KR101018016B1 - Substrate support unit, substrate processing apparatus and method using same - Google Patents

Abstract

The present invention discloses a substrate support unit and a substrate processing apparatus and method using the same, wherein the light emitting device disposed above the support plate emits light toward the rotating support plate, and the light transmitting unit provided on the support plate is emitted from the light emitting device. It is characterized by detecting whether the substrate is separated from the support plate while transmitting the light to the light receiving element disposed under the support plate.

According to this feature, it is possible to detect whether the substrate is removed during the process, the substrate support unit that can prevent damage to the substrate support unit and peripheral devices such as Paul due to the separated substrate, a substrate processing apparatus using the same and It may provide a method.

Support plate, substrate, separation, light emitting element, light receiving element, light transmission part

Description

Substrate support unit, substrate processing apparatus and method using same {SUBSTRATE SUPPORTING UNIT, APPARATUS AND METHOD FOR TREATING SUBSTRATE USING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and method, and more particularly, to a substrate support unit for supporting a substrate during process progression, and a substrate processing apparatus and method using the same.

Generally, semiconductor devices are manufactured by depositing and patterning various materials on a substrate in a thin film form. To this end, several different processes are required, such as a deposition process, a photographic process, an etching process and a cleaning process.

Among these processes, the etching process is a process of removing film quality formed on the substrate, and the cleaning process is a process of removing contaminants remaining on the surface of the substrate after each unit process for semiconductor manufacturing. The etching process and the cleaning process are classified into a wet method and a dry method according to the process method, and the wet method is classified into a batch type method and a spin type method.

In the spin type, the substrate is fixed to a chuck member capable of processing a single substrate, and then the chemical liquid or deionized water is supplied to the substrate through the spray nozzle while the substrate is rotated. The substrate is washed by being spread out, and the substrate is dried with dry gas after the substrate is washed.

The present invention is to provide a substrate support unit that can detect the departure of the substrate from the substrate support unit during the process, and a substrate processing apparatus and method using the same.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a substrate support unit according to the present invention includes a support plate on which a substrate is placed; And a sensing member for detecting the presence or absence of the substrate on the supporting plate, wherein the sensing member is disposed above the supporting plate and emits light toward an upper surface of the supporting plate; A light receiving element disposed under the support plate and receiving light; And a light transmission part installed on the support plate and transmitting the light emitted from the light emitting device to the light receiving device.

A substrate support unit according to the present invention having the configuration as described above, wherein the light transmitting portion comprises: a first light transmitting element provided on an upper surface of the support plate so as to face the light emitting element; A second light transmitting element disposed on a lower surface of the support plate so as to face the light receiving element; And a light moving module that provides a light moving path between the first light transmitting element and the second light transmitting element.

The light emitting device may be provided in a direction perpendicular to the upper surface of the support plate so that the emitted light is perpendicular to the upper surface of the support plate.

The light receiving element may be provided in a direction perpendicular to the lower surface of the support plate such that the light received is perpendicular to the lower surface of the support plate.

The light emitting element and the light receiving element may be provided not to be positioned on the same vertical line.

The optical transfer module may be an optical fiber.

Grooves in which the first and second light transmitting elements are inserted are formed on the upper and lower surfaces of the support plate, and each of the grooves may be sealed by a transparent corrosion-resistant synthetic resin cover.

In order to achieve the above object, a substrate processing apparatus according to the present invention includes a container for providing a space in which a substrate processing process proceeds; A substrate support unit installed inside the container and supporting the substrate; And a processing fluid supply unit supplying a processing fluid to the substrate supported by the substrate support unit to process the substrate, wherein the substrate support unit comprises: a support plate on which the substrate is placed; A light emitting element disposed above the support plate and emitting light toward an upper surface of the support plate; A light receiving element disposed under the support plate and receiving light; And a light transmission part installed on the support plate and transmitting the light emitted from the light emitting device to the light receiving device.

A substrate processing apparatus according to the present invention having the configuration as described above, wherein the light transmitting portion comprises: a first light transmitting element provided on an upper surface of the support plate so as to face the light emitting element; A second light transmitting element disposed on a lower surface of the support plate so as to face the light receiving element; And a light moving module that provides a light moving path between the first light transmitting element and the second light transmitting element.

The light emitting element is provided in a direction perpendicular to the upper surface of the support plate such that the emitted light is perpendicular to the upper surface of the support plate, and the light receiving element is perpendicular to the lower surface of the support plate such that the light received is perpendicular to the lower surface of the support plate. It can be provided in one direction.

The light emitting element and the light receiving element may be provided not to be positioned on the same vertical line.

The optical transfer module may be an optical fiber.

Grooves in which the first and second light transmitting elements are inserted are formed on the upper and lower surfaces of the support plate, and each of the grooves may be sealed by a transparent corrosion-resistant synthetic resin cover.

In order to achieve the above object, the substrate processing method according to the present invention loads a substrate on a support plate, and proceeds the processing process for the substrate while rotating the substrate by the rotation of the support plate, but the progress of the substrate processing process. It is characterized in that for detecting the departure from the support plate of the substrate.

In the substrate processing method according to the present invention having the configuration as described above, the detection of the departure of the substrate emits light toward the support plate to rotate the light emitting element disposed on the support plate, the light installed on the support plate The transfer unit may proceed while transferring the light emitted from the light emitting element to the light receiving element disposed under the support plate.

The first light transmitting element is provided on the upper surface of the support plate to face the light emitting element; A second light transmitting element disposed on a lower surface of the support plate so as to face the light receiving element; And a light moving module that provides a light moving path between the first light transmitting element and the second light transmitting element.

The light emitting device continuously emits light, and the first and second light transmitting devices periodically pass the light to the light receiving device while passing through a position facing the light emitting device and the light receiving device by rotation of the support plate. I can deliver it.

If the number of times of light transmission to the light receiving element per unit time is equal to the number of rotations of the support plate per unit time, an alarm may be generated.

According to the present invention, the detachment of the substrate from the substrate support unit can be detected during the process.

In addition, according to the present invention, it is possible to prevent damage to the substrate support unit and the Paul due to the detachment of the substrate.

Hereinafter, a substrate support unit, a substrate processing apparatus and a method using the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals have the same reference numerals as much as possible even if displayed on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

(Example)

In this embodiment, an apparatus for cleaning a substrate will be described as an example. However, the technical idea of the present invention is not limited thereto, and the present invention may be applied to all kinds of apparatuses which process the substrate while rotating the substrate in a single sheet method.

1 shows the layout of a sheet type substrate cleaning facility. Referring to FIG. 1, a sheet type substrate cleaning apparatus according to the present invention includes a loading / unloading unit 1, a carrier transfer unit 2, a carrier table 3, a substrate transfer unit 4, and a cleaning processing unit 5. Include.

The loading / unloading portion 1 has an in / out port 1-1 on which a carrier C on which substrates are accommodated is placed. The carrier transfer part 2 is arranged adjacent to the loading / unloading part 1, and the substrate transfer part 4 is arranged at the center of the other side of the carrier transfer part 2. The substrate transfer part 4 has a passage 4-1 for moving the transfer robot 4-3 formed in the direction perpendicular to the carrier transfer part 2. Inside the passage 4-1, a transfer guide 4-2 is provided along the longitudinal direction of the passage 4-1, and the transfer robot 4-3 is guided by the transfer guide 4-2. It moves along the longitudinal direction of the passage 4-1. The carrier table 3 and the washing | cleaning process part 5 are arrange | positioned at the both sides of the passage 4-1, respectively. The cleaning processor 5 has a plurality of process chambers 5a, 5b, 5c, and 5d arranged side by side on both sides of the passage 410 of the substrate transfer part 4. The substrate transfer unit 4, the carrier table 3, and the cleaning processing unit 5 may be arranged in a multilayer structure of an upper layer and a lower layer, and the carrier transfer unit 2 may also have a multilayer structure so as to correspond to the carrier table 3 having a multilayer structure. Can have In addition, a fan filter unit (not shown) for supplying clean air may be provided on the carrier transfer part 2, the carrier table 3, the substrate transfer part 4, and the cleaning processor 5, respectively. have.

As the carrier C for accommodating the substrate, a hermetically sealed container such as a front open unified pod may be used. The carrier C may be connected to the loading / unloading portion 1 by a transfer means (not shown), such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. It is placed on the in / out port 1-1. The carrier C placed in the in / out port 1-1 of the loading / unloading portion 1 is transferred to the carrier table 3 by the carrier transfer portion 2. The transfer robot 4-3 of the substrate transfer part 4 transfers the substrate to be cleaned from the carrier C placed on the carrier table 3 to the process chambers 5a, 5b, 5c, 5d of the cleaning process part 5. In the process chambers 5a, 5b, 5c, and 5d, the substrate is cleaned. The substrate cleaned by the cleaning processor 5 is transferred to the carrier C on the carrier table 3 by the transfer robot 4-3, and the carrier C containing the cleaned substrates is a carrier carrier 2. ) Into the in / out port 1-1 of the loading / unloading section 1.

FIG. 2 is a perspective view illustrating an internal configuration of the process chamber of FIG. 1. Referring to FIG. 2, a substrate support unit 10, a container 20, and substrate cleaning means 30, 40, and 50 are provided in the process chamber. The substrate support unit 10 supports the substrate W during the cleaning process of the substrate, and may be rotated while the process is in progress. The outer side of the substrate support unit 10 is provided with a container 20 for separating and recovering the chemical liquids used in the process. Substrate cleaning means 30, 40, and 50 are disposed around the vessel 20 to clean the substrate.

The substrate cleaning means 30, 40, 50 includes a first processing fluid supply member 30 for supplying a chemical liquid to the substrate, a second processing fluid supply member 40 for supplying a rinse liquid or a dry gas to the substrate, and an ultrasonic cleaning member. And 50.

The first processing fluid supply member 30 linearly reciprocates in a scan manner and supplies the chemical liquid on the substrate. Chemicals used in the substrate cleaning process include hydrofluoric acid (HF), sulfuric acid (H3SO4), nitric acid (HNO3), phosphoric acid (H3PO4), and SC-1 solutions (ammonium hydroxide (NH ₄ OH), hydrogen peroxide (H ₂ O _2). ) And at least one selected from the group consisting of water (mixture of H ₂ O)). The first processing fluid supply member 30 has at least one chemical liquid supply nozzle 32, and the chemical liquid is supplied onto the substrate using any one chemical liquid supply nozzle 32 selected according to the type of chemical liquid used for the substrate processing. Supply. The chemical liquid supply nozzle 32 is selected by driving of the movable rod 34 and the pick-up member 36. The movable rod 34 installed in the vertical direction can linearly reciprocate along the scan direction by a driving unit (not shown), and can also move in the vertical direction. The pick-up member 36 connected to the upper end of the moving rod 34 in the horizontal direction moves up and down by the vertical movement of the moving rod 34, and the pick-up member 36 moves the selected chemical liquid supply nozzle 32. Pick up. The moving rod 34 moves along the scanning direction while the chemical liquid supply nozzle 32 is picked up by the pickup member 36, and the chemical liquid supply nozzle 32 supplies the chemical liquid onto the substrate. At this time, the substrate placed on the substrate support unit 10 is rotated by the rotation of the substrate support unit 10.

The second processing fluid supply member 40 rotates in a boom swing manner and supplies rinse liquid or dry gas onto the substrate. Ultra rinse water (DIW: Deionized Water) may be used as the rinse liquid, and isopropyl alcohol gas (IPA: Isopropyl alcohol gas) may be used as the dry gas. The second processing fluid supply member 40 is disposed vertically and has a nozzle 42 for supplying a rinse liquid or a dry gas toward the substrate support unit 10. The nozzle 42 is connected to one end of the nozzle support 44, and the nozzle support 44 is disposed in the horizontal direction to maintain a right angle with the nozzle 42. The other end of the nozzle support 44 is disposed in the vertical direction to maintain a right angle with the nozzle support 44, the moving rod 46 for moving the nozzle 42 during or before the process is coupled. In addition, the moving rod 46 is connected to a driving unit (not shown). The driving unit (not shown) may be a motor for rotating the nozzle 42, and optionally, an assembly for linearly moving the nozzle 42 in the vertical direction.

The ultrasonic cleaning member 50 has a vibrator 52 for applying ultrasonic vibration to the chemical liquid supplied on the substrate W. As shown in FIG. The vibrator 52 is connected to one end of the support 54 arranged in the horizontal direction. The other end of the support 54 is disposed in the vertical direction to maintain a right angle with the support 54, the moving rod 56 for moving the vibrator 52 during or before or after the process is coupled. In addition, the moving rod 56 is connected to a driving unit (not shown). The driving unit (not shown) may be a motor for rotating the vibrator 52, and optionally an assembly for linearly moving the vibrator 52 in the vertical direction. The chemical liquid supplied on the substrate etches or peels off contaminants on the substrate, and at this time, ultrasonic vibration is applied to the chemical liquid by using the first processing fluid supply member 30. Ultrasonic vibration applied to the chemical liquid promotes chemical reaction of the chemical liquid and the contaminants on the substrate W, thereby improving the removal efficiency of the contaminants on the substrate W.

3 is a side cross-sectional view showing the structure of the substrate support unit 10 and the container 20 of FIG. 2 and the chemical liquid supply piping system.

2 and 3, the substrate support unit 10 is disposed in the inner space of the container 20. The substrate support unit 10 has a support plate 110. Pin members 112a and 112b supporting the substrate W are coupled to an upper surface of the support plate 110. The support pins 112a support the bottom surface of the substrate W, and the chucking pins 112b support the side surface of the substrate W.

The support plate 110 is rotated by the drive member 120. The driving member 120 includes a driving shaft 122 coupled to the lower surface of the support plate 110, and a driver 124 providing a driving force to the driving shaft 122. The driver 124 may be a motor that provides a rotational force to the driving shaft 122, and may optionally provide a driving force to linearly move the driving shaft 122 in the vertical direction. The driver 124 is supported by the frame 126.

The vessel 20 has a space in which the upper portion is opened and the substrate W is processed therein, and has a structure capable of separating and recovering the chemical liquids used in the process. This makes it possible to reuse the chemicals. The vessel 20 has a plurality of recovery bins 220, 240, 260. Each recovery container 220, 240, 260 recovers different types of treatment liquids from among treatment liquids used in the process. In this embodiment, the vessel 20 has three recovery bins. Each recovery container is referred to as an internal recovery container 220, an intermediate recovery container 240, and an external recovery container 260.

The inner recovery container 220 is provided in an annular ring shape surrounding the support plate 110, and the intermediate recovery container 240 is provided in an annular ring shape surrounding the internal recovery container 220, and the external recovery container 260 is provided. Is provided in an annular ring shape surrounding the intermediate recovery container 240. Each recovery bin 220, 240, 260 has inlets 227, 247, 267 in the vessel 20 that communicate with the space within the vessel. Each inlet 227, 247, 267 is provided in a ring shape around the support plate 110. Chemical liquids injected into the substrate W and used in the process are introduced into the recovery containers 220, 240, and 260 through the inlets 227, 247, and 267 by centrifugal force due to the rotation of the substrate W. FIG. The inlet port 267 of the outer container 260 is provided in the vertical upper portion of the inlet 247 of the intermediate container 240, the inlet 247 of the intermediate container 240 is the inlet of the internal container 220. 227 is provided at the vertical top.

The discharge pipe 225 is coupled to the bottom wall of the inner recovery container 220, the discharge pipe 245 is coupled to the bottom wall of the intermediate recovery container 240, and the discharge pipe 265 is connected to the bottom wall of the external recovery container 260. Is combined. The treatment liquid introduced through the inner recovery container 220, the intermediate recovery container 240, and the external recovery container 260 is discharged through the discharge pipes 225, 245, and 265 to a system for regenerating external chemical liquid. The exhaust pipe 263 is coupled to the bottom wall of the outer recovery container 260, and the gas introduced into the internal recovery container 220, the intermediate recovery container 240, and the external recovery container 260 is discharged through the exhaust pipe 263. Exhaust to the outside.

The lifting unit 280 linearly moves the container 20 in the vertical direction. As the container 20 is moved up and down, the relative height of the container 20 relative to the support plate 110 is changed. The elevating unit 280 has a bracket 282, a moving shaft 284, and a driver 286. The bracket 282 is fixedly installed on the outer wall of the container 20, and the bracket 282 is fixedly coupled to the moving shaft 284 moved in the vertical direction by the driver 286. When the substrate W is placed on the support plate 110 or lifted from the support plate 110, the container 20 is lowered so that the support plate 110 protrudes to the top of the container 20. In addition, when the process is in progress, the height of the container 20 is adjusted to allow the processing liquid to flow into the predetermined recovery containers 220, 240, and 260 according to the type of processing liquid supplied to the substrate W.

The chemical liquid supply nozzle 32 of the first processing fluid supply member 30 linearly reciprocates in a scan manner in the upper space of the substrate placed on the support plate 110, and supplies the chemical liquid to the substrate. The chemical liquid supply nozzle 32 is connected to the chemical liquid supply source 322 by the chemical liquid supply line 321. On the chemical liquid supply line 321, the pump 323, the filter 324, and the valve 325 are sequentially disposed in the direction of the chemical liquid supply nozzle 321 from the chemical liquid supply source 322. The valve 325 has a cut-off valve 325a and a suckback valve 325b. The chemical liquid supplied from the chemical liquid source 322 is pressurized by the pump 323, and the pressurized chemical liquid passes through the cut-off valve 325a and the seat back valve 325b through the filter 324, and then the chemical liquid supply nozzle ( Through 32). The cut-off valve 325a turns on / off the flow of the pressurized chemical liquid, and the seat back valve 325b has a predetermined amount of water present at the discharging port (not shown) end of the chemical liquid supply nozzle 32 after the chemical liquid is discharged. Inhalation and retraction of the chemical prevents the liquid from spilling.

The sensing member 400 detects whether the substrate is separated from the support plate 110 during the substrate processing process. The sensing member 400 includes a light emitting element 420, a light receiving element 440, and a light transmitting unit 460.

The light emitting device 420 is disposed above the support plate 110 and emits light toward the upper surface of the support plate 110. The light emitting device 420 may be provided perpendicular to the top surface of the support plate 110 so that light is emitted perpendicularly to the top surface of the support plate 110. The light emitting device 420 is connected to one end of the support 422, and the support 442 is disposed in a horizontal direction to maintain a right angle with the light emitting device 420. The other end of the support 442 is coupled to the vertical rod 424 disposed in the vertical direction to maintain a right angle with the support 442. The vertical rod 424 may be fixed and may also be rotated by the drive 426.

The light receiving element 440 is disposed under the support plate 110 and receives light. The light receiving element 440 may be provided in a direction perpendicular to the bottom surface of the support plate 110 so that the received light is perpendicular to the bottom surface of the support plate 110, and may be installed in the frame 126 supporting the driver 124. Can be.

The light transmitting unit 460 is installed on the support plate 110 and transmits the light emitted from the light emitting element 420 to the light receiving element 440. The light transmitting unit 460 is provided on the first light transmitting element 461 provided on the upper surface of the support plate 110 so as to face the light emitting element 420, and on the lower surface of the support plate 110 so as to face the light receiving element 440. Has a second light transmitting element 462. The first and second light transmitting elements 461 and 462 may be connected by the light moving module 463. The light transfer module 463 may be provided as an optical fiber and provide a light movement path between the first light transfer element 461 and the second light transfer element 462.

The first and second light transmitting elements 461 and 462 may be located on the same vertical line, or may be provided so as not to be located on the same vertical line, as shown in FIG. 3. If the first and second light transmitting elements 461 and 462 are provided so as not to be located on the same vertical line, the light emitting element 420 and the light receiving element 440 provided to face the first and second light transmitting elements 461 and 462 are also the same. It is not located on the vertical line.

The first light transmitting element 461 is inserted into the groove 110a formed on the upper surface of the support plate 110, and the second light transmitting element 462 is inserted into the groove 110b formed on the lower surface of the support plate 110. Can be. In addition, the grooves 110a and 100b into which the first and second light transmitting elements 461 and 462 are inserted may be sealed by covers 464 and 465 made of transparent corrosion resistant synthetic resin. The covers 464 and 465 prevent chemicals from penetrating into the first and second light transmitting elements 461 and 462 during the substrate processing process.

4 and 5 are views showing an operating state of the sensing member according to the presence or absence of a substrate. 4 and 5, the light emitting device 420 emits light toward the support plate 110. When the substrate W loaded on the support plate 110 is normally seated on the support plate 110, the light emitted from the light emitting element 420 is reflected by the substrate W as shown in FIG. 4. Therefore, light is not received by the light receiving element 440.

On the contrary, when the substrate W loaded on the support plate 110 is separated from the support plate 110, as shown in FIG. 5, the light emitted from the light emitting element 420 is first passed through the cover 464. Incident on the light transmitting element 461. The incident light into the first light transmitting element 461 is transmitted to the second light transmitting element 462 by the light transfer module 463. Light transmitted to the second light transmitting element 462 is transmitted to the light receiving element 440 through the cover 465. When light is transmitted to the light receiving element 440, the controller (not shown) may determine that the substrate W is separated from the support plate 110, and generate an alarm.

The process of detecting the departure of the substrate will be described in more detail as follows. The light emitting device 420 continuously emits light toward the support plate 110, and the support plate 110 is rotated. When the supporting plate 110 is rotated, as shown in FIG. 6, the first and second light transmitting elements 461 and 462 provided on the supporting plate 110 rotate, and the first and second light transmitting elements 461 and 462 are rotated. After rotating 360 degrees, the process of returning to the original position is repeated. The first and second light transmitting elements 461 and 462 periodically receive light emitted from the light emitting element 420 while passing through positions facing the light emitting element 420 and the light receiving element 440 while being rotated. To pass). If the period of light transmission to the light receiving element 440 (the number of light receptions per unit time) is the same as the rotation period (the number of revolutions per unit time) of the support plate 110, the controller (not shown) indicates that the substrate is separated from the support plate 110. Judgment, and may generate an alarm, and at the same time can stop the operation of the driver 124 to rotate the support plate 110.

By such a method, it is possible to check whether the substrate is separated from the supporting plate 110 which rotates during the process, thereby preventing damage to peripheral devices such as the supporting plate 110 or the container 20 by the separated substrate. Can be.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the invention.

1 shows the layout of a sheet type substrate cleaning facility.

FIG. 2 is a perspective view illustrating an internal configuration of the process chamber of FIG. 1.

3 is a side cross-sectional view showing the structure of the substrate supporting unit and the container of FIG. 2 and the chemical liquid supply piping system.

4 and 5 are views showing an operating state of the sensing member according to the presence or absence of a substrate.

6 is a plan view of FIG. 5.

<Description of Symbols for Main Parts of Drawings>

110: support plate 400: sensing member

420: light emitting element 440: light receiving element

460: light transmission unit 461, 462: light transmission element

463: light transfer module 464,465: cover

Claims (19)

Chuck pins supporting the side of the substrate are coupled to the upper surface, the support plate being rotatable; And It includes a sensing member for detecting whether the substrate is separated from the chuck pins, The sensing member, A light emitting device disposed on the support plate and emitting light; A light receiving element disposed below the support plate so as to be spaced apart from the support plate and receiving light; And A first light transmitting element inserted into a groove formed in an upper surface of the support plate to face the light emitting element, a second light transmitting element inserted into a groove formed in a lower surface of the support plate so as to face the light receiving element, and the first light transmitting element And a light moving module disposed inside the support plate to provide an optical path between the second light transmitting element, and covers for sealing the groove formed on the upper surface of the support plate and the groove formed on the lower surface of the support plate. And a transfer unit. delete The method of claim 1, And the light emitting element is provided in a direction perpendicular to the upper surface of the support plate such that the emitted light is perpendicular to the upper surface of the support plate. The method of claim 3, wherein And the light receiving element is provided in a direction perpendicular to the lower surface of the support plate such that the light received is perpendicular to the lower surface of the support plate. The method of claim 4, wherein And the light emitting element and the light receiving element are provided so as not to be positioned on the same vertical line. The method of claim 1, And the optical transfer module is an optical fiber. The method of claim 1, The cover is a substrate support unit, characterized in that provided with a transparent corrosion-resistant synthetic resin material. A substrate support unit for supporting a substrate; A processing fluid supply unit configured to process the substrate by supplying a processing fluid to the substrate supported by the substrate support unit; And A container provided to surround the substrate support unit, the container for recovering the processing fluid used for processing the substrate, The substrate support unit, A support plate rotatably coupled to the upper surface of the chuck pins for supporting the side of the substrate; A light emitting device disposed on the support plate and emitting light; A light receiving element disposed under the support plate and receiving light; And A first light transmitting element inserted into a groove formed in an upper surface of the support plate to face the light emitting element, a second light transmitting element inserted into a groove formed in a lower surface of the support plate so as to face the light receiving element, and the first light transmitting element And a light moving module disposed inside the support plate to provide an optical path between the second light transmitting element, and covers for sealing the groove formed on the upper surface of the support plate and the groove formed on the lower surface of the support plate. Substrate processing apparatus comprising a transfer unit. delete The method of claim 8, The light emitting device is provided in a direction perpendicular to the upper surface of the support plate so that the emitted light is perpendicular to the upper surface of the support plate, And the light receiving element is provided in a direction perpendicular to the lower surface of the support plate such that the light received is perpendicular to the lower surface of the support plate. The method of claim 10, And the light emitting element and the light receiving element are provided so as not to be positioned on the same vertical line. The method of claim 8, And the optical transfer module is an optical fiber. The method of claim 8, The cover is a substrate processing apparatus, characterized in that provided with a transparent corrosion-resistant synthetic resin material. In the method of processing a substrate using the substrate processing apparatus of claim 8, The chuck pins supporting a side of the substrate; Treating the substrate by supplying the processing fluid to the substrate while the processing fluid supply unit rotates the substrate by the rotation of the support plate; And Detecting whether the substrate is separated from the chuck pins during the substrate processing process, Detecting the departure of the substrate, Emitting light toward the support plate on which the light emitting element is rotated; And And determining that the substrate is separated when the light emitted from the light emitting element is transferred to the light receiving element through the light transmitting unit. delete delete The method of claim 14, The light emitting device continuously emits light, And the first and second light transmitting elements transmit the light to the light receiving element while passing through the position facing the light emitting element and the light receiving element periodically by the rotation of the support plate. The method of claim 17, And generating an alarm if the number of times of light transmission to the light receiving element per unit time is equal to the number of rotations of the support plate per unit time. The method of claim 8, A horizontal support having one end of the light emitting device coupled thereto; A vertical rod disposed outside the container and coupled to the other end of the horizontal support so as to be perpendicular to the horizontal support; And Further comprising a drive for rotating the vertical rod, And the light emitting element is moved between an outer side of the container and an upper portion of the support plate inside the container by the rotation of the vertical rod and the horizontal support by the driving unit.

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