KR101163646B1 - Address electrode line for LED module and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an address electrode line and a manufacturing method for an LED module, the address electrode line for an LED module according to the present invention, the base substrate; At least one first address electrode line disposed on the base substrate to have a predetermined width and a predetermined length and having a conductive material; An insulation line disposed on the first address electrode line; A second address electrode line is disposed on the insulation line and has a conductive material. According to the present invention, it is possible to use for a transparent sign board or a transparent display, and by forming a double-layered transparent address electrode line, the area occupied in comparison with a conventional metal address electrode line is reduced, thereby reducing the integration degree of the LED chip. Can be improved.

Description

Address electrode line for LED module and manufacturing method

The present invention relates to an address electrode line and a manufacturing method for an LED module, and more particularly, to an address electrode line and a manufacturing method for forming an address electrode line for mounting the LED chip in a double-layer structure.

In order to manufacture the LED module, two address electrode line patterns for electrically connecting the LED chip must be formed on the substrate. The address electrode line refers to an electrode line for electrically connecting two terminals of the LED chip when the LED chip is mounted. That is, the LED chip should have a structure electrically connected to two address electrode lines.

Most of the address electrode lines used in the conventional LED module are manufactured by patterning copper (Cu) on a printed circuit board (PCB).

In this method, a transparent LED module cannot be manufactured and the address electrode electrode lines have to connect the n electrode and p electrode terminals of the LED chip, respectively, and thus have a structure patterned in a two-layer array of a single layer.

This conventional address electrode line is shown in FIGS. 1 and 2. 1 is a plan view showing a state in which an LED chip is mounted on an address electrode line for a conventional LED module, Figure 2 is a cross-sectional view.

1 and 2, the address electrode line 20 for mounting the LED chip 30 forms a conductive layer on which a conductive material such as copper (CU) is deposited on the base substrate 10. By patterning it. The address electrode lines 20 are patterned to be spaced apart from each other in a predetermined width, length, and width direction. In this case, the LED chip 30 is disposed to overlap or partially overlap two address electrode lines 20 adjacent to each other, so that two connection terminals of the LED chip are connected to each of the two address electrode lines.

As described above, the conventional address electrode line has a structure formed in a single layer on the base substrate, and the address electrode lines must be patterned in two rows to be connected to two electrode terminals of the LED chip. The effect of the increase is to reduce the density of the LED chip. In addition, due to the structure of the two-column address electrode line, the design of the LED module is restricted. That is, there is a problem of being limited by the electrode line width in the LED chip integration degree and the LED module design.

It is an object of the present invention to provide an address electrode line and a manufacturing method for an LED module that can overcome the above-mentioned conventional problems.

Another object of the present invention is to provide an address electrode line and a manufacturing method for an LED module that can improve the integration degree of the LED chip.

It is still another object of the present invention to provide an address electrode line and a manufacturing method for an LED module that can eliminate the limitation caused by the design constraints of the LED module or the width of the address electrode line.

It is another object of the present invention to provide an address electrode line and a manufacturing method for an LED module that can be used for a transparent signboard or a transparent display.

According to an embodiment of the present invention for achieving some of the above technical problems, the address electrode line for the LED module according to the present invention, the base substrate; At least one first address electrode line disposed on the base substrate to have a predetermined width and a predetermined length and having a conductive material; An insulation line disposed on the first address electrode line; A second address electrode line is disposed on the insulation line and has a conductive material.

The base substrate may be a transparent substrate.

The first address electrode line and the second address electrode line may be made of a transparent conductive oxide (TCO) material.

Widths of the first address electrode line, the insulating line, and the second address electrode line may be the same.

The LED chip is mounted on the second address electrode line, the first electrode terminal of the LED chip is electrically connected to the first address electrode line, and the second electrode terminal of the LED chip is connected to the second address electrode line. Can be electrically connected.

Widths of the first address electrode line, the insulation line, and the second address electrode line may be greater than or equal to the size (or width) of the LED chip.

The widths of the first address electrode line, the insulation line, and the second address electrode line are greater than the size of the LED chip, and the second address line forms a lower portion of the LED chip when the LED chip is mounted. The portion on which the LED chip is mounted may have a structure patterned to expose the insulating line so that the second address electrode line is wrapped.

The width of the second address electrode line and the insulating line may be the same, and the width of the first address electrode line may have a structure larger than the width of the second address electrode line and the insulating line.

The LED chip is mounted on the second address electrode line, the first electrode terminal of the LED chip is electrically connected to the first address electrode line, and the second electrode terminal of the LED chip is connected to the second address electrode line. Can be electrically connected.

The width of the insulating line and the second address electrode line may be greater than or equal to the size (or width) of the LED chip.

The width of the insulation line and the second address electrode line is greater than the size of the LED chip, and the second address electrode line is formed by lowering the lower portion of the LED chip when the LED chip is mounted. The portion in which the LED chip is to be mounted may have a structure patterned to expose the insulation line so as to surround the LED chip.

According to another embodiment of the present invention for achieving some of the above technical problems, a method of manufacturing an address electrode line for an LED module according to the present invention comprises the steps of: depositing a first conductive film on a base substrate; Depositing an insulating film on the first conductive film; Depositing a second conductive film on the insulating film; And forming address electrode lines having a sequential stacked structure of a first address electrode line, an insulation line, and a second address electrode line on the base substrate through patterning using a photolithography process and an etching process.

The first conductive layer and the second conductive layer are made of a transparent conductive oxide (TCO) material and may be deposited using a deposition apparatus including an RF (Radio Frequency) sputtering apparatus or an E-beam evaporator.

The base substrate may be a transparent substrate including glass.

The insulating film may be any one selected from an oxide insulating film, a polymer insulating film, a plastic insulating film, and a glass insulating film, and may be deposited using chemical vapor deposition (PECVD) or plasma deposition.

Mounting the LED chip on the second address electrode after the forming of the address electrode line or mounting the LED chip on the insulating line in such a manner that the second address electrode line surrounds a lower portion of the LED chip. Wow; The method may further include forming a coating or depositing a transparent film on a base substrate on which the LED chip is mounted.

The technology disclosed in the present invention can be used for a transparent signboard or a transparent display, and by forming a double-layered transparent address electrode line, a large area occupied in comparison with a conventional metal address electrode line is reduced. Chip integration can be improved. In addition, according to the increase in the area of the address electrode line itself, the electrical resistance can be reduced compared to the prior art, thereby increasing the power efficiency. In addition, the design of the LED module can be designed without being restricted by the electrode line, and it can be arbitrarily adjusted according to the use purpose according to the minimum address electrode line line width structure and the LED chip mounting method.

1 is a plan view of a conventional address electrode line.
2 is a cross-sectional view of Fig.
3 to 5 are process cross-sectional views illustrating a method of manufacturing an address electrode line for an LED module and a structure thereof according to an embodiment of the present invention.
6 is a plan view of an address electrode line formed by FIGS. 3 to 5.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings without intending to intend to provide a thorough understanding of the present invention to a person having ordinary skill in the art to which the present invention belongs.

3 to 5 are process cross-sectional views illustrating a method of manufacturing an address electrode line for an LED module and a structure thereof according to an embodiment of the present invention.

As shown in FIG. 3A, a base substrate 100 is prepared, and a first conductive film 122 is formed on the base substrate 100. The base substrate 100 may be a transparent substrate such as glass (glass). The first conductive film 122 deposits a transparent conductive oxide film (TCO) on the base substrate 100 using a deposition equipment including an RF (Radio Frequency) sputtering equipment or an E-beam evaporator. It can be formed by.

In addition, the first conductive film 122 may be formed of a conductive material of a transparent material, which is well known to those skilled in the art (hereinafter referred to as the person skilled in the art), and the deposition apparatus may also be a person skilled in the art. Other deposition equipment well known to the art can be used.

Thereafter, an insulating film 130 is formed on the first conductive film 122.

The insulating film 130 may have any one material selected from an oxide insulating film, a polymer insulating film, a plastic insulating film, and a glass insulating film, and the insulating film 130 may be deposited using chemical vapor deposition (PECVD) or plasma deposition. Can be.

After forming the insulating layer 130, a second conductive layer 124 is formed on the insulating layer 130. The second conductive film 124 is deposited by depositing a transparent conductive oxide film (TCO) on the insulating film 130 using a deposition equipment including a radio frequency (RF) sputtering equipment or an E-beam evaporator. Can be formed.

In addition, the second conductive film 124 may be formed of a conductive material of a transparent material that is well known to those skilled in the art, and other deposition equipment that is well known to those skilled in the art may be used.

As the second conductive film 124 is formed, a sequentially stacked structure of the first conductive film 122, the insulating film 130, and the second conductive film 124 is formed on the base substrate 100.

As shown in FIGS. 3B to 3E, the first address electrode lines 122b, 122c, 122d and 122e and the insulating line 130b are formed on the base substrate 100 through patterning using a photolithography process and an etching process. And address electrode lines having a sequential stacked structure of the 130c, 130d, 130e, and second address electrode lines 124b, 124c, 124d, and 124e.

The first address electrode lines 122b, 122c, 122d and 122e, the insulation lines 130b, 130c, 130d and 130e, and the second address electrode lines 124b, 124c, 124d and 124e have a predetermined width and a predetermined length. It is patterned to have.

The lengths of the first address electrode lines 122b, 122c, 122d and 122e, the insulating lines 130b, 130c, 130d and 130e, and the second address electrode lines 124b, 124c, 124d and 124e are mounted. The number of LED chips may vary, and a plurality of LED chips may include the first address electrode lines 122b, 122c, 122d, and 122e, the insulation lines 130b, 130c, 130d, and 130e, and the second address electrode lines. It may have an appropriate length to be mounted in the longitudinal direction of (124b, 124c, 124d, 124e).

The widths of the first address electrode lines 122b, 122c, 122d and 122e, the insulation lines 130b, 130c, 130d and 130e, and the second address electrode lines 124b, 124c, 124d and 124e may be different. Can vary.

For example, as shown in FIGS. 3B and 3C, all of the first address electrode lines 122b and 122c, the insulation lines 130b and 130c, and the second address electrode lines 124b and 124c are all. It can have the same width.

In this case, the widths of the first address electrode lines 122b and 122c, the insulating lines 130b and 130c, and the second address electrode lines 124b and 124c are the size (or width) of the LED chip mounted in a subsequent process. It may be larger or the same. This may vary depending on whether the degree of integration is prioritized or the convenience of wire bonding is prioritized.

In the case of FIG. 3B, the widths of the first address electrode lines 122b and 122c, the insulating lines 130b and 130c, and the second address electrode lines 124b and 124c are measured in the subsequent process. In the case of FIG. 3C, the widths of the insulating lines 130b and 130c and the second address electrode lines 124b and 124c may be mounted in a subsequent process. It should be formed larger than the size (or width) of.

3D and 3E, the first address electrode lines 122d and 122e, the insulation lines 130d and 130e, and the second address electrode lines 124d and 124e have different widths. can do.

3D and 3E, the widths of the second address electrode lines 124d and 124e and the insulating lines 130d and 130e are the same, and the width of the first address electrode lines 122d and 122e is the second address. The structure is patterned to be larger than the widths of the electrode lines 124d and 124e and the insulating lines 130d and 130e. This is for ease of wire bonding and the like when mounting the LED chip in a subsequent process.

3B to 3E, the patterning structures of the second address electrode lines 124b, 124c, 124d, and 124e are different from each other.

3B and 3D, the second address electrode lines 124b and 124d are patterned to have a predetermined width and a predetermined length, and a separate pattern is not formed on the second address electrode lines 124b and 124d itself. .

However, in the case of FIGS. 3C and 3E, the patterning process is different from that of FIGS. 3B and 3D. As shown in FIGS. 3C and 3E, the second address electrode lines 124c and 124e are patterned so as not to be formed in the portion where the LED chip is mounted. That is, the portion corresponding to the size of the LED chip to be mounted in a subsequent process is removed from the region of the second address electrode lines 124c and 124e and is patterned to expose the insulating lines 130c and 130e.

Looking at the overall structure of the second address electrode line (124c, 124e) itself, the second address electrode line (124c, 124e) having a predetermined width and length, the LED chip is mounted on the portion, the LED chip It can be seen that it has a structure in which a hole (hole) of a size corresponding to the size of is formed. This may be performed in order to adjust the overall height of the entire LED module in which the LED chip is mounted, or may be performed due to the convenience of electrical connection between the electrode terminals of the LED chip and the second address electrode lines 124c and 124e. have.

After the address electrode lines having the structure as described above are formed, as shown in FIG. 4, the LED chip 300 is mounted.

As shown in FIG. 4A, the first address electrode line 122a, the insulating line 130a, and the second address electrode line 124a have the same structure as described with reference to FIG. 3B, that is, the first address electrode line 122a. ), The insulating line 130a and the second address electrode line 124a have the same width. In this case, the widths of the first address electrode line 122a, the insulating line 130a, and the second address electrode line 124a are patterned to have the same width as that of the LED chip 300.

In this case, the LED chip 300 is mounted on the second address electrode line 124a, and the first electrode terminal of the LED chip 300 is electrically connected to the first address electrode line 122a. Various connection methods are used, such as bonding through wires 302 and 304 such that the second electrode terminal of the LED chip 300 is electrically connected to the second address electrode line 124a. When wire bonding is performed, wires 302 and 304 may be connected to side surfaces of the first address electrode line 122a and the second address electrode line 124a.

In this case, the degree of integration can be greatly improved as compared with other cases.

As shown in FIG. 4B, the first address electrode line 122b, the insulating line 130b, and the second address electrode line 124b have the same structure as described with reference to FIG. 3B, that is, the first address electrode line 122b. ), The insulating line 130b and the second address electrode line 124b have the same width. At this time, the width of the first address electrode line 122a, the insulating line 130a, and the second address electrode line 124a is larger than the size of the LED chip 300.

In this case, the LED chip 300 is mounted on the second address electrode line 124b, and the first electrode terminal of the LED chip 300 is electrically connected to the first address electrode line 122b. Various connection methods are used, such as bonding through wires 302 and 304 such that the second electrode terminal of the LED chip 300 is electrically connected to the second address electrode line 124b.

In this case, although the degree of integration is slightly lower than that of FIG. 4A, wire bonding is possible on the second address electrode line 124b unlike FIG. 4A, and thus, convenience of wire bonding is improved.

As shown in FIG. 4C, the first address electrode line 122c, the insulating line 130c, and the second address electrode line 124c have the same structure as described with reference to FIG. 3C, that is, the first address electrode line 122c. ), The insulating line 130c and the second address electrode line 124c have the same width, and have a structure in which the second address electrode line 124c is not formed in the portion where the LED chip is mounted. .

At this time, the width of the first address electrode line 122c, the insulating line 130c, and the second address electrode line 124c is larger than the size of the LED chip 300.

In this case, the LED chip 300 is mounted on the insulating line 130c such that the second address electrode line 124c surrounds the lower portion of the LED chip 300. The first electrode terminal of the LED chip 300 is electrically connected to the first address electrode line 122c, and the second electrode terminal of the LED chip 300 is connected to the second address electrode line 124c. Various connection methods such as bonding through wires 302 and 304 are used to be electrically connected.

In this case, although the degree of integration is slightly lower than in the case of FIG. 4A, the height of the LED module can be lowered, and wire bonding is possible on the second address electrode line 124c unlike FIG. 4A or 4B, and thus convenience of wire bonding. This has the advantage of being improved.

As shown in FIG. 4D, the first address electrode line 122d, the insulating line 130d, and the second address electrode line 124d have the same structure as described with reference to FIG. 3D, that is, the insulating line 130d and the first address electrode line 122d. The second address electrode line 124d has the same width, and the first address electrode line 122d is formed to be larger than the width of the insulating line 130d and the second address electrode line 124d.

The width of the insulating line 130d and the second address electrode line 124d is larger than that of the LED chip 300. Although not shown, the width of the insulating line 130d and the second address electrode line 124d may be the same as that of the LED chip 300 to improve the degree of integration.

Here, only the case where the width of the insulating line 130d and the second address electrode line 124d is larger than the size of the LED chip 300 will be described.

In this case, the LED chip 300 is mounted on the second address electrode line 124d. The first electrode terminal of the LED chip 300 is electrically connected to the first address electrode line 122d, and the second electrode terminal of the LED chip 300 is connected to the second address electrode line 124d. Various connection methods such as bonding through wires 302 and 304 are used to be electrically connected.

In this case, although the degree of integration is slightly lower than that of FIGS. 4A, 4B, and 4C, wire bonding is possible on the first address electrode line 122d, unlike the FIGS. 4A, 4B, and 4C. Since wire bonding is possible on the line 124d, convenience of wire bonding is improved.

In the structure of FIG. 4D, as described above, the width of the insulating line 130d and the second address electrode line 124d is equal to the size of the LED chip 300, and as described above. The width of the first address electrode line 122d may be slightly larger than the width of the insulating line 130d and the second address electrode line 124d.

As shown in FIG. 4E, the first address electrode line 122e, the insulating line 130e, and the second address electrode line 124e have the same structure as described with reference to FIG. 3E, that is, the insulating line 130e and the first address electrode line 124e. The second address electrode line 124e has the same width, and the first address electrode line 122e is formed to be larger than the width of the insulating line 130e and the second address electrode line 124e. In the case where the LED chip is mounted, the second chip electrode line 124e is patterned such that the second address electrode line 124e is not formed.

The width of the first address electrode line 122e, the insulating line 130e, and the second address electrode line 124e is larger than the size of the LED chip 300.

In this case, the LED chip 300 is mounted on the insulating line 130e such that the second address electrode line 124e surrounds the lower portion of the LED chip 300. The first electrode terminal of the LED chip 300 is electrically connected to the first address electrode line 122e, and the second electrode terminal of the LED chip 300 is connected to the second address electrode line 124e. Various connection methods such as bonding through wires 302 and 304 are used to be electrically connected.

In this case, although the degree of integration is slightly lower than that of FIGS. 4A, 4B, and 4C, the height of the LED module may be lowered. Unlike the FIGS. 4A, 4B, and 4C, the wires on the first address electrode line 122e may be different. Bonding is possible, and wire bonding is possible on the second address electrode line 124e, thereby improving convenience of wire bonding.

An overall cross-sectional view of a form in which an LED chip is mounted through the process of FIGS. 4A to 4E is illustrated in FIG. 5. FIG. 5A shows an overall sectional view of the case of FIG. 4E, and FIG. 5B shows an overall sectional view of the case of FIG. 4B.

As shown in FIGS. 5A and 5B, the first address electrode lines 122b and 122e, the insulation lines 130b and 130e, and the second address electrode lines 124b and 124e are sequentially formed on the base substrate 100. Since it is formed in a laminated structure, it can be seen that the address electrode line has a double stacked structure. In addition, the width or pattern of the address electrode line may be variously used for the purpose of use, and may be arbitrarily adjusted according to the improvement of integration degree or the convenience of wire bonding, and thus, the mounting form of the LED chip 300 may be changed. Able to know. That is, the stacking structure can be manufactured differently according to the width control of the first address electrode lines 122b and 122e and the mounting method of the LED chip 300, so that the design is not restricted and the patterning through the photolithography process and the etching process control is performed. Through this, various laminated structures are possible.

Although not shown, the method may further include forming a coating or depositing a transparent film on the base substrate on which the LED chip is mounted as a subsequent process.

6 is an overall plan view of a form in which an LED chip is mounted through the process of FIGS. 4A to 4E. FIG. 6A is an overall plan view of the case of FIGS. 4B to 4E, and FIG. 6B is an overall plan view of the case of FIG. 4A. to be.

6A shows the width of the first address electrode lines 122b, 122c, 122d and 122e, commonly referred to as '122f', or the second address electrode lines 124b, 124c, 124d and 124e, rather than the size of the LED chip 300. 6b shows a case where the width of the '124f' is large, and FIG. 6b shows that the widths of the first address electrode line 122a, the insulating line 130a, and the second address electrode line 124a are the same, and the LED chip is the same. The size of the reference numeral 300 is the same as the width of the first address electrode line 122a, the insulating line 130a, and the second address electrode line 124a.

The address electrode line shown in FIG. 6A may be seen as one address electrode. However, when the width of the second address electrode line 124f is smaller than the width of the first address electrode line 122f, the address electrode line of FIG. The second address electrode line 124f and the first address electrode line 122f are shown together. When the width of the second address electrode line 124f is larger than the width of the first address electrode line 122f, the address electrode line of FIG. 6A, of course, shows the second address electrode line 124f. 6B, the second address electrode line 124a is shown.

As shown in FIGS. 6A and 6B, the address electrode line according to the present invention has an arrangement area of the address electrode line that must be provided to mount one LED chip, as compared with the prior art shown in FIGS. 1 and 2. It can be seen that it is significantly reduced, the area of the address electrode line itself is increased compared to the area of the address electrode line occupies on the substrate. Accordingly, it is possible to confirm the effect of improving the degree of integration, and as the area of the address electrode line itself increases, the electric resistance can be reduced as compared with the conventional art, and thus it can be seen that there is an effect of increasing the power efficiency accordingly. In addition, it can be seen that the design of the LED module can be designed with little influence from the constraints of the electrode lines. In addition, according to the minimum address electrode line width structure and the LED chip mounting method, it can be arbitrarily adjusted according to the intended use.

In the case of FIG. 6B, since the area occupied by the address electrode line on the substrate is substantially the same as the area occupied by the LED chip, the integration degree of the LED chip can be greatly improved.

The description of the above embodiments is only given by way of example with reference to the drawings for a thorough understanding of the present invention, it should not be construed as limiting the present invention. In addition, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the basic principles of the present invention.

100: base substrate 122: first conductive film
124: second conductive film 130; Insulating film
122a, 122b, 122c, 122d, 122e, 122f: first address electrode line
130a, 130b, 130c, 130d, 130e: Insulation Line
124a, 124b, 124c, 124d, 124e and 124f: second address electrode line

Claims (16)

In the address electrode line for the LED module:
A base substrate;
At least one first address electrode line disposed on the base substrate to have a predetermined width and a predetermined length and having a conductive material;
An insulation line disposed on the first address electrode line;
The second address electrode line is disposed on the insulation line and has a conductive material and is mounted with an LED chip.
And the first address electrode line, the insulating line, and the second address electrode line have the same longitudinal direction and have a sequential stacked structure.
The method according to claim 1,
And the base substrate is a transparent substrate.
The method according to claim 2,
And the first address electrode line and the second address electrode line are made of a transparent conductive oxide (TCO) material.
The method according to claim 1 or 3,
And the widths of the first address electrode line, the insulating line, and the second address electrode line are the same.
The method of claim 4,
The LED chip is mounted on the second address electrode line, the first electrode terminal of the LED chip is electrically connected to the first address electrode line, and the second electrode terminal of the LED chip is connected to the second address electrode line. An address electrode line, characterized in that electrically connected.
The method according to claim 5,
The width of the first address electrode line, the insulating line, and the second address electrode line is greater than or equal to the size (or width) of the LED chip.
The method of claim 4,
The widths of the first address electrode line, the insulation line, and the second address electrode line are greater than the size of the LED chip, and the second address line forms a lower portion of the LED chip when the LED chip is mounted. And the portion on which the LED chip is mounted has a structure in which the insulating line is exposed so that the second address electrode line is wrapped around the second address electrode line.
The method according to claim 1 or 3,
The width of the second address electrode line and the insulating line is the same, the width of the first address electrode line has a structure that is formed larger than the width of the second address electrode line and the insulating line Electrode line.
The method according to claim 8,
The LED chip is mounted on the second address electrode line, the first electrode terminal of the LED chip is electrically connected to the first address electrode line, and the second electrode terminal of the LED chip is connected to the second address electrode line. An address electrode line, characterized in that electrically connected.
The method according to claim 9,
The width of the insulating line and the second address electrode line is greater than or equal to the size (or width) of the LED chip address electrode line.
The method according to claim 8,
The width of the insulation line and the second address electrode line is greater than the size of the LED chip, and the second address electrode line is formed by lowering the lower portion of the LED chip when the LED chip is mounted. The part where the LED chip is to be mounted has a structure patterned to expose the insulating line so as to surround the LED chip.
In the manufacturing method of the address electrode line for the LED module,
Depositing a first conductive film on the base substrate;
Depositing an insulating film on the first conductive film;
Depositing a second conductive film on the insulating film;
Through patterning using a photolithography process and an etching process, the address electrodes are arranged on the base substrate such that the first address electrode line, the insulation line, and the second address electrode line on which the LED chip is mounted have the same length direction. And forming the lines.
The method of claim 12,
The first conductive layer and the second conductive layer are made of a transparent conductive oxide (TCO) material and are deposited using a deposition apparatus including an RF (Radio Frequency) sputtering apparatus or an E-beam evaporator. Method of manufacturing electrode line.
The method of claim 12,
And the base substrate is a transparent substrate including glass.
The method of claim 12,
The insulating film is any one selected from an oxide-based insulating film, a polymer insulating film, a plastic insulating film, and a glass insulating film, a method of manufacturing an address electrode line, characterized in that deposited by using chemical vapor deposition (PECVD) or plasma deposition method.
The method according to any one of claims 12 to 15,
Mounting the LED chip on the second address electrode after the forming of the address electrode line or mounting the LED chip on the insulating line in such a manner that the second address electrode line surrounds a lower portion of the LED chip. Wow;
And forming a coating or depositing a transparent film on the base substrate on which the LED chip is mounted.

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