KR100934957B1 - 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 - Google Patents
압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 Download PDFInfo
- Publication number
- KR100934957B1 KR100934957B1 KR1020080016227A KR20080016227A KR100934957B1 KR 100934957 B1 KR100934957 B1 KR 100934957B1 KR 1020080016227 A KR1020080016227 A KR 1020080016227A KR 20080016227 A KR20080016227 A KR 20080016227A KR 100934957 B1 KR100934957 B1 KR 100934957B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- electrode
- stacked
- light emitting
- electrode pattern
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/016—Input arrangements with force or tactile feedback as computer generated output to the user
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/071—Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/30—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
- H10K30/35—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains comprising inorganic nanostructures, e.g. CdSe nanoparticles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
- H10K85/146—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE poly N-vinylcarbazol; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (16)
- 삭제
- 유연 압전 폴리머 기판과;상기 유연 압전 폴리머 기판의 양면에 전극 물질을 진공 증착하여 전극 박막을 형성하고 상기 전극 박막을 상온 건식 레이저 조사 식각 공정을 통해 패턴화하여 형성한 전극 패턴과;상기 전극 패턴 위에 적층 형성된 발광층과;상기 발광층 위에 적층 형성된 상부 전극;을 포함하고,상기 발광층이 적층된 상기 전극 패턴 및 상기 발광층 위에 적층된 상부 전극을 전기 도선으로 사용하는 디스플레이 소자와, 기판 양면의 전극을 전기 도선으로 사용하는 진동발생 또는 진동감지용 소자가 상기 기판을 공유하는 일체형 유닛을 형성하여 구성되며,상기 전극 패턴 위에 적층 형성된 나노입자가 함유된 전도성 고분자층과;상기 전도성 고분자층 위에 적층 형성된 상부 전극;을 더 포함하고, 상기 전도성 고분자층이 적층된 상기 전극 패턴 및 상기 전도성 고분자층 위에 적층된 상부 전극을 전기 도선으로 사용하는 메모리 소자가, 상기 디스플레이 소자와 상기 진동발생 또는 진동감지용 소자와 함께 상기 기판을 공유하는 일체형 유닛을 형성하여 구성된 것을 특징으로 하는 압전 폴리머 기판을 이용한 하이브리드 전기소자.
- 청구항 2에 있어서, 상기 기판이 폴리비닐리덴 플루오라이드(PVDF) 기판인 것을 특징으로 하는 압전 폴리머 기판을 이용한 하이브리드 전기소자.
- 삭제
- 삭제
- 청구항 2에 있어서, 상기 기판 위에 적층 형성된 추가적인 전극과, 상기 추가적인 전극 위에 적층 형성된 절연층이, 상기 기판과 상기 전극 패턴 사이에 추가 개재되고, 상기 추가적인 전극이 상기 진동발생 또는 진동감지용 소자의 전기 도선이 되는 것을 특징으로 하는 압전 폴리머 기판을 이용한 하이브리드 전기소자.
- 삭제
- 유연 압전 폴리머 기판의 양면에 전극 물질을 진공 증착하여 전극 박막을 형성하고 상기 전극 박막을 상온 건식 레이저 조사 식각 공정을 통해 패턴화하여 전극 패턴을 형성하는 단계와;상기 전극 패턴 위에 발광층을 적층 형성하는 단계와;상기 발광층 위에 상부 전극을 적층 형성하는 단계;를 포함하고, 상기 발광층이 적층된 상기 전극 패턴 및 상기 발광층 위에 적층된 상부 전극을 전기 도선으로 사용하는 디스플레이 소자와, 기판 양면의 전극을 전기 도선으로 사용하는 진동발생 또는 진동감지용 소자가 상기 기판을 공유하는 일체형 유닛으로 구성하며,상기 전극 패턴 위에 나노입자가 함유된 전도성 고분자층을 적층 형성하는 단계와;상기 전도성 고분자층 위에 상부 전극을 적층 형성하는 단계;를 더 포함하고, 상기 전도성 고분자층이 적층된 상기 전극 패턴 및 상기 전도성 고분자층 위에 적층된 상부 전극을 전기 도선으로 사용하는 메모리 소자가, 상기 디스플레이 소자와 상기 진동발생 또는 진동감지용 소자와 함께 상기 기판을 공유하는 일체형 유닛으로 구성하는 것을 특징으로 하는 압전 폴리머 기판을 이용한 하이브리드 전기소자의 제조방법.
- 청구항 8에 있어서, 상기 기판이 폴리비닐리덴 플루오라이드(PVDF) 기판인 것을 특징으로 하는 압전 폴리머 기판을 이용한 하이브리드 전기소자의 제조방법.
- 삭제
- 삭제
- 청구항 8에 있어서, 상기 기판 위에 적층 형성된 추가적인 전극과, 상기 추가적인 전극 위에 적층 형성된 절연층을, 상기 기판과 상기 전극 패턴 사이에 개재하여, 상기 추가적인 전극이 상기 진동발생 또는 진동감지용 소자의 전기 도선이 되도록 한 것을 특징으로 하는 압전 폴리머 기판을 이용한 하이브리드 전기소자의 제조방법.
- 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080016227A KR100934957B1 (ko) | 2008-02-22 | 2008-02-22 | 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 |
PCT/KR2008/003692 WO2009104840A2 (en) | 2008-02-22 | 2008-06-26 | Hybrid electric device using piezo-electric polymer substrate and its fabrication method |
US12/918,651 US8288776B2 (en) | 2008-02-22 | 2008-06-26 | Hybrid electric device using piezoelectric polymer substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080016227A KR100934957B1 (ko) | 2008-02-22 | 2008-02-22 | 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090090774A KR20090090774A (ko) | 2009-08-26 |
KR100934957B1 true KR100934957B1 (ko) | 2010-01-06 |
Family
ID=40986016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080016227A KR100934957B1 (ko) | 2008-02-22 | 2008-02-22 | 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8288776B2 (ko) |
KR (1) | KR100934957B1 (ko) |
WO (1) | WO2009104840A2 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015130116A1 (ko) * | 2014-02-27 | 2015-09-03 | 서울대학교 산학협력단 | 신축성 및 연성 전자 소자 및 이의 제조 방법 |
KR20190073675A (ko) * | 2017-12-19 | 2019-06-27 | 엘지디스플레이 주식회사 | 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치 |
US10541358B2 (en) | 2012-12-21 | 2020-01-21 | Samsung Electronics Co., Ltd. | Hybrid generator using thermoelectric generation and piezoelectric generation |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9018030B2 (en) * | 2008-03-20 | 2015-04-28 | Symbol Technologies, Inc. | Transparent force sensor and method of fabrication |
DE102008058535A1 (de) * | 2008-11-21 | 2010-05-27 | Tesa Se | Verfahren zur Materialbearbeitung mit energiereicher Strahlung |
US8988191B2 (en) | 2009-08-27 | 2015-03-24 | Symbol Technologies, Inc. | Systems and methods for pressure-based authentication of an input on a touch screen |
US8963874B2 (en) | 2010-07-31 | 2015-02-24 | Symbol Technologies, Inc. | Touch screen rendering system and method of operation thereof |
US8515289B2 (en) | 2011-11-21 | 2013-08-20 | Environmental Light Technologies Corp. | Wavelength sensing lighting system and associated methods for national security application |
US8492995B2 (en) * | 2011-10-07 | 2013-07-23 | Environmental Light Technologies Corp. | Wavelength sensing lighting system and associated methods |
US9298333B2 (en) * | 2011-12-22 | 2016-03-29 | Smsc Holdings S.A.R.L. | Gesturing architecture using proximity sensing |
US8680457B2 (en) | 2012-05-07 | 2014-03-25 | Lighting Science Group Corporation | Motion detection system and associated methods having at least one LED of second set of LEDs to vary its voltage |
KR102061748B1 (ko) | 2013-05-07 | 2020-01-03 | 삼성디스플레이 주식회사 | 표시 장치 |
US10036734B2 (en) | 2013-06-03 | 2018-07-31 | Snaptrack, Inc. | Ultrasonic sensor with bonded piezoelectric layer |
US20140355387A1 (en) | 2013-06-03 | 2014-12-04 | Qualcomm Incorporated | Ultrasonic receiver with coated piezoelectric layer |
KR102025786B1 (ko) * | 2013-07-04 | 2019-09-27 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102108846B1 (ko) * | 2013-07-16 | 2020-05-11 | 엘지이노텍 주식회사 | 터치 윈도우 |
KR20150103977A (ko) * | 2014-03-04 | 2015-09-14 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
EP3137964B1 (en) | 2015-06-26 | 2018-05-09 | SABIC Global Technologies B.V. | Integrated piezoelectric cantilever actuator and transistor for touch input and haptic feedback applications |
DE102016205572A1 (de) * | 2016-04-05 | 2017-10-05 | Osram Gmbh | Akustischer sensor |
US11003884B2 (en) | 2016-06-16 | 2021-05-11 | Qualcomm Incorporated | Fingerprint sensor device and methods thereof |
WO2018102666A1 (en) | 2016-12-01 | 2018-06-07 | Avery Dennison Retail Information Services, Llc | Functional substrates for printed electronic devices |
JP6836441B2 (ja) * | 2017-03-27 | 2021-03-03 | 日東電工株式会社 | パターン積層体の製造方法 |
CN107222821B (zh) | 2017-06-09 | 2019-09-17 | 京东方科技集团股份有限公司 | 复合电极、使用其的声学传感器及制造方法 |
KR102312125B1 (ko) * | 2017-07-03 | 2021-10-12 | 엘지디스플레이 주식회사 | 표시장치 |
JP6821775B2 (ja) | 2018-12-27 | 2021-01-27 | エルジー ディスプレイ カンパニー リミテッド | ストレッチャブル表示装置 |
CN111403431B (zh) * | 2019-01-02 | 2023-09-05 | 京东方科技集团股份有限公司 | 柔性体及控制其发生形变的方法 |
CN110636420B (zh) * | 2019-09-25 | 2021-02-09 | 京东方科技集团股份有限公司 | 一种薄膜扬声器、薄膜扬声器的制备方法以及电子设备 |
CN114964458A (zh) * | 2021-02-25 | 2022-08-30 | 京东方科技集团股份有限公司 | 振动器及制作方法、触觉再现器件及振动波形检测方法 |
CN113724589B (zh) | 2021-08-20 | 2023-05-30 | 惠州华星光电显示有限公司 | 显示屏及显示装置 |
US12019253B2 (en) * | 2022-09-30 | 2024-06-25 | Universal City Studios Llc | Oscillating stacked digital displays for holographic image |
US20240345338A1 (en) * | 2023-04-11 | 2024-10-17 | Wisconsin Alumni Research Foundation | Magnetic-field-tunable terahertz optoelectronic transducer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR830001853B1 (ko) * | 1980-06-14 | 1983-09-14 | 가부시기 가이샤 히다찌세이사꾸쇼 | 투명평판 스피커 |
KR20060070490A (ko) * | 2003-06-24 | 2006-06-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 감지 장치 |
KR20070010573A (ko) * | 2005-07-19 | 2007-01-24 | 삼성전자주식회사 | 하이브리드형 편광 필름 및 이의 제조 방법과, 이를 구비한표시 장치 |
KR100791657B1 (ko) * | 2000-02-22 | 2008-01-03 | 엔엑스피 비 브이 | 하이브리드 집적 회로 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5796854A (en) | 1997-03-04 | 1998-08-18 | Compaq Computer Corp. | Thin film speaker apparatus for use in a thin film video monitor device |
JP2002064231A (ja) * | 2000-08-18 | 2002-02-28 | Tokin Ceramics Corp | 圧電式発光装置 |
JP2002094114A (ja) * | 2000-09-13 | 2002-03-29 | National Institute Of Advanced Industrial & Technology | ZnO系酸化物半導体層を有する半導体装置およびその製法 |
JP2004165267A (ja) * | 2002-11-11 | 2004-06-10 | Sharp Corp | 半導体発光素子および発光表示装置、ならびにそれらの製造方法 |
TW200410034A (en) * | 2002-11-28 | 2004-06-16 | Matsushita Electric Ind Co Ltd | Display device and manufacturing method thereof |
JP3994287B2 (ja) * | 2004-07-07 | 2007-10-17 | サンケン電気株式会社 | 半導体発光素子 |
-
2008
- 2008-02-22 KR KR1020080016227A patent/KR100934957B1/ko active IP Right Grant
- 2008-06-26 US US12/918,651 patent/US8288776B2/en active Active - Reinstated
- 2008-06-26 WO PCT/KR2008/003692 patent/WO2009104840A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR830001853B1 (ko) * | 1980-06-14 | 1983-09-14 | 가부시기 가이샤 히다찌세이사꾸쇼 | 투명평판 스피커 |
KR100791657B1 (ko) * | 2000-02-22 | 2008-01-03 | 엔엑스피 비 브이 | 하이브리드 집적 회로 제조 방법 |
KR20060070490A (ko) * | 2003-06-24 | 2006-06-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 감지 장치 |
KR20070010573A (ko) * | 2005-07-19 | 2007-01-24 | 삼성전자주식회사 | 하이브리드형 편광 필름 및 이의 제조 방법과, 이를 구비한표시 장치 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10541358B2 (en) | 2012-12-21 | 2020-01-21 | Samsung Electronics Co., Ltd. | Hybrid generator using thermoelectric generation and piezoelectric generation |
WO2015130116A1 (ko) * | 2014-02-27 | 2015-09-03 | 서울대학교 산학협력단 | 신축성 및 연성 전자 소자 및 이의 제조 방법 |
KR101765529B1 (ko) * | 2014-02-27 | 2017-08-07 | 서울대학교산학협력단 | 신축성 및 연성 전자 소자 및 이의 제조 방법 |
KR20190073675A (ko) * | 2017-12-19 | 2019-06-27 | 엘지디스플레이 주식회사 | 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치 |
CN110047827A (zh) * | 2017-12-19 | 2019-07-23 | 乐金显示有限公司 | 发光音频装置、音频输出装置和显示装置 |
KR102419272B1 (ko) * | 2017-12-19 | 2022-07-11 | 엘지디스플레이 주식회사 | 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치 |
CN110047827B (zh) * | 2017-12-19 | 2023-06-09 | 乐金显示有限公司 | 发光音频装置、音频输出装置和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2009104840A2 (en) | 2009-08-27 |
KR20090090774A (ko) | 2009-08-26 |
WO2009104840A3 (en) | 2010-04-15 |
US20100328328A1 (en) | 2010-12-30 |
US8288776B2 (en) | 2012-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100934957B1 (ko) | 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 | |
CN101711405B (zh) | 制造可寻址及静态电子显示器、发电或其它电子装置的方法 | |
CN102549797B (zh) | 单片并联互连结构 | |
CN108886101B (zh) | 量子点发光二极管及其制造方法、显示面板和显示装置 | |
TW587348B (en) | Multi substrate organic light emitting devices | |
CN101213682B (zh) | 用于在有机功能设备中形成电极层图案的方法 | |
EP2498316A1 (en) | Flexible display device and manufacturing method thereof | |
WO2004064167A1 (ja) | 透光性薄膜太陽電池モジュールおよびその製造方法 | |
JP5575882B2 (ja) | 気密式電気パッケージ | |
WO2008039757A3 (en) | Semiconductor devices and methods from group iv nanoparticle materials | |
KR20100065816A (ko) | 압전 기판을 이용한 투명 터치 패널 및 그 제조 방법 | |
TWI503804B (zh) | 可撓性顯示裝置及製造其之方法 | |
CN113764606B (zh) | 电子器件、电子器件的制造方法和蒸镀掩模组 | |
KR20220051196A (ko) | 투광형 광전지 장치 및 그의 제조방법 | |
JP2009244338A (ja) | 有機半導体素子、有機半導体素子の製造方法、および表示装置 | |
TW201037830A (en) | Substrate board for display device and method for making the substrate board | |
JP5240807B2 (ja) | 光電変換構造体及びその製造方法 | |
JP2017504191A (ja) | 埋め込まれたパターンニングされた金属構造物を有する伝送部材を提供するための方法とシステム | |
JP2004320889A (ja) | 光電変換構造体 | |
JP2017212127A (ja) | 有機デバイスの製造方法 | |
JP7132130B2 (ja) | 透明相関金属電極を形成するための方法 | |
JP2006260899A5 (ko) | ||
KR100853542B1 (ko) | 라미네이션 장치 및 이를 이용한 유기 전계 발광표시장치의 제조방법 | |
Ie et al. | P‐102: Audible OLED Device on Flexible PVDF Substrate with Laser Patterned ITO Electrode | |
KR100699992B1 (ko) | 레이저 전사장치와 유기전계발광표시장치의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20080222 |
|
PA0201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20090706 Patent event code: PE09021S01D |
|
PG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20091117 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20091223 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20091224 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20121203 Year of fee payment: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20121203 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20131129 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20131129 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20141201 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20141201 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20151126 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20151126 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20161201 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20161201 Start annual number: 8 End annual number: 8 |
|
FPAY | Annual fee payment |
Payment date: 20171201 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20171201 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20181203 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20181203 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20191203 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20191203 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20201201 Start annual number: 12 End annual number: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20211125 Start annual number: 13 End annual number: 13 |
|
PR1001 | Payment of annual fee |
Payment date: 20221025 Start annual number: 14 End annual number: 14 |