KR101070005B1 - 시일 구조체 - Google Patents
시일 구조체 Download PDFInfo
- Publication number
- KR101070005B1 KR101070005B1 KR1020097003662A KR20097003662A KR101070005B1 KR 101070005 B1 KR101070005 B1 KR 101070005B1 KR 1020097003662 A KR1020097003662 A KR 1020097003662A KR 20097003662 A KR20097003662 A KR 20097003662A KR 101070005 B1 KR101070005 B1 KR 101070005B1
- Authority
- KR
- South Korea
- Prior art keywords
- seal
- flexible wiring
- wiring board
- housing
- seal structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010410 layer Substances 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 239000013013 elastic material Substances 0.000 claims abstract description 6
- 239000012790 adhesive layer Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 6
- 229920001971 elastomer Polymers 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 2
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene naphthalate Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/14—Sealings between relatively-stationary surfaces by means of granular or plastic material, or fluid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (11)
- 플랙시블 배선기판(1)이 관통삽입되는 하우징(2)과, 상기 플랙시블 배선기판(1)에 일체 성형되며 상기 하우징(2)과 상기 플랙시블 배선기판(1) 사이의 틈을 밀봉하는 시일부재(3)로 이루어지는 시일 구조체로서, 상기 플랙시블 배선기판(1)은, 탄성재와 패터닝된 구리박과 접착층으로 이루어진 베이스 FPC(11)와, 상기 베이스 FPC(11)의 표면에 형성된 도전성의 전자파 시일드층(12)과, 상기 전자파 시일드층(12)의 표면을 덮는 절연층(13)으로 구성되어 있으며, 상기 시일부재(3)가 자기 접착형 실리콘고무를 이용하여 상기 절연층(13) 상에 금형을 이용하여 직접 베이크(bake)되어 일체화되는 동시에, 산형상(山形) 돌기부를 구비하고 있는 것을 특징으로 하는 시일 구조체.
- 삭제
- 삭제
- 삭제
- 제 1항에 있어서,상기 하우징(2)이 전자기기임을 특징으로 하는 시일 구조체.
- 제 5항에 있어서,상기 전자기기가 휴대전화임을 특징으로 하는 시일 구조체.
- 제 1항에 있어서,상기 하우징(2)이 방수 커넥터임을 특징으로 하는 시일 구조체.
- 제 1항에 있어서,상기 시일부재(3)가 상기 플랙시블 배선기판(1)의 양측에 설치되어 있는 것을 특징으로 하는 시일 구조체.
- 제 1항에 있어서,상기 시일부재(3)가 상기 하우징(2)의 맞춤면(4)을 시일하는 프레임체형상 시일(31)임을 특징으로 하는 시일 구조체.
- 제 1항에 있어서,상기 시일부재(3)가 상기 하우징(2)에 형성된 관통삽입구멍(5)에 장착되는 부시형상 시일(32)임을 특징으로 하는 시일 구조체.
- 제 1항에 있어서,상기 시일부재(3)가 프레임체형상 시일(31)과 부시형상 시일(32)의 조합임을 특징으로 하는 시일 구조체.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006264602 | 2006-09-28 | ||
JPJP-P-2006-264602 | 2006-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090056989A KR20090056989A (ko) | 2009-06-03 |
KR101070005B1 true KR101070005B1 (ko) | 2011-10-04 |
Family
ID=39229969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097003662A Active KR101070005B1 (ko) | 2006-09-28 | 2007-09-10 | 시일 구조체 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8003898B2 (ko) |
EP (1) | EP2068607B1 (ko) |
JP (1) | JP2008109107A (ko) |
KR (1) | KR101070005B1 (ko) |
CN (1) | CN101513148B (ko) |
WO (1) | WO2008038533A1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5003762B2 (ja) * | 2007-07-20 | 2012-08-15 | 富士通株式会社 | 密封構造、電子機器及びガスケットの製造方法 |
JP4829263B2 (ja) * | 2008-02-25 | 2011-12-07 | 富士通株式会社 | 防水型電子機器 |
JP2009267985A (ja) * | 2008-04-28 | 2009-11-12 | Fujitsu Ltd | 携帯端末装置 |
JP5169696B2 (ja) * | 2008-09-30 | 2013-03-27 | Nok株式会社 | 密封装置および密封構造 |
CN101742852B (zh) * | 2008-11-10 | 2012-10-17 | 深圳富泰宏精密工业有限公司 | 防水塞及应用该防水塞的电子装置 |
JP5354281B2 (ja) * | 2009-06-25 | 2013-11-27 | 日本メクトロン株式会社 | シール構造体 |
JP5285529B2 (ja) * | 2009-07-29 | 2013-09-11 | 京セラ株式会社 | スライド式携帯電子機器 |
JP5654379B2 (ja) * | 2010-03-03 | 2015-01-14 | パナソニックIpマネジメント株式会社 | 電気配線を備えた電子機器 |
CN202135399U (zh) * | 2011-07-15 | 2012-02-01 | 深圳市好年华模具有限公司 | 防腐蚀软胶包裹的电路板 |
JP2014157775A (ja) * | 2013-02-18 | 2014-08-28 | Sanyo Denki Co Ltd | 封止部材付きシールドケーブル |
JP6380013B2 (ja) * | 2014-11-04 | 2018-08-29 | コニカミノルタ株式会社 | 超音波プローブ |
CN105065670A (zh) * | 2015-07-29 | 2015-11-18 | 平湖阿莱德实业有限公司 | 无伸缩高精度装配弹性屏蔽密封条 |
CN106210197A (zh) * | 2016-07-28 | 2016-12-07 | 广东欧珀移动通信有限公司 | 移动终端 |
EP3293951A1 (en) * | 2016-09-09 | 2018-03-14 | Guangdong Oppo Mobile Telecommunications Corp., Ltd | Mobile terminal, housing assembly, and method for manufacturing the same |
US10103478B1 (en) * | 2017-06-23 | 2018-10-16 | Amazon Technologies, Inc. | Water resistant connectors with conductive elements |
US10411380B1 (en) * | 2018-05-24 | 2019-09-10 | Microsoft Technology Licensing, Llc | Connectors with liquid metal and gas permeable plugs |
US11573599B2 (en) * | 2020-06-11 | 2023-02-07 | Apple Inc. | Electrical connectors for electronic devices |
US12174660B2 (en) | 2020-06-11 | 2024-12-24 | Apple Inc. | Electronic device |
CN112930106B (zh) * | 2021-01-22 | 2022-11-22 | 杭州唯灵医疗科技有限公司 | 一种柔性电子设备及柔性电子设备的组装方法 |
JP7365490B2 (ja) | 2021-01-27 | 2023-10-19 | サムスン エレクトロニクス カンパニー リミテッド | シーリング部材を含む電子装置 |
EP4568234A2 (en) | 2021-02-10 | 2025-06-11 | Samsung Electronics Co., Ltd. | Electronic device comprising waterproof structure |
KR20230006350A (ko) * | 2021-07-02 | 2023-01-10 | 삼성전자주식회사 | 연성회로기판을 포함하는 전자 장치 |
Citations (1)
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---|---|---|---|---|
WO2003085793A1 (fr) * | 2002-04-11 | 2003-10-16 | Nok Corporation | Structure d'etancheite |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5819415U (ja) * | 1981-07-29 | 1983-02-05 | 日本電気ホームエレクトロニクス株式会社 | フレキシブルプリント板 |
JP2821262B2 (ja) * | 1990-11-26 | 1998-11-05 | 株式会社日立製作所 | 電子装置 |
JPH053395A (ja) * | 1991-06-24 | 1993-01-08 | Sumitomo Electric Ind Ltd | フレキシブルプリント配線板 |
US5247424A (en) * | 1992-06-16 | 1993-09-21 | International Business Machines Corporation | Low temperature conduction module with gasket to provide a vacuum seal and electrical connections |
JPH0638308U (ja) * | 1992-10-15 | 1994-05-20 | 松下電工株式会社 | アンテナユニット |
US5491300A (en) * | 1994-04-28 | 1996-02-13 | Cray Computer Corporation | Penetrator and flexible circuit assembly for sealed environment |
JP3552825B2 (ja) * | 1995-12-15 | 2004-08-11 | 矢崎総業株式会社 | 熱可塑性樹脂とオイルブリード性シリコーンゴムとの一体成形自動車用防水コネクタ |
JPH10322049A (ja) * | 1997-05-16 | 1998-12-04 | Denso Corp | 筐体の防水構造 |
US6521989B2 (en) * | 1998-10-08 | 2003-02-18 | Honeywell Inc. | Methods and apparatus for hermetically sealing electronic packages |
JP2001155815A (ja) * | 1999-11-30 | 2001-06-08 | Hirose Electric Co Ltd | 平形ケーブルとこの平形ケーブルを用いた防水コネクタ構造 |
US6409541B1 (en) * | 2000-11-02 | 2002-06-25 | Autonetworks Technologies, Ltd. | Waterproof structure in cable insertion section, method of manufacturing the same, and die for waterproof molding |
JP2002198664A (ja) * | 2000-12-26 | 2002-07-12 | Seiko Instruments Inc | 携帯電子機器 |
JP2003142836A (ja) | 2001-11-05 | 2003-05-16 | Seiko Instruments Inc | 電子機器 |
US6744051B2 (en) * | 2001-11-16 | 2004-06-01 | Ge Medical Systems Global Technology Company Llc | High density electrical interconnect system for photon emission tomography scanner |
JP3791510B2 (ja) | 2002-05-13 | 2006-06-28 | 日本電気株式会社 | 防水構造を備える折り畳み型携帯端末装置 |
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JP2004214927A (ja) | 2002-12-27 | 2004-07-29 | Casio Comput Co Ltd | 携帯用電子機器 |
JP2005350582A (ja) * | 2004-06-11 | 2005-12-22 | Wacker Asahikasei Silicone Co Ltd | シリコーンゴム組成物及びその硬化物 |
-
2007
- 2007-09-10 US US12/439,130 patent/US8003898B2/en active Active
- 2007-09-10 CN CN2007800331534A patent/CN101513148B/zh active Active
- 2007-09-10 EP EP07807419.2A patent/EP2068607B1/en active Active
- 2007-09-10 WO PCT/JP2007/068015 patent/WO2008038533A1/ja active Application Filing
- 2007-09-10 KR KR1020097003662A patent/KR101070005B1/ko active Active
- 2007-09-19 JP JP2007241856A patent/JP2008109107A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003085793A1 (fr) * | 2002-04-11 | 2003-10-16 | Nok Corporation | Structure d'etancheite |
Also Published As
Publication number | Publication date |
---|---|
WO2008038533A1 (fr) | 2008-04-03 |
US20090250261A1 (en) | 2009-10-08 |
EP2068607A4 (en) | 2012-07-04 |
EP2068607B1 (en) | 2013-12-25 |
KR20090056989A (ko) | 2009-06-03 |
CN101513148B (zh) | 2011-09-28 |
JP2008109107A (ja) | 2008-05-08 |
CN101513148A (zh) | 2009-08-19 |
US8003898B2 (en) | 2011-08-23 |
EP2068607A1 (en) | 2009-06-10 |
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