KR101327509B1 - Apparatus of manufacturing integrated circuit device - Google Patents

Abstract

An integrated circuit device manufacturing device includes a chuck with one surface gripping a substrate by using power generated by a power supply; a storage battery which is formed on a part of the chuck and which causes no interference to substrate gripping and transferring tasks; a conveyor which including a charge input terminal connected to the storage battery to charge the storage battery; an electricity supply unit supplies electricity to the storage battery; and a charge unit including a charge output terminal which is connected to the electricity supply unit and formed on a transferring route of the conveyor capable of facing the charge input terminal.

Description

Apparatus of manufacturing integrated circuit device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device manufacturing apparatus, and more particularly, to an integrated circuit device manufacturing apparatus having a chuck for holding a substrate by using a force formed by supplying electricity.

In general, in the manufacture of integrated circuit devices such as flat panel display devices and the like, a manufacturing apparatus including a chuck as a conveying body for holding a substrate by using a force formed by supplying electricity is used. In particular, in the manufacture of a flat panel display device such as an organic thin film display device, a chuck which is provided to hold the other surface of the substrate opposite to the surface of the substrate mentioned below with one surface for forming a pattern is used as a carrier.

An example of the conveying member having the chuck mentioned is disclosed in the patent application 2012-0046143 filed by the present applicant and filed with the Korean Intellectual Property Office. In addition, in performing a unit process such as pattern formation using the aforementioned conveying member, the conveying may be performed while the substrate is held. That is, the transfer of the transfer body itself may be performed along the transfer path for performing the unit process while holding the substrate.

Here, the conveying body mentioned above should be continuously supplied with electricity to the conveying body because the substrate is held by using a force formed mainly by supplying electricity. Thus, the conveying body has a structure that is electrically connected to an external electric supply source using a cable or the like for the supply of the mentioned electricity. However, as mentioned, there is a problem that the cable interferes with the transfer of the carrier when a carrier is used to hold the substrate by using the force formed by supplying electricity.

Thus, conventionally, a conveying body using an adhesive force or a magnetic force is used instead of the conveying body using a force formed by supplying electricity. However, the conveying body using the above mentioned adhesive force or magnetic force may be unstable to transfer the substrate with sufficient grip, and as a result, a situation in which the substrate held by the adhesive force or magnetic force falls and breaks frequently occurs. have.

SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated circuit device manufacturing apparatus which is free from constraints due to transfer even when using a transfer member that grips a substrate using a force formed by supplying electricity.

An integrated circuit device manufacturing apparatus according to an embodiment of the present invention for achieving the above-mentioned object has a chuck having one surface for holding a substrate using a force formed by supplying electricity, the power to supply electricity to the chuck A transfer body including a storage battery provided in a portion of the chuck that does not interfere with the holding and transferring of a substrate, and a charging input terminal connected to the storage battery to charge the storage battery; And a charging unit including an electricity supply unit for supplying electricity to the storage battery, and a charging output terminal connected to the electricity supply unit and provided in a transport path of the carrier body facing the charging input terminal.

In the apparatus for manufacturing an integrated circuit device according to an embodiment of the present invention mentioned above, the chuck may hold the substrate such that a process target surface of the substrate faces downward.

In the apparatus for manufacturing an integrated circuit device according to an embodiment of the present invention, the chuck may include a chuck holding the substrate by electrostatic force or a chuck holding the substrate by electromagnetic force.

In the apparatus for manufacturing an integrated circuit device according to an embodiment of the present invention, the storage battery may be provided with a structure embedded in the chuck or may be provided with a structure disposed on the other surface of the chuck opposite to one surface of the chuck.

In the integrated circuit device manufacturing apparatus according to an embodiment of the present invention mentioned above, the conveying path of the conveying body may be an infinite loop path that is continuously repeated or a confining path defined from one point to another point.

In the integrated circuit device manufacturing apparatus according to an embodiment of the present invention mentioned above, each of the charging input terminal and the charging output terminal is provided to have a contact type terminal structure or a rail terminal structure, the charging input terminal and the charging output Charging can be effected by non-contacting or contacting each other in a sliding manner as the terminals cross a transport path that can face each other.

An integrated circuit device manufacturing apparatus according to another embodiment of the present invention for achieving the above-mentioned object has a chuck having one surface for holding the substrate by electrostatic force, the interference of the holding and transfer of the substrate to supply electricity to the chuck A conveying body including a storage battery provided in a portion of the chuck which is not fitted, and a charging input terminal connected to the storage battery to charge the storage battery, and the conveying body is transported along a continuously repeated infinite conveying path; And a charging unit including an electricity supply unit for supplying electricity to the storage battery, and a charge output terminal connected to the electricity supply unit and provided in an infinite transfer path of the carrier body facing the charging input terminal. .

In the integrated circuit device fabrication apparatus according to another embodiment of the present invention mentioned above, the chuck may hold the substrate such that the process target surface of the substrate faces downward.

In the apparatus for manufacturing an integrated circuit device according to an embodiment of the present invention, the storage battery may be provided with a structure embedded in the chuck or may be provided with a structure disposed on the other surface of the chuck opposite to one surface of the chuck.

In the integrated circuit device manufacturing apparatus according to an embodiment of the present invention mentioned above, each of the charging input terminal and the charging output terminal is provided to have a contact type terminal structure or a rail terminal structure, the charging input terminal and the charging output Charging can be effected by non-contacting or contacting each other in a sliding manner as the terminals pass through an infinite conveyance path that can face each other.

As mentioned, the integrated circuit device fabrication apparatus of the present invention is a charging input terminal because the charging input terminal of the conveying body can be passed through a charging output terminal connected to a charger provided outside when the conveying body is conveyed along the conveying path. It is possible to stably charge the storage battery of the carrier connected to the chuck, so that the chuck may be supplied with electricity for generation of a force that can stably hold the substrate from the storage battery.

Therefore, in the case of using the integrated circuit device manufacturing apparatus of the present invention, even when using a chuck held by the substrate by using the force formed by supplying electricity, it does not interfere with the transfer of the substrate.

Therefore, the integrated circuit device manufacturing apparatus of the present invention can not only stably hold the substrate even by using the force formed by supplying electricity, but also stably transfer the conveying body in the state of holding the substrate without any restriction on transfer. Can be. In particular, the integrated circuit device manufacturing apparatus of the present invention can be expected to improve productivity since the ease of transfer of the substrate can be secured.

1 is a schematic diagram illustrating an integrated circuit device manufacturing apparatus according to an exemplary embodiment of the present invention.
FIG. 2 is a schematic configuration diagram showing the conveying member provided in FIG. 1. FIG.
3 is a view for explaining a situation that the charging input terminal of the conveying body provided in FIG. 1 passes the charging output terminal of the charging unit.
4 is a view for explaining a transfer path and a charging section of the integrated circuit device manufacturing apparatus of FIG. 1.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar components. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example

1 is a schematic diagram showing an integrated circuit device manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, an integrated circuit device manufacturing apparatus of the present invention is mainly provided in a manufacturing line of a flat panel display device, and particularly, may be used to hold and transport the substrate 11 when depositing an organic thin film. In the integrated circuit device manufacturing apparatus of the present invention, the transfer member 13 has the other surface of the substrate 11 opposite to one surface of the substrate 11 so that one surface of the substrate 11 for pattern formation of the organic thin film faces downward. It has a gripping structure. This is because, although not illustrated, a deposition source for supplying a deposition material to the substrate 11 during deposition of the organic thin film is disposed in a lower direction below the substrate 11. Here, the deposition source mentioned may be to supply the vaporized material by vaporization by the heat source.

The integrated circuit device manufacturing apparatus mentioned above may include a transfer body 13, a charging unit 21, and the like. The carrier 13 may include a chuck 15, a storage battery 17, a charge input terminal 19, and the like, and the charge unit 21 may include an electricity supply unit 23, a charge output terminal 25, and the like. can do.

FIG. 2 is a schematic configuration diagram illustrating a conveying body provided in FIG. 1, and FIG. 3 is a view for explaining a situation in which a charging input terminal of the conveying body provided in FIG. 1 passes a charging output terminal of the charging unit.

2 and 3, the chuck 15 in the conveying body 13 has one surface that grips the substrate 11 using a force formed by supplying electricity. That is, the chuck 15 is provided to hold the other surface of the substrate 11, which is the surface opposite to the surface of the substrate 11, so that one surface of the substrate 11 for pattern formation faces downward. Thus, the chuck 15 may be gripped by interviewing the other surface of the substrate 11 on one surface of the chuck 15 by using a force formed by supplying electricity. Examples of the chuck 15 mentioned above include a chuck holding the substrate 11 by an electrostatic force, a chuck holding the substrate 11 by an electromagnetic force, and the like.

The storage battery 17 is provided to supply electricity to the chuck 15 for generating a force for holding the substrate 11. That is, the storage battery 17 supplies electricity to the chuck 15 to generate a force that the chuck 15 can hold the substrate 11 as electricity is supplied from the storage battery 17 to the chuck 15. can do. In particular, the battery 17 mentioned may be provided in a part of the chuck 15 which does not interfere with the gripping and conveying of the substrate 11. Accordingly, the storage battery 17 may be provided on the other surface of the chuck 15, which is mainly opposite to the one surface of the chuck 15, or may be provided to be embedded in the chuck 15. As such, the integrated circuit device manufacturing apparatus of the present invention can stably supply electricity to the chuck 15 by including the storage battery 17 mentioned above.

The charging input terminal 19 is connected with the storage battery 17 to charge the storage battery 17. As described above, the charging input terminal 19 may be provided at a portion of the conveying body 13 so as not to affect the grasping and conveying interference of the conveying body 13. Thus, in the present invention, the aforementioned charging input terminal 19 may be provided to be mainly disposed at the side portion of the chuck 15. That is, the aforementioned charging input terminal 19 may be provided to be connected to the storage battery 17 and disposed at the side portion of the chuck 15. As such, the provision of the charging input terminal 19 to be arranged at the side portion of the chuck 15 may refer to the conveying path of the conveying body 13 as compared with the provision of the charging input terminal 19 to be arranged at another portion. This is because the charging output terminal 25 to be described later can be more easily encountered in the transfer path.

As mentioned, the transfer body 13 according to the present invention includes the chuck 15, the storage battery 17, the charging input terminal 19, etc., so that the substrate 11 is more easily supplied with electricity from the outside. Can be gripped with.

In the charging unit 21, the electric supply unit 23 is provided to supply electricity to the storage battery 17. Here, the transfer body 13 referred to when referring to the process chamber may be provided to be disposed inside the process chamber, and the electricity supply unit 23 may be provided to be disposed outside the process chamber. And the process chamber mentioned can be understood as a transfer chamber. As such, the provision of the aforementioned electrical supply unit 23 outside the process chamber is intended not to affect the gripping and transfer of the substrate 11 using the transfer body 13 such as interference.

In addition, the charge output terminal 25 of the charging unit 21 may be provided in the transfer path of the transfer body 13 which is connected to the electricity supply unit 23 and may face the charge input terminal 19. That is, the charging output terminal 25 may be provided to be disposed in the conveying path through which the conveying body 13 passes. Thus, as mentioned, when the conveying body 13 passes along the charging output terminal 25 while conveying along the conveying path, the charging input terminal 19 of the conveying body 13 and the charging output terminal 25 of the charging unit 21. ) May be supplied with electricity to the storage battery 17 from the electricity supply 23.

Here, the above-mentioned charging input terminal 19 may be provided to have a contact type terminal structure or may be provided to have a rail type terminal structure. In addition, the charging output terminal 25 mentioned above may be provided to have a contact type terminal structure or may have a rail type terminal structure. Thus, charging may be performed by non-contacting or contacting in a sliding manner when the charging input terminal 19 and the charging output terminal 21 pass through a transfer path that may face each other.

As described above, in the integrated circuit device manufacturing apparatus of the present invention, when the transfer body 13 transfers along the transfer path mentioned above, the charge input terminal 19 of the transfer body 13 has the charge output terminal 25 of the charge unit 21. ) Is supplied to the storage battery 17 through the electrical supply unit 23 by passing the non-contact or contact in a sliding manner, so that the chuck 15 uses a substrate (using electricity supplied from the battery 17 mentioned above). 11) can form a force to hold.

4 is a view for explaining a transfer path and a charging section of the integrated circuit device manufacturing apparatus of FIG. 1.

Referring to FIG. 4, the filling section in the present invention may be arranged not limited to the entire transport path but limited to any specific part. Therefore, the charging unit 21 mentioned above may be provided in the charging section, and in particular, the charging output terminal 25 may be provided to be disposed only in the charging section. In this way, the charging section can be arranged so as to be limited to a specific part of the entire transport path because the storage battery 17 is provided. That is, even if charging is performed only in the charging section mentioned above, the battery 17 may continue to supply electricity to the chuck 15 for a predetermined time.

Therefore, the integrated circuit manufacturing apparatus of the present invention can limit a specific section of the transfer path to the charging section, thereby minimizing effects such as interference due to gripping and transferring of the substrate 11 using the transfer member 13. .

In addition, the conveying path of the conveying body 13 may be an infinite loop path in which the conveying of the conveying body 13 is continuously repeated, and may be a confined path defined from one point to another point. Here, when the conveying path mentioned above is an infinite loop path, filling can be achieved when passing the filling section while continuously conveying the conveying body 13, and when the conveying path is a confined path, the conveying body 13 is After filling is achieved near one point, it may be transferred from one point to another.

As described above, the integrated circuit device manufacturing apparatus of the present invention can stably charge the storage battery 17, and uses electricity to form a force that can hold the substrate 11 stably from the storage battery. Can be supplied. Therefore, when the integrated circuit device manufacturing apparatus of the present invention is used, the transfer of the substrate 11 is not disturbed even when the substrate 11 is held. That is, the integrated circuit device manufacturing apparatus of the present invention can omit a cable for supplying electricity to the chuck 15, so that the transfer member 13 can be stably transferred in a state of holding the substrate without any restriction on the transfer. It can be.

As mentioned, in the case of using the integrated circuit device manufacturing apparatus of the present invention, since the substrate is not disturbed even when the substrate is held, the substrate can be stably gripped and the transfer member can be stably transferred. Thus, the integrated circuit device manufacturing apparatus of the present invention can secure the ease of the transfer of the substrate can also ensure the price competitiveness of the product through the improvement of productivity.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

11 substrate 13 carrier
15 chuck 17 storage battery
19: charging input terminal 21: charging unit
23: electricity supply 25: charge output terminal

Claims (10)

A chuck having one surface that grips the substrate using a force formed by supplying electricity, a storage battery provided in a portion of the chuck that does not interfere with the holding and conveying of the substrate to supply electricity to the chuck, and the A transfer body including a charging input terminal connected to the storage battery to charge the storage battery; And
And a charging unit including an electricity supply unit for supplying electricity to the storage battery, and a charge output terminal connected to the electricity supply unit and provided in a transfer path of the transfer body facing the charging input terminal. Integrated circuit device manufacturing apparatus. The apparatus of claim 1, wherein the chuck grips the substrate such that a process target surface of the substrate faces downward. The apparatus of claim 2, wherein the chuck comprises a chuck holding the substrate by an electrostatic force or a chuck holding the substrate by an electromagnetic force. The apparatus of claim 1, wherein the storage battery has a structure embedded in the chuck or a structure disposed on the other surface of the chuck opposite to one surface of the chuck. The integrated circuit device manufacturing apparatus according to claim 1, wherein the conveying path of the conveying body is an infinite loop path which is continuously repeated or a confining path defined from one point to another point. The charging input terminal and the charging output terminal each have a contact type terminal structure or a rail type terminal structure, and each of the charging input terminal and the charging output terminal passes through a transfer path that can face each other. When the non-contact or contact with each other in the sliding manner when the integrated circuit device manufacturing apparatus characterized in that the charge. A chuck having one surface that grips the substrate by an electrostatic force, a storage battery provided in a portion of the chuck that does not interfere with the holding and conveying of the substrate to supply electricity to the chuck, and a connection with the storage battery to charge the storage battery A conveying body including a charging input terminal configured to be conveyed along an endless conveying path continuously repeated; And
And a charging unit including an electricity supply unit for supplying electricity to the storage battery, and a charge output terminal connected to the electricity supply unit and provided in an infinite transfer path of the carrier body facing the charging input terminal. Integrated circuit device manufacturing apparatus. 8. The apparatus of claim 7, wherein the chuck grips the substrate such that the process target surface of the substrate faces downward. The apparatus of claim 7, wherein the storage battery has a structure embedded in the chuck or a structure disposed on the other surface of the chuck opposite to one surface of the chuck. The terminal of claim 7, wherein each of the charging input terminal and the charging output terminal has a contact type terminal structure or a rail type terminal structure, and each of the charging input terminal and the charging output terminal has an infinite transfer path that may face each other. An apparatus for manufacturing an integrated circuit device, characterized in that charging is performed by non-contacting or contacting each other when sliding.

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