KR100845653B1 - 카본 나노튜브 디바이스 및 그 제조방법 - Google Patents
카본 나노튜브 디바이스 및 그 제조방법 Download PDFInfo
- Publication number
- KR100845653B1 KR100845653B1 KR1020077001647A KR20077001647A KR100845653B1 KR 100845653 B1 KR100845653 B1 KR 100845653B1 KR 1020077001647 A KR1020077001647 A KR 1020077001647A KR 20077001647 A KR20077001647 A KR 20077001647A KR 100845653 B1 KR100845653 B1 KR 100845653B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- gap
- layer
- carbon nanotubes
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 144
- 239000002041 carbon nanotube Substances 0.000 title claims abstract description 128
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims abstract description 128
- 238000000034 method Methods 0.000 title claims description 49
- 230000008569 process Effects 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 158
- 239000003054 catalyst Substances 0.000 claims abstract description 122
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000009826 distribution Methods 0.000 claims abstract description 31
- 230000000149 penetrating effect Effects 0.000 claims abstract description 15
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 72
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 11
- 238000011068 loading method Methods 0.000 claims description 9
- 239000012876 carrier material Substances 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 5
- 238000013459 approach Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims 16
- 239000002253 acid Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 abstract description 16
- 238000000576 coating method Methods 0.000 abstract description 16
- 238000007865 diluting Methods 0.000 abstract 1
- 239000002071 nanotube Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 47
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 25
- 229910052804 chromium Inorganic materials 0.000 description 25
- 239000011651 chromium Substances 0.000 description 25
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 23
- 239000000377 silicon dioxide Substances 0.000 description 23
- 235000012239 silicon dioxide Nutrition 0.000 description 23
- 229910017052 cobalt Inorganic materials 0.000 description 21
- 239000010941 cobalt Substances 0.000 description 21
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 18
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 16
- 239000002109 single walled nanotube Substances 0.000 description 16
- 238000004544 sputter deposition Methods 0.000 description 15
- 239000002105 nanoparticle Substances 0.000 description 14
- 238000000151 deposition Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 9
- 239000002082 metal nanoparticle Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052750 molybdenum Inorganic materials 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 230000003197 catalytic effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000021329 brown rice Nutrition 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0009—Forming specific nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/04—Cathodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0009—Forming specific nanostructures
- B82B3/0014—Array or network of similar nanostructural elements
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
- C01B32/162—Preparation characterised by catalysts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30446—Field emission cathodes characterised by the emitter material
- H01J2201/30453—Carbon types
- H01J2201/30469—Carbon nanotubes (CNTs)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Cold Cathode And The Manufacture (AREA)
Abstract
Description
Claims (16)
- 기판(1);상기 기판(1)에 접하고, 상기 기판(1)에 대해 수직방향으로 관통하는 간극(5)을 가지는 층(3);상기 간극(5)에 면한 상기 기판(1)의 표면 상에, 상기 간극(5)의 중심으로부터의 거리에 따라 연속적으로 변화하는 수(數) 밀도 분포를 가진 카본 나노튜브(7);상기 카본 나노튜브(7)와 상기 기판(1)의 사이에 배치되고, 상기 카본 나노튜브(7)를 지지하는 촉매물질(6)을 구비하고,상기 카본 나노튜브(7)는 복수의 카본 나노튜브가 얽힌 다발이고, 상기 기판(1)에 대해 수직방향으로 신장하는 가시형상 구조를 이루는 것을 특징으로 하는 카본 나노튜브 구비기판.
- 청구항 1에 있어서,상기 간극(5)을 가지는 층(3)이 절연체로 이루어지는 것을 특징으로 하는 카본 나노튜브 구비기판.
- 청구항 1에 있어서,상기 기판(1)은, 상기 간극(5)을 가지는 층(3)에 접하는 측에, 도전성의 층(2)을 구비하는 것을 특징으로 하는 카본 나노튜브 구비기판.
- 청구항 3에 있어서,상기 촉매물질(6)과 상기 도전성의 층(2)의 사이의 일부에 촉매담체물질을 더 구비하는 것을 특징으로 하는 카본 나노튜브 구비기판.
- 청구항 1에 있어서,상기 기판(1)과 상기 간극(5)을 가지는 층(3)의 사이에, 상기 간극(5)부터 상기 기판(1)까지 관통하는 구멍을 가지는 도전성의 층(2)을 구비하는 것을 특징으로 하는 카본 나노튜브 구비기판.
- 청구항 1에 있어서,상기 간극(5)을 가지는 층(3)을, 상기 기판(1)과의 사이에 두는 피복층(4)을 더 구비하고,상기 피복층(4)은, 상기 기판(1)으로부터 연장되는 상기 카본 나노튜브(7)의 선단 근방에 개구부를 가지고,상기 간극(5)의 측면은, 상기 피복층(4)의 개구부로부터 상기 기판(1)으로 향하는 축의 주위에 축대칭의 형상을 이루고, 상기 간극(5)의 크기는 상기 피복층(4)으로부터 상기 기판(1)에 근접함에 따라 감소하고,상기 카본 나노튜브(7)는 상기 피복층(4)의 개구부에 향하는 산형의 형상을 이루는 것을 특징으로 하는 카본 나노튜브 구비기판.
- 청구항 6에 있어서,상기 피복층(4)은 도전성인 것을 특징으로 하는 카본 나노튜브 구비기판.
- 기판(1) 상에, 상기 기판(1)에 대해 수직방향으로 관통하는 간극(5)을 가지는 층(3)과,상기 간극(5)에 대한 개구부를 갖는 피복층(4)을 형성하고,상기 기판(1)과는 반대측으로부터 상기 피복층(4)이 갖는 개구부 및 상기 간극(5)을 통하여 촉매물질을 공급하여, 당해 촉매물질의 공급량을 희석하며,상기 간극(5)의 저부의 중심 위치로부터의 거리가 크게 되면 감소하는 담지량분포를 갖는 촉매물질(6)을 상기 간극(5)에 면한 기판 상에 형성시킨 후,탄소원을 공급함으로써, 수 밀도 분포가 있는 카본 나노튜브(7)로서, 복수의 카본 나노튜브가 얽힌 다발이고 상기 기판(1)에 대해 수직방향으로 신장하는 가시형상 구조를 이루고, 상기 피복층(4)의 개구부를 향하는 산형의 형상을 이루는 카본 나노튜브(7)를 상기 기판(1) 상에 형성하는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,상기 간극(5)을 가지는 층(3)을 절연체로 형성하는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,상기 기판(1)의 표면에 도전성의 층(2)을 형성하고 나서,상기 간극(5)을 가지는 층(3)을 형성하고,상기 카본 나노튜브를 상기 도전성의 층(2)의 표면 상에 형성하는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 10에 있어서,상기 간극(5)을 가지는 층(3)을 형성한 후에,상기 도전성의 층(2)의 상기 간극에 노출되는 면의 일부에 촉매담체물질을 담지시키고,상기 촉매담체물질 상에 촉매물질을 담지시키고 나서,상기 간극(5)을 통하여 탄소원을 공급하여, 상기 카본 나노튜브를 상기 도전성의 층(2) 및 상기 촉매담체물질 및 촉매물질(6) 상에 형성하는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,상기 기판(1)의 표면에 도전성의 층(2)을 형성하고 나서,상기 간극(5)을 가지는 층(3)을 형성하고,상기 도전성의 층(2)에 대해, 상기 간극(5)부터 상기 기판(1)까지 관통하는 구멍을 형성하고 나서,상기 카본 나노튜브를 상기 기판(1)의 표면 상에 형성하는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,상기 간극(5)을 가지는 층(3)에 있어서 상기 간극(5)을 형성하기 전에, 상기 간극(5)을 가져야 할 층(3) 상에 개구부를 가지는 피복층(4)을 형성하고,상기 피복층(4)이 가지는 개구부로부터 상기 간극(5)을 가져야 할 층(3)에 대해 에칭을 행함으로써,상기 간극(5)을 가져야 할 층(3)에, 상기 간극(5)으로서, 그 측면은, 상기 피복층(4)의 개구부로부터 상기 기판(1)으로 향하는 축의 주위에 축대칭의 형상을 이루고, 상기 간극(5)의 크기는 상기 피복층(4)으로부터 상기 기판(1)에 근접함에 따라 감소하는 간극(5)을 형성하는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,상기 피복층(4)은 도전성인 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,촉매를 담지 후에, 상기 간극(5)을 가지는 층(3)과 상기 피복층(4)을 제거하고, 촉매를 노출시킨 후에 카본 나노튜브(7)를 형성시키는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
- 청구항 8에 있어서,카본 나노튜브(7)를 형성 후에, 상기 간극(5)을 가지는 층(3)과 상기 피복층(4)을 제거하고, 카본 나노튜브(7)를 노출시키는 것을 특징으로 하는 카본 나노튜브 구비기판의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004219371 | 2004-07-27 | ||
JPJP-P-2004-00219371 | 2004-07-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070039553A KR20070039553A (ko) | 2007-04-12 |
KR100845653B1 true KR100845653B1 (ko) | 2008-07-10 |
Family
ID=35786217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077001647A Expired - Fee Related KR100845653B1 (ko) | 2004-07-27 | 2005-07-26 | 카본 나노튜브 디바이스 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8642126B2 (ko) |
JP (1) | JP4558735B2 (ko) |
KR (1) | KR100845653B1 (ko) |
CN (1) | CN101027742B (ko) |
WO (1) | WO2006011468A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100803194B1 (ko) * | 2006-06-30 | 2008-02-14 | 삼성에스디아이 주식회사 | 탄소나노튜브 구조체 형성방법 |
JP5667736B2 (ja) * | 2007-10-11 | 2015-02-12 | 三菱化学株式会社 | 微細中空状炭素繊維の集合体 |
JP2009245672A (ja) * | 2008-03-31 | 2009-10-22 | Univ Of Tokyo | フィールドエミッション装置、ならびに、その製造方法 |
WO2013191247A1 (ja) * | 2012-06-22 | 2013-12-27 | 国立大学法人東京大学 | カーボンナノチューブ合成用炭素含有金属触媒粒子及びその製造方法、並びに、触媒担持支持体、カーボンナノチューブの製造方法 |
CN105152124A (zh) * | 2015-08-04 | 2015-12-16 | 上海交通大学 | 利用深硅刻蚀技术存储CNTs的方法 |
KR102613029B1 (ko) | 2018-10-17 | 2023-12-12 | 삼성전자주식회사 | 커패시터 구조물 및 이를 구비하는 반도체 소자 |
CN112930578A (zh) | 2018-10-26 | 2021-06-08 | 学校法人早稻田大学 | 碳-金属结构体以及碳-金属结构体的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11139815A (ja) * | 1997-11-07 | 1999-05-25 | Canon Inc | カーボンナノチューブデバイスおよびその製造方法 |
JP2001126609A (ja) * | 1999-10-26 | 2001-05-11 | Futaba Corp | 電子放出素子及び蛍光発光型表示器 |
JP2002203473A (ja) * | 2000-11-01 | 2002-07-19 | Sony Corp | 冷陰極電界電子放出素子及びその製造方法、並びに、冷陰極電界電子放出表示装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5872422A (en) * | 1995-12-20 | 1999-02-16 | Advanced Technology Materials, Inc. | Carbon fiber-based field emission devices |
JP3569135B2 (ja) | 1998-09-09 | 2004-09-22 | 株式会社東芝 | 電界放出陰極の製造方法 |
JP2000268706A (ja) * | 1999-03-18 | 2000-09-29 | Matsushita Electric Ind Co Ltd | 電子放出素子及びそれを用いた画像描画装置 |
US6590322B2 (en) * | 2000-01-07 | 2003-07-08 | The United States Of America As Represented By The Secretary Of The Navy | Low gate current field emitter cell and array with vertical thin-film-edge emitter |
US6692324B2 (en) * | 2000-08-29 | 2004-02-17 | Ut-Battelle, Llc | Single self-aligned carbon containing tips |
JP2003031116A (ja) * | 2001-07-17 | 2003-01-31 | Nec Corp | 電界放出型冷陰極及びその製造方法並びに電解放出型冷陰極を備えた平面画像装置 |
JP2003288835A (ja) | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | 電界放出素子及びその製造方法 |
CN1195313C (zh) * | 2002-12-30 | 2005-03-30 | 中国电子科技集团公司第十二研究所 | 一种栅控碳纳米管/碳纤维场发射阵列阴极及其制作方法 |
JP3958695B2 (ja) * | 2003-02-20 | 2007-08-15 | 三菱電機株式会社 | 冷陰極表示装置の製造方法 |
JP2004359478A (ja) * | 2003-06-02 | 2004-12-24 | Univ Waseda | 繊維状カーボンの形態・位置制御方法、その方法を用いて位置制御された繊維状カーボン素子、及びその素子を用いたデバイス |
JP4349951B2 (ja) * | 2004-03-24 | 2009-10-21 | 三菱電機株式会社 | 電界型電子放出素子およびその製造方法 |
-
2005
- 2005-07-26 WO PCT/JP2005/013629 patent/WO2006011468A1/ja active Application Filing
- 2005-07-26 JP JP2006529330A patent/JP4558735B2/ja not_active Expired - Fee Related
- 2005-07-26 CN CN2005800254026A patent/CN101027742B/zh not_active Expired - Fee Related
- 2005-07-26 US US11/572,665 patent/US8642126B2/en not_active Expired - Fee Related
- 2005-07-26 KR KR1020077001647A patent/KR100845653B1/ko not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11139815A (ja) * | 1997-11-07 | 1999-05-25 | Canon Inc | カーボンナノチューブデバイスおよびその製造方法 |
JP2001126609A (ja) * | 1999-10-26 | 2001-05-11 | Futaba Corp | 電子放出素子及び蛍光発光型表示器 |
JP2002203473A (ja) * | 2000-11-01 | 2002-07-19 | Sony Corp | 冷陰極電界電子放出素子及びその製造方法、並びに、冷陰極電界電子放出表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4558735B2 (ja) | 2010-10-06 |
KR20070039553A (ko) | 2007-04-12 |
JPWO2006011468A1 (ja) | 2008-07-31 |
CN101027742B (zh) | 2010-11-03 |
US20070231486A1 (en) | 2007-10-04 |
WO2006011468A1 (ja) | 2006-02-02 |
CN101027742A (zh) | 2007-08-29 |
US8642126B2 (en) | 2014-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3804594B2 (ja) | 触媒担持基板およびそれを用いたカーボンナノチューブの成長方法ならびにカーボンナノチューブを用いたトランジスタ | |
CN101232941B (zh) | 用于纳米结构的组分的制备和涂覆的方法 | |
US7235159B2 (en) | Methods for producing and using catalytic substrates for carbon nanotube growth | |
US6656339B2 (en) | Method of forming a nano-supported catalyst on a substrate for nanotube growth | |
US6764874B1 (en) | Method for chemical vapor deposition of single walled carbon nanotubes | |
KR100376768B1 (ko) | 전자, 스핀 및 광소자 응용을 위한 탄소나노튜브의 선택적 수평성장 방법 | |
US8822000B2 (en) | Nanostructure and method for manufacturing the same | |
US20100009474A1 (en) | Method of growing carbon nanotubes and method of manufacturing field emission device using the same | |
US20050214197A1 (en) | Methods for producing and using catalytic substrates for carbon nanotube growth | |
US20030143327A1 (en) | Method for producing a carbon nanotube | |
KR100845653B1 (ko) | 카본 나노튜브 디바이스 및 그 제조방법 | |
US20060067872A1 (en) | Method of preparing catalyst base for manufacturing carbon nanotubes and method of manufacturing carbon nanotubes employing the same | |
JP2004051432A (ja) | カーボンナノチューブの製造用基板及びそれを用いたカーボンナノチューブの製造方法 | |
JP2004075422A (ja) | オフ基板上でのカーボンナノチューブの製造方法 | |
JP2006035379A (ja) | カーボンナノチューブデバイス及びカーボンナノチューブデバイスの製造方法 | |
JP2005126323A (ja) | 触媒担持基板、それを用いたカーボンナノチューブの成長方法及びカーボンナノチューブを用いたトランジスタ | |
US7645482B2 (en) | Method to make and use long single-walled carbon nanotubes as electrical conductors | |
US7718224B2 (en) | Synthesis of single-walled carbon nanotubes | |
TWI494268B (zh) | 準直性奈米碳管之製造方法 | |
KR20070105022A (ko) | 카본 나노튜브의 형성 방법 | |
Andalouci | Optimisation de la synthèse de nanotubes de carbone par dépôt chimique en phase vapeur assisté par micro-ondes: expérience et modélisation | |
TWI230204B (en) | Method for selectively depositing nano carbon structure on silicon substrate | |
Lalonde | Growth and characterization of metal nanoparticles on nanowire substrates | |
JP2011084464A (ja) | ナノメータスケールの構造物の作製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0105 | International application |
Patent event date: 20070123 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20071128 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20080519 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20080704 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20080704 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20110617 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20120621 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20130621 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20130621 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140630 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20140630 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150619 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20150619 Start annual number: 8 End annual number: 8 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20170609 |