KR101568517B1 - 가스메탈 아크 용접용 솔리드 와이어 - Google Patents
가스메탈 아크 용접용 솔리드 와이어 Download PDFInfo
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- KR101568517B1 KR101568517B1 KR1020130163193A KR20130163193A KR101568517B1 KR 101568517 B1 KR101568517 B1 KR 101568517B1 KR 1020130163193 A KR1020130163193 A KR 1020130163193A KR 20130163193 A KR20130163193 A KR 20130163193A KR 101568517 B1 KR101568517 B1 KR 101568517B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3053—Fe as the principal constituent
- B23K35/3066—Fe as the principal constituent with Ni as next major constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01007—Nitrogen [N]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01008—Oxygen [O]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01016—Sulfur [S]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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Abstract
Description
구분 | C | Si | Mn | P | S | Ni | Cr | Mo | B* | N* | Ti | Al | Cu | 추가 성분 |
O* |
발명 예1 |
0.05 | 0.2 | 2.45 | 0.005 | 0.003 | 2.5 | 0.3 | 0.3 | 15 | 42 | 0.02 | 0.005 | 0.4 | W 0.01 |
8 |
발명 예2 |
0.07 | 0.25 | 2.5 | 0.006 | 0.006 | 2.9 | 0.4 | 0.4 | 14 | 36 | 0.02 | 0.004 | 0.4 | Ca 0.001 |
5 |
발명 예3 |
0.07 | 0.32 | 2.8 | 0.008 | 0.005 | 2.6 | 0.4 | 0.4 | 22 | 40 | 0.03 | 0.003 | 0.2 | V 0.01 |
7 |
발명 예4 |
0.07 | 0.42 | 2.5 | 0.005 | 0.006 | 2.7 | 0.3 | 0.5 | 20 | 35 | 0.02 | 0.003 | 0.5 | - | 10 |
발명 예5 |
0.08 | 0.38 | 2.5 | 0.005 | 0.005 | 2.8 | 0.3 | 0.6 | 26 | 45 | 0.03 | 0.002 | 0.3 | Nb 0.01 |
9 |
비교예1 | 0.05 | 0.13 | 1.93 | 0.011 | 0.004 | 1.71 | 0.6 | 0.2 | 69 | 40 | 0.04 | 0.001 | 0.2 | - | 12 |
비교예2 | 0.06 | 0.06 | 1.25 | 0.010 | 0.007 | 1.61 | 0.5 | 0.01 | 21 | 44 | 0.3 | 0.007 | 0.3 | - | 15 |
비교예3 | 0.04 | 0.19 | 2.0 | 0.008 | 0.004 | 1.75 | 0.03 | 0.55 | 105 | 36 | - | - | 0.2 | - | 14 |
비교예4 | 0.06 | 0.28 | 1.56 | 0.013 | 0.008 | 2.5 | 0.02 | 1.14 | 58 | 31 | 0.012 | - | 0.5 | - | 12 |
비교예5 | 0.05 | 0.2 | 1.45 | 0.010 | 0.005 | 2.5 | 0.3 | 0.3 | 20 | 34 | 0.02 | 0.005 | 0.014 | W 0.01 |
12 |
구분 | 합금원소 구성비 | |
5C+Si+2Mn | Mo+2Cr+5Cu+4Ni | |
발명예 1 | 5.4 | 12.9 |
발명예 2 | 5.6 | 14.8 |
발명예 3 | 6.3 | 12.6 |
발명예 4 | 5.8 | 14.4 |
발명예 5 | 5.8 | 13.9 |
비교예 1 | 4.2 | 9.2 |
비교예 2 | 2.9 | 9.0 |
비교예 3 | 4.4 | 8.6 |
비교예 4 | 3.7 | 13.7 |
비교예 5 | 3.4 | 11.0 |
구분 | C | Si | Mn | P | S | Ni | Cr | Mo | B | N | Ti | Al | Cu | 추가성분 | O |
발명재1 | 0.04 | 0.2 | 2.4 | 0.013 | 0.005 | 2.4 | 0.3 | 0.3 | 18 | 52 | 0.01 | 0.003 | 0.35 | W 0.01 |
340 |
발명재2 | 0.06 | 0.2 | 2.5 | 0.011 | 0.006 | 2.5 | 0.4 | 0.4 | 23 | 53 | 0.01 | 0.004 | 0.36 | Ca 0.001 |
380 |
발명재3 | 0.06 | 0.3 | 2.5 | 0.008 | 0.005 | 2.5 | 0.4 | 0.4 | 23 | 50 | 0.02 | 0.003 | 0.21 | V 0.01 |
350 |
발명재4 | 0.07 | 0.4 | 2.4 | 0.009 | 0.006 | 2.4 | 0.3 | 0.5 | 18 | 43 | 0.02 | 0.003 | 0.46 | - | 320 |
발명재5 | 0.07 | 0.33 | 2.5 | 0.01 | 0.005 | 2.5 | 0.3 | 0.6 | 19 | 45 | 0.03 | 0.002 | 0.28 | Nb 0.01 |
380 |
비교재1 | 0.05 | 0.13 | 1.9 | 0.011 | 0.004 | 1.7 | 0.6 | 0.2 | 48 | 50 | 0.02 | 0.001 | 0.21 | - | 290 |
비교재2 | 0.06 | 0.06 | 1.2 | 0.01 | 0.007 | 1.6 | 0.5 | 0.01 | 25 | 74 | 0.3 | 0.007 | 0.32 | - | 480 |
비교재3 | 0.04 | 0.17 | 1.9 | 0.008 | 0.004 | 1.7 | 0.03 | 0.55 | 80 | 56 | - | - | 0.2 | - | 500 |
비교재4 | 0.04 | 0.20 | 1.56 | 0.013 | 0.008 | 2.3 | 0.02 | 1.14 | 39 | 71 | 0.012 | - | 0.5 | - | 670 |
비교재5 | 0.05 | 0.17 | 1.45 | 0.01 | 0.005 | 2.3 | 0.3 | 0.3 | 22 | 52 | 0.02 | 0.005 | 0.014 | W 0.01 |
440 |
구분 | 용접이음부 미세조직 (분율%) | 용접이음부 기계적 물성 | |||
AF | LB | M | 인장강도 (MPa) | vE-20℃(J) | |
발명재 1 | 27 | 72 | 1 | 904 | 83 |
발명재 2 | 26 | 71 | 3 | 922 | 83 |
발명재 3 | 28 | 70 | 2 | 911 | 76 |
발명재 4 | 25 | 72 | 3 | 924 | 86 |
발명재 5 | 28 | 70 | 2 | 922 | 82 |
비교재 1 | 16 | 53 | 31 | 837 | 16 |
비교재 2 | 15 | 50 | 35 | 844 | 26 |
비교재 3 | 24 | 40 | 36 | 851 | 44 |
비교재 4 | 15 | 45 | 40 | 973 | 28 |
비교재 5 | 17 | 34 | 49 | 996 | 39 |
Claims (6)
- 솔리드 와이어 전체 중량을 기준으로, 탄소(C): 0.03~0.1%, 실리콘(Si): 0.1~0.5%, 망간(Mn): 2.0~3.0%, 니켈(Ni): 2.0~3.5%, 크롬(Cr): 0.1~0.6%, 몰리브덴(Mo): 0.3~1.0%, 티타늄(Ti): 0.01~0.05%, 구리(Cu): 0.1~0.6%, 보론(B): 0.0005~0.003%, 알루미늄(Al): 0.001~0.01%, 질소(N): 0.005% 이하, 산소(O): 0.003% 이하, 인(P): 0.03% 이하, 황(S): 0.03% 이하, 잔부 Fe 및 불가피한 불순물을 포함하고,
5 ≤ (5C+Si+2Mn) ≤ 7, 12 ≤ (Mo+2Cr+5Cu+4Ni) ≤ 15를 만족하는 것인, 가스메탈 아크 용접용 솔리드 와이어.
- 제 1항에 있어서,
상기 와이어는 중량%로, 니오븀(Nb): 0.001~0.1%, 바나듐(V): 0.001~0.1% 및 텅스텐(W): 0.01~0.5%로 구성되는 그룹에서 선택된 1종 또는 2종 이상을 더 포함하는 것인, 가스메탈 아크 용접용 솔리드 와이어.
- 제 1항에 있어서,
상기 와이어는 중량%로, 칼슘(Ca): 0.0005~0.005% 및 희토류 원소(REM): 0.005~0.05% 중 1종 또는 2종을 더 포함하는 것인, 가스메탈 아크 용접용 솔리드 와이어.
- 제 1항에 있어서,
상기 와이어를 이용한 용접시 보호가스는 100% CO2 또는 Ar-CO2 혼합가스를 사용하는 것인, 가스메탈 아크 용접용 솔리드 와이어.
- 제 1항에 있어서,
상기 와이어를 이용하여 형성된 용접이음부의 미세조직은 면적분율로 20~30%의 침상 페라이트 및 70~80%의 하부 베이나이트를 포함하는 것인, 가스메탈 아크 용접용 솔리드 와이어.
- 제 1항에 있어서,
상기 와이어를 이용하여 형성된 용접이음부의 인장강도는 900Mpa 이상이고, -20℃에서의 충격인성이 70J 이상인 것인, 가스메탈 아크 용접용 솔리드 와이어.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016542266A JP6576348B2 (ja) | 2013-12-24 | 2013-12-24 | 衝撃靱性に優れた超高強度ガスメタルアーク溶接継手 |
CN201380081880.3A CN105848820B (zh) | 2013-12-24 | 2013-12-24 | 冲击韧性优异的超高强度气体保护金属极弧焊接头及用于制作其的焊丝 |
PCT/KR2013/012149 WO2015099219A1 (ko) | 2013-12-24 | 2013-12-24 | 충격인성이 우수한 초고강도 가스메탈 아크 용접이음부 및 이를 제조하기 위한 솔리드 와이어 |
KR1020130163193A KR101568517B1 (ko) | 2013-12-24 | 2013-12-24 | 가스메탈 아크 용접용 솔리드 와이어 |
US15/104,707 US10266929B2 (en) | 2013-12-24 | 2013-12-24 | Ultrahigh-strength gas metal arc welded joint having excellent impact toughness, and solid wire for producing same |
DE112013007707.8T DE112013007707B4 (de) | 2013-12-24 | 2013-12-24 | Ultrahochfeste Metallschutzgasschweißverbindung mit ausgezeichneter Kerbschlagzähigkeit und Volldraht zum Herstellen derselben |
JP2017225099A JP6803825B2 (ja) | 2013-12-24 | 2017-11-22 | 衝撃靱性に優れた超高強度ガスメタルアーク溶接継手を製造するためのソリッドワイヤ |
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KR1020130163193A KR101568517B1 (ko) | 2013-12-24 | 2013-12-24 | 가스메탈 아크 용접용 솔리드 와이어 |
Publications (2)
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KR20150074936A KR20150074936A (ko) | 2015-07-02 |
KR101568517B1 true KR101568517B1 (ko) | 2015-11-11 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101982160B1 (ko) * | 2016-12-23 | 2019-08-28 | 주식회사 포스코 | 저온인성이 우수한 극후강재 용접이음부 및 그 용접방법 |
KR102195473B1 (ko) * | 2019-11-27 | 2020-12-29 | 고려용접봉 주식회사 | 개량 9Cr-1Mo강용 용접 와이어 |
CN114769933A (zh) * | 2022-04-07 | 2022-07-22 | 江西恒大高新技术股份有限公司 | Inconel 625改型合金堆焊焊丝及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005046877A (ja) | 2003-07-29 | 2005-02-24 | Jfe Steel Kk | 炭酸ガスシールドアーク溶接用鋼ワイヤおよびそれを用いた溶接方法 |
JP2006000868A (ja) * | 2004-06-15 | 2006-01-05 | Nippon Steel Corp | 下盛り溶接用ガスシールドアーク溶接用ソリッドワイヤ。 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005046877A (ja) | 2003-07-29 | 2005-02-24 | Jfe Steel Kk | 炭酸ガスシールドアーク溶接用鋼ワイヤおよびそれを用いた溶接方法 |
JP2006000868A (ja) * | 2004-06-15 | 2006-01-05 | Nippon Steel Corp | 下盛り溶接用ガスシールドアーク溶接用ソリッドワイヤ。 |
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