KR100978521B1 - Touch screen panel - Google Patents

Abstract

The present invention is a paste (liquid silicon, insulating ink, etc.), metal foil, paper between the OPC layer and the window film layer in the bonding part region where the FPCB and the silver pattern electrode contact each other. By laminating non-adhesive materials such as PE / PET film or single-sided tape, the curvature of the bonding part is not transferred to the window film layer, so that the surface of the window film layer is not raised or settled. The present invention relates to a touch screen panel characterized by being able to expand its application to various kinds of electronic devices by fundamentally solving a poor appearance of electronic products to which the touch screen panel is applied.

Touch Screen Panel, TSP, Touch Screen Panel, Non-adhesive Material, Liquid Silicone, Insulation Ink, Paper, Metal Foil, Single Side Tape, Bonding Part, Bonding Bending

Description

Touch screen panel {Touchscreen panel}

The present invention relates to a touch screen panel, and more particularly, to a paste between the surfaces of the OCA layer and the window film layer in the bonding part region where the flexible printed circuit board (FPCB) and the silver pattern electrode contact each other. Non-adhesive materials such as liquid silicon, insulating ink, etc.), metal foil, paper, PE / PET film or single-sided tape are laminated so that the bending generated in the bonding portion does not transfer to the window film layer, thereby It relates to a touch screen panel characterized in that the rise and settling phenomenon does not occur.

Touch Screen Panel, an industry that is growing rapidly in recent years, is a new input method that can replace the input method such as a mouse or a keyboard, and the user directly touches the desired information on the screen using his / her fingers while looking at the screen. It is a new input method that can be input. Therefore, it can be easily operated by anyone, so it is evaluated as the most ideal input method under the GUI (Graphical User Interface) environment.Currently, mobile phones, navigation, PMPs, bank teller machines, civil documents issuers, various tourism and major institutions It is widely used in many fields such as guide equipment.

The touchscreen panel has grown rapidly in size as Apple's iPhone began to adopt capacitive touchscreen panels in mobile phones. Especially, from the beginning of this year, more mobile phone manufacturers applied touchscreen panels. As various new mobile phones are provided to consumers, various touch screen panels have been developed and patented and registered.

In addition, electronic products and devices to which the touch screen panel is applied are expensive products, and in order to satisfy consumer's needs, the device should have excellent performance and no defects in appearance. In other words, expensive electronic products and devices may suffer huge losses due to minor defects from customers due to minor defects in appearance.

Meanwhile, referring to the structure of a typical mobile phone as an electronic product to which a touch screen panel is applied, as shown in FIG. 1, the main body 510, the flip cover 520, and the main body 510 and the flip cover 520 are mechanically machined. In the flip-type mobile phone consisting of a hinge device for connecting the main body, the main PC board 512 is attached to the main body 510 mounted therein and placed on the LCD module for inputting various letters or numbers, Signal is transmitted to the board using the flexible printed circuit (526, FPCB), characterized in that the touch screen panel unit 522 is provided with a touch screen panel 524 is installed so that the surface is exposed from the flip The flip-type mobile phone 500 is provided with a touch screen panel is the main.

The mobile phone to which the touch screen panel having the above structure is applied has an ITO in which a plastic PC substrate 20, a lower OCA layer 30, and a flexible circuit board 50 are inserted and compressed as shown in FIGS. The film layer 40, the upper OCA layer 60 and the window film layer 70 is laminated in a structure. In the conventional touch screen panel 10, as shown in FIGS. 3 and 4, the flexible circuit board 50 is inserted between the lower ITO film layer 42 and the upper ITO film layer 46. The lower silver patternon electrodes 44 and 48 are connected to each other and then subjected to a bonding process by applying a pressure of 10 seconds or more using a high temperature of 150 ° C. and a strong pressure of 2 MPa.

In this case, as shown in FIGS. 5 to 6B, the anisotropic conductive film (ACF) (see FIG. 6B) and the silver patternon electrodes 44 and 48 adhered to the upper and lower ends of the flexible circuit board 50 are subjected to high temperature and high pressure. Although bonded in a state, a thickness difference with other parts occurs in the bonding part 41, which is a part in which the electrode part of the flexible circuit board 50 is fused. In addition, such a thickness difference of the bonding part 41 is transferred to the ITO film layers 42 and 46, and a bending phenomenon occurs outside the upper and lower ITO films. That is, due to the bonding part 41 to which the flexible circuit board 50 and the silver patternon electrodes 44 and 48 are bonded in the process, the ITO film layer 46 is shown in FIG. 6B. Bending occurs outside, and bending is transferred to the window film layer 70 bonded by the upper OCA layer 60, so that bumps and settles 72 such as fine teeth marks on the outside of the window film layer 70 are formed. The phenomenon that protrudes to the outside will occur.

The window film layer 70 of the raised and settled portion 72 as the raised and settled portion 72 is easily worn by the force applied from the outside when the mobile phone to which the touch screen panel is applied is used for a long time. As the color fades and damages the appearance of the touch screen panel, there are problems of losing the value of expensive electronic products, but in the related industry, only research and development on the functionality of the touch screen panel is actively progressed. The technology to improve the situation is not yet properly developed.

Therefore, in order to improve the above problems, the present invention provides a paste between the OCA layer and the window film layer of the bonding part region where the flexible printed circuit board (FPCB) and the silver pattern electrode are in contact with each other. (Liquid silicon, insulating ink, etc.), metal foil, paper, non-adhesive materials such as PE / PET films or single-sided tapes are laminated so that bending generated in the bonding portion does not transfer to the window film layer. It is an object of the present invention to provide a touch screen panel which is characterized in that no rise or settling phenomenon occurs on the outer surface.

The present invention for achieving the above object is a plastic PC substrate 20, lower OCA layer 30, lower ITO film layer 42, flexible circuit board 50, upper ITO film layer 46, upper part from the bottom In the touch screen panel having a structure in which the OCA layer 60 and the window film layer 70 are laminated,

Between the upper OCA layer 60 and the window film layer 70 in the bonding part 41 region where the flexible circuit board 50 is inserted and bonded between the upper and lower ITO film layers 42 and 46. A touch screen panel characterized by laminating a non-adhesive material 62 having a bonding area area size is a problem solving means.

And the present invention from the bottom of the plastic PC substrate 20, lower OCA layer 30, lower ITO film layer 42, flexible circuit board 50, upper ITO film layer 46, upper OCA layer 60 and In the touch screen panel having a structure in which the window film layer 70 is laminated,

Area size of the upper OCA layer 60 of the bonding part 41 to which the flexible circuit board 50 is inserted and bonded between the upper and lower ITO film layers 42 and 46. Another problem solving means is a touch screen panel characterized in that the non-adhesive material 62 is filled in the space 61 cut into the.

According to the present invention by the above problem solving means, in the touch screen panel, the bending caused in the bonding part 41 region in which the flexible printed circuit board (FPCB) is inserted and bonded between the ITO film layer is not transferred to the window film layer. By making the outer surface of the window film layer smooth so as to solve the appearance defects of the electronic products to which the touch screen panel according to the present invention is fundamentally solved, its application can be expanded to various kinds of electronic devices. It is expected to expand further.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, Figs. 7 to 10c, the same reference numerals are denoted for the components performing the same function. Meanwhile, in the drawings and the detailed description, the illustration and the description about the construction and the operation which can be easily understood by those skilled in the art from the general touch screen panel are briefly or omitted. In particular, in the drawings and detailed description of the drawings, detailed descriptions and illustrations of specific technical configurations and operations of elements not directly related to technical features of the present invention will be omitted, and only the technical configurations related to the present invention will be briefly shown. Explained. In addition, although the size ratio between elements is somewhat different in the drawings of the drawings, or the size between the parts that are coupled to each other is expressed differently, the representation differences in such drawings are easily understood by those skilled in the art. The descriptions are omitted since they are possible parts.

In addition, the present invention should be understood that the term 'ITO film layer' and 'window film layer' among the terms used in the description can be used interchangeably as 'ITO film' and 'window film' in the context flow before and after the sentence. .

In the present invention, Figure 7 is a cross-sectional view for explaining the cross-sectional view of the laminated structure of the touch screen panel (TSP) according to a preferred embodiment of the present invention, Figures 8a to 8c is a touch screen panel (TSP) stacked form of Figure 7 It relates to a perspective view showing a process of being stacked to explain, and in the present invention Figure 9 relates to a cross-sectional view for explaining the cross-section of the laminated structure of the touch screen panel (TSP) according to another embodiment of the present invention, 10A to 10C relate to perspective views illustrating a process of stacking to describe the touch screen panel (TSP) stacking form of FIG. 9.

The present invention provides a PC substrate 20, a lower OCA layer 30, a lower ITO film layer 42, a flexible circuit board 50, an upper ITO film layer 46, an upper OCA layer 60 and a window film from the bottom. In the touch screen panel having a structure in which the layers 70 are stacked, the upper OCA layer 60 in the bonding part 41 region where the flexible circuit board 50 and the silver pattern electrodes 44 and 48 are in contact with each other; The bonding part 41 is laminated by laminating non-adhesive materials such as pastes (liquid silicon, insulating ink, etc.), metal foil, paper, PE / PET film, or single-sided tape between the surfaces of the window film layer 70 in contact with each other. The curvature generated in the) is not transferred to the window film layer 70, so that bumps and sedimentation do not occur on the outer surface of the window film layer so as to fundamentally solve the appearance defect of the touch screen panel. to be.

In the present invention, the upper and lower OCA layers 30 and 60 are respectively formed of the upper and lower ITO film layers 42 and 46, the plastic PC substrate 20, and the window film layer using optical clean adhesive (OCA). It consists of a layer for adhering 70.

In addition, the ITO film layer 40 is a layer coated with indium tin oxide on the film. When an external pressure is applied on the touch screen, the upper and lower ITO film layers 42 and 46 come into contact with each other as electrical signals. It plays a role.

In addition, in the present invention, the flexible circuit board 50 is an anisotropic conductive film (ACF) adhered to the upper and lower ends of the flexible circuit board 50 at portions connected to the upper and lower silver pattern electrodes 44 and 48. The conductive balls contained in (not shown in the figure) are blown by the pressure, and a current flows between the flexible circuit board 50 and the silver patternon electrodes 44 and 48. Since it is not a feature of the invention, a description thereof will be omitted here.

In the present invention, the electrode portion thickness of the flexible circuit board 50 is preferably 70 ± 5 μm, and the thickness of the silver patternon electrodes 44 and 48 is preferably 10 μm to 15 μm, and the thickness of the anisotropic conductive film (ACF) Use a thickness of 25 ± 3㎛. Among these elements, the terminal part of the flexible circuit board 50 and the silver patterns 44 and 48 are positioned at the same position, and a thickness difference occurs at the terminal part and the other part. Transfer to ITO film causes bending.

And the present invention will be described in detail with reference to Figures 7 and 8a to 8c of the accompanying drawings, a plastic PC substrate 20, lower OCA layer 30, lower ITO film layer 42 from the bottom In the touch screen panel having a structure in which the flexible circuit board 50, the upper ITO film layer 46, the upper OCA layer 60 and the window film layer 70 are laminated,

Between the upper OCA layer 60 and the window film layer 70 of the bonding part 41 region where the flexible circuit board 50 is inserted and bonded between the upper and lower ITO film layers 42 and 46. The touch screen panel is characterized in that the non-adhesive material 62 having a bonding area area of the bonding part is laminated.

In addition, the present invention will be described in detail with reference to Figures 9 and 10a to 10c attached to another preferred embodiment, from the bottom of the plastic PC substrate 20, the bottom OCA layer 30, the bottom ITO film layer 42 In the touch screen panel having a structure in which the flexible circuit board 50, the upper ITO film layer 46, the upper OCA layer 60, and the window film layer 70 are laminated,

Area size of the upper OCA layer 60 of the bonding part 41 to which the flexible circuit board 50 is inserted and bonded between the upper and lower ITO film layers 42 and 46. It relates to a touch screen panel characterized in that the non-adhesive material 62 is filled in the space 61 cut into the.

In the present invention, the non-adhesive material 62 has a bonding portion 41 region where the flexible circuit board 50 and the silver patternon electrodes 44 and 48 are bonded to each other, as shown in FIG. 4. When the ITO films 46 and 42 are bonded to the outside (40), the curvature generated outside the upper ITO film layer 46 is transferred to the window film layer 70 in the state in which the bumps and settled 41 are present outside thereof. As shown in FIGS. 5 and 6, the upper ITO film layer 46 is a window film to prevent the formation of bumps and sediment 72 such as fine teeth marks on the outside of the window film layer 70. It is used to prevent adhesion to the layer 70 so that internal bending does not transfer to the outside.

In the present invention, the non-adhesive material does not have an adhesive ability because the non-adhesive material itself does not have an adhesive ability with other materials, but when the non-adhesive material is bonded with another material having adhesive performance, the non-adhesive material has an adhesive ability. It means a material that is bonded to other materials.

The non-adhesive material 62 usable in the present invention is used by selecting one of non-adhesive materials such as pastes (liquid silicon, insulating ink, etc.), metal foil, paper, PE / PET film or single-sided tape. It is desirable to.

In the case of using the liquid silicone in the present invention, if the coating area as much as the bonding part 41, the oil component of the liquid silicone reduces the adhesion of the OCA serves to relieve the bending of the window film layer.

In the case of using a paper or metal foil as a preferred embodiment of the present invention, after pressing for 10 seconds or more using a high temperature of 150 and a strong pressure of 2 MPa, a non-adhesive material such as paper or metal foil ( 62 is cut by the bonding part 41 area and laminated on the upper OCA 60 layer, and then bonded to the window film 70 so that the surface of the paper or metal foil contacting the OCA 60 layer is OCA. The surface of the paper or metal foil adhered to the layer and in contact with the window film layer 70 is not bonded to the window film layer 70 so as to mitigate the bending of the window film layer as shown in FIG. 8C.

In addition, as another preferred embodiment of the present invention, as shown in FIG. 10A, the flexible printed circuit board bonding part 41 is pressed under the above conditions while the cutting space 61 is formed in the upper OCA layer 60. When the non-adhesive material 62 is filled in the previous incision space, the surface of the material filled in the incision space and the upper OCA layer 60 become flat, and the surface of the non-adhesive material 62 in contact with the OCA layer is The surface of the non-adhesive material 62 adhered to the OCA layer and in contact with the window film layer 70 is not bonded to the window film layer 70 to alleviate the bending of the window film layer as shown in FIG. 10C. It will play a role.

In the present invention, the paper or the metal foil does not matter in the case of a non-adhesive material.

In the present invention, the thickness of the non-adhesive material 62 is preferably 2.5 to 30 μm when laminated to the outside of the upper OCA layer 60, and the thickness of the non-adhesive material 62 is limited to the above. If less, the non-adhesive material 62 is damaged and the bending of the bonding portion 41 may be transferred to the window film layer. If the non-adhesive material 62 is exceeded, the window film may not be formed due to the thickness of the non-adhesive material. There is a fear that a ridge phenomenon may occur on the outer surface of the layer 70.

When the non-adhesive material 62 is filled in the cutout space 61 of the upper OCA layer 60, the non-adhesive material 62 is preferably set to the same thickness as the thickness of the OCA layer 60. If the thickness of the non-adhesive material 62 is less than the range defined above, the window film layer 70 may be depressed and appearance defects may occur. If the thickness of the non-adhesive material 62 is exceeded, the non-adhesive material may be Due to the thickness, there is a fear that a ridge phenomenon may occur on the outer surface of the window film layer 70.

Therefore, the touch screen panel according to the embodiment of the present invention is laminated or filled with a non-adhesive material in the bonding portion 41 region, such that the bending phenomenon of the bonding portion 41 region is the upper ITO film layer 46. Only the transition to the window film layer 70 is not transferred to the window film layer 70 so as to smooth the appearance of the defect does not occur.

As described above, the touch screen panel according to a preferred embodiment of the present invention has been shown in accordance with the above description and drawings, but this is merely described, for example, and various changes and modifications without departing from the technical spirit of the present invention. It will be appreciated by those skilled in the art that this is possible.

1 is a view for explaining a typical mobile phone to which a touch screen panel (TSP) is applied as an example;

2 is a perspective view showing an example of a conventional touch screen panel (TSP);

3 is a cross-sectional view showing a plane taken along line A-A of FIG. 2;

4 is an exploded perspective view of the touch screen panel TSP of FIG. 2;

5 is a view for explaining a problem of a conventional touch screen panel (TSP);

FIG. 6A is a cross-sectional view illustrating a plane taken along line BB ′ of FIG. 5;

FIG. 6B is a cross-sectional view illustrating a plane taken along line CC ′ in FIG. 5;

7 is a cross-sectional view for explaining a cross-section of a laminated structure of a touch screen panel (TSP) according to a preferred embodiment of the present invention;

8A to 8C are perspective views illustrating a lamination process to explain the touch screen panel (TSP) lamination form of FIG. 7;

9 is a cross-sectional view for explaining a cross-section of a laminated structure of a touch screen panel (TSP) according to another embodiment of the present invention;

10A to 10C are perspective views illustrating a lamination process to explain the touch screen panel (TSP) lamination form of FIG. 9;

Explanation of symbols on the main parts of the drawings

10: touch screen panel 20: PC board

30: lower OCA layer 40: ITO film layer

41: bonding portion 50: flexible printed circuit board (FPCB)

60: upper OCA layer 70: window film layer

Claims (5)

Plastic PC substrate 20, lower OCA layer 30, lower ITO film layer 42, flexible circuit board 50, upper ITO film layer 46, upper OCA layer 60 and window film layer (from below) In the touch screen panel consisting of a laminated structure 70, Between the upper OCA layer 60 and the window film layer 70 in the bonding part 41 region where the flexible circuit board 50 is inserted and bonded between the upper and lower ITO film layers 42 and 46. Bonding unit 41 Touch screen panel, characterized in that for stacking the non-adhesive material 62 of the area size. Plastic PC substrate 20, lower OCA layer 30, lower ITO film layer 42, flexible circuit board 50, upper ITO film layer 46, upper OCA layer 60 and window film layer (from below) In the touch screen panel consisting of a laminated structure 70, Area size of the upper OCA layer 60 of the bonding part 41 to which the flexible circuit board 50 is inserted and bonded between the upper and lower ITO film layers 42 and 46. Touch screen panel, characterized in that for filling the non-adhesive material 62 in the space 61 cut into. The method according to claim 1 or 2 The non-adhesive material 62 may be used by selecting one kind from a paste, such as liquid silicone, an insulating ink, metal foil, paper, film, and single-sided tape. Touch screen panel. The method of claim 1, The non-adhesive material 62 is a touch screen panel, characterized in that the thickness of 2.5 ~ 30㎛. 3. The method of claim 2, The non-adhesive material 62 has a thickness equal to that of the upper OCA layer 60.

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