KR100889633B1 - 기판 고정 척핀 - Google Patents
기판 고정 척핀 Download PDFInfo
- Publication number
- KR100889633B1 KR100889633B1 KR1020070102663A KR20070102663A KR100889633B1 KR 100889633 B1 KR100889633 B1 KR 100889633B1 KR 1020070102663 A KR1020070102663 A KR 1020070102663A KR 20070102663 A KR20070102663 A KR 20070102663A KR 100889633 B1 KR100889633 B1 KR 100889633B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- chuck pin
- fixing chuck
- chemical liquid
- substrate fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000014759 maintenance of location Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 136
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 239000000126 substance Substances 0.000 claims abstract description 32
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000006227 byproduct Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (3)
- 기판의 주위에 이격 배치되어 상기 기판 측면과의 마찰력으로 상기 기판을 고정시키는 척핀에 있어서,상기 기판과 접촉하는 측면을 따라 홈이 형성된 홈부; 및상기 기판과 상기 척핀이 접촉하는 틈을 따라 흘러내리는 약액을 상기 척핀 외부로 배출시키기 위해, 상기 홈이 형성된 척핀의 종단면 상에 상기 척핀을 관통하는 홀을 포함하는 기판 고정 척핀.
- 제 1 항에 있어서,상기 홀은 아래로 경사지는 기판 고정 척핀.
- 제 1 항에 있어서,상기 척핀은 회동 가능한 기판 고정 척핀.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070102663A KR100889633B1 (ko) | 2007-10-11 | 2007-10-11 | 기판 고정 척핀 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070102663A KR100889633B1 (ko) | 2007-10-11 | 2007-10-11 | 기판 고정 척핀 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100889633B1 true KR100889633B1 (ko) | 2009-03-20 |
Family
ID=40698493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070102663A Active KR100889633B1 (ko) | 2007-10-11 | 2007-10-11 | 기판 고정 척핀 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100889633B1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101394092B1 (ko) * | 2012-12-06 | 2014-05-13 | 주식회사 케이씨텍 | 기판세정장치 |
KR20200029070A (ko) * | 2018-09-07 | 2020-03-18 | 세메스 주식회사 | 척핀 및 이를 포함하는 기판 처리 장치 |
CN112820689A (zh) * | 2021-01-06 | 2021-05-18 | 长鑫存储技术有限公司 | 浮动销、晶圆承载装置及沉积设备 |
US12119257B2 (en) | 2021-01-06 | 2024-10-15 | Changxin Memory Technologies, Inc. | Floating pin, wafer carrying device and depositing apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990000274A (ko) * | 1997-06-04 | 1999-01-15 | 윤종용 | 반도체 세정장치 |
JP2000286185A (ja) * | 1999-03-31 | 2000-10-13 | Nec Kansai Ltd | スピンチャック |
KR20040013257A (ko) | 2002-08-05 | 2004-02-14 | 삼성전자주식회사 | 반도체 소자의 레이저 리페어 장비 |
-
2007
- 2007-10-11 KR KR1020070102663A patent/KR100889633B1/ko active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990000274A (ko) * | 1997-06-04 | 1999-01-15 | 윤종용 | 반도체 세정장치 |
JP2000286185A (ja) * | 1999-03-31 | 2000-10-13 | Nec Kansai Ltd | スピンチャック |
KR20040013257A (ko) | 2002-08-05 | 2004-02-14 | 삼성전자주식회사 | 반도체 소자의 레이저 리페어 장비 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101394092B1 (ko) * | 2012-12-06 | 2014-05-13 | 주식회사 케이씨텍 | 기판세정장치 |
KR20200029070A (ko) * | 2018-09-07 | 2020-03-18 | 세메스 주식회사 | 척핀 및 이를 포함하는 기판 처리 장치 |
KR102201878B1 (ko) * | 2018-09-07 | 2021-01-13 | 세메스 주식회사 | 척핀 및 이를 포함하는 기판 처리 장치 |
CN112820689A (zh) * | 2021-01-06 | 2021-05-18 | 长鑫存储技术有限公司 | 浮动销、晶圆承载装置及沉积设备 |
US12119257B2 (en) | 2021-01-06 | 2024-10-15 | Changxin Memory Technologies, Inc. | Floating pin, wafer carrying device and depositing apparatus |
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