KR101454985B1 - 제작 기판을 캐리어 기판으로부터 분리하기 위한 장치 및 방법 - Google Patents
제작 기판을 캐리어 기판으로부터 분리하기 위한 장치 및 방법 Download PDFInfo
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- KR101454985B1 KR101454985B1 KR1020127032468A KR20127032468A KR101454985B1 KR 101454985 B1 KR101454985 B1 KR 101454985B1 KR 1020127032468 A KR1020127032468 A KR 1020127032468A KR 20127032468 A KR20127032468 A KR 20127032468A KR 101454985 B1 KR101454985 B1 KR 101454985B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000002904 solvent Substances 0.000 claims abstract description 69
- 239000010410 layer Substances 0.000 claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 238000000926 separation method Methods 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000027455 binding Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 4
- 238000004090 dissolution Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009870 specific binding Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/04—Treatment by energy or chemical effects using liquids, gas or steam
- B32B2310/0409—Treatment by energy or chemical effects using liquids, gas or steam using liquids
- B32B2310/0418—Treatment by energy or chemical effects using liquids, gas or steam using liquids other than water
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1922—Vibrating delaminating means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
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- Laminated Bodies (AREA)
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- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
또한 본 발명은 필름 프레임과 상기 필름 프레임에 연결된 가요성 필름에 의해 형성되며, 결합층을 분리하기 위한 용매를 보유하기 위한 용매 저장소를 형성하고; 뿐만 아니라 제작 기판 및 결합층을 용매 저장소에 고정하고; 그리고 용매를 용매 저장소에 전달하고; 그리고 제작 기판을 캐리어 기판으로부터 박리함으로써, 제작 기판을 캐리어 기판으로부터 박리하는 방법에 관한 것이다.
Description
도 1a는 필름 프레임 상의 제작 기판, 캐리어 기판 및 결합층으로 구성된 기판 결합물의 개략적인 상면도를 나타낸다.
도 1b는 도 1a의 개략적인 측면도를 더욱 상세하게 나타낸다.
도 2는 용매가 전달될 때 도 2에 따르는 개략도를 나타낸다.
도 3은 결합층을 분리하는 방법 단계의 개략도를 나타낸다.
도 4는 본 발명에 청구된 바와 같이 제작 기판을 캐리어 기판으로부터 박리하는 방법 단계의 개략도를 나타낸다.
도 5는 본 발명에 청구된 바와 같이 제작 기판을 캐리어 기판으로부터 박리하는 대안적인 방법 단계의 개략도를 나타낸다.
1 필름 프레임
2 캐리어 기판
3 필름
3a 박리 섹션
3b 부착 섹션
3k 접촉 표면 섹션
3s 접착층
4 제작 기판
4u 주변부
6 결합층
7 캐리어 기판 홀더
8 진공 경로
10, 10' 음향 파 발생기
20 용매 저장소
22 용매
23 전달 수단
24 라인
25 용매 보관소
Fs, Ff1, Ff2 ... Ffn 힘
Fs 힘
Claims (14)
- 제작 기판(4)과 상기 제작 기판(4)에 연결된 캐리어 기판(2) 사이에 위치한 결합층(6)을 분리하기 위한 용매 저장소(20)로서, 상기 용매 저장소는
- 필름 프레임(1); 및
- 상기 필름 프레임(1)에 연결된 가요성 필름(3) - 상기 가요성 필름(3)은 제작 기판(4)을 자신의 접촉 표면 섹션(3k)에 고정시키기 위한 접착층(3s)을 갖고, 상기 가요성 필름(3)은 상기 접촉 표면 섹션(3k)을 둘러싸는 자신의 부착 섹션(3b)에서 상기 필름 프레임(1)에 연결됨 -
을 포함하며,
상기 결합층(6)을 분리하기 위한 용매(22)를 수용하기 위한 상기 용매 저장소(20)는 상기 필름 프레임(1) 및 상기 가요성 필름(3)에 의해, 상기 접촉 표면 섹션(3k)과 상기 부착 섹션(3b) 사이에 위치하는 박리 섹션(3a)에서, 형성되며, 상기 제작 기판(4) 및 상기 결합층(6)은 상기 용매 저장소(20) 내에 수용되고, 상기 용매 저장소(20)의 부피는 상기 박리 섹션(3a)이 인장됨으로써 가변적인 것을 특징으로 하는, 용매 저장소. - 삭제
- 제 1 항에 있어서, 상기 결합층(6)의 분리가 시작된 이후에서, 상기 용매(22)가 제작 기판의 주변부(4u) 영역에만 작용하도록, 상기 용매 저장소(20)가 형성됨을 특징으로 하는, 용매 저장소.
- 제 1 항에 있어서, 상기 가요성 필름(3)은 상기 접촉 표면 섹션(3k)과 상기 부착 섹션(3b) 사이에 위치하는 박리 섹션(3a)에서 캐리어 기판(2)에 작용하는 힘 Fs 및 상기 힘 Fs에 반대 방향으로 상기 필름 프레임(1)에 작용하는 힘 Ff에 의해 인장되는 것을 특징으로 하는, 용매 저장소.
- 제 1 항에 있어서, 상기 용매 저장소(20)는 홈통-모양(trough-shape)으로 형성됨을 특징으로 하는, 용매 저장소.
- 가요성 필름(3)의 접촉 표면 섹션(3k)에 고정되어 있는 제작 기판(4)과 상기 제작 기판(4)에 연결된 캐리어 기판(2) 사이에 위치한 결합층(6)을 분리하기 위한 방법으로서, 상기 방법은
- 상기 가요성 필름(3)의 접촉 표면 섹션(3k) 둘레의 부착 섹션(3b)에 연결된 필름 프레임(1) 및 상기 가요성 필름(3)에 의해 상기 접촉 표면 섹션(3k)과 부착 섹션(3b) 사이에 위치하는 박리 섹션(3a)에서 형성되며 상기 결합층(6)을 분리하기 위한 용매(22)를 보유하기 위한 용매 저장소(20)를 형성하는 단계;
- 캐리어 기판(2)에 작용하는 힘 Fs 및 상기 힘 Fs에 반대 방향으로 상기 필름 프레임(1)에 작용하는 힘 Ff에 의해 필름(3)의 박리 섹션(3a)을 인장함으로써, 상기 용매 저장소(20)의 부피를 가변시키는 단계;
- 상기 용매 저장소(20)에 상기 제작 기판(4)과 상기 결합층(6)을 보유시키는 단계; 및
- 상기 용매(22)를 상기 용매 저장소(20)에 전달하고 상기 결합층(6)을 분리하는 단계
를 포함하는, 결합층을 분리하기 위한 방법. - 제 6 항에 있어서, 상기 용매(22)의 전달 및 상기 결합층(6)의 부분적인 또는 완전한 분리 이후, 상기 캐리어 기판(2)으로부터 상기 제작 기판(4)을 박리하는 단계가 수행됨을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 6 항 또는 제 7 항에 있어서, 상기 용매(22)는, 상기 결합층(6)의 분리가 시작된 이후에서, 상기 제작 기판(4)의 주변부(4u) 영역에만 작용함을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 7 항에 있어서, 상기 제작 기판(4)의 박리는 상기 캐리어 기판(2)에 작용하는 힘 Fs 및 상기 필름 프레임(1)에서 작용하고 상기 힘 Fs에 반대 방향인 힘 Ff에 의해 유발됨을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 7 항에 있어서, 상기 제작 기판(4)의 박리는 상기 제작 기판(4)의 주변부(4u)로부터 상기 제작 기판(4)의 중심(4z) 쪽으로 발생함을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 6 항 또는 제 7 항에 있어서, 상기 제작 기판(4)은 서로 다른 접착제를 함유하는 결합층에 의해 상기 캐리어 기판(2)에 결합됨을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 6 항 또는 제 7 항에 있어서, 상기 용매(22)는 상기 결합층(6)의 부분적인 또는 전체적인 분리를 위하여, 상기 결합층(6)을 선택적으로 용해시키는 유체 수단을 포함함을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 6 항 또는 제 7 항에 있어서, 결합층의 지정된 영역에서 용해가 이뤄짐을 특징으로 하는, 결합층을 분리하기 위한 방법.
- 제 6 항 또는 제 7 항에 있어서, 상기 제작 기판(4)은 서로 다른 접착제를 포함하는 둘 이상의 결합층에 의해 캐리어 기판(2)에 결합되고, 상기 둘 이상의 결합층은 선택적으로 용해됨을 특징으로 하는, 결합층을 분리하기 위한 방법.
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