CN107422904A - Touch-screen and electronic equipment - Google Patents
Touch-screen and electronic equipment Download PDFInfo
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- CN107422904A CN107422904A CN201710343504.7A CN201710343504A CN107422904A CN 107422904 A CN107422904 A CN 107422904A CN 201710343504 A CN201710343504 A CN 201710343504A CN 107422904 A CN107422904 A CN 107422904A
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- refractive index
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- 230000001939 inductive effect Effects 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- 239000010956 nickel silver Substances 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 18
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 5
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims 4
- 239000000853 adhesive Substances 0.000 abstract description 20
- 230000001070 adhesive effect Effects 0.000 abstract description 20
- 238000005530 etching Methods 0.000 abstract description 13
- 230000004075 alteration Effects 0.000 abstract description 6
- 230000009467 reduction Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 46
- 238000012360 testing method Methods 0.000 description 15
- 239000010409 thin film Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
This application provides a kind of touch-screen and electronic equipment.The touch-screen includes display screen, sense film and the cover plate set gradually, and sense film includes base material, inductive layer and frame wire, wherein, base material includes substrate with setting refractive index matching layers on the surface of the substrate, and the thickness of refractive index matching layers is 5~50nm;Inductive layer is arranged on the surface of remote substrate of refractive index matching layers;Frame wire is arranged on the surface of remote refractive index matching layers of inductive layer.The thickness of refractive index matching layers is arranged between 5~50nm, so that the roughness of base material is between 5~50nm, the roughness range can not only ensure there is stronger adhesive force between base material and structure sheaf thereon, when the frame wire in touch-screen includes copper film, larger roughness can also cause the reduction of copper film internal stress, and then make it that the adhesive force of copper film and inductive layer is larger, improve the yield of product;Also, the roughness range also ensures relatively low etching aberration.
Description
Technical field
The application is related to touch-screen field, in particular to a kind of touch-screen and electronic equipment.
Background technology
Touch-screen is widely used on the electronic products such as mobile phone, e-book, tablet personal computer and notebook computer, for sensing
The position and change of finger or stylus on screen, by position and action message and feed back to processor, wherein, capacitive touch
It is one kind the most frequently used in touch-screen to touch screen (abbreviation capacitance plate).
Capacitive touch screen be by the use of human body as conductor, when the finger of user is touched when on capacitive touch screen, by
In human body finger and capacitance touch screen surfaces formed with a coupled capacitor, (for high frequency electric, electric capacity can regard
For conductor), then the touch point of finger from capacitance touch screen surfaces siphons away the electric current of a very little, and this electric current is divided into four
Divide and flowed out from the electrode on the corner of capacitive touch screen.Flow through the distance of the electric current and finger to corner of this four electrodes
Directly proportional, the controller of touch-screen is accurately calculated this four current ratios, draws the position of touch point.
The structure of common capacitance plate is GF or GFF structures, and G represents glass cover-plate), F represents ito thin film (sense film, bag
Include frame wire), as shown in figure 1, GF structures include glass panel 01, (frame wire, shows not shown in figure with ito thin film 03
It is used for the OCA glue-lines 02 for bonding glass panel 01 and ito thin film 03), as shown in Fig. 2 GFF structures include a glass panel
01 and two ito thin films 03 (frame wire, shows the OCA for bonding glass panel 01 and ito thin film 03 not shown in figure
Glue-line 02).Forming the common technology of the frame wire of these capacitance plates has two kinds, and a kind of technique is printed at ito thin film edge
Silver paste, and signal path is formed by laser-induced thermal etching;Another kind is while ito thin film forming sputtering film, on ito thin film again
Coating copper film and/or Cu alloy-layers, the silver slurry layer of costliness is replaced with copper film and alloy-layer, reduce cost, and because copper film and conjunction
The resistivity of layer gold is lower, and wiring region area can be reduced, finally on the smart mobile phone or flat board of so-called " narrow frame ".
At present, some companies have pointed out the patent of invention based on ITO+ copper films, such as Publication No. CN103279250 and openly
Number be CN103345337 patent document.Using a critical defect of the product of these patents be the adhesive force of matrix compared with
Difference, causing the poor adhesive force of copper film subsequently set, (etching and fitting) copper film easily comes off in product actual production process,
Yield is caused to decline.The adhesive force that this is primarily due to matrix is poor so that in the market is inclined using the touch-screen price of narrow frame
Height, and hinder the product and promote on a large scale.
The content of the invention
The main purpose of the application is to provide a kind of touch-screen and electronic equipment, to solve matrix of the prior art
The problem of adhesive force is poor.
To achieve these goals, according to the one side of the application, there is provided a kind of touch-screen, the touch-screen include according to
Display screen, sense film and the cover plate of secondary setting, above-mentioned sense film include:Base material, including substrate is with being arranged on above-mentioned substrate surface
On refractive index matching layers, the thickness of above-mentioned refractive index matching layers is 5~50nm;Inductive layer, it is arranged on above-mentioned index matching
On the surface of the remote above-mentioned substrate of layer;Frame wire, it is arranged on the table of the remote above-mentioned refractive index matching layers of above-mentioned inductive layer
On face.
Further, the thickness of above-mentioned refractive index matching layers is 10~40nm, the thickness of preferably above-mentioned refractive index matching layers
For 30nm.
Further, above-mentioned frame wire includes:Layers of copper, it is arranged on the surface of the remote above-mentioned base material of above-mentioned inductive layer
On;Albata layer, it is arranged on the surface of remote above-mentioned inductive layer of above-mentioned layers of copper.
Further, in above-mentioned albata layer, the percentage by weight of nickel is 30~80%, the weight hundred of preferably above-mentioned nickel
Divide than being 60~80%, the percentage by weight of further preferred above-mentioned nickel is 70%.
Further, the thickness of above-mentioned layers of copper is 100~300nm.
Further, the thickness of above-mentioned albata layer is 10~50nm, and the thickness of preferably above-mentioned albata layer is 10
~30nm, the thickness of further preferred above-mentioned albata layer is 20nm.
Further, above-mentioned sense film includes two above-mentioned inductive layers and two above-mentioned frame wires, two above-mentioned sensings
Layer is separately positioned on two relative surfaces of above-mentioned base material, and an above-mentioned frame wire in two above-mentioned frame wires
It is disposed therein on the surface of the remote above-mentioned base material of an above-mentioned inductive layer, another above-mentioned frame wire is disposed therein separately
On the surface of the remote above-mentioned base material of one above-mentioned inductive layer.
Further, above-mentioned inductive layer is ITO layer.
Further, the thickness of above-mentioned ITO layer is 18~30nm.
According to the another aspect of the application, there is provided a kind of electronic equipment, including touch-screen, above-mentioned touch-screen are any
Above-mentioned touch-screen.
Using the technical scheme of the application, between the thickness of refractive index matching layers is arranged on into 5~50nm, due to substrate pair
The roughness of base material influences smaller, and then causes the roughness of base material the roughness range can not only be protected between 5~50nm
There is stronger adhesive force between card base material and structure sheaf thereon, it is larger when the frame wire in touch-screen includes copper film
Roughness can also cause the reduction of copper film internal stress, and then make it that the adhesive force of copper film and inductive layer is larger, improve product
Yield;Also, the roughness range also ensures relatively low etching aberration.
Brief description of the drawings
The Figure of description for forming the part of the application is used for providing further understanding of the present application, and the application's shows
Meaning property embodiment and its illustrate be used for explain the application, do not form the improper restriction to the application.In the accompanying drawings:
Fig. 1 shows a kind of structural representation of capacitive touch screen of the prior art;
Fig. 2 shows the structural representation of another capacitive touch screen of the prior art;
Fig. 3 shows the sense film structural representation for the touch-screen that a kind of embodiment of the application provides;
Fig. 4 shows the sense film structural representation for the touch-screen that another embodiment of the application provides;
Fig. 5 shows the structural representation for the touch-screen that the another embodiment of the application provides;And
Fig. 6 shows the structural representation for the touch-screen that the another embodiment of the application provides.
Wherein, above-mentioned accompanying drawing marks including the following drawings:
01st, glass panel;02nd, OCA glue-lines;03rd, ito thin film;1st, display screen;2nd, sense film;3rd, cover plate;10th, tack coat;
21st, base material;22nd, inductive layer;23rd, frame wire;211st, substrate;212nd, refractive index matching layers;231st, layers of copper;232nd, corronil
Layer.
Embodiment
It is noted that described further below is all exemplary, it is intended to provides further instruction to the application.It is unless another
Indicate, all technologies used herein and scientific terminology are with usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
Touch-screen of the prior art is all based on the base material of low roughness, is that surface roughness exists the characteristics of these base materials
Below 2nm;Low roughness advantageously reduces the thickness and resistance of inductive layer, and then advantageously reduces etching aberration (etching
Pattern).But the meeting of low roughness makes the adhesive force between base material and coating thereon be deteriorated, and easily comes off;This is lacked
The unobvious for common sense film are fallen into, but for the sense film including layers of copper, because layers of copper has very big internal stress in itself
(compressive stress), the adhesive force between other film layer entirety and the base material in sense film can be caused to be deteriorated, caused
During follow-up etching and fitting, layers of copper easily comes off, and the yield of touch-screen declines.In order to which the technology solved as above is asked
Topic, present applicant proposes a kind of touch-screen and electronic equipment.
In a kind of typical embodiment of the application, there is provided a kind of touch-screen, as shown in figure 5, the touch-screen includes
Display screen 1, sense film 2 and the cover plate 3 set gradually, also, as shown in figure 3, wherein, sense film 2 includes base material 21, inductive layer
22 with frame wire 23, wherein, base material 21 includes substrate 211 and the refractive index matching layers that are arranged on the above-mentioned surface of substrate 211
212, the thickness of above-mentioned refractive index matching layers 212 is between 5~50nm;Inductive layer 22 is arranged on above-mentioned refractive index matching layers 212
Remote above-mentioned substrate 211 surface on;Frame wire 23 is arranged on the remote above-mentioned refractive index matching layers of above-mentioned inductive layer 22
On 212 surface.
The thickness of refractive index matching layers is arranged between 5~50nm so that the roughness of base material between 5~50nm,
The roughness range can not only ensure there is stronger adhesive force between base material and structure sheaf thereon, when the side in touch-screen
When frame wire includes copper film, larger roughness can also cause the reduction of layers of copper internal stress, and then cause the attached of layers of copper and inductive layer
Put forth effort larger, improve the yield of product;Also, the roughness range also ensures that inductive layer has relatively low etching aberration.
In order to be further ensured that base material has appropriate roughness, and then it is further ensured that itself and the sense being disposed thereon
Answering between layer has larger adhesive force, and the adhesive force between copper film and sense film is larger, and ensures relatively low etching color simultaneously
Difference, in a kind of embodiment of the application, the thickness of above-mentioned refractive index matching layers 212 is between 10~40n1m.
In a kind of embodiment of the application, the thickness of above-mentioned refractive index matching layers 212 is 30nm, and the thickness is further ensured that
There is larger adhesive force between each layer, and ensure that there is relatively low etching aberration simultaneously.
In order to reduce the conductance of frame wire so that the area of frame wire further reduces, as shown in figure 4, this Shen
In a kind of embodiment please, above-mentioned frame wire 23 includes layers of copper 231 and albata layer 232, and layers of copper 231 is arranged on inductive layer
On the surface of 22 remote above-mentioned base material 21;Albata layer 232 is arranged on the remote above-mentioned inductive layer 22 of above-mentioned layers of copper 231
On surface.
In another embodiment of the application, in above-mentioned albata layer, the percentage by weight of nickel between 30~80%,
So that the needle pore defect of corronil layer surface is less, and its surface is not easy to be oxidized, and then can improve the resistance to of touch-screen
Hou Xing.
In order to further improve the weatherability of touch-screen, in a kind of embodiment of the application, above-mentioned albata layer 232
In, the percentage by weight of above-mentioned nickel is between 60~80%.
In the another embodiment of the application, in above-mentioned albata layer 232, the percentage by weight of above-mentioned nickel is 70%.
The percentage by weight of such nickel can further ensure that touch-screen has preferable weatherability.
In order to be further ensured that frame wire has a higher conductance, in a kind of embodiment of the application, above-mentioned layers of copper
Thickness between 100~300nm.
In another embodiment of the application, the thickness of above-mentioned albata layer is between 10~50nm, the copper of the thickness
On the one hand nickel alloy layer can ensure that frame wire has higher conductance, it is preferable on the other hand can to ensure that touch-screen has
Weatherability.
In order to be further ensured that frame wire with high conductance and ensure touch-screen with preferable weatherability, this Shen
In a kind of embodiment please, the thickness of above-mentioned albata layer 232 is between 10~30nm.
In another embodiment of the application, the thickness of above-mentioned albata layer 232 is 20nm, so can further be protected
Card frame wire has higher conductance, and is further ensured that touch-screen has preferable weatherability simultaneously.
In a kind of embodiment in the application, as shown in fig. 6, touch-screen includes two sense films, the two sense films
Including base material 21, inductive layer 22 and frame wire 23, its base material 21 includes substrate and refractive index matching layers (not shown),
The thickness of refractive index matching layers needs to be bonded by tack coat 10 between 5~50nm between two sense films in the structure,
Tack coat 10 is required between sense film and cover plate and sense film and display screen to be bonded.
In order that the touch of finger can more delicately be sensed while make it that the thickness of touch-screen is smaller simultaneously by obtaining touch-screen
And simplify the manufacture craft of touch-screen, as shown in figure 5, in a kind of embodiment of the application, above-mentioned sense film 2 is above-mentioned including two
Inductive layer 22 and two above-mentioned frame wires 23, two above-mentioned inductive layers 22 be separately positioned on two of above-mentioned base material 21 it is relative
On surface, two above-mentioned frame wires 23 are separately positioned on the surface of the remote above-mentioned base material 21 of two above-mentioned inductive layers 22.
In Fig. 5 structure, an inductive layer and frame wire are set respectively on two surfaces of base material, so pass through two inductive layers
It is capable of the touch of more delicately finger sensing with two frame wires, also, Fig. 5 structure only needs the fitting of two steps, and Fig. 6
Structure need to be bonded three times, the step of Fig. 5 structure reduces a fitting, improve producing efficiency and yield, also, scheme
5 structure compares Fig. 6 structure, it is only necessary to a base material and two layers of tack coat 10, the thickness of touch-screen is significantly reduced,
So that product is more frivolous, and improve the transmitance of touch-screen.
In the another embodiment of the application, above-mentioned inductive layer 22 is ITO layer.Inductive layer in certain the application is simultaneously unlimited
In ITO layer, those skilled in the art can select suitable material layer as inductive layer according to actual conditions.
In order to further improve the sensitivity of touch-screen, in a kind of embodiment of the application, the thickness of above-mentioned ITO layer is 18
Between~30nm.
Substrate in the application can be that any base material of the prior art is formed, for example, can be PET, PEN,
PE or PC, those skilled in the art can select suitable material to form substrate according to actual conditions.
In a kind of embodiment of the application, above-mentioned substrate is PET base, and PET material has physically better mechanical performance,
Weatherability and dimensional stability of touch-screen etc. can further be improved.
The material of refractive index matching layers in the application is selected from SiOx, NbOx or SiNx.Those skilled in the art can root
Refractive index matching layers are formed according to actual conditions selection suitable material.
The touch-screen of the application can use the feasible method of any one of the prior art to prepare, one kind of the application
In embodiment.The manufacturing process of touch-screen includes:First, IM-PET base materials are formed, i.e., are coated with index matching on the pet substrate
Layer (can be coated with by volume to volume sputtering technology), two-sided ITO is made using volume to volume sputtering technology on refractive index matching layers
Layer, and cover diaphragm;Crystallized by volume to volume crystallization furnace, the ITO layer after crystallization has more preferable optical characteristics;Passing through volume pair
Volume sputtering double-sided conductive film, before layers of copper sputter, first carry out bombardment pretreatment to ito film using pretreatment target, improve copper and
Adhesive force between ITO;Then use dry film photoresistance through exposure and development and etching operation forms copper film signal line graph;Again will
Conductive base with copper film signal line graph is through exposure and development and etching operation forms and carries the transparent of copper film signal line graph
Conductive film figure;Finally using the fitting for carrying out glass cover-plate and FPC.
In the typical embodiment of another kind of the application, there is provided a kind of electronic equipment, the electronic equipment include touching
Screen, the touch-screen is any one above-mentioned touch-screen.
The electronic equipment is due to including above-mentioned touch-screen so that its reliability is higher.
In order that the technical scheme of the application can clearly be understood by obtaining those skilled in the art, below with reference to tool
The embodiment of body illustrates the technical scheme of the application.
Embodiment 1
The structure sense film as shown in Figure 5 of sense film, including a base material, two inductive layers and two frames are led
Line, wherein, substrate is the IM-PET layers for 125nm, and refractive index matching layers 5nm, inductive layer is 18nm ITO layer, and frame is led
Line includes layers of copper and albata layer, and the thickness of layers of copper is 100nm, and the thickness of albata layer is 50nm, in albata layer,
The percentage by weight of nickel is 30%, and display screen is common LCD display, and cover plate is glass cover-plate.
Embodiment 2
Difference with embodiment 1 is:The thickness of refractive index matching layers is 15nm, and inductive layer is 30nm ITO layer, frame
Wire includes layers of copper and albata layer, and the thickness of layers of copper is 300nm, and the thickness of albata layer is 10nm, albata layer
In, the percentage by weight of nickel is 80%.
Embodiment 3
Difference with embodiment 1 is:The thickness of refractive index matching layers is 10nm, and the thickness of inductive layer is 24nm, layers of copper
Thickness be 200nm, the thickness of albata layer is 30nm, and in albata layer, the percentage by weight of nickel is 60%.
Embodiment 4
Difference with embodiment 3 is:The thickness of refractive index matching layers is 40nm, and the thickness of layers of copper is 200nm, and cupro-nickel is closed
The thickness of layer gold is 20nm, and in albata layer, the percentage by weight of nickel is 70%.
Embodiment 5
Difference with embodiment 4 is:The thickness of refractive index matching layers is 50nm.
Embodiment 6
Difference with embodiment 5 is:The thickness of refractive index matching layers is 30nm.
Embodiment 7
Difference with embodiment 5 is:In albata layer, the percentage by weight of nickel is 50%.
Embodiment 8
Difference with embodiment 5 is:In albata layer, the percentage by weight of nickel is 20%.
Comparative example 1
Difference with embodiment 5 is:The thickness of refractive index matching layers is 70nm.
The frame wire and inductive layer tested using hundred methods of testing in the sense film in each embodiment and comparative example
Hundred lattice adhesive force, test the adhesive force of inductive layer and base material, still then " 100/100 " is represented in 100 grid after test
100 grid are left, i.e., frame wire corresponding to 100 grid is bonded together with inductive layer, and " 100/73 " is represented in 100 grid
Still then 73 grid are left after test, i.e., frame wire corresponding to 73 grid is bonded together with inductive layer.It is also, right
Each sense film carries out environmental test test, and the actual conditions of environmental test test is:Temperature is 65 DEG C, relative humidity 95%
RH, the resistance value of sense film before and after environmental test test, the resistance value before environmental test test is R0, after environmental test test
Resistance value is R1, and calculates R1/R0, and R1/R0 is smaller to represent that weatherability is better, works as R1/R0>When 1.2, it is believed that sense film it is weather-proof
Property is poor, and is substandard product, and the defects of using the surface for visually observing albata layer, specific test result is shown in Table 1.
Table 1
From the data in above-mentioned table, for embodiment 1 to 8, comparative example 1 is due to the thickness of refractive index matching layers
Spend larger so that hundred lattice adhesive force of frame wire and inductive layer decline, and compared with Example 5, embodiment 7 is due to the weight of nickel
Percentage be 50% not between 60~80%, so, its weatherability is poor, and pinhole number is more;Compared with Example 5, implement
Example 8 is not because the percentage by weight of nickel is 20% between 30~80% so that its weatherability is poor, and pinhole number is more.
As can be seen from the above description, the application the above embodiments realize following technique effect:
1), in the touch-screen of the application, the thickness of refractive index matching layers is arranged between 5~50nm so that base material
Between 5~50nm, the roughness range can not only ensure to have between base material and structure sheaf thereon stronger roughness
Adhesive force, when the frame wire in touch-screen includes copper film, larger roughness can also cause the reduction of layers of copper internal stress, and then
So that the adhesive force of layers of copper and inductive layer is larger, the yield of product is improved;Also, the roughness range also ensures inductive layer
With relatively low etching aberration.
2), the electronic equipment of the application is due to including above-mentioned touch-screen so that its reliability is higher.
The preferred embodiment of the application is the foregoing is only, is not limited to the application, for the skill of this area
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent substitution, improvement etc., should be included within the protection domain of the application.
Claims (10)
1. a kind of touch-screen, including display screen (1), sense film (2) and the cover plate (3) set gradually, it is characterised in that the sense
Film (2) is answered to include:
Base material (21), including substrate (211) and the refractive index matching layers (212) that are arranged on the substrate (211) surface, it is described
The thickness of refractive index matching layers (212) is 5~50nm;
Inductive layer (22), it is arranged on the surface of the remote substrate (211) of the refractive index matching layers (212);And
Frame wire (23), it is arranged on the surface of the remote refractive index matching layers (212) of the inductive layer (22).
2. touch-screen according to claim 1, it is characterised in that the thickness of the refractive index matching layers (212) be 10~
40nm, the thickness of preferably described refractive index matching layers (212) is 30nm.
3. touch-screen according to claim 1, it is characterised in that the frame wire (23) includes:
Layers of copper (231), it is arranged on the surface of the remote base material (21) of the inductive layer (22);And
Albata layer (232), it is arranged on the surface of the remote inductive layer (22) of the layers of copper (231).
4. touch-screen according to claim 3, it is characterised in that in the copper-nickel alloy-layer (232), the weight percent of nickel
Than being 60~80% for the percentage by weight of 30~80%, preferably described nickel, the percentage by weight of the further preferred nickel is
70%.
5. touch-screen according to claim 4, it is characterised in that the thickness of the layers of copper (231) is 100~300nm.
6. touch-screen according to claim 4, it is characterised in that the thickness of the copper-nickel alloy-layer (232) be 10~
50nm, the preferably thickness of the copper-nickel alloy-layer (232) are 10~30nm, further preferred the copper-nickel alloy-layer (232)
Thickness is 20nm.
7. touch-screen according to claim 1, it is characterised in that the sense film (2) includes two inductive layers
(22) two of the base material (21) are separately positioned on relatively with two frame wires (23), two inductive layers (22)
Surface on, and a frame wire (23) in two frame wires (23) is disposed therein a sensing
On the surface of the remote base material (21) of layer (22), another described frame wire (23) is disposed therein another sense
Answer on the surface of the remote base material (21) of layer (22).
8. touch-screen according to any one of claim 1 to 7, it is characterised in that the inductive layer (22) is ITO layer.
9. touch-screen according to claim 8, it is characterised in that the thickness of the ITO layer is 18~30nm.
10. a kind of electronic equipment, including touch-screen, it is characterised in that the touch-screen is any one of claim 1 to 9 institute
The touch-screen stated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710343504.7A CN107422904B (en) | 2017-05-16 | 2017-05-16 | Touch screen and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710343504.7A CN107422904B (en) | 2017-05-16 | 2017-05-16 | Touch screen and electronic equipment |
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Publication Number | Publication Date |
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CN107422904A true CN107422904A (en) | 2017-12-01 |
CN107422904B CN107422904B (en) | 2021-02-19 |
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ID=60424594
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CN201710343504.7A Active CN107422904B (en) | 2017-05-16 | 2017-05-16 | Touch screen and electronic equipment |
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CN109491545A (en) * | 2018-12-19 | 2019-03-19 | 武汉华星光电半导体显示技术有限公司 | Touch panel unit and electronic equipment |
CN113220153A (en) * | 2021-01-20 | 2021-08-06 | 西安交通大学 | Non-contact flexible transparent sensor and preparation method thereof |
CN113823192A (en) * | 2018-03-15 | 2021-12-21 | 群创光电股份有限公司 | Display device |
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CN113823192A (en) * | 2018-03-15 | 2021-12-21 | 群创光电股份有限公司 | Display device |
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