength is longer than the above range, the oxygen radical generation efficiency is lowered, and the decomposition and removal efficiency of the material contained in the hole injection transport layer may be lowered. If the wavelength is shorter than the above range, it may be difficult to irradiate stable vacuum ultraviolet light.

Examples of the light source used to irradiate the vacuum ultraviolet light in the above wavelength range include an excimer lamp, a low-pressure mercury lamp, and various light sources.

The amount of the vacuum ultraviolet light to be irradiated is not particularly limited as long as it is within a range in which the layer for forming the lyophilic layer can be removed. The amount of the ultraviolet light to be irradiated may be appropriately determined depending on the kind of the material contained in the hole injection and transport layer, You can adjust it.

As the mask for vacuum ultraviolet light which can be used in the irradiation of the vacuum ultraviolet light, any material may be used as long as it can transmit vacuum ultraviolet light in a pattern shape. For example, a metal mask having an opening in a pattern shape, And a mask having a light shielding portion formed in a pattern on the transparent substrate and capable of shielding vacuum ultraviolet light.

The material of the metal mask may be any material as long as it can shield the vacuum ultraviolet light. For example, those described in JP-A-2007-178783 can be used.

On the other hand, as the transparent substrate, any material capable of transmitting vacuum ultraviolet light may be used, and for example, a quartz substrate or the like can be used. As the light-shielding material constituting the light-shielding portion, metals such as chromium and chromium oxide can be mentioned.

Since the vacuum ultraviolet light is dispersed light having no directivity, when vacuum ultraviolet light is irradiated via a vacuum ultraviolet mask, the vacuum ultraviolet mask is moved as close as possible to the hole injection and transport layer, It is preferable not to diffract between the injection transport layer and the vacuum ultraviolet light mask.

In particular, when a partitioning portion such as a partition or an insulating layer is not formed, the vacuum ultraviolet light mask is made as close to the hole injection and transport layer as possible, and the vacuum ultraviolet mask does not contact the hole injection transport layer. It is preferable to dispose a mask.

On the other hand, when a partitioning portion such as a partition or an insulating layer is formed, a mask for vacuum ultraviolet light is arranged so that the mask for vacuum ultraviolet light is brought into contact with the hole injecting and transporting layer while making the mask for vacuum ultraviolet light approach as close as possible to the hole injecting and transporting layer Alternatively, a mask for vacuum ultraviolet light may be arranged so that the mask for vacuum ultraviolet light is brought into contact with the hole injecting and transporting layer while bringing the mask for vacuum ultraviolet light closer to the hole injecting and transporting layer. In the case of using a mask for vacuum ultraviolet light in which a light shielding portion pattern is formed on a transparent substrate, the mask for vacuum ultraviolet light can be fixed so as to be in close contact with the hole injecting and transporting layer .

(3) Adjustment method of wettability change pattern

When a mask having a transmissive region and a light shielding region is used as a mask, the ratio of the area of the transmissive region of the mask to the area of the top of the partition portion And the distance between the hole injection transport layer and the mask may be adjusted so that the liquid repellent area is formed so that the contact angle of the liquid on the surface of the hole injection transport layer side becomes higher from the side of the partition toward the top side.

For example, in the case of the method using the action of the photocatalyst accompanying the above-described energy irradiation, in the case where the light-shielding portion is formed in the pattern shape on the photocatalyst-containing substrate, the light- And a photocatalyst-containing layer substrate having a transmissive region in which only the photocatalyst-containing layer is provided on the substrate can be used. In this case, at least either the ratio of the area S2 of the transmission region of the photocatalyst-comprising-layer substrate to the area S1 of the top of the partition (partition wall 6a) and the distance D between the hole injection transport layer and the photocatalyst- It is possible to form the liquid-repellent region 12 so that the contact angle of the liquid on the surface of the hole injection and transport layer side becomes higher toward the top side from the side of the partition (partition wall 6a).

For example, in the case of the method of irradiating vacuum ultraviolet light described above, by adjusting the ratio of the area S2 of the transmission region of the metal mask to the area S1 of the top portion of the partition (partition wall 6a) The liquid-repellent region 12 can be formed such that the contact angle of the liquid on the surface of the hole injection and transport layer side becomes higher toward the top side from the side of the partition (partition wall 6a).

This is due to the diffraction phenomenon of the light and the effect of the solid angle. The former can be adjusted by adjusting at least one of the ratio of the area of the transmissive area of the mask to the area of the top of the partition and the distance between the hole injecting and transporting layer and the mask so that the amount of energy irradiated to the hole injecting and transporting layer A gradient occurs, and as a result, a gradient occurs in the amount of decomposition of the material contained in the hole injection and transport layer. The latter is vertical to the incidence of light at the top of the dividing portion, and the angle of the side of the dividing portion is small so that the angle of solid angle becomes small and the amount of irradiation of the outer appearance of the light becomes small. As a result, A gradient occurs. This makes it possible to make the contact angle of the liquid inclined at the surface of the hole injection and transport layer side so that the contact angle of the liquid becomes higher toward the top side from the side of the partition.

Further, in the case of a partition having a relatively large film thickness, such as a partition, the distance between the hole injection and transportation layer and the mask is gradually widened from the top side to the side side of the partition. Therefore, depending on the distance between the hole injection and transportation layer and the mask, The contact angle may be inclined.

It is preferable that the area of the transmissive area of the mask is made equal to or larger than the area of the top of the partition when the inclination is caused in the contact angle of the liquid by adjusting the ratio of the area of the transmissive area of the mask to the area of the top of the partition . This is because it is easy to make the contact angle of the liquid in the region located near the boundary between the top portion and the side portion of the partition portion inclined.

3. Compartment forming process

In the present invention, a step of forming a partition may be provided between the patterns of the first electrode layer on the substrate on which the first electrode layer is formed in the pattern shape before the hole injecting and transporting layer forming step, if necessary.

Examples of the partitioning portion include a partition wall and an insulating layer. As exemplified as the partition 6a in FIG. 2A, FIG. 3A and FIG. 4A, the partition may be formed integrally to achieve the functions of both the partition and the insulating layer good. Hereinafter, the barrier ribs and the insulating layer will be described separately.

In the device according to the present invention, the portion where the partition is formed is usually a non-light emitting region.

(1)

In the present invention, as exemplified in Figs. 2A, 3A and 4A, the partition 6a is formed on the substrate 2 on which the first electrode layer 3 is formed, Or the like. Normally, when the first electrode layer is formed in a pattern shape, the partition 6a is formed in the opening of the pattern of the first electrode layer 3.

The barrier ribs are provided to coat the layers formed on the hole injection transport layer in a pattern shape.

The material for forming the barrier rib is not particularly limited and may be an organic material, an inorganic material, or a material used for a barrier rib in a device such as an organic EL device.

Examples of the organic material include ethylene-vinyl acetate copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polystyrene, acrylonitrile-styrene copolymer, ABS resin, polymethacrylic resin, ethylene- Polyvinyl alcohol, cellulose acetate propionate, cellulose acetate butyrate, nylon 6, nylon 66, nylon 12, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, A polyimide resin, a polyamic acid resin, a polyetherimide resin, a polyimide resin, a polyimide resin, a polyimide resin, a polyetherimide resin, a polyetherimide resin, Resins, phenol resins, and urea resins.

Examples of the inorganic material include SiO ₂ and the like.

The height of the barrier rib can be set to about 0.01 탆 to 50 탆. When the barrier ribs are formed separately on the insulating layer, the width of the barrier ribs may be smaller than the width between the patterns of the first electrode layer 3 as shown in Fig. 7 (A) The width of the barrier rib 6a may be wider than the width between the patterns of the first electrode layer 3, as illustrated in Fig. 7 (B).

As a method for forming the barrier rib, a general method such as a photolithography method or a printing method can be used.

(2) Insulating layer

In the present invention, as shown in Figs. 7A and 7B, the insulating layer 6b may be formed in a pattern on the substrate 2 on which the first electrode layer 3 is formed. In general, when the first electrode layer is formed in a pattern shape, the insulating layer 6b is formed in the opening portion of the pattern of the first electrode layer 3 and is formed so as to cover the end portion of the pattern of the first electrode layer. 7A and 7B, the partition 6a is also formed on the insulating layer 6b. Alternatively, only the insulating layer 6b may be formed, and the partition 6a may not be formed.

The insulating layer is provided to prevent conduction between patterns of the adjacent first electrode layers or conduction between the first electrode layer and the second electrode layer.

The material for forming the insulating layer is not particularly limited as long as it has an insulating property, and may be an organic material, an inorganic material, or the like, and a material used for an insulating layer in a device such as an organic EL device.

As a method of forming the insulating layer, a general method such as a photolithography method or a printing method can be used.

The thickness of the insulating layer may be about 10 nm to 50 탆.

4. Other processes

As for other processes in the method of manufacturing a device, conventionally known processes can be appropriately used depending on each device.

The second electrode layer, which is an essential component of the present invention, may be suitably formed by conventionally known processes by properly employing conventionally known materials in accordance with each device. In the device of the present invention, it is preferable that the second electrode layer is formed of a metal or a metal oxide, and the metal oxide such as a metal such as aluminum, gold, silver, nickel, palladium, platinum and the like and an oxide of indium and / .

The electrode is usually formed on the substrate by a method such as a sputtering method, a vacuum deposition method, or the like, but may be formed by a wet method such as a coating method or a dipping method. The thickness of the electrode differs depending on the transparency required for each electrode. When transparency is required, it is preferable that the light transmittance of the electrode in the visible light wavelength region is generally 60% or more, preferably 80% or more, and the thickness in this case is usually about 10 to 1000 nm, preferably about 20 to 500 nm .

IV. device

A first aspect of the device according to the present invention is a device having two or more electrodes opposing to a substrate and a hole injection transport layer disposed between two of the electrodes,

Wherein the hole injection and transport layer contains the device material for a hole injection transport layer according to the present invention and the fluorine containing organic compound of the device material for the hole injection transport layer in the surface layer portion of the hole injection transport layer is decomposed and removed.

A second aspect of the device according to the present invention is a device having two or more electrodes opposing a substrate and a hole injection transport layer disposed between two of the electrodes,

And a hole injection and transport layer which has a partition between patterns of the first electrode layer on the substrate on which the first electrode layer is formed in a pattern shape and which is continuous over the first electrode layer and the partition in the opening of the partition,

At least a part of the fluorine-containing organic compound in the device material for the hole injection transport layer according to the present invention is decomposed and removed in the hole injection and transport layer on the first electrode layer and on the side of the partition in the opening of the partition, And the hole injection transport layer on the top of the layer contains the device material for the hole injection transport layer according to the present invention.

The device of the present invention can be obtained in any form by the above-described method of manufacturing a device according to the present invention.

Hereinafter, the layer structure of the device according to the present invention will be described with reference to the drawings.

Fig. 8 is a schematic cross-sectional view showing a basic layer structure of the first embodiment of the device according to the present invention. Fig. The basic layer structure of the device 10 of the present invention is composed of two electrodes 3 and 9 opposed to each other on the substrate 2 and a hole injection and transport layer 4 disposed between the two electrodes 3 and 9 , And the hole injection and transport layer (4) contains the device material for a hole injection transport layer according to the present invention, and the fluorine containing organic compound of the device material for the hole injection transport layer in the surface layer portion of the hole injection transport layer is decomposed and removed And a fluorine decomposing portion (5) of the hole injecting and transporting layer. The lyophilic areas 11 and the tops of the compartments 6a are formed on the surface layer part of the hole injection and transport layer 4 on the first electrode layer 3 and on the side of the partition part 6a, 12 are formed. (Hereinafter referred to as a functional layer) and an auxiliary layer of the functional layer (hereinafter referred to as an auxiliary layer) on the lyophilic area 11 of the hole injection and transport layer 4 A device layer 7 is formed.

The substrate 2 is a support for forming each layer constituting the device and is not necessarily provided on the surface of the electrode 1 but may be provided on the outermost surface of the device.

The hole injection and transport layer 4 contains at least the device material for the hole injection and transport layer according to the present invention and is a layer responsible for injecting and / or transporting holes from the electrode 3 to the device layer 7.

The device layer 7 is a layer exhibiting various functions depending on the type of device as a result of being injected and transported by holes, and may be a single layer or multiple layers. When the device layer 7 is composed of multiple layers, it includes a functional layer and an auxiliary layer. For example, in the case of an organic EL device, a hole transport layer that is further laminated on the surface of the hole injection transport layer corresponds to the auxiliary layer, and a light emitting layer that is laminated on the surface of the hole transport layer corresponds to the functional layer.

The second electrode layer 9 is provided at least in a portion where the hole injecting and transporting layer 4 and the device layer 7 are present between the second electrode layer 9 and the opposed electrode 1. Further, if necessary, a third electrode (not shown) may be provided. By applying an electric field between these electrodes, the function of the device can be expressed.

9 is a schematic cross-sectional view showing a basic layer structure of a second embodiment of the device according to the present invention. The basic layer structure of the device of the present invention is such that a partition 6a is formed between patterns of the first electrode layer 3 on the substrate 2 in which the first electrode layer 3 is formed in a pattern shape, (3) and the hole injection and transport layers (4 and 5) continuing on the first electrode layer (3) and the partition (6a) in the opening of the partition (6a) And the hole injection and transport layer (4) on the side of the partition (6a), the fluorine-containing organic compound of at least part of the device material for the hole injection and transport layer according to the present invention is decomposed and removed, and the fluorine decomposition (5), and the normal hole injection and transport layer (4) of the partition does not decompose fluorine and contains the device material for the hole injection and transport layer according to the present invention. 9 is a sectional view showing the hole injection and transport layer 4 on the first electrode layer 3 in the opening of the partition 6a and on the side of the partition 6a, The fluorine-containing organic compound in all of the transporting-layer-use device material is decomposed and removed to form the fluorine decomposing portion 5 of the hole injecting and transporting layer.

The fluorine decomposing portion 5 of the hole injecting and transporting layer on the first electrode layer 3 and on the side of the partitioning portion 6a is in contact with the lyophilic region 11 and the top portion of the partitioning portion 6a, (12) are formed. A device layer 7 is formed on the lyophilic area 11 of the hole injection and transport layer 4. The second electrode layer 9 is formed so as to have a hole injection and transport layer 4 disposed between the two electrodes 3 and 9 so that the two electrodes 3 and 9 face each other on the substrate 2 .

The hole injection and transport layers 4 and 5 on the first electrode layer 3 in the opening of the partition 6a and on the partition 6a do not have an interface provided as a separate layer in the hole injection and transport layer. The fluorine decomposing portion 5 of the hole injecting and transporting layer is formed from the same material as the hole injecting and transporting layer 4 as a portion in which at least a part of the fluorine-containing organic compound in the device material for the hole injecting and transporting layer is decomposed and removed, .

In addition, the layer structure of the device of the present invention is not limited to the above-described example, and any layer which has substantially the same structure as the technical idea described in the claims of the present invention, It is included in the technical scope.

In the device of the present invention, the device material for the first electrode layer, the second electrode layer, the hole injecting and transporting layer, and the hole injecting and transporting layer used in the hole injecting and transporting layer is described in "I. Device material for hole injection and transport layer &quot;, &quot; II. Ink for hole injection and transport layer &quot;, &quot; III. Method of manufacturing a device &quot;. The device layer (functional layer or auxiliary layer) included in the device will be described in detail in a specific example of a device to be described later.

Here, the hole injection and transport layer is further supplemented.

<Hole injection and transport layer>

The hole injecting and transporting layer in the device of the present invention contains at least the device material for the hole injecting and transporting layer according to the present invention. The hole injecting and transporting layer may be made of only the device material for the hole injecting and transporting layer in the present invention, but may contain other components.

As the other component, the hole-transporting compound other than the device material for a hole injection and transport layer according to the present invention may be suitably used as far as the effect of the present invention is not impaired, as long as it has a hole-transporting property. Here, the hole transportability means that an overcurrent due to hole transport is observed by a known photocurrent method.

As the hole-transporting compound, a polymer compound in addition to a low-molecular compound is suitably used. The hole-transporting polymer compound refers to a polymer compound having a hole-transporting property and having a weight average molecular weight of 2000 or more as measured by polystyrene conversion of gel permeation chromatography. The hole injecting and transporting layer of the present invention is intended to form a stable film by a solution coating method and uses a polymer compound which is easy to dissolve in an organic solvent and is capable of forming a stable coating film in which a compound is hardly aggregated desirable.

The hole-transporting compound is not particularly limited, and examples thereof include arylamine derivatives, anthracene derivatives, carbazole derivatives, thiophene derivatives, fluorene derivatives, distyrylbenzene derivatives, spiro compounds and the like. Specific examples of the arylamine derivatives include N, N'-bis- (3-methylphenyl) -N, N'-bis- (phenyl) -benzidine (TPD) Benzidine (? -NPD), 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine (MTDATA), 4,4' 4,4-N, N'-dicarbazole-biphenyl (CBP) as the carbazole derivative and N, N'-bis (diphenylphosphino) (Di-p-tolylamino) -4 '- [(3-methylphenyl) -N, N'-bis (phenyl) -9,9-dimethylfluorene (DMFL- Styryl] stilbene (DPAVB) as the spiro compound, 2,7-bis (N-naphthalen-1-yl-N-phenylamino) -9,9-spirobifluorene -NPB), 2,2 ', 7,7'-tetrakis (N, N-diphenylamino) -9,9'-spirobifluorene (spiro-TAD).

As the hole-transporting polymer compound, for example, polyaniline, polythiophene, polyphenylene vinylene derivatives and the like can be used. The conductive polymer such as polyaniline, polythiophene, and polyphenylene vinylene derivative may be doped with an acid. Also included are polymers containing recurring units such as arylamine derivatives, anthracene derivatives, carbazole derivatives, thiophene derivatives, fluorene derivatives, distyrylbenzene derivatives, spiro compounds and the like.

When a hole-transporting compound other than the device material for a hole-injecting and transporting layer according to the present invention is used in the hole-injecting and transporting layer of the present invention, the content of the hole- 10 to 10000 parts by weight based on 100 parts by weight is preferable in that hole injection transportability is enhanced and stability of the film is high and long life is attained.

The hole injection and transport layer of the present invention may contain additives such as a binder resin, a curable resin, and a coating improver, provided that the effect of the present invention is not impaired. Examples of the binder resin include polycarbonate, polystyrene, polyarylate, and polyester. Further, it may contain a binder resin which is cured by heat or light. As the material to be cured by heat or light, it is possible to use a material in which a curable functional group is introduced into the molecule or a curable resin in the hole-transporting compound. Specific examples of the curable functional group include acrylic functional groups such as an acryloyl group and a methacryloyl group, or a vinylene group, an epoxy group, and an isocyanate group. The curable resin may be either a thermosetting resin or a photo-curable resin, and examples thereof include an epoxy resin, a phenol resin, a melamine resin, a polyester resin, a polyurethane resin, a silicone resin and a silane coupling agent.

&Lt; Organic EL device &

As an embodiment of the device of the present invention, there can be mentioned an organic EL element containing at least an organic layer including a hole injection transport layer and a light emitting layer of the present invention.

Hereinafter, each layer constituting the organic EL element will be described in order with reference to FIG.

10 is a schematic cross-sectional view showing an example of the organic EL device of the present invention. The organic EL element 31 shown in Fig. 10 has a structure in which the first electrode layer 3 is formed in a pattern on the substrate 2, the partition wall 6a is formed in the opening of the pattern of the first electrode layer 3, The hole injection and transport layer 4 is formed on the one electrode layer 3 and the partition wall 6a and the fluorine containing organic compound of the device material for the hole injection and transport layer in the surface layer portion of the hole injection transport layer 4 is decomposed and removed, A lyophilic region 11 and a top portion of the partition 6a are formed of a liquid repellent region 12 and a lyophilic region 11 is formed on the surface of the fluorine removal layer 5. [ The electron injection and transport layer 33 formed on the light emitting layer 32 and the second electrode layer 34 formed on the electron injection and transport layer 33.

10, a hole transporting layer may be further formed between the lyophilic region 11 and the luminescent layer 32 in the hole injecting and transporting layer (not shown).

In Fig. 10, the first electrode layer 3 functions as a positive electrode, and the second electrode layer 34 functions as a negative electrode. When an electric field is applied between the anode and the cathode, the organic EL element is injected into the light emitting layer 32 from the anode through the hole injecting and transporting layer 4, and electrons are injected from the cathode into the light emitting layer, The holes and the electrons injected from the light emitting layer recombine to emit light to the outside of the device.

In order to radiate light to the outside of the device, all layers present on at least one side of the light emitting layer need to have transparency to light of at least a part of the visible wavelength region. Further, an electron injection and transport layer 33 is provided between the light emitting layer and the electrode 6 (cathode) as required.

Hereinafter, each layer of the organic EL device according to the present invention will be described in detail.

As for the substrate and the electrode layer, examples of the device can be used.

(Hole injection transport layer, hole transport layer and hole injection layer)

The hole injection transport layer, the hole transport layer, and the hole injection layer may be formed between the light emitting layer and the first electrode layer in addition to the hole injection transport layer containing the decomposition product or the device material for a hole injection transport layer according to the present invention which is an essential component in the device of the present invention Or may be appropriately formed. A hole transporting layer may be further laminated on the hole injection transporting layer containing the device material or the decomposition product of the hole transporting layer according to the present invention and the light emitting layer may be laminated thereon. A hole injecting and transporting layer containing a device material or a decomposition product thereof may be further laminated, and a light emitting layer may be laminated thereon.

In the case of further laminating the hole transporting layer on the hole injecting and transporting layer which is an essential component of the present invention, the hole transporting compound used in the hole transporting layer is not particularly limited, and the hole injecting and transporting compound described in the above- Can be selected and used. In the case where the hole injecting and transporting layer, which is an essential component of the present invention, further contains a hole injecting and transporting compound different from the hole transporting layer device material or the decomposition product thereof according to the present invention, the adjacent hole transporting layer It is preferable to use the same compound as the hole-transporting compound contained in the hole-injecting and transporting layer because it improves the adhesion stability of the interface between the hole-injecting and transporting layer and the hole-transporting layer, which are essential components of the present invention, and contributes to the long driving life.

The hole transporting layer can be formed by the same method as a light emitting layer described later using a hole injecting and transporting compound. The film thickness of the hole transporting layer is usually 0.1 to 1 占 퐉, preferably 1 to 500 nm.

When the hole injecting and transporting layer, which is an essential component of the present invention, is further laminated on the hole injecting layer, the hole injecting material used for the hole injecting layer is not particularly limited and conventionally known compounds can be used. Examples thereof include oxides such as phenylamine type, starburst type amine type, phthalocyanine type, vanadium oxide, molybdenum oxide, ruthenium oxide and aluminum oxide, amorphous carbon, polyaniline and polythiophene derivatives.

The hole injecting layer can be formed by the same method as the light emitting layer described later using a hole injecting material. The film thickness of the hole injection layer is usually from 1 nm to 1 占 퐉, preferably from 2 nm to 500 nm, and more preferably from 5 nm to 200 nm.

In consideration of the hole injecting property, the hole injecting material and the hole transporting material whose values of the work function (HOMO) of each layer are increased stepwise from the first electrode layer side to the light emitting layer 5 are selected, The energy barrier of the hole injection of the first electrode layer and the light emitting layer is preferably made as small as possible to compensate the energy barrier of the large hole injection between the first electrode layer and the light emitting layer.

(Light emitting layer)

The light emitting layer 32 is formed on the lyophilic area 11 on the hole injection and transport layer between the substrate 2 and the second electrode layer 34 on which the first electrode layer 3 is formed as shown in Fig. do.

The material used for the light emitting layer of the present invention is not particularly limited as long as it is a material usually used as a light emitting material, and both a fluorescent material and a phosphorescent material can be used. Specifically, a material such as a dye-based light-emitting material, a metal complex-based light-emitting material, and the like can be used, and a low molecular weight compound or a high molecular weight compound can be used.

[Specific examples of coloring matter emitting material]

Examples of the dye-based light-emitting material include, for example, arylamine derivatives, anthracene derivatives, (phenylanthracene derivatives), oxadiazole derivatives, oxazole derivatives, oligothiophene derivatives, carbazole derivatives, cyclopentadiene derivatives, Benzene derivatives, distyrylpyrazine derivatives, distyrylarylene derivatives, silole derivatives, stilbene derivatives, spiro compounds, thiophene ring compounds, tetraphenylbutadiene derivatives, triazole derivatives, triphenylamine derivatives, tripyranylamine derivatives, Quinoline derivatives, hydrazone derivatives, pyrazoline dimers, pyridine ring compounds, fluorene derivatives, phenanthrolines, perinone derivatives, and perylene derivatives. Further, a dimer, a trimer, an oligomer thereof, or a compound of two or more derivatives thereof may be used.

These materials may be used alone, or two or more of them may be used in combination.

[Specific examples of the metal complex system light emitting material]

Examples of the metal complex system light emitting material include metal complexes such as aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzooxazole zinc complexes, benzothiazole zinc complexes, azomethyl zinc complexes, porphyrin zinc complexes, europium complexes, Metal complexes having a rare earth metal such as Al, Zn, Be or the like, or a rare earth metal such as Tb, Eu, or Dy, and a ligand having oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline structure, have.

These materials may be used alone, or two or more of them may be used in combination.

[Specific examples of polymeric light emitting materials]

As the polymer light emitting material, a material in which the low molecular weight material is introduced into a molecule as a linear chain, a side chain, or a functional group in the molecule, a polymer, a dendrimer, or the like can be used. For example, there may be mentioned polyparaphenylenevinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyvinylcarbazole, polyfluorenone derivatives, polyfluorene derivatives, polyquinoxaline derivatives And copolymers thereof.

[Specific examples of dopants]

A doping material may be added to the light emitting layer for the purpose of improving the light emitting efficiency or changing the light emitting wavelength. In the case of high molecular weight materials, they may be contained in the molecular structure as a light emitting device. Examples of such doping materials include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squarylium derivatives, porphyrin derivatives, styryl type pigments, tetracene derivatives, pyrazoline derivatives, decacyclene, A quinoxaline derivative, a carbazole derivative, and a fluorene derivative. Further, a compound in which a spiro group is introduced into these can also be used.

These materials may be used alone, or two or more of them may be used in combination.

In the present invention, as the material of the light emitting layer, a low molecular compound or a polymer compound emitting fluorescence, a low molecular compound or a polymer compound emitting phosphorescence may be used. In the present invention, in the case where the base layer for providing the light emitting layer is the hole injection transport layer of the present invention, the hole injection transport layer forms a charge transfer complex and tends to be insoluble in a non-aqueous solvent such as xylene used for solution coating And the material of the light emitting layer can be a polymer type material which is easily dissolved in a non-aqueous solvent such as xylene and forms a layer by a solution coating method. In this case, a polymer compound including a fluorescent polymer light-emitting polymer compound or a fluorescent light-emitting low molecular weight compound, a polymer compound containing phosphorescent light, or a polymer compound including a phosphorescent light-emitting low molecular compound may be suitably used.

The light emitting layer can be formed by a solution coating method using a wettability change pattern on the surface of the hole injection transport layer and using a light emitting material. As the solution coating method, the same method as that described in the item of the above-mentioned manufacturing method of the device can be used. When another layer such as a hole transport layer is formed using the wettability change pattern of the surface of the hole injection transport layer, the layer may be formed by a vapor deposition method or a transfer method. In the vapor deposition method, for example, in the case of the vacuum vapor deposition method, the material of the light emitting layer is placed in a crucible provided in a vacuum container, the vacuum container is evacuated to about 10 ^-4 Pa by a suitable vacuum pump, And a luminescent layer is formed on a laminate of a substrate facing the crucible, a first electrode layer, a hole injecting and transporting layer, and a hole transporting layer. The transfer method is formed, for example, by bonding a light emitting layer formed in advance on a film by a solution coating method or a vapor deposition method to a hole injecting and transporting layer provided on the first electrode layer, and transferring the light emitting layer onto the hole injecting and transporting layer by heating. The thickness of the light-emitting layer is usually 1 to 500 nm, preferably 20 to 1000 nm. In the present invention, it is preferable to form the hole injecting and transporting layer by a solution coating method, and since the light emitting layer can also be formed by the solution coating method using the wettability change pattern on the surface of the hole injecting and transporting layer, .

In addition, for organic dye-sensitized photovoltaic cells, organic thin film solar cells, organic semiconductors, organic devices other than organic transistors, quantum dot light emitting devices having hole injecting and transporting layers, oxide compound solar cells, etc., The constitution of the hole injecting and transporting layer is not particularly limited, and may be appropriately the same as the known constitution.

[Example]

Hereinafter, the present invention will be described more specifically by way of examples. The present invention is not limited by these descriptions. In the following Examples, "parts" means parts by weight unless otherwise specified. In addition, the thickness of the layer or film is indicated by the average film thickness.

In the following, embodiments of the organic EL device will be described in more detail with reference to the present invention. The present invention is not limited to the description of the following examples.

The structures of the compounds obtained in the following Synthesis Examples were specified by 1H NMR (alpha-400 from Nippon Denshi Co., Ltd.) and mass spectrometry (JMS 600 from Nippon Denshoku). The obtained NMR spectra are shown in Figs. 13 to 16.

[Synthesis Example 1: Synthesis of fluorine-containing organic compound F-1]

Using N, N'-dicyclohexylcarbodiimide (manufactured by Tokyo Kasei Co., Ltd.) in dichloromethane solvent, 2,2,3,3,4,4,5,5,6,6,7,7,7- Condensation reaction of tridecafluoroheptanoic acid (manufactured by Aldrich) with 1,4-diaminobutane (manufactured by Tokyo Kasei Kasei) was carried out to synthesize fluorine-containing organic compound F-1. The molecular weight of the resulting compound F-1 was confirmed to be 434 by mass analysis and 1 H NMR confirmed that the compound of the following structural formula was synthesized.

[Synthesis Example 2: Synthesis of fluorine-containing organic compound F-2]

Condensation reaction of 1H, 1H, 2H, 2H-tridecafluoro-n-octyl iodide (manufactured by Tokyo Kasei Kasei) and 2-aminoethanethiol (manufactured by Tokyo Kasei Kasei) in chloroform in the presence of triethylamine To thereby synthesize a fluorine-containing organic compound F-2. The molecular weight of the obtained compound F-2 was confirmed to be 423 by mass analysis and 1 H NMR confirmed that the compound of the following structural formula was synthesized.

[Synthesis Example 3: Synthesis of fluorine-containing organic compound F-3]

The fluorine-containing organic compound F-1 obtained in Synthesis Example 1 was reduced using lithium aluminum hydride to obtain a fluorine-containing organic compound F-3. The molecular weight of the resulting compound F-3 was found to be 420 by mass analysis and it was confirmed from the 1 H NMR that the compound of the following structural formula was synthesized.

[Synthesis Example 4: Synthesis of fluorine-containing organic compound F-4]

Tetramethyl-2,3,3,3-tetrafluoro-2- (1,1,2,2,3,3,3-heptafluoropropoxy) propanoate (manufactured by Aldrich) was dissolved in a dichloromethane solvent, Was converted into oxyfluoride by reacting cyanuric acid fluoride (manufactured by Aldrich). A condensation reaction of the obtained oxyfluoride with 1,4-diaminobutane in a dichloromethane solvent was conducted to synthesize a fluorine-containing organic compound F-4. The molecular weight of the resulting compound F-4 was found to be 400 by mass analysis and 1 H NMR confirmed that the compound of the following structural formula was synthesized.

[Production Example 1]

Molybdenum hexacarbonyl was dissolved in cyclohexanone in an amount of 0.4 wt%, and the solution was heated and dissolved in the atmosphere at 100 DEG C for 10 minutes and then returned to room temperature, and a solution prepared by dissolving 4- (3,3,4,4,5,5 , 6,6,7,7,8,8,9,9,10,10-heptadecafluorodecyl) benzylamine was dissolved in cyclohexanone in an amount of 0.4 wt% and then the solution was returned to room temperature. 1: 1, stirred in the air, and then filtered through a filter to prepare an ink 1 for forming a positive hole injection transport layer.

[Production Example 2]

Molybdenum hexacarbonyl was dissolved in cyclohexanone in an amount of 0.4 wt%, and the solution was heated to 100 DEG C for 10 minutes in the atmosphere to dissolve the solution, then returned to room temperature, and a solution prepared by dissolving 4,4,5,5,6,6,7, Heptadecafluoroundecylamine was dissolved in cyclohexanone in an amount of 0.2 wt%, and then the solution was returned to room temperature. : 1, stirred in the air, and then filtered through a filter to prepare an ink 2 for forming a positive hole injection transport layer.

[Production Example 3]

The solution prepared by dissolving tungsten hexacarbonyl in cyclohexanone in 0.4 wt%, heating it in air at 100 캜 for 10 minutes to dissolve it, then returning to room temperature, and a solution prepared by dissolving 4- (3,3,4,4,5,5 , 6,6,7,7,8,8,9,9,10,10-heptadecafluorodecyl) benzylamine was dissolved in cyclohexanone in an amount of 0.4 wt% and then the solution was returned to room temperature. , And the mixture was stirred in the atmosphere and then filtered through a filter to prepare an ink 3 for forming a positive hole injection transport layer.

[Production Example 4]

A solution prepared by dissolving vanadium (III) acetylacetonate in cyclohexanone in 0.4 wt%, heating it in air at 100 DEG C for 10 minutes to dissolve it, and then returning to room temperature, and 4- (3,3,4,4, 5,5,6,6,7,7,8,8,9,9,10,10-heptadecafluorodecyl) benzylamine was dissolved in cyclohexanone in an amount of 0.2 wt%, and the solution was returned to room temperature Were mixed in a weight ratio of 1: 1, stirred in the air, and then filtered through a filter to prepare an ink 4 for forming a positive hole injection transport layer.

[Production Example 5]

Molybdenum hexacarbonyl and 0.008 g of 4- (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10-heptadecafluorodecyl) benzylamine Was dissolved in 2.0 g of cyclohexanone and dissolved by heating at 100 占 폚 for 10 minutes in the air. Then, the solution was returned to room temperature and filtered with a filter to prepare an ink 5 for forming a hole injection transport layer.

[Production Example 6]

0.008 g of molybdenum hexacarbonyl and 0.004 g of the fluorine-containing organic compound F-1 obtained in Synthesis Example 1 were dissolved in 2.0 g of cyclohexanone and dissolved by heating at 100 ° C for 10 minutes in the air, Followed by filtration to prepare an ink 6 for forming a positive hole injection transport layer.

[Production Example 7]

0.008 g of molybdenum hexacarbonyl and 0.004 g of the fluorine-containing organic compound F-2 obtained in Synthesis Example 2 were dissolved in 2.0 g of cyclohexanone and dissolved by heating at 100 ° C for 10 minutes in the air, Followed by filtration to prepare an ink 7 for forming a hole injection transport layer.

[Production Example 8]

0.008 g of molybdenum hexacarbonyl and 0.004 g of the fluorine-containing organic compound F-3 obtained in Synthesis Example 3 were dissolved in 2.0 g of cyclohexanone and dissolved by heating at 100 캜 for 10 minutes in the air, Followed by filtration to produce the ink 8 for forming a hole injection transport layer.

[Production Example 9]

0.008 g of molybdenum hexacarbonyl and 0.004 g of the fluorine-containing organic compound F-4 obtained in Synthesis Example 4 were dissolved in 2.0 g of cyclohexanone and dissolved by heating at 100 ° C for 10 minutes in the air, Followed by filtration to prepare an ink 9 for forming a hole injection transport layer.

[Production Example 10]

0.008 g of molybdenum hexacarbonyl and 0.004 g of the fluorine-containing organic compound F-4 obtained in Synthesis Example 4 were dissolved in 2.0 g of isopropyl alcohol and dissolved by heating at 100 캜 for 10 minutes in the air. Followed by filtration to produce an ink 10 for forming a hole injection transport layer.

[Production Example 11]

0.008 g of molybdenum hexacarbonyl and 0.004 g of the fluorine-containing organic compound F-4 obtained in Synthetic Example 4 were dissolved in 2.0 g of ethyl benzoate and dissolved by heating at 100 ° C for 10 minutes in the air. After returning to room temperature, Thereby forming the hole injection transport layer formation ink 11.

[Comparative Production Example 1]

Molybdenum hexacarbonyl was dissolved in cyclohexanone in an amount of 0.4 wt%, and the mixture was heated in the air at 100 占 폚 for 10 minutes to prepare Comparative Ink 1 for forming a positive hole injection transport layer.

&Lt; Measurement of film thickness &

The film thickness was measured by forming a layer formed of a material to be measured on a cleaned ITO glass substrate as a single layer and forming a step with a cutter knife and then measuring the height of the stepped portion using a probe microscope (SII, manufactured by Nanotechnology Co., , &Lt; / RTI &gt; Nanopix 1000).

&Lt; Measurement of ionization potential >

The value of the ionization potential in the present invention is a value of the work function measured using an optoelectronic spectrometer AC-1 (manufactured by Rigaku Corporation). The measurement was carried out by forming a layer formed of a material to be measured on a cleaned ITO-equipped glass substrate (manufactured by Sanyo Chemical Industries, Ltd.) as a single layer, and determining the energy value at which photoelectrons were emitted by the above-described photoelectron spectroscope AC-1. The measurement was performed at 0.05 eV with a light amount of 50 nW.

<Measurement of Absorption Spectrum>

The absorption spectrum is obtained by forming a layer formed of a material to be measured on a cleaned quartz substrate as a single layer and measuring the difference in optical absorption between the thin film-formed substrate and the reference quartz substrate using UV-3100PC (manufactured by Hitachi) Respectively.

The transmittance of the thin film (10 nm) formed using the ink for forming a hole injection transport layer obtained in Production Examples 1 to 11 at a wavelength of 254 nm was as high as 80% or more.

&Lt; Measurement of contact angle of liquid &

The contact angle of the liquid was measured using a contact angle meter (DM700, automatic contact angle meter manufactured by Kyowa Chemical Industry Co., Ltd.). Using a xylene (surface tension: 28.5 mN / m) as a standard solution, 2 microliters of a droplet was dropped from the microsyringe, and the contact angle was measured after 5 seconds.

&Lt; Surface analysis of hole injection transport layer >

X-ray photoelectron spectroscopy (XPS) was used to determine the presence of fluoroalkyl groups and the valence of the transition metal contained in the organic-transition metal oxide complex. For the measurement, ESCA-3400 manufactured by CRATOS CORPORATION was used. As the X-ray source used for the measurement, MgK ray was used. A monochrometer was not used, and measurement was made under the conditions of an acceleration voltage of 10 kV and a filament current of 20 mA.

«Experiment of device characteristics»

In the organic EL device of the present invention, a hole injecting and transporting layer containing an organic-transition metal oxide complex having a fluorine-containing organic compound adhered on its surface is formed on a glass substrate with a transparent anode, and then a photocatalyst treatment is performed, , A light emitting layer, a hole blocking layer, an electron transporting layer, an electron injecting layer, and a cathode were laminated and sealed to form a green light emitting organic EL device, and the characteristics and wettability of the organic EL device were evaluated.

[Example 1]

Patterned ITO glass substrates (manufactured by Sanyo Chemical Industries, Ltd., ITO film thickness: 150 nm) were subjected to ultrasonic cleaning in the order of a neutral detergent and ultrapure water, and subjected to UV ozone treatment.

Subsequently, an organic-transition metal oxide composite thin film was formed by spin coating using the ink 1 for positive hole injection transport layer obtained in Production Example 1 as a positive hole injection transport layer on the substrate. After the coating film was formed, it was dried at 200 ° C on a hot plate. The film thickness after drying was 10 nm.

Then, a photomask with a photocatalyst-containing layer was prepared. A photomask having a transmission region and a shielding region formed on a synthetic quartz substrate was prepared. A coating solution for forming a photocatalyst-containing layer having the following composition was applied on the photomask by a spin coater, followed by heating and drying treatment at 150 ° C for 10 minutes to carry out a hydrolysis and polycondensation reaction to cure the photocatalyst, A transparent photocatalyst-containing layer having a film thickness of 100 nm firmly fixed in the siloxane was formed.

(Coating liquid for forming photocatalyst-containing layer)

2 parts by weight of titanium dioxide (ST-K01, manufactured by Ishihara Sangyo Co., Ltd.)

0.4 parts by weight of organoalkoxysilane (TSL8113, manufactured by Toshiba Silicone Co., Ltd.)

3 parts by weight of isopropyl alcohol

Subsequently, the hole injection transport layer was exposed through the photomask provided with the photocatalyst-containing layer prepared above to form a pattern composed of the lyophilic area and the lyophobic area. The distance between the photocatalyst-containing layer in the photocatalyst-containing-layer-provided photomask and the hole-injecting and transporting layer was adjusted to 100 μm by using a high-pressure mercury lamp, a photomask with a photocatalyst-comprising layer and a position adjusting mechanism of the substrate, And the photocatalyst-comprising layer was exposed for 3 minutes so that the exposure amount of light of 254 nm was 5 J / cm ² from the back side of the photomask.

Subsequently, a thin film of polyvinylcarbazole (PVK) (molecular weight: 700,000) as a hole transporting layer was applied and formed on the treated hole injection transport layer by a spin coat method. The coating solution was prepared by dissolving PVK in 1,2-dichloroethane. After the coating film was formed, it was dried at 150 ° C on a hot plate. The film thickness after drying was 20 nm.

(III) (Ir (mppy) 3) as a luminescent dopant, and 4,4'-bis (9-carbazolyl-2 , 2'dimethylbiphenyl (CDBP) as a host was applied by a spin coat method. The coating solution was prepared by coating a mixture of a host CDBP and a dopant Ir (mppy) 3 in a weight ratio of 20: 1 In a state that the total film thickness after drying was 40 nm. After forming the coating film, it was dried at 100 캜 on a hot plate.

A hole blocking layer was deposited on the light emitting layer. The hole blocking layer was formed by a resistive heating method using vacuum (pressure: 1 x 10 &lt; -10 &gt; (cm)) using a bis (2-methyl-8- quinolinolato) ^-4 Pa) to form a BAlq vapor-deposited film having a thickness of 15 nm.

An electron transport layer was deposited on the hole blocking layer. The electron transport layer was formed by evaporation of a tris (8-quinolinolato) aluminum complex (Alq3) so as to have a thickness of 20 nm in an Alq3 vapor deposition film under vacuum (pressure: 1 x ^10-4 Pa) by resistance heating method.

The electron injection layer and the cathode were sequentially deposited on the electron transport layer of the prepared transparent anode-supported glass substrate / hole injecting / transporting layer / hole transporting layer / light emitting layer / hole blocking layer / electron transporting layer. A vapor deposition film was formed in vacuum (pressure: 1 x 10 &lt; ^-4 &gt; Pa) by LiF (thickness: 0.5 nm) for the electron injection layer and Al (thickness: 100 nm) for the cathode sequentially by resistance heating deposition.

After formation of the negative electrode, the negative electrode was sealed in a glove box with low oxygen and low humidity by using an alkali-free glass and a UV curable epoxy adhesive, and a positive electrode patterned in the form of a line having a width of mm and a line- An organic EL device of Example 1 having an electron injection layer and a cathode formed thereon was fabricated.

These devices were driven at 10 mA / cm ² , and the luminescence brightness and spectrum were measured by a spectroscopic radiation system SR-2 of Topcon Corporation. The organic EL devices produced in the above Examples and Comparative Examples all emitted green light derived from Ir (mppy) ₃ . The measurement results are shown in Table 3. The current efficiency was calculated from the driving current and the luminance.

The lifetime characteristics of the organic EL device were evaluated by observing that the luminance gradually decreased with time in the constant current driving. Here, the time (hr.) From the initial luminance of 2000 cd / m ² to the deterioration of the luminance with the retention rate of 50% was defined as the lifetime LT50.

Further, as described above, the wettability and the ionization potential of the positive hole injection transport layer before and after the photocatalytic treatment were evaluated. These results are also shown in Table 1.

[Example 2]

In the same manner as in Example 1, except that the ink for forming a hole injection transporting layer was used in place of the ink 1 for forming a hole injection transporting layer in Example 1 to form a thin film having a thickness of 10 nm, And the wettability was evaluated.

[Example 3]

In the same manner as in Example 1, except that the ink for forming a hole injection transport layer was used instead of the ink 1 for forming a hole injection transport layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 4]

In the same manner as in Example 1, except that a thin film having a thickness of 10 nm was formed by using the ink 4 for forming a hole injection transport layer instead of the ink 1 for forming a hole injection transport layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 5]

In the same manner as in Example 1, except that the ink for forming a hole injection transporting layer was used in place of the ink 1 for forming a hole injection transporting layer and the thin film having a thickness of 10 nm was formed as the ink for forming the hole injection transporting layer in Example 1 And the wettability was evaluated.

[Example 6]

A device was prepared and evaluated for wettability in the same manner as in Example 1 except that only the ultraviolet light of 253 nm was irradiated to the hole injection transport layer without interposing the photocatalyst mask.

[Example 7]

In the same manner as in Example 1, except that a thin film having a thickness of 10 nm was formed by using the ink 6 for forming a hole injection transporting layer instead of the ink 1 for forming a hole injection transporting layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 8]

In the same manner as in Example 1, except that the ink for forming a hole injection transport layer was used instead of the ink 1 for forming a hole injection transport layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 9]

In the same manner as in Example 1, except that the ink for forming a hole injection transport layer was used instead of the ink 1 for forming a hole injection transport layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 10]

In the same manner as in Example 1, except that a thin film having a thickness of 10 nm was formed by using the ink 9 for forming a hole injection transporting layer instead of the ink 1 for forming the hole injection transporting layer as the ink for forming the hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 11]

In the same manner as in Example 1, except that the ink for forming a hole injection transport layer was used in place of the ink 1 for forming a hole injection transport layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Example 12]

In the same manner as in Example 1, except that the ink for forming a hole injection transport layer was used in place of the ink 1 for forming a hole injection transport layer as the ink for forming a hole injection transport layer in Example 1, And the wettability was evaluated.

[Comparative Example 1]

In the same manner as in Example 1 except that a thin film having a thickness of 10 nm was formed by using the comparative ink 1 for forming a positive hole injection transport layer instead of the positive hole injection transport layer forming ink 1 as the positive hole injection transport layer ink in Example 1 And the wettability was evaluated.

[Comparative Example 2]

PEDOT / PSS (manufactured by Stacking Agent AI4083) and 4- (3,3,4,4,5,5,6-tetraazaindene) were used instead of the film formed using the hole injection transport layer forming ink 1 as the hole injection transport layer in Example 1, 6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl) benzylamine was formed by spin-coating the same method as in Example 1 And the wettability was evaluated. The PEDOT / PSS layer was prepared by diluting the PEDOT / PSS solution with distilled water and dissolving it to a film thickness of 10 nm after drying. Subsequently, a solution of heptadecafluorodecylbenzylamine dissolved in heptafluoro-n-butyric acid in an amount of 0.4 wt% was used to form a coating, and the thin film was dried. The film thickness after drying was not measurable and was less than 5 nm.

[Comparative Example 3]

In Comparative Example 2, a device was prepared and evaluated for wettability in the same manner as in Comparative Example 2, except that the hole injection transport layer was not subjected to the photocatalytic treatment.

[Comparative Example 4]

The same procedure as in Example 1 was carried out except that a MoO ₃ film (10 nm) formed by vacuum evaporation in a resistance heating method was used in place of the film formed using the hole injection transport layer forming ink 1 as the hole injection transport layer in Example 1 And the wettability was evaluated.

[Referential Example 1]

A device was prepared and evaluated for wettability in the same manner as in Example 1 except that the hole injection transport layer was not subjected to a photocatalytic treatment.

[Reference Example 2]

A device was prepared and evaluated for wettability in the same manner as in Example 2 except that the hole injection transport layer was not subjected to a photocatalytic treatment.

[Referential Example 3]

A device was prepared and evaluated for wettability in the same manner as in Example 3 except that the hole injection transport layer was not subjected to the photocatalytic treatment.

[Reference Example 4]

A device was prepared and evaluated for wettability in the same manner as in Example 4 except that the hole injection transport layer was not subjected to the photocatalytic treatment in Example 4.

[Reference Example 5]

A device was prepared and evaluated for wettability in the same manner as in Example 5 except that the hole injection transport layer was not subjected to a photocatalytic treatment.

[evaluation]

Comparing Example 1 with Reference Example 1, in Example 1, the contact angle after the photocatalytic treatment was lowered from 49 ° to 5 ° or less, and the ionization potential was raised from 5.2 eV to 5.4 eV. In the device characteristics, the lifetime after the photocatalytic treatment was improved from 2.0 hours to 3.0 hours. In Example 1, it is presumed that the fluoroalkyl component was decomposed by the photocatalytic treatment and the surface of the organic-transition metal oxide composite layer was oxidized to improve the characteristics. The results are also shown in the comparison between Example 2 and Reference Example 2, the comparison between Example 3 and Reference Example 3, the comparison between Example 4 and Reference Example 4, and the comparison between Example 5 and Reference Example 5 Even when the photocatalyst treatment is carried out, the properties are equal and are not deteriorated, or the photocatalyst treatment is improved.

Comparing Example 5 with Example 1, it is preferable that the ink 1 is produced by the manufacturing method of the ink 1 rather than the ink 5 because the initial contact angle is higher when the ink 1 of Example 1 is used.

Further, when the examples were compared, the examples 10 to 12 using the inks 9 to 11 were excellent in brightness, current efficiency and lifetime. This is presumed to be due to the fact that the fluorine component having an ether bond is easily decomposed and the residual organic component on the surface of the hole injection transport layer is reduced, whereby the adhesion of the thin film interface is improved and the device characteristics are improved.

Comparing Example 6 with Comparative Example 1, the contact angle was reduced from 49 ° to 10 ° by irradiation with vacuum ultraviolet light, and the ionization potential rose from 5.2 eV to 5.4 eV. In the device characteristics, the lifetime after vacuum ultraviolet light irradiation was improved from 2.0 hours to 2.6 hours. It is presumed that the fluoroalkyl component is decomposed by the irradiation of vacuum ultraviolet light and the surface of the organic-transition metal oxide composite layer is oxidized by ozone generated in the vacuum ultraviolet light, thereby improving the characteristics.

The reason why Example 1 is longer than Comparative Example 4 using MoO ₃ is considered to be that the component of the oxidation number +5 is properly contained in a stable state as described later.

Comparing Example 1 with Comparative Example 1, in Example 1, the driving voltage is reduced by 1V. This result suggests that the device performance is improved because the ionization potential is changed and the hole injecting property is improved because the organic material to which the fluoroalkyl group is attached is mixed in Example 1.

Comparing Comparative Example 2 with Comparative Example 3, it can be seen that when PEDOT / PSS, which is a general organic-based hole injection material, is used for the hole injection transport layer, the voltage is increased by light irradiation and photocatalytic treatment and the lifetime is shortened. These results suggest that the PEDOT / PSS is oxidized or decomposed by light irradiation and photocatalytic treatment, resulting in deterioration of hole injection property and driving resistance.

&Lt; Measurement of oxidation number of transition metal &

The oxidation number of the transition metal was measured using the hole injecting and transporting layer formed in Example 1 and Comparative Example 4. The oxidation number of the transition metal was measured by X-ray photoelectron spectroscopy (XPS) in the surface analysis of the hole injection transport layer.

In Example 1, XPS measurement was performed on the photocatalyst treatment unit and the photocatalytic treatment unit, and the Mo oxidation number was estimated. In the following table, the peaks of the oxidation number of +6 and the oxidation number of +5 of Mo were subjected to peak separation, and the peak number of the oxidation number + 5 when the oxidation number + 6 was normalized to 100 was shown.

[evaluation]

In the spectrum of molybdenum of Example 1, a component of +5 oxidation number was detected from both the photocatalyst treatment portion and the photocatalytic treatment portion. In the case of the photocatalyst-treated film, the ratio of the pentavalent is slightly reduced. However, the fact that the photovoltaic treated film is only slightly changed in spite of the strong oxidation treatment indicates that the organic-transition metal oxide complex of the present invention is very stable. The reason that Example 1 is longer than Comparative Example 4 using MoO ₃ is considered to be that the component of the oxidation number +5 is appropriately contained in a stable state. In addition, in Example 1, the surface of the hole injection transporting layer was oxidized, and the ionization potential was 5.2 eV near the ITO interface, It is presumed that there is a high possibility that a stepwise shape is formed at 5.4 eV at the interface of the transport layer and thus the hole injecting property is improved or stabilized.

«Experiment of wetting change»

[Example 13]

As shown in Fig. 11, on the glass substrate 41 having the ITO transparent electrode (anode) 42 formed thereon, an organic-transition metal Oxide composite thin film was formed to a thickness of 10 nm by spin coating and patterned using a photocatalyst-containing layered substrate (photomask 50 with a photocatalyst-containing layer) having a light-shielding portion and a photocatalyst-containing layer formed on the substrate. The wettability between the exposed portion and non- .

First, a thin film of indium tin oxide (ITO) (thickness: 150 nm) was used as a transparent electrode. The ITO-equipped glass substrate (manufactured by Sanyo Chemical Industries, Ltd.) was subjected to ultrasonic cleaning in the order of a neutral detergent and ultrapure water, followed by UV ozone treatment.

Subsequently, an organic-transition metal oxide composite thin film as a hole injecting and transporting layer was formed on the substrate by spin coating using the ink 1 for forming a hole injection transport layer. After the coating film was formed, it was dried at 200 ° C on a hot plate. The film thickness after drying was 10 nm. The contact angle of the surface of the positive hole injection transport layer with respect to xylene was 49 °.

Subsequently, a photomask 50 with a photocatalyst-containing layer was prepared. A photomask having a chromium mask 54 formed on a synthetic quartz substrate 51 so as to provide a transmissive region 52 and a shielding region 53 was prepared. A coating solution for forming a photocatalyst-containing layer having the following composition was applied on the photomask by a spin coater, followed by heating and drying treatment at 150 ° C for 10 minutes to carry out a hydrolysis and polycondensation reaction to cure the photocatalyst, A transparent photocatalyst-containing layer 55 having a film thickness of 100 nm, which was firmly fixed, was formed. A transmission region 56 in which the photocatalyst-containing layer 55 is not formed is provided at the end on the synthetic quartz substrate 51.

(Coating liquid for forming photocatalyst-containing layer)

2 parts by weight of titanium dioxide (ST-K01, manufactured by Ishihara Sangyo Co., Ltd.)

0.4 parts by weight of organoalkoxysilane (TSL8113, manufactured by Toshiba Silicone Co., Ltd.)

3 parts by weight of isopropyl alcohol

Subsequently, the hole injection transport layer was exposed through the photomask provided with the photocatalyst-containing layer prepared above to form a pattern composed of the lyophilic area and the lyophobic area. Containing layer 55 of the photomask-containing layer photomask 50 provided with a photocatalyst-containing layer and the hole-injecting / transporting layer 43 by using a high-pressure mercury lamp, an ultraviolet exposure apparatus having a photomask with a photocatalyst- The distance was adjusted to be 100 mu m and then exposed for 3 minutes so that the exposure amount of light of 254 nm was 5 J / cm &lt; ² &gt; from the back side of the photomask 50 provided with the photocatalyst-containing layer.

Subsequently, the static contact angle of the liquid between the exposed portion and the non-exposed portion on the hole injection transport layer was measured by a contact angle meter (manufactured by Kyowa Chemical Industry Co., Ltd.). Xylene (surface tension: 28.5 mN / m) was used as the liquid.

[Example 14]

A pattern composed of a lyophilic area and a lyophobic area was formed in the same manner as in Example 13 except that the exposure was performed using vacuum ultraviolet light instead of ultraviolet light of 253 nm as an exposure light source to evaluate the wettability . At this time, vacuum ultraviolet light having a wavelength of 172 nm was formed from the metal mask side to form a pattern composed of a liquid-repellent region and a lyophilic region so that the light exposure amount was 5 J / cm ² .

[Example 15]

Same as Example 13 except that a thin film (film thickness: 10 nm) was formed by using the hole injection transport layer formation ink 3 instead of the hole injection transport layer formation ink 1 as the hole injection transport layer formation ink in Example 13 A lyophilic area and a lyophobic area were formed and the wettability was evaluated.

[Example 16]

Same as Example 13 except that a thin film (film thickness: 10 nm) was formed by using the ink 4 for forming a hole injection transporting layer in place of the hole injection transporting layer forming ink 1 as the hole injection transporting layer forming ink in Example 13 A lyophilic area and a lyophobic area were formed and the wettability was evaluated.

[Referential Example 6]

A wettability was evaluated by forming a thin film in the same manner as in Example 13 except that the hole injecting and transporting layer was heated in a hot plate at 200 캜 for 1 hour without carrying out the photocatalyst treatment.

[Reference Example 7]

In Reference Example 6, a thin film was formed in the same manner as in Reference Example 6 except that the hole injection transport layer formation ink 3 was used instead of the hole injection transport layer formation ink 1, and the wettability was evaluated.

[Referential Example 8]

In Reference Example 6, a wettability was evaluated by forming a thin film in the same manner as in Reference Example 6, except that the ink 4 for forming a hole injection transporting layer was used in place of the ink 1 for forming a hole injection transporting layer.

[Comparative Example 5]

In Reference Example 6, in place of the ink 1 for forming the positive hole injection transport layer, PEDOT / PSS (Static Agent AI4083) and 4- (3,3,4,4,5,5,6,6,7,7,8,8,8 , 9,9,10,10,10-heptadecafluorodecyl) benzylamine was formed by a spin coating method, the wettability was evaluated by forming elements in the same manner as in Reference Example 6. [ The PEDOT / PSS layer was prepared by diluting the PEDOT / PSS solution with distilled water and dissolving it to a film thickness of 10 nm after drying. Subsequently, a solution in which heptadecafluorodecylbenzylamine was dissolved in heptafluoro-n-butyric acid in an amount of 0.4 wt% was used, and the thin film was dried by applying. The film thickness after drying was not measurable and was 5 nm or less.

[evaluation]

11 to 11, a region II in which a photocatalyst is irradiated with light shown in Fig. 11, a region III in which a photocatalyst does not act in the unexposed portion, and a region III in which light is irradiated Table 3 shows the contact angle of the liquid in the region IV in which the photocatalyst does not act.

Table 4 shows the contact angles of the liquid before and after heating at 200 占 폚 with respect to the hole injection and transport layer in Reference Examples 6 to 8 and Comparative example 5. [

In Examples 13 to 16, the contact angles of xylene in region II (irradiation of light in the presence of a photocatalyst) were all lowered to 5 DEG or less. This result is considered to be that the fluoroalkyl group component is decomposed by the superoxide radical or the hydroxy radical generated on the photomask to be lyophilized. XPS measurement of these surfaces revealed that the fluoroalkyl groups were removed. On the other hand, in the region III (unexposed portion), the contact angle of the liquid was the same as the initial region I. The contrast of the liquid repellency of the unexposed portion and the exposed portion is 20 DEG or more, and it can be understood that the division of the ink can be performed by the present process. In Examples 13 and 15, it is found that the presence of the photocatalyst is necessary because the material is not decomposed by the light of 254 nm in the portion where only the exposure portion of the region IV is exposed. XPS measurements of these surfaces showed that the fluoroalkyl groups remained to the same extent as the untreated film. On the other hand, in the exposure portion of the region IV of Example 14, the contact angle is 10 DEG, which is 39 DEG lower than that of the unexposed portion. The contrast of the unexposed portion and the exposed portion of the exposed portion is 20 ° or more. Therefore, in the case of vacuum ultraviolet light, it is possible to carry out the division coating even without a photocatalyst. XPS measurements of these surfaces showed that a small amount of fluoroalkyl groups remained. In the case of vacuum ultraviolet light, it is presumed that the direct C-C bonding is broken by the energy of light. Therefore, in Region II of Example 14, two effects of photocatalytic effect and direct decomposition by light are expected.

In Reference Examples 6 to 8, it was observed that the contact angle with respect to the hole injection transporting layer-related device material of the present invention was decreased by about 10 deg. By heating, but since the contrast was 20 DEG or more as compared with the unexposed portion, It can be seen that it is possible. Therefore, it can be seen that the oil-repellency can be maintained even when high temperature heating is required in the drying process of the hole transport layer or the heat curing process. On the other hand, in Comparative Example 5, since the lyophobicity was completely damaged by heating, it can be seen that division application was impossible by heating.

&Lt; Fabrication of Device Patterned with Light Emitting Layer >

[Example 17]

A hole injecting and transporting layer is formed on an ITO substrate on which an insulating layer and a partition are formed (a partially enlarged schematic sectional view of FIG. 12 (A) and a partially enlarged schematic plan view thereof seen from above on FIG. 12 (B) The transport layer was exposed by a photomask having a photocatalyst to perform wettability patterning, and a hole transport layer and a light emitting layer were formed by applying ink by a jet method between the partition walls of the lyophilic dregs, and the basic layer structure of the hole block layer, electron transport layer, electron injection layer, And sealed to prepare an organic EL device having a green luminescence, and the luminescent surface of the organic EL device was observed. The light emitting layer was divided into two colors, green and blue.

First, an ITO substrate having a lattice-shaped insulating layer and a line-shaped partition as shown in Figs. 12 (A) and 12 (B) was subjected to ultrasonic cleaning in the order of neutral detergent and ultrapure water, and finally UV ozone treatment Respectively.

Subsequently, an organic-transition metal oxide composite thin film was formed as a hole injection transport layer on the substrate by spin coating. As the ink for forming the hole injection transport layer, the ink 1 for forming the hole injection transport layer was used. After the coating film was formed, it was dried at 200 ° C on a hot plate. The film thickness after drying was 10 nm. The contact angle was measured in a flat part having no barrier structure. As a result, the contact angle of the surface of the hole injection transport layer with respect to xylene was 49 °.

Next, using a photomask having a line-shaped light shielding region formed so as to have an opening of 90 占 퐉 as shown in Fig. 12 (B), the opening was adjusted to be positioned on the line-shaped partition, The wettability patterning with high contrast was performed. The distance between the photocatalyst-containing layer in the photocatalyst-containing-layer-provided photomask and the hole-injecting and transporting layer was adjusted to 100 μm by using a high-pressure mercury lamp, a photomask with a photocatalyst-comprising layer and a position adjusting mechanism of the substrate, And the photocatalyst-comprising layer was exposed for 3 minutes so that the exposure amount of light of 254 nm was 5 J / cm ² from the back side of the photomask. The contact angle was measured at a flat portion having no barrier structure even though it was an exposed portion. The contact angle of the surface of the hole injection transport layer with respect to xylene was 5 ° or less and lyophilized.

Subsequently, a coating solution for forming a hole transport layer of the following composition was applied to the lyophilic area formed between the partition walls by the inkjet method to form a hole transport layer. After the coating film was formed, it was dried in nitrogen at 200 DEG C for 60 minutes. (Amount of coating) was adjusted so that the film thickness after drying was 30 nm.

(Coating liquid for forming a hole transport layer)

- (4,4 '- (N- (4-sec-butylphenyl)) diphenylamine)] (TFB) 1.8 Weight portion

Methyl anisole 98.2 parts by weight

Subsequently, a coating liquid for forming a green light emitting layer was applied on the hole transport layer formed between the partition walls by an ink jet method at intervals of one line, and then a coating liquid for forming a blue light emitting layer was applied to a line not coated with the coating liquid for forming a green light emitting layer Jet method, thereby forming a light emitting layer in which green and blue colors are arranged at intervals of one line. After forming the coating film, it was dried in nitrogen at 100 DEG C for 30 minutes. The lead-out amount of the ink was adjusted so that the film thickness after drying was 40 nm.

(Coating liquid for forming a green light emitting layer)

1.8 parts by weight of 2-methyl-9,10-bis (naphthalen-2-yl) anthracene (MADN)

0.02 part by weight of 9,10-bis [N, N-di- (p-tolyl) -amino] anthracene (TTPA)

ㆍ 98 parts by weight of ethyl benzoate

(Coating solution for forming a blue light emitting layer)

1.8 parts by weight of 2-methyl-9,10-bis (naphthalen-2-yl) anthracene (MADN)

0.02 part by weight of 1-tert-butyl-perylene (TBP)

ㆍ 98 parts by weight of ethyl benzoate

A hole blocking layer was uniformly deposited on the light emitting layer. The hole blocking layer was formed by a resistive heating method using a bis (2-methyl-8-quinolinolato) (p-phenylphenolate) aluminum complex (BAlq) ^-4 Pa) to form a BAlq vapor-deposited film having a thickness of 15 nm.

An electron transport layer was deposited on the hole blocking layer. The electron transport layer was formed by evaporation of a tris (8-quinolinolato) aluminum complex (Alq3) so as to have a thickness of 20 nm in an Alq3 vapor deposition film under vacuum (pressure: 1 x ^10-4 Pa) by resistance heating method.

The electron injection layer and the cathode were sequentially deposited on the electron transport layer of the prepared transparent anode-supported glass substrate / hole injecting / transporting layer / hole transporting layer / light emitting layer / hole blocking layer / electron transporting layer. A vapor deposition film was formed in vacuum (pressure: 1 x 10 &lt; ^-4 &gt; Pa) by LiF (thickness: 0.5 nm) for the electron injection layer and Al (thickness: 100 nm) for the cathode sequentially by resistance heating deposition.

After the formation of the negative electrode, the glass was sealed with a non-alkali glass and a UV curable epoxy adhesive in a low-oxygen and low-humidity globe box.

After the luminescent layer was coated, the luminescent layer was observed by a fluorescence microscope, and it was confirmed that the luminescent layer was clearly colored and not mixed with green and blue. Further, by observing the light emitting surface of the fabricated device with a microscope, it was confirmed that a device capable of emitting blue and green light at one line intervals could be manufactured. It has been confirmed that the light emission in the pixels of each pixel is uniform, the light emission deviation between the pixels is small, and the divided application is performed with high precision.

In this embodiment, the two colors of green and blue are separately applied. According to the method of this embodiment, however, the three colors and four colors can be easily extended in principle, It is possible.

[Example 18]

Example 18 was repeated in the same manner as in Example 17 except that a photomask free of photocatalyst was used instead of the photocatalyst-carrying photomask in the exposure of the photocatalyst, using vacuum ultraviolet light instead of ultraviolet light of 253 nm as the light source for exposure, Were prepared. At this time, a pattern composed of a liquid-repellent region and a lyophilic region was formed from the photomask side so that a vacuum ultraviolet light having a wavelength of 172 nm was exposed at a light exposure of 5 J / cm ² .

Observation of the light-emitting surface of the fabricated device with a microscope confirmed that devices emitting blue and green light at one line intervals could be fabricated. It has been confirmed that the light emission in the pixels of each pixel is uniform, the light emission deviation between the pixels is small, and the divided application can be performed with high precision.

In this embodiment, the two colors of green and blue are separately applied. According to the method of this embodiment, however, the three colors and four colors can be easily extended in principle, It is possible.

[Example 19]

The organic EL device of Example 19 was fabricated in the same manner as in Example 17 except that the ITO substrate in which the barrier ribs were not formed using only the insulating layer was used instead of the ITO substrate in which the insulating layer and the barrier rib were formed.

After the luminescent layer was coated, the luminescent layer was observed by a fluorescence microscope. It was confirmed that the ink was not broken (although the partition structure was not formed), and the luminescent layer was cleanly divided and not mixed with green and blue there was. Further, by observing the light emitting surface of the fabricated device with a microscope, it was confirmed that a device capable of emitting blue and green light at one line intervals could be manufactured. It has been confirmed that the light emission in the pixels of each pixel is uniform, the light emission deviation between the pixels is small, and the divided application can be performed with high precision.

In this embodiment, the two colors of green and blue are separately applied. According to the method of this embodiment, however, the three colors and four colors can be easily extended in principle, It is possible.

[Example 20]

The photomask provided with the photocatalyst in Example 17 was not provided with a chrome pattern but a photomask having no chrome pattern was used and exposure of 254 nm was carried out from the side of the ITO substrate instead of the back side of the photomask having the photocatalyst- ² for 9 minutes, the organic EL device of Example 20 was fabricated in the same manner as in Example 17. [

Observation of the light-emitting surface of the fabricated device with a microscope confirmed that devices emitting blue and green light at one line intervals could be fabricated. It has been confirmed that the light emission in the pixels of each pixel is uniform, the light emission deviation between the pixels is small, and the divided application can be performed with high precision.

The device material for a hole injection and transport layer obtained in Synthesis Example 1 shows a high transmittance at 254 nm, and as shown in the above example, the device characteristics are not deteriorated by UV irradiation at 254 nm, which is advantageous for exposure from the backside.

[Comparative Example 6]

PEDOT / PSS (manufactured by Stark Co., AI4083) and 4- (3,3,4,4,5,5,6,6,7,7, &lt; RTI ID = 0.0 & 8,8,9,9,10,10,10-heptadecafluorodecyl) benzylamine was used as a light emitting material and a laminated thin film was formed by the spin coating method, the organic EL of Comparative Example 6 The device was fabricated. The PEDOT / PSS layer was prepared by diluting the PEDOT / PSS solution with distilled water and dissolving it to a film thickness of 10 nm after drying. Subsequently, a solution in which heptadecafluorodecylbenzylamine was dissolved in heptafluoro-n-butyric acid in an amount of 0.4 wt% was used, and the thin film was dried by applying. The film thickness after drying was not measurable and was 5 nm or less.

When the light emitting surface of the fabricated device was observed under a microscope, it was confirmed that the mixture of blue and green inks was severe, the light emission deviation between pixels was seriously deteriorated, and the oil repellent layer did not function at all.

1 device substrate
2 substrate
3 First electrode layer
4 hole injection transport layer
5 Fluorine decomposition part of the hole injection transport layer
6a partition (partition wall)
6b partition (insulating layer)
11 lyophilic region
12 Repellent area
21 photocatalyst-containing layer substrate
22 gas
23th light pipe
24 photocatalyst-containing layer
27 energy lines
28 Laser
29 Vacuum Ultraviolet Light
30 Metal mask
31 organic EL device
32 luminescent layer
33 electron injection transport layer
34 Second electrode layer
41 glass substrate
42 ITO transparent electrode (anode)
43 hole injection transport layer
50 Photomask with photocatalyst-containing layer
51 synthetic quartz substrate
52 transmission area
53 Shading area
54 chrome mask
55 photocatalyst-containing layer
56 Transmission region where no photocatalyst-containing layer is formed
60 ITO substrate with insulating layer and barrier ribs
61 glass substrate
62 ITO transparent electrode (anode)
63 compartment (insulating layer)
64 compartment (partition wall)

Claims (20)

delete delete delete delete delete delete delete delete delete A method of manufacturing a device having two or more electrodes facing each other on a substrate and a hole injecting and transporting layer disposed between two of the electrodes,
A hole injection and transport layer containing a device material for a hole injection and transport layer, characterized in that a fluorine-containing organic compound is adhered to an organic-transition metal oxide complex which is a reaction product of an organic transition metal complex on a substrate on which a first electrode layer is formed in a pattern shape. A hole injecting and transporting layer forming step of forming a hole injecting and transporting layer,
A photocatalyst treatment layer substrate on which a photocatalyst treatment layer containing at least a photocatalyst is formed on a substrate is disposed on the hole injection transport layer with a gap that can act as a photocatalyst accompanied by energy irradiation, And a wettability change pattern forming step of forming a wettability change pattern whose wettability is changed on the surface of the hole injection transport layer by energy irradiation. 11. The device manufacturing method according to claim 10, further comprising a dividing step of forming a dividing portion between the patterns of the first electrode layer on the substrate on which the first electrode layer is formed in the pattern shape before the hole injecting and transporting layer forming step Way. 12. The method according to claim 11, wherein the substrate on which the first electrode layer is formed is a light-transmitting substrate, and the partitioning portion is a dividing portion for reflecting or absorbing an energy ray irradiated in the wettability changing pattern forming step, Wherein a wettability change pattern in which the wettability is changed is formed on the surface of the hole injection transport layer by energy irradiation from the substrate side. The method of manufacturing a device according to claim 10, wherein in the wettability change pattern forming step, energy is irradiated in a pattern shape using a mask. The method of manufacturing a device according to claim 10, wherein in the step of forming a wettability-variable pattern, a method of energy irradiation in a pattern shape is a method of scanning an ultraviolet laser in a pattern shape to perform energy irradiation. A method of manufacturing a device having two or more electrodes facing each other on a substrate and a hole injecting and transporting layer disposed between two of the electrodes,
A hole injection and transport layer containing a device material for a hole injection and transport layer, characterized in that a fluorine-containing organic compound is adhered to an organic-transition metal oxide complex which is a reaction product of an organic transition metal complex on a substrate on which a first electrode layer is formed in a pattern shape. A hole injecting and transporting layer forming step of forming a hole injecting and transporting layer,
And a wettability change pattern forming step of forming a wettability change pattern whose wettability is changed on the surface of the hole injection transport layer by irradiating vacuum ultraviolet rays in a pattern shape. The method of manufacturing a device according to claim 10, comprising a step of applying the hole injection transport layer formation ink containing the hole injection transport layer-forming device material and the organic solvent in the hole injection transport layer formation step. The method of manufacturing a device according to claim 16, wherein the step of forming the hole injection transport layer includes a step of heating or light irradiation in the presence of oxygen. delete delete delete

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