CN212696256U - Wafer static electricity removing and cleaning device - Google Patents
Wafer static electricity removing and cleaning device Download PDFInfo
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- CN212696256U CN212696256U CN202022138485.4U CN202022138485U CN212696256U CN 212696256 U CN212696256 U CN 212696256U CN 202022138485 U CN202022138485 U CN 202022138485U CN 212696256 U CN212696256 U CN 212696256U
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Abstract
The utility model relates to a wafer removes static and belt cleaning device, the static eliminator transmission positive and negative ion wind is in order to get rid of the static on the wafer that is located the washing tank, drives the wafer swing through the swing of wafer box support frame, makes the clearance of wafer can receive the positive and negative ion wind of static eliminator spun with different angles for more positive and negative ion wind can get into the wafer clearance and can reach the problem that is closer to the wafer bottom, thereby has improved the static effect of removing to whole wafer. The function of removing static electricity in the cleaning tank is realized.
Description
Technical Field
The application belongs to the technical field of static electricity removal and cleaning of wafers, and particularly relates to a static electricity removal and cleaning device for a wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer manufacturing process is complicated and has many steps, and different chemical materials are used in different steps, and impurities such as chemicals, particles, metals, and the like usually remain on the surface of the wafer, so that the wafer needs to be cleaned. During the wafer transportation process, for the convenience of transportation, several tens of wafers are usually placed together in a wafer cassette.
In many cases, it is necessary to process wafers in a wafer box, for example, to perform static electricity removal and cleaning operations, and since the wafers are relatively dense in the wafer box and the gap is about 1cm, how to improve the static electricity removal and cleaning effects is a technical problem that needs to be solved urgently in the field.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: in order to solve the defects in the prior art, the wafer static electricity removing and cleaning device with good static electricity removing and cleaning effects is provided.
The utility model provides a technical scheme that its technical problem adopted is:
a wafer destaticizing and cleaning apparatus comprising:
a housing;
a cleaning tank arranged in the housing;
the cover body is arranged above the cleaning tank and can rotate under the driving of the driving part to cover the top end of the cleaning tank;
the wafer box supporting frame is used for placing the wafer box;
the swinging lifting component is used for driving the wafer box supporting frame to lift and swing;
and the static eliminator is arranged at two sides above the cleaning tank and used for emitting positive and negative ion wind to eliminate static on the wafer.
Preferably, the wafer static electricity removing and cleaning device of the utility model,
the swing angle of the wafer box support frame is 20-25 degrees.
Preferably, the utility model discloses a wafer destatics and belt cleaning device, be provided with the water jet on the lid, work as when the lid was covered on the washing tank, through water jet blowout water or washing liquid.
Preferably, the utility model discloses a wafer removes static and belt cleaning device, be provided with the air jet on the lid, finish when the wafer washing, and water or washing liquid evacuation back in the washing tank, by the air jet blowout gas in order to carry out the drying to the wafer.
Preferably, the utility model discloses a wafer destatics and belt cleaning device, the washing tank bottom is provided with the suction opening, and the electrostatic eliminator during operation, suction opening begin convulsions.
Preferably, the utility model discloses a wafer removes static and belt cleaning device, the washing tank side still is provided with the suction opening, and the suction opening sets up the minimum when highly being less than the wafer and being located the washing tank.
Preferably, the utility model discloses a wafer destatics and belt cleaning device, the purge tank bottom is the high inclined plane in middle end both sides, and the inclination on inclined plane is 20-40, and the suction opening sets up along the inclined plane.
The utility model has the advantages that:
the utility model discloses a wafer removes static and belt cleaning device, and static eliminator transmission positive and negative ion wind drives the wafer swing in order to get rid of the static on the wafer that is located the washing tank through the swing of wafer box support frame, makes the clearance of wafer can receive static eliminator spun positive and negative ion wind with different angles for more positive and negative ion wind can get into the wafer clearance and can reach the problem that is closer to the wafer bottom, thereby has improved the static effect that removes to whole wafer. The function of removing static electricity in the cleaning tank is realized.
Drawings
The technical solution of the present application is further explained below with reference to the drawings and the embodiments.
FIG. 1 is a front cross-sectional view of a wafer destaticizing and cleaning apparatus according to an embodiment of the present application;
FIG. 2 is a side cross-sectional view of a wafer destaticizing and cleaning apparatus according to an embodiment of the present application;
fig. 3 is a diagram illustrating a state where a wafer according to an embodiment of the present invention is located in a cleaning tank (arrows indicate a pumping direction).
The reference numbers in the figures are:
1, a shell;
2, cleaning a tank;
3, covering the cover body;
4, a wafer box support frame;
5 swinging the lifting component;
6 a static eliminator;
9 wafer box.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.
The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Examples
The present embodiment provides a wafer destaticizing and cleaning apparatus, as shown in figure 1,
the device comprises a function of removing static electricity from the wafer and then cleaning the wafer with water/cleaning solution,
the method comprises the following steps:
a housing 1;
a cleaning tank 2 arranged in the housing 1;
the cover body 3 is arranged above the cleaning tank 2 and can rotate under the driving of the driving part to cover the top end of the cleaning tank 2;
the wafer box support frame 4 is used for placing a wafer box 9;
a swing elevating assembly 5 for driving the wafer cassette support frame 4 to ascend and descend and swing (swing in a direction perpendicular to fig. 1);
and the static eliminator 6 is arranged at two sides above the cleaning tank 2 and is used for emitting positive and negative ion wind to eliminate static on the wafer.
The wafer removes static and belt cleaning device, and the static eliminator launches positive and negative ion wind in order to get rid of the static on the wafer that is located the washing tank, drives the wafer swing through the swing of wafer box support frame, makes the clearance of wafer can receive the positive and negative ion wind of static eliminator spun with different angles for more positive and negative ion wind can get into the wafer clearance and can reach the problem that is closer to the wafer bottom, thereby has improved the static effect that removes to whole wafer. The function of removing static electricity in the cleaning tank is realized.
The swing lifting assembly 5 generally realizes a lifting function by a sliding rail, a sliding block and a driving piece, and realizes a swinging function by a rotating shaft and a sector gear.
Further, the swing angle of the wafer cassette holder 4 is 20 ° to 25 °.
Furthermore, the lid 3 is provided with a water jet, and when the lid 3 is covered on the cleaning tank 2, water or cleaning liquid is jetted through the water jet, which is equivalent to rinsing the wafer.
Further, an air suction opening is formed in the bottom of the cleaning tank 2, and when the static eliminator 6 works, the air suction opening starts to suck air to enable the cleaning tank 2 to form turbulent flow, so that static electricity can be eliminated in all areas of the wafer in the cleaning tank 2.
Furthermore, the bottom of the cleaning tank 2 is an inclined plane with a middle bottom and two high sides, the inclination angle of the inclined plane is 20-40 degrees, and the air suction opening is arranged along the inclined plane.
The wafer box 9 is used for accommodating wafers, and the bottom of the wafer box 9 is hollowed.
The structure of the cleaning tank 2 with overflow trough, water inlet pipe, water outlet pipe, etc. is a common structure of the cleaning tank 2, and is not described herein again.
As shown in fig. 3, the range of direct contact of the electrostatic eliminator 6 emitting positive and negative ion wind on the outer surface facing the wafer is: the center of the positive and negative ion wind is positioned at the highest point of the wafer, and the included angle alpha between the straight line from the lowest point to the center of the wafer when the positive and negative ion wind directly contacts the wafer and the straight line from the highest point to the center of the wafer is 45-60 degrees.
As shown in fig. 2, with two cassettes, wafers in the two cassettes can be processed simultaneously.
The wafer static electricity removing and cleaning method comprises the following steps:
the cover body 3 is opened, the swing lifting component 5 is lifted to the highest end, the wafer box is arranged on the wafer box supporting frame 4, the swing lifting component 5 is descended into the cleaning tank 2, the static eliminator 6 is started to drive the wafer box supporting frame 4 to swing, meanwhile, the air suction opening arranged at the bottom or on the side wall of the cleaning tank 2 starts air suction, after the static electricity is removed, closing the air suction opening and the electrostatic eliminator 6, stopping swinging the wafer box support frame 4, covering the cover body 3, injecting water or cleaning solution into the cleaning groove 2, continuously injecting water into the wafer before the wafer is immersed by the water or the cleaning solution in the cleaning groove 2 through the water injection opening on the cover body, after the wafer is cleaned, the water or cleaning liquid in the cleaning tank 2 is emptied, the gas (such as nitrogen) sprayed from the gas nozzle arranged on the cover body (3) is used for drying the wafer, if necessary, hot air can be sprayed to accelerate the drying process, and the cover 3 is opened to take out the wafer after the wafer is dried.
The wafers are placed in the wafer box 9 in a row, because the static electricity eliminator 6 can only be arranged outside the cleaning tank 2, the static electricity on the wafers can not be completely eliminated easily by the wafer in a row, therefore, the wafer needs to be driven to swing by the wafer box supporting frame 4, the gap of the wafer can receive positive and negative ion wind sprayed by the static electricity eliminator 6 at different angles, meanwhile, an air suction opening is arranged at the bottom of the cleaning tank 2, the positive and negative ion wind can reach the bottom of the wafer more smoothly, and finally the whole wafer is contacted by the positive and negative ion wind and is eliminated.
In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. A wafer destaticizing and cleaning apparatus, comprising:
a housing (1);
a cleaning tank (2) arranged in the shell (1);
the cover body (3) is arranged above the cleaning tank (2), can rotate under the driving of the driving part and is attached to the top end of the cleaning tank (2);
the wafer box support frame (4) is used for placing a wafer box (9);
the swinging lifting component (5) is used for driving the wafer box support frame (4) to lift and swing;
and the static eliminator (6) is arranged at two sides above the cleaning tank (2) and is used for emitting positive and negative ion wind to eliminate static on the wafer.
2. The wafer destaticizing and cleaning apparatus as recited in claim 1,
the swing angle of the wafer box support frame (4) is 20-25 degrees.
3. The wafer destaticizing and cleaning device according to claim 1, wherein a water jet is provided on the cover body (3) and water or a cleaning solution is jetted through the water jet when the cover body (3) is covered on the cleaning tank (2).
4. The wafer static electricity removing and cleaning device according to claim 3, characterized in that the cover body (3) is provided with a gas nozzle, and when the wafer is cleaned and the water or cleaning solution in the cleaning tank (2) is emptied, gas is ejected from the gas nozzle to dry the wafer.
5. The wafer static electricity removing and cleaning device as claimed in claim 1, wherein an air suction opening is arranged at the bottom of the cleaning tank (2), and when the static electricity eliminator (6) works, the air suction opening starts to suck air.
6. The wafer destaticizing and cleaning device according to claim 5, wherein the side surface of the cleaning tank (2) is further provided with an air suction opening, and the air suction opening is arranged at a height lower than the lowest point of the wafer when the wafer is positioned in the cleaning tank.
7. The wafer destaticizing and cleaning device according to claim 1, wherein the bottom of the cleaning tank (2) is a slope with a middle bottom and two high sides, the slope has an inclination angle of 20-40 degrees, and the suction opening is arranged along the slope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022138485.4U CN212696256U (en) | 2020-09-26 | 2020-09-26 | Wafer static electricity removing and cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022138485.4U CN212696256U (en) | 2020-09-26 | 2020-09-26 | Wafer static electricity removing and cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212696256U true CN212696256U (en) | 2021-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022138485.4U Active CN212696256U (en) | 2020-09-26 | 2020-09-26 | Wafer static electricity removing and cleaning device |
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| CN (1) | CN212696256U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115025831A (en) * | 2022-06-20 | 2022-09-09 | 刘晓羽 | Electrostatic protection device for electricity test |
| CN118976748A (en) * | 2024-10-14 | 2024-11-19 | 青岛中油岩土工程有限公司 | Automatic processing device for geotechnical survey sampling drill bit and use method thereof |
-
2020
- 2020-09-26 CN CN202022138485.4U patent/CN212696256U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115025831A (en) * | 2022-06-20 | 2022-09-09 | 刘晓羽 | Electrostatic protection device for electricity test |
| CN115025831B (en) * | 2022-06-20 | 2023-10-20 | 国网新疆电力有限公司奎屯供电公司 | An electrostatic protection device for electrical testing |
| CN118976748A (en) * | 2024-10-14 | 2024-11-19 | 青岛中油岩土工程有限公司 | Automatic processing device for geotechnical survey sampling drill bit and use method thereof |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225300 No.199, Keji Road, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |