KR101178632B1 - 규소함유 경화성 조성물, 및 이를 열경화시킨 경화물 - Google Patents
규소함유 경화성 조성물, 및 이를 열경화시킨 경화물 Download PDFInfo
- Publication number
- KR101178632B1 KR101178632B1 KR1020067018727A KR20067018727A KR101178632B1 KR 101178632 B1 KR101178632 B1 KR 101178632B1 KR 1020067018727 A KR1020067018727 A KR 1020067018727A KR 20067018727 A KR20067018727 A KR 20067018727A KR 101178632 B1 KR101178632 B1 KR 101178632B1
- Authority
- KR
- South Korea
- Prior art keywords
- silicon
- group
- containing polymer
- component
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Compounds (AREA)
Abstract
Description
이하, 실시예에 의해 본 발명을 더 설명하지만, 본 발명은 이들 실시예에 의해 한정되는 것은 아니다. 한편, 실시예 중의 '부'나 '%'는 중량기준에 의한 것이다.
전개 용매: 테트라히드로푸란
Claims (4)
- 하기의 (A)성분, (B)성분 및 (C)성분 중의 적어도 하나의 규소함유 중합체를 함유(단 (C)성분을 함유하지 않는 경우는 (A)성분 및 (B)성분 양쪽을 함유)하고, 또한 하기 (D)성분의 촉매를 함유하여 제조하는 규소함유 경화성 조성물의 제조방법.(A): Si-R1[식 중, R1은 알킬렌기 및/또는 아릴렌기를 포함하여도 좋은 탄소수 2~20의 알케닐기이다]로 이루어지는 군에서 선택되는 반응기(A')를 한 종 또는 두 종 이상 가지며, Si-O-Si결합에 의한 가교구조를 한 군데 이상 가지는, 중량 평균분자량 1000 이하의 성분이 20중량% 이하인 규소함유 중합체로서,반응기(A')를 가지는 알콕시실란 및/또는 클로로실란과 반응기(A')를 가지지 않는 알콕시실란 및/또는 클로로실란을 사용하여, 이들을 반응시켜 규소함유 중합체 전구체를 얻어, 얻어진 규소함유 중합체 전구체끼리를 반응시켜 얻어진 규소함유 중합체이고, 상기 규소함유중합체 전구체의 적어도 하나가 선형상 폴리실록산인 규소함유 중합체;(B): Si-H기를 가지며, Si-O-Si결합에 의한 가교구조를 한 군데 이상 가지는, 중량 평균분자량 1000 이하의 성분이 20중량% 이하인 규소함유 중합체로서,Si-H기를 가지는 알콕시실란 및/또는 클로로실란과 Si-H기를 가지지 않는 알콕시실란 및/또는 클로로실란을 사용하여, 이들을 반응시켜 규소함유 중합체 전구체를 얻어, 얻어진 규소함유 중합체 전구체끼리를 반응시켜 얻어지는 규소함유 중합체이고, 상기 규소함유 중합체 전구체의 적어도 하나가 선형상 폴리실록산인 규소함유 중합체;(C): Si-R1[식 중, R1는 알킬렌기 및/또는 아릴렌기를 포함하여도 좋은 탄소수 2~20의 알케닐기이다]로 이루어지는 군에서 선택되는 반응기(A')를 한 종 또는 두 종 이상 가지며, 나아가 Si-H기를 가지고, Si-O-Si결합에 의한 가교구조를 한 군데 이상 가지는, 중량 평균분자량 1000 이하의 성분이 20중량% 이하인 규소함유 중합체로서,반응기(A') 및 Si-H기를 갖는 알콕시실란 및/또는 클로로실란과 반응기(A') 및 Si-H기를 가지지 않는 알콕시실란 및/또는 클로로실란을 사용하여, 이들을 반응시켜 규소함유 중합체 전구체를 얻어, 얻어진 규소함유 중합체 전구체끼리를 반응시켜 얻어진 규소함유 중합체이고, 상기 규소함유 중합체 전구체의 적어도 하나가 선형상 폴리실록산인 규소함유 중합체;(D): 백금계 촉매인 경화반응촉매
- 제1항에 있어서, 상기 규소함유 경화성 조성물이 함유하는 (A)성분, (B)성분 및 (C)성분을 합한 규소함유 중합체는, 아릴기 및 아릴렌기의 합계 함유량이 0.1~50중량%인 것을 특징으로 하는 규소함유 경화성 조성물의 제조방법.
- 제1항 또는 제2항에 있어서, 또한 (E)성분으로서 금속산화물 미분말을 함유하는 것을 특징으로 하는 규소함유 경화성 조성물의 제조방법.
- 제1항 또는 제2항에 기재된 제조방법에 의해 제조된 규소함유 경화성 조성물을 열경화시키는 것을 특징으로 하는 경화물의 제조방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-00142607 | 2004-05-12 | ||
JP2004142607A JP5132027B2 (ja) | 2004-05-12 | 2004-05-12 | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
PCT/JP2005/008490 WO2005108496A1 (ja) | 2004-05-12 | 2005-05-10 | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070007313A KR20070007313A (ko) | 2007-01-15 |
KR101178632B1 true KR101178632B1 (ko) | 2012-08-30 |
Family
ID=35320212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067018727A Expired - Fee Related KR101178632B1 (ko) | 2004-05-12 | 2005-05-10 | 규소함유 경화성 조성물, 및 이를 열경화시킨 경화물 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7939614B2 (ko) |
EP (1) | EP1746132B1 (ko) |
JP (1) | JP5132027B2 (ko) |
KR (1) | KR101178632B1 (ko) |
CN (1) | CN1930245B (ko) |
TW (1) | TW200613450A (ko) |
WO (1) | WO2005108496A1 (ko) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006206721A (ja) * | 2005-01-27 | 2006-08-10 | Kansai Electric Power Co Inc:The | 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置 |
JP2007277072A (ja) * | 2006-03-16 | 2007-10-25 | Jsr Corp | 酸化物微粒子分散体およびその製造方法 |
JP2007277505A (ja) * | 2006-03-16 | 2007-10-25 | Jsr Corp | 酸化物微粒子分散体およびその製造方法 |
WO2007108281A1 (ja) * | 2006-03-16 | 2007-09-27 | Jsr Corporation | 酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
JP2007291324A (ja) * | 2006-03-31 | 2007-11-08 | Jsr Corp | 酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
JP2007277073A (ja) * | 2006-03-16 | 2007-10-25 | Jsr Corp | 酸化物微粒子分散体およびその製造方法 |
JP2007270055A (ja) * | 2006-03-31 | 2007-10-18 | Jsr Corp | 多官能ポリシロキサンおよび金属酸化物微粒子含有ポリシロキサン組成物、ならびにそれらの製造方法 |
JP2007270056A (ja) * | 2006-03-31 | 2007-10-18 | Jsr Corp | 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
RU2401846C2 (ru) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе |
JP5073738B2 (ja) * | 2007-03-26 | 2012-11-14 | 新日鐵化学株式会社 | レンズ |
US8026035B2 (en) * | 2007-03-30 | 2011-09-27 | Cheil Industries, Inc. | Etch-resistant disilane and saturated hydrocarbon bridged silicon-containing polymers, method of making the same, and method of using the same |
JP5248034B2 (ja) * | 2007-04-23 | 2013-07-31 | 株式会社Adeka | ケイ素含有化合物、硬化性組成物及び硬化物 |
JP5248033B2 (ja) | 2007-04-23 | 2013-07-31 | 株式会社Adeka | ケイ素含有化合物、硬化性組成物及び硬化物 |
JP2009091547A (ja) * | 2007-09-21 | 2009-04-30 | Shin Etsu Chem Co Ltd | 付加硬化型シリコーンゴム組成物及びその硬化物並びに架橋剤 |
JP5393373B2 (ja) * | 2009-09-16 | 2014-01-22 | 関西電力株式会社 | 半導体装置 |
EP2599836B1 (en) * | 2010-07-27 | 2015-03-25 | Adeka Corporation | Curable composition for semiconductor encapsulation |
JP2012097225A (ja) * | 2010-11-04 | 2012-05-24 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
CN103517884B (zh) * | 2011-05-10 | 2016-08-17 | 住友电气工业株式会社 | 光纤 |
JP6011230B2 (ja) | 2011-10-25 | 2016-10-19 | セントラル硝子株式会社 | シロキサン系組成物およびその硬化物ならびにその用途 |
JP6213257B2 (ja) | 2013-01-25 | 2017-10-18 | セントラル硝子株式会社 | シリコーンを含む硬化性組成物およびその硬化物 |
JP2016169358A (ja) * | 2014-07-24 | 2016-09-23 | セントラル硝子株式会社 | 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置 |
WO2016013421A1 (ja) * | 2014-07-24 | 2016-01-28 | セントラル硝子株式会社 | 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置 |
TWI738743B (zh) | 2016-03-23 | 2021-09-11 | 美商道康寧公司 | 金屬-聚有機矽氧烷 |
US10836906B2 (en) | 2016-12-19 | 2020-11-17 | Saint-Gobain Performance Plastics Corporation | Silicone-based composition and article made therefrom |
CN111542550B (zh) * | 2017-12-28 | 2022-07-19 | 国立研究开发法人产业技术综合研究所 | 聚合物刷形成用基体和该基体的制造方法以及该方法中使用的前体液 |
CN110330653B (zh) * | 2019-07-05 | 2020-10-23 | 北京化工大学 | 一种耐高温高折射率的主链含亚苯基的钛杂化硅树脂、其制备方法及应用 |
TW202428780A (zh) * | 2022-12-05 | 2024-07-16 | 美商陶氏有機矽公司 | Uv可固化聚矽氧組成物 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002173661A (ja) | 2000-09-13 | 2002-06-21 | Nippon Sheet Glass Co Ltd | 接着剤組成物およびそれを用いた光学装置 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3284406A (en) | 1963-12-18 | 1966-11-08 | Dow Corning | Organosiloxane encapsulating resins |
US4310678A (en) * | 1980-12-02 | 1982-01-12 | Dow Corning Corporation | Liquid copolymeric organopolysiloxanes comprising SiO2 and method therefor |
US5217811A (en) * | 1989-05-18 | 1993-06-08 | At&T Bell Laboratories | Devices featuring silicone elastomers |
US5215801A (en) * | 1990-08-22 | 1993-06-01 | At&T Bell Laboratories | Silicone resin electronic device encapsulant |
JP3134333B2 (ja) * | 1991-03-27 | 2001-02-13 | ジェイエスアール株式会社 | 導電性エラストマー用組成物 |
JP2623380B2 (ja) * | 1991-06-03 | 1997-06-25 | 信越化学工業株式会社 | 熱伝導性に優れたシリコーン組成物 |
JP3615784B2 (ja) * | 1994-04-21 | 2005-02-02 | ダウ コーニング アジア株式会社 | 光学素子用樹脂組成物及び光学素子 |
JPH07306301A (ja) * | 1994-05-13 | 1995-11-21 | Dow Corning Kk | 光学素子及びその製造方法 |
US5536803A (en) * | 1994-06-06 | 1996-07-16 | Shin-Etsu Chemical Co., Ltd. | Adhesive silicone compositions |
US5623030A (en) * | 1994-12-01 | 1997-04-22 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Curable composition and process for producing molded articles using the same |
US6307081B1 (en) * | 1997-11-24 | 2001-10-23 | Dow Corning Silicone Company, Ltd. | Hyperbranched polymers and methods for the preparation, cure, and stabilization thereof |
JP2000231001A (ja) * | 1999-02-10 | 2000-08-22 | Konica Corp | 光学用レンズ |
JP2000231002A (ja) * | 1999-02-10 | 2000-08-22 | Konica Corp | 光学用レンズ |
DE19957276A1 (de) * | 1999-11-29 | 2001-10-11 | Abb Research Ltd | Additionsvernetzende Siliconkautschukmischungen |
WO2002014451A1 (fr) | 2000-08-17 | 2002-02-21 | Nippon Sheet Glass Co., Ltd. | Composition adhesive et dispositif optique l'utilisant |
JP3718123B2 (ja) * | 2000-12-18 | 2005-11-16 | 信越化学工業株式会社 | 型取り用オルガノポリシロキサン組成物 |
JP4009067B2 (ja) | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
JP3757264B2 (ja) * | 2001-03-27 | 2006-03-22 | 独立行政法人産業技術総合研究所 | シルセスキオキサン系ポリマー成形体及びその製造方法 |
JP2002348473A (ja) * | 2001-05-23 | 2002-12-04 | Asahi Denka Kogyo Kk | 硬化性組成物 |
JP5225528B2 (ja) * | 2001-05-30 | 2013-07-03 | 株式会社Adeka | ケイ素含有重合体の製造方法 |
JP3865639B2 (ja) * | 2002-01-28 | 2007-01-10 | 信越化学工業株式会社 | 半導体封止用シリコーン組成物および半導体装置 |
CA2475468C (en) * | 2002-02-08 | 2011-11-01 | Ophtec B.V. | High refractive index flexible silicone |
WO2003080753A1 (en) * | 2002-03-22 | 2003-10-02 | Dow Corning Corporation | Silicone resins and their preparation |
US6907176B2 (en) * | 2002-06-24 | 2005-06-14 | Dow Corning Corporation | Planar optical waveguide assembly and method of preparing same |
JP4663969B2 (ja) * | 2002-07-09 | 2011-04-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
JP3919001B2 (ja) * | 2002-08-08 | 2007-05-23 | 信越化学工業株式会社 | 付加反応硬化型オルガノポリシロキサン組成物 |
JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
US7241823B2 (en) * | 2002-12-11 | 2007-07-10 | Shin-Etsu Chemical Co., Ltd. | Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device |
JP3912525B2 (ja) * | 2002-12-12 | 2007-05-09 | 信越化学工業株式会社 | 付加硬化型シリコーンゴム組成物及び粘着ゴムシート |
US7160972B2 (en) * | 2003-02-19 | 2007-01-09 | Nusil Technology Llc | Optically clear high temperature resistant silicone polymers of high refractive index |
JP2004359756A (ja) * | 2003-06-03 | 2004-12-24 | Wacker Asahikasei Silicone Co Ltd | Led用封止剤組成物 |
TWI373150B (en) * | 2003-07-09 | 2012-09-21 | Shinetsu Chemical Co | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
JP2005272697A (ja) * | 2004-03-25 | 2005-10-06 | Shin Etsu Chem Co Ltd | 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置 |
JP4494077B2 (ja) * | 2004-04-22 | 2010-06-30 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 光学材料封止用硬化性組成物 |
-
2004
- 2004-05-12 JP JP2004142607A patent/JP5132027B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-10 EP EP05739080.9A patent/EP1746132B1/en not_active Expired - Lifetime
- 2005-05-10 CN CN2005800079614A patent/CN1930245B/zh not_active Expired - Fee Related
- 2005-05-10 US US10/594,221 patent/US7939614B2/en not_active Expired - Fee Related
- 2005-05-10 WO PCT/JP2005/008490 patent/WO2005108496A1/ja not_active Application Discontinuation
- 2005-05-10 KR KR1020067018727A patent/KR101178632B1/ko not_active Expired - Fee Related
- 2005-05-12 TW TW094115459A patent/TW200613450A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002173661A (ja) | 2000-09-13 | 2002-06-21 | Nippon Sheet Glass Co Ltd | 接着剤組成物およびそれを用いた光学装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1930245B (zh) | 2010-05-05 |
EP1746132B1 (en) | 2013-07-10 |
EP1746132A4 (en) | 2009-12-16 |
EP1746132A1 (en) | 2007-01-24 |
JP2005325174A (ja) | 2005-11-24 |
US20070197755A1 (en) | 2007-08-23 |
WO2005108496A1 (ja) | 2005-11-17 |
JP5132027B2 (ja) | 2013-01-30 |
CN1930245A (zh) | 2007-03-14 |
TW200613450A (en) | 2006-05-01 |
KR20070007313A (ko) | 2007-01-15 |
US7939614B2 (en) | 2011-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101178632B1 (ko) | 규소함유 경화성 조성물, 및 이를 열경화시킨 경화물 | |
EP2141188B1 (en) | Silicon-containing compound, curable composition and cured product | |
KR101223545B1 (ko) | 규소함유 경화성 조성물 및 그 경화물 | |
JP6565818B2 (ja) | ヒドロシリル基含有オルガノポリシロキサン及びその製造方法並びに付加硬化型シリコーン組成物 | |
JP2013170270A (ja) | 分岐状ポリシロキサンおよびこれらの使用 | |
KR20130073894A (ko) | 신규 유기 규소 화합물, 상기 유기 규소 화합물을 포함하는 열경화성 수지 조성물, 경화 수지 및 광 반도체용 봉지 재료 | |
JP5248032B2 (ja) | ケイ素含有化合物、硬化性組成物及び硬化物 | |
JP2006283012A (ja) | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 | |
JP6313722B2 (ja) | 付加硬化型シリコーン組成物および半導体装置 | |
JP3858976B2 (ja) | 非汚染性シリコーンゴム組成物 | |
JP4822001B2 (ja) | エポキシ・シリコーン混成樹脂組成物及びその硬化物 | |
WO2015178475A1 (ja) | 分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置 | |
KR20230108289A (ko) | 2-파트 축합 경화성 실리콘 조성물 및 이의 적용 | |
JP4553562B2 (ja) | 接着性ポリオルガノシロキサン組成物 | |
JP6402690B2 (ja) | オルガノポリシルメチレンシロキサン組成物 | |
TWI745348B (zh) | 含有矽之硬化性組合物及其硬化物 | |
JP6393659B2 (ja) | 付加硬化型シリコーン組成物および半導体装置 | |
JP4781810B2 (ja) | 室温硬化性ポリオルガノシロキサン組成物 | |
JP5819089B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
JP2012162665A (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を硬化させてなる硬化物 | |
COSY | Aggregation. See 18-Nonadecyltrichlorosilane (NTS) monolayer Ahmad-Rolfes-Stepto (ARS) theory of gelation. See Gelation studies | |
JP2018145369A (ja) | 熱硬化性オルガノポリシロキサン組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
A201 | Request for examination | ||
AMND | Amendment | ||
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
AMND | Amendment | ||
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
J201 | Request for trial against refusal decision | ||
PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
|
AMND | Amendment | ||
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
PB0901 | Examination by re-examination before a trial |
St.27 status event code: A-6-3-E10-E12-rex-PB0901 |
|
B701 | Decision to grant | ||
PB0701 | Decision of registration after re-examination before a trial |
St.27 status event code: A-3-4-F10-F13-rex-PB0701 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
PR1002 | Payment of registration fee |
Fee payment year number: 1 St.27 status event code: A-2-2-U10-U12-oth-PR1002 |
|
PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Not in force date: 20150825 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE St.27 status event code: A-4-4-U10-U13-oth-PC1903 |
|
PC1903 | Unpaid annual fee |
Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20150825 St.27 status event code: N-4-6-H10-H13-oth-PC1903 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |