KR100968843B1 - 다수의 발광셀이 어레이된 발광소자 - Google Patents
다수의 발광셀이 어레이된 발광소자 Download PDFInfo
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- KR100968843B1 KR100968843B1 KR20050124882A KR20050124882A KR100968843B1 KR 100968843 B1 KR100968843 B1 KR 100968843B1 KR 20050124882 A KR20050124882 A KR 20050124882A KR 20050124882 A KR20050124882 A KR 20050124882A KR 100968843 B1 KR100968843 B1 KR 100968843B1
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- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 17
- 238000005530 etching Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
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- 238000001312 dry etching Methods 0.000 description 2
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- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- H—ELECTRICITY
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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Abstract
Description
Claims (9)
- 기판과 상기 기판상에 형성된 복수의 발광셀을 포함하는 발광소자에 있어서,상기 발광소자는,복수의 발광셀이 직렬 연결된 발광셀 블럭; 및각각 복수의 발광 다이오드를 포함하는 제 1 내지 제 4 다이오드 블럭으로 이루어지고, 상기 발광셀 블럭의 주변부를 둘러싸는 브릿지 정류 회로;를 포함하며,상기 발광셀 블럭 일단의 제 1 전극이 상기 브릿지 정류 회로내 제 1 및 제 3 다이오드 블럭 일단의 발광 다이오드의 제 2 전극에 전기적으로 접속되고,상기 발광셀 블럭 타단의 제 2 전극이 상기 브릿지 정류 회로내 제 2 및 제 4 다이오드 블럭 일단의 발광 다이오드의 제 1 전극에 전기적으로 접속되며, 상기 브릿지 정류 회로는 기판의 최외각부에 형성된 것을 특징으로 하는 발광소자.
- 제 1 항에 있어서,상기 발광셀 블럭 일단의 제 1 전극이 상기 브릿지 정류 회로내 제 1 및 제 3 다이오드 블럭 일단의 발광 다이오드의 제 2 전극에 전기적으로 접속되는 위치와,상기 발광셀 블럭 타단의 제 2 전극이 상기 브릿지 정류 회로내 제 2 및 제 4 다이오드 블럭 일단의 발광 다이오드의 제 1 전극에 전기적으로 접속되는 위치가 기판상에서 서로 대향하여 위치됨을 특징으로 하는 발광소자.
- 제 2 항에 있어서,상기 발광셀 블럭의 일단 및 타단과, 상기 다이오드 블럭들의 일단의 발광 다이오드와의 전기적인 접속은 상기 기판상에 추가적으로 구비된 전극을 통하여 형성된 것을 특징으로 하는 발광 소자.
- 제 1 항에 있어서,상기 발광소자는 외부전원을 공급하기 위한 제 1 전극 및 제 2 전극을 추가로 구비하며,상기 브릿지 정류 회로내 제 1 및 제 2 다이오드 블럭의 타단의 발광 다이오드가 상기 외부전원을 공급하기 위한 상기 제 1 전극에 전기적으로 접속되고,상기 브릿지 정류 회로내 제 3 및 제 4 다이오드 블럭의 타단의 발광 다이오드가 상기 외부전원을 공급하기 위한 상기 제 2 전극에 전기적으로 접속됨을 특징으로 하는 발광소자.
- 제 4 항에 있어서,상기 외부전원을 공급하기 위한 전극이 기판상에서 서로 대향하여 위치됨을 특징으로 하는 발광소자.
- 제 1 항에 있어서,상기 브릿지 정류 회로내 발광 다이오드의 개수는 상기 발광셀 블럭내 발광셀의 개수의 100~200%인 것을 특징으로 하는 발광소자.
- 제 1 항에 있어서,상기 브릿지 정류 회로내 발광 다이오드 중 적어도 하나의 발광 다이오드의 크기는 상기 발광셀 블럭내 발광셀의 크기의 80% 이하인 것을 특징으로 하는 발광소자.
- 삭제
- 제 1 항 내지 제 7 항 중 어느 한 항에 있어서,상기 발광소자는 전체 형상이 사각형 형상인 것을 특징으로 하는 발광소자.
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20050124882A KR100968843B1 (ko) | 2005-12-16 | 2005-12-16 | 다수의 발광셀이 어레이된 발광소자 |
DE112006004221.1T DE112006004221B4 (de) | 2005-12-16 | 2006-12-05 | Lichtemittierende Anordnung mit gruppierten lichtemittierenden Zellen |
CN2006800416805A CN101305476B (zh) | 2005-12-16 | 2006-12-05 | 具有排列的发光单元的发光装置 |
PCT/KR2006/005186 WO2007083885A1 (en) | 2005-12-16 | 2006-12-05 | Light emitting device with light emitting cells arrayed |
CN2010102321761A CN101924117A (zh) | 2005-12-16 | 2006-12-05 | 具有排列的发光单元的发光装置 |
JP2008545479A JP4694631B2 (ja) | 2005-12-16 | 2006-12-05 | 複数の発光セルが配列された発光素子 |
DE200611002702 DE112006002702B4 (de) | 2005-12-16 | 2006-12-05 | Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen |
US12/088,906 US8054002B2 (en) | 2005-12-16 | 2006-12-05 | Light emitting device with light emitting cells arrayed |
TW99133759A TWI430698B (zh) | 2005-12-16 | 2006-12-13 | 具有發光單元的發光元件 |
TW95146586A TWI410169B (zh) | 2005-12-16 | 2006-12-13 | 具有發光單元陣列的發光元件 |
JP2009275101A JP4690482B2 (ja) | 2005-12-16 | 2009-12-03 | 複数の発光セルが配列された発光素子 |
JP2010260444A JP5193271B2 (ja) | 2005-12-16 | 2010-11-22 | 複数の発光セルが配列された発光素子 |
US13/243,802 US8294386B2 (en) | 2005-12-16 | 2011-09-23 | Light emitting device with light emitting cells arrayed |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20050124882A KR100968843B1 (ko) | 2005-12-16 | 2005-12-16 | 다수의 발광셀이 어레이된 발광소자 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100032436A Division KR101055782B1 (ko) | 2010-04-08 | 2010-04-08 | 다수의 발광셀이 어레이된 발광소자 |
Publications (2)
Publication Number | Publication Date |
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KR20070064208A KR20070064208A (ko) | 2007-06-20 |
KR100968843B1 true KR100968843B1 (ko) | 2010-07-09 |
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Application Number | Title | Priority Date | Filing Date |
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KR20050124882A KR100968843B1 (ko) | 2005-12-16 | 2005-12-16 | 다수의 발광셀이 어레이된 발광소자 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8054002B2 (ko) |
JP (3) | JP4694631B2 (ko) |
KR (1) | KR100968843B1 (ko) |
CN (2) | CN101924117A (ko) |
DE (2) | DE112006004221B4 (ko) |
TW (2) | TWI430698B (ko) |
WO (1) | WO2007083885A1 (ko) |
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- 2006-12-05 CN CN2010102321761A patent/CN101924117A/zh active Pending
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Publication number | Publication date |
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CN101305476A (zh) | 2008-11-12 |
DE112006002702B4 (de) | 2012-11-29 |
DE112006002702T5 (de) | 2008-07-24 |
US20080218098A1 (en) | 2008-09-11 |
TW200731863A (en) | 2007-08-16 |
JP2010093279A (ja) | 2010-04-22 |
TWI430698B (zh) | 2014-03-11 |
JP2011040791A (ja) | 2011-02-24 |
CN101924117A (zh) | 2010-12-22 |
DE112006004221B4 (de) | 2015-08-20 |
US20120013260A1 (en) | 2012-01-19 |
TW201117645A (en) | 2011-05-16 |
JP5193271B2 (ja) | 2013-05-08 |
KR20070064208A (ko) | 2007-06-20 |
JP4690482B2 (ja) | 2011-06-01 |
US8054002B2 (en) | 2011-11-08 |
WO2007083885A1 (en) | 2007-07-26 |
JP4694631B2 (ja) | 2011-06-08 |
TWI410169B (zh) | 2013-09-21 |
CN101305476B (zh) | 2011-08-24 |
JP2009519605A (ja) | 2009-05-14 |
US8294386B2 (en) | 2012-10-23 |
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