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KR100953341B1 - Wafer Inspection Device for Semiconductor Manufacturing - Google Patents

Wafer Inspection Device for Semiconductor Manufacturing Download PDF

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KR100953341B1
KR100953341B1 KR1020070138355A KR20070138355A KR100953341B1 KR 100953341 B1 KR100953341 B1 KR 100953341B1 KR 1020070138355 A KR1020070138355 A KR 1020070138355A KR 20070138355 A KR20070138355 A KR 20070138355A KR 100953341 B1 KR100953341 B1 KR 100953341B1
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wafer
inspection apparatus
stage chuck
stage
semiconductor manufacturing
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KR20090070367A (en
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이승원
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주식회사 동부하이텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

본 발명은 반도체 제조용 웨이퍼 검사장치에 관한 것으로, 본 발명에 따른 반도체 제조용 웨이퍼 검사장치는 웨이퍼의 디팩트를 검사하기 위해 웨이퍼가 안착되는 스테이지 척이 구비되는 반도체 제조용 웨이퍼 검사장치에 있어서, 상기 스테이지 척 상에 배치되고, 상기 스테이지 척에 안착된 상기 웨이퍼의 위치를 감지할 수 있도록 하는 웨이퍼 위치 감지부와, 상기 스테이지 척의 소정 위치에 상기 웨이퍼 위치 감지부로부터 조사되는 레이저 빔을 반사하는 반사판을 포함한다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer inspection apparatus for semiconductor manufacturing. The wafer inspection apparatus for semiconductor manufacturing according to the present invention is a wafer inspection apparatus for semiconductor manufacturing, wherein the stage chuck is provided with a stage chuck on which wafers are placed to inspect a wafer defect. It is disposed on the, and includes a wafer position sensing unit for sensing the position of the wafer seated on the stage chuck, and a reflecting plate for reflecting the laser beam irradiated from the wafer position sensing unit at a predetermined position of the stage chuck. .

웨이퍼 wafer

Description

반도체 제조용 웨이퍼 검사장치{Wafer inspection system for semiconductor manufacturing} Wafer inspection system for semiconductor manufacturing

본 발명은 반도체 제조용 웨이퍼 검사장치에 관한 것이다.The present invention relates to a wafer inspection apparatus for semiconductor manufacturing.

일반적으로 반도체 제조공정에서 웨이퍼 상의 일련의 단위 공정들이 연속적으로 진행됨으로써 완성되며, 상기 단위 공정사이에는 검사(inspection)단계를 진행함으로써 선행된 공정의 정상 유무를 확인하고 있다. In general, a series of unit processes on a wafer are completed in a semiconductor manufacturing process, and an inspection step is performed between the unit processes to confirm whether the preceding process is normal.

상기 검사단계는 검사 장치를 이용하여 웨이퍼 상에 존재하는 디펙트(defect)의 개수 및 위치를 검출한 후 상기 검출 결과가 입력된 마이크로스코프(microscope), 전자 현미경(SEM)등을 이용하여 상기 디펙트를 관찰하고 이러한 불량 발생 원인을 제거함으로써 수율(yield)을 향상시키는 것이다. The inspection step detects the number and location of defects on the wafer by using an inspection apparatus and then uses the microscope, electron microscope (SEM), etc. to which the detection result is input. By observing the effect and eliminating the cause of the failure, the yield is improved.

도 1은 종래 기술에 따른 검사장치의 구성을 보여주는 구성도로써, 첨부된 도 1은 이해의 편의를 위해 검사장치의 내부를 도시하였다. Figure 1 is a block diagram showing the configuration of the inspection apparatus according to the prior art, Figure 1 is attached to the inside of the inspection apparatus for convenience of understanding.

첨부된 도 1에 도시된 바와 같이, 종래의 검사장치에서는 트랜스퍼암(미도시)에 의해 다수의 웨이퍼가 수납된 카세트(cassette, 미도시)로부터 스테이지 척(stage, 10) 위로 웨이퍼가 놓이면 상기 스테이지 척(10)이 검사위치로 이동하고 이후 수평방향(X, Y방향)으로 움직이면서 웨이퍼 검사단계가 진행되는 것이다. 레이저 또는 기타 광학적 장치에 의해 웨이퍼 표면을 검사하는 검사단계가 완료되면 상기 스테이지는 다시 도어(door)방향으로 이동하고 웨이퍼가 스테이지의 팝업핀(pop up pin)에 의해 들려지면 트랜스터 암은 상기 웨이퍼를 카세트로 반송하는 것이다. As shown in FIG. 1, in the conventional inspection apparatus, when a wafer is placed on a stage chuck 10 from a cassette in which a plurality of wafers are accommodated by a transfer arm (not shown), the stage is placed. The chuck 10 moves to the inspection position and then moves to the horizontal direction (X, Y direction) to proceed with the wafer inspection step. When the inspection step of inspecting the wafer surface by a laser or other optical device is completed, the stage is moved back to the door direction and the transfer arm is lifted when the wafer is lifted by the stage's pop up pin. To the cassette.

그러나 종래의 검사장치에는 도 2a 및 도 2b에 도시된 바와 같이, 상기 스테이지 척(10)에 웨이퍼(12)의 안착 상태를 확인하는 장치가 없어서 상기 스테이지(10)에 놓인 웨이퍼(12)가 비정상적인 위치에 있는 경우 웨이퍼 노치(notch)를 감지할 수 없어, 웨이퍼 검사공정을 수행할 수 없게 되는 문제점이 있다. However, in the conventional inspection apparatus, as shown in FIGS. 2A and 2B, there is no device for checking the seating state of the wafer 12 on the stage chuck 10, and thus the wafer 12 placed on the stage 10 is abnormal. If the position is in the wafer notch (notch) can not be detected, there is a problem that can not perform the wafer inspection process.

상기와 같은 문제점을 해결하기 위하여, 본 발명은 스테이지 척에 안착된 웨이퍼의 안착 상태를 확인하는 장치를 구비한 반도체 제조용 웨이퍼 검사장치를 제공함에 있다. In order to solve the above problems, the present invention is to provide a wafer inspection apparatus for semiconductor manufacturing having a device for checking the seating state of the wafer seated on the stage chuck.

상술한 목적을 달성하기 위한 본 발명에 따른 반도체 제조용 웨이퍼 검사장치는 웨이퍼의 디팩트를 검사하기 위해 웨이퍼가 안착되는 스테이지 척이 구비되는 반도체 제조용 웨이퍼 검사장치에 있어서, 상기 스테이지 척 상에 배치되고, 상기 스테이지 척에 안착된 상기 웨이퍼의 위치를 감지할 수 있도록 하는 웨이퍼 위치 감지부와, 상기 스테이지 척의 소정 위치에 상기 웨이퍼 위치 감지부로부터 조사되는 레이저 빔을 반사하는 반사판을 포함한다. A wafer inspection apparatus for manufacturing a semiconductor according to the present invention for achieving the above object is a wafer inspection apparatus for manufacturing a semiconductor having a stage chuck on which a wafer is seated for inspecting a defect of a wafer, the wafer inspection apparatus being disposed on the stage chuck, And a wafer position sensing unit for sensing a position of the wafer mounted on the stage chuck, and a reflecting plate reflecting a laser beam irradiated from the wafer position sensing unit at a predetermined position of the stage chuck.

상기 웨이퍼 위치 감지부는 레이저 빔을 상기 스테이지 척으로 조사하는 조사부와, 상기 조사부에서 조사된 레이저 빔이 상기 반사판에서 반사되어 감지되는 수광부를 포함한다. The wafer position detector includes an irradiation unit for irradiating a laser beam to the stage chuck, and a light receiving unit for reflecting and detecting the laser beam irradiated from the irradiation unit.

본 발명은 반도체 소자를 제조하기 위한 웨이퍼 검사장치에 웨이퍼 감지수단을 구비함으로서, 스테이지 척에 안착되는 웨이퍼의 상태를 확인할 수 있는 감지할 수 있게 되어, 웨이퍼가 비정상적인 상태에서 웨이퍼 검사공정을 수행하지 않게 되는 효과가 있다. The present invention is provided with a wafer sensing means in the wafer inspection apparatus for manufacturing a semiconductor device, it is possible to detect the state of the wafer seated on the stage chuck, so that the wafer does not perform the wafer inspection process in an abnormal state It is effective.

이하, 첨부된 도면 및 실시 예를 통해 본 발명의 실시 예를 구체적으로 살펴보면 다음과 같다. Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings and embodiments.

본 발명에 따른 반도체 제조용 웨이퍼 검사장치는 스테이지 척(10), 구동부(20), 트랜스퍼 암(미도시), 검사 수단(30) 및 웨이퍼 위치 감지부(24)에 포함하여 이루어져 있으며, 상기 스테이지 척(10), 구동부(20), 트랜스퍼 암(미도시), 검사 수단(30)의 구성은 종래의 기술과 동일하므로 설명의 중복을 피하기 위하여 상세한 설명은 생략하고, 새로이 부가되는 구성부재들의 동작을 중심으로 하여 상세히 설명한다. The wafer inspection apparatus for manufacturing a semiconductor according to the present invention includes a stage chuck 10, a driver 20, a transfer arm (not shown), an inspection means 30, and a wafer position detector 24. 10, the configuration of the drive unit 20, transfer arm (not shown), and inspection means 30 is the same as in the prior art, the detailed description is omitted in order to avoid duplication of description, operation of the newly added components It demonstrates in detail centering.

첨부된 도 3a 및 도 3b에 도시된 바와 같이, 본 발명에 따른 반도체 제조용 웨이퍼 검사장치에는 상기 스테이지 척(10) 상에 배치되고, 상기 스테이지 척(10)에 안착된 웨이퍼(12)의 위치를 감지할 수 있도록 하는 웨이퍼 위치 감지부(24)와, 스테이지 척(10)의 소정 위치에 상기 웨이퍼 위치 감지부(24)로부터 조사되는 레이저 빔을 반사하는 반사판(21)을 더 포함하여 이루어진다. 도 3a에 도시된 바와 같이 반사판(21)은 상기 스테이지 척(10) 측부로 돌출된다.
이때, 웨이퍼 위치 감지부(24)는 도 3a에 도시된 바와 같이 레이저 빔을 돌출된 반사판(21)으로 조사하는 조사부와, 조사부에서 조사된 레이저 빔이 상기 반사판(21)에서 반사되어 감지되는 수광부를 구비한다. As shown in FIGS. 3A and 3B, the wafer inspection apparatus for manufacturing a semiconductor according to the present invention is disposed on the stage chuck 10 and the position of the wafer 12 seated on the stage chuck 10. It further comprises a wafer position sensing unit 24 for sensing and a reflector 21 reflecting the laser beam irradiated from the wafer position sensing unit 24 at a predetermined position of the stage chuck 10. As shown in FIG. 3A, the reflector 21 protrudes toward the side of the stage chuck 10.
At this time, the wafer position detection unit 24 is an irradiation unit for irradiating a laser beam to the protruding reflector 21, as shown in Figure 3a, and a light receiving unit for the laser beam irradiated from the irradiation unit is reflected by the reflector 21 and detected It is provided.

이와 같은 본 발명에 따른 반도체 제조용 웨이퍼 검사장치는 트랜스퍼 암(미도시)에 의해 다수의 웨이퍼가 수납된 카세트(cassette, 미도시)로부터 스테이지 척(stage, 10) 위로 웨이퍼(12)가 놓이면 상기 스테이지 척(10)이 검사위치로 이동하고, 웨이퍼 위치 감지부(24)의 조사부로부터 레이저빔을 조사시킨다. The wafer inspection apparatus for manufacturing a semiconductor according to the present invention as described above includes a wafer 12 placed on a stage chuck 10 from a cassette in which a plurality of wafers are stored by a transfer arm (not shown). The chuck 10 moves to the inspection position, and irradiates a laser beam from the irradiation portion of the wafer position detection unit 24.

이때, 조사된 레이저 빔이 웨이퍼(12)에 흡수되면, 웨이퍼(12)는 비정상적인 위치에 안착된 상태이므로, 트랜스터 암을 통해 웨이퍼(12)를 검사위치로 다시 이동시키고, 조사된 레이저 빔이 반사판(21)에서 반사되어 수광부를 통해 감지되면, 웨이퍼(12)는 정상적인 위치에 안착된 상태이므로, 수평방향(X, Y방향)으로 움직이면서 웨이퍼 검사단계가 진행되는 것이다.
즉 웨이퍼(12)가 스테이지 척(10)의 정상적인 위치에 안착할 경우 웨이퍼(120)는 상기 스테이지 척(10)의 측부로 돌출된 반사판(21)을 가리지 않기 때문에 반사판(21)에 의해 반사된 레이저 빔은 예컨대, 100이라는 감도로 수광되어 웨이퍼(12)의 안착 상태가 정상이라고 판단할 수 있습니다. 반면에 웨이퍼(12)가 스테이지 척(10)의 비정상적인 위치에 안착할 경우 웨이퍼(120)는 돌출된 반사판(21)을 가리게 되어 조사된 레이저 빔은 웨이퍼(12)에 일부 흡수되거나 반사되고 반사된 레이저 빔은 예컨대, 100이하의 감도로 수광되어 웨이퍼(120)의 안착 상태가 비정상적이라고 판단할 수 있습니다.
광학적 장치에 의해 웨이퍼 표면을 검사하는 검사단계가 완료되면 상기 스테이지는 다시 도어(door)방향으로 이동하고 웨이퍼가 스테이지의 팝업핀(pop up pin)에 의해 들려지면 트랜스터 암은 상기 웨이퍼를 카세트로 반송하는 것이다. At this time, when the irradiated laser beam is absorbed by the wafer 12, the wafer 12 is in a state of being settled in an abnormal position, so that the wafer 12 is moved back to the inspection position through the transfer arm, and the irradiated laser beam is When the light is reflected by the reflector 21 and sensed through the light receiver, the wafer 12 is placed in a normal position, and thus the wafer inspection step is performed while moving in the horizontal direction (X, Y direction).
That is, when the wafer 12 is seated at the normal position of the stage chuck 10, the wafer 120 does not cover the reflecting plate 21 protruding to the side of the stage chuck 10, and thus is reflected by the reflecting plate 21. For example, the laser beam may be received with a sensitivity of 100 to determine that the seating state of the wafer 12 is normal. On the other hand, when the wafer 12 is seated at an abnormal position of the stage chuck 10, the wafer 120 covers the protruding reflector 21 so that the irradiated laser beam is partially absorbed or reflected and reflected on the wafer 12. For example, the laser beam may be received with a sensitivity of 100 or less to determine that the seating state of the wafer 120 is abnormal.
When the inspection step of inspecting the wafer surface by the optical device is completed, the stage is moved back to the door direction, and when the wafer is lifted by the stage's pop up pin, the transfer arm transfers the wafer to the cassette. To return.

따라서 웨이퍼(12)가 상기 스테이지 척(10)에 놓이면 상기 웨이퍼 위치 감지부(24)에 의하여 웨이퍼(12)의 정상적인 안착 유무를 감지할 수 있는 것이다. Therefore, when the wafer 12 is placed on the stage chuck 10, the wafer position detecting unit 24 may detect whether the wafer 12 is normally seated.

이상에서 설명한 본 발명은 상술한 실시 예 및 첨부된 도면에 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 기술분야에서 종래의 지식을 가진 자에게 있어 명백할 것이다.It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

도 1은 종래 기술에 의한 검사장치의 구성을 도시한 사시도1 is a perspective view showing the configuration of a test apparatus according to the prior art

도 2a 및 도 2b는 종래 기술에 의한 검사장치의 스테이지 척에 안착된 웨이퍼를 도시한 구성도2A and 2B are diagrams illustrating a wafer seated on a stage chuck of an inspection apparatus according to the prior art.

도 3a 및 도 3b는 본 발명에 따른 반도체 제조용 웨이퍼 검사장치의 스테이지 척에 안착된 웨이퍼를 도시한 구성도3A and 3B are diagrams illustrating a wafer seated on a stage chuck of a wafer inspection apparatus for manufacturing a semiconductor according to the present invention.

Claims (2)

웨이퍼의 디팩트를 검사하기 위해 웨이퍼가 안착되는 스테이지 척이 구비되는 반도체 제조용 웨이퍼 검사장치에 있어서, In the wafer inspection apparatus for semiconductor manufacturing provided with a stage chuck on which a wafer is seated for inspecting a defect of a wafer, 상기 스테이지 척의 측부로 돌출되는 반사판;A reflection plate protruding to the side of the stage chuck; 상기 스테이지 척 상에 배치되고, 상기 돌출되는 반사판으로 레이저 빔을 조사하는 조사부; 및An irradiation unit disposed on the stage chuck and irradiating a laser beam to the protruding reflector; And 상기 돌출되는 반사판에 의해 반사된 레이저 빔을 감지하는 수광부를 포함하는 반도체 제조용 웨이퍼 검사장치.Wafer inspection apparatus for manufacturing a semiconductor comprising a light receiving unit for detecting a laser beam reflected by the projecting reflector. 삭제delete
KR1020070138355A 2007-12-27 2007-12-27 Wafer Inspection Device for Semiconductor Manufacturing Expired - Fee Related KR100953341B1 (en)

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KR20070070541A (en) * 2005-12-29 2007-07-04 동부일렉트로닉스 주식회사 Wafer Inspection Device and Interlock Method for Semiconductor Manufacturing

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