KR101465081B1 - 멤즈 액츄에이터가 적용된 카메라모듈 - Google Patents
멤즈 액츄에이터가 적용된 카메라모듈 Download PDFInfo
- Publication number
- KR101465081B1 KR101465081B1 KR1020080047053A KR20080047053A KR101465081B1 KR 101465081 B1 KR101465081 B1 KR 101465081B1 KR 1020080047053 A KR1020080047053 A KR 1020080047053A KR 20080047053 A KR20080047053 A KR 20080047053A KR 101465081 B1 KR101465081 B1 KR 101465081B1
- Authority
- KR
- South Korea
- Prior art keywords
- pcb
- mems actuator
- camera module
- flexible circuit
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004593 Epoxy Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 6
- YTBRNEUEFCNVHC-UHFFFAOYSA-N 4,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=C(Cl)C=C1 YTBRNEUEFCNVHC-UHFFFAOYSA-N 0.000 description 5
- GBUCDGDROYMOAN-UHFFFAOYSA-N 1,2,5-trichloro-3-phenylbenzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C=CC=CC=2)=C1 GBUCDGDROYMOAN-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (4)
- 카메라하우징;상기 카메라하우징 상부에 배치되는 것으로, MEMS 액츄에이터가 구비되고, 일측에 패드단자가 형성된 렌즈부;상기 카메라하우징 하부에 배치되는 PCB부;상기 패드단자와 상기 PCB부가 전기적으로 연결되도록 하는 연성회로부;를 포함하여 이루어지는 MEMS 액츄에이터가 적용된 카메라모듈.
- 제1항에 있어서, 상기 연성회로부는 용이하게 구부러지는 인쇄회로기판으로 이루어진 것을 특징으로 하는 MEMS 액츄에이터가 적용된 카메라모듈.
- 제1항 또는 제2항에 있어서, 상기 연성회로부는 전도성테잎을 통해 상기 패드단자에 접속되는 것을 특징으로 하는 MEMS 액츄에이터가 적용된 카메라모듈.
- 제3항에 있어서, 상기 연성회로부는 실리콘이나 에폭시에 의해 상기 카메라하우징, 렌즈부, PCB부 중 적어도 어느 하나에 고정되는 것을 특징으로 하는 MEMS 액츄에이터가 적용된 카메라모듈.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080047053A KR101465081B1 (ko) | 2008-05-21 | 2008-05-21 | 멤즈 액츄에이터가 적용된 카메라모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080047053A KR101465081B1 (ko) | 2008-05-21 | 2008-05-21 | 멤즈 액츄에이터가 적용된 카메라모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090120983A KR20090120983A (ko) | 2009-11-25 |
KR101465081B1 true KR101465081B1 (ko) | 2014-11-25 |
Family
ID=41604147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080047053A Active KR101465081B1 (ko) | 2008-05-21 | 2008-05-21 | 멤즈 액츄에이터가 적용된 카메라모듈 |
Country Status (1)
Country | Link |
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KR (1) | KR101465081B1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101631888B1 (ko) * | 2009-11-27 | 2016-06-20 | 디지털옵틱스 코포레이션 | Mems액츄에이터와 인쇄회로기판간의 전기적 연결부 집합체 및 연결부 집합체를 이용한 카메라 모듈 제조방법 |
KR101235240B1 (ko) * | 2010-03-17 | 2013-02-20 | 엘지이노텍 주식회사 | Mems액추에이터 및 이를 포함하는 카메라 모듈 |
WO2011145907A2 (en) * | 2010-05-20 | 2011-11-24 | Lg Innotek Co., Ltd. | Camera module having mems actuator, connecting method for shutter coil of camera module and camera module manufactured by the same method |
KR101280986B1 (ko) * | 2012-05-10 | 2013-07-08 | 엘지이노텍 주식회사 | 카메라 모듈 및 그 제조방법 |
KR101713879B1 (ko) * | 2012-08-10 | 2017-03-09 | 난창 오-필름 옵토일렉트로닉스 테크놀로지 리미티드 | 연성 인쇄 회로 연장부를 구비한 자동 초점 카메라 모듈 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10285475A (ja) * | 1997-04-03 | 1998-10-23 | Hewlett Packard Co <Hp> | 固体撮像装置及びこれを用いたディジタル撮像機器 |
KR20060040003A (ko) * | 2004-11-04 | 2006-05-10 | 삼성전자주식회사 | 카메라 렌즈 어셈블리의 손떨림 보정 장치 |
JP2008048387A (ja) * | 2006-07-20 | 2008-02-28 | Konica Minolta Opto Inc | 撮像ユニットおよび撮像装置 |
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2008
- 2008-05-21 KR KR1020080047053A patent/KR101465081B1/ko active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10285475A (ja) * | 1997-04-03 | 1998-10-23 | Hewlett Packard Co <Hp> | 固体撮像装置及びこれを用いたディジタル撮像機器 |
KR20060040003A (ko) * | 2004-11-04 | 2006-05-10 | 삼성전자주식회사 | 카메라 렌즈 어셈블리의 손떨림 보정 장치 |
JP2008048387A (ja) * | 2006-07-20 | 2008-02-28 | Konica Minolta Opto Inc | 撮像ユニットおよび撮像装置 |
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Publication number | Publication date |
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KR20090120983A (ko) | 2009-11-25 |
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