KR101523003B1 - Side view LED package and manufacturing method thereof - Google Patents

Abstract

The package includes a package body having a laterally elongated cavity formed therein, a plurality of LED chips longitudinally arranged and mounted on the bottom of the cavity, and a plurality of leads connected to the LED chip by bonding wires in the cavity, Wherein at least one of the plurality of lead terminals is at least partially present on a long side wall surface of the cavity.

Cavity, package, side view, LED, chip, lead terminal, sidewall, slope

Description

SIDE VIEW LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a side view LED (Light Emitting Diode) package, and more particularly to a side view LED package that reduces the spacing between LED chips arranged in a cavity of a package body.

Generally, a side view LED package is widely used as a light source of a backlight unit. At this time, the side view LED package is disposed on the side surface of the light guide plate, and supplies light into the light guide plate. The side view LED package includes a package body having an elongated cavity in which an LED chip is mounted. The LED chip receives light from the lead terminals provided in the package body and emits light.

Recently, a side view LED package including a structure in which blue, green, and red LED chips are arranged in a single long cavity in a row is developed. Such a side view LED package is disclosed in Korean Patent Registration No. 10-0838498.

The disclosed side view LED package includes a package body in which an elongated cavity is formed in a transverse direction, and three LED chips, i.e., blue, green, and red LED chips, are arranged in a row in the cavity.

At this time, since there must be a lead terminal and a bonding wire between neighboring LED chips, the gap between neighboring LED chips has to be increased excessively. At this time, if the distance between the LED chips is large, the color mixing interval between the blue, green and red lights generated from each LED chip is shortened. In order to compensate for the shortening of the color mixing section, a larger number of light sources are additionally required, resulting in economical waste. Also, connecting the LED chips arranged in a row to the lead terminals with bonding wires requires an unnecessarily long bonding wire, which causes the process to be complicated and difficult.

It is an object of the present invention to provide a side view LED package in which the interval between LED chips arranged in the cavity is reduced compared to the prior art by directing some of the bonding wires to the cavity sidewall surface of the package body.

Another object of the present invention is to provide a method of manufacturing a side view LED package in which the interval between LED chips arranged in a long cavity in the cavity is reduced compared with the conventional one by orienting a part of the bonding wires to the cavity sidewall of the package body .

A side view LED package according to an aspect of the present invention includes: a package body having an elongated cavity formed in a transverse direction; a plurality of LED chips longitudinally arranged and mounted in the bottom of the cavity; And at least one of the plurality of lead terminals is at least partially present on a long sidewall of the cavity.

Preferably, the plurality of LED chips include LED chips that are sandwiched between two LED chips, and at least one of the two electrodes of the LED chip is connected to a lead terminal on the side wall surface by a bonding wire do.

Preferably, one electrode of the LED chip located outside the array of the plurality of LED chips is connected to a lead terminal on the side wall surface by a bonding wire.

Preferably, one lead terminal on the sidewall surface is connected by two or more LED chips and a bonding wire.

Preferably, the plurality of LED chips include red, green, and blue LED chips.

Preferably, the side wall surface is inclined so as to form an obtuse angle with respect to the floor.

According to another aspect of the present invention, there is provided a method of manufacturing a side view LED package, the manufacturing method comprising: providing a cavity having an elongate cavity in a lateral direction, wherein a plurality of lead terminals are included in the cavity, The method comprising the steps of: preparing a package body having at least a part on a long sidewall of the cavity; mounting a plurality of LED chips on the bottom of the cavity by arranging the LED chips in a transversely long direction; And a wire bonding step of connecting the plurality of LED chips to the lead terminals. At this time, in the wire bonding step, at least one of the plurality of LED chips is connected to a lead terminal on a long sidewall of the cavity by a bonding wire.

Preferably, the wire bonding step includes a normal wire bonding step of connecting a bonding wire to a lead terminal on the bottom of the cavity, and a wire bonding step of connecting another bonding wire to a lead terminal on a sidewall of the cavity, and an abnormal wire bonding process.

Preferably, the sidewall surface is inclined to form an obtuse angle with respect to the floor, the normal wire bonding process is performed while the bottom is horizontal, and the up-normal wire bonding process is performed such that the side wall surface is horizontal Lt; / RTI >

According to the present invention, the distance between the LED chips can be reduced by moving the lead terminals between the LED chips to the sidewall of the cavity. When white light is to be realized using blue, green, and red LED chips, the interval between the LED chips is narrowed, so that the mixing range of blue, green, and red light is widened, It is economically very advantageous. Further, according to the present invention, it is possible to realize a reliable side view LED package without necessitating an unnecessarily long bonding wire.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

FIG. 1 is a plan view showing a side view LED package according to an embodiment of the present invention, and FIG. 2 is a sectional view illustrating a side view LED package according to an embodiment of the present invention.

1 and 2, the side view LED package 1 of the present embodiment includes a package body 10, three LED chips 21, 22, 23 (collectively 20) Terminals 41, 42, 43, 44 (collectively, 40).

The package body 10 has an elongated shape in the transverse direction, and an elongated cavity 12 is formed on the upper surface of the elongated cavity 12 in the transverse direction. In describing the present invention, the top surface of the package body is defined as the front surface in Fig. The cavity 12 is defined by the bottom 14 on which the LED chips 40 are mounted and the sidewalls that intersect the bottom 14 thereof. Although not shown, a light-permeable sealing material for protecting the LED chip, the bonding wire, and the like is formed in the cavity 12.

In particular, an elongated sidewall 16 is formed on the inside of the cavity 12 in the lateral direction of the package body 10. The sidewall surface 16 is formed obliquely to form an obtuse angle with respect to the bottom 14 of the cavity. The inclined sidewall surface 16 serves as a reflector surface for reflecting light. Furthermore, at least one lead terminal is provided on the sidewall surface 16, which facilitates a wire bonding process that connects the bonding wires to the lead terminals of the sidewall surfaces.

For convenience of explanation, the LED chips are divided into the first LED chip 21, the second LED chip 22 and the third LED chip 23, and the lead terminals are connected to the first lead terminal 41, The terminal 42, the third lead terminal 43, and the fourth lead terminal 44, respectively. On the other hand, the number of LED chips or the number of lead terminals does not limit the present invention. It should be noted, however, that when the number of LED chips is three or more and the number of lead terminals is four or more, it best matches the intention of the present invention.

In the present embodiment, the second, third and fourth lead terminals 42, 43 and 44 are connected to the first lead terminal 41, unlike the case where they exist in the bottom 14 of the cavity in the cavity 12. [ Extends through the bottom 14 to the long sidewall 16 of the cavity. Here, the meaning of 'exists' means that it is exposed so as to be connected to the bonding wire (W). In order to avoid complicating the drawing, reference numeral 'W' is shown in FIG. 1 only for one bonding wire.

On the other hand, the first, second and third LED chips 21, 22 and 23 are arranged in a row in the longitudinal direction on the bottom 14 of the cavity and are mounted on the bottom 14 thereof. Here, the surface of the lead terminal located at the bottom 14 should also be regarded as a part of the cavity bottom. The first and second LED chips 21 and 22 are located outside the array of LED chips and the third LED chip 23 is interposed between the first LED chip 21 and the second LED chip 22. [ Respectively. Due to this arrangement, the third LED chip 23 is also referred to as a " chip " in the specification of the present invention, particularly in the claims. Each of the first, second, and third LED chips 21, 22, and 23 is preferably a red LED chip, a green LED chip, or a blue LED chip.

In this embodiment, the third LED chip 23 has two electrodes on its top, one of which is connected to the first lead terminal 41 on the long sidewall 16 of the cavity and the bonding wire W ). The other electrode of the third LED chip 23 is connected to the fourth lead terminal 44 at the bottom of the cavity by a bonding wire. The fourth lead terminal 44 is disposed between the first lead terminal 41 and the third lead terminal 44.

Alternatively, it may be considered to extend the fourth lead terminal to the long side wall surface of the cavity, and in such a case, two electrodes of the third LED chip may be connected to the two lead terminals on the cavity side wall surface. However, electrical insulation between the first lead terminal and the fourth lead terminal should be ensured.

The first LED chip 21 also has two electrodes on the top. One of the two electrodes is connected by a bonding wire to the first lead terminal 41 on the long side wall 16 of the cavity. The other electrode of the first LED chip 21 is connected to the second lead terminal 42 at the left edge of the cavity bottom 14 by a bonding wire. Likewise, the second LED chip 22 also has two electrodes on top, one of which is connected by a bonding wire to a first lead terminal 41 on the long sidewall 16 of the cavity And the other electrode is connected to the third lead terminal 43 at the right edge of the cavity bottom 14 by a bonding wire.

The arrangement of the first LED chip 21 and the third LED chip 23, which is described above, in which some lead terminals (first lead terminals in the present embodiment) are transferred from the cavity bottom to the long side wall of the cavity, It is possible to eliminate or reduce the area between the second LED chip 22 and the third LED chip 23 for connecting the lead terminal and the bonding wire between the first LED chip 22 and the third LED chip 23, Lt; / RTI > In the case where the plurality of LED chips 21, 22, and 23 are red, green, and blue LED chips, when the distance between the LED chips is narrowed, a mixed region of blue light, green light, and red light increases.

According to a preferred embodiment of the present invention, one lead terminal, i.e., a first lead terminal 41, present on the long sidewall of the cavity is connected to all of the LED chips in the cavity, 3 LED chips 21, 22, 23 and the bonding wires. However, in the present invention, at least one of the plurality of lead terminals is moved from the bottom of the cavity to the long sidewall of the cavity, thereby reducing the interval between the LED chips. Therefore, Modified embodiments will be possible.

2, the long side wall surface 16 of the cavity is inclined to form an obtuse angle &thetas; with respect to the bottom 14 of the cavity. Since the package body is formed by a resin including a reflective pigment or the inner surface of the cavity is reflective coated, the long side wall surface 16 reflects light and transmits the light in a desired direction. Since the lead terminals extending to the sidewall surface 16 are made of a reflective metal material, the reflection performance of the sidewall surface 16 is not lowered by the lead terminals. By tilting the sidewall surface 16, it is possible to further facilitate the bonding wire connection process and the process of forming the solder ball therefor.

3 is a plan view illustrating a side view LED package according to another embodiment of the present invention. 3, a third LED chip 23, which is a chip sandwiched between two LED chips, and a second LED chip 22 adjacent to the right side of the third LED chip 23, And has two electrodes at the top. Thus, the relationship between the bonding wire and the lead terminal is the same as in the previous embodiment. That is, the second LED chip 22 and the third LED chip 23 are connected such that one of the electrodes is commonly connected to the first lead terminal 41 on the long sidewall 16 of the cavity by the bonding wire And the remaining electrodes are connected to the third and fourth lead terminals 43 and 44 at the bottom 40 of the cavity by different bonding wires, respectively.

On the other hand, the first LED chip 21 'adjacent to the left side of the third LED chip 23 includes a top electrode and a bottom electrode. In the wiring connection between the second lead terminal 42 and the top electrode, Only the bonding wire is used. The first LED chip 21 'is mounted on a part of the first lead terminal 41 at the bottom of the cavity so that the lower electrode of the first LED chip 21' and the first lead terminal 41 . At this time, the first lead terminal 41 serves as a common electrode for the first, second, and third LED chips. Normally, there are many red LED chips as the one-bonding type LED chip having electrodes at the top and bottom.

In the description of the above embodiments, it has been described that the number of lead terminals existing on the long sidewall in the cavity is one, and that one lead terminal serves as a common electrode for several LED chips. However, there can be a plurality of lead terminals on the long side wall of the cavity, which is well illustrated in FIG. 4, which schematically shows a side view LED package according to another embodiment of the present invention.

4, there are four lead terminals, that is, first, second, third and fourth lead terminals 41a, 41b, 41c, and 41d, on the long side wall 16 of the cavity 12 And two lead terminals, that is, fifth and sixth lead terminals 42a and 42b, are present on the left and right outer sides of the bottom 14 of the cavity 12. [

In this embodiment, the center LED chip 210 is connected to two bonding wires for its two electrodes, and the two bonding wires are connected to the second and third leads Terminals 41b and 41c.

In the LED chip 220 on the left side, one electrode of the two electrodes is connected to the first lead terminal 41a on the long sidewall 16 by bonding wires, and in the case of the remaining electrodes, And is connected to the fifth lead terminal 42a in the cavity bottom 16. Likewise, the LED chip 230 on the right side is connected to the fourth lead terminal 41d on the long sidewall 16 by one electrode of the two electrodes by the bonding wire. In the case of the remaining electrodes, And is connected to the sixth lead terminal 42b at the bottom 16.

5 is a flow chart schematically illustrating a method of manufacturing a side view LED package according to an embodiment of the present invention.

Referring to FIG. 5, the side view LED package manufacturing method of this embodiment includes preparing the package body S1, mounting the LED chip S2, and wire bonding S3.

 1 and 2, the package body to be prepared in step S1 includes a long cavity 12 in the lateral direction, and a plurality of lead terminals 41, 42, 43, And at least one lead terminal 41 of the plurality of lead terminals 41, 42, 43 and 44 is at least partially present on the long sidewall 16 of the cavity 12.

Next, in step S2, a plurality of LED chips are mounted on the bottom 14 of the cavity in a row and in a row using an adhesive in paste form. Here, the plurality of LED chips may include a red LED chip, a blue LED chip, and a green LED chip. When the LED chip is mounted, the bottom 14 of the cavity is aligned with or parallel to the horizontal line x and is in a horizontal state perpendicular to the vertical line y, as shown in Fig.

Next, in step S3, a process of electrically connecting a plurality of LED chips to the lead terminals by a bonding wire is performed. In this embodiment, the wire bonding step is performed by a known normal wire bonding step and an up normal wire bonding step proposed in accordance with the present invention.

The normal wire bonding process is performed such that the bottom of the cavity 14 is horizontal as in the chip mounting step shown in Fig. On the other hand, the up-normal wire bonding process can be performed by rotating the cavity body 10 at an arbitrary angle up to a horizontal position where the inclined side wall surface 16 of the cavity is parallel or coincident with the horizontal line x, . The process of forming the solder ball B and the process of connecting the one end of the bonding wire W to the solder ball B are not interfered with other parts of the package body because the side wall surface 16 is inclined. .

1 is a plan view of a side view LED package in accordance with an embodiment of the present invention.

2 is a cross-sectional view of a side view LED package in accordance with an embodiment of the present invention.

3 is a plan view of a side view LED package in accordance with another embodiment of the present invention;

4 is a view for explaining a side view LED package according to another embodiment of the present invention;

5 is a flowchart illustrating a method of manufacturing a side view LED package according to an embodiment of the present invention.

FIGS. 6 and 7 are diagrams for explaining a chip mounting step and a wire bonding step in the manufacturing method shown in FIG. 5;

Claims (9)

A package body having an elongated cavity formed in a lateral direction; A plurality of LED chips longitudinally arranged and mounted on the bottom of the cavity; And And a plurality of lead terminals connected to the LED chip by bonding wires in the cavity, At least one of the plurality of lead terminals is at least partially present on a long sidewall of the cavity,  Wherein at least one of the two electrodes of the LED chip is connected to a lead terminal on the side wall surface by a bonding wire, Wherein the bonding wire and the lead terminals on the sidewall are connected through an abnormal wire bonding process. delete The side view LED package according to claim 1, wherein one of the plurality of LED chips is connected to a lead terminal on the sidewall by a bonding wire. The side view LED package of claim 1, wherein one lead terminal on the side wall surface is connected by two or more LED chips and a bonding wire. The side view LED package of claim 1, wherein the plurality of LED chips comprises red, green, and blue LED chips. The side view LED package according to any one of claims 1 and 3 to 5, wherein the side wall surface is inclined so as to form an obtuse angle with respect to the floor. Providing a package body having an elongated cavity in a transverse direction, wherein a plurality of lead terminals are included in the cavity, and at least one of the plurality of lead terminals is at least partially present on a long sidewall of the cavity; A chip mounting step of arranging and arranging a plurality of LED chips in a lateral direction on the bottom of the cavity; And And a wire bonding step of connecting the plurality of LED chips to the lead terminals using bonding wires, In the wire bonding step, at least one of the plurality of LED chips is connected to a lead terminal on a long sidewall of the cavity by a bonding wire, Wherein the wire bonding step includes an abnormal wire bonding process for connecting the bonding wire to a lead terminal on a sidewall of the cavity. 8. The method of claim 7, And a normal wire bonding process for connecting a bonding wire different from the bonding wire connected to the lead terminal on the sidewall of the cavity to the lead terminal on the bottom of the cavity. 9. The apparatus of claim 8, wherein the sidewall surface is inclined to form an obtuse angle with respect to the floor, The normal wire bonding process is performed in a state where the bottom is horizontal, Wherein the upper normal wire bonding process is performed in a state where the sidewall surface is horizontal.

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